Method and device for detecting package substrate, electronic equipment and storage medium

Abstract

The present disclosure provides a detection method and device of a packaging substrate, an electronic device and a storage medium. The method comprises: obtaining a historical defect file of a packaging substrate to be detected in a previous detection stage; performing defect detection on the packaging substrate to be detected in a current detection stage to obtain a current defect file of the packaging substrate to be detected in the current detection stage; determining a target defect substrate newly added in the current detection stage from the packaging substrate to be detected according to the historical defect file and the current defect file, and performing a scrapping process on the target defect substrate. In this way, repeated detection of the target defect substrate in a next detection stage is avoided, unnecessary detection time and resource consumption are reduced, and the detection efficiency of the packaging substrate is improved.

Description

Technical Field

[0001] This disclosure relates to the field of substrate testing technology, and in particular to a method, apparatus, electronic device and storage medium for testing packaged substrates. Background Technology

[0002] As a key component in electronic component packaging, the packaging substrate plays a crucial role in its inspection. However, the inspection of packaging substrates involves multiple stages, and inspecting all packaging substrates at each stage results in repeated inspections of defective substrates, leading to low inspection efficiency.

[0003] Therefore, how to avoid repeated testing of defective packaging substrates, which leads to low testing efficiency, has become an urgent technical problem to be solved.

[0004] Based on the background description, packaging substrates undergo inspection at various stations, including Automated Optical Inspection (AOI), Electrical Test (ET), and Automatic Visual Inspection (AVI). At each station, the same strip of packaging substrate may contain both good and defective products. When the product is transferred to the next production process, if the station does not distinguish between good and defective products, the entire strip of packaging substrate needs to be inspected as a whole. This results in the repeated inspection of defective products from the previous station, leading to a waste of equipment and human resources, and reduced efficiency.

[0005] When an AOI site has already identified and scrapped the corresponding unit in the inner layer of the packaging substrate, the incoming material inspection of the secondary or outer layer will also perform an integrity scan inspection on the incoming material of the defective unit in the inner layer that has already been scrapped. This results in a waste of inspection resources, and the defects will contain a large amount of duplicate defect data, which will mask the real process fluctuation data, leading to inaccurate defect data output yield and problems such as the lack of traceability of defect data chain integrity.

[0006] When the packaging substrate arrives at the electrical testing station, it undergoes full-area / board-wide testing again. Defective units corresponding to packaging substrates already scrapped at previous processes are repeatedly reported during electrical testing, impacting equipment operating capacity. Repeated reporting of defective units from previous processes hinders data traceability and identification, making it difficult to distinguish between historical and new defects, and hindering data analysis and process optimization. Repeated electrical testing of packaging substrates with defects from previous processes increases the number of times probes encounter poor contact, thus shortening the lifespan of the fixture probes.

[0007] When the substrate is packaged at the AVI station, the AVI equipment will perform a comprehensive surface defect inspection scan on the incoming substrate, outputting images of the defects on the entire board. Then, the staff needs to confirm and judge all the defect images. Defective substrates from the previous process cannot be skipped, which means that defective products need to be checked and judged repeatedly at different stations, thereby reducing production efficiency, increasing labor costs, and wasting resource allocation. Summary of the Invention

[0008] In view of this, the purpose of this disclosure is to provide a method, apparatus, electronic device and storage medium for testing a packaged substrate to solve or partially solve the above-mentioned technical problems.

[0009] To achieve the above objectives, the first aspect of this disclosure provides a method for inspecting a packaging substrate, the method comprising:

[0010] Obtain historical defect files of the packaging substrate under test from the previous testing stage; Defect detection is performed on the packaged substrate under test in the current detection stage to obtain the current defect file of the packaged substrate under test in the current detection stage; Based on the historical defect file and the current defect file, a new target defect substrate is identified from the package substrates under test in the current testing stage, and the target defect substrate is scrapped.

[0011] Based on the same inventive concept, a second aspect of this disclosure provides a testing device for a packaging substrate, comprising: The acquisition module is configured to acquire historical defect files of the package substrate under test in the previous inspection stage; The defect detection module is configured to perform defect detection on the package substrate under test in the current detection stage and obtain the current defect file of the package substrate under test in the current detection stage. The scrapping module is configured to determine, based on the historical defect file and the current defect file, a target defect substrate newly added in the current testing stage from the package substrate under test, and to scrap the target defect substrate.

[0012] Based on the same inventive concept, a third aspect of this disclosure proposes an electronic device including a memory, a processor, and a computer program stored in the memory and executable by the processor, wherein the processor implements the method described above when executing the computer program.

[0013] Based on the same inventive concept, a fourth aspect of this disclosure provides a non-transitory computer-readable storage medium that stores computer instructions for causing a computer to perform the methods described above.

[0014] As described above, the present disclosure provides a method, apparatus, electronic device, and storage medium for inspecting packaged substrates. The method involves: acquiring historical defect files of the packaged substrate under test from the previous inspection stage; performing defect inspection on the packaged substrate under test in the current inspection stage to obtain the current defect file of the packaged substrate under test in the current inspection stage; identifying target defective substrates newly added in the current inspection stage from the packaged substrates under test based on the historical and current defect files, and scrapping the target defective substrates. In this way, based on the historical and current defect files, the target defective substrates newly added in the current inspection stage can be accurately identified. By scrapping the target defective substrates, repeated inspection of the target defective substrates in the next inspection stage is avoided, reducing unnecessary inspection time and resource consumption, thereby improving the inspection efficiency of the packaged substrates. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this disclosure or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a flowchart of a method for detecting a packaging substrate according to an embodiment of the present disclosure; Figure 2 This is a flowchart illustrating the skip detection process for a target defective substrate according to an embodiment of the present disclosure; Figure 3 This is a schematic diagram of an optical defect file according to an embodiment of the present disclosure; Figure 4 This is a schematic diagram of an electrical defect file according to an embodiment of the present disclosure; Figure 5 This is a schematic diagram of an appearance defect file according to an embodiment of the present disclosure; Figure 6 This is a schematic diagram of the target control in an embodiment of this disclosure; Figure 7 This is a schematic diagram illustrating the reading of the current defective file in an embodiment of this disclosure; Figure 8 This is a schematic diagram of the first settings interface according to an embodiment of the present disclosure; Figure 9 This is a schematic diagram of the second settings interface according to an embodiment of the present disclosure; Figure 10 This is a schematic diagram of an information input interface according to an embodiment of the present disclosure; Figure 11 This is a schematic diagram illustrating the updating of defective files according to an embodiment of this disclosure; Figure 12This is a schematic diagram of the structure of the testing device for the packaging substrate according to an embodiment of the present disclosure; Figure 13 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0018] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in the embodiments of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0019] As mentioned above, how to avoid repeated inspections of defective packaging substrates, which leads to low inspection efficiency, has become an important research problem.

