A composite cavity structure heat spreader

Abstract

The application provides a composite cavity structure heat spreader, relates to the field of heat spreaders, and comprises a heat spreader upper cover plate, a heat spreader lower cover plate, a heat dissipation mounting hole, a heat spreader main cavity, a heat spreader auxiliary cavity, a support protection mechanism and a connection combination mechanism; the heat spreader lower cover plate is welded below the heat spreader upper cover plate; the heat dissipation mounting hole is arranged at the front end of the heat spreader upper cover plate and the heat spreader lower cover plate; the heat spreader main cavity is fixedly connected to the inner side of the heat spreader upper cover plate and the heat spreader lower cover plate; two groups of heat spreader auxiliary cavities are arranged, and the two groups of heat spreader auxiliary cavities are fixedly connected to the left side and the right side of the heat spreader main cavity respectively; the support protection mechanism is arranged on the inner side of the heat spreader upper cover plate and the heat spreader lower cover plate; and the connection combination mechanism is arranged on the outer side of the heat spreader upper cover plate and the heat spreader lower cover plate, so that the universality and practicality of the heat spreader are greatly improved, the problem that the existing heat spreader needs to be customized in special sizes for different equipment is solved, and the problems of mold opening, processing and production cycle cost are reduced.

Description

Technical Field

[0001] This invention relates to the field of temperature distribution plate technology, and in particular to a temperature distribution plate with a composite cavity structure. Background Technology

[0002] A vapor chamber is a high-efficiency vacuum phase change heat transfer element. It consists of upper and lower cover plates and a sealed cavity structure to form a closed vacuum cavity. The interior is equipped with capillary structures and support components and filled with a phase change working fluid. It relies on the cyclic phase change process of the working fluid evaporating when heated and condensing when cooled, and with the help of the capillary structure, it can achieve rapid reflux of the working fluid. It can quickly and evenly transfer localized concentrated heat to the entire plate surface. It has the characteristics of high thermal conductivity, good temperature uniformity and compact structure, and is widely used in high-efficiency heat dissipation in electronic equipment, new energy products and other scenarios.

[0003] A vapor chamber, disclosed in CN114719643A, is used to contain a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The first cover has a thermal contact surface. The second cover is joined to the first cover and together forms an airtight space. The airtight space contains the cooling fluid. The thermal contact surface faces away from the airtight space. The first capillary structure is located within the airtight space. The first capillary structure includes a base, a plurality of first protrusions, and a plurality of second protrusions. These first protrusions and second protrusions protrude from the same side of the base, and the second protrusions are located around the first protrusions. The second capillary structure is located within the airtight space and is stacked on top of the first protrusions. The spacing between the first protrusions is smaller than the spacing between the second protrusions, forming an evaporation chamber and a condensation chamber on opposite sides of the second capillary structure, respectively.

[0004] However, most existing heat spreaders are single-size structures. In practical applications, it is often necessary to customize heat spreaders of special sizes for different equipment. This not only increases the cost of mold opening, processing and production cycle, but also significantly increases the investment in the overall heat dissipation solution of the equipment. The products have poor versatility and are not conducive to large-scale production and flexible adaptation to diverse heat dissipation scenarios. Summary of the Invention

[0005] In view of this, the present invention provides a vapor chamber plate with a composite cavity structure, which allows for flexible selection of connection methods according to actual usage scenarios. Utilizing magnetic attraction with mating magnetic blocks, it can meet the needs of temporary expansion and frequent disassembly, enabling rapid assembly and disassembly and flexible expansion of the vapor chamber plate. By fixing the expansion splicing plate with bolts through the mating holes, it can meet the connection requirements for long-term stable use, ensuring a robust and reliable structure after splicing. This improves the convenience and flexibility of vapor chamber plate expansion and assembly, while ensuring connection stability under long-term use. It effectively adapts to different heat dissipation expansion scenarios, significantly improving the versatility and practicality of the vapor chamber plate. It can significantly improve the overall thermal conductivity and heat dissipation uniformity of the vapor chamber plate, accelerate the circulation and reflux speed of the phase change working fluid, and prevent liquid accumulation and condensation from affecting the heat dissipation effect. Simultaneously, it effectively enhances the structural strength and compressive strength of the cavity and cover plate, preventing deformation and damage under pressure, and ensuring long-term stability. Furthermore, it significantly improves the ease of assembly of the vapor chamber plate, making the installation more secure and less prone to displacement. Overall, it achieves multiple optimizations in heat dissipation performance, structural reliability, and installation practicality.

