Differential constant speed double-layer flight path planning method and system for laser mass transfer

Abstract

The present application relates to the technical field of mass transfer, and particularly relates to a difference uniform speed double-layer flight path planning method and system for laser mass transfer. The method comprises the following steps: obtaining configuration parameters of a transfer substrate, a receiving substrate and a laser array component; constructing a double-layer substrate cooperative motion mathematical model based on a speed Bezier curve according to the configuration parameters, constructing a constraint function of the double-layer substrate cooperative motion mathematical model based on a Bernstein basis function Bezier curve, and obtaining constraint boundaries of speed control points of the transfer substrate and the receiving substrate in each motion stage; constructing a path loss function for suppressing vibration, taking minimization of the path loss function as an objective, taking the constraint boundaries as constraint conditions, and constructing a constraint optimization model about the speed control points; solving the constraint optimization model to obtain an optimal speed control point vector, generating an optimal path of the transfer substrate and the receiving substrate, and realizing more stable and low-vibration flight operation, thereby improving chip transfer efficiency while ensuring transfer precision.

Description

Technical Field

[0001] This invention relates to the technical field of mass transfer, and particularly to a differential uniform velocity dual-layer flight path planning method and system for laser mass transfer. Background Technology

[0002] With the rapid development of the electronic display field, the demand for microelectronic display chips such as Mini / Micro LED has exploded. These chips are extremely small (<200μm), and the manufacturing process requires efficient and high-precision transfer of the chips from the source substrate used for growth to the target substrate used for display. This process is called mass transfer, and mass transfer technology is the core bottleneck restricting the large-scale mass production of microelectronic display panels.

[0003] Currently, a common technology for mass transfer is laser-induced transfer technology. This technology uses high-energy lasers to irradiate the interface material of the adhered chip, inducing a thermal reaction in the interface material, resulting in ablation or bulging. This causes the chip to detach or be pushed onto the target substrate, achieving contactless chip peeling and release. Currently, laser-induced technology has the advantage of being non-destructive, with a transfer efficiency (UPH) exceeding 130kk, making it the most promising technology for industrialization.

[0004] Laser-induced transfer technology still faces several challenges in meeting the demands of ultra-large-scale chip transfer. Since laser-induced technology involves transferring chips between two substrates, single-layer transfer techniques that only move the transfer substrate are limited by the spot size and travel distance, making it difficult to simultaneously meet the requirements of "large travel coverage" and "micrometer-level precision" for such tasks. Therefore, dual-layer transfer technology, which simultaneously moves both the transfer substrate and the receiving substrate, can better achieve parallel chip transfer and is more suitable for laser-induced transfer. However, most current motion planning algorithms can only realize the motion path of a single platform and cannot simultaneously consider the coordination of motion between two platforms (transfer substrate and receiving substrate). If such algorithms are rigidly applied to dual-layer transfer substrates, it will be difficult to achieve efficient transfer with dual-layer motion. Summary of the Invention

[0005] The main objective of this invention is to provide a differential uniform speed dual-layer flight path planning method and system for laser mass transfer, which aims to plan the optimal path of the transfer substrate and the receiving substrate during the laser mass transfer process of dual-layer substrates, so as to achieve a more stable and low-flutter flight operation, and improve chip transfer efficiency while ensuring transfer accuracy.

[0006] To achieve the above objectives, the present invention proposes a differential uniform velocity dual-layer flight path planning method for laser mass transfer, which is applied to planning the optimal paths of the transfer substrate and the receiving substrate during the laser mass transfer process of dual-layer substrates, and includes the following steps: Obtain the configuration parameters of the transfer substrate, the receiving substrate, and the laser array components; Based on the configuration parameters, a mathematical model of the coordinated motion of the two-layer substrate is constructed based on the velocity Bezier curve. The mathematical model of the coordinated motion of the two-layer substrate consists of the velocity curve equations of the transfer substrate and the receiving substrate at each motion stage. The constraint function of the mathematical model of the cooperative motion of the double-layer substrate is constructed based on the Bernstein basis function and the Bézier curve. The constraint boundary value is set according to the actual working condition and substituted into the constraint function to obtain the constraint boundary of the speed control point of the transfer substrate and the receiving substrate at each motion stage. Construct a path loss function to suppress vibration, and with the path loss function as the objective and the constraint boundary as the constraint condition, construct a constraint optimization model for the velocity control point; Solve the constraint optimization model to obtain the optimal speed control point vector; based on the optimal speed control point vector and the mathematical model of the cooperative motion of the double-layer substrate, generate the optimal paths for the transfer substrate and the receiving substrate.

[0007] In the aforementioned differential uniform two-layer flight path planning method for laser mass transfer, the configuration parameters include: The laser output time interval and the output size of the laser array in the laser array component; The number of columns of transfer chips in the transfer substrate, the number of rows of transfer chips, the horizontal spacing of transfer chips, the vertical spacing of transfer chips, the horizontal distance from the origin of the coordinate system to the starting point of the transfer substrate, and the vertical distance from the origin of the coordinate system to the starting point of the transfer substrate. The number of columns, rows, horizontal spacing, and vertical spacing of the chips in the receiving substrate; the horizontal distance from the origin of the coordinate system to the starting point of the receiving substrate; and the vertical distance from the origin of the coordinate system to the starting point of the receiving substrate.

