A local intelligent refrigeration system based on ferroelectric ceramic electric calorimetric effect

Abstract

The application relates to a local intelligent refrigeration system based on the electrocaloric effect of ferroelectric ceramics and belongs to the technical field of refrigeration equipment, wherein the system comprises a heat source end and a heat sink end; an electrocaloric element unit is arranged between the heat source end and the heat sink end and comprises arrayed ferroelectric ceramic sheets; the first end of each ferroelectric ceramic sheet is connected with the first end of a power supply through a target circuit, and the second end is connected with the second end of the power supply; the target circuit comprises a plurality of first switches; the first end of each first switch is connected with the first end of each ferroelectric ceramic sheet, and the second end is connected with the first end of the power supply; a temperature monitoring unit is used for monitoring the temperature of local points of the heat source end in real time; a first program control unit is connected with the target circuit and the temperature monitoring unit and is used for controlling the on-off of each first switch on the target circuit according to real-time temperature information. The application can realize targeted refrigeration of local heating points of the heat source end, so that the refrigeration is more intelligent.

Description

Technical Field

[0001] This invention relates to the field of refrigeration equipment technology, and in particular to a localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect. Background Technology

[0002] With the continuous improvement of the integration and power density of integrated circuits, the size of chips such as central processing units (CPUs) and graphics processing units (GPUs) has been greatly reduced, and the power consumption distribution is extremely uneven. The computing core area can generate an astonishing power density of over 500 W / cm², while other areas have relatively lower temperatures, resulting in severe uneven temperature distribution on the chip surface. In integrated circuits, approximately 55% of damage originates from thermal runaway, and for every 10°C increase in temperature, computing power decreases by 50%, eventually leading to burnout. Therefore, localized overheating of chips has become a key factor affecting system stability and lifespan. Traditional heat dissipation methods, such as air cooling and liquid cooling, mainly target the overall average temperature of the chip, but they suffer from drawbacks such as large size and slow response, making it difficult to meet the precise temperature control requirements of highly integrated chips. Active cooling technologies such as thermoelectric cooling have low cooling efficiency and high cost, and the heat generated by the input electrical energy exceeds the heat transfer energy. Therefore, there is an urgent need to develop a localized cooling system that is simple in structure, precisely controlled, stable in operation, and capable of efficient heat transfer.

[0003] Ferroelectric materials exhibit the electrocaloric effect, where dipoles flip under an applied electric field, altering the dipole entropy and lattice entropy, thus changing the material's temperature upon application and removal of the electric field. By controlling the electric field, ferroelectric materials can absorb and release heat at the low and high temperature ends of a heat storage device, enabling heat transfer and cooling. Electrocaloric coolers based on ferroelectric materials offer advantages such as high cooling efficiency, small size, light weight, low cost, and the absence of environmentally polluting refrigerants. However, most current electrocaloric coolers used in integrated circuit thermal management still employ a full-coverage cooling mode, significantly increasing energy waste from components that do not require cooling. Summary of the Invention

[0004] In view of this, it is necessary to provide a localized intelligent refrigeration system based on the ferroelectric ceramic electrocardiogram effect to solve the problem of energy waste caused by the existing electrocardiogram refrigerators still using a full-coverage mode for refrigeration.

[0005] To address the aforementioned problems, in a first aspect, the present invention provides a localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect, comprising:

[0006] Heat source end and heat sink end; An electric card element unit is disposed between the heat source end and the heat sink end, and includes ferroelectric ceramic sheets distributed in an array. The first end of each ferroelectric ceramic sheet is connected to the first end of the power supply through a target circuit, and the second end of each ferroelectric ceramic sheet is connected to the second end of the power supply. The target circuit includes a plurality of first switches, the first end of each first switch being connected to the first end of each of the ferroelectric ceramic sheets, and the second end of each first switch being connected to the first end of the power supply. The first program control unit is connected to the target circuit and is used to control the on / off state of each first switch on the target circuit.

[0007] In one possible implementation, the localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect also includes: A temperature monitoring unit is used to monitor the temperature at the heat source end; The first program control unit is also connected to the temperature monitoring unit and is used to control the on / off state of each first switch on the target circuit according to the temperature information monitored by the temperature monitoring unit.

[0008] In one possible implementation, the localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect also includes: The magnetic drive unit includes a magnetic traction component fixedly mounted on the card element unit and an electromagnet mounted on the heat sink end; wherein, the current circuit in the electromagnet includes a second switch; The second program control unit, connected to the magnetic drive unit, is used to control the second switch to periodically turn on and off, so that the electronic card element unit can move periodically between the heat source end and the heat sink end.

