A high-frequency PCB material thermal reliability rapid verification method and system based on multi-physical field coupling

Abstract

The application discloses a kind of high-frequency PCB material thermal reliability fast verification method and system based on multi-physical field coupling, through multi-physical field coupling mechanism, high-frequency electric loss, heat conduction and material thermal decomposition characteristics are dynamically associated, break through the limitation of traditional single physical field simulation electric-thermal split analysis, can verify the necessity of liquid cooling scheme in material selection stage, auxiliary system level decision-making;The application uses lumped parameter thermal resistance network model to replace complex three-dimensional finite element analysis, compresses single verification time consumption to millisecond level, simultaneously by introducing surface roughness correction factor and thermal resistance correction factor, realize the accurate compensation of high-frequency copper foil skin effect and material dielectric property thermal drift.

Description

Technical Field

[0001] This invention relates to the field of computer-aided research and development technology for electronic materials, and in particular to a method and system for rapid verification of the thermal reliability of high-frequency PCB materials based on multi-physics coupling. Background Technology

[0002] In the research and development of high-frequency materials for millimeter-wave radar and 6G communication, traditional verification methods have the following drawbacks: heavy-duty simulation is time-consuming. Existing technologies (such as Ansys HFSS+Icepak co-simulation) rely on finite element analysis (FEA), which requires the construction of complex 3D meshes and cross-software data import and export, with a single verification taking hours. The physical field is fragmented. Traditional material selection often only considers the electrical parameters (Dk / Df) at room temperature, ignoring the dielectric property drift caused by the "self-heating effect" of materials under high power. Summary of the Invention

[0003] To address the shortcomings of the aforementioned technologies, this invention provides a method and system for rapid verification of the thermal reliability of high-frequency PCB materials based on multi-physics coupling.

[0004] To achieve the above objectives, this invention provides a rapid verification method for the thermal reliability of high-frequency PCB materials based on multi-physics coupling, comprising the following steps:

[0005] S1. Obtain the high-frequency PCB material to be tested, and obtain the dielectric constant of the high-frequency PCB material based on the material parameter database. Dielectric loss angle tan(δ), thermal conductivity and decomposition temperature ;

[0006] S2, through a high-frequency loss calculation unit, combined with a surface roughness correction factor Calculate the total loss of the transmission line in the high-frequency band. ;

[0007] S3, total loss Real-time conversion to thermal power And input it into the dynamic thermal resistance network calculation unit;

[0008] S4, based on thermal resistance correction factor Construct a lumped-parameter thermal resistance network model to predict the thermal equilibrium junction temperature. ;

[0009] S5 will bring the thermal equilibrium junction temperature to a minimum. With the material decomposition temperature The comparison outputs the material's thermal reliability status as Safe / Critical / Burnout.

[0010] As an improvement of the present invention, the total loss of the transmission line in the high-frequency band The calculation formula is:

[0011]

[0012] in, For dielectric loss, For conductor loss, For unit conversion constants, For operating frequency, For conductor geometry constants, Conductor losses are proportional to the square root of the frequency.

[0013] As an improvement of the present invention, the total loss Converted into thermal power The calculation formula is:

[0014]

[0015] in, Where L is the input RF power, and L is the transmission line length. Represents the proportion of remaining power, 1- The proportion of power that is lost and converted into heat.

[0016] As an improvement of the present invention, the predicted junction temperature The calculation formula is:

[0017]

[0018] in, For ambient temperature, The effective thermal resistance of the material.

[0019] As an improvement of the present invention, the effective thermal resistance The calculation formula is:

[0020] ≈

[0021] Among them, the The thermal conductivity of the material The effective heat dissipation area of ​​the material, The thickness is the dielectric layer thickness.

[0022] As an improvement of the present invention, in S5, the thermal reliability state of the material includes the following states:

[0023] When the thermal equilibrium junction temperature Material decomposition temperature - If so, it is determined to be Safe;

[0024] When the thermal equilibrium junction temperature Material decomposition temperature If so, it is determined that the Burnout has been burned;

[0025] When the material decomposition temperature - Thermal equilibrium junction temperature ≤ Material decomposition temperature If so, it is judged as high-risk (Critical).

[0026] in, For safety margin.

[0027] As an improvement of the present invention, the surface roughness correction factor The roughness of copper foil is obtained dynamically based on the Hammerstad model and measured.