[0006] This invention provides a temperature equalization plate with a composite cavity structure, specifically including a temperature equalization upper cover plate, a temperature equalization lower cover plate, heat dissipation mounting holes, a temperature equalization main cavity, a temperature equalization auxiliary cavity, a support and protection mechanism, and a connecting assembly mechanism; the temperature equalization lower cover plate is welded to the bottom of the temperature equalization upper cover plate; the heat dissipation mounting holes are formed at the front ends of the temperature equalization upper cover plate and the temperature equalization lower cover plate; the temperature equalization main cavity is fixedly connected to the inner side of the temperature equalization upper cover plate and the temperature equalization lower cover plate; two sets of temperature equalization auxiliary cavities are provided, and the two sets of temperature equalization auxiliary cavities are respectively fixedly connected to the left and right sides of the temperature equalization main cavity, and the two sets of temperature equalization auxiliary cavities are respectively connected to the temperature equalization main cavity; the support and protection mechanism is disposed on the inner side of the temperature equalization upper cover plate and the temperature equalization lower cover plate; the connecting assembly mechanism is disposed on the outer side of the temperature equalization upper cover plate and the temperature equalization lower cover plate.

[0007] Furthermore, the support and protection mechanism includes: a first capillary structure and a second capillary structure; the first capillary structure is disposed on the inner side of the temperature equalization main cavity, and the first capillary structure is a capillary structure sintered from copper powder; the second capillary structure is provided in two sets, and the two sets of second capillary structures are respectively disposed on the inner side of the temperature equalization auxiliary cavity, and both sets of second capillary structures are copper mesh structures.

[0008] Furthermore, the support and protection mechanism also includes: reinforcing support columns; multiple sets of reinforcing support columns are provided, and the multiple sets of reinforcing support columns are fixedly connected to the inner side of the temperature equalization auxiliary cavity, and the upper and lower ends of the multiple sets of reinforcing support columns are in contact with the temperature equalization upper cover plate and the temperature equalization lower cover plate, respectively.

[0009] Furthermore, the support and protection mechanism also includes: a flow guiding channel; the flow guiding channel is provided in multiple sets, and the multiple sets of flow guiding channels are respectively opened at the connection between the temperature equalization main cavity and the temperature equalization auxiliary cavity. The inner front and rear ends of the multiple sets of flow guiding channels are provided with protruding structures, and the protruding structures inside the multiple sets of flow guiding channels make the inside of the flow guiding channels form a Venturi tube shape.

[0010] Furthermore, the support and protection mechanism also includes: anti-liquid accumulation protrusions and holding grooves; multiple sets of anti-liquid accumulation protrusions are provided, and the multiple sets of anti-liquid accumulation protrusions are respectively welded to the inner corner of the temperature equalization main cavity, and the multiple sets of anti-liquid accumulation protrusions are all semi-cylindrical protrusion structures; two sets of holding grooves are provided, and the two sets of holding grooves are respectively opened on the left and right sides of the temperature equalization upper cover plate and the temperature equalization lower cover plate.

[0011] Furthermore, the support and protection mechanism also includes: anti-pressure support components; there are two sets of anti-pressure support components, which are respectively fixedly connected to the outside of the temperature equalization upper cover plate and the temperature equalization lower cover plate, and both sets of anti-pressure support components are rectangular frame structures.

[0012] Furthermore, the support and protection mechanism also includes anti-slip textures; there are two sets of anti-slip textures, one set of which is located below the uniform temperature lower cover plate and the other set of which is located above the uniform temperature upper cover plate.

