A perfusion liquid coating apparatus and process

Abstract

This invention discloses a liquid coating equipment and process for infusion, belonging to the field of coating processing technology. It includes a coating machine main unit and a main shaft fixedly mounted thereon. A main arm is fixedly connected to the main shaft via a slidingly mounted lifting block. A drive device is installed on the main shaft to drive the lifting block to move up and down along the main shaft. A chuck is fixedly mounted on the main arm, and a syringe is installed inside the chuck. A pressure plate is detachably mounted at the bottom of the chuck via a connecting assembly. A micro-metering pump and a liquid storage tank are also fixedly mounted on the main arm. The inlet end of the micro-metering pump is connected to the liquid storage tank via a conduit, and the outlet end of the micro-metering pump is connected to the syringe inside the chuck via a conduit. The syringe is connected to the center of the pressure plate via a liquid guiding assembly. Under the action of the drive device, when the pressure plate contacts the bearing plate on the stage, the coating liquid is quantitatively and uniformly infused onto the substrate under pressure.

Description

Technical Field

[0001] This invention relates to the field of coating processing technology, and in particular to a pouring liquid coating equipment and process. Background Technology

[0002] Regarding photoresist coating on silicon wafers, Chinese patent (CN118311831A) discloses a pressure-type spin coating apparatus and method. While this technology effectively improves the problem of low photoresist utilization, it still has significant process defects and structural design shortcomings. In terms of process, the pressure spin coating and spin coating processes are independent. After pressure film formation, the wafer needs to be removed from the pressure coating apparatus and transferred to the spin coating apparatus for subsequent processing. Furthermore, the pressure coating and spin coating processes are not on the same substrate, making substrate transfer time-consuming and prone to introducing external contamination and damaging the photoresist film during wafer movement. The multi-device, step-by-step operation mode also significantly reduces the overall spin coating efficiency and is difficult to adapt to various applications. The high-efficiency production requirements of semiconductor manufacturing necessitate several structural design considerations. The rigid adhesive press uses an integrated, fixed structure without any detachable design. This leads to the easy adhesion of photoresist residue to the surface after use, making cleaning cumbersome and difficult. Furthermore, semiconductor processes often require the application of different types of photoresist, and the fixed rigid press cannot quickly adapt to the needs of photoresist replacement. Repeated cleaning during photoresist replacement further increases the time consumption. In addition, this technology still uses the method of dispensing photoresist onto the substrate surface and then extruding it into a film. If there is a parallelism deviation between the rigid press and the silicon wafer, it will cause asymmetrical film formation defects during photoresist extrusion, resulting in poor film thickness uniformity. High-precision guide rails are required to meet the stringent coating accuracy requirements of advanced processes.

[0003] Furthermore, for high-precision, high-density PCB photoresist spin coating processes, methods such as roller coating, spraying, and dip coating are used to apply the photoresist to the PCB surface. Uneven surfaces result in poor photolithographic pattern quality, leading to rough edges on the conductors and impacting signal transmission quality. While high-speed centrifugal spin coating, similar to photoresist spin coating on silicon wafers, produces a smoother surface, the steps and holes on PCBs are much larger than on silicon wafers. This can cause defects such as incomplete or insufficient photoresist coverage at the edges of steps and holes, uneven photoresist thickness on hole walls, and reduced circuit pattern accuracy and overall device reliability.

[0004] Traditional spin-coating processes for the photoelectric active layer of perovskite solar cells suffer from significant efficiency and quality bottlenecks. Current industry efforts to improve production efficiency generally prioritize the rapid film-forming characteristics of perovskite precursor solutions. However, this characteristic also presents significant process challenges: the discontinuous operation of solution drop-addition and high-speed spin-coating in existing spin-coating processes easily exacerbates premature and rapid drying and curing of the precursor solution during spin-coating. This leads to defects such as dense pinholes, interlayer cracking, and insufficient film surface smoothness within the film, severely degrading the overall film quality and long-term operational stability of the photoelectric film. Summary of the Invention

[0005] The purpose of this invention is to provide a liquid coating equipment for pouring to solve the technical problems of low solution utilization, poor uniform coating quality, and low processing efficiency in the coating process of silicon wafers, PCB board photoresists, and perovskite solar cell photoelectric active layers.

