Wafer processing apparatus

Abstract

A processing apparatus according to an embodiment of the present application can include a frame, a polishing unit disposed on the frame and including a spindle motor, a polishing pad rotated by the spindle motor, and a polishing pad cover disposed on the polishing pad, a cover body having a processing hole through which the polishing pad passes and movably disposed in the frame, a first cover covering between the polishing pad cover and the processing hole and made of a flexible material, and a second cover covering between the cover body and the frame and made of a flexible material.

Description

Technical Field

[0001] This invention relates to a wafer processing apparatus. Background Technology

[0002] In wafer fabrication equipment, a cover that shields the inner elliptical opening of the processing section prevents the inflow of foreign matter and protects internal components by blocking the connection between the inside and outside of the equipment. This extends the lifespan of internal components, improves the working environment, and ensures operator safety. However, in fabrication equipment using a cylindrical cover to shield the inner opening of the processing section, the cover reciprocates horizontally and vertically. Prolonged use of the cover can lead to wear due to friction from the material itself, negatively impacting the lifespan of the fabrication equipment.

[0003] In traditional wafer processing equipment, the flatness of the flange face of the processing spindle and the elliptical opening of the lower processing chamber is deformed, resulting in the distortion of the outer skin of the cover, which leads to the disadvantages of cover wear and shortened life of the processing equipment. Summary of the Invention

[0004] The problem the invention aims to solve

[0005] The purpose of this invention is to provide a wafer processing apparatus that reduces friction of the outer material of the processing apparatus caused by driving the horizontal axis by using a processing apparatus cover driven by a horizontal axis and a vertical axis respectively.

[0006] The technical problems to be solved by the present invention are not limited to those mentioned above. Those skilled in the art can clearly understand other technical problems not mentioned from the following description.

[0007] means for solving problems

[0008] According to an embodiment of the present invention, a wafer processing apparatus may include: a frame; a grinding unit disposed on the frame and including a spindle motor, a grinding wheel rotated by the spindle motor, and a grinding wheel cover disposed on the grinding wheel; a cover having a processing hole through which the grinding wheel passes and movably disposed within the frame; a first cover covering the space between the grinding wheel cover and the processing hole and made of a flexible material; and a second cover covering the space between the cover and the frame and made of a flexible material.

[0009] According to one embodiment of the present invention, the first cover and the second cover may be separate structures.

[0010] According to one embodiment of the present invention, the second cover may have a structure that is capable of extending and retracting as the cover body moves within the frame in a first direction.

[0011] According to one embodiment of the present invention, the second cover may include: a second-1 cover disposed between one side of the cover body and one end of the frame; and a second-2 cover disposed between the other side of the cover body and the other end of the frame.

[0012] According to one embodiment of the present invention, guide rails for guiding the movement of the cover may be arranged on both sides of the frame, and the cover may further include a moving part, the moving part corresponding to the guide rail and including one or more rolling members.

[0013] According to one embodiment of the present invention, the rolling member may include: a first rolling member disposed on the outer side of the cover within the moving portion; and a second rolling member disposed on the inner side of the cover within the moving portion.

[0014] According to one embodiment of the present invention, at least one of the first cover and the second cover may have a multi-level folding structure.

[0015] According to one embodiment of the present invention, it may further include: a driving unit, which is connected to the grinding unit and provides power to move along a first direction and a second direction.

[0016] According to one embodiment of the present invention, the driving unit may include: a first servo motor that provides a driving force to the grinding unit along the first direction; and a second servo motor that provides a driving force to the grinding unit along the second direction.

[0017] According to an embodiment of the present invention, the driving unit may further include: a first movable body, which is coupled to the grinding unit and moves along the first direction under the driving force of the first servo motor; and a second movable body, which is coupled to the first movable body and moves along the second direction under the driving force of the second servo motor.

[0018] According to one embodiment of the present invention, it may further include: a connecting unit that connects the cover and the second movable body.

