A bump detection method and detection device for automatically creating a prescription

Abstract

The application belongs to the technical field of semiconductor packaging detection, and discloses a bump detection method and a detection device for automatically creating a prescription, which comprises the following steps: performing white light interference scanning on a reference area of a chip to obtain three-dimensional coordinate data of a bump in the reference area; performing multiple progressive scans to determine the position of the best focal plane and obtain optimized optical focusing parameters; automatically adjusting the intensity of an illumination light source to obtain optimized illumination parameters; automatically defining a top collection interval of the bump to obtain collection parameters; forming a detection prescription; and loading the detection prescription to a white light line triangle module to perform scanning on a set area on the chip to obtain height information of the bump on the set area. The bump detection method and the detection device for automatically creating a prescription provided by the application not only improve the detection efficiency, but also take into account the detection accuracy, truly reflect the actual height of the bump, and fully adapt to the core needs of advanced semiconductor packaging production lines for efficient, accurate and reliable detection.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor packaging inspection technology, specifically relating to a bump detection method and device for automatically creating a prescription. Background Technology

[0002] As the semiconductor industry rapidly advances towards advanced packaging, chip integration is continuously increasing and dimensions are constantly miniaturizing. Packaging processes are placing increasingly stringent demands on the reliability of interconnect structures. Among these, bumps, as the core interconnect structure enabling electrical signal transmission and mechanical connections between chips and substrates, and between chips themselves, directly determine the yield of packaged products. Whether the bump height parameters meet design standards, and whether the coplanarity of all bumps within a single chip meets the requirements, are crucial factors. Therefore, high-precision, high-reliability testing of bumps is a key step in ensuring the stable progress of advanced semiconductor packaging processes and improving product yield.

[0003] Currently, the main technologies used in bump detection include laser triangulation, confocal microscopy, and white light interferometry. However, laser triangulation and confocal microscopy suffer from drawbacks when measuring highly reflective or irregularly shaped bump surfaces, such as susceptibility to specular reflection interference, slow measurement speed, and insufficient measurement capability on steep sidewalls. White light interferometry, utilizing interference characteristics for height detection, offers superior accuracy compared to laser triangulation and confocal microscopy, but its throughput is insufficient for large-scale, high-speed production line inspections. Patent US20120274946A1 proposes a white light triangulation method for measuring object height. By utilizing the fixed angle relationship between illumination and imaging, only the reflected signal from horizontal surfaces has high intensity, allowing for the identification of the top and bottom of the bump from the image. This enables rapid bump height measurement, balancing detection speed and accuracy.

[0004] However, in actual measurement, the use of white light triangulation requires manual determination of the focal plane, light intensity, and signal acquisition range at the top of the bump, which has some drawbacks: 1. Poor positioning accuracy and low determination efficiency of the focal plane: During the measurement process, the determination of the focal plane either relies on the operator's past experience for subjective judgment, or it needs to be verified by scanning point by point within the entire height range of the bump. The former is greatly affected by the difference in personnel experience, and the focal plane determined by different personnel has positioning differences and errors. The latter requires the acquisition and analysis of interference signals at the entire height during the detection process, which leads to a complicated detection process, long detection time, and low detection efficiency. 2. Poor reliability of lighting: Because lighting parameters need to be adjusted manually and repeatedly, and different types of bumps (such as copper pillars and solder balls) have large material differences, even the same type of bumps may have different states such as oxidation, roughness, and contamination on their surfaces. These factors will cause large differences in the reflectivity of the bump surface when the lighting parameters are adjusted manually, resulting in overexposure or underexposure. 3. Large signal acquisition error: Since the signal acquisition range on the top of the bump needs to be set manually based on experience, in actual production, the density of the bump array may vary with different product models. Some bumps may also have surface defects such as top depressions and scratches. The fixed range parameters set manually cannot flexibly adapt to these changes, resulting in incomplete signal acquisition of some bumps or the inclusion of too many interference signals, which in turn leads to signal misjudgment and affects the consistency of the test results.

[0005] The aforementioned differences in detection directly lead to a decrease in the accuracy of measurement results, failing to accurately reflect the actual height and coplanarity of the bumps. In summary, existing detection solutions have not yet formed a mature solution that can simultaneously consider detection speed, detection accuracy, automation level, and result reliability. Further research is needed on how to fully adapt to the core requirements of advanced semiconductor packaging production lines for efficient, accurate, and reliable detection. Summary of the Invention

[0006] This invention provides a method and apparatus for automatically creating bumps in prescriptions, in order to solve the technical problem that existing detection technologies cannot simultaneously achieve detection speed, detection accuracy, automation level, and result reliability.