[0028] This invention also provides a rapid thermal reliability verification system for high-frequency PCB materials based on multi-physics coupling, comprising:

[0029] The material parameter database module is used to store and manage the dielectric constants of high-frequency PCB materials. Dielectric loss angle tan(δ), thermal conductivity and decomposition temperature parameters ;

[0030] The high-frequency loss calculation unit module is used to calculate the total loss of the transmission line in the high-frequency band based on the surface roughness correction factor and relevant parameters obtained from the material parameter database module. ;

[0031] The dynamic thermal resistance network calculation unit module is used to receive the heat power after converting the total loss in real time. And combined with thermal resistance correction factor Construct a lumped-parameter thermal resistance network model;

[0032] The thermal equilibrium junction temperature prediction module is used to predict the thermal equilibrium junction temperature based on the model built by the dynamic thermal resistance network calculation unit module. ;

[0033] The material thermal reliability condition determination module is used to determine the thermal equilibrium junction temperature predicted by the thermal equilibrium junction temperature prediction module. With the material decomposition temperature The comparison outputs the material's thermal reliability status as Safe / Critical / Burnout.

[0034] The beneficial effects of this invention are as follows: Compared with the prior art, this invention provides a rapid verification method for the thermal reliability of high-frequency PCB materials based on multi-physics coupling. Through the multi-physics coupling mechanism, high-frequency electrical loss, heat conduction, and material thermal decomposition characteristics are dynamically correlated, breaking through the limitations of electro-thermal separation analysis in traditional single-physics simulation. The necessity of liquid cooling schemes can be verified at the material selection stage, assisting system-level decision-making. This invention uses a lumped parameter thermal resistance network model to replace complex three-dimensional finite element analysis, compressing the verification time to the millisecond level. At the same time, by introducing surface roughness correction factors and thermal resistance correction factors, it achieves accurate compensation for the skin effect of high-frequency copper foil and thermal drift of material dielectric properties, and has a closed-loop verification function from "material micro-physical parameters" to "macro-weapon-level scenario survival determination". Attached Figure Description

[0035] Figure 1 This is a flowchart of the method of the present invention;

[0036] Figure 2 This is a diagram illustrating the module interaction of the present invention. Detailed Implementation

[0037] To more clearly illustrate the present invention, the invention will be further described below with reference to the accompanying drawings.

[0038] In the following description, specific examples are given to provide a more in-depth understanding of the invention. It is obvious that the described embodiments are merely some, not all, of the embodiments of the invention. It should be understood that the specific embodiments described are for illustrative purposes only and are not intended to limit the scope of the invention.

[0039] It should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of the said feature, integral, step, operation, element, or component, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, or combinations thereof.

[0040] Please see Figures 1-2 The present invention provides a rapid verification method for the thermal reliability of high-frequency PCB materials based on multi-physics coupling, comprising the following steps:

[0041] S1. Obtain the high-frequency PCB material to be tested, and obtain the dielectric constant of the high-frequency PCB material based on the material parameter database. Dielectric loss angle tan(δ), thermal conductivity and decomposition temperature ;

[0042] S2, through a high-frequency loss calculation unit, combined with a surface roughness correction factor Calculate the total loss of the transmission line in the high-frequency band. ;

[0043] S3, total loss Real-time conversion to thermal power And input it into the dynamic thermal resistance network calculation unit;

[0044] S4, based on thermal resistance correction factor Construct a lumped-parameter thermal resistance network model to predict the thermal equilibrium junction temperature. ;

[0045] S5 will bring the thermal equilibrium junction temperature to a minimum. With the material decomposition temperature The comparison outputs the material's thermal reliability status as Safe / Critical / Burnout.