[0009] In one possible implementation, the temperature monitoring unit monitors the temperature information including the temperature at multiple points on the surface of the heat source, and a third switch is included in the connection circuit between the electrical card element unit and the power supply. The first program control unit is used to determine the target ferroelectric ceramic sheet corresponding to the location of any point when the temperature at any point is greater than a first temperature threshold, and control the target first switch connected to the target ferroelectric ceramic sheet to close, until the temperature at any point is less than a second temperature threshold, and control the target first switch to open; wherein, the first temperature threshold is greater than the second temperature threshold; The second program control unit is used to control the third switch to periodically turn on and off, so that the electric card element unit absorbs heat when in contact with the heat source end based on the electric card effect, and releases heat when in contact with the heat sink end.

[0010] In one possible implementation, the second program control unit is used to control the closing cycle of the second switch to be delayed by a preset time compared to the closing cycle of the third switch.

[0011] In one possible implementation, the preset time is less than half the movement cycle of the card element unit between the heat source end and the heat sink end.

[0012] In one possible implementation, it further includes: a bracket and a plurality of elastic reset structures, wherein a first end of the plurality of elastic reset structures is connected to the bracket, and a second end of the plurality of elastic reset structures is connected to the card element unit.

[0013] In one possible implementation, the bracket is used to fix the heat source end and the heat sink end at a distance.

[0014] In one possible implementation, the localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect also includes: A terminal device, connected to the temperature monitoring unit, is used to visually display the temperature information monitored by the temperature monitoring unit.

[0015] In one possible implementation, the heat source is a chip.

[0016] The beneficial effects of this invention are: This invention involves arranging ferroelectric ceramic sheets in an array between a heat source and a heat sink. Each ferroelectric ceramic sheet has its first end connected to a first terminal of a power supply via a first switch, and its second end connected to a second terminal of the power supply. A first program control unit can independently control the operating electric field of each ferroelectric ceramic sheet by controlling each first switch, thereby independently controlling the heat absorption at the heat source and heat release at the heat sink. This invention enables targeted cooling of localized heating points at the heat source, making cooling more intelligent, and also saves energy and reduces costs. Furthermore, dividing the brittle ferroelectric ceramics into a small, dispersed array improves system stability, increases system integration, and reduces system size. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1A schematic diagram of an embodiment of the localized intelligent refrigeration system based on the ferroelectric ceramic electrocardiogram effect provided by the present invention; Figure 2 This is a schematic diagram of the electrode structure and lead connection of the electronic card element unit provided by the present invention; Figure 3 The cooling effect diagram of the electrical card element unit at room temperature under different electric fields provided by the present invention; Figure 4 The electric card element unit provided by this invention operates in an electric field of 80 kV cm. -1 Summary chart of operational stability tests below; Figure 5 Temperature variation curves at three operating points of the system provided by this invention; Among them, 1 is the heat source end; 2 is the heat sink end; 3 is the electrical card component unit; 4 is the target circuit; 4-1 is the first switch; 5 is the power supply; 6 is the first program control unit; 7 is the temperature monitoring unit; 7-1 is the temperature sensor; 8 is the magnetic drive unit; 8-1 is the magnetic traction component; 8-2 is the electromagnet; 8-3 is the second switch; 9 is the second program control unit; 10 is the third switch; 11 is the bracket; 12 is the elastic reset structure; 13 is the gold electrode; 14 is the ultra-fine silver wire; and 15 is the insulating tape. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0020] In the description of the embodiments of this invention, unless otherwise stated, "a plurality of" means two or more. The terms "first," "second," etc., used in the embodiments of this invention are used to distinguish similar objects, and are not used to describe a specific order or sequence, nor to indicate or imply their relative importance or implicitly specify the number of indicated technical features. It should be understood that such data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class, and the number of objects is not limited; for example, a first object can be one or more.

[0021] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0022] Reference Figure 1 This diagram illustrates a structural schematic of an embodiment of the localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect provided by the present invention. The system includes: Heat source end 1 and heat sink end 2; The card element unit 3 includes ferroelectric ceramic sheets 3-1 arranged in an array between the heat source end and the heat sink end. The first end of each ferroelectric ceramic sheet 3-1 is connected to the first end of the power supply 5 through the target circuit 4, and the second end of each ferroelectric ceramic sheet 3-1 is connected to the second end of the power supply 5. The target circuit 4 includes multiple first switches 4-1, the first end of each first switch 4-1 is connected to the first end of each ferroelectric ceramic sheet 3-1, and the second end of each first switch 4-1 is connected to the first end of the power supply 5. The first program control unit 6 is connected to the target circuit 4 and is used to control the on / off state of each first switch 4-1 on the target circuit 4.