[0006] The technical solution of this invention is implemented as follows: A liquid coating equipment for dispensing includes a main body of a glue applicator and a main shaft fixedly mounted thereon. A main arm is fixedly connected to the main shaft via a slidingly mounted lifting block. A drive device capable of driving the lifting block to move up and down along the main shaft is mounted on the main shaft. A chuck is fixedly mounted on the main arm. An syringe is disposed inside the chuck. A pressure plate is detachably mounted on the bottom end of the chuck via a connecting component. The main arm is also fixedly equipped with a micro metering pump and a liquid storage tank. The inlet end of the micro metering pump is connected to the liquid storage tank through a conduit, and the outlet end of the micro metering pump is connected to the syringe inside the clamp through a conduit. The syringe is connected to the center of the pressure plate through a liquid guiding component. Under the action of the driving device, when the pressure plate contacts the bearing plate on the stage, the adhesive liquid is quantitatively and uniformly injected into the substrate under pressure.

[0007] Furthermore, the liquid guiding assembly includes a first liquid guiding tube opened inside the clamp, the top end of the first liquid guiding tube being sealed and connected to the syringe, and the bottom end of the first liquid guiding tube penetrating the clamp and extending to communicate with the center of the pressure plate.

[0008] Furthermore, a first oleophobic film is laid on the lower surface of the pressure plate, and the first liquid guide tube penetrates the first oleophobic film.

[0009] Furthermore, the liquid guiding assembly includes a second liquid guiding tube connected to the center of the pressure plate, the top end of the second liquid guiding tube being sealed to the bottom end of a third liquid guiding tube disposed inside the clamp, and the top end of the third liquid guiding tube being sealed to the syringe.

[0010] Furthermore, a coating liquid buffer cavity is formed at the bottom end of the third liquid guide tube, and the diameter of the buffer cavity is larger than the diameter of the third liquid guide tube.

[0011] Furthermore, a second oleophobic film is laid on the lower surface of the pressure plate, and the second liquid guide tube penetrates the second oleophobic film.

[0012] Furthermore, the connecting assembly includes a plurality of first locking members fixedly mounted on the clamp and a plurality of second locking members fixedly mounted on the pressure plate, wherein the first locking members are snapped together with the second locking members via their mounted handles.

[0013] Furthermore, the connecting component includes annularly distributed adsorption pores at the bottom of the clamp, and the adsorption pores are connected to a negative pressure air source through an air pipe.

[0014] Furthermore, the bottom end of the pressure plate has a raised annular flange, which fits tightly against the outer edge of the support plate on the platform, and the support plate is provided with a limiting protrusion.

[0015] This invention also provides a pouring liquid coating process, which uses the aforementioned pouring liquid coating equipment for coating, and includes the following steps: S1: Place the substrate in the support tray of the stage and position the substrate using the limiting protrusions; S2: Pre-align the center of the chuck with the center of the pressure plate, start the servo motor to drive the lifting block to complete the precise engagement of the chuck and the pressure plate, and then fix the pressure plate and the chuck through the connecting component; then drive the lifting block with the servo motor to align the chuck and the pressure plate with the center of the substrate. S3: Next, drive the servo motor to make the annular flange on the lower surface of the pressure plate fit tightly with the edge of the carrier plate, so that a closed space can be formed when the annular flange contacts the substrate; start the micro metering pump to quantitatively deliver the coating liquid in the storage tank to the syringe through the micro metering pump, and inject the coating liquid into the center of the substrate through the liquid guiding component, and squeeze the coating liquid into an initial uniform film under pressure. S4: Start the servo motor to drive the pressure plate to detach from the substrate; start the stage to drive the carrier plate and substrate to rotate at high speed to achieve spin coating and uniform adhesive application, and at the same time, separate the pressure plate from the clamp through the connecting component.