[0013] Furthermore, the support and protection mechanism also includes: anti-condensation protrusions; multiple sets of anti-condensation protrusions are provided, and each set of anti-condensation protrusions is a hemispherical protrusion structure, and the multiple sets of anti-condensation protrusions are respectively fixedly connected to the lower inner side of the temperature equalization upper cover plate.

[0014] Furthermore, the connection assembly mechanism includes: an expansion splicing plate and docking holes; two sets of expansion splicing plates are provided, one set of expansion splicing plates is fixedly connected to the left side of the temperature equalization upper cover plate, and the other set of expansion splicing plates is fixedly connected to the right side of the temperature equalization lower cover plate, with the two sets of expansion splicing plates corresponding to each other; four sets of docking holes are provided, with the four sets of docking holes respectively opened at the front and rear ends of the inner side of the expansion splicing plate.

[0015] Furthermore, the connection assembly mechanism also includes: docking magnetic blocks; two sets of docking magnetic blocks are provided, one set of docking magnetic blocks is fixedly connected to the lower part of the left set of expansion splicing plates, and the other set of docking magnetic blocks is fixedly connected to the lower part of the right set of expansion splicing plates, and the two sets of docking magnetic blocks are magnetically connected. Beneficial effects

[0016] This invention utilizes a support and protection mechanism. The first capillary structure, made of sintered copper powder, is located inside the main homogenizing cavity. This provides sufficient capillary suction for the phase-change working fluid, accelerating the reflux of the condensed working fluid and improving the thermal conductivity of the main homogenizing cavity. The second capillary structure, made of copper mesh, is located inside the auxiliary homogenizing cavity. This structure adapts to the structural characteristics of the auxiliary cavity to achieve working fluid circulation and works with the main cavity to achieve uniform heat dissipation. Reinforcing support columns are located inside the auxiliary homogenizing cavity, with their upper and lower ends abutting against the upper and lower homogenizing cover plates. It effectively enhances the structural strength of the cavity, preventing the cover plate from deforming under pressure. The flow guide channel is located at the connection between the main and auxiliary temperature homogenizing cavities and is shaped like a Venturi tube, which reduces the flow resistance of the working fluid, increases the flow velocity, and enhances the heat transfer efficiency between the main and auxiliary cavities. The anti-liquid accumulation protrusion is a semi-cylindrical protrusion located in the inner corner of the main temperature homogenizing cavity, which can prevent the working fluid from accumulating at the corners and avoid the problem of uneven local heat conduction. The holding grooves are opened on the left and right sides of the upper and lower temperature homogenizing cover plates, which facilitates the operation of personnel in handling and assembly. To improve installation convenience, the pressure-resistant support is a rectangular frame structure fixed to the outside of the cover plate, enhancing the overall pressure resistance of the heat spreader and preventing structural damage from external pressure. Anti-slip textures are located above the upper cover plate and below the lower cover plate, increasing surface friction and ensuring a more secure fit, preventing displacement during assembly. Anti-condensation protrusions are hemispherical protrusions fixed to the lower inner side of the upper cover plate, guiding condensate to quickly converge and flow back to the capillary structure, preventing condensation buildup and ensuring optimal heat dissipation. The vapor chamber operates stably. Through the aforementioned components, the overall thermal conductivity and heat dissipation uniformity of the vapor chamber are significantly improved, accelerating the circulation and reflux of the phase change working fluid and preventing liquid accumulation and condensation from affecting the heat dissipation effect. At the same time, it effectively enhances the structural strength and compressive strength of the cavity and cover plate, preventing deformation and damage under pressure and ensuring long-term stability. In addition, it can greatly improve the ease of assembly of the vapor chamber, making the installation more secure and less prone to displacement. Overall, it achieves multiple optimizations in heat dissipation performance, structural reliability, and installation practicality.

[0017] This invention, through the design of a connecting assembly mechanism, combines magnetic and bolt connections, allowing for flexible selection of connection methods based on actual usage scenarios. The magnetic connection using mating magnetic blocks meets the needs of temporary expansion and frequent disassembly, enabling rapid assembly and disassembly of the heat spreader and flexible expansion. By fixing the expansion splicing plate with bolts through mating holes, the connection requirements for long-term stable use are met, ensuring a robust and reliable structure after assembly. This invention improves the convenience and flexibility of heat spreader expansion and assembly, reduces equipment heat dissipation costs, lowers heat spreader processing costs, and ensures connection stability under long-term use. It effectively adapts to different heat dissipation expansion scenarios, significantly enhancing the versatility and practicality of the heat spreader. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments will be briefly described below.

