Inductive element and method of manufacturing the same

Abstract

Provided are an inductance element and a manufacturing method thereof, comprising a magnetic packaging structure, a coil body embedded in the magnetic packaging structure, two extension wire segments respectively connected to two ends of the coil body, and two sealing materials. The magnetic packaging structure comprises a surface and two grooves arranged on the surface. Each extension wire segment comprises a bending portion, a pin portion and a fixing portion connected in sequence from the coil body. The bending portion extends from the coil body towards the surface of the magnetic packaging structure and penetrates the surface to be exposed outside the magnetic packaging structure. The pin portion is arranged on the surface of the magnetic packaging structure and extends from the bending portion towards the groove. The fixing portion extends from the pin portion towards the inside of the groove and extends along the sidewall of the groove to the bottom surface of the groove. The sealing material is arranged in the inside of the groove and covers the fixing portion. In this way, the electrode stability of the inductance element can be improved.

Description

Technical Field

[0001] This invention relates to an inductor, and more particularly to an inductor comprising a magnetic material and a method for manufacturing the same. Background Technology

[0002] Inductors are passive components widely used in circuit design, and their structural designs vary depending on the application requirements. One existing inductor structure uses a T-core magnetic core with a coil wound around it, and the core and coil are encapsulated in a package. The electrodes of this type of inductor are formed on the package by electroplating and are connected to the coil embedded within the package. However, because the continuity of the electroplated layers is difficult to control during the electroplating process, excessive internal stress between the plating layers leads to easy peeling of the electrode plating. Therefore, it is difficult to improve the manufacturing yield of this type of inductor, which is detrimental to mass production and market competitiveness. Summary of the Invention

[0003] Therefore, the present invention provides an inductor element that helps to improve the electrode stability of the inductor element.

[0004] The present invention also provides a method for manufacturing the above-mentioned inductor.

[0005] At least one embodiment of the present invention provides an inductor element comprising a magnetic encapsulation structure, a coil body, two extension segments, and two sealing materials. The magnetic encapsulation structure includes a surface and two recesses, with the recesses disposed on the surface. The coil body is embedded within the magnetic encapsulation structure, and the two extension segments are respectively connected to both ends of the coil body. Each extension segment includes a bend, a lead, and a fixing portion, the bend being connected to the coil body. The bend extends from the coil body toward the surface of the magnetic encapsulation structure and penetrates the surface to be exposed outside the magnetic encapsulation structure. The lead is connected to the bend and disposed on the surface of the magnetic encapsulation structure. The lead extends from the bend toward one of the recesses and is connected to the coil body via the bend. The fixing portion is connected to the lead and extends from the lead toward the interior of the recess. The fixing portion extends along the sidewall of the recess to the bottom surface of the recess, the sidewall being adjacent to the surface, and the bottom surface being recessed from the surface. The sealing materials are respectively disposed inside the recesses and cover the fixing portions.

[0006] In at least one embodiment of the present invention, the coil body is a flat wire coil.

[0007] In at least one embodiment of the present invention, the end face of the sealing material is flush with the surface of the magnetic encapsulation structure.

[0008] In at least one embodiment of the present invention, the magnetic packaging structure further includes two carrier portions disposed on the surface of the magnetic packaging structure, wherein the plane of each carrier portion protrudes from the surface of the magnetic packaging structure, and the pin portion of the extended line segment covers the plane of the carrier portion.

[0009] In at least one embodiment of the present invention, the pin portion includes a first region and two second regions. The first region is connected to the carrier portion of the magnetic packaging structure, while the second regions are respectively connected to the bending portion and the fixing portion. The second regions are suspended on the surface of the magnetic packaging structure.

[0010] In at least one embodiment of the present invention, the inductor element further includes two bonding materials respectively disposed on the planes of the carrier portion. The bonding materials are located between the carrier portion of the magnetic packaging structure and the lead portion of the extension segment.