[0007] The technical solution adopted in this invention is as follows: This invention provides a bump detection method for automatically creating prescriptions. The detection method includes the following steps: S1, performing white light interferometric scanning on a reference area on a chip to obtain three-dimensional contour data of the bumps in the reference area; S2, extracting the top height of the bumps as a provisional focal plane position based on the three-dimensional contour data, controlling a white light triangulation module to perform multiple progressive scans within a preset height range starting from the provisional focal plane position, automatically analyzing the signal intensity of the top of the bump obtained in each scan, determining the focal plane position corresponding to the peak signal intensity as the optimal focal plane position, and obtaining optimized optical focusing parameters; S3, in the optimal focal plane position, the top height of the bumps is further analyzed. S4. The optimal focal plane position is referenced to the signal strength at the top of the bump, and the intensity of the illumination source is automatically iteratively adjusted until the signal strength falls into the preset optimal intensity range to obtain optimized illumination parameters; S5. The white light triangulation module scans the reference area based on the optimal focal plane position and the optimized illumination parameters, automatically defines the top acquisition range of the bump, and obtains acquisition parameters; S6. Based on the optimized optical focusing parameters, optimized illumination parameters, and acquisition parameters, a detection prescription is formed, and the detection prescription is loaded into the white light triangulation module to perform scanning on the set area on the chip to obtain the height information of the bump on the set area.

[0008] The bump detection method for automatically creating prescriptions provided by this invention first performs white light interferometry scanning on the chip reference area to obtain bump contour data, and extracts the top height as a provisional focal plane position based on this. Then, using the provisional focal plane position supported by the three-dimensional contour data and progressive automatic scanning analysis, the optimal focal plane position is determined by automatically analyzing the peak signal intensity. This completely eliminates the traditional method of manual subjective judgment of the optimal focal plane or full-height point-by-point scanning verification, avoiding focal plane positioning deviations caused by differences in human experience, or complex and time-consuming detection processes due to the analysis of interference fringes during full-height scanning. This ensures the accuracy of focal plane positioning and significantly improves the efficiency and precision of focal plane positioning. Based on the accurate positioning of the optimal focal plane position, the intensity of the illumination source is automatically iteratively adjusted until the signal falls into the optimal range, realizing dynamic adaptation of illumination parameters and ensuring the reliability of illumination. This effectively adapts to bumps of different materials (such as copper pillars and solder balls) as well as bumps of the same material. Reliable illumination for different bump surface conditions (oxidation, roughness, contamination) avoids overexposure or underexposure, ensuring reliable signal quality and illumination. Based on the optimal focal plane position and optimized illumination parameters, the reference area is scanned, automatically defining the top acquisition zone of the bumps. This effectively avoids the incomplete signal acquisition or excessive interference signals that can lead to misjudgments caused by manually setting fixed interval parameters, ensuring the integrity and accuracy of signal acquisition. Finally, the optimized optical focusing parameters, illumination parameters, and acquisition parameters are used to form a detection prescription, which is then loaded into the white light triangulation module to scan the designated area, completing the height detection of all bumps on the chip. The optimal prescription obtained from the reference area detection is applied to the detection of the entire chip area. Based on the relatively small overall height difference of the bumps on the chip, a fully automated closed-loop detection process is achieved. The entire process, from parameter optimization to precise execution of all detections, can be completed without manual intervention, achieving highly efficient detection. In summary, the bump detection method for automatically creating prescriptions provided by this invention, through the progressive automated design of each step, not only improves detection efficiency but also takes into account detection accuracy, ensuring the consistency and accuracy of detection results for different types and states of bumps on the chip, truly reflecting the actual height and coplanarity of the bumps, and fully adapting to the core requirements of advanced semiconductor packaging production lines for efficient, accurate, and reliable detection.

[0009] In a preferred embodiment, step S5 includes: forming a detection prescription based on the optimized optical focusing parameters, optimized illumination parameters, and acquisition parameters; verifying the effectiveness of the detection prescription using a white light interferometer module and the white light triangulation module; loading the effective detection prescription onto the white light triangulation module; and performing a scan on a set area on the chip to obtain the height information of the bumps on the set area.

