Micro-leds and micro-led display panels

Abstract

A micro LED (110, 510, 610, 711) includes: a bonding layer (111, 511, 611) disposed at the bottom of the micro LED (110, 510, 610, 711); and two or more light-emitting mesa (112, 113, 512, 513, 612, 613) disposed on the bonding layer (111, 511, 611) and arranged vertically from top to bottom, wherein the two or more light-emitting mesa (112, 113, 512, 513, 612, 613) are electrically connected in parallel.

Description

Technical Field

[0001] This disclosure relates to the manufacturing technology of micro light-emitting diodes (LEDs), and more particularly, to a micro LED and a micro LED display panel. Background Technology

[0002] Inorganic micropixel light-emitting diodes (also known as micro LEDs, micro-LEDs, or μ-LEDs) are becoming increasingly important for various applications such as self-emissive microdisplays, visible light communication, and optogenetics. Compared to traditional LEDs, micro LEDs exhibit better strain relaxation, higher light extraction efficiency, and more uniform current distribution, resulting in superior output performance. Micro LEDs also offer other advantages over traditional LEDs, such as better thermal performance, faster response times, a wider operating temperature range, higher resolution, a wider color gamut, higher contrast, lower power consumption, and the ability to operate at higher current densities.

[0003] MicroLEDs consist of a light-emitting mesa and electrical connections to electrodes, allowing for control of the microLED. As the spacing and size of microLEDs become increasingly smaller, their luminous efficiency may decrease significantly. Summary of the Invention

[0004] This disclosure provides a microLED, which includes: a bonding layer disposed at the bottom of the microLED; and two or more light-emitting platforms disposed on the bonding layer, arranged vertically from top to bottom and electrically connected in parallel.

[0005] This disclosure also provides a microLED display panel, which includes an integrated circuit (IC) backplane. The IC backplane includes: a bottom pad array comprising a plurality of bottom pads; and a microLED array formed on the IC backplane, comprising a plurality of microLEDs. One of the plurality of microLEDs is electrically connected to one of the plurality of bottom pads. Each microLED includes a bonding layer bonded to the IC backplane, and two or more light-emitting mesas formed on the bonding layer. The two or more light-emitting mesas are arranged vertically from top to bottom and electrically connected in parallel. Attached Figure Description

[0006] Embodiments and aspects of this disclosure will be set forth in the following detailed description and accompanying drawings. Various features shown in the drawings are not drawn to scale.

[0007] Figure 1 A cross-sectional structural diagram of an exemplary microLED display panel in some embodiments of this disclosure is shown.

[0008] Figure 2 This is a circuit diagram of some embodiments of the present disclosure, showing two light-emitting platforms connected in parallel.

[0009] Figure 3A Some embodiments of this disclosure are shown, such as Figure 1 The diagram shown is a top view of the microLED display panel.

[0010] Figure 3B Some embodiments of this disclosure are shown, such as Figure 1 Another top view of the microLED display panel shown.

[0011] Figure 4A Some embodiments of this disclosure are shown, such as Figure 1 The diagram shown is a top view of the microLED display panel, with the top conductive layer and reinforcing pads removed.

[0012] Figure 4B Some embodiments of this disclosure are shown, such as Figure 1 Another top view of the microLED display panel is shown, in which the top conductive layer and reinforcing pads have been removed.

[0013] Figure 5 A cross-sectional view of another exemplary microLED display panel is shown in some embodiments of this disclosure.

[0014] Figure 6 A cross-sectional view of another exemplary microLED display panel is shown in some embodiments of this disclosure.

[0015] Figure 7 A top view of the micro-LED display panel is shown in some embodiments of this disclosure. Detailed Implementation

[0016] Reference will now be made specifically to exemplary embodiments. Examples of these exemplary embodiments are illustrated in the accompanying drawings. The following description refers to the accompanying drawings, where the same numbers in different figures denote the same or similar elements unless otherwise stated. The implementations set forth in the following description of exemplary embodiments do not represent all implementations consistent with this disclosure. Rather, these implementations are merely examples of apparatuses and methods consistent with the aspects of this disclosure recounted in the appended claims. Specific aspects of this disclosure will now be described in more detail. If any terminology and definitions provided herein conflict with those incorporated by reference, the terminology and definitions provided herein shall prevail.