[0011] In at least one embodiment of the present invention, the inductor further includes a protective layer covering the outer surface of the magnetic package structure, and the protective layer exposes a portion of the magnetic package structure and a portion of the extended line segment.

[0012] In at least one embodiment of the present invention, the magnetic packaging structure includes a magnetic material, which is selected from iron, iron-nickel alloys, iron-cobalt alloys, iron-silicon alloys, iron-vanadium alloys, iron-silicon-chromium alloys, iron-silicon-aluminum alloys, iron-silicon-aluminum alloys, iron-cobalt-vanadium alloys, iron-based amorphous alloys, iron-based nanocrystalline alloys, nickel-zinc ferrites, nickel-copper-zinc ferrites, manganese-zinc ferrites, or combinations thereof.

[0013] In at least one embodiment of the present invention, the sealing material comprises epoxy resin.

[0014] The present invention also provides a method for manufacturing an inductor, the method comprising: providing a coil structure, the coil structure including a coil body and two extending segments, the extending segments respectively connecting to both ends of the coil body; providing a magnetic encapsulation structure on the coil structure, the magnetic encapsulation structure including a surface and two grooves disposed on the surface, the magnetic encapsulation structure covering the coil body, the extending segments extending from the coil body toward the surface and penetrating the surface to be exposed outside the magnetic encapsulation structure; after providing the magnetic encapsulation structure, bending the extending segments toward the surface and the interior of the grooves to form a bent portion, a lead portion and a fixing portion on each extending segment, the bent portion connecting the coil body and the lead portion, the lead portion connecting the bent portion and the fixing portion, and the lead portion being disposed on the surface; and after forming the bent portion, the lead portion and the fixing portion, providing a sealing material in the interior of the grooves to cover the fixing portion.

[0015] In at least one embodiment of the present invention, the internal bending extension segment toward the surface and the groove includes: a bending extension segment toward the sidewall of the groove to form a pin portion, and the sidewall is adjacent to the surface; and a bending extension segment away from the bottom surface of the groove to form a fixing portion, and the bottom surface is recessed into the surface.

[0016] In at least one embodiment of the present invention, the method of manufacturing an inductor further includes: before bending the extension segment toward the surface and the interior of the groove, providing a bonding material on the extension segment, so that after bending the extension segment toward the surface and the interior of the groove, the bonding material is located between the surface of the magnetic package structure and the pin portion.

[0017] In at least one embodiment of the present invention, the magnetic encapsulation structure is provided by means of die casting integral molding.

[0018] Based on the above, since the inductor in at least one embodiment of the present invention is disposed on the surface of the magnetic package structure by bending an extension segment to serve as the electrode of the inductor, it is not necessary to form the electrode of the inductor on the surface of the magnetic package structure by electroplating, thus saving manufacturing costs. Furthermore, the present invention performs a second bend on a portion of the extension segment to form a lead portion and a fixing portion, and uses a sealing material to encapsulate the fixing portion in the groove of the magnetic package structure, thereby increasing the bonding strength between the extension segment and the magnetic package structure, ensuring that the extension segment is not affected by high vibration and will not detach from the surface of the magnetic package structure (i.e., reducing the possibility of electrode peeling). In this way, the electrode stability of the inductor can be improved. Attached Figure Description

[0019] Embodiments of the invention can be understood from the following detailed description and accompanying drawings. It should be noted that many features are not drawn to industry-standard scale. In fact, for clarity of discussion, the dimensions of various features may be arbitrarily increased or decreased.

[0020] Figure 1 A perspective view of an inductor element according to an embodiment of the present invention is shown.

[0021] Figure 2 Draw Figure 1 A cross-sectional view of the inductor element along section C in an embodiment.

[0022] Figures 3A to 3B A perspective view illustrating a method for manufacturing an inductor element according to an embodiment of the present invention is shown.