[0019] Other aspects, features, and advantages will become clear from the following drawings, claims, and detailed description of the invention.

[0020] Invention Effects

[0021] According to an embodiment of the present invention, a wafer processing apparatus is equipped with a first cover and a second cover that are respectively movable along a first direction and a second direction, thereby minimizing cover distortion during the movement of the polishing unit. Furthermore, by reducing the friction of the cover caused by the movement of the polishing unit, the wafer processing apparatus can extend its lifespan.

[0022] In addition, the wafer processing apparatus connects the cover and the polishing unit by means of a bonding unit, which can minimize the positional error of the polishing unit that may be caused by cover distortion and achieve a more precise polishing process.

[0023] The effects of this invention are not limited to those described herein, but should be understood to include all effects that can be inferred from the detailed description of the invention or the composition of the invention as set forth in the claims. Attached Figure Description

[0024] Figure 1 This is a perspective view of a processing apparatus according to an embodiment of the present invention.

[0025] Figure 2 yes Figure 1 A cross-sectional view of the processing equipment.

[0026] Figure 3 It is used for explanation Figure 1 The diagram shows the relationship between the second cover and the guide rail.

[0027] Figure 4 It is along Figure 1 A sectional view cut along the A-A' direction.

[0028] Figure 5 It is used for explanation Figure 1 The diagram of the combined unit.

[0029] Explanation of reference numerals in the attached figures

[0030] 100: Processing equipment

[0031] 110: Framework

[0032] 120: Grinding Unit

[0033] 130: Cover

[0034] 140: First Cover

[0035] 150: Second Cover

[0036] 160: Drive Unit

[0037] 170: Assembled Unit Detailed Implementation

[0038] The invention will be described below with reference to the accompanying drawings. However, the invention can be implemented in various different forms and is therefore not limited to the embodiments described herein. Furthermore, for the purpose of clearly illustrating the invention in the drawings, parts unrelated to the description have been omitted, and similar reference numerals have been used throughout the specification for similar portions.

[0039] While terms such as "first," "second," "A," and "B" can be used to describe multiple constituent elements, the constituent elements described above should not be limited to these terms. These terms are used only to distinguish one constituent element from others. For example, without departing from the scope of this invention, a first constituent element may be named a second constituent element, and similarly, a second constituent element may be named a first constituent element. The term "and / or" includes a combination of multiple related listed items or any one of multiple related listed items.

[0040] Throughout the specification, when one part is "connected (coupled, contacted, joined)" to another part, this includes not only "direct connection" but also "indirect connection" where another component is inserted between them. Furthermore, when a part "includes" a certain constituent element, this means that, unless otherwise stated, other constituent elements may be included, rather than excluded.

[0041] The terminology used in this specification is for illustrative purposes only and is not intended to limit the invention. Unless the context clearly specifies otherwise, singular expressions include plural expressions.

[0042] The terms "comprising" or "having" used in this specification are used to specify the presence of features, figures, steps, actions, constituent elements, components, or combinations thereof described in the specification, and do not preclude the presence or additional possibilities of more than one other feature, figure, step, action, constituent element, component, or combination thereof.

[0043] When a component or layer is described as being "on" or "above" another component or layer, it includes both cases where it is directly above another component or layer and cases where there are other layers or components in between. Conversely, when a component is described as being "directly on" or "directly above," it means that there are no other components or layers in between.

[0044] According to an embodiment of the present invention, the first direction of the wafer processing apparatus may be the z-axis direction, and the second direction may be the x-axis direction.

[0045] Figure 1 This is a perspective view of a processing apparatus according to an embodiment of the present invention. Figure 2 yes Figure 1 A cross-sectional view of the processing equipment. Figure 3 It is used for explanation Figure 1 The diagram shows the relationship between the second cover and the guide rail. Figure 4 It is along Figure 1 A sectional view cut along the A-A' direction.

[0046] The following is for reference Figures 1 to 4 The structure and drive of the processing apparatus 100 according to an embodiment of the present invention will be described in detail.