[0019] The accompanying drawings described below are only related to some embodiments of the invention and are not intended to limit the invention.

[0020] In the attached diagram: Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0021] Figure 2 This is a schematic diagram of the anti-pressure support structure of the present invention.

[0022] Figure 3 This is a schematic diagram of the extended splicing panel structure of the present invention.

[0023] Figure 4 This is a schematic diagram of the anti-liquid accumulation bump structure of the present invention.

[0024] Figure 5 This is a schematic diagram of the anti-condensation protrusion structure of the present invention.

[0025] Figure 6 This is a schematic diagram of the reinforced support column structure of the present invention.

[0026] Figure 7 This is a schematic diagram of the temperature equalization auxiliary cavity structure of the present invention.

[0027] Figure 8 This is a schematic diagram of the flow channel structure of the present invention.

[0028] List of reference numerals 1. Temperature equalization upper cover plate; 101. First capillary structure; 102. Second capillary structure; 103. Reinforcing support column; 104. Flow guide channel; 105. Anti-liquid accumulation protrusion; 106. Holding groove; 107. Anti-pressure support component; 108. Anti-slip texture; 109. Anti-condensation protrusion; 2. Temperature equalization lower cover plate; 201. Extension splicing plate; 202. Docking hole; 203. Docking magnet; 3. Heat dissipation mounting hole; 4. Temperature equalization main cavity; 5. Temperature equalization auxiliary cavity. Detailed Implementation Example 1

[0029] Please refer to Figures 1 to 8 As shown: This invention provides a temperature equalization plate with a composite cavity structure, including a temperature equalization upper cover plate 1, a temperature equalization lower cover plate 2, heat dissipation mounting holes 3, a temperature equalization main cavity 4, a temperature equalization auxiliary cavity 5, and a support and protection mechanism; the temperature equalization lower cover plate 2 is welded to the lower part of the temperature equalization upper cover plate 1; the heat dissipation mounting holes 3 are formed at the front ends of the temperature equalization upper cover plate 1 and the temperature equalization lower cover plate 2; the temperature equalization main cavity 4 is fixedly connected to the inner side of the temperature equalization upper cover plate 1 and the temperature equalization lower cover plate 2; two sets of temperature equalization auxiliary cavities 5 are provided, and the two sets of temperature equalization auxiliary cavities 5 are respectively fixedly connected to the left and right sides of the temperature equalization main cavity 4, and the two sets of temperature equalization auxiliary cavities 5 are respectively connected to the temperature equalization main cavity 4; the support and protection mechanism is set on the inner side of the temperature equalization upper cover plate 1 and the temperature equalization lower cover plate 2.

[0030] The supporting and protective mechanism includes: a first capillary structure 101 and a second capillary structure 102; the first capillary structure 101 is disposed inside the main temperature equalization cavity 4, and the first capillary structure 101 is a capillary structure sintered from copper powder; two sets of the second capillary structure 102 are provided, and the two sets of the second capillary structure 102 are respectively disposed inside the auxiliary temperature equalization cavity 5, and both sets of the second capillary structure 102 are copper mesh structures.

[0031] The support and protection mechanism also includes: a reinforcing support column 103; multiple sets of reinforcing support columns 103 are provided, and the multiple sets of reinforcing support columns 103 are fixedly connected to the inner side of the temperature equalization auxiliary cavity 5, and the upper and lower ends of the multiple sets of reinforcing support columns 103 are in contact with the temperature equalization upper cover plate 1 and the temperature equalization lower cover plate 2 respectively.