[0020] Based on the above description, such as Figure 1 As shown, the method for detecting a packaging substrate proposed in this embodiment includes: Step 101: Obtain the historical defect file of the package substrate under test in the previous testing stage.

[0021] In specific implementation, the embodiments of this disclosure are applied to the inspection system of the packaging substrate. The system includes: Manufacturing Execution System (MES), Equipment (EQP), and Quality Management System (QMS).

[0022] To improve production efficiency, increase equipment uptime, reduce labor costs, and avoid the problem of repeatedly inspecting defective packaging substrates, a packaging substrate inspection system is implemented to skip target defective substrates, thereby improving packaging substrate production efficiency, increasing equipment uptime, and saving labor costs.

[0023] Among them, equipment utilization rate refers to the ratio of the actual operating time of equipment to the planned operating time (or theoretically operable time) within a certain period of time. Equipment utilization rate reflects the effective proportion of equipment actually used for production and embodies the time utilization efficiency of equipment.

[0024] Multiple test packages are set in a strip substrate. Before defect detection of the test packages in each inspection stage, the strip substrate of the target production batch is selected by the Manufacturing Execution System (MES) and enters the station. The Quality Management System (QMS) reads the historical defect files of the test packages in the strip substrate from the previous inspection stage and sends the historical defect files to the preset machine sharing path.

[0025] Step 102: Perform defect detection on the packaged substrate under test in the current detection stage to obtain the current defect file of the packaged substrate under test in the current detection stage.

[0026] In practice, the current testing phase includes at least one of the following: optical testing phase, electrical performance testing phase, and appearance testing phase.

[0027] The strip substrate is set onto the inspection equipment (EQP) corresponding to the current inspection stage using the Manufacturing Execution System (MES), completing the on-machine operation of the strip substrate. The inspection equipment (EQP) corresponding to the current inspection stage performs defect detection on the package substrate under test in the strip substrate, obtaining the current defect file of the package substrate under test in the current inspection stage.

[0028] The current defect file can be a text file (TXT) or a comma-separated values ​​file (CSV).

[0029] After the testing of the packaged substrate is completed, the strip substrate is removed from the inspection equipment (EQP) corresponding to the current inspection stage by the Manufacturing Execution System (MES), completing the strip substrate removal operation. At the same time, the current defect file is stored in the Quality Management System (QMS).

[0030] Step 103: Based on the historical defect file and the current defect file, determine the target defect substrate newly added in the current testing stage from the package substrate to be tested, and scrap the target defect substrate.

[0031] In practice, the quality management system (QMS) is used to compare historical defect files with current defect files. If the current defect file is inconsistent with the historical defect file, it is determined that there is a new target defect substrate in the current inspection stage. If the current defect file is consistent with the historical defect file, it is determined that there is no new target defect substrate in the current inspection stage.

[0032] The Quality Management System (QMS) determines whether any new target defect substrates exist during the current inspection phase. If no new target defect substrates exist during the current inspection phase, the Manufacturing Execution System (MES) controls the shipment of the strip substrates from the target production batch (Lot). If new target defect substrates exist during the current inspection phase, the QMS records the number of target defect substrates, and the target defect substrates are scrapped. Then, the MES controls the shipment of the strip substrates from the target production batch (Lot).

[0033] Figure 2 This is a flowchart illustrating the skip detection process for a target defective substrate according to an embodiment of this disclosure. Figure 2 As shown, the strip substrate of the target production batch is selected by the Manufacturing Execution System (MES) and enters the station. The Quality Management System (QMS) reads the historical defect files of the package substrate to be tested in the previous inspection stage and sends the historical defect files to the preset machine sharing path.

[0034] The manufacturing execution system (MES) sets the strip substrate onto the inspection equipment (EQP) corresponding to the current inspection stage, completing the strip substrate's onboarding operation. The inspection equipment (EQP) corresponding to the current inspection stage performs defect detection on the package substrate under test in the strip substrate, obtaining the current defect file of the package substrate under test in the current inspection stage, and storing the current defect file in the quality management system (QMS).

[0035] After the testing of the packaged substrate is completed, the strip substrate is removed from the testing equipment (EQP) corresponding to the current testing stage by the manufacturing execution system (MES), thus completing the strip substrate removal operation.

[0036] The Quality Management System (QMS) compares historical and current defect files to determine if any new target defect substrates exist during the current inspection phase. If no new target defect substrates exist, the Manufacturing Execution System (MES) controls the shipment of the strip substrates from the target production batch (Lot). If new target defect substrates exist, the QMS records the number of target defect substrates, scraps them, and then the MES controls the shipment of the strip substrates from the target production batch (Lot).

[0037] This disclosure applies to the site inspection processing method of packaging substrates. By skipping the inspection of target defective substrates in the packaging substrates to be tested, the product processing efficiency is improved, resource and labor costs are reduced, and the accuracy and traceability of digital data are enhanced.

[0038] Through the above embodiments, historical defect files of the packaged substrate under test in the previous inspection stage are obtained. Defect detection is performed on the packaged substrate under test in the current inspection stage to obtain the current defect file of the packaged substrate under test in the current inspection stage. Based on the historical defect file and the current defect file, newly added target defect substrates in the current inspection stage are identified from the packaged substrates under test, and these target defect substrates are scrapped. In this way, based on the historical and current defect files, newly added target defect substrates in the current inspection stage can be accurately identified. By scrapping these target defect substrates, repeated inspection of the target defect substrates in the next inspection stage is avoided, reducing unnecessary inspection time and resource consumption, thereby improving the inspection efficiency of the packaged substrate.

[0039] In some embodiments, step 101 includes: Step 1011: Determine whether the current detection stage is the initial detection stage.

[0040] In practice, the inspection of the packaged substrate includes multiple inspection stages. By determining whether the current inspection stage is the initial inspection stage, it is possible to accurately determine whether there were any previous inspection stages before the current inspection stage.