[0008] In the aforementioned differential uniform two-layer flight path planning method for laser mass transfer, the velocity curve equation of the transfer substrate is: (1); (2); (3); in, The transfer substrate startup speed curve is shown. The transfer speed of the substrate transfer section. To transfer the horizontal spacing of the chips, The laser output time interval. For the transfer substrate section switching speed curve, The transfer substrate feed line speed curve is shown. The start-up time of the transfer substrate This is the start time of the transfer segment on the transfer substrate. , This is the start time of the substrate transfer area switching. To transfer the horizontal spacing of the chips, To adjust the vertical spacing of the chips, This is the start time of the transfer substrate line wrapping. To transfer the number of columns of the chip arrangement, This represents the number of laser points in the horizontal direction within the laser array. This is the end time of the transfer substrate line wrapping. The starting coefficient of the transfer substrate. The transfer coefficient of the transfer substrate. The transfer coefficient of the transfer substrate. The wrapping factor for the transfer substrate; The velocity curve equation for the substrate is: (4); (5); (6); To support the speed curve of the substrate startup segment, To accommodate the speed of the substrate receiving section, To accommodate the horizontal spacing of the chip arrangement, To support the speed curve of the substrate's changing section; To receive the substrate during startup. This marks the start time of the substrate receiving segment. This is the start time for receiving the substrate line break. This is to receive the end time of the substrate line change; The starting coefficient for the substrate. This represents the bearing capacity coefficient of the substrate. To accommodate the number of columns of the chip arrangement, This is the line break factor for the substrate.

[0009] In the aforementioned differential uniform two-layer flight path planning method for laser mass transfer, the constraint function is: (7); (8); (9); (10); (11); (12); (13); (14); in, This is a shift constraint function; Let i be the coordinate vector of the i-th velocity control point; These are Bernstein basis functions; The number of speed control points; It is the independent variable of the function; For the first moment, For the second moment; For time difference; For the velocity constraint function, Let i be the coordinate vector of the (i+1)th control point. Displacement constraint function The (n-1)th order Bernstein basis functions of the sum of the i-th terms; For the start-up section of the transfer substrate The initial velocity control point group, For transferring substrate to change sections The initial velocity control point group, For the transfer substrate change section The initial velocity control point group, To support the start-up section of the substrate The initial velocity control point group, To undertake the substrate replacement section The initial velocity control point group.

[0010] In the aforementioned differential uniform two-layer flight path planning method for laser mass transfer, the constraint boundary values ​​set according to the actual working conditions include: Constraints on the start-up section of the transfer substrate: (15); in, The maximum speed that the transfer substrate drive motor can withstand; This is the maximum acceleration that the transfer substrate drive motor can withstand; The horizontal distance between the origin of the coordinate system and the starting point of the transfer substrate; Constraints on substrate transfer and segment switching: (16); Constraints on the wrapping section of the transfer substrate: (17); Constraints of the substrate startup section: (18); in, To withstand the maximum speed that the baseboard drive motor can withstand; To withstand the maximum acceleration that the baseboard drive motor can withstand; This represents the horizontal distance from the origin of the coordinate system to the starting point of the receiving substrate. Constraints of substrate replacement section: (19); Substituting the constraints of the transfer substrate start-up segment, the transfer substrate section change segment, the transfer substrate line change segment, the receiving substrate start-up segment, and the receiving substrate section change segment into the constraint function, the following constraint boundaries for the speed control points of the transfer substrate and the receiving substrate at each motion stage are obtained: Constraint boundaries of the speed control point of the transfer substrate start-up section: (20); Constraint boundaries of speed control points for transferring substrate sections: (twenty one); Constraint boundaries of the speed control points for the transfer substrate's line crossing segment: (twenty two); Constraint boundaries of the speed control point of the substrate startup section: (twenty three); Constraint boundaries of speed control points for substrate switching sections: (twenty four).

[0011] In the aforementioned differential uniform two-layer flight path planning method for laser mass transfer, the path loss function is: (25); in, This is the path loss value. For stage index, , For the transfer substrate start-up section, To transfer the substrate to a different section, For the transfer substrate line break section, To support the start-up section of the substrate. To undertake the substrate replacement section; for The coordinate vector of the (i+1)th control point in the stage; for The coordinate vector of the i-th control point in the stage; The constraint optimization model for the speed control point is: (26); in, This is the equality constraint matrix. For the velocity control point matrix, The boundary matrix is ​​an equality constraint matrix. The inequality constraint matrix is... is the boundary matrix for inequality constraints.

[0012] In the aforementioned differential uniform two-layer flight path planning method for laser mass transfer, the minimum value of the loss function under equality and inequality constraints is found based on the projection gradient algorithm, thereby obtaining the corresponding optimal velocity control point vector. ; Based on the corresponding optimal speed control point vector, the optimal speed curve expression for the transfer substrate is: (27); The optimal speed curve expression for the substrate is: (28).