[0017] This disclosure provides a microLED with improved luminous efficiency, the microLED comprising a plurality of parallel light-emitting mesa.

[0018] Figure 1A cross-sectional view of an exemplary microLED display panel 100 in some embodiments of the present disclosure is shown. MicroLEDs consistent with the present disclosure include two or more light-emitting mesas connected in parallel. Figure 1 Two adjacent microLEDs are shown. The microLED display panel 100 includes a microLED array comprising a plurality of microLEDs 110 and an IC (integrated circuit) backplane 120. The plurality of microLEDs 110 are disposed on the IC backplane 120.

[0019] like Figure 1 As shown, the micro-LED 110 includes a bonding layer 111, which is bonded to an IC backplane 120. In some embodiments, the bonding layer 111 is bonded to the IC backplane 120 via pads 130. In some embodiments, the material of the bonding layer 111 is a metal. For example, the material may include Al, Au, Rh, Ag, Cr, Ti, Pt, Sn, Cu, etc. The material may also include one or more metal alloys, such as AuSn, TiW, etc. A first light-emitting mesa 112 and a second light-emitting mesa 113 are disposed on the bonding layer 111, and the first light-emitting mesa 112 and the second light-emitting mesa 113 are arranged vertically from bottom to top. The first light-emitting mesa 112 is formed on the bonding layer 111 and is electrically connected to the bonding layer 111. The second light-emitting mesa 113 is disposed above the first light-emitting mesa 112. The first light-emitting mesa 112 and the second light-emitting mesa 113 are electrically connected in parallel. For example, the bottom of the first light-emitting platform 112 and the bottom of the second light-emitting platform 113 are connected to the first electrode (e.g., P pad, not shown), and the top of the first light-emitting platform 112 and the top of the second light-emitting platform 113 are connected to the second electrode (e.g., N pad, not shown). Figure 2 This is a circuit diagram of some embodiments of the present disclosure, showing two light-emitting platforms connected in parallel. For example... Figure 2 As shown, the light-emitting mesa (e.g., light-emitting mesa 112 or 113) can be considered as a diode, and the first light-emitting mesa 112 and the second light-emitting mesa 113 are connected in parallel. Reference Figure 1 and Figure 2 The driver 150 can be connected to the microLEDs 110 and configured to control each microLED 110. In some embodiments, the driver 150 can be integrated into the IC backplane 120.

[0020] refer to Figure 1The first light-emitting mesa 112 and the second light-emitting mesa 113 have bottom connection structures 114 disposed on their sides. The bottom connection structures 114 are used to electrically connect the bottom of the first light-emitting mesa 112 and the bottom of the second light-emitting mesa 113. In some embodiments, the second light-emitting mesa 113 further includes a bottom connection layer 116 formed on the bottom of the second light-emitting mesa 113 and electrically connected to the bottom connection structure 114 and the bottom of the second light-emitting mesa 113. Therefore, the bottom of the second light-emitting mesa 113 is electrically connected to the bottom connection structure 114 through the bottom connection layer 116. The bottom connection structure 114 is also electrically connected to the bonding layer 111. For example, the bottom connection structure 114 is electrically connected to the sidewall of the bonding layer 111. Therefore, the bottom connection structure 114 can electrically connect the bottom of the first light-emitting mesa 112 and the bottom of the second light-emitting mesa 113 to a first electrode, such as a P-pad. In some embodiments, the bottom of the bottom connection structure 114 is aligned with the bottom of the bonding layer 111. In some embodiments, the top of the bottom connection structure 114 is aligned with the bottom of the second light-emitting platform 113. In some embodiments, the bottom connection structure 114 is opaque. The bottom connection structure 114 is made of metal. Therefore, the bottom connection structure 114 can also isolate light interference from adjacent micro-LEDs. In some embodiments, the bottom connection structure 114 surrounds half of the micro-LED 110.