[0010] The efficacy of the prescription is verified by using a white light interferometer module and a white light triangulation module. By leveraging the characteristics of these two different detection modules to form a complementary verification, the parameter compatibility and reliability of the effective prescription are ensured. This can screen out bump detection inaccuracies that may be caused by optical path offset or algorithm errors (which only occur in rare cases). It avoids the possibility that algorithm errors may prevent the acquisition parameters from accurately capturing bump signals, which would lead to the detection results not reflecting the actual height and coplanarity of the bumps, or misjudging defects on the chip as bumps and affecting product yield. This ensures that the detection results can accurately support the yield control of advanced semiconductor packaging processes and fully meet the production line's needs for efficient, accurate and reliable detection.

[0011] In a preferred embodiment, the validity verification of the detection prescription using the white light interferometer module and the white light triangulation module includes: based on the detection prescription, using the white light interferometer module and the white light triangulation module to scan the same area of ​​the chip in parallel or sequentially, and obtaining measurement results respectively; comparing the measurement results of the white light interferometer module and the white light triangulation module for the same bump, if the comparison results are both within a preset error range, the detection prescription is determined to be effective; otherwise, a calibration warning is triggered.

[0012] By using a white light interferometer module and a white light triangulation module to scan the same area of ​​the chip in parallel or sequentially and compare the measurement results of the same bump, the technical characteristics of the two modules can form a complementary verification. This can accurately identify the risk of prescription failure caused by problems such as optical path offset, algorithm error, and parameter adaptation deviation. By determining the prescription's effectiveness through a preset error range, it can not only ensure that the prescription used has stable and reliable detection capabilities and guarantee the accuracy and consistency of subsequent bump height measurements, but also trigger calibration warnings in a timely manner when the prescription fails, providing precise guidance for the timely maintenance of the detection system.

[0013] In a preferred embodiment, in step S2, the preset height range is set within ±10% of the provisional focal plane position, and the progressive scanning number is set to 5-10 times.

[0014] By locking the preset height range of the scan within an extremely narrow height interval at the top of the bump, it is possible to focus on the area most sensitive to signal changes, thereby quickly capturing the peak position of the signal intensity and achieving precise locking of the focus surface. At the same time, through 5-10 progressive scans, while ensuring that the scan density is sufficient to distinguish minute height differences, the time loss caused by over-scanning is avoided, achieving a balance between accuracy and efficiency.

[0015] In a preferred embodiment, step S1 includes: performing white light interference vertical scanning on a reference area on the chip to obtain an interference image, and processing the interference image or the corresponding coherent envelope signal to obtain the horizontal and vertical position information of the bumps in the reference area.

[0016] By acquiring interferometric images through vertical scanning with white light interferometry and processing them to obtain the horizontal and height position information of the bumps, accurate and comprehensive three-dimensional data support can be provided for determining the optimal provisional focal plane position. This ensures that the optimal focal plane positioning has a reliable initial benchmark, while avoiding reliance on manual experience estimation or blind large-area scanning, which leads to large focal plane positioning deviations and low efficiency. This effectively improves the accuracy, reliability, and efficiency of subsequent optimal focal plane positioning, parameter optimization, and full-area detection.

[0017] In a preferred embodiment, in step S3, the intensity of the lighting source is adjusted by 1%-10% each time, and the preset optimal intensity range is 65-225.

[0018] A gradual adjustment range of 1%-10% allows for precise adaptation of lighting intensity, avoiding sudden changes in intensity due to excessive adjustment range that deviate from the optimal range. The optimal intensity range of 65-225 grayscale values ​​provides a stable light intensity benchmark for signal acquisition, ensuring clear reflection signals from the bump surface without overexposure or underexposure.

[0019] In a preferred embodiment, in step S3, the lighting parameters include light source intensity and exposure time.

[0020] The coordinated adaptation of light source intensity and exposure time can more flexibly cope with the differences in bump reflection characteristics of different materials and different surface conditions (such as oxidation and roughness), ensuring clear and stable imaging of bump surface signals.

[0021] In a preferred embodiment, in step S4, the acquisition parameters include the acquisition range in the height direction of the bump and the signal acquisition range at the top of the bump.

[0022] The acquisition parameters include the acquisition range in the height direction of the bump and the signal acquisition range at the top of the bump, which can realize the layered and precise acquisition and control of the bump detection signal. The acquisition range in the height direction ensures complete coverage of the overall height-related signals of the bump, while the acquisition range at the top of the bump focuses on the core detection area and effectively filters out interference signals in non-critical areas.

[0023] The present invention also provides a bump detection device for automatically creating prescriptions, for implementing the above-mentioned detection method. The detection device includes: a control component; an optical component including a white light interference module and a white light triangulation module, the white light interference module and the white light triangulation module being controlled by the control component to align with the same area of ​​the chip; and a motion stage for carrying the chip, the motion stage being controlled by the control component to drive the chip to move.