[0013] This invention also discloses a differential uniform velocity two-layer flight path planning system for laser mass transfer, applied to the aforementioned differential uniform velocity two-layer flight path planning method for laser mass transfer, the system comprising: The acquisition module is used to acquire the configuration parameters of the transfer substrate, the receiving substrate, and the laser array components; The mathematical model building module is used to construct a mathematical model of the coordinated motion of the two-layer substrates based on the velocity Bezier curve according to the configuration parameters. The mathematical model of the coordinated motion of the two-layer substrates consists of the velocity curve equations of the transfer substrate and the receiving substrate at each motion stage. The constraint establishment module is used to construct the constraint function of the mathematical model of the cooperative motion of the double-layer substrate based on the Bernstein basis function and the Bézier curve. The constraint boundary value is set according to the actual working condition and substituted into the constraint function to obtain the constraint boundary of the speed control point of the transfer substrate and the receiving substrate at each motion stage. The optimization model building module is used to construct a path loss function with the goal of suppressing residual vibration, and to construct a constrained optimization model about the velocity control point with the constraint boundary as the constraint condition. The solution module is used to solve the constraint optimization model to obtain the optimal speed control point vector; and based on the optimal speed control point vector and the mathematical model of the cooperative motion of the double-layer substrate, to generate the optimal path of the transfer substrate and the receiving substrate.

[0014] The present invention also discloses an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the above-described differential uniform velocity dual-layer flight path planning method for laser mass transfer.

[0015] The present invention also discloses a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described differential uniform velocity two-layer flight path planning method for laser mass transfer.

[0016] The technical solution provided by this invention may include the following beneficial effects: In this invention, a mathematical model of the cooperative motion of two-layer substrates is established based on the velocity Bezier curve. Compared with the traditional single-layer laser mass transfer, this application can plan a shorter and more continuous path between the transfer substrate and the receiving substrate, which significantly improves the efficiency of parallel chip transfer.

[0017] By constructing constraint boundaries using Bézier curves based on Bernstein basis functions, the continuity and smoothness of the motion trajectories of the transfer substrate and the receiving substrate are ensured. This effectively suppresses mechanical vibration and acceleration / deceleration impacts during high-speed movement of the dual-layer platform with "large stroke coverage," thereby achieving the positioning requirement of "micron-level accuracy" while ensuring high efficiency.

[0018] Meanwhile, taking advantage of the non-contact, high-frequency triggering characteristics of laser-induced transfer technology, this application constructs a constraint optimization model for the speed control point, which can achieve precise synchronization between motion and laser triggering, reducing the yield reduction problem caused by motion pauses or jitter. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram showing the positional relationship between the transfer substrate, the receiving substrate, and the laser array component in an embodiment of the present invention; Figure 2 for Figure 1 Another perspective illustration of the embodiment; Figure 3 This is a schematic diagram of each stage of the transfer substrate in an embodiment of the present invention; Figure 4 This is a schematic diagram of each stage of receiving the substrate in an embodiment of the present invention; Figure 5 This is a flowchart of the differential uniform velocity dual-layer flight path planning method in an embodiment of the present invention; Figure 6 This is a schematic diagram of the transfer substrate in an embodiment of the invention; Figure 7 This is a schematic diagram of the substrate receiving in an embodiment of the invention; Figure 8 This is a schematic diagram of the laser array component in an embodiment of the invention; Figure 9 This is a speed curve of the transfer substrate in an embodiment of the present invention; Figure 10 This is a speed curve diagram of the substrate receiving in an embodiment of the present invention; Figure 11 This is a schematic diagram of the laser mass transfer process on a double-layer substrate in this invention; Figure 12 This is a schematic diagram of the optimal path for the transfer substrate in this invention; Figure 13 This is a schematic diagram of the optimal path for receiving the substrate in this invention; Figure 14 This is a schematic diagram of the framework of the differential uniform velocity dual-layer flight path planning system for laser mass transfer in this invention; Figure 15 This is a schematic diagram of the electronic device in this invention. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0023] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the word "and / or" throughout the text means including three parallel solutions; taking "A and / or B" as an example, it includes solution A, solution B, or a solution that simultaneously satisfies A and B. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0025] The following description, in conjunction with the accompanying drawings, describes a differential uniform speed dual-layer flight path planning method for laser mass transfer according to an embodiment of the present invention. This method is applied to plan the optimal paths for transfer substrates and receiving substrates with different size parameters during the laser mass transfer process of dual-layer substrates, achieving a more stable and low-flutter flight operation, and improving chip transfer efficiency while ensuring transfer accuracy.

