Modulation module and electronic device comprising the same

Abstract

This disclosure provides an electronic device, comprising: a frame including a receiving space and a frame groove disposed adjacent to the periphery of the receiving space; a signal connection element disposed within the frame groove; and a modulation module disposed within the receiving space, comprising: a first carrier plate; a second carrier plate corresponding to the first carrier plate; an electromagnetic wave receiving element disposed on at least one of the first carrier plate or the second carrier plate; and an electromagnetic wave adjustment element disposed between the first carrier plate and the second carrier plate; wherein the electromagnetic wave receiving element is electrically connected to the signal connection element within the frame groove.

Description

Technical Field

[0001] This disclosure provides a modulation module and an electronic device including the same. Background Technology

[0002] Smart glass or smart windows, also known as LCD windows, have been developed for many years and are widely used in many fields such as smart buildings, energy conservation and environmental protection, and privacy protection. They refer to devices that can switch the glass or window to present a light-transmitting state, a dark state (color-changing state), a fog state, etc. by controlling the dye to follow the liquid crystal arrangement, so as to change the light transmittance and achieve the effects of dimming and / or heat insulation. For example, it can reduce air conditioning energy consumption while maintaining a bright view.

[0003] However, with the evolution of communication technology, 5G signals have gradually moved towards high-frequency signals, which are prone to attenuation after passing through buildings. Furthermore, the transparent electrode layer in smart glass or smart windows may block the signal of communication devices, resulting in significant attenuation of high-frequency signals. Therefore, problems such as poor indoor signal strength still need to be overcome.

[0004] Therefore, there is an urgent need to provide a new modulation module and an electronic device containing it to improve the above-mentioned defects. Summary of the Invention

[0005] This disclosure provides an electronic device, comprising: a frame including a receiving space and a frame groove disposed adjacent to the periphery of the receiving space; a signal connection element disposed within the frame groove; and a modulation module disposed within the receiving space, comprising: a first carrier plate; a second carrier plate corresponding to the first carrier plate; an electromagnetic wave receiving element disposed on at least one of the first carrier plate or the second carrier plate; and an electromagnetic wave adjustment element disposed between the first carrier plate and the second carrier plate; wherein the electromagnetic wave receiving element is electrically connected to the signal connection element within the frame groove.

[0006] This disclosure also provides a modulation module, including: a first carrier plate; a second carrier plate corresponding to the first carrier plate; a liquid crystal layer disposed between the first carrier plate and the second carrier plate; and an electromagnetic wave receiving element including a first pattern layer; and a ground layer corresponding to the first pattern layer; wherein the first pattern layer is disposed on the first carrier plate, and the ground layer is adjacent to the liquid crystal layer relative to the first pattern layer. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0008] Figure 2 This is a cross-sectional schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0009] Figure 3 This is a top view schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0010] Figure 4 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure;

[0011] Figure 5 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure;

[0012] Figure 6 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure;

[0013] Figure 7 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure;

[0014] Figure 8 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure;

[0015] Figure 9 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure;

[0016] Figure 10 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure;

[0017] Figure 11 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure.

[0018] In the accompanying drawings, the meanings of the reference numerals are as follows:

[0019] 1. Framework;

[0020] 11. Storage space;

[0021] 12. Frame groove;

[0022] 121. First sub-frame slot;

[0023] 122. Second sub-frame slot;

[0024] 2. Signal connection components;

[0025] 21. First sub-device;

[0026] 22. Second sub-device;

[0027] 3. Modulation module;

[0028] 31. First carrier plate;

[0029] 311. Top surface;

[0030] 32. Second carrier plate;

[0031] 33. Electromagnetic wave receiving element;

[0032] 331, 331a, 331-1, 331-2, 331-3, First pattern layer;

[0033] 331b, Second pattern layer;

[0034] 332. Grounding layer;

[0035] 332a, First grounding layer;

[0036] 332b, Second grounding layer;

[0037] 333. Modulation carrier plate;

[0038] 333a, First modulation carrier plate;

[0039] 333b, Second modulation carrier plate;

[0040] 3331. Top surface;

[0041] 3332, Bottom surface;

[0042] 34. Electromagnetic wave modulation element;

[0043] 341. Third carrier plate;

[0044] 342. Fourth carrier plate;

[0045] 343. Liquid crystal layer;

[0046] 3431. Liquid crystal materials;

[0047] 3432. Liquid crystal spacers;

[0048] 3451. First alignment film;

[0049] 3452, Second alignment membrane;

[0050] 346. First electrode layer;

[0051] 347. Second electrode layer;

[0052] 348. Frame adhesive;

[0053] 349. Top surface;

[0054] 38. The fifth carrier plate;

[0055] 39. Cavity;

[0056] 391. First cavity;

[0057] 392. Second cavity;

[0058] 4. Wires;

[0059] 5. Adhesive layer;

[0060] 51. First adhesive layer;

[0061] 511. Top surface;

[0062] 52. Second adhesive layer;

[0063] 53. Third adhesive layer;

[0064] 61. First sealing element;

[0065] 62. Second sealing element;

[0066] 63. Third sealing element;

[0067] 64. Fourth sealing element;

[0068] 65. Fifth sealing element;

[0069] 66. The sixth sealing element;

[0070] 7. Cover plate;

[0071] CPE, client devices;

[0072] HUB, hub;

[0073] T1, First Thickness;

[0074] T2, second thickness;

[0075] T3, third thickness;

[0076] T4, fourth thickness;

[0077] T5, fifth thickness;

[0078] T6, sixth thickness;

[0079] T7, seventh thickness;

[0080] T8, eighth thickness;

[0081] T9, ninth thickness;

[0082] T10, the tenth thickness. Detailed Implementation

[0083] To make the objectives, technical content, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0084] The following provides a detailed description of an electronic device based on embodiments of the present disclosure. It should be understood that the following description provides many different embodiments for implementing various forms of some embodiments of the present disclosure. The specific elements and arrangements described below are merely for the simple and clear description of some embodiments of the present disclosure. Of course, these are for illustrative purposes only and not for limiting the present disclosure. Furthermore, similar and / or corresponding reference numerals may be used in different embodiments to identify similar and / or corresponding elements for the clear description of the present disclosure. However, the use of these similar and / or corresponding reference numerals is only for the simple and clear description of some embodiments of the present disclosure and does not imply any association between the different embodiments and / or structures discussed.