[0046] This invention provides a method for simultaneously performing electromagnetic and thermal environment tests on high-frequency PCB materials. Compared to traditional testing methods that require separate electromagnetic simulation tests in different simulation software followed by thermal environment simulation tests, this method offers higher testing efficiency and more comprehensive testing dimensions. Traditional testing methods are discrete and sequential, requiring switching between different software, resulting in cumbersome calculations, long processing times, inability to achieve real-time linkage, and potential data errors due to software compatibility issues. The multi-physics coupling method proposed in this invention integrates electromagnetic and thermal environment tests on the same platform, achieving seamless data integration and real-time interaction. Electromagnetic and thermal simulations are calculated within the same software framework, with data directly transferred in memory. The electromagnetic loss calculation is immediately incorporated into the thermal simulation test calculation, achieving "second-level joint simulation" of electromagnetic and thermal simulations. This effectively avoids error accumulation during data transmission, significantly improving the accuracy and reliability of the test. Furthermore, this invention introduces a surface roughness correction factor. The surface roughness correction factor for the corresponding material can be calculated using the classic Hammerstad model. It is mainly used to correct the increased loss caused by the roughness of the copper foil; surface roughness correction factor. The introduction of this factor makes the calculation of total loss more accurate and can more realistically reflect the performance of high-frequency PCB materials in practical applications; traditional unidirectional thermal resistance calculation ignores the lateral transfer of heat, while this invention is based on a thermal resistance correction factor. Constructed lumped parameter thermal resistance network model, thermal resistance correction factor This method is used to characterize the thermal diffusion effect of high-frequency transmission lines (narrow linewidth) in the dielectric layer, correcting for deviations in actual thermal resistance caused by different PCB shapes and mounting methods. It maps complex three-dimensional thermal flow field characteristics to a one-dimensional lumped parameter model, thus correcting dimensional biases in the physical model while maintaining computational speed. It fully considers the heat dissipation of materials in actual working environments, making the predicted thermal equilibrium junction temperature closer to the true value. In practical applications, this method can be widely used in high-frequency communications, aerospace, automotive electronics, and other fields, helping to improve the reliability and stability of related products and reduce the risk of failure due to material failure. It should be noted that the dielectric constant symbol used in this application... Compared with specific embodiments and material parameters commonly used in industry. (Dielectric Constant) characterizes the same physical quantity; similarly, the dielectric loss angle tan(δ) and The Dissipation Factor represents the same physical quantity, and the two can be equivalently substituted in this invention.

[0047] This invention simplifies complex field calculations into a set of directly solvable closed-loop mathematical formulas (transmission line theory + thermal resistance network model), without the need for mesh generation or cross-software interaction. Therefore, the computational load is extremely small, and verification can be completed in milliseconds, requiring only minimal computing power (CPU is sufficient, no workstation is needed).

[0048] In this embodiment, existing commercial databases (such as HFSS or ADS libraries) typically only contain electrical parameters. / (Or it may only contain thermal parameters, and most of them are for room temperature environments. The material parameter database of this invention is a pre-built database that includes electrical parameters.) , With thermodynamics , Bound under the same ID, the database covers key parameters of various domestically produced high-frequency PCB materials, including but not limited to dielectric constant, dielectric loss angle, thermal conductivity, and decomposition temperature. These parameters are the basic data source for subsequent electromagnetic and thermal environment testing. The database of this invention not only stores nominal values ​​but also engineering values ​​corrected based on actual measurements, features not found in existing general-purpose databases. In practice, users only need to input the type or number of the material to be tested to quickly retrieve the corresponding parameter values ​​from the database, greatly simplifying pre-test preparation and improving testing efficiency. In addition, the database has a dynamic update function, which can be expanded and optimized in a timely manner as new material research and development results emerge, ensuring the timeliness and accuracy of test data.

[0049] In this embodiment, the total loss of the transmission line in the high-frequency band The calculation formula is:

[0050]

[0051] in, This is a unit conversion constant used to convert the results of physical formulas into the industry-standard dB / inch unit (in this embodiment, ...). The value of is approximately equal to 2.3. For operating frequency, For conductor geometry constants, The conductor loss is proportional to the square root of the frequency. This formula fully considers the influence of dielectric loss, conductor loss, and surface roughness on the total transmission line loss in high-frequency environments. According to transmission line theory, in the millimeter-wave band, the skin effect is extremely strong, and the current concentrates on the conductor surface. If the copper foil surface is rough, the current path will be longer and more tortuous, resulting in the actual conductor loss being much greater than the theoretical value for an ideal smooth surface. This can effectively correct this deviation, making the total loss calculation result closer to the actual working conditions.

[0052] In this embodiment, the total loss Converted to thermal power The calculation formula is:

[0053]

[0054] Among them, among them, Where L is the input RF power, and L is the transmission line length. Represents the proportion of remaining power, 1- The proportion of power that is lost and converted into heat. This represents the total attenuation (in dB) of the transmission line over a specified length L; this formula can be used to calculate the thermal power of high-frequency PCB materials. What is the value of ? This directly reflects the heat generated by the material due to losses during high-frequency signal transmission, providing key data reference for predicting the thermal equilibrium junction temperature. The input RF power and transmission line length are obtained by consulting a material parameter database, and combined with the previously calculated total loss... The heat power can be accurately calculated. .

