A PCB half-hole making method based on washable protective ink

Abstract

This invention relates to the field of integrated circuit manufacturing technology, specifically to a method for fabricating half-holes in PCBs based on removable protective ink, comprising the following steps: S1, completing a pattern electroplating process on the PCB substrate; S2, placing the PCB substrate on a moving worktable and passing it sequentially through each station; S3, printing thermosetting removable protective ink; S4, drying and curing; S5, router operation to form a half-hole structure; S6, placing the cut PCB substrate in an alkaline stripping solution to remove the thermosetting removable protective ink. This technical solution uses thermosetting removable protective ink to replace the traditional tin protective layer. This ink can be used for hole plugging and surface coating, forming a reliable protective layer that effectively blocks cutting stress. It is completely removed without residue by an alkaline solution. This solves the problems of burrs, residual copper, and dry film back-adhesion during the half-hole cutting process, simplifies the traditional integrated circuit manufacturing process, reduces production costs, and improves product yield by approximately 20%.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and specifically to a method for fabricating half-holes in PCBs based on washable protective ink. Background Technology

[0002] The conventional practice for cutting half-holes on PCB circuit boards is to protect the copper surface through the physical isolation properties and chemical stability of solder, acting like a "buffer pad" to reduce chipping and copper loss caused by stress concentration, thus maintaining the integrity of the copper surface. After the half-hole is cut, the solder is removed with a chemical solution to meet the customer's half-hole design requirements.

[0003] However, in the actual manufacturing process, there are still residual wires inside the holes, and after stripping the solder, there are residual copper residues on the hole walls, which is a defect. Figure 1 As shown, the circuitry on the board is covered with dry film, and the board is cut while still covered by the dry film. During the cutting process, there is a problem with the dry film not adhering properly, such as... Figure 2 As shown, existing technologies typically consider increasing the thickness of the tin layer to reduce the high-frequency vibration stress generated when the cutter operates at high speed, but this increases the manufacturing cost and cannot fundamentally solve the above pain points. Summary of the Invention

[0004] To address the aforementioned technical deficiencies, the purpose of this invention is to provide a method for fabricating half-holes in a PCB based on washable protective ink, comprising the following steps: S1, completing a pattern electroplating process on the PCB substrate; S2. Place the PCB substrate on the moving workbench and pass it through each station in sequence; S3. Print thermosetting washable protective ink in the half-hole area and on the surface of the PCB substrate, so that the thermosetting washable protective ink fills the half-hole and forms a protective layer covering the surface of the PCB substrate. S4. Dry and cure the PCB substrate printed with the thermosetting washable protective ink. S5. Perform a routing operation on the PCB substrate printed with the thermosetting washable protective ink to form a half-hole structure. S6. Place the cut PCB substrate in an alkaline stripping solution to remove the thermosetting washable protective ink and obtain the finished PCB.

[0005] Preferably, the thermosetting washable protective ink is a water-washable pore-filling resin ink (HDR-1).

[0006] Preferably, the drying and curing conditions are drying and curing at 130℃±5℃ for 50 minutes.

[0007] Preferably, the alkaline rinsing solution is a 5% concentration alkaline rinsing solution, and the rinsing environment is stable at 55±5℃.

[0008] To ensure the stability of the PCB substrate's position when the moving worktable moves it, thereby guaranteeing the processing accuracy at each workstation, the following features are specifically provided: The moving worktable includes a moving track and a sliding base slidably installed within the moving track. The sliding base is provided with a support surface for horizontally placing the PCB substrate. The periphery of the support surface is provided with positioning posts coaxial with the mounting holes of the PCB substrate. Lower pressure plates are slidably installed on the upper sides of both sides of the support surface, and the lower pressure plates are attached to the upper sides of both ends of the PCB substrate to fix it in place.