[0085] The embodiments disclosed herein can be used in conjunction with the appendix Figure 1 It is understood that the accompanying drawings of this disclosure are also considered part of the disclosure. It should be understood that the drawings of this disclosure are not drawn to scale; in fact, the dimensions of elements may be arbitrarily enlarged or reduced to clearly show the features of this disclosure. Furthermore, directional terms used in this disclosure, such as "up," "down," "front," "back," "left," and "right," are only for reference to the direction of the drawings. Therefore, the directional terms used are for illustration and not for limiting the scope of this disclosure. In the drawings, each figure illustrates the general characteristics of the methods, structures, and / or materials used in a particular embodiment. However, these figures should not be construed as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative dimensions, thicknesses, and positions of various film layers, regions, and / or structures may be reduced or enlarged.

[0086] In this disclosure, a structure (or layer, component, substrate) located above / above another structure (or layer, component, substrate) can refer to two structures being adjacent and directly connected, or to two structures being adjacent but not directly connected. Indirect connection means that there is at least one intermediate structure (or intermediate layer, intermediate component, intermediate substrate, intermediate spacer) between the two structures, with the lower surface of one structure adjacent to or directly connected to the upper surface of the intermediate structure, and the upper surface of the other structure adjacent to or directly connected to the lower surface of the intermediate structure. The intermediate structure can be composed of a single or multiple solid or non-solid structure, without limitation. In this disclosure, when a structure is positioned "on" another structure, it may mean that the structure is "directly" on the other structure, or that the structure is "indirectly" on the other structure, meaning that at least one structure is sandwiched between the structure and the other structure.

[0087] Furthermore, it should be understood that ordinal numbers used in the specification and claims, such as "first" and "second," to modify elements do not in themselves imply any prior ordinal number for that element (or those elements), nor do they represent the order of one element with another, or the order of manufacturing processes. The use of these ordinal numbers is solely to clearly distinguish one named element from another element with the same name. The claims and specification may not use the same terminology; for example, a first element in the specification may be a second element in the claims.

[0088] In some embodiments of this disclosure, terms such as "connection" and "interconnection," unless specifically defined, may refer to two structures being in direct contact, or to two structures not being in direct contact, with other structures disposed between them. Furthermore, these terms may also include cases where both structures are movable or both are fixed. Additionally, the terms "electrical connection" or "coupling" encompass any direct or indirect electrical connection means.

[0089] In this document, the terms "approximately," "substantially," and "roughly" typically indicate that a given value or range is within 10%, 5%, 3%, 2%, 1%, or 0.5%. Unless otherwise stated, the phrase "range between a first value and a second value" means that the range includes the first value, the second value, and other values ​​in between. Furthermore, any two values ​​or directions used for comparison may have a certain degree of error. If the first value is equal to the second value, it implies that there may be an error of approximately 10% between the first and second values; if the first direction is perpendicular to the second direction, the angle between the first and second directions may be between 80 and 100 degrees; if the first direction is parallel to the second direction, the angle between the first and second directions may be between 0 and 10 degrees. In this disclosure, the terms "given range is between a first value and a second value" and "given range falls within the range between a first value and a second value" mean that the given range includes the first value, the second value, and other values ​​in between.

[0090] Furthermore, according to embodiments of this disclosure, the thickness, length, width, or distance and angle between components can be measured using an optical microscopy (OM), a scanning electron microscope (SEM), an alpha-step thickness gauge, an ellipsometry, or other suitable methods. Specifically, according to some embodiments, a scanning electron microscope can be used to obtain cross-sectional images of the structure and to measure the thickness, length, width, or distance and angle between components.

[0091] Throughout this disclosure and in the appended claims, certain terms are used to refer to specific elements. Those skilled in the art will understand that electronic device manufacturers may use different names to refer to the same element. This document is not intended to distinguish between elements that have the same function but different names. In the following description and claims, words such as “comprising,” “including,” and “having” are open-ended terms and should therefore be interpreted as “including but not limited to…”. Thus, when the terms “comprising,” “including,” and / or “having” are used in the description of this disclosure, they specify the presence of the corresponding feature, area, step, operation, and / or element, but do not exclude the presence of one or more of the corresponding feature, area, step, operation, and / or element.

[0092] It should be understood that the features described below can be replaced, reorganized, or combined in several different embodiments to complete other embodiments without departing from the spirit of this disclosure. Features between embodiments can be arbitrarily combined and used as long as they do not violate the spirit of the invention or conflict with it.

[0093] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It is understood that these terms, for example, as defined in a commonly used dictionary, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of this disclosure. This disclosure can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and for the sake of brevity, many of the drawings in this disclosure depict only a portion of the electronic device, and specific elements in the drawings are not drawn to scale. Furthermore, the number and dimensions of the elements in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0094] The electronic device disclosed herein may include electronic components. Electronic components may include passive components, active components, or combinations thereof, such as capacitors, resistors, inductors, varactor diodes, variable capacitors, filters, diodes, transistors, sensors, microelectromechanical systems (MEMS) components, liquid crystal chips, etc., but this disclosure is not limited thereto. Diodes may include light-emitting diodes (LEDs) or non-light-emitting diodes. Diodes include PN junction diodes, PIN diodes, or constant current diodes. Light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), mini LEDs, micro LEDs, quantum dot LEDs, fluorescent, phosphorescent, or other suitable materials, or combinations thereof, but are not limited thereto. Sensors may include, for example, capacitive sensors, optical sensors, electromagnetic sensors, fingerprint sensors (FPS), touch sensors, antennas, or pen sensors, but this disclosure is not limited thereto. The following description uses a display device as an example of an electronic device to illustrate the contents of this disclosure, but this is not intended to limit it.