[0026] For ease of understanding, Figure 1 and Figure 2 The diagram illustrates the relative positions of the transfer substrate 100, the receiving substrate 200, and the laser array output by the laser array component 300 involved in the mass laser transfer of a double-layer substrate. Specifically, the laser array output component 300 outputs a laser array 310 at regular time intervals. This laser array 310 illuminates the laser alignment point 320 corresponding to the Mini / MicroLED chip 400 (hereinafter referred to as the chip) on the transfer substrate, causing the chip to peel off the transfer substrate 100 and fall onto the chip receiving position 210 corresponding to the receiving substrate 200.

[0027] In this embodiment, the spacing between the laser beams in the laser array is equal to the spacing between the chip receiving positions on the receiving board, while the chip spacing on the transfer substrate is much smaller than that on the receiving substrate. During the transfer process, the laser array output component remains stationary. After the transfer substrate and the receiving substrate are started, they undergo differential uniform speed movement; that is, both the transfer substrate and the receiving substrate maintain uniform speed movement, but their speeds differ. The laser array component causes the receiving substrate to move in units of the laser array, dividing the transfer substrate into different processing areas. After processing one transfer area, the transfer substrate needs to undergo variable speed movement to move to the next laser processing area for uniform speed movement. Every laser emission time interval, the transfer substrate and the laser emission component complete an alignment, i.e., a laser alignment point is formed. Simultaneously, the chip receiving positions on the receiving substrate and the chips on the transfer substrate also complete an alignment to achieve chip receiving. When the receiving substrate finishes processing its row area, it moves to the next row along with the transfer substrate. This process is repeated to form a periodic, massive laser transfer motion of the double-layer substrate until the transfer process ends.

[0028] Combination Figure 3 The movement process of the transfer substrate is divided into the start-up phase (acceleration movement, Sa ), transition segment (uniform motion, Sd ), changing sections (speed change), Sb ), change section (variable speed motion, Sc Four stages of movement; combined with Figure 4 The movement process of the substrate can be divided into the starting phase (acceleration movement, Ra ), connecting section (uniform motion, Rc ), change section (variable speed motion, Rb There are three stages of motion. Among them, variable speed motion refers to the stage that includes both acceleration and deceleration.

[0029] Considering the coordination of the transfer substrate and the receiving substrate during movement, such as Figure 5 As shown, the first aspect of this application provides a differential uniform velocity two-layer flight path planning method for laser mass transfer, comprising the following steps: Step S1: Obtain the configuration parameters of the transfer substrate, the receiving substrate, and the laser array components. The configuration parameters include the dimensional parameters of the transfer substrate, the receiving substrate, and the laser array components, as well as the chip layout parameters, etc.

[0030] Step S2: Based on the configuration parameters, construct a mathematical model of the cooperative motion of the two-layer substrates using velocity Bezier curves. This model consists of the velocity curve equations of the transfer substrate and the receiving substrate at each stage of motion. Specifically, Figure 9The speed curve of the transfer substrate is shown, including four motion stages in the transfer substrate's motion process: the start-up segment (acceleration motion), the transfer segment (uniform motion), the section change segment (variable speed motion), and the line change segment (variable speed motion). Figure 10 The speed curve of the receiving substrate is shown, including three motion stages in the motion process of the receiving substrate: the starting stage (acceleration motion), the receiving stage (uniform motion), and the changing stage (variable speed motion).

[0031] Step S3: Construct the constraint function of the mathematical model of the cooperative motion of the double-layer substrate based on the Bernstein basis function and the Bézier curve. Set the constraint boundary value according to the actual working conditions and substitute it into the constraint function to obtain the constraint boundary of the velocity control point of the transfer substrate and the receiving substrate at each motion stage. The constraints of the transfer substrate and the receiving substrate include velocity constraints, displacement constraints and acceleration constraints at each motion stage.

[0032] Step S4: Construct a path loss function to suppress vibration, with the goal of minimizing the path loss function and the constraint boundary as the constraint condition, and construct a constraint optimization model about the velocity control point.

[0033] Step S5: Solve the constraint optimization model to obtain the optimal velocity control point vector; based on the optimal velocity control point vector and the mathematical model of the cooperative motion of the double-layer substrate, generate the optimal paths for the transfer substrate and the receiving substrate. Specifically, the optimal velocity control point vector includes the velocity control point vector of the transfer substrate and the velocity control point vector of the receiving substrate. The velocity curve equations of the transfer substrate in each motion stage in the mathematical model of the cooperative motion of the double-layer substrate are reconstructed based on the velocity control point vector of the transfer substrate, and the velocity curve equations are integrated to obtain the displacement curve of the transfer substrate. Similarly, the velocity curve equations of the receiving substrate in each motion stage in the mathematical model of the cooperative motion of the double-layer substrate are reconstructed based on the velocity control point vector of the receiving substrate, and the velocity curve equations are integrated to obtain the displacement curve of the receiving substrate. Thus, the optimal paths for the transfer substrate and the receiving substrate can be obtained.

[0034] In this invention, a mathematical model of the cooperative motion of two-layer substrates is established based on the velocity Bezier curve. Compared with the traditional single-layer laser mass transfer, this application can plan a shorter and more continuous path between the transfer substrate and the receiving substrate, which significantly improves the efficiency of parallel chip transfer.