[0041] Step 1012: In response to the current detection stage being the initial detection stage, the initial detection file of the package substrate under test is obtained, and the initial detection file is used as a historical defect file.

[0042] In practice, when the current testing stage is the initial testing stage, it means that there were no previous testing stages before the current testing stage. In this case, the initial testing file of the packaged substrate under test is used as the historical defect file. The defect substrate information in the initial testing file can be empty.

[0043] Step 1013: In response to the fact that the current detection stage is not the initial detection stage, the historical defect file of the package substrate under test in the previous detection stage is obtained.

[0044] In practice, if the current testing stage is not the initial testing stage, it indicates that there was a previous testing stage. In this case, the historical defect file of the packaged substrate under test in the previous testing stage is obtained. The historical defect file may contain defect substrate information from multiple historical testing stages.

[0045] For example, if the current inspection stage is the second inspection stage, then the historical defect file contains information about defective substrates generated in the first inspection stage. Similarly, if the current inspection stage is the third inspection stage, then the historical defect file contains information about defective substrates generated in both the first and second inspection stages.

[0046] The above method determines whether the current testing stage is the initial testing stage. If it is, the initial testing file of the packaged substrate under test is obtained and used as the historical defect file. If the current testing stage is not the initial testing stage, the historical defect file of the packaged substrate under test from the previous testing stage is obtained. In this way, by determining whether the current testing stage is the initial testing stage, the historical defect file of the packaged substrate under test can be accurately obtained in different scenarios.

[0047] In some embodiments, the current detection stage is the optical detection stage, the packaged substrate under test is the initial packaged substrate under test, and the historical defect file is the initial detection file.

[0048] Step 102 includes: Step 102A: Perform optical inspection on the initial test package substrate to obtain an optical defect file of the initial test package substrate during the optical inspection stage.

[0049] In practice, the optical inspection stage can be the first inspection stage of the packaged substrate. During the optical inspection stage, an automated optical inspection (AOI) is performed on the initial packaged substrate to obtain an optical defect file. This optical defect file can be a text file (TXT) or a comma-separated value file (CSV).

[0050] Specifically, the strip substrate of the target production batch is selected by the Manufacturing Execution System (MES) and enters the station. The initial inspection file of the initial test package substrate in the strip substrate is read by the Quality Management System (QMS) and the initial inspection file is sent to the preset machine shared path.

[0051] The manufacturing execution system (MES) sets the strip substrate onto the optical inspection equipment (EQP) corresponding to the optical inspection stage, completing the on-machine operation of the strip substrate. The optical inspection equipment (EQP) performs defect detection on the initial test package substrate in the strip substrate to obtain optical defect files, which are then stored in the quality management system (QMS).

[0052] After completing the optical inspection of the initial test package substrate, the strip substrate is removed from the optical inspection equipment (EQP) by the manufacturing execution system (MES), completing the strip substrate removal operation.

[0053] Figure 3 This is a schematic diagram of an optical defect file according to an embodiment of this disclosure. Figure 3 As shown, the optical defect file includes: the total number of packaging substrates in the strip, the total number of strips in the current batch, the number of blocks, the completed inspection stage, the QR code of the strip, and the first location information of the first defective substrate.

[0054] like Figure 3 As shown, in the strip substrate, there are 8 packaging substrates in the first direction (X direction) and 12 packaging substrates in the second direction (Y direction), for a total of 8 × 12 = 96 packaging substrates in the strip substrate. The current batch of strip substrates contains 1 strip substrate. The number of blocks is 48. Based on this, each defect inspection can inspect 48 packaging substrates in the strip substrate, completing the defect inspection of the entire strip substrate through two inspections. The completed inspection stage is the optical inspection stage. The QR code of the strip substrate is 20091832010109. The first location information of the first defective substrate includes the first defective substrate. .

[0055] Step 103 includes: Step 103A: Based on the optical defect file and the initial inspection file, determine the first defective substrate newly added in the optical inspection stage from the initial packaging substrate to be tested, and scrap the first defective substrate to obtain the first normal packaging substrate.

[0056] In practice, the optical defect file and the initial inspection file are compared to identify the first defective substrate newly added during the optical inspection stage from the initial packaged substrates to be tested. The first defective substrate is then scrapped to obtain the first normal packaged substrate. The first defective substrate is the packaged substrate for which defects were detected during the optical inspection stage, while the first normal packaged substrate is the packaged substrate for which no defects were detected during the optical inspection stage.

[0057] Specifically, the initial inspection documents and optical defect documents are compared using the Quality Management System (QMS) to determine if any new first-defect substrates were added during the optical inspection stage. If no new first-defect substrates were found during the optical inspection stage, the Manufacturing Execution System (MES) controls the strip substrates of the target production batch (Lot) to leave the station. If new first-defect substrates were found during the optical inspection stage, the QMS records the number of first-defect substrates, and the first-defect substrates are scrapped. Then, the MES controls the strip substrates of the target production batch (Lot) to leave the station.

[0058] In this way, by scrapping the first defective substrate, the strip substrate leaving the station and entering the next inspection stage will only have the first normal packaged substrate. The first defective substrate will not be repeatedly inspected in the next inspection stage, reducing unnecessary inspection time and resource consumption, thereby improving the inspection efficiency of the packaged substrate.

[0059] The above scheme involves optical inspection of the initial test package substrate to obtain an optical defect file during the optical inspection stage. This facilitates the reading of the optical defect file in the next inspection stage, allowing the identification of the first defective substrate. This enables the first defective substrate to be skipped in the next inspection stage, avoiding repeated inspection and improving the inspection efficiency of the package substrate. Based on the optical defect file and the initial inspection file, the first defective substrate newly added during the optical inspection stage is identified from the initial test package substrates. This first defective substrate is then discarded to obtain the first normal package substrate. By discarding the first defective substrate, it is prevented from being repeatedly inspected in the next inspection stage, reducing unnecessary inspection time and resource consumption, thereby improving the inspection efficiency of the package substrate.

[0060] In some embodiments, the current testing stage is an electrical performance testing stage, the previous testing stage is an optical testing stage, the packaged substrate under test is a first normal packaged substrate, and the historical defect file is an optical defect file.

[0061] Step 102 includes: Step 102B: Perform electrical performance testing on the first normal packaging substrate to obtain an electrical defect file of the first normal packaging substrate during the electrical performance testing stage.