[0009] To prevent the lower pressure plates on both sides from affecting the loading of the PCB substrate, the following features are specifically designed: several sliding rods are respectively provided at both ends of the support platform in the width direction of the moving track, and the sliding rods at both ends of the support platform extend in an inclined direction to form an "U" shape with the opening widening upward; the lower pressure plate is provided with an oblique sliding sleeve coaxial with the sliding rod, and the lower pressure plate is fitted onto the sliding rod through the oblique sliding sleeve to keep the lower pressure plate horizontal; when the lower pressure plate is located at the top of the sliding rod, the distance between two adjacent lower pressure plates is greater than the width of the PCB substrate.

[0010] In order to reduce the contact area between the pressure plate and the PCB substrate, the following feature is specifically designed: the bottom of the pressure plate is provided with several nail feet.

[0011] To achieve the goal of automatically fixing the PCB substrate when the pressure plate moves with the sliding base without a separate power source, the following features are specifically designed: several horizontal guide rods are provided in the moving track, the sliding base is slidably mounted on the guide rods, and a linear actuator for driving the sliding base to move along the axis of the guide rods is provided on the moving track.

[0012] Preferably, the middle section of the limiting slide groove is provided with a tightening part, the inner width of which is smaller than the inner width of the limiting slide groove; adjustment blocks are slidably installed on both sides of the bottom of the sliding base, the adjustment blocks and the sliding base are elastically connected by springs, the side of the adjustment block facing the inner wall of the limiting slide groove is provided with an arc-shaped convex surface, the elastic force of the spring makes the arc-shaped convex surface fit against the inner wall of the limiting slide groove, adjustment brackets extending vertically upward are provided on both sides of the adjustment block, the adjustment brackets are provided with vertically extending limiting holes, and extension rods extending horizontally perpendicular to the length direction of the moving track are provided on both sides of the lower pressure plate, the diameter of the extension rods is the same as the inner width of the limiting holes, and the extension rods are inserted into the limiting holes.

[0013] To ensure that the pressing position of the lower platen is appropriately adjusted according to the thickness of the PCB substrate, thereby guaranteeing that the lower platen adheres to both ends of the PCB substrate with appropriate force when the arc-shaped convex surface contacts the tightening part of the limiting slide groove, the following features are specifically provided: The adjusting block has horizontally extending mounting sleeves on both sides along the moving direction of the adjusting block; the bottom end of the adjusting bracket is slidably installed inside the mounting sleeve; the adjusting bracket extends upward through a waist-shaped hole on the upper side of the mounting sleeve; a horizontally extending threaded rod is provided on one side of the bottom end of the adjusting bracket; the threaded rod extends to the outside of the mounting sleeve through a side slot on the side wall of the mounting sleeve; the waist-shaped hole and the side slot extend along the length direction of the mounting sleeve; and a locking nut for locking the position of the adjusting bracket in the mounting sleeve is screwed onto the threaded rod.

[0014] The advantages of this invention compared to existing technologies are as follows: This invention uses a thermosetting, washable protective ink to replace the traditional tin protective layer. This ink can be used for hole plugging and topcoating, forming a reliable protective layer that effectively blocks cutting stress. It is completely washed away with an alkaline solution without any residue. This solves the problems of burrs, residual copper, and dry film back-adhesion during the half-hole cutting process, simplifies the traditional integrated circuit manufacturing process, reduces production costs, and improves product yield by approximately 20%. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram illustrating the defect of residual copper on the hole wall after tin stripping in existing technology.

[0017] Figure 2 This is a schematic diagram illustrating the poor dry film adhesion in existing technologies.

[0018] Figure 3 This is a rendering of step S3 in a PCB half-hole fabrication method based on washable protective ink.

[0019] Figure 4 This is a rendering of step S4 in a method for fabricating half-holes in a PCB based on washable protective ink.

[0020] Figure 5 This is a cross-sectional view of the ink inside the hole of the PCB substrate after step S4 in a method for fabricating half-holes in a PCB based on washable protective ink.