[0023] Figure 4 A flowchart illustrating a method for manufacturing an inductor element according to an embodiment of the present invention is shown. Detailed Implementation

[0024] The present invention will be described in detail with reference to the following embodiments. It should be noted that the following description of the embodiments of the present invention is for illustrative purposes only and is not intended to disclose all embodiments exhaustively or to limit the specific embodiments of the invention. For example, the phrase "a first feature is formed on a second feature" in the description includes various implementations, covering both situations where the first and second features are in direct contact, and situations where an additional feature is formed between the first and second features so that they are not in direct contact. Furthermore, the same element symbols used in the drawings and specification will, as far as possible, represent the same or similar elements.

[0025] In the following text, to clearly present the technical features of the present invention, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions) in the accompanying drawings will be enlarged proportionally. Therefore, the description and explanation of the embodiments below are not limited to the dimensions and shapes presented by the elements in the drawings, but should cover dimensions, shapes, and deviations from both due to actual manufacturing processes and / or tolerances. For example, a flat surface shown in the drawings may have rough and / or non-linear characteristics, and an acute angle shown in the drawings may be rounded. Therefore, the elements presented in the accompanying drawings of the present invention are primarily for illustrative purposes and are not intended to precisely depict the actual shape of the elements, nor are they intended to limit the claims of the present invention.

[0026] Please refer to Figure 1 and Figure 2 ,in Figure 1 An inductor element 100 according to at least one embodiment of the present invention is illustrated, while Figure 2 The diagram shows a cross-sectional view of the inductor 100 along section CS. The inductor 100 includes a magnetic encapsulation structure 120, a coil body 140, two extension segments 160, and sealing materials 180a and 180b. The magnetic encapsulation structure 120 includes a surface 120s and two recesses 122 disposed on the surface 120s. In various embodiments of the invention, the magnetic encapsulation structure 120 may be composed of a magnetic material and a binder material, wherein the magnetic material may include at least one of crystalline magnetic metal powder and amorphous magnetic metal powder.

[0027] Specifically, the aforementioned magnetic materials can be selected from iron, iron-nickel alloys, iron-cobalt alloys, iron-silicon alloys, iron-vanadium alloys, iron-silicon-chromium alloys, iron-silicon-aluminum alloys, iron-silicon-aluminum alloys, iron-cobalt-vanadium alloys, iron-based amorphous alloys, iron-based nanocrystalline alloys, nickel-zinc ferrites, nickel-copper-zinc ferrites, manganese-zinc ferrites, or combinations thereof. The binder material can be selected from epoxy resin, polysiloxane resin, acrylic resin, phenolic resin, polyvinyl alcohol, or combinations thereof. Notably, by mixing magnetic material powders of different particle sizes, the relative permeability and saturation magnetic field strength of the magnetic encapsulation structure 120 can be adjusted.

[0028] The coil body 140 is embedded within the magnetic encapsulation structure 120, and two extension segments 160 are respectively connected to the two ends of the coil body 140. Specifically, the coil body 140 is formed by winding a conductor (not shown) along the axis A1, and can be formed using a flat winding method or an alpha winding method. The conductor may include an inner conductive wire and an insulating coating layer disposed outside the inner conductive wire, but the conductor structure of the present invention is not limited thereto. Although in this embodiment, the coil body 140 is a flat conductor coil (i.e., the conductor wound to form the coil body 140 is a flat conductor), in other embodiments, the coil body 140 may also be a circular conductor coil.

[0029] like Figure 2 As shown, each extension segment 160 includes a bending portion 162, a lead portion 164, and a fixing portion 166. The bending portion 162 connects to the coil body 140. Furthermore, the bending portion 162 extends from the coil body 140 toward the surface 120s of the magnetic encapsulation structure 120, and penetrates the surface 120s to be exposed outside the magnetic encapsulation structure 120. The lead portion 164 is connected to the bending portion 162 and is disposed on the surface 120s of the magnetic encapsulation structure 120. The lead portion 164 extends from the bending portion 162 toward one of the recesses 122, and the lead portion 164 is connected to the coil body 140 through the bending portion 162.