[0035] By constructing constraint boundaries using Bézier curves based on Bernstein basis functions, the continuity and smoothness of the motion trajectories of the transfer substrate and the receiving substrate are ensured. This effectively suppresses mechanical vibration and acceleration / deceleration impacts during high-speed movement of the dual-layer platform with "large stroke coverage," thereby achieving the positioning requirement of "micron-level accuracy" while ensuring high efficiency.

[0036] Meanwhile, taking advantage of the non-contact, high-frequency triggering characteristics of laser-induced transfer technology, this application constructs a constraint optimization model for the speed control point, which can achieve precise synchronization between motion and laser triggering, reducing the yield reduction problem caused by motion pauses or jitter.

[0037] For example, in a specific embodiment of the present invention, in step S1, the configuration parameters include: like Figure 6 As shown, the number of columns of transfer chips in the transfer substrate Number of rows of transfer chip arrangement Horizontal spacing of transfer chips Vertical spacing of transfer chips Horizontal distance from the origin of the coordinate system to the starting point of the transfer substrate The vertical distance between the origin of the coordinate system and the starting point of the transfer substrate ; like Figure 7 As shown, the number of rows of chips arranged in the receiving substrate Number of rows of chips to be accepted Horizontal spacing of the chip arrangement Vertical spacing of the receiving chip arrangement The horizontal distance between the origin of the coordinate system and the starting point of the receiving substrate The vertical distance from the origin of the coordinate system to the starting point of the receiving substrate ; like Figure 8 As shown, the laser output time interval in the laser array component and the output size of the laser array Of course, in other embodiments, the number of laser points in the horizontal direction and the number of laser points in the vertical direction of the laser array may also be different.

[0038] Based on the above configuration parameters, the laser array ( The transfer substrate is divided into OK List the laser processing areas and accept the substrate in one go. One chip.

[0039] Specifically, based on the above configuration parameters, in step S2, the velocity curve equation of the transfer substrate is: (1); (2); (3); in, The transfer substrate startup speed curve is shown. The transfer speed of the substrate transfer section. To transfer the horizontal spacing of the chips, The laser output time interval. For the transfer substrate section switching speed curve, The transfer substrate feed line speed curve is shown. The start-up time of the transfer substrate This is the start time of the transfer segment on the transfer substrate. , This is the start time of the substrate transfer area switching. To transfer the horizontal spacing of the chips, To adjust the vertical spacing of the chips, This is the start time of the transfer substrate line wrapping. To transfer the number of columns of the chip arrangement, This represents the number of laser points in the horizontal direction within the laser array. This is the end time of the transfer substrate line wrapping. The starting coefficient of the transfer substrate. The transfer coefficient of the transfer substrate. The transfer coefficient of the transfer substrate. The wrapping factor for the transfer substrate; The velocity curve equation for the substrate is: (4); (5); (6); To support the speed curve of the substrate startup segment, To accommodate the speed of the substrate receiving section, To accommodate the horizontal spacing of the chip arrangement, To support the speed curve of the substrate's changing section; To receive the substrate during startup. This marks the start time of the substrate receiving segment. This is the start time for receiving the substrate line break. This is to receive the end time of the substrate line change; The starting coefficient for the substrate. This represents the bearing capacity coefficient of the substrate. To accommodate the number of columns of the chip arrangement, This is the line break factor for the substrate.

[0040] Based on the velocity curve equations of the transfer substrate and the receiving substrate, a mathematical model of the cooperative motion of the two-layer substrate is constructed. The corresponding laser dual-layer differential cooperative flight operation realizes the laser mass transfer process as follows: Figure 11 As shown.

[0041] More specifically, in step S3, the constraint function constructed is: (7); (8); (9); (10); (11); (12); (13); (14); in, This is a shift constraint function; Let i be the coordinate vector of the i-th velocity control point; These are Bernstein basis functions; The number of speed control points; It is the independent variable of the function; For the first moment, For the second moment; For time difference; For the velocity constraint function, Let i be the coordinate vector of the (i+1)th control point. Displacement constraint function The (n-1)th order Bernstein basis functions of the sum of the i-th terms; For the start-up section of the transfer substrate The initial velocity control point group, For transferring substrate to change sections The initial velocity control point group, For the transfer substrate change section The initial velocity control point group, To support the start-up section of the substrate The initial velocity control point group, To undertake the substrate replacement section The initial velocity control point group.

[0042] Furthermore, in step S3, setting the constraint boundary values ​​according to the actual working conditions includes: Constraints on the start-up section of the transfer substrate: (15); in, The maximum speed that the transfer substrate drive motor can withstand; This is the maximum acceleration that the transfer substrate drive motor can withstand; The horizontal distance between the origin of the coordinate system and the starting point of the transfer substrate; Constraints on substrate transfer and segment switching: (16); Constraints on the wrapping section of the transfer substrate: (17); Constraints of the substrate startup section: (18); in, To withstand the maximum speed that the baseboard drive motor can withstand; To withstand the maximum acceleration that the baseboard drive motor can withstand; This represents the horizontal distance from the origin of the coordinate system to the starting point of the receiving substrate. Constraints of substrate replacement section: (19); Among them, in the above formulas (15), (16), (17), (18), and (19) v This represents a constraint in the velocity dimension. x This represents a constraint in the horizontal displacement dimension. a This represents a constraint in the acceleration dimension.