[0032] The supporting and protective mechanism also includes: a flow guiding channel 104; multiple sets of flow guiding channels 104 are provided, and the multiple sets of flow guiding channels 104 are respectively opened at the connection between the temperature equalization main cavity 4 and the temperature equalization auxiliary cavity 5. The inner front and rear ends of the multiple sets of flow guiding channels 104 are provided with protruding structures, and the protruding structures inside the multiple sets of flow guiding channels 104 form a Venturi tube shape inside the flow guiding channel 104.

[0033] The supporting and protective mechanism also includes: anti-liquid accumulation protrusions 105 and holding grooves 106; multiple sets of anti-liquid accumulation protrusions 105 are provided, and the multiple sets of anti-liquid accumulation protrusions 105 are welded to the inner corner of the temperature equalization main cavity 4, and the multiple sets of anti-liquid accumulation protrusions 105 are all semi-cylindrical protrusion structures; two sets of holding grooves 106 are provided, and the two sets of holding grooves 106 are respectively opened on the left and right sides of the temperature equalization upper cover plate 1 and the temperature equalization lower cover plate 2.

[0034] The support and protection mechanism also includes: pressure-resistant support 107; there are two sets of pressure-resistant support 107, which are fixedly connected to the outside of the uniform temperature upper cover plate 1 and the uniform temperature lower cover plate 2 respectively, and both sets of pressure-resistant support 107 are rectangular frame structures.

[0035] The supporting and protective mechanism also includes: anti-slip texture 108; there are two sets of anti-slip texture 108, one set of anti-slip texture 108 is located below the uniform temperature lower cover plate 2, and the other set of anti-slip texture 108 is located above the uniform temperature upper cover plate 1.

[0036] The supporting and protective mechanism also includes: anti-condensation protrusions 109; multiple sets of anti-condensation protrusions 109 are provided, and each set of anti-condensation protrusions 109 is a hemispherical protrusion structure, and the multiple sets of anti-condensation protrusions 109 are respectively fixedly connected to the lower inner side of the temperature equalization upper cover plate 1.

[0037] The specific usage and function of this embodiment are as follows: The first capillary structure 101 is made of copper powder sintering and is located inside the homogenizing main cavity 4. It can provide sufficient capillary suction for the phase change working fluid, accelerate the reflux speed of the condensing working fluid, and improve the thermal conductivity of the homogenizing main cavity 4. The second capillary structure 102 is made of copper mesh and is located inside the homogenizing auxiliary cavity 5. It can adapt to the structural characteristics of the auxiliary cavity to realize the circulation of the working fluid and cooperate with the main cavity to complete uniform heat dissipation. The reinforcing support column 103 is located inside the homogenizing auxiliary cavity 5 and its upper and lower ends abut against the homogenizing upper cover plate 1 and homogenizing lower cover plate 2. It can effectively enhance the structural strength of the cavity and prevent the cover plate from deforming under pressure. The flow channel 104 is located at the connection between the homogenizing main cavity 4 and the homogenizing auxiliary cavity 5 and is in the shape of a Venturi tube. It can reduce the flow resistance of the working fluid, increase the flow speed, enhance the heat transfer efficiency between the main and auxiliary cavities, and prevent liquid accumulation. The anti-liquidation protrusion 10 5 is a semi-cylindrical protrusion located at the inner corner of the main temperature-equalizing cavity 4, which can prevent the working fluid from accumulating at the corners and prevent uneven local heat conduction. The holding groove 106 is opened on the left and right sides of the upper temperature-equalizing cover plate 1 and the lower temperature-equalizing cover plate 2, which facilitates the operation of the staff and improves the ease of installation. The anti-pressure support 107 is a rectangular frame structure and is fixed on the outside of the cover plate, which can improve the overall pressure resistance of the temperature-equalizing plate and prevent the structure from being damaged by external pressure. The anti-slip texture 108 is respectively set above the upper temperature-equalizing cover plate 1 and below the lower temperature-equalizing cover plate 2, which can increase the surface friction, make the temperature-equalizing plate more firmly installed, and prevent displacement during assembly. The anti-condensation protrusion 109 is a semi-spherical protrusion and is fixed on the lower inner side of the upper temperature-equalizing cover plate 1, which can guide the condensate to quickly converge and flow back to the capillary structure, preventing condensation from affecting the heat dissipation effect and ensuring the stable operation of the temperature-equalizing plate. Example 2

[0038] like Figures 1 to 3 As shown: The present invention provides a temperature equalization plate with a composite cavity structure. Based on the first embodiment, it further includes a connecting and combining mechanism, which is disposed on the outside of the upper temperature equalization cover plate 1 and the lower temperature equalization cover plate 2.