[0062] In practice, the electrical performance testing stage can be the second testing stage of the packaged substrate. During the electrical performance testing stage, an electrical performance test (ET) is performed on the first normal packaged substrate to obtain an electrical defect file. This electrical defect file can be a text file (TXT) or a comma-separated value file (CSV).

[0063] Specifically, the target production batch (Lot) of strip substrates that have completed optical inspection is controlled by the Manufacturing Execution System (MES) and enters the station. The quality management system (QMS) reads the optical defect file of the first normal packaged substrate in the strip substrate and sends the optical defect file to the preset machine shared path.

[0064] The manufacturing execution system (MES) sets the strip substrate onto the electrical testing equipment (EQP) corresponding to the electrical performance testing stage, completing the on-machine operation of the strip substrate. The electrical testing equipment (EQP) performs defect detection on the first normal package substrate in the strip substrate to obtain electrical defect files, which are then stored in the quality management system (QMS).

[0065] After completing the electrical testing of the first normal package substrate, the strip substrate is removed from the electrical testing equipment (EQP) by the manufacturing execution system (MES), completing the strip substrate removal operation.

[0066] Figure 4 This is a schematic diagram of an electrical defect document according to an embodiment of this disclosure. Figure 4 As shown, the electrical defect file includes: the total number of packaging substrates in the strip, the total number of strips in the current batch, the number of blocks, the completed inspection stage, the QR code of the strip, the first location information of the first defective substrate, and the second location information of the second defective substrate.

[0067] like Figure 4As shown, in the strip substrate, there are 8 packaging substrates in the first direction (X direction) and 12 packaging substrates in the second direction (Y direction), for a total of 8 × 12 = 96 packaging substrates in the strip substrate. The current batch of strip substrates contains 1 strip substrate. The number of blocks is 48. Based on this, each defect inspection can inspect 48 packaging substrates in the strip substrate, completing the defect inspection of the entire strip substrate through two inspections. The completed inspection stages are the optical inspection stage and the electrical performance inspection stage. The QR code of the strip substrate is 20091832010109. The first location information of the first defective substrate includes the first defective substrate. The second location information of the second defective substrate includes the second defective substrate. Second defective substrate Among them, the second defective substrate The number 0010 indicates an open circuit defect, and the second defective substrate. The number 0032 indicates a short-circuit defect.

[0068] Step 103 includes: Step 103B: Based on the electrical defect file and the optical defect file, determine the second defective substrate newly added during the electrical performance testing stage from the first normal packaging substrate, and scrap the second defective substrate to obtain the second normal packaging substrate.

[0069] In practice, electrical defect files and optical defect files are compared to identify the second defective substrate newly added during the electrical performance testing phase from the first normal packaging substrate. The second defective substrate is then scrapped to obtain the second normal packaging substrate. The second defective substrate is the packaging substrate for which defects were detected during the electrical performance testing phase, while the second normal packaging substrate is the packaging substrate for which no defects were detected during the electrical performance testing phase.

[0070] Specifically, the Quality Management System (QMS) compares optical defect documents and electrical defect documents to determine if any new second defective substrates were added during the electrical performance testing stage. If no new second defective substrates were found during the electrical performance testing stage, the Manufacturing Execution System (MES) controls the strip substrates of the target production batch (Lot) to leave the station. If new second defective substrates were found during the electrical performance testing stage, the QMS records the number of second defective substrates, and the second defective substrates are scrapped. Then, the MES controls the strip substrates of the target production batch (Lot) to leave the station.

[0071] In this way, by scrapping the second defective substrate, the strip substrate leaving the station and entering the next inspection stage will only have the second normal packaging substrate. The second defective substrate will not be repeatedly inspected in the next inspection stage, reducing unnecessary inspection time and resource consumption, thereby improving the inspection efficiency of the packaging substrate.

[0072] The above scheme involves performing electrical performance testing on a first normal packaging substrate to obtain an electrical defect file for that substrate during the electrical performance testing phase. This facilitates the reading of the electrical defect file in the next testing phase, allowing for the identification of the first and second defective substrates. This enables the testing of the first and second defective substrates to be skipped in the next testing phase, avoiding redundant testing and improving the testing efficiency of the packaging substrate. Based on the electrical and optical defect files, a second defective substrate newly added during the electrical performance testing phase is identified from the first normal packaging substrate. This second defective substrate is then scrapped to obtain the second normal packaging substrate. By scrapping the second defective substrate, it is prevented from being repeatedly tested in the next testing phase, reducing unnecessary testing time and resource consumption, thereby improving the testing efficiency of the packaging substrate.

[0073] In some embodiments, the current testing stage is the appearance testing stage, the previous testing stage is the electrical performance testing stage, the packaged substrate under test is a second normal packaged substrate, and the historical defect file is an electrical defect file.

[0074] Step 102 includes: Step 102C: Perform appearance inspection on the second normal packaging substrate to obtain the appearance defect file of the second normal packaging substrate in the appearance inspection stage.

[0075] In practice, the appearance inspection stage can be the third inspection stage of the packaged substrate. During the appearance inspection stage, an automated appearance inspection (AVI) is performed on the second normal packaged substrate to obtain an appearance defect file. This appearance defect file can be a text file (TXT) or a comma-separated value file (CSV).

[0076] Specifically, the strip substrates of the target production batch (Lot) that have completed electrical performance testing are brought into the station under the control of the Manufacturing Execution System (MES). The electrical defect files of the second normal package substrate in the strip substrate are read by the Quality Management System (QMS) and the electrical defect files are sent to the preset machine sharing path.

[0077] The manufacturing execution system (MES) sets the strip substrate onto the appearance inspection equipment (EQP) corresponding to the appearance inspection stage, completing the on-machine operation of the strip substrate. The appearance inspection equipment (EQP) performs defect detection on the second normal package substrate in the strip substrate to obtain appearance defect documents, and stores the appearance defect documents in the quality management system (QMS).

[0078] After completing the appearance inspection of the second normal packaging substrate, the strip substrate is removed from the appearance inspection equipment (EQP) by the manufacturing execution system (MES), completing the strip substrate removal operation.

[0079] Figure 5 This is a schematic diagram of an appearance defect file according to an embodiment of this disclosure. Figure 5 As shown, the appearance defect file includes: the total number of packaging substrates in the strip, the total number of strips in the current batch, the number of blocks, the completed inspection stage, the QR code of the strip, the first location information of the first defective substrate, the second location information of the second defective substrate, and the third location information of the third defective substrate.