[0023] Specifically, heat source 1 can be an electronic component that generates heat during operation, such as a chip. Heat sink 2 can be a heat dissipation medium, such as a metal heat sink with aluminum fins, a heat spreader, or a graphene / high thermal conductivity composite material. In this embodiment, the selection of heat sink 2 is not specifically limited.

[0024] The electronic card element unit 3 may include multiple ferroelectric ceramic sheets 3-1, which are arranged in an array to form an electronic card cooling array type thin sheet. Figure 1 The example shows an electric card element unit 3, which includes nine ferroelectric ceramic plates 3-1 arranged in an array.

[0025] The ferroelectric ceramic sheet can be lead-based ceramic, lead-free ceramic, polymer ceramic composite, etc. This embodiment does not impose specific restrictions on the preparation materials and preparation methods of the ferroelectric ceramic sheet.

[0026] When heat dissipation is required at the heat source end 1, the target ferroelectric ceramic sheet at the corresponding position can be controlled to absorb heat from the heat source and then release heat to the heat sink end, thus completing the heat transfer. The heat absorption and release of the target ferroelectric ceramic sheet can be controlled by switching the target first switch connected to the target ceramic sheet on and off.

[0027] In summary, this invention enables targeted cooling of localized heating points at the heat source, making cooling more intelligent, and also saves energy and reduces costs. Furthermore, dividing the brittle ferroelectric ceramics into small, dispersed ferroelectric ceramic arrays improves system stability and increases system integration while reducing system size.

[0028] In some embodiments of the present invention, the localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect further includes: Temperature monitoring unit 7 is used to monitor the temperature at the heat source end; The first program control unit 6 is also connected to the temperature monitoring unit 7, and is used to control the on / off state of each first switch 4-1 on the target circuit 4 according to the temperature information monitored by the temperature monitoring unit 7.

[0029] The temperature monitoring unit 7 may include multiple temperature sensors 7-1, such as multiple multi-channel K-type thin-film thermocouples. The temperature sensors 7-1 can be disposed on the surface of the heat source end, for example, by attaching the temperature sensors to different points on the surface of the heat source end using 30 μm thick polyimide insulating tape. The temperature monitoring unit 7 is used for real-time temperature detection of the surface of the heat source end.

[0030] The first program control unit 6 can use Python to design a CNN algorithm to judge temperature information, accurately locate the heat point, and perform targeted cooling on the heat point.

[0031] In summary, this embodiment can improve the intelligence of the system.

[0032] In some embodiments of the present invention, the localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect further includes: The magnetic drive unit 8 includes a magnetic traction member 8-1 fixedly mounted on the card element unit 3 and an electromagnet 8-2 mounted on the heat sink end; wherein, the current circuit in the electromagnet 8-2 includes a second switch 8-3. The second program control unit 9 is connected to the magnetic drive unit 8 and is used to control the second switch 8-3 to periodically switch on and off so that the card element unit 3 can periodically move between the heat source end and the heat sink end.

[0033] Ferroelectric ceramic plates can be used for heat transfer in two ways: active and static. Active heat transfer involves mechanically moving the ceramic plate to alternately contact the heat source and heat sink, ensuring the plate is in the correct heat absorption / release state at the moment of contact. Static heat transfer involves keeping the ceramic plate stationary while maintaining permanent thermal contact with both the heat source and heat sink; however, the heat flow path is controlled through material properties or additional mechanisms.

[0034] In this embodiment, an active heat transfer method is adopted. More specifically, a magnetic drive method is used to control the periodic movement of the card element unit 3 between the heat source end 1 and the heat sink end 2.

[0035] The second program control unit 9 can achieve periodic control of the on / off state of the second switch 8-3 through simple programming instructions. By controlling the on / off state of the second switch 8-3, the electromagnet 8-2 can be controlled to exert a force or not exert a force on the magnetic traction component 8-1. The force can include attractive or repulsive forces, thereby controlling the movement of the card element unit 3 between the heat source end and the heat sink end. The type of force generated by the electromagnet 8-2 can be selected and determined based on factors such as the vertical position of the heat source end relative to the heat sink end.