[0039] The connecting assembly mechanism includes: an expansion splicing plate 201 and docking holes 202; there are two sets of expansion splicing plates 201, one set of expansion splicing plates 201 is fixedly connected to the left side of the temperature equalization upper cover plate 1, and the other set of expansion splicing plates 201 is fixedly connected to the right side of the temperature equalization lower cover plate 2, and the two sets of expansion splicing plates 201 are in corresponding positions; there are four sets of docking holes 202, and the four sets of docking holes 202 are respectively opened at the front and rear ends of the inner side of the expansion splicing plate 201.

[0040] The connecting assembly mechanism also includes: docking magnetic blocks 203; there are two sets of docking magnetic blocks 203, one set of docking magnetic blocks 203 is fixedly connected to the bottom of the left set of expansion splicing plates 201, and the other set of docking magnetic blocks 203 is fixedly connected to the bottom of the right set of expansion splicing plates 201, and the two sets of docking magnetic blocks 203 are magnetically connected.

[0041] The specific usage and function of this embodiment are as follows: When expanding the entire heat exchange plate, in the case of temporary expansion or frequent disassembly, the mating magnetic blocks 203 of one heat exchange plate are directly connected to the mating magnetic blocks 203 of another heat exchange plate by magnetic attraction, thereby realizing the expansion of the heat exchange plate. When facing long-term use, the expansion splicing plate 201 of one heat exchange plate is aligned with the expansion splicing plate 201 of another heat exchange plate, and after the mating holes 202 are aligned, the expansion splicing plate 201 is connected and fixed with bolts.

[0042] The following points should be noted in this article: 1. The accompanying drawings of this embodiment only involve the structures involved in this embodiment; other structures can refer to the general design.

[0043] 2. Where there is no conflict, this embodiment and the features in the embodiment can be combined with each other to obtain new embodiments.

[0044] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A temperature distribution plate with a composite cavity structure, characterized in that: The system includes a uniform temperature upper cover plate (1), a uniform temperature lower cover plate (2), a heat dissipation mounting hole (3), a uniform temperature main cavity (4), a uniform temperature auxiliary cavity (5), a support and protection mechanism, and a connecting assembly mechanism. The uniform temperature lower cover plate (2) is welded to the bottom of the uniform temperature upper cover plate (1). The heat dissipation mounting hole (3) is opened at the front end of the uniform temperature upper cover plate (1) and the uniform temperature lower cover plate (2). The uniform temperature main cavity (4) is fixedly connected to the inner side of the uniform temperature upper cover plate (1) and the uniform temperature lower cover plate (2). There are two sets of uniform temperature auxiliary cavities (5), which are fixedly connected to the left and right sides of the uniform temperature main cavity (4) respectively, and the two sets of uniform temperature auxiliary cavities (5) are respectively connected to the uniform temperature main cavity (4). The support and protection mechanism is set on the inner side of the uniform temperature upper cover plate (1) and the uniform temperature lower cover plate (2). The connecting assembly mechanism is set on the outer side of the uniform temperature upper cover plate (1) and the uniform temperature lower cover plate (2).

2. The temperature distribution plate with a composite cavity structure as described in claim 1, characterized in that: The support and protection mechanism includes: a first capillary structure (101) and a second capillary structure (102); the first capillary structure (101) is disposed inside the temperature equalization main cavity (4), and the first capillary structure (101) is a capillary structure sintered from copper powder; the second capillary structure (102) is provided in two sets, and the two sets of second capillary structures (102) are respectively disposed inside the temperature equalization auxiliary cavity (5), and both sets of second capillary structures (102) are copper mesh structures.