[0080] like Figure 5 As shown, in the strip substrate, there are 8 packaging substrates in the first direction (X direction) and 12 packaging substrates in the second direction (Y direction), for a total of 8 × 12 = 96 packaging substrates in the strip substrate. The current batch of strip substrates contains 1 strip substrate. The number of blocks is 48. Based on this, each defect inspection can inspect 48 packaging substrates in the strip substrate, completing the defect inspection of the entire strip substrate through two inspections. The completed inspection stages are optical inspection, electrical performance inspection, and appearance inspection. The QR code of the strip substrate is 20091832010109. The first location information of the first defective substrate includes the first defective substrate. The second location information of the second defective substrate includes the second defective substrate. Second defective substrate Among them, the second defective substrate The number 0010 indicates an open circuit defect, and the second defective substrate. The number 0032 indicates a short-circuit defect. The third location information of the third defective substrate includes the third defective substrate. .

[0081] Step 103 includes: Step 103C: Based on the appearance defect file and the electrical defect file, determine the third defective substrate newly added during the appearance inspection stage from the second normal packaging substrate, and scrap the third defective substrate to obtain the third normal packaging substrate.

[0082] In practice, the appearance defect documents and electrical defect documents are compared and processed to identify the third defective substrate newly added during the appearance inspection stage from the second normal packaged substrates. The third defective substrate is then scrapped to obtain the third normal packaged substrate. The third defective substrate is the packaged substrate for which defects were detected during the appearance inspection stage, while the third normal packaged substrate is the packaged substrate for which no defects were detected during the appearance inspection stage.

[0083] Specifically, the Quality Management System (QMS) compares electrical defect documents and appearance defect documents to determine if any new third-defect substrates were found during the appearance inspection stage. If no new third-defect substrates were found during appearance inspection, the Manufacturing Execution System (MES) controls the strip substrates of the target production batch (Lot) to leave the station. If new third-defect substrates were found during appearance inspection, the QMS records the number of third-defect substrates, scraps them, and then the MES controls the strip substrates of the target production batch (Lot) to leave the station.

[0084] In this way, by scrapping the third defective substrate, the strip substrate leaving the station and entering the next inspection stage will only have the third normal packaging substrate. The third defective substrate will not be repeatedly inspected in the next inspection stage, reducing unnecessary inspection time and resource consumption, thereby improving the inspection efficiency of the packaging substrate.

[0085] The above scheme involves performing an appearance inspection on the second normal packaged substrate to obtain an appearance defect file for the second normal packaged substrate during the appearance inspection stage. This facilitates the reading of the appearance defect file in the next inspection stage, allowing for the identification of the first, second, and third defective substrates. This enables the inspection of the first, second, and third defective substrates to be skipped in the next inspection stage, avoiding repeated inspections and improving the inspection efficiency of the packaged substrate. Based on the appearance defect file and the electrical defect file, the third defective substrate newly added during the appearance inspection stage is identified from the second normal packaged substrate, and this third defective substrate is scrapped to obtain the third normal packaged substrate. By scrapping the third defective substrate, it is prevented from being repeatedly inspected in the next inspection stage, reducing unnecessary inspection time and resource consumption, thereby improving the inspection efficiency of the packaged substrate.

[0086] In some embodiments, after step 102, the method further includes: Step 1021: In response to the target control in the settings interface being triggered, read the current defect file; wherein, the target control is a settings control for recording defects of the package substrate under test.

[0087] In practice, the settings interface is used to configure the target defective substrate in the packaged substrate under test. Specifically, the target defective substrate is marked in the settings interface, allowing staff to quickly locate its position based on the markings. After proceeding to the next testing stage, the marked target defective substrate is skipped, avoiding repeated testing.

[0088] After entering the settings interface, when the target control in the settings interface is triggered, the marking of the target defective substrate in the package substrate under test begins. Specifically, the current defect file is read so that the target defective substrate in the package substrate under test can be marked based on the current defect file.

[0089] Figure 6 This is a schematic diagram of the target control according to an embodiment of this disclosure. Figure 6 As shown, the target control can be the control corresponding to "Piece Setting". The display state of the target control indicates whether it has been triggered. When the target control is in the normal button state, it means the target control has not been triggered, the current defect file cannot be read, and the target defective substrate in the package under test cannot be marked. When the target control is in the button pressed state, it means the target control has been triggered, the current defect file can be read, and the target defective substrate in the package under test can be marked. The display state of the target control serves to indicate the operating status of the setting interface to the operator.

[0090] Specifically, after entering the settings interface, the target control corresponding to "Piece Setting" is in the normal button state. After the target control receives a click command, the target control is triggered, and the target control corresponding to "Piece Setting" is in the button pressed state.

[0091] Step 1022: Extract the location information corresponding to the target defect substrate from the current defect file.

[0092] In practice, the current defect file stores the location information corresponding to the target defective substrate. The location information corresponding to the target defective substrate is extracted from the current defect file so that the target defective substrate in the package substrate under test can be marked based on the location information.

[0093] Figure 7 This is a schematic diagram illustrating the reading of a current defective file according to an embodiment of this disclosure. Figure 7 As shown, Figure 7 The file on the left is the current defect file. Figure 7 The right side of the image shows a preset area for marking the location of the target defect substrate. After the target control in the settings interface is triggered, the current defect file is read, the location information corresponding to the target defect substrate is extracted from the current defect file, and the location coordinates of the target defect substrate in the preset area are marked.

[0094] like Figure 3 As shown, when the current detection stage is the optical detection stage, the current defect file stores the location information of the first defective substrate newly added during the optical detection stage. The location information of the first defective substrate is... .

[0095] like Figure 4 As shown, when the current testing stage is the electrical performance testing stage, the current defect file stores the location information of the second defective substrate newly added during the electrical performance testing stage. The location information of the second defective substrate is... and .

[0096] like Figure 5 As shown, when the current inspection stage is the visual inspection stage, the current defect file stores the location information of the third defective substrate newly added during the visual inspection stage. The location information of the third defective substrate is... .

[0097] Step 1023: Determine the position coordinates corresponding to the position information in the preset area corresponding to the package substrate under test, and mark the position coordinates in the preset area.

[0098] In practice, the preset area is a pre-defined area corresponding to multiple test packaging substrates in a strip substrate. For example... Figure 8 or Figure 9 As shown, in the strip substrate, there are 8 test package substrates in the first direction (X direction) and 12 test package substrates in the second direction (Y direction). Correspondingly, the preset area is an area with 8 units per row and 12 units per column.