[0016] The beneficial effects of this invention are as follows: The clamp is connected to the pressure plate via a connecting assembly. The pressure plate is placed on the substrate, and the syringe inside the clamp injects the coating solution (photoresist / perovskite precursor solution) onto the substrate (silicon wafer / PCB board / perovskite solar cell photoactive layer) through a liquid guide tube. The pressure plate then compresses the coating solution into a film. This allows a small amount of coating solution to be uniformly spread and formed into a film on the silicon wafer, PCB board, or perovskite solar cell photoactive layer. After the pressure plate detaches from the substrate, spin coating is performed, achieving the goal of controlling the uniformity of the substrate film thickness. Compared to traditional processing where excessive amounts of coating solution are directly dripped onto the substrate, this device only requires a small amount of coating solution, effectively solving the problem of low utilization rate of photoresist and perovskite precursor solutions in existing technologies. Simultaneously, the detachable clamp and pressure plate combination maintains the cleanliness of the device, enabling industrial-scale, repetitive coating of silicon wafers, PCB boards, and perovskite solar cell photoactive layers. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of the injection-type liquid coating equipment of the present invention; Figure 2 This is a front view of the infusion-type liquid coating device of the present invention; Figure 3 This is a top view of the chuck and pressure plate mating according to an embodiment of the present invention; Figure 4 for Figure 3 A cross-sectional view along the AA direction; Figure 5 This is a top view of the clamp and pressure plate mating according to another embodiment of the present invention; Figure 6 for Figure 5 Cross-sectional view along the BB direction; Figure 7 A schematic diagram showing the cooperation between the first and second locking components; Figure 8 This is a schematic diagram of the mating state between the pressure plate and the substrate provided in an embodiment of the present invention.

[0019] Legend: 1. Glue applicator main unit; 2. Main shaft; 3. Main arm; 4. Lifting block; 5. Chuck; 6. Pressure plate; 7. Stage; 8. Liquid storage tank; 9. Micro metering pump; 10. Substrate; 11. Syringe; 12. First oleophobic film; 13. Second oleophobic film; 14. First locking element; 15. Second locking element; 16. Adsorption vent; 17. Positioning cylinder; 18. Frustum-shaped through hole; 19. Protrusion; 51. First liquid guide tube; 52. Second liquid guide tube; 53. Third liquid guide tube; 54. Buffer cavity; 61. Annular flange; 71. Support plate; 711. Limiting protrusion. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0021] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0022] See attached document Figures 1-8 According to an embodiment of the present invention, a liquid coating device for dispensing includes a coating machine main unit 1 and a main shaft 2 fixedly mounted thereon. A main arm 3 is fixedly connected to the main shaft 2 via a slidingly mounted lifting block 4. A drive device capable of driving the lifting block 4 to move up and down along the main shaft 2 is mounted on the main shaft 2. A chuck 5 is fixedly mounted on the main arm 3. An syringe 11 is disposed inside the chuck 5. A pressure plate 6 is detachably mounted at the bottom end of the chuck 5 via a connecting component.

[0023] A micro metering pump 9 and a liquid storage tank 8 are also fixedly installed on the main arm 3. The inlet end of the micro metering pump 9 is connected to the liquid storage tank 8 through a conduit, and the outlet end of the micro metering pump 9 is connected to the syringe 11 in the clamp 5 through a conduit. The syringe 11 is connected to the center of the pressure plate 6 through a liquid guiding component, and under the action of the driving device, when the pressure plate 6 contacts the bearing plate 71 on the stage 7, the adhesive liquid is quantitatively and uniformly injected into the substrate 10 under pressure.

[0024] The pressure plate 6 is a rigid, disc-shaped component with a raised annular flange 61 at its bottom periphery. The annular flange 61 fits tightly against the outer edge of the support plate 71 on the stage 7, allowing the annular flange 61 to limit the horizontal flow range of the photoresist during the pressing process, preventing the photoresist from overflowing the substrate 10 area and improving the utilization rate of the photoresist and perovskite precursor solution. Simultaneously, the annular flange 61 forms a closed space when in contact with the substrate 10, allowing the photoresist to spread more evenly on the surface of the substrate 10 under pressure. A positioning cylinder 17 is provided on the upper surface of the pressure plate 6 for precise positioning between the pressure plate 6 and the chuck 5. The stage 7 has a support plate 71 at its center to support the substrate 10. The stage 7 can drive the substrate 10 to rotate at high speed to achieve spin coating and uniform application of the photoresist. A limiting protrusion 711 is provided on the support plate 71 for precise positioning and fixation of the substrate 10.