[0036] Furthermore, by controlling the on / off state of the second switch 8-3, the card element unit 3 can be made to adhere tightly to the heat source end 1 when in contact with the heat source end 1, thereby reducing heat dissipation caused by poor contact.

[0037] In summary, a small commercial electromagnet can be driven with only 12V low voltage and milliamp-level low current. This embodiment uses a magnetic drive method, which is safer and more stable.

[0038] In some embodiments of the present invention, the temperature information monitored by the temperature monitoring unit 7 includes the temperature of multiple points on the surface of the heat source end, and a third switch 10 is included in the connection circuit between the card element unit 3 and the power supply 5. The first program control unit 6 is used to determine the target ferroelectric ceramic sheet corresponding to any point when the temperature at any point is greater than the first temperature threshold, and control the target first switch connected to the target ferroelectric ceramic sheet to close until the temperature at any point is less than the second temperature threshold, and control the target first switch to open; wherein, the first temperature threshold is greater than the second temperature threshold. The second program control unit 9 is used to control the third switch 10 to periodically switch on and off, so that the electric card element unit 3 absorbs heat when in contact with the heat source end 1 and releases heat when in contact with the heat sink end 2 based on the electric card effect.

[0039] For example, the first program control unit 6 judges the temperature. If any temperature is higher than 70 ℃, it identifies the horizontal and vertical coordinates of the location and outputs the corresponding first switch closing command for that location. If the temperature at that location is lower than 30 ℃, it outputs the first switch opening command for that location.

[0040] In this embodiment, the control of the working electric field of the ferroelectric ceramic sheet is jointly determined by the first switch and the third switch. When the first switch is closed, the working electric field of the ferroelectric ceramic sheet is determined by the third switch. When the third switch is closed, the working electric field is applied; when the second switch is open, the working electric field is removed. Therefore, in this embodiment, the second program control unit 9 controls the third switch 10 to periodically switch on and off, thereby controlling the periodicity of the application of the working electric field.

[0041] In some embodiments of the present invention The second program control unit 9 is used to control the closing cycle of the second switch 8-3 to be delayed by a preset time for the closing cycle of the third switch.

[0042] This embodiment avoids the loss of electrical card effect in the electrical card element unit 3 during the displacement process by introducing a delay.

[0043] In some embodiments of the present invention, the preset delay time is less than half of the movement cycle of the card element unit between the heat source end and the heat sink end.

[0044] In some embodiments of the present invention, the localized intelligent refrigeration system based on the ferroelectric ceramic electrocard effect further includes: a bracket 11 and a plurality of elastic reset structures 12, wherein the first end of the plurality of elastic reset structures 12 is connected to the bracket 11, and the second end of the plurality of elastic reset structures 12 is connected to the electrocard element unit 3.

[0045] The elastic reset structure 12 is used to provide a restoring force when the magnetic drive unit 8 is released, so that the card element unit 3 returns to its initial position.

[0046] In some embodiments of the present invention, the bracket 11 is also used to fix the heat source end 1 and the heat sink end 2 at intervals.

[0047] In some embodiments of the present invention, the localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect further includes: The terminal device is connected to the temperature monitoring unit 7 and is used to visually display the temperature information monitored by the temperature monitoring unit 7.

[0048] Reference Figure 2 This diagram illustrates the electrode structure and lead connection of an electronic card element unit provided by the present invention. In one example, the fabrication process of the electronic card element unit 3 includes: firstly, fabricating a unit of size 10... 10 mm 2 A ferroelectric ceramic sheet 3-1 with a thickness of 100 μm was prepared on both sides of the ceramic sheet by ion sputtering using a mask, with 8 facing images on each side. 8 mm 2The square gold electrode 13 and the card element unit 3 are card-cooling array type thin sheets composed of nine card ceramic sheets 3-1 arranged in a specific array. The card ceramic sheets 3-1 are connected to the external circuit through 50 μm ultrafine silver wires 14. The upper and lower surfaces are covered with 30 μm polyimide insulating tape 15, and the two ends contain a size of 10. 35 0.3 mm 3 The silicon steel sheet 8-1 (magnetic traction component) and multiple electric card ceramic sheets 3-1 wrapped with insulating tape 15 are integrated into an electric card element unit 3.