[0030] On the other hand, the fixing part 166 connects to the lead part 164 and extends from the lead part 164 toward the interior of the groove 122. Specifically, the fixing part 166 extends along the sidewall 122w of the groove 122 to the bottom surface 122b of the groove 122, wherein the sidewall 122w of the groove 122 abuts the surface 120s, and the bottom surface 122b of the groove 122 is recessed into the surface 120s. Notably, the lead part 164 is not directly connected to the coil body 140, and the fixing part 166 is not directly connected to the bending part 162 and the lead part 164. That is, starting from the intersection point P1 of the coil body 140 and the extension segment 160, the sequence is bending part 162, lead part 164, and fixing part 166.

[0031] Sealing materials 180a and 180b are respectively disposed inside the groove 122, and the sealing materials 180a and 180b cover the fixing part 166. Please refer to this for further information. Figure 1 and Figure 2 Sealing materials 180a and 180b completely fill the interior of the groove 122 and cover the sidewalls 122w and bottom surface 122b of the groove 122. Therefore, the fixing portion 166 can be fixed inside the groove 122 by the sealing materials 180a and 180b to improve the bonding strength between the extension segment 160 and the magnetic encapsulation structure 120. Furthermore, although the end face ED of the sealing material 180a (or sealing material 180b) is flush with the surface 120s of the magnetic encapsulation structure 120 in this embodiment, the invention is not limited to this; the end face ED may also protrude or be recessed into the surface 120s of the magnetic encapsulation structure 120. Sealing materials 180a and 180b may include, but are not limited to, epoxy resin.

[0032] It is worth mentioning that, in this embodiment, the bending point P2 included in the bending portion 162 of the extended line segment 160 is not a right angle, but rather an arc. To ensure that the lead portion 164 of the extended line segment 160 is flat against the magnetic packaging structure 120, the magnetic packaging structure 120 further includes two support portions 124, which are disposed on the surface 120s of the magnetic packaging structure 120. The plane 124p of each support portion 124 protrudes from the surface 120s of the magnetic packaging structure 120, and the lead portion 164 of the extended line segment 160 covers the plane 124p of the support portion 124. In this way, even if the bending point P2 included in the bending portion 162 is not a right angle, the lead portion 164 can still be flat against the magnetic packaging structure 120.

[0033] However, the aforementioned support portion 124 causes a portion of the pin portion 164 to be suspended above the surface 120s of the magnetic packaging structure 120. Specifically, the pin portion 164 includes a first region 164a and two second regions 164b, wherein the first region 164a is connected to the support portion 124 of the magnetic packaging structure 120. On the other hand, the two second regions 164b are respectively connected to the bending portion 162 and the fixing portion 166, and the second regions 164b are suspended above the surface 120s of the magnetic packaging structure 120. It is worth noting that although a portion of the pin portion 164 is suspended above the surface 120s of the magnetic packaging structure 120 in this embodiment, the present invention is not limited thereto. In other embodiments, the two ends of the support portion 124 (i.e....) Figure 2 The left and right ends of the middle bearing portion 124 can also extend to the two ends of the aligning pin portion 164 (i.e., Figure 2 (The left and right ends of the middle pin portion 164) so ​​that the pin portion 164 is not suspended on the surface 120s of the magnetic package structure 120.

[0034] like Figure 2 As shown, the inductor 100 also includes two bonding materials 150, which are respectively disposed on the plane 124p of the carrier portion 124. The bonding materials 150 are located between the carrier portion 124 of the magnetic package structure 120 and the lead portion 164 of the extension segment 160, thereby bonding the carrier portion 124 of the magnetic package structure 120 and the lead portion 164 of the extension segment 160. The bonding materials 150 may contain nickel, tin, similar solder metals, or other non-metallic materials, such as epoxy resin, polyimide, or similar bonding materials. Notably, in various embodiments, the inductor 100 is not limited to including bonding materials 150. In other words, in some embodiments, the inductor 100 may not include bonding materials 150. Therefore, the plane 124p of the carrier portion 124 can directly contact the lead portion 164 (not shown) of the extension segment 160.