[0043] Substituting the constraints of the transfer substrate start-up segment, the transfer substrate section change segment, the transfer substrate line change segment, the receiving substrate start-up segment, and the receiving substrate section change segment into the constraint function, the following constraint boundaries for the speed control points of the transfer substrate and the receiving substrate at each motion stage are obtained: Constraint boundaries of the speed control point of the transfer substrate start-up section: (20); Constraint boundaries of speed control points for transferring substrate sections: (twenty one); Constraint boundaries of the speed control points for the transfer substrate's line crossing segment: (twenty two); Constraint boundaries of the speed control point of the substrate startup section: (twenty three); Constraint boundaries of speed control points for substrate switching sections: (twenty four).

[0044] Thus, the constraint boundaries of the initial velocity point set of the transfer substrate and the receiving substrate are obtained.

[0045] Further, in step S4, the path loss function is: (25); in, This is the path loss value. For stage index, , For the transfer substrate start-up section, To transfer the substrate to a different section, For the transfer substrate line break section, To support the start-up section of the substrate. To undertake the substrate replacement section; for The coordinate vector of the (i+1)th control point in the stage; for The coordinate vector of the i-th control point in the stage; Correspondingly, the constrained optimization model for constructing the velocity control point is as follows: (26); in, This is the equality constraint matrix. For the velocity control point matrix, The boundary matrix is ​​an equality constraint matrix. The inequality constraint matrix is... is the boundary matrix for inequality constraints.

[0046] Furthermore, based on the projection gradient algorithm, the minimum value of the loss function under equality and inequality constraints is found respectively, and the corresponding optimal velocity control point vector is obtained. ; Based on the corresponding optimal speed control point vector, such as Figure 12 The velocity curve shown, the optimal velocity curve expression for the transfer substrate is: (27); like Figure 13 The velocity curve shown, the optimal velocity curve expression for the substrate is: (28).

[0047] like Figure 14 As shown, the second aspect of the present invention discloses a differential uniform velocity two-layer flight path planning system 500 for laser mass transfer, applied to the differential uniform velocity two-layer flight path planning method for laser mass transfer in any of the above embodiments. The system 500 includes: The acquisition module 501 is used to acquire the configuration parameters of the transfer substrate, the receiving substrate, and the laser array components; The mathematical model building module 502 is used to construct a mathematical model of the coordinated motion of the two-layer substrates based on the velocity Bezier curve according to the configuration parameters. The mathematical model of the coordinated motion of the two-layer substrates consists of the velocity curve equations of the transfer substrate and the receiving substrate at each motion stage. The constraint establishment module 503 is used to construct the constraint function of the mathematical model of the cooperative motion of the double-layer substrate based on the Bernstein basis function and the Bézier curve. The constraint boundary value is set according to the actual working condition and substituted into the constraint function to obtain the constraint boundary of the speed control point of the transfer substrate and the receiving substrate at each motion stage. The optimization model building module 504 is used to construct a path loss function with the goal of suppressing residual vibration, and to construct a constrained optimization model about the velocity control point with the constraint boundary as the constraint condition. The solver module 505 is used to solve the constraint optimization model to obtain the optimal speed control point vector; and based on the optimal speed control point vector and the mathematical model of the cooperative motion of the double-layer substrate, to generate the optimal path of the transfer substrate and the receiving substrate.

[0048] The differential uniform velocity dual-layer flight path planning system 500 for laser mass transfer provided in this embodiment establishes a mathematical model of the cooperative motion of the dual-layer substrate based on the velocity Bezier curve. Compared with traditional single-layer laser mass transfer, this application can plan a shorter and more continuous path between the transfer substrate and the receiving substrate, significantly improving the efficiency of parallel chip transfer. By using Bezier curves based on Bernstein basis functions to construct constraint boundaries, the continuity and smoothness of the motion trajectories of the transfer substrate and the receiving substrate are ensured. This effectively suppresses mechanical vibration and acceleration / deceleration impacts of the dual-layer platform during high-speed motion with "large stroke coverage," thereby achieving the positioning requirement of "micron-level accuracy" while ensuring high efficiency. Simultaneously, considering the non-contact, high-frequency triggering characteristics of laser-induced transfer technology, this application constructs a constraint optimization model regarding the speed control point, enabling precise synchronization between motion and laser triggering, reducing yield reduction problems caused by motion pauses or jitter.