[0095] Electronic devices may include, but are not limited to, image capturing devices, bonding devices, display devices, backlight devices, antenna devices, splicing devices, touch displays, curved displays, or freeshape displays. Electronic devices may include, for example, liquid crystal, light-emitting diodes, fluorescent, phosphorescent, other suitable display media, or combinations thereof, but are not limited to. Display devices may be non-emissive or self-emissive. Antenna devices may be liquid crystal antenna devices or non-liquid crystal antenna devices; sensing devices may be sensing capacitance, light, heat, or ultrasound, but are not limited to. Splicing devices may be, for example, display splicing devices or antenna splicing devices, but are not limited to. It should be noted that electronic devices may be any arrangement or combination of the foregoing, but are not limited to. Electronic devices may be bendable or flexible. It should be noted that electronic devices may be any arrangement or combination of the foregoing, but are not limited to. Furthermore, the electronic device can be rectangular, circular, polygonal, have curved edges, or other suitable shapes. The electronic device may have peripheral systems such as a drive system, control system, light source system, and shelving system to support display devices, antenna devices, or splicing devices. It should be understood that the features of several different embodiments described below can be replaced, recombined, or mixed to complete other embodiments without departing from the spirit of this disclosure. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it. It should be noted that the technical solutions provided in the different embodiments below can be substituted, combined, or mixed with each other to constitute another embodiment without violating the spirit of this disclosure.

[0096] Figure 1 This is a schematic diagram of an electronic device according to an embodiment of the present disclosure. Figure 2 This is a schematic cross-sectional view of an electronic device according to an embodiment of the present disclosure. For ease of explanation, Figure 1 Only a portion of the electronic devices are displayed, and Figure 2 Some components are omitted. In one embodiment of this disclosure, such as... Figure 1 and Figure 2As shown, the electronic device includes a frame 1, a signal connection element 2, and a modulation module 3. The frame 1 is U-shaped and includes a receiving space 11 and a frame groove 12 adjacent to the periphery of the receiving space 11. The receiving space 11 is adjacent to the inner side of the frame 1, and the frame groove 12 is adjacent to the outer side of the frame 1. The signal connection element 2 is disposed within the frame groove 12. When viewed from the Z-axis direction, the signal connection element 2 is hidden within the frame groove 12 of the frame 1, achieving an aesthetically pleasing effect. Furthermore, the modulation module 3 is disposed within the receiving space 11. Specifically, the modulation module 3 is embedded within the receiving space 11 of the frame 1 on all sides, and the modulation module 3 includes a first carrier plate 31, a second carrier plate 32, an electromagnetic wave receiving element 33, and an electromagnetic wave adjusting element 34. The second carrier plate 32 corresponds to the first carrier plate 31. Electromagnetic waves include visible or non-visible light. In some embodiments, electromagnetic waves may contain frequencies between 410 MHz and 300 GHz, between 7.125 GHz and 24 GHz, between 24 GHz and 71 GHz, or between 92 GHz and 300 GHz. In this disclosure, the first carrier plate 31 is the side closer to the outdoors, and the second carrier plate 32 is the side closer to the indoors. The first carrier plate 31 and the second carrier plate 32 are, for example, the two side substrates of the modulation module 3. Furthermore, an electromagnetic wave receiving element 33 is disposed on at least one of the first carrier plate 31 or the second carrier plate 32. In this disclosure, the electromagnetic wave receiving element 33 is disposed on the first carrier plate 31, but it is not limited thereto; the electromagnetic wave receiving element 33 may also be disposed on the second carrier plate 32. In addition, an electromagnetic wave adjustment element 34 is disposed between the first carrier plate 31 and the second carrier plate 32, and the electromagnetic wave receiving element 33 is electrically connected to the signal connection element 2 within the frame slot 12.

[0097] like Figure 1 and Figure 2As shown, the electronic device may also include a conductor 4 disposed within the device. The conductor 4 can pass through the frame 1 to connect the signal connection element 2 and the electromagnetic wave receiving element 33, allowing the signal received by the electromagnetic wave receiving element 33 to be transmitted to the signal connection element 2 via the conductor 4. Since the electromagnetic wave receiving element 33 is located near the outdoors, the signal does not need to pass through buildings or be blocked by the electrode layer in the electromagnetic wave adjustment element 34, exhibiting excellent signal attenuation resistance and ensuring signal quality, thereby improving indoor signal strength and stability. Furthermore, the electromagnetic wave receiving element 33 may include a first pattern layer 331, which can be disposed on the first carrier plate 31. The first pattern layer 331 can be connected to the conductor 4 and can be connected to the signal connection element 2 via the conductor 4. Additionally, the electromagnetic wave receiving element 33 or the modulation module 3 may include a ground layer 332, which can be connected to the conductor 4 and can be connected to the signal connection element 2 via the conductor 4. Specifically, the first pattern layer 331 and the ground layer 332 can be respectively connected to the conductor 4 and can be respectively connected to the signal connection element 2 via the conductor 4. Here, "connection" refers to a direct connection, but is not limited to this; it can also refer to an indirect connection. In some embodiments, the ground layer 332 can be part of the electromagnetic wave receiving element 33, forming the electromagnetic wave receiving element 33 together with the first pattern layer 331. In some embodiments, the ground layer 332 can be part of the modulation module 3, working in conjunction with the first pattern layer 331 to achieve the same function as the electromagnetic wave receiving element 33. Therefore, the first pattern layer 331 and the ground layer 332 are not limited to independently formed components (e.g., the electromagnetic wave receiving element 33); they can be located anywhere in the modulation module 3, as long as the function of electromagnetic wave reception is achieved.

[0098] like Figure 1 and Figure 2 As shown, the modulation module 3 may further include an adhesive layer 5, which may be selectively disposed between the first carrier plate 31 and the electromagnetic wave adjustment element 34 and / or between the electromagnetic wave adjustment element 34 and the second carrier plate 32. In this disclosure, the adhesive layer 5 may include a first adhesive layer 51 and a second adhesive layer 52, wherein the first adhesive layer 51 may be disposed between the first carrier plate 31 and the electromagnetic wave adjustment element 34, and the second adhesive layer 52 may be disposed between the electromagnetic wave adjustment element 34 and the second carrier plate 32. Specifically, the electromagnetic wave adjustment element 34 may be disposed between the first adhesive layer 51 and the second adhesive layer 52. The first adhesive layer 51 may have a sixth thickness T6 in the Z direction, and the second adhesive layer may have a seventh thickness T7 in the Z direction, wherein the sixth thickness T6 and the seventh thickness T7 may be approximately 0.76 mm, approximately 1.52 mm, or multiples of approximately 0.76 mm, respectively.