[0021] Figure 6This is a rendering of step S5 in a PCB half-hole fabrication method based on washable protective ink.

[0022] Figure 7 This is a cross-sectional view of the PCB substrate after step S6 in a method for fabricating half-holes in a PCB based on washable protective ink.

[0023] Figure 8 This is a schematic diagram of a mobile worktable in the loading state of a PCB half-hole fabrication method based on washable protective ink.

[0024] Figure 9 This is a top view of a mobile worktable in the loading state of a PCB half-hole fabrication method based on washable protective ink.

[0025] Figure 10 for Figure 9 Sectional view at point AA.

[0026] Figure 11 This is a side view of a mobile worktable in the manufacturing process of a PCB half-hole fabrication method based on washable protective ink.

[0027] Figure 12 for Figure 11 Sectional view of section BB.

[0028] Figure 13 for Figure 12 A magnified view of a portion of point C.

[0029] Figure 14 A three-dimensional sliding base for a PCB half-hole fabrication method based on washable protective ink. Figure 1 .

[0030] Figure 15 A three-dimensional sliding base for a PCB half-hole fabrication method based on washable protective ink. Figure 2 .

[0031] Figure 16 An exploded three-dimensional view of a sliding base for a PCB half-hole fabrication method based on washable protective ink.

[0032] Explanation of reference numerals in the attached drawings: 1. Moving track; 1a. Guide rod; 1b. Limiting groove; 1c. Tightening part; 2. Sliding base; 2a. Supporting platform; 2a1. Slide rod; 2b. Positioning column head; 2c. Lower pressure plate; 2c1. Slanted slide sleeve; 2c2. Nail foot; 2c3. Extension rod; 2d. Adjusting block; 2d1. Arc-shaped convex surface; 2d2. Adjusting bracket; 2d3. Limiting hole; 2d4. Mounting slide sleeve; 2d5. Waist-shaped hole; 2d6. Side slot; 2d7. Threaded rod; 2d8. Locking nut; 2e. Spring. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Reference Figures 1 to 16 : A method for fabricating half-holes on a PCB based on washable protective ink includes the following steps: S1. Complete the pattern electroplating process on the PCB substrate; S2. Place the PCB substrate on the moving workbench and pass it through each station in sequence; S3. Print thermosetting washable protective ink in the half-hole area and on the surface of the PCB substrate, so that the thermosetting washable protective ink fills the half-hole and forms a protective layer covering the surface of the PCB substrate. S4. Dry and cure the PCB substrate printed with thermosetting washable protective ink; S5. Perform a router operation on the PCB substrate printed with thermosetting washable protective ink to form a half-hole structure. S6. Place the cut PCB substrate in an alkaline stripping solution to remove the thermosetting washable protective ink and obtain the finished PCB.

[0035] The thermosetting washable protective ink is a water-washable pore-filling resin ink (HDR-1).

[0036] The drying and curing conditions are 130℃±5℃ for 50 minutes.

[0037] The alkaline rinsing solution is a 5% concentration alkaline rinsing solution, and the rinsing environment is stable at 55±5℃.

[0038] In this application, the moving worktable first moves the PCB substrate to the ink coating station, allowing the thermosetting washable protective ink to fill the semi-holes and form a protective layer covering the PCB substrate surface. The specific effect is as follows: Figure 3 As shown, the PCB substrate is then moved to a drying oven for drying and curing, with the specific effect as follows. Figure 4 As shown, the ink condition inside the holes of the PCB substrate at this time is as follows. Figure 5 As shown, the PCB substrate with cured ink is then moved to the router station for half-hole routing, resulting in the desired effect. Figure 6 As shown, the workers removed the cut PCB substrate and moved it to an alkaline washing tank for ink removal. The condition inside the holes after ink removal is as follows. Figure 7As shown, this embodiment uses a thermosetting washable protective ink to replace the traditional tin protective layer. This ink can be used for hole plugging and topcoat application, forming a reliable protective layer that effectively blocks cutting stress. It eliminates the need for exposure and development processes, requiring only drying and curing at 130°C for 50 minutes. Furthermore, it can be completely washed away without residue using a 5% alkaline solution at 55±5°C. This embodiment changes the traditional positive film fabrication process to a negative film process. First, pattern electroplating is completed, then the thermosetting washable protective ink is printed, followed by half-hole cutting, and finally, the ink is washed away. This method solves the problems of burrs, residual copper, and dry film back-adhesion during half-hole cutting, simplifies the traditional integrated circuit manufacturing process, reduces production costs, and improves product yield by approximately 20%.