[0099] The marking method for marking the position coordinates corresponding to the target defect substrate includes at least one of the following: bold marking, diagonal marking, circle marking, and cross marking. In this embodiment, the marking method is preferably diagonal marking.

[0100] The location information of the first defective substrate is: The location information of the second defective substrate is and The location information of the third defective substrate is as follows: .like Figure 8 As shown, select the position coordinates corresponding to the target defect substrate from the preset area. , , , The selected location coordinates are the bolded display area. For example... Figure 9 As shown, the position coordinates in the preset area , , , The marked areas are displayed with diagonal lines, allowing staff to quickly locate the defective substrate based on the information in the settings interface. When proceeding to the next inspection stage, the marked defective substrate is skipped, avoiding repeated inspections.

[0101] Furthermore, the target defect substrates detected in different inspection stages can be marked using different marking methods. Specifically, the first defect substrate detected in the optical inspection stage is marked with a first color mark, the second defect substrate detected in the electrical performance inspection stage is marked with a second color mark, and the third defect substrate detected in the appearance inspection stage is marked with a third color mark.

[0102] For example, the location information of the first defective substrate is The location information of the second defective substrate is and The location information of the third defective substrate is as follows: For the position coordinates in the preset area The first color is used to mark the position coordinates in the preset area. and The second color mark is used to indicate the position coordinates in the preset area. Use a third color for marking.

[0103] In addition, the location coordinates within the preset area are marked upon receiving a click command. This allows operators to select the location coordinates corresponding to a target defective substrate within the preset area, enabling the marked substrate to be skipped in the next inspection stage and avoiding repeated inspections.

[0104] like Figure 8 or Figure 9As shown, when the target control corresponding to "Piece Setting" is in the button pressed state, only the position coordinates in the preset area can be selected, and other controls will not be triggered.

[0105] The above scheme involves reading the current defect file when the target control in the settings interface is triggered. The target control is a setting control that records defects in the packaged substrate under test. The location information corresponding to the target defective substrate is extracted from the current defect file. The location coordinates corresponding to the location information are determined in a preset area corresponding to the packaged substrate under test, and these coordinates are marked. This allows staff to quickly locate the target defective substrate based on the marking information in the settings interface. After entering the next inspection stage, the marked target defective substrate is skipped, avoiding repeated inspections.

[0106] In some embodiments, prior to step 1021, the method further includes: Step 1021A: Scan the package substrate under test to obtain the batch information of the package substrate under test.

[0107] In practice, Figure 10 This is a schematic diagram of an information input interface according to an embodiment of this disclosure. Figure 10 As shown, when the operator clicks the detection button, the detection control is triggered, and the information input interface is entered. The workpiece table of the packaged substrate to be tested is scanned to obtain operator information and batch information of the substrate to be tested.

[0108] Step 1021B: Add the batch information in the information input interface and enter the setting interface for recording the defects of the package substrate to be tested.

[0109] In specific implementation, such as Figure 10 As shown, operator information and batch information of the substrate under test are added in the information input interface. When the operator clicks the "Complete" button, the completion control is triggered, and the settings interface for recording defects in the packaged substrate under test is entered.

[0110] The above method involves scanning the packaged substrate under test to obtain batch information. Batch information is then added in the information input interface, leading to a settings interface for recording defects in the packaged substrate under test. This allows for accurate recording of batch information, facilitating the marking of target defective substrates in the settings interface.

[0111] Through the above embodiments, historical defect files of the packaged substrate under test in the previous inspection stage are obtained. Defect detection is performed on the packaged substrate under test in the current inspection stage to obtain the current defect file of the packaged substrate under test in the current inspection stage. Based on the historical defect file and the current defect file, newly added target defect substrates in the current inspection stage are identified from the packaged substrates under test, and these target defect substrates are scrapped. In this way, based on the historical and current defect files, newly added target defect substrates in the current inspection stage can be accurately identified. By scrapping these target defect substrates, repeated inspection of the target defect substrates in the next inspection stage is avoided, reducing unnecessary inspection time and resource consumption, thereby improving the inspection efficiency of the packaged substrate.

[0112] Figure 11 This is a schematic diagram illustrating the updating of defective files according to an embodiment of this disclosure. Figure 11 As shown, the inspection equipment (EQP) identifies the strip ID of the substrate and triggers the corresponding defect file information. The EQP sends a request to the Quality Management System (QMS) to download the strip defect file. The QMS retrieves the latest defect file (CVS or TXT) from the previous inspection stage and sends the strip defect file to the EQP for download. The EQP skips the test on the target defective substrate and performs on-site inspection on the normal substrate from the previous inspection stage. The EQP uploads the latest strip defect file to the QMS. The defect file corresponding to the previous station in the QMS will be overwritten by the new defect file.

[0113] The embodiments disclosed herein can achieve the following technical effects: (1) By combining the hardware and software of the MES system, EQP system, and QMS system, the function of skipping the incoming defective product testing of the previous process can be realized, thereby improving the production capacity of the equipment. This avoids the waste of resources caused by repeated testing of defective products and avoids the reduction of probe life caused by repeated testing of defective products by the test fixture.

[0114] (2) The solution of this disclosure realizes the inspection and testing function of skipping defective products, thereby improving product production and processing efficiency, saving production costs and reducing labor costs.

[0115] (3) By combining hardware and software and developing a new interface to skip defective tests, the function of skipping defective inspection tests at the testing site can be effectively realized, which can effectively improve production efficiency and avoid the inaccuracy of testing caused by repeated testing of defective products.

[0116] (4) By applying the embodiments of this disclosure, the normal test life of the electrical test fixture test probe is set to 1 million times. Products with defects in the previous process are enabled by skipping the test function, thereby increasing the fixture life by 5-15% on the original basis.

[0117] (5) Through the scheme of this disclosure, the yield data of the packaging substrate process is more accurate. The packaging substrates that have been scrapped in the previous process will not be added to the calculation of the product defect rate. The yield of each inspection station process is increased by an average of about 5%-10% compared with the original method.

[0118] (6) Through the actual production use of the solutions of this disclosure, the operating power of the AOI, electrical testing and AVI inspection stations has been effectively improved to about 5%-20%; labor costs have also been effectively reduced, and the target defect substrate no longer needs to be repeatedly judged and confirmed by manpower, so both efficiency and cost have been effectively improved.