[0049] like Figure 15As shown, another aspect of the present invention provides an electronic device 600, including a processor 601 and a memory 602 connected together, such as via a bus 603. Further, the electronic device 600 may also include a transceiver 604. It should be noted that in practical applications, the transceiver 604 is not limited to one, and the structure of the electronic device 600 does not constitute a limitation on the embodiments of this application. The processor 601 is used in the embodiments of this application to implement the steps of the differential uniform velocity dual-layer flight path planning method for laser mass transfer. The processor 601 can be a CPU, a general-purpose processor, a DSP, an ASIC, an FPGA, or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It can implement or execute various exemplary logic blocks, modules, and circuits described in conjunction with the disclosure of this application. The processor 601 can also be a combination that implements computing functions, such as including one or more microprocessor combinations, a combination of a DSP and a microprocessor, etc. The bus 603 may include a path for transmitting information between the above components. The bus 603 can be a PCI bus or an EISA bus, etc. The bus 603 can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 15 The term "bus" is represented by a single thick line, but this does not imply that there is only one bus or one type of bus. The memory 602 can be a ROM or other type of static storage device capable of storing static information and instructions, RAM or other type of dynamic storage device capable of storing information and instructions, or it can be an EEPROM, CD-ROM or other optical disc storage, optical disk storage (including compressed optical disks, laser discs, optical discs, digital universal optical disks, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but is not limited thereto. The memory 602 is used to store application code that executes the scheme of this application, and its execution is controlled by the processor 601. The processor 601 is used to execute the application code stored in the memory 602 to implement the steps of the differential uniform velocity dual-layer flight path planning method for laser mass transfer provided by this invention.

[0050] In another aspect, the present invention provides a storage medium having a computer program stored thereon, the program being executed by a processor of the steps of the differential uniform velocity bilayer flight path planning method for laser mass transfer as executed by the server described above.

[0051] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made under the concept of the present invention using the contents of the present invention specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A differential uniform velocity dual-layer flight path planning method for laser mass transfer, applied to planning the optimal paths for the transfer substrate and the receiving substrate during laser mass transfer of dual-layer substrates, characterized by: Includes the following steps: Obtain the configuration parameters of the transfer substrate, the receiving substrate, and the laser array components; Based on the configuration parameters, a mathematical model of the coordinated motion of the two-layer substrate is constructed based on the velocity Bezier curve. The mathematical model of the coordinated motion of the two-layer substrate consists of the velocity curve equations of the transfer substrate and the receiving substrate at each motion stage. The constraint function of the mathematical model of the cooperative motion of the double-layer substrate is constructed based on the Bernstein basis function and the Bézier curve. The constraint boundary value is set according to the actual working condition and substituted into the constraint function to obtain the constraint boundary of the speed control point of the transfer substrate and the receiving substrate at each motion stage. A path loss function is constructed with the goal of suppressing residual vibration, and a constrained optimization model is constructed with the constraint boundary as the constraint condition for the velocity control point. Solve the constraint optimization model to obtain the optimal speed control point vector; based on the optimal speed control point vector and the mathematical model of the cooperative motion of the double-layer substrate, generate the optimal paths for the transfer substrate and the receiving substrate.

2. The differential uniform velocity dual-layer flight path planning method for laser mass transfer according to claim 1, characterized in that: The configuration parameters include: The laser output time interval and the output size of the laser array in the laser array component; The number of columns of transfer chips in the transfer substrate, the number of rows of transfer chips, the horizontal spacing of transfer chips, the vertical spacing of transfer chips, the horizontal distance from the origin of the coordinate system to the starting point of the transfer substrate, and the vertical distance from the origin of the coordinate system to the starting point of the transfer substrate. The number of columns, rows, horizontal spacing, and vertical spacing of the chips in the receiving substrate; the horizontal distance from the origin of the coordinate system to the starting point of the receiving substrate; and the vertical distance from the origin of the coordinate system to the starting point of the receiving substrate.

3. The differential uniform velocity dual-layer flight path planning method for laser mass transfer according to claim 1, characterized in that: The equation for the velocity curve of the transfer substrate is: （1）； （2）； （3）； in, The transfer substrate startup speed curve is shown. The transfer speed of the substrate transfer section. To transfer the horizontal spacing of the chips, The laser output time interval. For the transfer substrate section switching speed curve, The transfer substrate feed line speed curve is shown. The start-up time of the transfer substrate This is the start time of the transfer segment on the transfer substrate. , This is the start time of the substrate transfer area switching. To transfer the horizontal spacing of the chips, To adjust the vertical spacing of the chips, This is the start time of the transfer substrate line wrapping. To transfer the number of columns of the chip arrangement, This represents the number of laser points in the horizontal direction within the laser array. This is the end time of the transfer substrate line wrapping. The starting coefficient of the transfer substrate. The transfer coefficient of the transfer substrate. The transfer coefficient of the transfer substrate. The wrapping factor for the transfer substrate; The velocity curve equation for the substrate is: （4）； （5）； （6）； To support the speed curve of the substrate startup segment, To accommodate the speed of the substrate receiving section, To accommodate the horizontal spacing of the chip arrangement, To support the speed curve of the substrate's changing section; To receive the substrate during startup. This marks the start time of the substrate receiving segment. This is the start time for receiving the substrate line break. This is to receive the end time of the substrate line change; The starting coefficient for the substrate. This represents the bearing capacity coefficient of the substrate. To accommodate the number of columns of the chip arrangement, This is the line break factor for the substrate.