[0039] To ensure the stability of the PCB substrate's position when the moving worktable moves it, thereby guaranteeing the processing accuracy at each workstation, the following features are specifically designed: The mobile worktable includes a mobile track 1 and a sliding base 2 slidably installed in the mobile track 1. The sliding base 2 is provided with a support surface 2a for horizontally placing the PCB substrate. The support surface 2a is provided with positioning pins 2b coaxial with the mounting holes of the PCB substrate. Lower pressure plates 2c are slidably installed on the upper sides of both sides of the support surface 2a. The lower pressure plates 2c are attached to the upper sides of both ends of the PCB substrate to fix the PCB substrate.

[0040] like Figures 8 to 14 As shown, in this embodiment, the sliding base 2 is slidably installed in the moving track 1, and can drive the PCB substrate to complete the transfer between multiple workstations along the moving track 1. During operation, the PCB substrate is first placed horizontally on the support surface 2a of the sliding base 2 at the loading station, so that the positioning pins 2b on the periphery of the support surface 2a are coaxially aligned with the mounting holes of the PCB substrate to complete the pre-positioning of the PCB substrate; then, the lower pressure plates 2c on both sides of the support surface 2a slide downwards to fit and press against the upper edges of both ends of the PCB substrate to complete the rigid locking and fixing of the PCB substrate; finally, the sliding base 2 accurately transports the fixed PCB substrate sequentially to the corresponding workstations such as ink coating, drying and curing, and PCB winding operation along the moving track 1 to complete the processing actions of each process. This embodiment achieves precise pre-positioning of the PCB substrate through the coaxial alignment design of the positioning column head 2b and the mounting hole of the PCB substrate. The lower pressure plates 2c on both sides of the support platform 2a adopt the end-fitting and pressing fixing method, which achieves a firm lock on the PCB substrate without obstructing the half-hole area and the processing surface of the board. This can effectively suppress the high-frequency vibration and displacement deviation generated by the substrate during the PCB cutting process, and greatly improve the dimensional accuracy and processing stability of the half-hole cutting.

[0041] To prevent the side pressure plates 2c from affecting the PCB substrate loading, the following features are specifically designed: Several sliding rods 2a1 are respectively provided at both ends of the support platform 2a in the width direction of the moving track 1. The sliding rods 2a1 at both ends of the support platform 2a extend in the inclined direction and form a "V" shape with the opening widening upward. The lower pressure plate 2c is provided with a slanted sliding sleeve 2c1 coaxial with the sliding rod 2a1. The lower pressure plate 2c is fitted on the sliding rod 2a1 through the slanted sliding sleeve 2c1 and keeps the lower pressure plate 2c horizontal. When the lower pressure plate 2c is located at the top of the sliding rod 2a1, the distance between two adjacent lower pressure plates 2c is greater than the width of the PCB substrate.

[0042] like Figures 10 to 13 As shown, in this embodiment, during the PCB substrate loading operation, the lower pressure plate 2c slides upward along the slide rod 2a1 to the top position of the slide rod 2a1. At this time, the distance between the lower pressure plates 2c on both sides of the support table 2a is greater than the width of the PCB substrate, reserving unobstructed operating space for the loading and unloading of the PCB substrate. After the PCB substrate is placed on the support table 2a and pre-positioned by the positioning pin 2b, the lower pressure plate 2c is pushed to slide downward along the slide rod 2a1 through the inclined sliding sleeve 2c1. Relying on the inclined guide of the slide rod 2a1, the two lower pressure plates 2c move vertically downward while simultaneously narrowing the horizontal distance towards each other, and finally horizontally adhering and pressing against the upper side of both ends of the PCB substrate, completing the locking and fixing of the PCB substrate.