[0049] In some embodiments of the present invention, reference continues to be made to... Figure 2 The construction process of the localized intelligent cooling system based on the ferroelectric ceramic electrocaloric effect includes: the support frame 8 is constructed from cut acrylic glass, and aluminum fins (40) are placed below the support frame 8. 40 mm 2 As heat sink 2, 40 is selected above. 40 0.05 mm 3 A thick ceramic heating element 7-1 serves as the simulated heat source, with a support 8 used in the middle to maintain an appropriate distance between the heat source and the heat sink. The electric card element unit 3 is fixed to the aluminum fins by a rubber band (elastic reset structure 12). To obtain a greater magnetic traction force, a 10-inch wire is added to each side of the ferroelectric ceramic-based electric card cooling element. 35 0.3 mm 3 The silicon steel sheet 8-1, under the attraction of the commercial electromagnet 8-2, makes the electric card element unit tightly attached to the simulated heat source above, reducing heat dissipation caused by poor contact. By controlling the electromagnet power supply and the electric field at both ends of the electric card element unit through switches 3-2 and 3-3 respectively, the electric card element unit can periodically alternately contact the hot end and the cold end under magnetic drive, while absorbing and releasing heat respectively, and finally realizing heat transfer.

[0050] Test content: The cooling performance of the magnetically driven electronic card element unit was tested. First, a voltage of 20 kV cm was applied to both ends of a single electronic card ceramic plate. -1 Gradually increase to 80 kV cm -1 The electric field, the results are shown in the appendix. Figure 3 As the electric field gradually increases, the cooling capacity of the electronic card element unit gradually increases at room temperature, reaching a maximum of 1.5 °C. When the electric field exceeds 80 kV cm⁻¹, arcing occurs at high fields due to the small air gap between the insulating film and the ceramic sheet. Further testing of the operational stability of the electronic card element unit yielded the following results: Figure 4As shown, the temperature change of the electric card cooler remained stable during a single cycle while working continuously for ten minutes.

[0051] Continuing from the previous embodiment, the temperature monitoring unit 7 monitors the temperature of all points on the chip in real time. The multi-channel temperature monitoring module inputs the temperature information of each point into the first program control unit 6, which receives the signal from the temperature sensing module and is configured to independently control the ferroelectric ceramic sheet at the corresponding position in the card cooling array to start cooling when the temperature of any local heat source exceeds 70 ℃. Combined with the efficient and stable magnetically driven card cooling device, point-to-point local intelligent cooling of the chip is realized. When the temperature is below 30 ℃, the program control module disconnects the circuit unit at that point.

[0052] Test content: The cooling effect of the card cooling unit at different locations on the chip was tested, and the results are shown in Figure 5. The temperature changes of the card cooling units at three locations were tested simultaneously under different temperature environments. The attached figure shows that at room temperature, all three card cooling units could perform cooling operations synchronously and stably.

[0053] In summary, this invention selects ferroelectric ceramics as the core of the electronic card element unit. Multiple small-volume array-type electronic card element units, distributed at different local points on the chip, are cleverly designed within a single plane. A stable mode using small, low-power electromagnetic drive is employed, combined with intelligent temperature monitoring and program control units, to build a localized intelligent cooling system based on the ferroelectric ceramic electronic card effect. By designing the circuit of the array-type ferroelectric ceramic sheet and connecting both ends to an external electric field, and coordinating with electromagnet attraction and release, the ferroelectric ceramic sheet can enter a heat absorption mode when in contact with a heat source and a heat release mode when in contact with a heat sink, ultimately achieving heat transfer and cooling of the chip. When the temperature module at a local point on the chip detects that the temperature at a certain point exceeds the normal operating range, the program automatically activates the electronic card element unit at that point to start the electronic card cooling mode. When the temperature at that point drops to a good operating temperature range, the program automatically disconnects the cooling mode.

[0054] In summary, the present invention has the following beneficial effects: 1. Improved operational stability. Ferroelectric ceramics with high electrocaloric effect under low electric field are selected as the core of the electrocaloric cooler. A low-power commercial electromagnetic drive mode is selected to drive the device. The brittle ferroelectric ceramics are divided into small-volume, dispersed ferroelectric ceramic arrays, which greatly improves the operational stability of the device.

[0055] 2. Improved operational durability. A low voltage of 12V and a low current of milliamps are sufficient to drive small commercial electromagnets. The ferroelectric ceramic terminals also require only a low electric field to drive the electrocardiogram effect. With the right circuit module, the device has high operational durability and is less prone to sudden events such as breakdown, damage, or short circuit.