[0055] In this embodiment, the junction temperature is predicted. The calculation formula is:

[0056]

[0057] in, Ambient temperature refers to the external ambient temperature where the equipment is located. Effective thermal resistance of the material; predicted junction temperature This refers to the junction temperature of a material, i.e., the steady-state core temperature of the material under maximum load. This temperature is a key indicator for evaluating the thermal stability of a material. By combining ambient temperature and the material's effective thermal resistance, the thermal equilibrium state of the material in the actual working environment can be accurately predicted; effective thermal resistance... The introduction of this method fully considers the influence of material shape, installation method and heat dissipation conditions on heat conduction, making the prediction results more practical for engineering applications.

[0058] In this embodiment, effective thermal resistance The calculation formula is:

[0059] ≈

[0060] in, The thermal conductivity of the material The effective heat dissipation area of ​​a material refers to the equivalent area of ​​the PCB or material surface that can participate in convection / radiation heat dissipation. The thickness of the dielectric layer or the length of the heat conduction path; based on the thermal resistance network model, calculate the core temperature of the material in steady state; effective thermal resistance. Taking into full account the thermal properties of the material itself and heat dissipation conditions, the thermal resistance correction factor γ is used to correct for deviations in actual thermal resistance caused by different PCB shapes and mounting methods, making the calculation results more consistent with reality; through calculation This allows for a more accurate estimation of the effective thermal resistance of materials under specific working conditions, improving the accuracy and reliability of the test.

[0061] In this embodiment, in S5, the material thermal reliability state includes the following states:

[0062] When the thermal equilibrium junction temperature Material decomposition temperature - If so, it is determined to be Safe;

[0063] When the thermal equilibrium junction temperature Material decomposition temperature If so, it is determined that the Burnout has been burned;

[0064] When the material decomposition temperature - Thermal equilibrium junction temperature ≤ Material decomposition temperature If so, it is judged as high-risk (Critical).

[0065] in, For safety margins, which are generally engineering-set values, they are usually determined by system reliability standards, such as IPC standards or military standards. For example, the long-term operating temperature must be 20°C or 50°C below the material decomposition temperature. Exceeded ( - This indicates that although the material has not yet decomposed, it is approaching its limit and is in a "high-risk zone," requiring a warning. If the temperature... Less than the material decomposition temperature If the temperature is within a safe operating range, it indicates that the material is still within the safe operating range, but continuous monitoring is required to prevent further temperature increases. Other situations can be deduced similarly. The safety margin Δt not only considers the thermal stability of the material itself but also covers uncertainties such as environmental fluctuations and load changes in practical applications, ensuring the reliability of the system under extreme conditions. Through a graded judgment mechanism, users can intuitively understand the working status of the material, avoid potential failure risks, adapt to different application scenarios, and further enhance the flexibility and engineering value of testing.

[0066] In this embodiment, the surface roughness correction factor Based on the Hammerstad model and dynamically calculated from measured copper foil roughness, the Hammerstad model constructs a loss correction mathematical model by accurately measuring the microscopic morphology parameters of the copper foil surface, such as average roughness, root mean square roughness, and peak density, and combining them with the propagation characteristics of high-frequency signals on rough surfaces. The Hammerstad model not only considers the extension of the current path under the skin effect but also quantifies the uneven current distribution caused by surface roughness, thus accurately calculating the additional losses due to increased surface roughness. In practical applications, users only need to input the measured roughness parameters of the copper foil, and the system can automatically call the Hammerstad model to dynamically generate the surface roughness correction factor for the current material. This ensures the accuracy of the total loss calculation.