[0047] Reference Figure 1 and Figure 2 According to an embodiment of the present invention, a wafer processing apparatus 100 may include a frame 110, a polishing unit 120, a cover 130, a first cover 140, and a second cover 150. Furthermore, according to an embodiment of the present invention, the wafer processing apparatus 100 may also include a driving unit 160 and a bonding unit 170.

[0048] The frame 110 provides a basic framework for the installation, setup, fixation, and connection of the various components of the wafer processing apparatus 100. The frame 110 can be configured as a workspace for processing wafers, and the grinding unit 120, described later, can move within the frame 110 to perform operations.

[0049] The frame 110 can be made of various shapes to define the workspace, for example, it can be rectangular as shown in the figure.

[0050] A guide rail 111 for guiding the movement of the grinding unit 120 may be configured on the frame 110. The guide rail 111 may be configured on both sides of the frame 110 along the movement direction (x direction) of the grinding unit 120. Specifically, the cover 130, which moves together with the grinding unit 120, is slidably coupled to the guide rail 111, thereby guiding the movement of the cover 130 within the frame 110.

[0051] The grinding unit 120 is disposed on the frame 110 and may include a spindle motor 121, a grinding wheel (not shown) rotated by the spindle motor 121, and a grinding wheel cover 123 disposed on the grinding wheel (not shown).

[0052] The grinding unit 120 is movably located within the frame 110, thereby enabling the grinding of wafers.

[0053] The wafer can be formed from silicon (Si) or from semiconductor materials other than silicon, such as gallium nitride (GaN) or silicon carbide (SiC). However, the wafer of this invention is not limited to materials, shapes, structures, or sizes. A resin protective strip with the same diameter as the wafer can be attached to the surface of the wafer to reduce damage to the surface side.

[0054] The spindle motor 121 provides power to rotate the grinding wheel (not shown) around the rotating axis.

[0055] At this time, the rotation axis of the spindle motor 121 can be parallel to the first direction (z direction). Although not shown in the figure, the rotation speed and rotation direction of the spindle motor 121 can be controlled by the control unit (not shown).

[0056] The grinding unit 120 may also include a bracket 122 that encloses the spindle motor 121. The bracket 122 provides housing space for mounting the spindle motor 121 and protects the spindle motor 121.

[0057] The grinding wheel (not shown) can be detachably mounted on one end of the spindle motor 121. The grinding wheel (not shown) can process one side of the wafer by moving along a first direction (z direction) and a second direction (x direction).

[0058] The grinding wheel (not shown) can receive rotational force through the spindle motor 121 and perform grinding while rotating clockwise or counterclockwise in contact with the wafer.

[0059] The grinding wheel (not shown) has a hardness greater than that of the wafer, thus enabling it to process the wafer's surfaces. The grinding wheel (not shown) may include a grinding pad made of foamed polyurethane or non-woven fabric. However, it is not limited to these materials; it can be used freely as long as it incorporates materials for grinding wafers.

[0060] The grinding wheel cover 123 can cover the processing hole 1321 to prevent the grinding fluid from splashing onto the outside of the grinding wheel cover 124 during the grinding process using the grinding wheel 123, thereby avoiding contamination of the wafer processing apparatus 100 caused by splashed particles or grinding fluid during the grinding process.

[0061] The grinding wheel cover 123 is disposed on the grinding wheel (not shown) and is combined with the first cover 140 described later, thereby sealing the machining hole 1321 of the cover body 130.

[0062] The cover 130 has a machining hole 1321 through which a grinding wheel (not shown) passes and can be movably configured within the frame 110.

[0063] The cover 130 can be plate-shaped, including the machining hole 1321. In this case, the length of the cover 130 in one direction (y direction) can correspond to the width of the frame 110, and the length in the other direction (x direction) can be less than the length of the frame 110.