[0099] like Figure 2As shown, the modulation module 3 may further include a modulation carrier plate 333, which may be selectively disposed between the first pattern layer 331 and the ground layer 332. In some embodiments, the modulation carrier plate 333 may be part of the electromagnetic wave receiving element 33, forming the electromagnetic wave receiving element 33 together with the first pattern layer 331. In some embodiments, the modulation carrier plate 333 may be part of the modulation module 3, cooperating with the first pattern layer 331 to achieve the function of receiving the signal frequency desired by the electromagnetic wave receiving element 33. Therefore, the first pattern layer 331 and the modulation carrier plate 333 are not limited to independently composed components (e.g., electromagnetic wave receiving element 33), and can be located anywhere in the modulation module 3, as long as they can achieve the function of receiving the desired signal frequency of the electromagnetic wave. Furthermore, the modulation substrate 333 may have a first thickness T1 in the Z direction, which is the shortest distance between the top surface 3331 and the bottom surface 3332 of the modulation substrate 333. The first thickness T1 may be between 2 mm and 10 mm, for example, between 3 mm and 8 mm, approximately 3 mm, approximately 4 mm, approximately 5 mm, approximately 6 mm, approximately 7 mm, or approximately 8 mm. The aforementioned first thickness T1 is the average thickness of the modulation substrate 333 in the Z direction (for example, the average thickness at three locations), which depends on the signal frequency that the modulation module 3 wants to receive and the dielectric constant of the material of the first pattern layer 331. In addition, the loss factor (DK) of the material of the modulation substrate 333 may be less than 0.02, and the modulation substrate 333 may be, for example, a glass substrate or a plastic substrate.

[0100] like Figure 1 and Figure 2As shown, the frame slot 12 may include a first sub-frame slot 121 and a second sub-frame slot 122. The signal connection element 2 may include a first sub-device 21 and a second sub-device 22. The first sub-device 21 may be disposed in the first sub-frame slot 121, and the second sub-device 22 may be disposed in the second sub-frame slot 122. In this disclosure, the first sub-frame slot 121 is disposed between the accommodating space 11 and the second sub-frame slot 122, and the accommodating space 11, the first sub-frame slot 121, and the second sub-frame slot 122 are arranged sequentially from the inner side to the outer side of the frame 1. Furthermore, in this disclosure, the first sub-device 21 is a hub, and the second sub-device 22 is a client device (CPE). The first pattern layer 331 and the ground layer 332 of the modulation module 3 can be connected to the hub via wires 4, and then connected to the client device (CPE). Therefore, the first pattern layer 331 can be used to receive signals (such as 5G or other frequency signals), which are controlled by the hub to determine whether to transmit to the client device CPE. Upon receiving the signal, the client device CPE can convert it into a wireless signal (such as a WiFi signal or other suitable signal). In this disclosure, the hub is connected to one client device CPE, but it is not limited to this; the hub can also be connected to multiple client device CPEs located in different rooms or spaces. Furthermore, in this disclosure, the hub and the client device CPE are, for example, two separate but interconnected devices, but it is not limited to this; the hub can also be integrated into the client device CPE, becoming a single device.

[0101] like Figure 2As shown, the modulation module 3 includes a first carrier plate 31, a second carrier plate 32, a liquid crystal layer 343, and an electromagnetic wave receiving element 33. The second carrier plate 32 corresponds to the first carrier plate 31. The liquid crystal layer 343 is disposed between the first carrier plate 31 and the second carrier plate 32. The electromagnetic wave receiving element 33 includes a first pattern layer 331 and a ground layer 332. The first pattern layer 331 is disposed on the first carrier plate 31, and the ground layer 332 is adjacent to the liquid crystal layer 343 relative to the first pattern layer 331. In some embodiments, the electromagnetic wave adjustment element 34 includes a liquid crystal layer 343, a third carrier plate 341, and a fourth carrier plate 342. The thickness of the third carrier plate 341 and the fourth carrier plate 342 may be less than the thickness of the first carrier plate 31 and the second carrier plate 32, but is not limited thereto. Here, the second thickness T2 of the first carrier plate 31 refers to the average thickness of the first carrier plate 31 in the Z direction (e.g., the average thickness at three locations), the third thickness T3 of the second carrier plate 32 refers to the average thickness of the second carrier plate 32 in the Z direction (e.g., the average thickness at three locations), the fourth thickness T4 of the third carrier plate 341 refers to the average thickness of the third carrier plate 341 in the Z direction (e.g., the average thickness at three locations), and the fifth thickness T5 of the fourth carrier plate 342 refers to the average thickness of the fourth carrier plate 342 in the Z direction (e.g., the average thickness at three locations). The second thickness T2, the third thickness T3, the fourth thickness T4, and the fifth thickness T5 can each be between 2 mm and 10 mm, for example, between 3 mm and 8 mm, approximately 3 mm, approximately 4 mm, approximately 5 mm, approximately 6 mm, approximately 7 mm, or approximately 8 mm.

[0102] In addition, such as Figure 2As shown, the modulation module 3 may further include an electromagnetic wave adjustment element 34, which may also include a third carrier plate 341 and a fourth carrier plate 342. The fourth carrier plate 342 may correspond to the third carrier plate 341. The third carrier plate 341 and the fourth carrier plate 342 may be disposed between the first carrier plate 31 and the second carrier plate 32, and the liquid crystal layer 343 may be disposed between the third carrier plate 341 and the fourth carrier plate 342. The liquid crystal layer 343 may further include a liquid crystal material 3431 and a liquid crystal spacer 3432. The liquid crystal spacer 3432 is disposed in the liquid crystal layer 343. Specifically, the liquid crystal spacer 3432 is dispersed in the liquid crystal material 3431. By setting the liquid crystal spacer 3432, the liquid crystal material 3431 can be pre-tilted at an angle, thereby accelerating the response time of the liquid crystal. Furthermore, the electromagnetic wave adjustment element 34 may also include a first electrode layer 346 and a second electrode layer 347. The first electrode layer 346 may be disposed between the third carrier plate 341 and the liquid crystal layer 343, and the second electrode layer 347 may be disposed between the liquid crystal layer 343 and the fourth carrier plate 342. Therefore, the liquid crystal layer 343 drives the liquid crystal material 3431 therein to align by the electric field generated by the voltage applied between the first electrode layer 346 and the second electrode layer 347, thereby changing its state (the angle of rotation of the liquid crystal material 3431) to achieve the dimming effect. In this disclosure, the liquid crystal material 3431 may include guest-host type liquid crystal (GHLC), or liquid crystal material with switchable haze and transmittance, such as polymer-dispersed liquid crystal (PDLC), polymer network liquid crystal (PNLC), cholesteric liquid crystal, or other suitable liquid crystals, but is not limited thereto.