[0067] This invention also provides a rapid thermal reliability verification system for high-frequency PCB materials based on multi-physics coupling, comprising:

[0068] The material parameter database module is used to store and manage the dielectric constants of high-frequency PCB materials. Dielectric loss angle tan(δ), thermal conductivity and decomposition temperature parameters ;

[0069] The high-frequency loss calculation unit module is used to calculate the total loss of the transmission line in the high-frequency band based on the surface roughness correction factor and relevant parameters obtained from the material parameter database module. ;

[0070] The dynamic thermal resistance network calculation unit module is used to receive the heat power after converting the total loss in real time. And combined with thermal resistance correction factor Construct a lumped-parameter thermal resistance network model;

[0071] The thermal equilibrium junction temperature prediction module is used to predict the thermal equilibrium junction temperature based on the model built by the dynamic thermal resistance network calculation unit module. ;

[0072] The material thermal reliability condition determination module is used to determine the thermal equilibrium junction temperature predicted by the thermal equilibrium junction temperature prediction module. With the material decomposition temperature The comparison outputs the material's thermal reliability status as Safe / Critical / Burnout.

[0073] This system, through a highly integrated modular design, achieves precise processing from parameter calling to state determination. The high-frequency loss calculation unit module incorporates a multi-band adaptive algorithm, capable of simultaneously processing wideband signals from MHz to THz. By dynamically adjusting the weighting coefficients of the surface roughness correction factor, it ensures calculation accuracy across different frequency bands. The dynamic thermal resistance network calculation unit module introduces a thermal resistance correction factor. By correcting thermal resistance deviations caused by differences in PCB shape and mounting method in real time, the conversion of heat power to junction temperature is made more consistent with actual operating conditions; the thermal balance junction temperature prediction module is used to determine the steady-state core temperature of the material under the highest load; the material thermal reliability status judgment module adopts a graded early warning mechanism, combined with user-defined safety margins. The system dynamically assesses the thermal reliability of materials. When the junction temperature enters the high-risk critical region, the system not only outputs a status indicator but also triggers a visual warning interface. For example, it uses color gradients (green → yellow → red) to visually display the degree to which the temperature approaches the decomposition temperature, records the junction temperature change curve and key parameter fluctuations, and provides users with analytical data support.

[0074] Example: The following example uses material 43*0 sold by a certain company:

[0075] Material type: 43*0 (equivalent to Rogers 4350B);

[0076] Frequency f: 77 GHz;

[0077] parameter: =3.66, =0.0037, thermal conductivity =0.62 W / mK, decomposition temperature =390℃, dielectric layer thickness =0.508mm, effective heat dissipation area = Thermal resistance correction factor =0.8;

[0078] Roughness correction : 1.15 (based on a roughness of 0.5µm);

[0079] Operating conditions: Input power P_input = 10W, length L = 2 inches, ambient temperature =85℃;

[0080] The calculation process for obtaining the thermal reliability state of a material:

[0081] 1. S1 (Calculate Losses):

[0082] Dielectric loss term = ≈2.3×77×0.0037× ≈1.25dB / inch;

[0083] Conductor loss term = ≈1.15×0.15× ≈1.51 dB / inch (assuming geometric constant A = 0.15);

[0084] Total loss =1.25+1.51=2.76dB / inch.

[0085] 2.S2 (calculate heat generation):

[0086] Total Attenuation =2.76×2=-5.52dB;

[0087] = =10×(1- =10×(1-0.28)=7.2Watt, meaning that 7.2W of the 10W signal is converted into heat.

[0088] 3. S3 (Calculate Temperature):

[0089] Assuming effective thermal resistance = / =0.000508 / ( ≈15℃ / W;

[0090] = =85+(15×7.2)=85+108=193℃.

[0091] 4. S4 (Judgment):

[0092] Threshold = - =390℃-50℃=340℃

[0093] because < - =193℃<340℃, so the conclusion is safe.

[0094] The advantages of this invention are:

[0095] 1. This invention achieves simultaneous verification of the electromagnetic and thermal properties of high-frequency PCB materials by integrating a multi-physics coupling test method, avoiding data errors and efficiency losses caused by software switching in the traditional discrete test process; the closed-loop mathematical model of this invention reduces the computational complexity by two orders of magnitude, and with the dynamically updated domestic material database, the test cycle is shortened to the millisecond level, and no high-end computing hardware support is required.

[0096] 2. The surface roughness correction factor and thermal resistance correction factor introduced in this invention are used to correct the influence of conductor surface roughness and actual heat dissipation conditions of materials on the test results under high frequency environment, thereby improving the prediction accuracy of total loss and thermal equilibrium junction temperature.

[0097] 3. The graded judgment mechanism, combined with engineering safety margins, can provide flexible and accurate thermal reliability status assessments for high-frequency PCB materials in different application scenarios. By setting differentiated safety margins, it can meet the requirements of extreme reliability in the aerospace field, as well as adapt to the lenient thresholds of cost-sensitive scenarios such as consumer electronics, so that the test results are both engineering practical and economical.