[0064] The cover 130 is movable within the frame 110 together with the grinding unit 120. The cover 130 is movable along guide rails 111 disposed on both sides of the frame 110. For this purpose, the cover 130 may include: a moving part 131, which includes one or more rolling members; and a main body 132, which has a machining hole 1321 at its center.

[0065] The movable part 131 may be located at the edge of the cover 130 and corresponding to the guide rail 111 of the frame 110, and includes a plurality of rolling members 1311.

[0066] The rolling member 1311 can be arranged along the second direction (x direction) of the moving part 131 so that the cover 130 can move smoothly within the guide rail 111.

[0067] The rolling component 1311 can be, for example, a ball bearing or a ball retainer, but is not limited thereto. Any component that can reduce friction with the guide rail 111 through rolling motion can be used without limitation.

[0068] At this time, the rolling member 1311 may include: a first rolling member 1311a, which is disposed on the outside of the inner cover 130 of the moving part 131; and a second rolling member 1311b, which is disposed on the inside of the inner cover 130 of the moving part 131.

[0069] One or more first rolling members 1311a may be disposed on the outer side of the moving part 131. The first rolling members 1311a can reduce the driving friction of the cover 130 that moves along the guide rail 111 in a sliding manner, so as to make it move smoothly.

[0070] One or more second rolling members 1311b may be disposed on the inner side of the moving part 131 that is connected to the main body 132. The second rolling members 1311b can maintain the overall balance of the cover 130 when the cover 130 moves along the guide rail 111, so as to prevent the cover 130 from twisting left and right and to make it move stably.

[0071] Friction may occur when the cover 130 moves, but this friction can be reduced by the rolling member 1311 to enable the cover 130 to move smoothly within the guide rail.

[0072] The main body 132 forms the skeleton of the cover 130, and specifically, it can be in the form of a plate including a machining hole 1321 at the center.

[0073] The machining hole 1321 can be a channel through which the grinding unit 120 passes.

[0074] The main body 132 can separate the grinding work space and, by combining with the grinding wheel cover 123 and the first cover 140, minimize the splashing of grinding fluid or particles to the outside of the wafer processing apparatus 100.

[0075] On the other hand, the wafer processing apparatus 100 is equipped with a first cover 140 and a second cover 150 to prevent foreign matter from flowing into the interior of the wafer processing apparatus 100. In this case, the first cover 140 and the second cover 150 can be separate structures. In addition, at least one of the first cover 140 and the second cover 150 can have a multi-level folded structure.

[0076] The first cover 140 covers the area between the grinding wheel cover 124 and the machining hole 1321 and may be made of a flexible material. For example, the first cover 140 may be made of polyethylene or vinyl.

[0077] The first cover 140 may be connected to the machining hole 1321 in a shape corresponding to the shape of the machining hole 1321, for example, it may be cylindrical. The first cover 140 may be a corrugated shape that can stretch along a first direction. For example, the first cover 140 may be a cylindrical corrugated tube made of a polyethylene-based material.

[0078] The first cover 140 can extend or retract according to the movement of the polishing unit 120. The polishing unit 120, for wafer polishing, can move in a direction perpendicular to the wafer (i.e., the first direction (z-direction)), and the first cover 140 can extend or retract in response to this movement of the polishing unit 120. For this purpose, the first cover 140 can be made of a flexible material and can adopt a multi-stage folded structure such as a bellows.

[0079] For example, when the grinding unit 120 moves along the first direction away from the frame 110, the corrugations of the first cover 140 expand, and the length of the first cover 140 increases accordingly. Conversely, when the grinding unit 120 moves along the first direction closer to the frame 110, the corrugations of the first cover 140 fold, and the length of the first cover 140 shortens accordingly.

[0080] The second cover 150 covers the space between the cover body 130 and the frame 110 and may be made of a flexible material.

[0081] For example, the second cover 150 may be made of polyethylene or vinyl.

[0082] The second cover 150 may have a structure that can extend and retract as the cover 130 moves within the frame 110 in a second direction (x direction).

