Air-cooled semiconductor refrigerator

Abstract

The application discloses a forced air cooling semiconductor refrigerator and relates to the technical field of vehicle-mounted refrigerators. The semiconductor refrigerator comprises a box assembly, a door body assembly, a refrigeration unit assembly, an air duct structure and an in-box fan, and a refrigeration chamber is formed in the box assembly. The air duct structure arranged in the box assembly is used for connecting the internal radiator of the refrigeration unit assembly with the refrigeration chamber, and the in-box fan arranged in the air duct structure is used for driving air to form forced convection circulation, so that the cold quantity transmission mode of the conventional semiconductor refrigerator relying on natural convection or simple turbulence is changed. The structure enables the cold quantity generated by the internal radiator to be quickly and uniformly transported to each region of the refrigeration chamber through the air duct structure, effectively avoids the problems of serious loss of the cold quantity in the transmission process and uneven temperature distribution in the box caused by the simple combination of the refrigeration unit and the box, and realizes the quick and uniform cooling effect in the refrigeration chamber.

Description

Technical Field

[0001] This invention relates to the field of semiconductor refrigerator technology, and particularly to an air-cooled semiconductor refrigerator. Background Technology

[0002] Semiconductor refrigerators utilize the Peltier effect for refrigeration. Due to their advantages such as no compressor, no noise, no vibration, environmental friendliness, and portability, they are widely used in automotive applications. Traditional semiconductor refrigerators mostly employ conductive or direct cooling structures, where the cold end of the semiconductor cooling element is placed close to the inner wall of the refrigerator or the evaporator, utilizing natural convection or simple fan turbulence to lower the internal temperature.

[0003] However, the aforementioned structures have significant limitations: the cold air transfer path is singular, relying mainly on heat conduction and limited natural convection, resulting in uneven temperature distribution within the refrigerator, large local temperature differences, and low cooling efficiency. Although some solutions have attempted to use forced convection with fans, they often neglect the rational design of the air duct and efficient cold air transfer. Most structures still simply combine the refrigeration unit with the refrigerator body, resulting in significant cold air loss during transmission and making it difficult to achieve rapid and uniform cooling. Furthermore, traditional designs also have many shortcomings in terms of refrigerator body sealing, door durability, and overall assembly convenience. Therefore, how to design a semiconductor refrigerator with a rational air duct structure, high cold air transfer efficiency, uniform internal temperature, and a stable and durable structure has become a pressing technical problem to be solved in this field. Summary of the Invention

[0004] This invention provides an air-cooled semiconductor refrigerator, which can solve the problem that most existing technologies still simply combine the refrigeration unit with the cabinet, resulting in significant loss of cold energy during transmission and making it difficult to achieve rapid and uniform cooling.

[0005] A wind-cooled semiconductor refrigerator includes a cabinet assembly, a door assembly, a refrigeration unit assembly, an air duct structure, and an internal fan. The cabinet assembly has a refrigeration compartment formed inside. The door assembly is movably connected to the cabinet assembly for opening and closing the refrigeration compartment. The refrigeration unit assembly is disposed within the cabinet assembly and generates cooling capacity. The refrigeration unit assembly includes a semiconductor cooling chip and an internal heat sink thermally connected to the cold end of the semiconductor cooling chip. The air duct structure is formed inside the cabinet assembly and communicates with the refrigeration compartment and the internal heat sink. The internal fan is disposed within the air duct structure and drives air to form a forced convection circulation between the internal heat sink and the refrigeration compartment.

[0006] The air-cooled semiconductor refrigerator provided by this invention has, but is not limited to, the following beneficial effects compared to the prior art: This air-cooled semiconductor refrigerator connects the internal heat sink of the refrigeration unit to the refrigeration compartment through an air duct structure set inside the cabinet assembly. An internal fan within the air duct structure drives the air to form a forced convection circulation, thus changing the traditional semiconductor refrigerator's method of transferring cold energy by relying solely on natural convection or simple turbulence. This structure allows the cold energy generated by the internal heat sink to be quickly and evenly transported to all areas of the refrigeration compartment through the air duct structure, effectively avoiding the serious loss of cold energy during transmission and uneven temperature distribution inside the cabinet caused by the simple combination of the refrigeration unit and the cabinet, achieving a rapid and uniform cooling effect inside the refrigeration compartment.

[0007] Furthermore, the refrigeration unit assembly also includes an external heat sink for dissipating heat from the hot end of the thermoelectric cooler and an external fan for driving airflow through the external heat sink. The thermoelectric cooler is sandwiched between the internal heat sink and the external heat sink and is integrated into one unit through the refrigeration unit foaming component.

[0008] Furthermore, the housing assembly includes a foamed housing component, which has an installation through hole. The refrigeration unit component is embedded in the installation through hole, the internal radiator faces the refrigeration compartment, and the external radiator faces the outside of the housing assembly.