[0024] This invention provides an automated prescription creation bump detection device. Through a control component, it coordinates and manages optical components and a motion stage. Combined with a white light interferometer module and a white light triangulation module capable of same-area alignment, and a motion stage that can move the chip, it achieves fully automated collaborative operation of the detection process. This device accurately supports the orderly implementation of each step in the aforementioned detection method, such as reference area scanning, parameter optimization, prescription verification, and full-area detection. It also ensures precise alignment of the two modules for the same area detection. Furthermore, the controllable movement of the motion stage adapts to different chip sizes and full-area detection requirements. Therefore, it provides reliable hardware support for automated prescription creation and accurate detection, ensuring the efficient and stable implementation of the aforementioned detection methods. It also improves the device's adaptability to different chip products, ensuring the automation, accuracy, and reliability of the detection process from a hardware perspective, and providing comprehensive protection for the efficient detection needs of advanced semiconductor packaging production lines.

[0025] In a preferred embodiment, the detection device further includes a microscopic imaging module for providing real-time microscopic images of the chip surface.

[0026] By providing real-time microscopic images of the chip surface, it can provide manual or algorithmic assistance for the initial coarse positioning of bumps and the selection of the test area before prescription creation or during the testing process, ensuring accurate and efficient positioning and selection. It can also assist manual personnel in quickly locating the root cause of the problem and fine-tuning the parameters when the prescription verification triggers a calibration warning.

[0027] In a preferred embodiment, the control component includes a data processing unit, which is used to compare the detection results of the white light interferometer module and the white light triangulation module to verify the effectiveness of the detection prescription.

[0028] By setting up a data processing unit, it can accurately undertake and execute the comparison task of the detection results of the white light interferometry module and the white light triangulation module, providing core data processing support for the verification of prescription validity and ensuring the automation and accuracy of the verification logic. Attached Figure Description

[0029] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings: Figure 1 This is a flowchart of a bump detection method for automatically creating prescriptions according to one embodiment of the present invention; Figure 2 This is a flowchart of a bump detection method for automatically creating prescriptions in another embodiment of the present invention; Figure 3 This is a schematic diagram of a bump detection device for automatically creating prescriptions according to one embodiment of the present invention. Detailed Implementation

[0030] One or more embodiments of the present invention provide a bump detection method for automatically creating prescriptions, which can be executed by a bump detection device for automatically creating prescriptions provided by one or more embodiments of the present invention. Certain input parameters or intermediate results in the detection method can be manually adjusted to help improve accuracy.

[0031] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on the embodiments of this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.

[0032] In one embodiment, this invention provides a bump detection method for automatically creating prescriptions. The detection method includes the following steps: S1, performing white light interferometric scanning on a reference area on a chip to obtain three-dimensional contour data of the bumps in the reference area; S2, extracting the top height of the bumps based on the three-dimensional contour data as a provisional focal plane position, controlling the white light triangulation module to perform multiple progressive scans within a preset height range, starting from the provisional focal plane position, automatically analyzing the signal intensity of the top of the bumps obtained in each scan, determining the focal plane position corresponding to the peak signal intensity as the optimal focal plane position, and obtaining optimized optical focusing parameters. S3, at the optimal focal plane position, referencing the signal strength at the top of the bump, automatically iteratively adjust the intensity of the illumination source until the signal strength falls within the preset optimal intensity range, obtaining optimized illumination parameters; S4, the white light triangulation module scans the reference area based on the optimal focal plane position and optimized illumination parameters, automatically defining the top acquisition range of the bump, obtaining acquisition parameters; S5, based on the optimized optical focusing parameters, optimized illumination parameters, and acquisition parameters, a detection prescription is formed, the detection prescription is loaded into the white light triangulation module, and a scan is performed on the set area on the chip to obtain the height information of the bump on the set area.