[0083] The second cover 150 may have a shape corresponding to that of the frame 110 and may have a corrugated shape that is stretchable along a second direction (x direction). For example, the second cover 150 may be a planar corrugated tube made of a polyethylene-based material.

[0084] Reference Figure 3 The second cover 150 may include a second-1 cover 151 and a second-2 cover 152 that are retractable and disposed on both sides of the cover body 130. The second-1 cover 151 may be disposed between one side of the cover body 130 and one end of the frame 110, and the second-2 cover may be disposed between the other side of the cover body 130 and the other end of the frame 110.

[0085] The second cover 150 can extend and retract according to the movement of the cover 130 to cover the interior of the frame 110.

[0086] For example, when the cover 130 moves towards one end of the frame 110, the second-1 cover 151, disposed between the cover 130 and one end of the frame 110, can retract, while the second-2 cover 152 can extend. Conversely, when the cover 130 moves towards the other end of the frame 110, the second-2 cover 152, disposed between the cover 130 and the other end of the frame 110, can retract, while the second-1 cover 151 can extend. Thus, the second cover 150 can not only prevent the polishing fluid or particles generated during the polishing process from splashing to the outside, but also prevent foreign objects from entering the interior of the second cover 150.

[0087] The drive unit 160 can be connected to the grinding unit 120 to provide the grinding unit 120 with power to move along the first direction (z direction) and the second direction (x direction).

[0088] The drive unit 160 may include: a first servo motor 1611 that provides a driving force to the grinding unit 120 in a first direction (z direction); and a second servo motor 1621 that provides a driving force to the grinding unit 120 in a second direction (x direction).

[0089] In addition, the drive unit 160 may include: a first moving body 161 that moves along a first direction (z direction) under the driving force of a first servo motor 1611; and a second moving body 162 that is coupled to the first moving body 161 and moves along a second direction (x direction) under the driving force of a second servo motor 1621.

[0090] The first moving body 161 can move along the first drive rail 1612 in the first direction (z direction) under the driving force of the first servo motor 1611. The first moving body 161 can be connected to the grinding unit 120.

[0091] The first drive rail 1612 can be combined with the first moving body 161 to provide a path for the grinding unit 120 so that it can move stably.

[0092] The second moving body 162 can be connected to the first moving body 161 and receive power from the second servo motor 1621 to move in a direction along the second drive rail 1622. The second drive rail 1622 can be combined with the second moving body 162 to provide a path for the grinding unit 120 to move stably within the second moving body 162.

[0093] The drive unit 160 can give the grinding unit 120 the ability to move along a first direction (z direction) and a second direction (x direction) by means of a first moving body 161 and a second moving body 162 connected in sequence to the grinding unit 120.

[0094] The control unit (not shown) can receive data about the wafer grinding range and generate a control signal to move the grinding unit 120 along a first direction (z direction) or a second direction (x direction) based on the preset setting value corresponding to the above data.

[0095] On the other hand, in the wafer processing apparatus 100 according to an embodiment of the present invention, the cover 130 also moves along with the drive unit 160. At this time, the drive unit 160 and the cover 130 are connected only by a first cover 140 made of a flexible material. Therefore, when the moving speeds of the drive unit 160 and the cover 130 are different, the first cover 140 may twist. To prevent this phenomenon, the wafer processing apparatus 100 according to an embodiment of the present invention may further include a bonding unit 170, which bonds the cover 130 and the second moving body 162.

[0096] like Figure 5 As shown, the connecting unit 170 may include a first connecting rod 171, which connects one side of the cover 130 to one side of the second movable body 162. The cover 130 can be connected to the second movable body 162 of the drive unit 160 via the first connecting rod 171, thereby moving together with the second movable body 162. At this time, the first connecting rod 171 can be connected to the side of the second movable body 162 facing the cover 130. In addition, the connecting unit 170 may also include a second connecting rod 172, which is connected to the first connecting rod 171 and to another side of the second movable body 162 that is different from the first connecting rod 171. The connecting unit 170 can improve the connection force between the drive unit 160 and the cover 130 by using the second connecting rod 172 connected to the first connecting rod 171 in different directions.