[0021] The microLED 110 also includes a top conductive layer 117 formed on top of the microLED 110, the top conductive layer 117 being electrically connected to the top of the second light-emitting mesa 113 and the top of the first light-emitting mesa 112. For example, as Figure 1 As shown, the first light-emitting platform 112 includes a top connection layer 115 formed on the top of the first light-emitting platform 112 and extending outward from the first light-emitting platform 112. The top conductive layer 117 includes a recessed portion 117A that extends downward to the first light-emitting platform 112 and is electrically connected to the top connection layer 115 of the first light-emitting platform 112. Therefore, the top conductive layer 117 can electrically connect the top of the first light-emitting platform 112 and the top of the second light-emitting platform 113. Furthermore, the top conductive layer 117 can also be connected to a second electrode, such as an N-pad. In this structure, the bottoms of the first light-emitting platform 112 and the second light-emitting platform 113 are connected to the first electrode, and the tops of the first light-emitting platform 112 and the second light-emitting platform 113 are connected to the second electrode. Therefore, the first light-emitting platform 112 and the second light-emitting platform 113 are connected in parallel.

[0022] In some embodiments, the top conductive layer 117, the top interconnect layer 115, and the bottom interconnect layer 116 are transparent. In some embodiments, the top conductive layer 117, the top interconnect layer 115, and the bottom interconnect layer 116 are transparent conductive oxide (TCO) thin layers, such as indium tin oxide (ITO) layers, antimony-doped zinc oxide (AZO) layers, antimony-doped tin oxide (ATO) layers, fluorine-doped tin oxide (FTO) layers, etc.

[0023] In some embodiments, the light-emitting area of ​​the first light-emitting platform 112 and the light-emitting area of ​​the second light-emitting platform 113 may be the same, and the first light-emitting platform 112 and the second light-emitting platform 113 may have the same size.

[0024] In some embodiments, the microLED 110 further includes a dielectric material 118 filled between and around the first light-emitting mesa 112 and the second light-emitting mesa 113. The dielectric material 118 is transparent. The material of the dielectric material 118 may be selected from one or more of SiO2, SiON, Al2O3, or SiN.

[0025] In some embodiments, a top conductive layer 117 is interconnected and continuously formed on the top surface of a plurality of microLEDs 110. The top conductive layer 117 is electrically connected to the top of the second light-emitting mesa 113 and the top of the first light-emitting mesa 112 and is connected to a second electrode (e.g., an N-pad). The bonding layers 111 of the microLEDs 110 are connected to the IC backplane 120 via their respective bottom pads 130. Each of the plurality of microLEDs 110 can be independently controlled, for example, via a driver 150 (e.g., ...). Figure 2 (As shown).

[0026] In some embodiments, the microLED display panel 100 further includes reinforcing pads 140 disposed on the top conductive layer 117 to improve the conductivity of the top conductive layer 117. In some embodiments, the reinforcing pads 140 are disposed between adjacent microLEDs. In some embodiments, the reinforcing pads 140 have a mesh structure.

[0027] Figure 3A Some embodiments of this disclosure are shown, such as Figure 1 The diagram shows a top view of the microLED display panel 100. Figure 1 Consistent, Reference Figure 3AA top conductive layer 117 is continuously formed on the micro-LED display panel 100. In this embodiment, reinforcing pads 140 are disposed on the top conductive layer 117 between adjacent micro-LEDs 110 (including bonding layer 111, first light-emitting mesa 112 and second light-emitting mesa 113), and are shown in a grid pattern. The exposed portion of the top conductive layer 340 is rectangular.

[0028] Figure 3B Some embodiments of this disclosure are shown, such as Figure 1 Another top view of the microLED display panel 100 shown. Figure 1 Consistent, Reference Figure 3B A top conductive layer 117 is continuously formed on the micro-LED display panel 100. In this embodiment, reinforcing pads 140 are disposed on the top conductive layer 117 between adjacent micro-LEDs 110 (including bonding layer 111, first light-emitting mesa 112 and second light-emitting mesa 113), and are shown in a grid pattern. The exposed portion of the top conductive layer 117 is circular.