[0056] 3. Breakthrough from Device to Cooling System Application. Current research largely focuses on electronic card cooling devices, neglecting their practical application in integrated circuit thermal management. This invention, through the design and coordination of multiple modules, applies a stable and effective electromagnetically driven electronic card cooler to chip cooling, enabling laboratory-prepared electronic card materials to become cooling devices, ultimately achieving practical application.

[0057] 4. Enhanced System Intelligence. Unlike simple device and circuit designs, this invention integrates a program module that uses real-time monitoring results of the chip's local temperature as a signal input to a Python algorithm. The algorithm then determines whether to activate or deactivate the cooling module, thus improving the intelligence of the cooling system.

[0058] 5. Improved system integration. In other inventions and research, electrocaloric coolers based on ferroelectric ceramics mainly include fluid pumping mode or large-scale cascaded drive mode, while the device structure of this invention greatly reduces the size of the cooler, and the array design also improves the system integration.

[0059] 6. Improved system efficiency. In contrast to other research and inventions that employ a full-coverage approach for global chip cooling, this invention utilizes localized design and intelligent circuit control to precisely cool the chip's hot spots. This reduces energy consumption in areas of the chip that do not require cooling, significantly decreasing the energy used for chip thermal management in integrated circuits and improving the overall system efficiency.

[0060] Those skilled in the art will understand that all or part of the processes of the methods described in the above embodiments can be implemented by a computer program instructing related hardware, and the program can be stored in a computer-readable storage medium. The computer-readable storage medium may be a disk, optical disk, read-only memory, or random access memory, etc.

[0061] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect, characterized in that, include: Heat source end and heat sink end; An electric card element unit is disposed between the heat source end and the heat sink end, and includes ferroelectric ceramic sheets distributed in an array. The first end of each ferroelectric ceramic sheet is connected to the first end of the power supply through a target circuit, and the second end of each ferroelectric ceramic sheet is connected to the second end of the power supply. The target circuit includes a plurality of first switches, the first end of each first switch being connected to the first end of each of the ferroelectric ceramic sheets, and the second end of each first switch being connected to the first end of the power supply. The first program control unit is connected to the target circuit and is used to control the on / off state of each first switch on the target circuit.

2. The localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect according to claim 1, characterized in that, Also includes: A temperature monitoring unit is used to monitor the temperature at the heat source end; The first program control unit is also connected to the temperature monitoring unit and is used to control the on / off state of each first switch on the target circuit according to the temperature information monitored by the temperature monitoring unit.

3. The localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect according to claim 2, characterized in that, Also includes: The magnetic drive unit includes a magnetic traction component fixedly mounted on the card element unit and an electromagnet mounted on the heat sink end; wherein, the current circuit in the electromagnet includes a second switch; The second program control unit, connected to the magnetic drive unit, is used to control the second switch to periodically turn on and off, so that the electronic card element unit can move periodically between the heat source end and the heat sink end.

4. The localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect according to claim 3, characterized in that, The temperature monitoring unit monitors the temperature information including the temperature at multiple points on the surface of the heat source end, and a third switch is included in the connection circuit between the electrical card element unit and the power supply. The first program control unit is used to determine the target ferroelectric ceramic sheet corresponding to the location of any point when the temperature at any point is greater than a first temperature threshold, and control the target first switch connected to the target ferroelectric ceramic sheet to close, until the temperature at any point is less than a second temperature threshold, and control the target first switch to open; wherein, the first temperature threshold is greater than the second temperature threshold; The second program control unit is used to control the third switch to periodically turn on and off, so that the electric card element unit absorbs heat when in contact with the heat source end based on the electric card effect, and releases heat when in contact with the heat sink end.

5. The localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect according to claim 4, characterized in that, The second program control unit is used to control the closing cycle of the second switch to be delayed by a preset time compared to the closing cycle of the third switch.

6. The localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect according to claim 5, characterized in that, The preset time is less than half of the movement cycle of the card element unit between the heat source end and the heat sink end.

7. The localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect according to claim 1, characterized in that, Also includes: The bracket is connected to multiple elastic reset structures, with the first end of each elastic reset structure connected to the bracket and the second end of each elastic reset structure connected to the card element unit.

8. The localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect according to claim 7, characterized in that, The bracket is used to fix the heat source end and the heat sink end at intervals.

9. The localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect according to claim 1, characterized in that, Also includes: A terminal device, connected to the temperature monitoring unit, is used to visually display the temperature information monitored by the temperature monitoring unit.

10. The localized intelligent refrigeration system based on the ferroelectric ceramic electrocaloric effect according to claim 1, characterized in that, The heat source is a chip.

Images