[0103] like Figure 2 As shown, the electromagnetic wave adjustment element 34 may further include a first alignment film 3451 and a second alignment film 3452. The first alignment film 3451 may be disposed between the third carrier plate 341 and the liquid crystal layer 343, and the second alignment film 3452 may be disposed between the liquid crystal layer 343 and the fourth carrier plate 342. Specifically, the first alignment film 3451 may be disposed between the first electrode layer 346 and the liquid crystal layer 343, and the second alignment film 3452 may be disposed between the liquid crystal layer 343 and the second electrode layer 347. In addition, the first alignment film 3451 has a first friction direction (not shown), and the second alignment film 3452 has a second friction direction (not shown). The first friction direction and the second friction direction refer to the directions of mechanical orientation brushing on the first alignment film 3451 and the second alignment film 3452, respectively, to achieve the effect of liquid crystal alignment. However, it is not limited to this; the first alignment film 3451 and the second alignment film 3452 may also be photoalignment films.

[0104] like Figure 2 As shown, the electromagnetic wave adjustment element 34 may also include a frame adhesive 348, which may be disposed between the third carrier plate 341 and the fourth carrier plate 342. For example, part of the frame adhesive 348 may be disposed between the first alignment film 3451 and the second alignment film 3452 and may surround the liquid crystal layer 343, so that the liquid crystal material 3431 in the liquid crystal layer 343 is disposed in the space formed by the first alignment film 3451, the second alignment film 3452 and the frame adhesive 348, but is not limited thereto.

[0105] Figure 3 This is a top view schematic diagram of an electronic device according to an embodiment of the present disclosure.

[0106] In one embodiment of this disclosure, such as Figure 3 As shown, when a specific logo or pattern is designed and arranged using the first pattern layer 331, the first pattern layer (e.g., 331-1) can be disposed, for example, in one corner of the modulation module 3, to serve as a logo or pattern without affecting the display of the electronic device, but this disclosure is not limited thereto. In other embodiments, although not shown in the figure, the first pattern layer 331 can also be disposed on the entire surface.

[0107] In one embodiment of this disclosure, such as Figure 3 As shown, the first pattern layer (e.g., 331-2) can be a metal mesh design. In one embodiment of this disclosure, as... Figure 3 As shown, the first pattern layer (e.g., 331-3) can be in the form of a patch. Furthermore, although not shown in the figure, the first pattern layer (e.g., 331-2) can be a metal mesh with small holes, or the first metal pattern (e.g., 331-3) can be in the form of a patch with small holes. The metal mesh can have mesh openings of other shapes or different sizes. The patch form can be designed with different patterns as needed. Since the small holes (not shown) are distributed throughout the various areas of the first pattern layer 331, the light transmittance of the electronic device can be further improved. In this disclosure, the form, size, and placement of the first pattern layer 331 can be adjusted according to actual needs or design.

[0108] Figure 4 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure, wherein, Figure 4 modulation module and Figure 2 Similar, except for the following differences. Furthermore, for ease of explanation, Figure 4 The electromagnetic wave adjustment element 34 omits some of its structure; for details, please refer to [reference needed]. Figure 2 As shown.

[0109] Figure 4In this embodiment, the first pattern layer 331 of the modulation module 3 can be disposed on one side of the first carrier plate 31 opposite to the electromagnetic wave adjustment element 34, and the ground layer 332 can be disposed on the other side of the first carrier plate 31 adjacent to the electromagnetic wave adjustment element 34. Specifically, the first carrier plate 31 can be disposed between the first pattern layer 331 and the ground layer 332. In this disclosure, the ground layer 332 can be disposed within the first adhesive layer 51. In some embodiments, the material of the first carrier plate 31 can be selected or the thickness of the first carrier plate 31 can be adjusted according to the desired signal frequency.

[0110] In one embodiment of this disclosure, such as Figure 4 As shown, the modulation module 3 may optionally further include a fifth carrier plate 38, wherein the first carrier plate 31 may be disposed between the fifth carrier plate 38 and the second carrier plate 32, and the fifth carrier plate 38 and the first carrier plate 31 may define a cavity 39. Therefore, the first pattern layer 331 can be protected by the first carrier plate 31 and the fifth carrier plate 38, providing integrity and aesthetics, or preventing oxidation or corrosion of the first pattern layer 331 and the ground layer 332, thereby increasing product lifespan. Here, the modulation carrier plate 333 of the first pattern layer 331 and the ground layer 332 may be disposed on corresponding sides of the first carrier plate 31, but is not limited to this. Furthermore, as Figure 4 As shown, the modulation module 3 may further include a first sealing member 61 and a second sealing member 62, and the cavity 39 may be formed by being surrounded by a first carrier plate 31, a fifth carrier plate 38, the first sealing member 61, and the second sealing member 62. The first sealing member 61 and the second sealing member 62 may have an eighth thickness T8 in the Z direction, which may be between 6 mm and 12 mm, for example, approximately 6 mm, approximately 8 mm, approximately 10 mm, or approximately 12 mm. In this disclosure, the materials of the first sealing member 61 and the second sealing member 62 may include aluminum or other suitable materials, but are not limited thereto.

[0111] In one embodiment of this disclosure, although not shown in the figures, the ground layer 332 of the modulation module 3 may be disposed between the first carrier plate 31 and the first adhesive layer 51, and the ground layer 332 may be disposed over the entire surface. Here, "disposed over the entire surface" means that the ground layer 332 is disposed over the entire top surface 511 of the first adhesive layer 51.

[0112] Figure 5 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure. Wherein, Figure 5 modulation module and Figure 2 Similar, except for the following differences. Furthermore, for ease of explanation, Figure 5 The electromagnetic wave adjustment element 34 omits some local structures; for details, please refer to [reference needed]. Figure 2 As shown.