[0025] The chuck 5 is a rectangular rigid component with a disc structure of the same size as the pressure plate 6 connected to its bottom, ensuring the contact area between the chuck 5 and the pressure plate 6 and improving connection stability. A syringe 11 is located at the center of the chuck 5, and the top of the chuck 5 is fixedly connected to the main arm 3. The syringe 11 is connected to a micro-metering pump 9, which can precisely control the dosage of adhesive liquid delivered to the syringe 11 according to the required film thickness, achieving quantitative injection of the adhesive liquid and precisely controlling the film forming thickness. A lifting block 4 is fixedly connected to the main arm 3 via a sliding connection on the main shaft 2. The drive device includes a servo motor and a ball screw. The lifting block 4 is connected to the ball screw via a nut, achieving micron-level precise lifting control of the main arm 3, thereby precisely controlling the pressure and spacing between the pressure plate 6 and the substrate 10, ensuring the consistency of the film thickness.

[0026] In this embodiment of the invention, to prevent air bubbles from forming in the adhesive coating solution during the film-forming process, the entire adhesive coating device can be placed inside a small vacuum chamber. Before the film-forming operation, the air inside the vacuum chamber is evacuated, and the adhesive coating solution is poured and formed under vacuum conditions, effectively eliminating air bubbles in the film and improving the film-forming quality. Simultaneously, since the pressure plate 6 adopts a detachable design, it can be cleaned and maintained uniformly after use, or a new pressure plate 6 can be directly replaced. This prevents adhesive residue on the surface of the pressure plate 6 from affecting the subsequent film-forming accuracy, ensuring the coating accuracy of the device for long-term use, and enabling industrial-grade repetitive large-batch adhesive coating processing, adapting to the needs of large-scale production.

[0027] This invention provides two embodiments in which the chuck 5 and the pressure plate 6 cooperate, both of which can achieve precise injection of adhesive liquid and pressure film formation, as detailed below: Example 1 The pressure plate 6 has a frustum-shaped through hole 18 at its center, with the upper diameter of the frustum-shaped through hole 18 being larger than the lower diameter. A first oleophobic film 12, made of nano-oleophobic material, is provided on the lower surface of the pressure plate 6. This film reduces friction between the pressure plate 6 and the photoresist / perovskite precursor solution, preventing the coating solution from adhering to the lower surface of the pressure plate 6 and causing waste. Simultaneously, it allows the coating solution to spread more smoothly under pressure, improving the uniformity of the coating film. A protrusion 19, identical in shape and size to the frustum-shaped through hole 18, is provided at the center of the lower surface of the chuck 5. The protrusion 19 can extend into the frustum-shaped through hole 18 of the pressure plate 6, achieving precise center alignment between the chuck 5 and the pressure plate 6, ensuring the accuracy of the center position of the coating solution injection. The clamp 5 has a first liquid guide tube 51, which is closely connected to the syringe 11. The adhesive liquid output by the syringe 11 is precisely dripped into the center of the substrate 10 through the slender first liquid guide tube 51. With the quantitative control of the micro metering pump 9, the adhesive liquid is injected on demand, reducing the waste of adhesive liquid from the source.

[0028] Example 2 A second liquid guide tube 52, connected to the center of the pressure plate 6, is provided on the lower surface of the pressure plate 6, which serves to prevent adhesion and aid in spreading. A third liquid guide tube 53 is provided inside the clamp 5, which is sealed and connected to the syringe 11 for dripping the adhesive solution. The bottom end of the third liquid guide tube 53 is radially expanded to form an adhesive solution buffer chamber 54. The buffer chamber 54 can temporarily store and stabilize the adhesive solution delivered by the micro metering pump 9, avoiding problems such as uneven flow rate and splashing during the adhesive solution pouring process, ensuring that the adhesive solution is delivered to the surface of the substrate 10 at a stable pressure and flow rate, and improving the quality of the adhesive film formation.