[0033] The bump detection method for automatically creating prescriptions provided by this invention first performs white light interferometry scanning on the chip reference area to obtain the three-dimensional contour data of the bumps, and extracts the top height as a provisional focal plane position based on this. Then, using the provisional focal plane position supported by the three-dimensional contour data and progressive automatic scanning analysis, the optimal focal plane position is determined by automatically analyzing the peak signal intensity. This completely eliminates the traditional method of manual subjective judgment of the optimal focal plane or full-height point-by-point scanning verification, avoiding focal plane positioning deviations caused by differences in human experience, or complex and time-consuming detection processes due to the analysis of interference fringes during full-height scanning. This ensures the accuracy of focal plane positioning and significantly improves the efficiency and precision of focal plane positioning. Based on the accurate positioning of the optimal focal plane position, the intensity of the illumination source is automatically iteratively adjusted until the signal falls into the optimal range, realizing dynamic adaptation of illumination parameters and ensuring the reliability of illumination. This effectively adapts to bumps of different materials (such as copper pillars and solder balls) and... Reliable illumination for bumps of the same material with different surface conditions (oxidation, roughness, contamination) avoids overexposure or underexposure, ensuring reliable signal quality and illumination. Based on the optimal focal plane position and optimized illumination parameters, the reference area is scanned, automatically defining the acquisition range at the top of the bumps. This effectively avoids the incomplete signal acquisition or excessive interference signals that can lead to misjudgments caused by manually setting fixed range parameters in traditional methods, ensuring the integrity and accuracy of signal acquisition. Finally, the optimized optical focusing parameters, illumination parameters, and acquisition parameters are used to form a detection prescription and loaded into the white light triangulation module to scan the set area, completing the height detection of all bumps on the chip. The optimal prescription obtained from the reference area detection is applied to the detection of the entire chip area. Based on the fact that the overall height difference of the bumps on the chip is not large, a fully automated closed loop of the detection process is achieved, completing the entire process from parameter optimization to accurate execution of all detections without manual intervention. In summary, the chip bump detection method with automatic prescription creation provided by this invention, through the progressive automation design of each step, not only improves detection efficiency but also takes into account detection accuracy, ensuring the consistency and accuracy of detection results for different types and states of bumps on the chip, truly reflecting the actual height and coplanarity of the bumps, and fully adapting to the core requirements of advanced semiconductor packaging production lines for efficient, accurate, and reliable detection.

[0034] It should be noted that inaccurate optimal focal plane positioning can easily lead to blurred edges in the final scanned image of the bump, excessive interference areas in the acquisition range, or missed effective signals, making it impossible to clearly define the true boundary of the bump top. For example, the lines corresponding to the top of the bump in the scanned image may be thick or wide, making it impossible to accurately capture the true distance between the top and bottom reference points during height calculation, ultimately resulting in inaccurate bump height measurement. Therefore, this application ensures the accuracy of focal plane positioning, significantly improving its efficiency and precision. The resulting lines corresponding to the top of the bump in the scanned image are narrower or thinner, providing a reliable foundation for clear, continuous, and stable imaging of the subsequent bump height lines. This allows for accurate identification of the bump top boundary, precise delineation of the acquisition range, and a more stable and reliable reference point for height calculation, effectively improving the accuracy and consistency of bump height measurement and laying a crucial foundation for the accurate execution of subsequent detection strategies. Under the premise of accurate optimal focal plane positioning, this application prevents overexposure or underexposure due to unreliable illumination intensity, as well as the impact of unreliable signals and inaccurate signal acquisition on bump imaging, thereby achieving accurate and efficient measurement of bump height on the chip.

[0035] like Figure 1 As shown, in a preferred embodiment, a bump detection method for automatically creating prescriptions includes: S1, White light interferometry scanning reference area: Perform white light interferometry scanning on the reference area on the chip to obtain the three-dimensional contour data of the bumps in the reference area; Specifically, a white light interference vertical scan is performed on the reference area on the chip to obtain an interference image. The interference image or the corresponding coherent envelope signal is then processed to obtain the horizontal and vertical position information of the bumps in the reference area.

[0036] S2, Determine the optimal focal plane: This includes S21, extracting the top height of the bump as the provisional focal plane position; S22, White ray triangulation to determine the optimal focal plane: Control the white ray triangulation module to perform multiple progressive scans within a preset height range, starting from the provisional focal plane position. Automatically analyze the signal intensity of the bump top obtained in each scan, determine the focal plane position corresponding to the peak signal intensity as the optimal focal plane position, and obtain optimized optical focusing parameters. Specifically, the preset height range is set within ±10% of the provisional focal plane position, and the number of progressive scans is set to 5-10 times. For example, 5 progressive scans are performed within the range of 5% above and 5% below the provisional focal plane position.

[0037] S3, Adaptive Illumination Source: Based on the signal strength at the top of the reference bump at the optimal focal plane position, automatically iteratively adjust the intensity of the illumination source until the signal strength falls into the preset optimal intensity range to obtain optimized illumination parameters; Optionally, the adjustment increment of the illumination source intensity is 1%-10% each time, and the preset optimal intensity range is 65-225. For example, the adjustment increment of the illumination source intensity is 5% each time, which can be to gradually increase or gradually decrease the light source intensity until the optimal intensity range, i.e., the grayscale value, is stable at 65-225.