[0098] The above-disclosed embodiments are merely a few specific examples of the present invention, but the present invention is not limited thereto. Any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. A rapid verification method for the thermal reliability of high-frequency PCB materials based on multi-physics coupling, characterized in that, Includes the following steps: S1. Obtain the high-frequency PCB material to be tested, and obtain the dielectric constant of the high-frequency PCB material based on the material parameter database. Dielectric loss angle tan(δ), thermal conductivity and decomposition temperature ; S2, through a high-frequency loss calculation unit, combined with a surface roughness correction factor Using the relevant parameters in S1, calculate the total loss of the transmission line in the high-frequency band. ; S3, total loss Real-time conversion to thermal power and heat power Input to the dynamic thermal resistance network calculation unit; S4, based on thermal resistance correction factor By combining the aforementioned dynamic thermal resistance network calculation unit, a lumped parameter thermal resistance network model is constructed to predict the thermal equilibrium junction temperature. ; S5 will bring the thermal equilibrium junction temperature to a minimum. With the material decomposition temperature The comparison outputs the material's thermal reliability status as Safe / Critical / Burnout.

2. The method for rapid verification of thermal reliability of high-frequency PCB materials based on multi-physics coupling according to claim 1, characterized in that, The high-frequency loss calculation unit calculates the total loss of the transmission line in the high-frequency band. The calculation formula is: ， in, For dielectric loss, For conductor loss, For unit conversion constants, For operating frequency, For conductor geometry constants, Conductor losses are proportional to the square root of the frequency.

3. The rapid verification method for the thermal reliability of high-frequency PCB materials based on multi-physics coupling according to claim 1, characterized in that, The total loss Converted into thermal power The calculation formula is: ， in, Where L is the input RF power, and L is the transmission line length. Represents the proportion of remaining power, 1- The proportion of power that is lost and converted into heat.

4. The rapid verification method for the thermal reliability of high-frequency PCB materials based on multi-physics coupling according to claim 1, characterized in that, The predicted junction temperature The calculation formula is: ， in, For ambient temperature, The effective thermal resistance of the material.

5. The rapid verification method for the thermal reliability of high-frequency PCB materials based on multi-physics coupling according to claim 4, characterized in that, The effective thermal resistance The calculation formula is: ≈ ， Among them, the The thermal conductivity of the material The effective heat dissipation area of ​​the material, The thickness is the dielectric layer thickness.

6. The rapid verification method for the thermal reliability of high-frequency PCB materials based on multi-physics coupling according to claim 1, characterized in that, In S5, the thermal reliability state of the material Includes the following states: When the thermal equilibrium junction temperature Material decomposition temperature - If so, it is determined to be Safe; When the thermal equilibrium junction temperature Material decomposition temperature If so, it is determined that the Burnout has been burned; When the material decomposition temperature - Thermal equilibrium junction temperature ≤ Material decomposition temperature If so, it is judged as high-risk (Critical). in, For safety margin.

7. The rapid verification method for the thermal reliability of high-frequency PCB materials based on multi-physics coupling according to claim 1, characterized in that, The surface roughness correction factor The roughness of copper foil is obtained dynamically based on the Hammerstad model and measured.

8. A rapid verification system for the thermal reliability of high-frequency PCB materials based on multi-physics coupling, characterized in that, include: The material parameter database module is used to store and manage the dielectric constants of high-frequency PCB materials. Dielectric loss angle tan(δ), thermal conductivity and decomposition temperature parameters ; The high-frequency loss calculation unit module is used to calculate the total loss of the transmission line in the high-frequency band based on the surface roughness correction factor and relevant parameters obtained from the material parameter database module. ; The dynamic thermal resistance network calculation unit module is used to receive the heat power after converting the total loss in real time. And combined with thermal resistance correction factor Construct a lumped-parameter thermal resistance network model; The thermal equilibrium junction temperature prediction module is used to predict the thermal equilibrium junction temperature based on the model built by the dynamic thermal resistance network calculation unit module. ; The material thermal reliability condition determination module is used to determine the thermal equilibrium junction temperature predicted by the thermal equilibrium junction temperature prediction module. With the material decomposition temperature The comparison outputs the material's thermal reliability status as Safe / Critical / Burnout.

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