[0119] It should be noted that the method of this disclosure embodiment can be executed by a single device, such as a computer or server. The method of this embodiment can also be applied to a distributed scenario, where multiple devices cooperate to complete the task. In such a distributed scenario, one of these devices may execute only one or more steps of the method of this disclosure embodiment, and the multiple devices will interact with each other to complete the method described.

[0120] It should be noted that the above description describes some embodiments of this disclosure. Other embodiments are within the scope of the appended claims of this disclosure. In some cases, the actions or steps described in the claims of this disclosure may be performed in a different order than that shown in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require a specific or sequential order to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0121] Based on the same inventive concept, corresponding to any of the above embodiments, this disclosure also provides a testing device for a packaging substrate.

[0122] refer to Figure 12 The detection device for the packaging substrate includes: The acquisition module 301 is configured to acquire historical defect files of the package substrate under test in the previous inspection stage; The defect detection module 302 is configured to perform defect detection on the package substrate under test in the current detection stage and obtain the current defect file of the package substrate under test in the current detection stage. The scrapping module 303 is configured to determine, based on the historical defect file and the current defect file, a new target defect substrate added in the current testing stage from the package substrate under test, and to scrap the target defect substrate.

[0123] In some embodiments, the acquisition module 301 includes: The judgment unit is configured to determine whether the current detection stage is the initial detection stage; The first acquisition unit is configured to acquire the initial inspection file of the package substrate under test in response to the current inspection stage being the initial inspection stage, and to use the initial inspection file as a historical defect file. The second acquisition unit is configured to acquire the historical defect file of the package substrate under test in the previous detection stage in response to the current detection stage not being the initial detection stage.

[0124] In some embodiments, the current detection stage is the optical detection stage, the packaged substrate under test is the initial packaged substrate under test, and the historical defect file is the initial detection file; The defect detection module 302 includes: An optical inspection unit is configured to perform optical inspection processing on the initial test package substrate to obtain an optical defect file of the initial test package substrate during the optical inspection stage; The scrapping module 303 includes: The first scrapping unit is configured to determine, based on the optical defect file and the initial inspection file, a first defective substrate newly added during the optical inspection stage from the initial test package substrate, and scrap the first defective substrate to obtain a first normal package substrate.

[0125] In some embodiments, the current testing stage is an electrical performance testing stage, the previous testing stage is an optical testing stage, the packaged substrate under test is a first normal packaged substrate, and the historical defect file is an optical defect file. The defect detection module 302 includes: An electrical performance testing unit is configured to perform electrical performance testing on the first normal packaging substrate to obtain an electrical defect file of the first normal packaging substrate during the electrical performance testing stage. The scrapping module 303 includes: The second scrapping unit is configured to determine, based on the electrical defect file and the optical defect file, a second defective substrate newly added during the electrical performance testing stage from the first normal packaging substrate, and to scrap the second defective substrate to obtain a second normal packaging substrate.

[0126] In some embodiments, the current inspection stage is the appearance inspection stage, the previous inspection stage is the electrical performance inspection stage, the package substrate to be tested is a second normal package substrate, and the historical defect file is an electrical defect file. The defect detection module 302 includes: The appearance inspection unit is configured to perform appearance inspection processing on the second normal packaging substrate to obtain an appearance defect file of the second normal packaging substrate in the appearance inspection stage. The scrapping module 303 includes: The third scrapping unit is configured to determine, based on the appearance defect file and the electrical defect file, a third defective substrate newly added during the appearance inspection stage from the second normal packaging substrate, and to scrap the third defective substrate to obtain a third normal packaging substrate.

[0127] In some embodiments, the apparatus further includes: The defect file reading module is configured to read the current defect file in response to the triggering of a target control in the settings interface; wherein the target control is a settings control for recording defects of the package substrate under test; The location information determination module is configured to extract the location information corresponding to the target defect substrate from the current defect file; The defect substrate marking module is configured to determine the position coordinates corresponding to the position information in a preset area corresponding to the package substrate under test, and to mark the position coordinates in the preset area.

[0128] In some embodiments, the defect file reading module further includes: The scanning processing unit is configured to scan the package substrate under test to obtain batch information of the package substrate under test. The batch information adding unit is configured to add the batch information in the information input interface and enter the setting interface for recording the defects of the package substrate under test.

[0129] For ease of description, the above apparatus is described in terms of its functions, divided into various modules. Of course, in implementing this disclosure, the functions of each module can be implemented in one or more software and / or hardware.

[0130] The apparatus of the above embodiments is used to implement the detection method of the corresponding packaging substrate in any of the foregoing embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0131] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this disclosure also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the detection method of the packaging substrate described in any of the above embodiments.

[0132] Figure 13 This embodiment illustrates a more specific hardware structure of an electronic device, which may include a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, memory 1020, input / output interface 1030, and communication interface 1040 are interconnected internally via the bus 1050.

[0133] The processor 1010 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0134] The memory 1020 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program code is stored in the memory 1020 and is called and executed by the processor 1010.

[0135] The input / output interface 1030 is used to connect input / output modules to realize information input and output. Input / output modules can be configured as components within the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Input devices may include keyboards, mice, touchscreens, microphones, various sensors, etc., while output devices may include displays, speakers, vibrators, indicator lights, etc.

[0136] The communication interface 1040 is used to connect the communication module (not shown in the figure) to enable communication between this device and other devices. The communication module can communicate via wired means (such as USB (Universal Serial Bus), network cable, etc.) or wireless means (such as mobile network, WIFI (Wireless Fidelity), Bluetooth, etc.).

[0137] Bus 1050 includes a pathway for transmitting information between various components of the device, such as processor 1010, memory 1020, input / output interface 1030, and communication interface 1040.

[0138] It should be noted that although the above-described device only shows the processor 1010, memory 1020, input / output interface 1030, communication interface 1040, and bus 1050, in specific implementations, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the embodiments of this specification, and not necessarily all the components shown in the figures.

[0139] The electronic devices described above are used to implement the detection method of the corresponding packaging substrate in any of the foregoing embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0140] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this disclosure also provides a non-transitory computer-readable storage medium storing computer instructions for causing the computer to execute the detection method of the packaging substrate as described in any of the above embodiments.