[0029] Figure 4A Some embodiments of this disclosure are shown, such as Figure 1 The diagram shown is a top view of the microLED display panel, with the top conductive layer and reinforcing pads removed. Figure 1 Consistent, Reference Figure 4A A bottom connection structure 114 is provided on one side of the micro LED 110 (e.g., including a bonding layer 111, a first light-emitting platform 112, and a second light-emitting platform 113). The bottom connection structure 114 is connected to the first light-emitting platform 112 through a top connection layer 115 and to the second light-emitting platform 113 through a bottom connection layer 116.

[0030] Figure 4B Some embodiments of this disclosure are shown, such as Figure 1 Another top view of the microLED display panel is shown, in which the top conductive layer and reinforcing pads have been removed. Figure 1 Consistent, Reference Figure 4B The bottom connection structure 114 is disposed around a semi-circumference of the micro-LED display panel 110 (e.g., including a bonding layer 111, a first light-emitting mesa 112, and a second light-emitting mesa 113). The bottom connection structure 114 is connected to the first light-emitting mesa 112 via a top connection layer 115 and to the second light-emitting mesa 113 via a bottom connection layer 116. In this embodiment, the bottom connection structure 114 can also isolate light interference from adjacent micro-LEDs 110.

[0031] Figure 5A cross-sectional view of another exemplary microLED display panel 500 in some embodiments of this disclosure is shown. The microLED display panel 500 includes a microLED array comprising a plurality of microLEDs 510 disposed on an IC backplane 520. Figure 5 As shown, the micro-LED 510 includes a bonding layer 511, a first light-emitting mesa 512, a second light-emitting mesa 513, and a bottom connection structure 514. In this embodiment, the first light-emitting mesa 512 further includes a first bottom connection layer 519 formed on and electrically connected to the bottom of the first light-emitting mesa 512. The first bottom connection layer 519 is disposed between the bottom of the first light-emitting mesa 512 and the bonding layer 511 to electrically connect the bottom of the first light-emitting mesa 512 and the bonding layer 511. The first bottom connection layer 519 extends outward from the first light-emitting mesa 512 to electrically connect to the bottom connection structure 514. The second light-emitting mesa 513 further includes a second bottom connection layer 516 formed on and electrically connected to the bottom of the second light-emitting mesa 513. The second bottom connection layer 516 extends outward from the second light-emitting mesa 513 to electrically connect to the bottom connection structure 514. Therefore, the bottom connection structure 514 electrically connects the bottom of the first light-emitting mesa 512 and the bottom of the second light-emitting mesa 513. The bottoms of the first light-emitting mesa 512 and the bottoms of the second light-emitting mesa 513 can also be connected to the first electrode (not shown) via a bonding layer 511. In some embodiments, the bonding layer 511 is made of metal. For example, the material may include: Al, Au, Rh, Ag, Cr, Ti, Pt, Sn, Cu, etc. The material may also include one or more metal alloys, such as AuSn, TiW, etc.

[0032] In this embodiment, the bottom connection structure 514 is not directly connected to the bonding layer 511, but is indirectly connected through the first bottom connection layer 519. The bottom of the bottom connection structure 514 is aligned with the top of the bonding layer 511.

[0033] In some embodiments, the micro-LED display panel 500 further includes a dielectric material 515 filled between and around the first light-emitting mesa 512 and the second light-emitting mesa 513. The dielectric material 515 is transparent. The material of the dielectric material 515 may be selected from one or more of SiO2, SiON, Al2O3, or SiN.

[0034] For a description of other features of the micro-LED display panel 500, please refer to the above. Figure 1 The corresponding features described herein will not be elaborated upon here.

[0035] Figure 6This is a cross-sectional view of another exemplary microLED display panel 600 in some embodiments of this disclosure. The microLED display panel 600 includes a microLED array, which includes a plurality of microLEDs 610 disposed on an IC backplane 620. Figure 6 As shown, the microLED 610 includes a bonding layer 611, a first light-emitting mesa 612, a second light-emitting mesa 613, and a bottom connection structure 614. The bottom connection structure 614 is electrically connected to the bottom of the second light-emitting mesa 613. For example, the bottom connection structure 614 is electrically connected to the bottom of the second light-emitting mesa 613 via a bottom connection layer 616. The bottom connection structure 614 is further electrically connected to the bonding layer 611. Since the bottom of the first light-emitting mesa 612 is electrically connected to the bonding layer 611, the bottom of both the first light-emitting mesa 612 and the bottom of the second light-emitting mesa 613 are electrically connected to the bonding layer 611 and further connected to a first electrode (not shown), such as a P-pad. In some embodiments, the bottom of the bottom connection structure 614 is aligned with the bottom of the bonding layer 611. The top of the bottom connection structure 614 is aligned with the bottom of the second light-emitting mesa 613.