[0038] S4, Custom Acquisition Range: The white light triangulation module scans the reference area based on the optimal focal plane position and optimized illumination parameters, automatically defines the top acquisition range of the bump, and obtains the acquisition parameters; S5, forming a detection prescription to scan the set area and obtain the bump height: Based on optimized optical focusing parameters, optimized illumination parameters, and acquisition parameters, a detection prescription is formed, which is then loaded into the white light triangulation module to perform a scan on the set area on the chip to obtain the height information of the bumps on the set area.

[0039] In this embodiment of the invention, by locking the preset height range of the scan within an extremely narrow height interval at the top of the protrusion, it is possible to focus on the area most sensitive to signal changes, thereby quickly capturing the peak position of the signal intensity and achieving precise locking of the focus surface. At the same time, by performing 5 to 10 progressive scans, while ensuring that the scan density is sufficient to distinguish minute height differences, the time loss caused by over-scanning is avoided, thus achieving a balance between accuracy and efficiency.

[0040] By acquiring interferometric images through vertical scanning with white light interferometry and processing them to obtain the horizontal and height position information of the bumps, accurate and comprehensive three-dimensional data support can be provided for determining the optimal provisional focal plane position. This ensures that the optimal focal plane positioning has a reliable initial benchmark, while avoiding reliance on manual experience estimation or blind large-area scanning, which leads to large focal plane positioning deviations and low efficiency. This effectively improves the accuracy, reliability, and efficiency of subsequent optimal focal plane positioning, parameter optimization, and full-area detection.

[0041] In a preferred embodiment, a gradual adjustment range of 1%-10% can achieve fine adaptation of the lighting intensity, avoiding sudden changes in intensity due to excessive adjustment range, which would deviate from the optimal range. The optimal intensity range of 65-225 gray values ​​provides a stable light intensity reference for signal acquisition, ensuring that the reflected signal from the bump surface is clear and free from overexposure or underexposure.

[0042] like Figure 2As shown, in a more preferred embodiment, step S5 includes: S51 forming a detection prescription and scanning a set area; S52 verifying the validity of the detection prescription using a white light interferometer module and a white light triangulation module; more specifically, verifying the validity of the detection prescription using a white light interferometer module and a white light triangulation module includes: based on the detection prescription, using a white light interferometer module and a white light triangulation module to scan the same area of ​​the chip in parallel or sequentially, obtaining measurement results respectively; comparing the measurement results of the white light interferometer module and the white light triangulation module for the same bump, if the comparison results are both within a preset error range, the detection prescription is determined to be effective; otherwise, a calibration warning is triggered, and manual confirmation is prompted for manual confirmation. S53, obtaining the bump height: loading the effective detection prescription onto the white light triangulation module, scanning the set area on the chip to obtain the height information of the bump on the set area. More specifically, the illumination parameters include the light source intensity and exposure time, and the acquisition parameters include the acquisition range in the height direction of the bump and the signal acquisition range at the top of the bump.

[0043] Specifically, the preset error range is determined based on the bump detection accuracy requirements, and the calibration warning methods include audible and visual warnings or system pop-up warnings. The same area verified by the aforementioned white light interferometry module and white light triangulation module can be selected as a reference area or another separate verification area.

[0044] It should be noted that the specific content of the above cross-validation can be selected as follows: comparing the measurement height of the same bump by the white light interferometer module and the white light triangulation module, and determining whether the difference is within the preset error tolerance; or, further, comparing the peak position of the coherent envelope signal obtained by the white light interferometer module with the peak position of the signal intensity obtained by the white light triangulation module under the detection prescription, and if the deviation between the two is within the preset range, it is used as an auxiliary basis for consistency determination; or, calculating the statistical characteristic value of the difference between the two measurement results of multiple bumps in the verification area, and if the statistical characteristic value meets the preset conditions, it is used as an auxiliary basis for determining the prescription to be effective.

[0045] In this embodiment, a white light interference module is used to perform a vertical white light interference scan on the reference area on the chip, forming layers of white light interference images along the entire height direction of the bump. This provides a very accurate interference image. By processing the interference image or the corresponding coherent envelope signal, accurate horizontal and height position information of the bump in the reference area is obtained, resulting in high detection accuracy. Furthermore, a white light triangulation module is used to emit light towards the bump and determine whether a signal is received, eliminating the need for scanning the entire height of the bump. This allows for faster acquisition of image information of the bump near a provisional focal plane position, determining the optimal focal plane position, and thus providing a precise foundation for subsequent determination of light intensity and acquisition range. Therefore, this embodiment, by utilizing the combination of the white light interference module and the white light triangulation module, achieves both high detection accuracy and high detection speed.