[0043] To reduce the contact area between the pressure plate 2c and the PCB substrate, the following features are specifically designed: The bottom of the pressure plate 2c has several nail feet 2c2.

[0044] like Figure 13 As shown, in this embodiment, the pin 2c2 significantly reduces the contact area between the pressure plate 2c and the PCB substrate, which can avoid large-area contact, enhance the fixing stability, and ensure product yield.

[0045] To achieve the goal of automatically fixing the PCB substrate when the lower pressure plate 2c moves with the sliding base 2 without a separate power source, the following features are specifically designed: The moving track 1 is provided with several horizontal guide rods 1a. The sliding base 2 is slidably mounted on the guide rods 1a. The moving track 1 is provided with a linear actuator for driving the sliding base 2 to move along the axis of the guide rods 1a.

[0046] A tightening part 1c is provided in the middle section of the limiting slide groove 1b. The inner width of the tightening part 1c is smaller than the inner width of the limiting slide groove 1b. Adjusting blocks 2d are slidably installed on both sides of the bottom of the sliding base 2. The adjusting blocks 2d and the sliding base 2 are elastically connected by springs 2e. An arc-shaped convex surface 2d1 is provided on the side of the adjusting block 2d facing the inner wall of the limiting slide groove 1b. The elastic force of the spring 2e makes the arc-shaped convex surface 2d1 fit against the inner wall of the limiting slide groove 1b. Vertically upward extending adjusting brackets 2d2 are provided on both sides of the adjusting block 2d. Vertically extending limiting holes 2d3 are provided on the adjusting brackets 2d2. Extension rods 2c3 are provided on both sides of the lower pressure plate 2c, which are horizontally extending perpendicular to the length direction of the moving track 1. The diameter of the extension rods 2c3 is the same as the inner width of the limiting holes 2d3. The extension rods 2c3 are inserted into the limiting holes 2d3.

[0047] like Figure 1 , Figures 14 to 16 As shown, in this embodiment, the sliding base 2 is installed on several horizontal guide rods 1a inside the moving track 1, and is driven by a linear actuator set on the moving track 1 to move along the axis of the guide rods 1a. The linear actuator in this embodiment can be a lead screw slide or a linear slide, etc., which will not be described in detail here and is not shown in the figure. Under the elastic force of the spring 2e, the adjusting blocks 2d on both sides of the bottom of the sliding base 2 keep their arc-shaped convex surfaces 2d1 in contact with the inner wall of the limiting slide groove 1b. When the linear actuator drives the sliding base 2 to move into the tightening part 1c in the middle section of the limiting slide groove 1b, because the inner width of the tightening part 1c is smaller than the inner width of the limiting slide groove 1b, the inner walls on both sides of the limiting slide groove 1b simultaneously squeeze the arc-shaped convex surfaces 2d1 of the adjusting blocks 2d on both sides, overcoming the elastic force of the spring 2e and pushing the two adjusting blocks 2d to move inward. At the same time, the adjusting bracket 2d2 drives the lower pressure plate 2c to move downward along the slide rod 2a1. When the arc-shaped convex surfaces 2d1 are in contact with the inner wall of the tightening part 1c, the lower pressure plate 2c is fixed to both ends of the PCB substrate. Similarly, after the sliding base 2 completes processing and moves out of the tightening part 1c, the rebound force of the spring 2e pushes the two adjusting blocks 2d to slide back to their original positions along the bottom of the sliding base 2, and simultaneously drives the adjusting bracket 2d2 to move back to its original positions. Through the extension rod 2c3, the lower pressure plate 2c slides back to its original position along the slide rod 2a1, automatically releasing the pressure and locking on the PCB substrate.