3. The temperature distribution plate with a composite cavity structure as described in claim 1, characterized in that: The support and protection mechanism also includes: a reinforcing support column (103); the reinforcing support column (103) is provided in multiple sets, and the multiple sets of reinforcing support columns (103) are respectively fixedly connected to the inner side of the temperature equalization auxiliary cavity (5), and the upper and lower ends of the multiple sets of reinforcing support columns (103) are in contact with the temperature equalization upper cover plate (1) and the temperature equalization lower cover plate (2) respectively.

4. The temperature distribution plate with a composite cavity structure as described in claim 1, characterized in that: The supporting and protective mechanism also includes: a flow guide channel (104); the flow guide channel (104) is provided in multiple sets, and the multiple sets of flow guide channels (104) are respectively opened at the connection between the temperature equalization main cavity (4) and the temperature equalization auxiliary cavity (5). The inner front and rear ends of the multiple sets of flow guide channels (104) are provided with protruding structures, and the protruding structures inside the multiple sets of flow guide channels (104) make the interior of the flow guide channel (104) form a Venturi tube.

5. The temperature distribution plate with a composite cavity structure as described in claim 1, characterized in that: The support and protection mechanism also includes: anti-liquidation protrusions (105) and holding grooves (106); the anti-liquidation protrusions (105) are provided in multiple sets, and the multiple sets of anti-liquidation protrusions (105) are respectively welded to the inner corner of the temperature equalization main cavity (4), and the multiple sets of anti-liquidation protrusions (105) are all semi-cylindrical protrusion structures; the holding grooves (106) are provided in two sets, and the two sets of holding grooves (106) are respectively opened on the left and right sides of the temperature equalization upper cover plate (1) and the temperature equalization lower cover plate (2).

6. The temperature distribution plate with a composite cavity structure as described in claim 1, characterized in that: The support and protection mechanism also includes: pressure-resistant support (107); the pressure-resistant support (107) is provided in two sets, and the two sets of pressure-resistant support (107) are respectively fixedly connected to the outside of the temperature equalization upper cover plate (1) and the temperature equalization lower cover plate (2), and both sets of pressure-resistant support (107) are rectangular frame structures.

7. The temperature distribution plate with a composite cavity structure as described in claim 1, characterized in that: The support and protection mechanism also includes: anti-slip texture (108); the anti-slip texture (108) is provided in two sets, one set of anti-slip texture (108) is provided below the uniform temperature lower cover plate (2), and the other set of anti-slip texture (108) is provided above the uniform temperature upper cover plate (1).

8. The temperature distribution plate with a composite cavity structure as described in claim 1, characterized in that: The support and protection mechanism also includes: anti-condensation protrusions (109); the anti-condensation protrusions (109) are provided in multiple sets, and the multiple sets of anti-condensation protrusions (109) are all hemispherical protrusion structures, and the multiple sets of anti-condensation protrusions (109) are respectively fixedly connected to the lower inner side of the temperature equalization upper cover plate (1).

9. The temperature distribution plate with a composite cavity structure as described in claim 1, characterized in that: The connecting assembly mechanism includes: an expansion splicing plate (201) and docking holes (202); the expansion splicing plate (201) is provided in two sets, one set of expansion splicing plate (201) is fixedly connected to the left side of the uniform temperature upper cover plate (1), and the other set of expansion splicing plate (201) is fixedly connected to the right side of the uniform temperature lower cover plate (2), and the two sets of expansion splicing plates (201) are in corresponding positions; the docking holes (202) are provided in four sets, and the four sets of docking holes (202) are respectively opened at the front and rear ends of the inner side of the expansion splicing plate (201).

10. The temperature distribution plate with a composite cavity structure as described in claim 9, characterized in that: The connection assembly mechanism also includes: docking magnetic blocks (203); there are two sets of docking magnetic blocks (203), one set of docking magnetic blocks (203) is fixedly connected to the bottom of a set of expansion splicing plates (201) on the left side, and the other set of docking magnetic blocks (203) is fixedly connected to the bottom of a set of expansion splicing plates (201) on the right side, and the two sets of docking magnetic blocks (203) are magnetically connected.

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