[0046] In addition, the efficacy of the prescription is verified by using a white light interferometer module and a white light triangulation module. By leveraging the characteristics of the two different detection modules to form a complementary verification, the parameter compatibility and reliability of the effective prescription are ensured. This can screen out bump detection inaccuracies that may be caused by optical path offset or algorithm errors (which only occur in rare cases). It avoids the possibility that algorithm errors may prevent the acquisition parameters from accurately capturing bump signals, which would lead to the detection results not reflecting the actual height and coplanarity of the bumps, or misjudging defects on the chip as bumps and affecting product yield. This ensures that the detection results can accurately support the yield control of advanced semiconductor packaging processes and fully meet the production line's needs for efficient, accurate and reliable detection. By using a white light interferometer module and a white light triangulation module to scan the same area of ​​the chip in parallel or sequentially and compare the measurement results of the same bump, the technical characteristics of the two modules can form a complementary verification. This can accurately identify the risk of prescription failure caused by problems such as optical path offset, algorithm error, and parameter adaptation deviation. By determining the prescription's effectiveness through a preset error range, it can not only ensure that the prescription used has stable and reliable detection capabilities and guarantee the accuracy and consistency of subsequent bump height measurements, but also trigger calibration warnings in a timely manner when the prescription fails, providing precise guidance for the timely maintenance of the detection system.

[0047] In this embodiment, the coordinated adaptation of light source intensity and exposure time can more flexibly address the differences in bump reflection characteristics due to different materials and surface conditions (such as oxidation and roughness), ensuring clear and stable imaging of bump surface signals. The acquisition parameters include the acquisition range along the bump height and the signal acquisition range at the top of the bump, enabling precise, layered acquisition and control of bump detection signals. The height-direction acquisition range ensures complete coverage of the overall height-related signals of the bump, while the top signal acquisition range focuses on the core detection area, effectively filtering interference signals from non-critical areas.

[0048] like Figure 3 As shown, in one embodiment of the present invention, a bump detection device for automatically creating prescriptions is also provided for implementing the above-described detection method. The detection device includes: a control component 10; an optical component 20, including a white light interference module 21 and a white light triangulation module 22, wherein the white light interference module 21 and the white light triangulation module 22 are controlled by the control component to align the same area of ​​the chip; and a motion stage 30 for carrying the chip, wherein the motion stage is controlled by the control component to drive the chip to move.

[0049] Specifically, the control component 10 is electrically or signal-connected to the optical component 20; the control device 10 is drive-connected to the drive component that drives the motion stage 30.

[0050] like Figure 3As shown, in a preferred embodiment, the detection device further includes a microscopic imaging module 23 for providing real-time microscopic images of the chip surface. The control component 10 includes a data processing unit 11, which compares the detection results of the white light interferometry module and the white light triangulation module to verify the effectiveness of the detection prescription.

[0051] More preferably, as shown in 3, the detection device further includes an operation module 40 for manual operation, such as an operation screen, which is electrically connected to the control component 10.

[0052] The bump detection device for automatically creating prescriptions provided by this invention manages the optical components and the motion stage in a coordinated manner through a control component. Combined with a white light interferometer module and a white light triangulation module capable of aligning within the same area, and a motion stage that can move the chip, it achieves fully automated and collaborative operation of the detection process. This not only accurately supports the orderly implementation of each step in the aforementioned detection method, such as reference area scanning, parameter optimization, prescription verification, and full-area detection, but also ensures precise alignment of the two modules for detecting the same area. Furthermore, the controllable movement of the motion stage adapts to different chip sizes and full-area detection requirements. Therefore, it provides reliable hardware support for automatic prescription creation and accurate detection, ensuring the efficient and stable implementation of the aforementioned detection methods. It also improves the device's adaptability to different chip products, ensuring the automation, accuracy, and reliability of the detection process from a hardware perspective, and providing comprehensive protection for the efficient detection needs of advanced semiconductor packaging production lines.

[0053] By providing real-time microscopic images of the chip surface, it can offer manual or algorithmic assistance for initial coarse positioning of bumps and selection of test areas before prescription creation or during testing, ensuring accurate and efficient positioning and selection. It can also assist manual intervention in quickly locating the root cause of problems and fine-tuning parameters when prescription verification triggers calibration warnings. By setting up a data processing unit, it can accurately undertake and execute the comparison task between the detection results of the white light interferometry module and the white light triangulation module, providing core data processing support for prescription validity verification and ensuring the automated and accurate implementation of the verification logic.