[0035] Depend on Figures 3A to 3B The following steps illustrate the manufacturing method of the inductor element 100 in at least one embodiment of the present invention. Figure 4 This is a flowchart illustrating a method for manufacturing an inductor element 100 according to at least one embodiment of the present invention. Please refer to... Figure 4 First, in step S1, a coil structure is provided, comprising a coil body and two extending segments. Next, in step S2, a magnetic encapsulation structure is provided on the coil structure, comprising a surface and two grooves disposed on the surface. Then, in step S3, the extending segments are bent toward the surface and the interior of the grooves to form a bend, a lead, and a fixing portion on each extending segment. Finally, in step S4, a sealing material is disposed within the grooves. The above steps will be described in detail below.

[0036] Please refer to Figure 3A First, a coil structure (not shown) is provided, which includes a coil body 140 and two extension segments 160. The extension segments 160 are respectively connected to both ends of the coil body 140. Next, a magnetic encapsulation structure 120 can be integrally formed on the coil structure by die casting.

[0037] The die-casting process involves placing a coil structure into a mold cavity and filling the cavity with powder containing magnetic and binder materials to form a magnetic encapsulation structure 120. Next, a stamping press is used to extrude the powder into the mold cavity, causing it to coat a portion of the coil structure (including the coil body 140 and a portion of the extension segment 160) and form an initial encapsulation (not shown). Pressure is applied to the powder using the stamping press, causing it to be extruded and fill the gap between the mold cavity and the coil structure. After forming the initial encapsulation through, for example, cold pressing or hot pressing at different temperatures, it is removed from the mold.

[0038] In addition, in the die-casting integral molding step of this embodiment, after the initial package is removed, the initial package can be heat-treated, such as cured by baking, to further solidify the initial package and form the magnetic package structure 120. The magnetic package structure 120 covers the coil body 140. The magnetic package structure 120 includes a surface 120s and two grooves 122 provided on the surface 120s. An extension segment 160 extends from the coil body 140 toward the surface 120s and penetrates the surface 120s to be exposed on the outside of the magnetic package structure 120.

[0039] Next, in some embodiments, a protective layer can be formed on the outer surface (including surface 120s) of the magnetic packaging structure 120 by means of, for example, spray coating. This protective layer may include, for example, epoxy resin or similar insulating materials. In addition, in some embodiments, the protective layer is also formed on the extended line segment 160 exposed outside the magnetic packaging structure 120. After the protective layer is formed, a portion of the protective layer can be removed by means of, for example, laser cutting or laser ablation, to expose a portion of the magnetic packaging structure 120 (i.e., the groove 122 of the magnetic packaging structure 120) and a portion of the extended line segment 160. It is worth noting that some embodiments of the present invention may also include, but are not limited to, a step of, for example, terminal cutting, on the extended line segment 160 to adjust the length of the extended line segment 160 exposed outside the magnetic packaging structure 120.

[0040] After setting up the magnetic encapsulation structure 120, please refer to... Figure 3B The extension segment 160 can be bent toward the inside of the surface 120s and the groove 122 by mechanical processing, so that a bending portion 162, a lead portion 164, and a fixing portion 166 are formed on each extension segment 160. The bending portion 162 connects the coil body 140 and the lead portion 164, and the lead portion 164 connects the bending portion 162 and the fixing portion 166, and the lead portion 164 is provided on the surface 120s.