[0097] With the above structure, the cover 130 of the wafer processing apparatus 100 according to an embodiment of the present invention can be moved in conjunction with the movement of the drive unit 160, thereby moving together. As a result, the wafer processing apparatus 100 can prevent the first cover 140 from twisting, thereby minimizing the reduction in equipment lifespan. Furthermore, the wafer processing apparatus 100 can minimize the polishing pad position error that may be caused by the twisting of the first cover 140, thereby enabling the execution of a more precise polishing process.

[0098] As previously described, the wafer processing apparatus 100 according to an embodiment of the present invention is equipped with a first cover 140 and a second cover 150 that are movable along a first direction (z-direction) and a second direction (x-direction), respectively, which can minimize cover distortion caused by cover flatness deformation when the polishing unit 120 moves. Furthermore, by reducing the friction of the cover caused by the movement of the polishing unit 120, the lifespan of the wafer processing apparatus 100 can be extended.

[0099] Therefore, even when the grinding unit 120 moves, the torsion of the cover can be minimized, thereby reducing the wear of the cover.

[0100] The above description of the present invention is merely illustrative, and those skilled in the art will understand that it can be readily modified into other specific forms without changing the technical concept or essential features of the invention. Therefore, it should be understood that the above embodiments are exemplary in all respects and not restrictive. For example, constituent elements described as a single type can be implemented in a distributed manner; similarly, constituent elements described as distributed can also be implemented in a combined manner.

[0101] The scope of this invention is indicated by the claims and should be interpreted to include all variations or modifications derived from the meaning, scope, and equivalent concepts of the claims.

Claims

1. A processing apparatus, characterized in that, include: frame; A grinding unit, which is disposed on the frame, includes a spindle motor, a grinding wheel rotated by the spindle motor, and a grinding wheel cover disposed on the grinding wheel; A cover having a machining hole through which the grinding wheel passes and is movably disposed within the frame; A first cover, which covers the space between the grinding wheel cover and the machining hole, and is made of a flexible material; and The second cover, which covers the space between the cover body and the frame, is made of a flexible material.

2. The processing apparatus according to claim 1, characterized in that, The first cover and the second cover are separate structures.

3. The processing apparatus according to claim 1, characterized in that, The second cover has a structure that allows it to expand and contract as the cover moves within the frame in a first direction.

4. The processing apparatus according to claim 3, characterized in that, The second cover includes: A second-1 cover, disposed between one side of the cover body and one end of the frame; and The second-2 cover is disposed between the other side of the cover and the other end of the frame.

5. The processing apparatus according to claim 1, characterized in that, Guide rails are provided on both sides of the frame to guide the movement of the cover. The cover also includes: The moving part corresponds to the guide rail and includes one or more rolling members.

6. The processing apparatus according to claim 5, characterized in that, The rolling component includes: A first rolling member, disposed within the moving portion on the outer side of the cover; and The second rolling member is disposed within the moving part on the inner side of the cover.

7. The processing apparatus according to claim 1, characterized in that, At least one of the first cover and the second cover has a multi-level folding structure.

8. The processing apparatus according to claim 1, characterized in that, The processing apparatus further includes: The drive unit is connected to the grinding unit and provides power to move along the first and second directions.

9. The processing apparatus according to claim 8, characterized in that, The drive unit includes: A first servo motor provides a driving force to the grinding unit along the first direction; and A second servo motor provides a driving force to the grinding unit along the second direction.

10. The processing apparatus according to claim 9, characterized in that, The drive unit also includes: A first moving body, which is coupled to the grinding unit and moves along the first direction under the driving force of the first servo motor; and The second moving body is combined with the first moving body and moves along the second direction under the driving force of the second servo motor.

11. The processing apparatus according to claim 10, characterized in that, The processing apparatus further includes: A connecting unit that connects the cover to the second movable body.

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