[0054] It should be noted that the working principle of the white light interference module and the white light triangulation module provided in the various embodiments of the present invention can be found in the background description of patent US20120274946A1.

[0055] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the apparatus embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0056] Those skilled in the art will recognize that the modules and method steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0057] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The aforementioned units can be implemented in hardware or software.

[0058] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A method for automatically creating bump detection for prescriptions, characterized in that, The detection method includes the following steps: S1, perform white light interferometric scanning on the reference area on the chip to obtain the three-dimensional contour data of the bumps in the reference area; S2, based on the three-dimensional contour data, extract the top height of the bump as the provisional focal plane position, control the white light triangulation module to perform multiple progressive scans within a preset height range starting from the provisional focal plane position, automatically analyze the signal intensity of the top of the bump obtained in each scan, determine the focal plane position corresponding to the peak signal intensity as the optimal focal plane position, and obtain optimized optical focusing parameters. S3, at the optimal focal plane position, referencing the signal strength at the top of the bump, automatically and iteratively adjust the intensity of the illumination source until the signal strength falls into the preset optimal intensity range, thereby obtaining optimized illumination parameters; S4, the white light triangulation module scans the reference area based on the optimal focal plane position and optimized illumination parameters, automatically defines the top acquisition range of the bump, and obtains the acquisition parameters; S5. Based on the optimized optical focusing parameters, optimized illumination parameters, and acquisition parameters, a detection prescription is formed. The detection prescription is loaded onto the white light triangulation module, and a scan is performed on a set area on the chip to obtain the height information of the bumps on the set area.

2. The bump detection method for automatically creating prescriptions according to claim 1, characterized in that, Step S5 includes: Based on the optimized optical focusing parameters, optimized illumination parameters, and acquisition parameters, a detection prescription is formed. After the effectiveness of the detection prescription is verified by the white light interferometry module and the white light triangulation module, the effective detection prescription is loaded into the white light triangulation module to perform a scan on a set area on the chip to obtain the height information of the bumps on the set area.

3. The method for automatically creating a prescription by detecting bumps according to claim 2, characterized in that, The method of using the white light interferometer module and the white light triangulation module to verify the effectiveness of the detection prescription includes: Based on the detection prescription, the same area of ​​the chip is scanned in parallel or sequentially using the white light interferometry module and the white light triangulation module to obtain measurement results respectively; If the measurement results of the white light interferometer module and the white light triangulation module for the same protrusion are compared, and both results are within the preset error range, the detection prescription is deemed effective; otherwise, a calibration warning is triggered.

4. The bump detection method for automatically creating prescriptions according to claim 1, characterized in that, In step S2, the preset height range is set within ±10% of the provisional focal plane position, and the number of progressive scans is set to 5-10 times.

5. The method for automatically creating a prescription by detecting bumps according to claim 1, characterized in that, Step S1 includes: A white light interferometric vertical scan is performed on a reference area on the chip to obtain an interference image. The interference image or the corresponding coherent envelope signal is processed to obtain the horizontal and height position information of the bumps in the reference area, thereby obtaining the three-dimensional contour data of the bumps in the reference area.

6. The bump detection method for automatically creating prescriptions according to claim 1, characterized in that, In step S3, the intensity of the lighting source is adjusted by 1%-10% each time, and the preset optimal intensity range is 65-225.

7. The method for automatically creating a prescription by detecting bumps according to claim 1, characterized in that, In step S3, the lighting parameters include light source intensity and exposure time.

8. The method for automatically creating prescriptions by detecting bumps according to claim 1, characterized in that, In step S4, the acquisition parameters include the acquisition range in the height direction of the bump and the signal acquisition range at the top of the bump.

9. A bump detection device for automatically creating prescriptions, used to implement the detection method according to any one of claims 1-8, characterized in that, The detection device includes: Control components; Optical components, including a white light interference module and a white light triangulation module, wherein the white light interference module and the white light triangulation module are controlled by the control component to be aligned with the same area of ​​the chip; A motion stage is used to carry the chip, and the motion stage is controlled by the control component to drive the chip to move.

10. The bump detection device for automatically creating prescriptions according to claim 9, characterized in that, The detection device further includes: a microscopic imaging module for providing real-time microscopic images of the chip surface; Alternatively, the control component may include a data processing unit, which is used to compare the detection results of the white light interferometer module and the white light triangulation module to verify the effectiveness of the detection prescription.

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