[0041] Before bending the extension segment 160 toward the surface 120s and the interior of the groove 122, a bonding material 150 (illustrated in) can be applied to the extension segment 160 by means of, for example, tinning or coating. Figure 2 After bending the extension segment 160 toward the surface 120s and the interior of the groove 122, the adhesive material 150 can be positioned between the surface 120s and the lead portion 164 of the magnetic package structure 120. In other words, providing the adhesive material 150 on the extension segment 160 allows the extension segment 160 exposed outside the magnetic package structure 120 to be bonded to the magnetic package structure 120. However, the present invention is not limited to providing the adhesive material 150 on the extension segment 160. In some embodiments, the adhesive material 150 may also be provided on the surface 120s of the magnetic package structure 120 or the support portion 124 (marked as shown in the figure). Figure 2 On the ), so that the extension segment 160 can be joined to the magnetic encapsulation structure 120.

[0042] In detail, the step of extending the inner bending line segment 160 toward the surface 120s and the groove 122 may include: toward the sidewall 122w of the groove 122 (indicated by...) Figure 2 A portion of the extended line segment 160 is bent to form the pin portion 164. Additionally, this step may include: the bottom surface 122b (marked in...) away from the recess 122. Figure 2 A portion of the extended line segment 160 is bent to form a fixing part 166. The side wall 122w is adjacent to the surface 120s, while the bottom surface 122b is recessed into the surface 120s.

[0043] After forming the bending portion 162, the pin portion 164, and the fixing portion 166, sealing materials 180a and 180b (illustrated in the figure) can be applied to the inside of the groove 122 by dispensing. Figure 1 Furthermore, the sealing materials 180a and 180b are covered with the fixing portion 166 by means of, for example, baking. Thus, the inductor element 100 of at least one embodiment of the present invention is substantially completed.

[0044] In summary, because the coil structure of the inductor element of this invention uses a flat wire coil, and the extended segment is bent and disposed on the surface of the magnetic package structure to serve as the electrode of this inductor element, it is not necessary to form the electrode of the inductor element on the surface of the magnetic package structure through electroplating, thus saving manufacturing costs. Furthermore, this invention performs a second bend on the extended segment, which is part of the inductor element electrode, to form a lead portion and a fixing portion, and uses a sealing material to encapsulate the fixing portion in the groove of the magnetic package structure. This increases the bonding strength between the extended segment and the magnetic package structure, ensuring that the extended segment is not affected by high vibration and will not detach from the surface of the magnetic package structure (i.e., reducing the possibility of electrode peeling), thereby improving the electrode stability and process yield of the inductor element.

[0045] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the invention. Those skilled in the art to which this invention pertains may make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of this invention shall be determined by the appended claims.

[0046] [Symbol Explanation]

[0047] 100: Inductor

[0048] 120: Magnetic packaging structure

[0049] 120s: Surface

[0050] 122: Groove

[0051] 122w: Sidewall

[0052] 122b: Bottom surface

[0053] 124: Bearing section

[0054] 124p: Flat

[0055] 140: Coil body

[0056] 150: Next material

[0057] 160: Extended line segment

[0058] 162: Bending section

[0059] 164: Pin section

[0060] 164a: Region 1

[0061] 164b: Second Region

[0062] 166: Fixing part

[0063] 180a, 180b: Sealing materials

[0064] 190: Protective layer

[0065] A1: Axis

[0066] CS: Section

[0067] ED: End face

[0068] P1: Handover Point

[0069] P2: Bend point

[0070] S1~S4: Steps.

Claims

1. An inductor element, characterized in that, include: A magnetic encapsulation structure includes a surface and two grooves, wherein the grooves are disposed on the surface; The coil body is embedded in the magnetic encapsulation structure; Two extension segments, respectively connecting the two ends of the coil body, wherein each of the extension segments includes: A bend, connecting the coil body, wherein the bend extends from the coil body toward the surface of the magnetic encapsulation structure and penetrates the surface to be exposed outside the magnetic encapsulation structure; A lead portion is connected to the bend portion and disposed on the surface of the magnetic package structure, wherein the lead portion extends from the bend portion toward one of the grooves, and the lead portion is connected to the coil body through the bend portion; A fixing part is connected to the pin portion and extends from the pin portion toward the interior of the groove, wherein the fixing part extends along the sidewall of the groove to the bottom surface of the groove, and the sidewall is adjacent to the surface, while the bottom surface is recessed into the surface; as well as Two sealing materials are respectively disposed inside the groove and cover the fixing part.