[0113] Figure 5In this embodiment, the ground layer 332 of the modulation module 3 can be disposed between the liquid crystal layer 343 and the third carrier plate 341. Specifically, the first electrode layer 346 of the electromagnetic wave adjustment element 34 is used as the ground layer 332 of the modulation module 3, thus reducing the fabrication of one electrode layer and lowering costs. Furthermore, the area of ​​the ground layer 332 can be the same as the area of ​​the third carrier plate 341, but is not limited to this. Here, the area of ​​the ground layer 332 refers to the area projected onto the third carrier plate 341. In some embodiments, the width of the first carrier plate 31 in the X-axis direction is greater than the width of the third carrier plate 341 in the X-axis direction; therefore, the area of ​​the ground layer 332 (first electrode layer 346) will be smaller than the area of ​​the first carrier plate 31.

[0114] In one embodiment of this disclosure, such as Figure 5 As shown, the modulation module 3 may optionally further include a fifth carrier plate 38, wherein the first carrier plate 31 may be disposed between the fifth carrier plate 38 and the second carrier plate 32, and the fifth carrier plate 38 and the first carrier plate 31 may define a cavity 39. Therefore, the first pattern layer 331 can be protected by the first carrier plate 31 and the fifth carrier plate 38, which provides integrity and aesthetics, or can prevent the first pattern layer 331 and the ground layer 332 from oxidation or corrosion, thereby increasing product life. In addition, the modulation module 3 may also include a first sealing member 61 and a second sealing member 62, and the cavity 39 may be formed by surrounding the first carrier plate 31, the fifth carrier plate 38, the first sealing member 61, and the second sealing member 62. The first sealing member 61 and the second sealing member 62 may have an eighth thickness T8 in the Z direction, and the eighth thickness T8 may be between 6 mm and 12 mm, for example, about 6 mm, about 8 mm, about 10 mm, or about 12 mm. In this disclosure, the materials of the first seal 61 and the second seal 62 may include aluminum or other suitable materials, but are not limited thereto.

[0115] Figure 6 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure. Wherein, Figure 6 modulation module and Figure 2 Similar, except for the following differences. Furthermore, for ease of explanation, Figure 6 The electromagnetic wave adjustment element 34 omits some local structures; for details, please refer to [reference needed]. Figure 2 As shown.

[0116] In one embodiment of this disclosure, such as Figure 6As shown, the modulation module 3 may further include a fifth carrier plate 38, wherein the first carrier plate 31 may be disposed between the fifth carrier plate 38 and the second carrier plate 32, and the fifth carrier plate 38 and the first carrier plate 31 may define a cavity 39. In this disclosure, the first pattern layer 331 may be disposed within the cavity 39. Specifically, the first pattern layer 331, the ground layer 332, and the modulation carrier plate 333 of the modulation module 3 may be disposed at any position within the cavity 39, thus being protected by the first carrier plate 31 and the fifth carrier plate 38, providing integrity and aesthetics, or preventing oxidation or corrosion of the first pattern layer 331 and the ground layer 332, thereby increasing product lifespan. Here, the first pattern layer 331, the ground layer 332, and the modulation carrier plate 333 may be stacked on top of each other and may be disposed on the first carrier plate 31, but are not limited thereto.

[0117] In addition, such as Figure 6 As shown, the modulation module 3 may further include a first sealing element 61 and a second sealing element 62. The cavity 39 may be formed by being surrounded by the first carrier plate 31, the fifth carrier plate 38, the first sealing element 61, and the second sealing element 62, and the cavity 39 may be a vacuum or may contain air or an inert gas. The first sealing element 61 and the second sealing element 62 may have an eighth thickness T8 in the Z direction, which may be between 6 mm and 12 mm, for example, approximately 6 mm, approximately 8 mm, approximately 10 mm, or approximately 12 mm. Furthermore, in the Z direction, the thickness of the cavity 39 may be substantially the same as the eighth thickness T8 of the first sealing element 61 and the second sealing element 62. In this disclosure, the materials of the first sealing element 61 and the second sealing element 62 may include aluminum or other suitable materials, but are not limited thereto.

[0118] In another embodiment, although not shown in the figure, the first pattern layer 331, the ground layer 332 and the modulation carrier 333 may also be stacked on top of each other and disposed on the fifth carrier 38, that is, the first pattern layer 331 may contact the fifth carrier 38, but is not limited thereto.

[0119] Figure 7 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure. Wherein, Figure 7 modulation module and Figure 6 Similar, except for the following differences. Furthermore, for ease of explanation, Figure 7 The electromagnetic wave adjustment element 34 omits some local structures; for details, please refer to [reference needed]. Figure 2 As shown.

[0120] Figure 7The modulation module 3 in this embodiment may include a first pattern layer 331 and a ground layer 332, wherein the first pattern layer 331 may be disposed on the fifth carrier plate 38, and the ground layer 332 may be disposed on the first carrier plate 31, thereby reducing the number of modulation carrier plates 333. In some embodiments, the eighth thickness T8 may be adjusted according to the desired signal frequency.

[0121] In one embodiment of this disclosure, such as Figure 7 As shown, the grounding layer 332 of the modulation module 3 can be disposed on the first carrier plate 31, and the grounding layer 332 can be disposed on the entire surface. Here, "disposed on the entire surface" means that the grounding layer 332 is disposed on the entire top surface 311 of the third carrier plate 31.

[0122] Figure 8 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure. Wherein, Figure 8 modulation module and Figure 4 Similar, except for the following differences. Furthermore, for ease of explanation, Figure 8 The electromagnetic wave adjustment element 34 omits some local structures; for details, please refer to [reference needed]. Figure 2 As shown.

[0123] Figure 8 The modulation module 3 in this embodiment may further include a third adhesive layer 53, which may be disposed between the fifth carrier plate 38 and the first carrier plate 31. Furthermore, Figure 8 The modulation module 3 of the embodiment may further include a third sealing element 63, a fourth sealing element 64, a fifth sealing element 65 and a sixth sealing element 66, wherein the third sealing element 63 and the fourth sealing element 64 may be disposed between the first carrier plate 31 and the electromagnetic wave adjustment element 34, and the fifth sealing element 65 and the sixth sealing element 66 may be disposed between the electromagnetic wave adjustment element 34 and the second carrier plate 32. Figure 8 The modulation module 3 in this embodiment may further include a first cavity 391 and a second cavity 392. The first cavity 391 may be formed by surrounding a first carrier plate 31, an electromagnetic wave adjustment element 34, a third sealing element 63, and a fourth sealing element 64. The second cavity 392 may be formed by surrounding an electromagnetic wave adjustment element 34, a second carrier plate 32, a fifth sealing element 65, and a sixth sealing element 66. In this disclosure, the first pattern layer 331 may be disposed on the first carrier plate 31 and may be disposed within the third adhesive layer 53. The grounding layer 332 may be disposed on the side of the first carrier plate 31 adjacent to the electromagnetic wave adjustment element 34 and may be disposed within the first cavity 391.

