Chip self-adaptive sweating heat dissipation structure

By employing a passive mechanical temperature control switch structure in high heat flux density electronic devices, and utilizing the difference in the thermal expansion coefficients of materials to drive the sweating switch to achieve rapid deformation and self-locking sealing, the problems of system complexity and slow response in existing technologies are solved, achieving zero-energy consumption and high-efficiency adaptive heat dissipation.

CN122180387APending Publication Date: 2026-06-09XI AN JIAOTONG UNIV +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
XI AN JIAOTONG UNIV
Filing Date
2026-03-13
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Existing adaptive sweating cooling technology suffers from problems such as system complexity, high energy consumption, slow response, and low integration in high heat flux density electronic devices, making it difficult to achieve rapid thermal response and efficient heat dissipation.

Method used

A passive mechanical temperature control switch structure is adopted, which utilizes the difference in thermal expansion coefficients of two layers of materials to generate thermal stress, driving the sweating switch structure to achieve rapid deformation at the micron scale. It is integrated on the chip surface or inside, and achieves self-locking sealing and phase change heat dissipation through surface tension.

Benefits of technology

It achieves zero-energy, fast-response adaptive heat dissipation, improves integration density and space utilization, simplifies manufacturing process, solves the complexity and failure risk of existing technologies, and has microsecond-level transient response capability.

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Abstract

This invention relates to the field of chip heat dissipation structure technology, and discloses a chip adaptive sweating heat dissipation structure, including a sweating switch structure integrated on or inside the heat-generating area of ​​the target chip. The sweating switch structure is a passive mechanical temperature control switch, including a first material layer and a second material layer stacked together with different coefficients of thermal expansion. When heated, the first and second material layers generate thermal stress due to the difference in their coefficients of thermal expansion, driving the sweating switch structure to undergo out-of-plane warping deformation. Sweat holes are formed on the target chip. When the sweating switch structure is in the first deformation state, it covers the sweat holes to seal the cooling medium. When the sweating switch structure reaches a predetermined temperature threshold and switches to the second deformation state, it undergoes out-of-plane warping deformation, opening the sweat holes to allow the cooling medium to seep out and perform phase change heat dissipation. This invention provides a chip adaptive sweating heat dissipation structure that is compatible with standard semiconductor processes, has zero energy consumption, and possesses rapid thermal response capabilities.
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