2. The inductor element according to claim 1, characterized in that, The coil body is a flat wire coil.

3. The inductor element according to claim 1, characterized in that, The end face of the sealing material is flush with the surface of the magnetic encapsulation structure.

4. The inductor element according to claim 1, characterized in that, The magnetic packaging structure further includes: Two carrier portions are disposed on the surface of the magnetic package structure, wherein the plane of each of the carrier portions protrudes from the surface of the magnetic package structure, and the pin portion of the extension segment covers the plane of the carrier portion.

5. The inductor element according to claim 4, characterized in that, The pin portion includes: The first region, connecting the carrier portion of the magnetic encapsulation structure; and Two second regions are respectively connected to the bending portion and the fixing portion, wherein the second regions are suspended on the surface of the magnetic encapsulation structure.

6. The inductor element according to claim 4, characterized in that, Also includes: Two adhesive materials are respectively disposed on the plane of the carrier portion, wherein the adhesive materials are located between the carrier portion of the magnetic packaging structure and the pin portion of the extension segment.

7. The inductor element according to claim 1, characterized in that, Also includes: A protective layer covers the outer surface of the magnetic packaging structure, and the protective layer exposes a portion of the magnetic packaging structure and a portion of the extended line segment.

8. The inductor element according to claim 1, characterized in that, The magnetic packaging structure includes a magnetic material, which is selected from iron, iron-nickel alloys, iron-cobalt alloys, iron-silicon alloys, iron-vanadium alloys, iron-silicon-chromium alloys, iron-silicon-aluminum alloys, iron-silicon-aluminum alloys, iron-cobalt-vanadium alloys, iron-based amorphous alloys, iron-based nanocrystalline alloys, nickel-zinc ferrites, nickel-copper-zinc ferrites, manganese-zinc ferrites, or combinations thereof.

9. The inductor element according to claim 1, characterized in that, The sealing material includes epoxy resin.

10. A method for manufacturing an inductor element, characterized in that, include: A coil structure is provided, the coil structure comprising: Coil body; and Two extended line segments connect the two ends of the coil body, respectively; A magnetic encapsulation structure is provided on the coil structure, wherein the magnetic encapsulation structure includes a surface and two grooves provided on the surface, and the magnetic encapsulation structure covers the coil body, wherein the extended line segment extends from the coil body toward the surface and penetrates the surface to be exposed outside the magnetic encapsulation structure; After setting the magnetic encapsulation structure, the extended line segment is bent toward the surface and the interior of the groove to form a bend, a pin, and a fixing portion on each of the extended line segment, wherein the bend connects the coil body and the pin, the pin connects the bend and the fixing portion, and the pin is disposed on the surface; and After forming the bending portion, the pin portion, and the fixing portion, a sealing material is respectively provided inside the groove so that the sealing material covers the fixing portion.

11. The method according to claim 10, characterized in that, Bending the extended line segment toward the surface and the interior of the groove includes: The extended line segment is bent toward the sidewall of the groove to form the pin portion, wherein the sidewall abuts the surface; and The extended line segment is bent away from the bottom surface of the groove to form the fixing part, wherein the bottom surface is recessed into the surface.

12. The method according to claim 10, characterized in that, Also includes: Before bending the extension segment toward the surface and the interior of the groove, an adhesive material is provided on the extension segment so that after bending the extension segment toward the surface and the interior of the groove, the adhesive material is located between the surface of the magnetic package structure and the pin portion.

13. The method according to claim 10, characterized in that, The magnetic packaging structure can be configured by die casting as a single unit.

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