[0048] In order to appropriately adjust the pressing position of the lower pressure plate 2c according to the thickness of the PCB substrate, so as to ensure that when the arc-shaped convex surface 2d1 contacts the tightening part 1c of the limiting slide groove 1b, the lower pressure plate 2c adheres to both ends of the PCB substrate with appropriate force, the following features are specifically designed: The adjusting block 2d has horizontally extending mounting sleeves 2d4 on both sides along the moving direction of the adjusting block 2d. The bottom end of the adjusting bracket 2d2 is slidably installed in the mounting sleeve 2d4. The adjusting bracket 2d2 extends upward through the waist-shaped hole 2d5 provided on the upper side of the mounting sleeve 2d4. A horizontally extending threaded rod 2d7 is provided on one side of the bottom end of the adjusting bracket 2d2. The threaded rod 2d7 extends to the outside of the mounting sleeve 2d4 through the side slot 2d6 provided on the side wall of the mounting sleeve 2d4. The waist-shaped hole 2d5 and the side slot 2d6 extend along the length direction of the mounting sleeve 2d4. A locking nut 2d8 for locking the position of the adjusting bracket 2d2 in the mounting sleeve 2d4 is screwed on the threaded rod 2d7.

[0049] like Figures 14 to 16 As shown, in this embodiment, the operator can change the position of the lower pressure plate 2c on the slide rod 2a1 when the arc-shaped convex surface 2d1 contacts the tightening part 1c of the limiting slide groove 1b by changing the position of the adjusting bracket 2d2 in the mounting sleeve 2d4. This adapts to the processing of PCB substrates of different thicknesses and improves the applicability of the equipment. During pre-adjustment, the operator moves the sliding base 2 to the tightening part 1c of the limiting slide groove 1b, so that the arc-shaped convex surface 2d1 of the adjusting block 2d fits against the inner wall of the tightening part 1c. Then, the operator loosens the locking nut 2d8 to release the locking limit of the adjusting bracket 2d2. Then, the operator moves the lower pressure plate 2c to the position of locking the PCB substrate, and then tightens the locking nut 2d8 to make it fit tightly against the outer wall of the mounting sleeve 2d4, thus completing the rigid locking of the position of the adjusting bracket 2d2.

[0050] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A method for fabricating half-holes on a PCB based on washable protective ink, characterized in that, Includes the following steps: S1. Complete the pattern electroplating process on the PCB substrate; S2. Place the PCB substrate on the moving workbench and pass it through each station in sequence; S3. Print thermosetting washable protective ink in the half-hole area and on the surface of the PCB substrate, so that the thermosetting washable protective ink fills the half-hole and forms a protective layer covering the surface of the PCB substrate. S4. Dry and cure the PCB substrate printed with the thermosetting washable protective ink. S5. Perform a router operation on the PCB substrate printed with the thermosetting washable protective ink to form a half-hole structure. S6. Place the cut PCB substrate in an alkaline stripping solution to remove the thermosetting washable protective ink and obtain the finished PCB.

2. The method for fabricating PCB half-holes based on washable protective ink according to claim 1, characterized in that, The thermosetting washable protective ink is a water-washable pore-filling resin ink (HDR-1).

3. The method for fabricating PCB half-holes based on washable protective ink according to claim 1, characterized in that, The drying and curing conditions are as follows: drying and curing at 130℃±5℃ for 50 minutes.

4. The method for fabricating PCB half-holes based on washable protective ink according to claim 1, characterized in that, The alkaline rinsing solution is a 5% concentration alkaline rinsing solution, and the rinsing environment is stable at 55±5℃.