[0029] It should be noted that the adhesive solution is metered and injected using a micrometer pump 9, and then immediately extruded into a film under the pressure plate 6. The precise output (metering) of the micrometer pump 9 may be accompanied by slight fluctuations or intermittent flow rates. If this pulsating adhesive solution is directly injected into the narrow, enclosed pressure space (formed by the annular flange 61), it may result in uneven initial distribution of the adhesive solution, the generation of bubbles or splashing, thereby undermining the foundation of "uniform extrusion film formation". The buffer chamber 54 acts as a temporary "pressure stabilizing chamber" and "buffer zone" to receive the adhesive solution from the micrometer pump 9, stabilizing its flow rate and equalizing its pressure. Then, the adhesive solution is delivered to the center of the substrate 10 in a stable and continuous state through the second liquid guide tube 52. This ensures that the precise metering performance is effectively translated into the uniformity of the initial adhesive film. In addition, the design of the replaceable pressure plate 6 is intended to facilitate cleaning and adaptation to different adhesive solutions, but frequent replacements require ensuring reliable sealing and quick docking of the flow interface. The buffer chamber 54 is located inside the chuck 5, while only a relatively simple second liquid guide tube 52 is retained on the pressure plate 6. This makes the structure of the pressure plate 6 simpler, lighter, and easier to process, clean, and replace. The complex flow stabilization function is integrated into the chuck 5, reducing the complexity and cost of a single pressure plate 6. Furthermore, the buffer cavity 54 provides a stable adhesive flow, the oleophobic film reduces the adhesion resistance of the adhesive on the lower surface of the pressure plate 6, and the annular flange 61 forms a closed space to prevent adhesive overflow. This allows the pressure plate 6 to work synergistically the instant it descends and contacts the substrate 10: the buffer cavity 54 outputs stable adhesive to the center of the substrate 10; the adhesive spreads smoothly under the pressure plate 6 with its oleophobic film; and the annular flange 61 restricts its flow boundary, forming a uniform film.

[0030] Regarding the detachable connection between the chuck 5 and the pressure plate 6, this invention provides two implementation methods that can be freely combined with the two liquid guiding components mentioned above to meet different production and processing needs, as detailed below: Example 3 The connecting assembly includes several first locking elements 14 fixedly mounted on the chuck 5 and several second locking elements 15 fixedly mounted on the pressure plate 6. The first locking elements 14 are snapped together with the second locking elements 15 via their mounted handles. Locking and unlocking of the pressure plate 6 and the chuck 5 can be achieved through manual or semi-automatic operation. The connection structure is robust, has good vibration resistance, and is suitable for high-speed rotation, high-pressure adhesive pressing, and other working conditions. Furthermore, it does not require an external negative pressure air source, making the equipment more adaptable. Preferably, the first locking elements 14 and the second locking elements 15 are evenly distributed on the sides of the chuck 5 and the pressure plate 6, respectively.

[0031] Example 4 A sealed fit is formed between the mating surfaces of the chuck 5 and the pressure plate 6. The lower part of the chuck 5 has several circumferentially arranged adsorption holes 16, which can be connected to a negative pressure air source. When the pressure plate 6 needs to be fixed, the negative pressure air source generates negative pressure through the adsorption holes 16, using air pressure adsorption force to tightly fix the pressure plate 6 onto the chuck 5, resulting in a stable connection and high coaxiality. When the pressure plate 6 needs to be replaced, the negative pressure air source is cut off, the adsorption force disappears, and the used pressure plate 6 can be quickly removed and replaced with a new one. The operation is convenient, there is no mechanical contact wear, and the connection accuracy can be guaranteed after long-term use.

[0032] The above-mentioned liquid guiding components can be used in any combination with the gas pressure adsorption method and the locking structure method to realize the detachable connection between the pressure plate 6 and the clamp 5, and all of them are within the protection scope of this invention.

[0033] This invention also discloses a pouring liquid coating process, which uses the aforementioned pouring liquid coating equipment for coating, and includes the following steps: S1: Substrate positioning and fixing The substrate 10 is placed in the bearing plate 71 at the center of the stage 7, so that the limiting protrusion 711 accurately positions and fixes the substrate 10, preventing the substrate 10 from shifting during subsequent pressing and spinning processes, and ensuring the quality of uniform adhesive application.