[0124] In this disclosure, the third seal 63 and the fourth seal 64 may have a ninth thickness T9 in the Z direction, which may be between 6 mm and 12 mm, for example, about 6 mm, about 8 mm, about 10 mm, or about 12 mm. Furthermore, in the Z direction, the thickness of the first cavity 391 may be substantially the same as the ninth thickness T9 of the third seal 63 and the fourth seal 64. In this disclosure, the fifth seal 65 and the sixth seal 66 may have a tenth thickness T10 in the Z direction, which may be between 6 mm and 12 mm, for example, about 6 mm, about 8 mm, about 10 mm, or about 12 mm. Furthermore, in the Z direction, the thickness of the second cavity 392 may be substantially the same as the tenth thickness T10 of the fifth seal 65 and the sixth seal 66. In this disclosure, the materials of the third seal 63, the fourth seal 64, the fifth seal 65, and the sixth seal 66 may include aluminum or other suitable materials, but are not limited thereto.

[0125] In one embodiment of this disclosure, although not shown in the figures, the first pattern layer 331 of the modulation module 3 may be disposed on the side of the third adhesive layer 53 away from the electromagnetic wave adjustment element 34, but is not limited thereto.

[0126] Figure 9 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure. Wherein, Figure 9 modulation module and Figure 8 Similar, except for the following differences. Furthermore, for ease of explanation, Figure 9 The electromagnetic wave adjustment element 34 omits some local structures; for details, please refer to [reference needed]. Figure 2 As shown.

[0127] Figure 9 The modulation module 3 in this embodiment may include a first pattern layer 331a, a first ground layer 332a, and a first modulation carrier plate 333a. The first pattern layer 331a, the first ground layer 332a, and the first modulation carrier plate 333a may be stacked on top of each other and may be disposed within the first cavity 391. Furthermore, Figure 9 The modulation module 3 of the embodiment may include a second pattern layer 331b, a second ground layer 332b and a second modulation carrier 333b. The second pattern layer 331b, the second ground layer 332b and the second modulation carrier 333b may be stacked on top of each other and may be disposed in the second cavity 392.

[0128] In this disclosure, the first pattern layer 331a may be disposed on the side of the first carrier plate 31 adjacent to the electromagnetic wave adjustment element 34, and the second ground layer 332b may be disposed on the side of the second carrier plate 32 adjacent to the electromagnetic wave adjustment element 34. However, it is not limited to this. The first pattern layer 331a, the first ground layer 332a, and the first modulation carrier plate 333a may be disposed at any position within the first cavity 391, and the second pattern layer 331b, the second ground layer 332b, and the second modulation carrier plate 333b may be disposed at any position within the second cavity 392. For example, in one embodiment, although not shown in the figure, the ground layer 332a may be disposed on the side of the electromagnetic wave adjustment element 34 adjacent to the first carrier plate 31. In one embodiment, although not shown in the figure, the ground layer 332a of the modulation module 3 may be disposed on the liquid crystal layer 343 (e.g., Figure 2 (as shown) and the third carrier plate 341 (as shown) Figure 2 Specifically, it is between the first electrode layer 346 of the electromagnetic wave adjustment element 34 (as shown) Figure 2 As shown in the figure, the ground layer 332a of the modulation module 3 can be used, thus reducing the fabrication of one electrode layer and lowering costs. In one embodiment, although not shown in the figure, the first pattern layer 331a of the modulation module 3 can be disposed on the side of the first carrier plate 31 adjacent to the electromagnetic wave adjustment element 34, and the ground layer 332a can be disposed on the liquid crystal layer 343 (as shown in the figure). Figure 2 (as shown) and the third carrier plate 341 (as shown) Figure 2 Therefore, the first modulation carrier plate 333a can be omitted. In one embodiment, although not shown in the figure, the ground layer 332a of the modulation module 3 can be disposed on the side of the electromagnetic wave adjustment element 34 adjacent to the first carrier plate 31 and is disposed on the entire surface. Here, "disposed on the entire surface" means that the entire top surface 349 of the electromagnetic wave adjustment element 34 is provided with the ground layer 332.

[0129] In this embodiment, the remaining features of the first pattern layer 331a, the first ground layer 332a, the first modulation carrier 333a, the second pattern layer 331b, the second ground layer 332b, and the second modulation carrier 333b can be referred to the aforementioned first pattern layer 331, ground layer 332, and modulation carrier 333, and will not be repeated here.

[0130] Figure 10 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure. Wherein, Figure 10 modulation module and Figure 8 Similar, except for the following differences. Furthermore, for ease of explanation, Figure 10 The electromagnetic wave adjustment element 34 omits some local structures; for details, please refer to [reference needed]. Figure 2 As shown.

[0131] Figure 10In this embodiment, the first pattern layer 331, the ground layer 332, and the modulation carrier plate 333 of the modulation module 3 can be stacked on top of each other and can be disposed on the fifth carrier plate 38. Furthermore, for aesthetic purposes and to achieve a protective effect, Figure 10 The modulation module 3 in this embodiment may further include a cover plate 7 disposed on the fifth carrier plate 38 and covering the first pattern layer 331, the ground layer 332, and the modulation carrier plate 333. The material of the cover plate 7 may include polycarbonate (PC), polymethyl methacrylate (PMMA), or a combination thereof.

[0132] Figure 11 This is a cross-sectional schematic diagram of a modulation module according to another embodiment of the present disclosure. Wherein, Figure 11 modulation module and Figure 10 Similar, except for the following differences. Furthermore, for ease of explanation, Figure 11 The electromagnetic wave adjustment element 34 omits some local structures; for details, please refer to [reference needed]. Figure 2 As shown.