5. The method for fabricating PCB half-holes based on washable protective ink according to claim 1, characterized in that, The mobile worktable includes a mobile track (1) and a sliding base (2) slidably installed in the mobile track (1). The sliding base (2) is provided with a support surface (2a) for horizontally placing the PCB substrate. The support surface (2a) is provided with positioning pins (2b) coaxial with the mounting holes of the PCB substrate on its periphery. Lower pressure plates (2c) are slidably installed on the upper sides of both sides of the support surface (2a). The lower pressure plates (2c) are attached to the upper sides of both ends of the PCB substrate to fix the PCB substrate.

6. The method for fabricating PCB half-holes based on washable protective ink according to claim 5, characterized in that, The support platform (2a) is provided with several sliding rods (2a1) at both ends of the moving track (1) in the width direction. The sliding rods (2a1) at both ends of the support platform (2a) extend in the inclined direction and form a "V" shape with the opening widening upward. The lower pressure plate (2c) is provided with a slanted sleeve (2c1) coaxial with the sliding rod (2a1). The lower pressure plate (2c) is sleeved on the sliding rod (2a1) through the slanted sleeve (2c1) and keeps the lower pressure plate (2c) horizontal. When the lower pressure plate (2c) is located at the top of the slide bar (2a1), the distance between two adjacent lower pressure plates (2c) is greater than the width of the PCB substrate.

7. The method for fabricating PCB half-holes based on washable protective ink according to claim 5, characterized in that, The bottom of the lower pressure plate (2c) is provided with several nail feet (2c2).

8. A method for fabricating PCB half-holes based on washable protective ink according to claim 6, characterized in that, The moving track (1) is provided with several horizontal guide rods (1a), the sliding base (2) is slidably mounted on the guide rods (1a), and the moving track (1) is provided with a linear actuator for driving the sliding base (2) to move along the axis of the guide rods (1a).

9. A method for fabricating PCB half-holes based on washable protective ink according to claim 8, characterized in that, The middle section of the limiting slide groove (1b) is provided with a tightening part (1c), and the inner width of the tightening part (1c) is smaller than the inner width of the limiting slide groove (1b). Adjustment blocks (2d) are slidably installed on both sides of the bottom of the sliding base (2). The adjustment blocks (2d) and the sliding base (2) are elastically connected by springs (2e). An arc-shaped convex surface (2d1) is provided on the side of the adjustment block (2d) facing the inner wall of the limiting slide groove (1b). The elastic force of the spring (2e) makes the arc-shaped convex surface (2d1) fit against the inner wall of the limiting slide groove (1b). Vertically upward extending adjustment brackets (2d2) are provided on both sides of the adjustment block (2d). Vertically extending limiting holes (2d3) are provided on the adjustment brackets (2d2). Extension rods (2c3) are provided on both sides of the lower pressure plate (2c) and extend horizontally perpendicular to the length direction of the moving track (1). The diameter of the extension rods (2c3) is the same as the inner width of the limiting holes (2d3). The extension rods (2c3) are inserted into the limiting holes (2d3).

10. A method for fabricating PCB half-holes based on washable protective ink according to claim 9, characterized in that, The adjusting block (2d) has horizontally extending mounting sleeves (2d4) on both sides along the moving direction of the adjusting block (2d). The bottom end of the adjusting bracket (2d2) is slidably installed in the mounting sleeve (2d4). The adjusting bracket (2d2) extends upward through the waist-shaped hole (2d5) provided on the upper side of the mounting sleeve (2d4). A horizontally extending threaded rod (2d7) is provided on one side of the bottom end of the adjusting bracket (2d2). The threaded rod (2d7) extends to the outside of the mounting sleeve (2d4) through the side slot (2d6) provided on the side wall of the mounting sleeve (2d4). The waist-shaped hole (2d5) and the side slot (2d6) extend along the length direction of the mounting sleeve (2d4). A locking nut (2d8) for locking the position of the adjusting bracket (2d2) in the mounting sleeve (2d4) is screwed on the threaded rod (2d7).

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