[0036] In this embodiment, the micro-LED 610 further includes a top connection structure 619, which is electrically connected to the top of the first light-emitting platform 612 and the top of the second light-emitting platform 613. A top conductive layer 617 is disposed on the top of the second light-emitting platform 613 and electrically connected to the top of the second light-emitting platform 613. The first light-emitting platform 612 includes a top connection layer 615 formed on the top of the first light-emitting platform 612 and electrically connected to the top of the first light-emitting platform 612. The top connection structure 619 is disposed on the other side of the first light-emitting platform 612 and the second light-emitting platform 613, and below the top conductive layer 617. The top connection structure 619 is electrically connected to the top conductive layer 617 and the top connection layer 615. Therefore, the first light-emitting platform 612 is connected in parallel with the second light-emitting platform 613 through the top connection structure 619 and the bottom connection structure 614.

[0037] In some embodiments, the top connection layer 615 and the bottom connection layer 616 are transparent. In some embodiments, the top connection layer 615 and the bottom connection layer 616 are transparent conductive oxide (TCO) thin layers, such as indium tin oxide (ITO) layers, antimony-doped zinc oxide (AZO) layers, antimony-doped tin oxide (ATO) layers, fluorine-doped tin oxide (FTO) layers, etc.

[0038] In some embodiments, the light-emitting area of ​​the first light-emitting platform 612 is the same as that of the second light-emitting platform 613, and the first light-emitting platform 612 and the second light-emitting platform 613 have the same dimensions.

[0039] In some embodiments, the top surface area of ​​the bonding layer 611 is larger than the bottom surface area of ​​the first light-emitting platform 612.

[0040] In some embodiments, the top conductive layers 617 of the plurality of microLEDs are interconnected and continuously formed on the top surfaces of the plurality of microLEDs 610. The top conductive layers 617 electrically connect the top of the first light-emitting mesa 612 and the top of the second light-emitting mesa 613 to a second electrode (e.g., an N-pad, not shown). Since the bonding layers 611 of the microLEDs 610 are connected to the IC backplane 620 through their respective bottom pads 630, each of the plurality of microLEDs 610 can be controlled independently.

[0041] In some embodiments, the microLED display panel 600 further includes reinforcing pads 640 disposed on the top conductive layer 617 to improve the conductivity of the continuous top conductive layers 617. In some embodiments, the reinforcing pads 640 are disposed between adjacent microLEDs. In some embodiments, the reinforcing pads 640 have a mesh structure.

[0042] For a description of other features of the micro-LED display panel 600, please refer to the above. Figure 1 The corresponding features described herein will not be elaborated upon here.

[0043] refer to Figures 1 to 6 Understandably, two or more light-emitting platforms can be set in the vertical direction and connected in parallel in a similar manner.

[0044] In some embodiments, two or more light-emitting platforms emit light of the same color, thereby improving the luminous efficiency of monochrome LEDs.

[0045] Figure 7 A top view of a micro-LED display panel 700 according to some embodiments of this disclosure is shown. (See reference...) Figure 7The microLED display panel 700 includes a microLED array 710 and an IC backplane 720. The microLED array 710 is located on the IC backplane 720, forming the image display area of ​​the microLED display panel 700. The remaining area of ​​the IC backplane 720 not covered by the microLED array 710 is formed as a non-functional area. The IC backplane 720 is formed on the back of the microLED array 710, with a portion extending beyond the microLED array 710, i.e., not covered by the microLED array 710. The microLED array 710 includes a plurality of microLEDs 711 arranged in an array. The IC backplane 720 is configured to control the plurality of microLEDs 711. The IC backplane 720 may include a bottom pad array (not shown) corresponding to the microLED array 710. The bottom pad array includes a plurality of bottom pads (e.g., bottom pads 130 or 630), with one bottom pad corresponding to one microLED 711. Each of the plurality of microLEDs is electrically connected to one bottom pad.