[0034] S2: Align and fix the chuck with the pressure plate, align the chuck with the substrate. Place the pressure plate 6 to be used under the chuck 5, pre-aligning the center of the chuck 5 with the center of the pressure plate 6; start the servo motor, and drive the spindle 2 through the lifting block 4 to make the main arm 3 adjust up and down slightly, so that the liquid guiding components of the chuck 5 and the pressure plate 6 are precisely matched, completing the center positioning of the chuck 5 and the pressure plate 6; then, use the connecting components to firmly fix the pressure plate 6 on the chuck 5; after the pressure plate 6 is fixed, use the servo motor to drive the chuck 5 and the pressure plate 6 to move as a whole, so that the center of the pressure plate 6 is precisely aligned with the center of the substrate 10 on the carrier plate 71, ensuring the accuracy of the center position of the subsequent glue application and pressing.

[0035] S3: Press-fit film formation, quantitative injection of adhesive solution. The servo motor is started, and the main shaft 2 is driven by the lifting block 4 to lower the main arm 3, so that the annular flange 61 at the bottom of the pressure plate 6 contacts the surface of the substrate 10 on the stage 7, forming a closed pressure space. At the same time, the coating liquid in the storage tank 8 is quantitatively delivered to the syringe 11 in the chuck 5 by the micro metering pump 9. The syringe 11 accurately injects the coating liquid into the center of the substrate 10 through the liquid guiding component. Under the pressure of the pressure plate 6, the coating liquid is quickly and evenly squeezed onto the substrate 10 to form an initial adhesive film of uniform thickness. The quantitative control of the micro metering pump 9 can ensure that the amount of coating liquid used is just enough to meet the requirements of adhesive film formation, without any excess coating liquid wasted.

[0036] S4: Spin glue application, platen replacement After the adhesive solution forms an initial uniform film under pressure, the lifting block 4, driven by a servo motor, causes the spindle 2 to move the pressure plate 6 upward, detaching it from the surface of the substrate 10. Subsequently, the rotation drive mechanism of the stage 7 is activated, causing the carrier plate 71 and the substrate 10 to rotate at high speed. Centrifugal force is used to further spin-coat and homogenize the initial adhesive film on the substrate 10, forming a final adhesive film with precise thickness and high uniformity. Simultaneously with the spin-coating of the substrate 10, the used pressure plate 6 is disassembled, and a new, clean pressure plate 6 is used for fixation, preparing for the next substrate 10 to be coated. This synchronized operation of pressing, spinning, and pressure plate replacement significantly improves the overall coating efficiency.

[0037] This invention provides a liquid coating equipment and process for a pouring method. Through an integrated pressure-spinning process, a quantitative amount of coating liquid is first extruded into an initial uniform film using pressure, and then further homogenized using high-speed spin coating. This ensures both the uniformity and thickness accuracy of the film. Furthermore, the quantitative pouring using a micro-metering pump and the anti-overflow design of the pressure plate significantly reduce coating liquid waste, solving the problem of low coating liquid utilization in existing technologies. Simultaneously, the detachable pressure plate design allows for rapid replacement, ensuring the cleanliness of the device and the coating accuracy for long-term use. Spin coating and pressure plate replacement can be performed simultaneously, eliminating the need for manual dispensing. Dispensing and homogenization are completed continuously at the same station, effectively improving the overall homogenization and coating efficiency and solving the problem of low efficiency in pressure-based homogenization methods. In addition, the liquid guiding components and connecting components can be freely combined, greatly improving the versatility and adaptability of the device. It can be widely applied to photoresist homogenization coating of silicon wafers and PCB boards, and the homogenization process of perovskite precursor solution for the photoelectric active layer of perovskite solar cells.

[0038] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A liquid coating device for injection, characterized in that, The machine includes a glue applicator (1) and a main shaft (2) fixedly mounted thereon. A main arm (3) is fixedly connected to the main shaft (2) via a slidingly mounted lifting block (4). A drive device capable of driving the lifting block (4) to move up and down along the main shaft (2) is installed on the main shaft (2). A chuck (5) is fixedly mounted on the main arm (3). An syringe (11) is provided inside the chuck (5). A pressure plate (6) is detachably mounted at the bottom of the chuck (5) via a connecting component. The main arm (3) is also fixedly installed with a micro metering pump (9) and a storage tank (8). The inlet end of the micro metering pump (9) is connected to the storage tank (8) through a conduit. The outlet end of the micro metering pump (9) is connected to the syringe (11) in the clamp (5) through a conduit. The syringe (11) is connected to the center of the pressure plate (6) through a liquid guiding component. Under the action of the driving device, when the pressure plate (6) contacts the bearing plate (71) on the stage (7), the adhesive liquid is quantitatively and uniformly injected into the substrate (10) under pressure.