[0141] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0142] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute the detection method of the package substrate as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0143] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this application also provides a computer program product, including computer program instructions. When the computer program instructions are run on a computer, the computer causes the computer to execute the detection method of the packaging substrate as described in any of the above embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0144] It is understood that before using the technical solutions of the various embodiments in this disclosure, users will be informed of the type, scope of use, and usage scenarios of the personal information involved in an appropriate manner, and user authorization will be obtained.

[0145] For example, upon receiving a user's active request, a prompt message is sent to the user to explicitly inform them that the requested operation will require the acquisition and use of the user's personal information. This allows the user to independently choose, based on the prompt message, whether to provide personal information to the software or hardware such as electronic devices, applications, servers, or storage media performing the operations of this disclosed technical solution.

[0146] As an optional but not limited implementation, in response to a user's active request, sending a prompt message to the user can be done via a pop-up window, where the prompt message can be presented in text format. Furthermore, the pop-up window can also include a selection control allowing the user to choose "agree" or "disagree" to provide personal information to the electronic device.

[0147] It is understood that the above notification and user authorization process are merely illustrative and do not constitute a limitation on the implementation of this disclosure. Other methods that comply with relevant laws and regulations may also be applied to the implementation of this disclosure.

[0148] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this disclosure is limited to these examples; within the framework of this disclosure, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this disclosure as described above, which are not provided in detail for the sake of brevity.

[0149] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this disclosure, the provided drawings may or may not show well-known power / ground connections to integrated circuit (IC) chips and other components. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this disclosure, and this also takes into account the fact that the details of implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this disclosure will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this disclosure, it will be apparent to those skilled in the art that the embodiments of this disclosure can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0150] Although this disclosure has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0151] This disclosure is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of this disclosure. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A method for detecting a packaging substrate, characterized in that, The method includes: Obtain historical defect files of the packaging substrate under test from the previous testing stage; Defect detection is performed on the packaged substrate under test in the current detection stage to obtain the current defect file of the packaged substrate under test in the current detection stage; Based on the historical defect file and the current defect file, a new target defect substrate is identified from the package substrates under test in the current testing stage, and the target defect substrate is scrapped.

2. The method according to claim 1, characterized in that, The process of obtaining historical defect files of the packaged substrate under test in the previous testing stage includes: Determine whether the current detection stage is the initial detection stage; In response to the current detection stage being the initial detection stage, the initial detection file of the packaged substrate under test is obtained, and the initial detection file is used as a historical defect file; If the current detection stage is not the initial detection stage, then the historical defect file of the package substrate under test in the previous detection stage is obtained.

3. The method according to claim 1, characterized in that, The current detection stage is the optical detection stage, the packaged substrate under test is the initial packaged substrate under test, and the historical defect file is the initial detection file; The step of performing defect detection on the packaged substrate under test in the current testing stage to obtain the current defect file of the packaged substrate under test in the current testing stage includes: The initial test package substrate is subjected to optical inspection to obtain an optical defect file of the initial test package substrate during the optical inspection stage; The step of determining the target defect substrate newly added in the current testing stage from the package substrates under test based on the historical defect file and the current defect file, and scrapping the target defect substrate, includes: Based on the optical defect file and the initial inspection file, a first defective substrate newly added during the optical inspection stage is determined from the initial packaging substrate to be tested, and the first defective substrate is scrapped to obtain a first normal packaging substrate.

4. The method according to claim 1, characterized in that, The current testing stage is the electrical performance testing stage, the previous testing stage is the optical testing stage, the packaged substrate under test is the first normal packaged substrate, and the historical defect file is the optical defect file. The step of performing defect detection on the packaged substrate under test in the current testing stage to obtain the current defect file of the packaged substrate under test in the current testing stage includes: The first normal packaged substrate is subjected to electrical performance testing to obtain an electrical defect file of the first normal packaged substrate during the electrical performance testing stage. The step of determining the target defect substrate newly added in the current testing stage from the package substrates under test based on the historical defect file and the current defect file, and scrapping the target defect substrate, includes: Based on the electrical defect file and the optical defect file, a second defective substrate newly added during the electrical performance testing stage is identified from the first normal packaging substrate, and the second defective substrate is scrapped to obtain a second normal packaging substrate.

5. The method according to claim 1, characterized in that, The current testing stage is the appearance testing stage, the previous testing stage is the electrical performance testing stage, the packaged substrate under test is the second normal packaged substrate, and the historical defect file is the electrical defect file. The step of performing defect detection on the packaged substrate under test in the current testing stage to obtain the current defect file of the packaged substrate under test in the current testing stage includes: The second normal packaging substrate is subjected to appearance inspection to obtain the appearance defect file of the second normal packaging substrate in the appearance inspection stage. The step of determining the target defect substrate newly added in the current testing stage from the package substrates under test based on the historical defect file and the current defect file, and scrapping the target defect substrate, includes: Based on the appearance defect file and the electrical defect file, a third defective substrate newly added during the appearance inspection stage is identified from the second normal packaged substrate, and the third defective substrate is scrapped to obtain a third normal packaged substrate.

6. The method according to claim 1, characterized in that, After performing defect detection on the packaged substrate under test in the current inspection stage and obtaining the current defect file of the packaged substrate under test in the current inspection stage, the method further includes: In response to the target control in the settings interface being triggered, the current defect file is read; wherein, the target control is a settings control for recording defects of the package substrate under test; Extract the location information corresponding to the target defect substrate from the current defect file; The position coordinates corresponding to the position information are determined in a preset area corresponding to the package substrate under test, and the position coordinates in the preset area are marked.

7. The method according to claim 6, characterized in that, Before reading the current defect file in response to the target control being triggered, the method further includes: The batch information of the packaged substrate under test is obtained by scanning the packaged substrate under test; Add the batch information in the information input interface to enter the settings interface for recording defects of the package substrate under test.

8. A testing device for a packaged substrate, characterized in that, include: The acquisition module is configured to acquire historical defect files of the package substrate under test in the previous inspection stage; The defect detection module is configured to perform defect detection on the package substrate under test in the current detection stage and obtain the current defect file of the package substrate under test in the current detection stage. The scrapping module is configured to determine, based on the historical defect file and the current defect file, a target defect substrate newly added in the current testing stage from the package substrate under test, and to scrap the target defect substrate.

9. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the processor, when executing the program, implements the method as claimed in any one of claims 1 to 7.

10. A non-transitory computer-readable storage medium, characterized in that, The non-transitory computer-readable storage medium stores computer instructions for causing a computer to perform the method according to any one of claims 1 to 7.

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