[0046] In some embodiments, the top conductive layer of the microLED 711 (e.g., Figure 1 The top conductive layer 117 or Figure 6 The top conductive layer 617 is interconnected with each of the plurality of microLEDs 711. That is, the top conductive layer is continuously formed on top of the microLED array 710 and connected to each microLED 711. In some embodiments, reinforcing pads (e.g., ...) are provided on the top conductive layer between adjacent microLEDs 711. Figure 1 The reinforced pad 140 in the middle, Figure 5 The reinforced pad 540 in the middle, or Figure 6 (640 in the middle). Reinforced pad interconnects improve the conductivity of the top interconnect layer.

[0047] In some embodiments, the IC backplane 720 further includes top connection pads 721. A top conductive layer (e.g., Figure 1 The top conductive layer 117 and Figure 6 The top conductive layer 617 is connected to the top connection pad 721.

[0048] Each microLED described herein (e.g., microLEDs 110, 510, 610) is extremely small. MicroLEDs can be used in microLED display panels. The light-emitting area of ​​a microLED display panel (e.g., microLED display panel 700) is very small, such as 1mm × 1mm, 3mm × 5mm, etc. In some embodiments, the light-emitting area is the area of ​​the microLED array in the microLED display panel. The microLED display panel includes one or more microLEDs forming a pixel array with microLEDs as pixels, such as a 1600 × 1200, 680 × 480, or 1920 × 1080 pixel array. The diameter of each microLED is in the range of approximately 200nm to 2μm. An IC backplane, such as IC backplane 720, is formed on the back side of the microLED array 710, and the IC backplane is electrically connected to the microLED array 710. The IC backplane 720 acquires signals such as image data from the outside via signal lines to control the corresponding microLED 711 to emit or not emit light.

[0049] Those skilled in the art will understand that the microLED display panel is not limited to the structure described above, and may include more or fewer components than shown in the figure, or may combine some components, or may use different components.

[0050] It is important to note that the relational terms used in this document, such as “first” and “second”, are used only to distinguish one entity or operation from another, and do not require or imply any actual relationship or order between these entities or operations. Furthermore, words such as “including,” “having,” “containing,” and “comprising,” as well as other similar forms, should have the same meaning and are open-ended; one or more items following any of these words do not imply an exhaustive list of those items, nor do they imply limitation to only one or more of the listed items.

[0051] Unless otherwise specified, the term "or" as used herein covers all possible combinations except where it is impractical. For example, if a database is declared to contain A or B, then unless otherwise specified or impractical, the database may include A, or B, or A and B. As a second example, if a database is declared to contain A, B, or C, then unless otherwise specified or impractical, the database may include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C.

[0052] In the foregoing specification, embodiments have been described with reference to numerous specific details, which may vary from embodiment to embodiment. Certain adjustments and modifications may be made to the embodiments. Other embodiments will be apparent to those skilled in the art based on the specification and practice of the invention disclosed herein. The specification and examples should be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims. The sequence of steps shown in the figures is for illustrative purposes only and is not intended to limit any particular order of steps. Therefore, those skilled in the art will understand that these steps may be performed in a different order when implementing the same method.

[0053] Exemplary embodiments have been disclosed in the accompanying drawings and description. However, various changes and modifications can be made to these embodiments. Therefore, although specific terms are used, they are used in a general and descriptive sense only and not for limiting purposes.

Claims

1. A micro LED (light-emitting diode), characterized in that, include: A bonding layer disposed at the bottom of the microLED; as well as Two or more light-emitting platforms are disposed on the bonding layer, arranged vertically from top to bottom, and electrically connected in parallel.

2. The microLED according to claim 1, characterized in that, The two or more light-emitting platforms include: A first light-emitting platform is disposed on the bonding layer and electrically connected to the bonding layer; and A second light-emitting platform is disposed above the first light-emitting platform. The bottom of the first light-emitting platform is electrically connected to the bottom of the second light-emitting platform, and the top of the first light-emitting platform is electrically connected to the top of the second light-emitting platform.