2. The injection-type liquid coating equipment according to claim 1, characterized in that, The liquid guiding assembly includes a first liquid guiding tube (51) opened inside the clamp (5), the top end of the first liquid guiding tube (51) is sealed and connected to the syringe (11), and the bottom end of the first liquid guiding tube (51) passes through the clamp (5) and extends to communicate with the center of the pressure plate (6).

3. The injection-type liquid coating equipment according to claim 2, characterized in that, The lower surface of the pressure plate (6) is covered with a first oleophobic film (12), and the first liquid guide tube (51) passes through the first oleophobic film (12).

4. The injection-type liquid coating equipment according to claim 1, characterized in that, The liquid guiding assembly includes a second liquid guiding tube (52) connected to the center of the pressure plate (6). The top end of the second liquid guiding tube (52) is sealed to the bottom end of a third liquid guiding tube (53) provided in the clamp (5). The top end of the third liquid guiding tube (53) is sealed to the syringe (11).

5. The injection-type liquid coating device according to claim 4, characterized in that, The bottom end of the third liquid guide tube (53) is formed with a coating liquid buffer cavity (54), the diameter of which is larger than the diameter of the third liquid guide tube (53).

6. The injection-type liquid coating equipment according to claim 5, characterized in that, The lower surface of the pressure plate (6) is covered with a second oleophobic film (13), and the second liquid guide tube (52) passes through the second oleophobic film (13).

7. A liquid coating apparatus for injection according to any one of claims 1-6, characterized in that, The connecting assembly includes a plurality of first locking members (14) fixedly mounted on the clamp (5) and a plurality of second locking members (15) fixedly mounted on the pressure plate (6), wherein the first locking members (14) are snapped together with the second locking members (15) by means of their mounted handles.

8. A liquid coating apparatus for injection according to any one of claims 1-6, characterized in that, The connecting component includes annularly distributed adsorption pores (16) at the bottom of the clamp (5), and the adsorption pores (16) are connected to a negative pressure air source through an air pipe.

9. A liquid coating device for injection according to claim 8, characterized in that, The bottom end of the pressure plate (6) has a raised annular flange (61), which is in close contact with the outer edge of the support plate (71) on the stage (7). The support plate (71) is provided with a limiting protrusion (711).

10. A pouring-type liquid coating process, wherein the liquid coating is performed using the pouring-type liquid coating equipment as described in claim 9, characterized in that, Includes the following steps: S1: Place the substrate (10) in the carrier plate (71) of the stage (7) and position the substrate (10) by means of the limiting protrusion (711); S2: Pre-align the center of the chuck (5) with the center of the pressure plate (6), start the servo motor to drive the lifting block (4) to complete the precise matching of the chuck (5) and the pressure plate (6), and then fix the pressure plate (6) and the chuck (5) through the connecting component; then drive the lifting block (4) with the servo motor to align the chuck (5) and the pressure plate (6) with the center of the substrate (10); S3: Next, drive the servo motor to make the annular flange (61) on the lower surface of the pressure plate (6) fit tightly with the edge of the support plate (71), so that the annular flange (61) can form a closed space when it contacts the substrate (10); start the micro metering pump (9) to quantitatively deliver the coating liquid in the storage tank (8) to the syringe (11) through the micro metering pump (9), and inject the coating liquid into the center of the substrate (10) through the liquid guiding component, and squeeze the coating liquid into an initial uniform film under pressure; S4: Start the servo motor to drive the pressure plate (6) to detach from the substrate (10); start the stage (7) to drive the carrier plate (71) and the substrate (10) to rotate at high speed to achieve spin coating and uniform adhesive application, and at the same time, separate the pressure plate (6) from the chuck (5) through the connecting component.

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