4. The differential uniform velocity dual-layer flight path planning method for laser mass transfer according to claim 1, characterized in that: The constraint function is: （7）； （8）； （9）； （10）； （11）； （12）； （13）； （14）； in, This is a shift constraint function; Let i be the coordinate vector of the i-th velocity control point; These are Bernstein basis functions; The number of speed control points; It is the independent variable of the function; For the first moment, For the second moment; For time difference; For the velocity constraint function, Let i be the coordinate vector of the (i+1)th control point. Displacement constraint function The (n-1)th order Bernstein basis functions of the sum of the i-th terms; For the start-up section of the transfer substrate The initial velocity control point group, For transferring substrate to change sections The initial velocity control point group, For the transfer substrate change section The initial velocity control point group, To support the start-up section of the substrate The initial velocity control point group, To undertake the substrate replacement section The initial velocity control point group.

5. The differential uniform velocity dual-layer flight path planning method for laser mass transfer according to claim 4, characterized in that: The constraint boundary values ​​are set according to the actual working conditions, including: Constraints on the start-up section of the transfer substrate: （15）； in, The maximum speed that the transfer substrate drive motor can withstand; This is the maximum acceleration that the transfer substrate drive motor can withstand; The horizontal distance between the origin of the coordinate system and the starting point of the transfer substrate; Constraints on substrate transfer and segment switching: （16）； Constraints on the wrapping section of the transfer substrate: （17）； Constraints of the substrate startup section: （18）； in, To withstand the maximum speed that the baseboard drive motor can withstand; To withstand the maximum acceleration that the baseboard drive motor can withstand; This represents the horizontal distance from the origin of the coordinate system to the starting point of the receiving substrate. Constraints of substrate replacement section: （19）； Substituting the constraints of the transfer substrate start-up segment, the transfer substrate section change segment, the transfer substrate line change segment, the receiving substrate start-up segment, and the receiving substrate section change segment into the constraint function, the following constraint boundaries for the speed control points of the transfer substrate and the receiving substrate at each motion stage are obtained: Constraint boundaries of the speed control point of the transfer substrate start-up section: (20)； Constraint boundaries of speed control points for transferring substrate sections: (21)； Constraint boundaries of the speed control points for the transfer substrate's line crossing segment: (22)； Constraint boundaries of the speed control point of the substrate startup section: (23)； Constraint boundaries of speed control points for substrate switching sections: （24）。 6. The differential uniform velocity dual-layer flight path planning method for laser mass transfer according to claim 4, characterized in that: The path loss function is: （25）； in, This is the path loss value. For stage index, , For the transfer substrate start-up section, To transfer the substrate to a different section, For the transfer substrate line break section, To support the start-up section of the substrate. To undertake the substrate replacement section; for The coordinate vector of the (i+1)th control point in the stage; for The coordinate vector of the i-th control point in the stage; The constraint optimization model for the speed control point is: （26）； in, This is the equality constraint matrix. For the velocity control point matrix, The boundary matrix is ​​an equality constraint matrix. The inequality constraint matrix is... is the boundary matrix for inequality constraints.

7. The differential uniform velocity dual-layer flight path planning method for laser mass transfer according to claim 1, characterized in that: The minimum value of the loss function under equality and inequality constraints is found using the projection gradient algorithm, thus obtaining the corresponding optimal velocity control point vector. ; Based on the corresponding optimal speed control point vector, the optimal speed curve expression for the transfer substrate is: （27）； The optimal speed curve expression for the substrate is: （28）。 8. A laser mass transfer differential uniform velocity dual-layer flight path planning system, characterized in that: The system, applied to the differential uniform velocity two-layer flight path planning method for laser mass transfer as described in any one of claims 1-7, comprises: The acquisition module is used to acquire the configuration parameters of the transfer substrate, the receiving substrate, and the laser array components; The mathematical model building module is used to construct a mathematical model of the coordinated motion of the two-layer substrates based on the velocity Bezier curve according to the configuration parameters. The mathematical model of the coordinated motion of the two-layer substrates consists of the velocity curve equations of the transfer substrate and the receiving substrate at each motion stage. The constraint establishment module is used to construct the constraint function of the mathematical model of the cooperative motion of the double-layer substrate based on the Bernstein basis function and the Bézier curve. The constraint boundary value is set according to the actual working condition and substituted into the constraint function to obtain the constraint boundary of the speed control point of the transfer substrate and the receiving substrate at each motion stage. The optimization model building module is used to construct a path loss function with the goal of suppressing residual vibration, and to construct a constrained optimization model about the velocity control point with the constraint boundary as the constraint condition. The solution module is used to solve the constraint optimization model to obtain the optimal speed control point vector; and based on the optimal speed control point vector and the mathematical model of the cooperative motion of the double-layer substrate, to generate the optimal path of the transfer substrate and the receiving substrate.

9. An electronic device, characterized in that: It includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor, when executing the program, implements the method according to any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the method described in any one of claims 1-7.

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