3. The microLED according to claim 2, characterized in that, It also includes a bottom connection structure, which is disposed on the side of the two or more light-emitting platforms and is used to connect the bottom of the first light-emitting platform and the bottom of the second light-emitting platform.

4. The microLED according to claim 3, characterized in that, The second light-emitting mesa includes a bottom connection layer formed at the bottom of the second light-emitting mesa and extending outward from the second light-emitting mesa to be electrically connected to the bottom connection structure, the bottom connection structure being electrically connected to the bonding layer.

5. The microLED according to claim 3, characterized in that, The first light-emitting platform includes a first bottom connection layer formed between the bottom of the first light-emitting platform and the bonding layer to electrically connect the bottom of the first light-emitting platform and the bonding layer. The first bottom connection layer extends outward from the first light-emitting platform to electrically connect to the bottom connection structure. The second light-emitting platform includes a second bottom connection layer formed at the bottom of the second light-emitting platform and extending outward from the second light-emitting platform to electrically connect to the bottom connection structure.

6. The microLED according to claim 3, characterized in that, The bottom of the bottom connection structure is aligned with the bottom of the bonding layer.

7. The microLED according to claim 6, characterized in that, The top of the bottom connecting structure is aligned with the bottom of the second light-emitting platform.

8. The microLED according to claim 7, characterized in that, The bottom connection structure is also configured for optical isolation.

9. The microLED according to claim 8, characterized in that, The bottom connection structure surrounds half the circumference of the microLED.

10. The microLED according to claim 2, characterized in that, It also includes a top conductive layer formed on top of the microLED, the top conductive layer being electrically connected to the top of the second light-emitting platform and the top of the first light-emitting platform.

11. The microLED according to claim 10, characterized in that, The first light-emitting platform includes a top connecting layer formed on the top of the first light-emitting platform and extending outward from the first light-emitting platform, and the top conductive layer includes a recessed portion electrically connected to the top conductive layer of the first light-emitting platform.

12. The microLED according to claim 10, characterized in that, The first light-emitting platform includes a top connection layer formed on the top of the first light-emitting platform and extending outward from the first light-emitting platform. The microLED also includes a top connection structure that electrically connects the top connection layer and the top conductive layer of the first light-emitting platform.

13. A micro LED (light-emitting diode) display panel, characterized in that, include: An integrated circuit (IC) backplane includes a bottom pad array, the bottom pad array comprising a plurality of bottom pads; and A microLED array formed on the IC backplane, the microLED array comprising multiple microLEDs; One of the plurality of microLEDs is electrically connected to one of the plurality of bottom pads, and each of the plurality of microLEDs comprises: The bonding layer bonded to the IC backplane; as well as Two or more light-emitting platforms are disposed on the bonding layer, arranged vertically from top to bottom, and electrically connected in parallel.

14. The microLED display panel according to claim 13, characterized in that, The two or more light-emitting platforms include: A first light-emitting platform is disposed on the bonding layer and electrically connected to the bonding layer; and The second light-emitting platform is disposed above the first light-emitting platform. The bottom of the first light-emitting platform is electrically connected to the bottom of the second light-emitting platform, and the top of the first light-emitting platform is electrically connected to the top of the second light-emitting platform.

15. The micro-LED display panel according to claim 14, characterized in that, The microLED also includes a top conductive layer formed on the top of each of the plurality of microLEDs and electrically connected to the top of the second light-emitting platform and the top of the first light-emitting platform.

16. The microLED display panel according to claim 15, characterized in that, The top conductive layer of the plurality of microLEDs is interconnected.

17. The micro-LED display panel according to claim 16, characterized in that, It also includes reinforcement pads disposed on the top conductive layer and between adjacent microLEDs, the reinforcement pads being configured to improve the conductivity of the top conductive layer.

18. The microLED display panel according to claim 16, characterized in that, The IC backplane also includes a top connection pad, and the top conductive layer is connected to the top connection pad of the IC backplane.

19. The microLED display panel according to claim 14, wherein, The microLED also includes a bottom connection structure disposed on the side of the two or more light-emitting platforms, for connecting the bottom of the first light-emitting platform and the bottom of the second light-emitting platform.

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