[0133] Figure 11 In the embodiment, the modulation module 3 may not have a third adhesive layer 53 and a fifth carrier plate 38. The first pattern layer 331, the ground layer 332 and the modulation carrier plate 333 may be stacked on top of each other and may be disposed on the side of the first carrier plate 31 opposite to the electromagnetic wave adjustment element 34.

[0134] In this disclosure, the materials of the first carrier plate 31, the second carrier plate 32, the third carrier plate 341, the fourth carrier plate 342, the fifth carrier plate 38, the modulation carrier plate 333, the first modulation carrier plate 333a, and / or the second modulation carrier plate 333b may respectively include rigid substrates, soft substrates, or flexible substrates. The materials of the first carrier plate 31, the second carrier plate 32, the third carrier plate 341, the fourth carrier plate 342, the fifth carrier plate 38, the modulation carrier plate 333, the first modulation carrier plate 333a, and / or the second modulation carrier plate 333b may be the same as or different from each other. The materials of the first carrier plate 31, the second carrier plate 32, the third carrier plate 341, the fourth carrier plate 342, the fifth carrier plate 38, the modulation carrier plate 333, the first modulation carrier plate 333a, and / or the second modulation carrier plate 333b may each include glass, quartz, sapphire, ceramic, plastic, polycarbonate (PC), polyimide (PI), polypropylene (PP), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), other suitable materials, or combinations of the above materials, but are not limited thereto.

[0135] In this disclosure, the materials of the conductor 4, the first pattern layers 331 and 331a, the second pattern layer 331b, the ground layer 332, the first ground layer 332a, the second ground layer 332b, the first electrode layer 346, and / or the second electrode layer 347 may be the same or different from each other. The materials of the conductor 4, the first pattern layers 331 and 331a, the second pattern layer 331b, the ground layer 332, the first ground layer 332a, the second ground layer 332b, the first electrode layer 346, and / or the second electrode layer 347 may each comprise transparent conductive materials (e.g., indium zinc oxide (IZO), indium tin oxide (ITO), indium tin zinc oxide (ITZO), indium gallium zinc oxide (IGZO), aluminum zinc oxide (AZO)), non-transparent conductive materials (e.g., gold, silver, copper), or combinations thereof, but are not limited thereto.

[0136] In this disclosure, the materials of the first adhesive layer 51, the second adhesive layer 52, and / or the third adhesive layer 53 may include, for example, polyvinyl butyral (PVB), ethylene vinyl acetate (EVA), optical clear adhesive (OCA), optical clear resin (OCR), other suitable materials, or combinations thereof, but are not limited thereto.

[0137] In this disclosure, since the electromagnetic wave receiving element 33 in the electronic device or the modulation module 3 containing it is located near the outdoors, the signal is not affected by buildings or electrode layers, thus improving the signal strength and stability indoors. Furthermore, the first pattern layers 331 and 331a, the second pattern layer 331b, and the ground layer 332, as well as the first ground layer 332a and the second ground layer 332b in the modulation module 3, can be protected by the first carrier plate 31, the second carrier plate 32, and the fifth carrier plate 38, preventing oxidation or corrosion of the aforementioned pattern layers and ground layers, thereby improving product lifespan.

[0138] The specific embodiments described above should be interpreted as merely illustrative and not as limiting the remainder of this disclosure in any way.

[0139] The specific embodiments described above further illustrate the purpose, technical solutions, and beneficial effects of this disclosure. It should be understood that the above descriptions are merely specific embodiments of this disclosure and are not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. An electronic device, characterized in that, include: A frame, comprising an accommodating space and a frame slot disposed adjacent to the periphery of the accommodating space; A signal connection element is disposed within the frame slot; and A modulation module, disposed within the accommodating space, includes: First carrier board; A second carrier plate, corresponding to the first carrier plate; An electromagnetic wave receiving element is disposed on at least one of the first carrier plate or the second carrier plate; as well as An electromagnetic wave adjustment element is disposed between the first carrier plate and the second carrier plate; The electromagnetic wave receiving element is electrically connected to the signal connection element within the frame slot.

2. The electronic device according to claim 1, characterized in that, It also includes a wire that passes through the frame to connect the signal connection element and the electromagnetic wave receiving element.

3. The electronic device according to claim 2, characterized in that, The electromagnetic wave receiving element includes a first pattern layer disposed on the first carrier plate, and the first pattern layer is connected to the wire.

4. The electronic device according to claim 2, characterized in that, The modulation module includes a ground plane, and the ground plane is connected to the conductor.

5. The electronic device according to claim 1, characterized in that, The frame slot includes a first sub-frame slot and a second sub-frame slot. The signal connection element includes a first sub-device and a second sub-device. The first sub-device is disposed in the first sub-frame slot, and the second sub-device is disposed in the second sub-frame slot.

6. A modulation module, characterized in that, include: First carrier board; A second carrier plate, corresponding to the first carrier plate; A liquid crystal layer is disposed between the first substrate and the second substrate; An electromagnetic wave receiving element includes a first patterned layer; as well as A ground layer, corresponding to the first pattern layer; The first pattern layer is disposed on the first carrier plate, and the ground layer is adjacent to the liquid crystal layer relative to the first pattern layer.

7. The modulation module according to claim 6, characterized in that, It also includes a third carrier plate and a fourth carrier plate, the fourth carrier plate corresponding to the third carrier plate, the third carrier plate and the fourth carrier plate being disposed between the first carrier plate and the second carrier plate, and the liquid crystal layer being disposed between the third carrier plate and the fourth carrier plate.

8. The modulation module according to claim 7, characterized in that, The grounding layer is disposed between the liquid crystal layer and the third carrier plate.

9. The modulation module according to claim 7, characterized in that, The area of ​​the grounding layer is the same as the area of ​​the third carrier plate.

10. The modulation module according to claim 7, characterized in that, The thickness of the third and fourth carrier plates is less than the thickness of the first and second carrier plates.

11. The modulation module according to claim 6, characterized in that, It also includes a fifth carrier plate, wherein the first carrier plate is disposed between the fifth carrier plate and the second carrier plate, and the fifth carrier plate and the first carrier plate define a cavity.

12. The modulation module according to claim 11, characterized in that, The first pattern layer is disposed within the cavity.

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