[0009] Furthermore, the door assembly includes an outer door panel and an inner door panel. The inner door panel is connected to the housing assembly, and a door frame sealing strip is provided between the inner door panel and the housing assembly. The outer door panel is connected to the inner door panel, and a decorative strip is provided on the outer door panel.

[0010] Furthermore, the enclosure assembly also includes a temperature probe for detecting the temperature of the refrigeration chamber and a PCB board for controlling the refrigeration and air supply operations. The temperature probe and the fan inside the enclosure are both electrically connected to the PCB board.

[0011] Furthermore, the cabinet assembly is provided with a drawer assembly, and the drawers of the drawer assembly are slidably disposed in the refrigeration room via a slide rail mechanism, the slide rail mechanism including a slide rail installed on the drawer and a guide rail mounting seat installed on the cabinet assembly.

[0012] Furthermore, the guide rail mounting base is provided with a damper and a buffer pin to provide cushioning and damping force when the drawer assembly is closed in place.

[0013] Furthermore, the refrigerator door lock assembly is provided on the cabinet assembly. The refrigerator door lock assembly includes a lock base and a lock tongue connected thereto. The lock tongue is rotatably connected to the cabinet assembly via a rotating shaft, and a refrigerator coil spring is sleeved on the rotating shaft. A door return spring for driving the lock tongue to return to its original position is provided on the lock base. A corresponding latch structure that cooperates with the lock tongue is provided on the door assembly.

[0014] Furthermore, the refrigerator door lock assembly also includes an unlock button, which is connected to the latch and is used to drive the latch to rotate to disengage from the locked state of the latch structure.

[0015] Furthermore, a radiator protective cover is provided on the external radiator, and protective foam is provided on both sides of the radiator protective cover. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of an air-cooled semiconductor refrigerator according to an embodiment of the present invention; Figure 2 for Figure 1 Schematic diagram of the structure of the refrigeration unit assembly; Figure 3 for Figure 1 Schematic diagram of the refrigerator door lock assembly; Figure 4 for Figure 1 Schematic diagram of the middle door assembly; Figure 5 for Figure 3 A schematic diagram of the middle drawer assembly.

[0017] Explanation of reference numerals in the attached figures: 1. Cabinet assembly; 2. Door assembly; 3. Refrigeration unit assembly; 4. Air duct structure; 5. Internal fan; 6. Drawer assembly; 7. Refrigerator door lock assembly; 8. Radiator protective cover; 9. Protective foam; 31. Semiconductor cooling chip; 32. Internal radiator; 33. External radiator; 34. External fan; 35. Refrigeration unit foam component; 101. Foamed cabinet assembly; 102. Temperature probe; 103. PCB board; 201. Outer door panel; 202. Inner door panel; 203. Door frame sealing strip; 204. Decorative strip; 61. Drawer; 62. Slide rail; 63. Guide rail mounting base; 71. Lock base; 72. Lock tongue; 73. Spindle; 74. Refrigerator coil spring; 75. Door return spring; 76. Unlock button. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings showing multiple embodiments according to this application. It should be understood that the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments described in this application without creative effort will fall within the scope of protection of this application.

[0019] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing specific embodiments only and is not intended to limit this application; the terms "comprising," "including," "having," "containing," etc., in the description, claims, and accompanying drawings of this application are open-ended terms. Therefore, "comprising," "including," or "having" refers to, for example, a method or apparatus having one or more steps or elements, but is not limited to having only these one or more elements. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0020] In the description of this invention, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0021] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0022] It should be emphasized that when the term "comprising / including" is used in this specification, it is used to explicitly indicate the presence of the stated feature, integer, step, or component, but does not exclude the presence or addition of one or more other features, integers, steps, components, or groups of features, integers, steps, or components.

[0023] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0024] like Figure 1-3 As shown in the figure, an embodiment of the present invention provides a wind-cooled semiconductor refrigerator, including a cabinet assembly 1, a door assembly 2, a refrigeration unit assembly 3, an air duct structure 4, and an internal fan 5. The cabinet assembly 1 has a refrigeration compartment formed inside. The door assembly 2 is movably connected to the cabinet assembly 1 for opening and closing the refrigeration compartment. The refrigeration unit assembly 3 is disposed inside the cabinet assembly 1 for generating cooling capacity. The refrigeration unit assembly 3 includes a semiconductor cooling chip 31 and an internal heat sink 32 thermally connected to the cold end of the semiconductor cooling chip 31. The air duct structure 4 is formed inside the cabinet assembly 1 and communicates with the refrigeration compartment and the internal heat sink 32. The internal fan 5 is disposed inside the air duct structure 4 for driving air to form a forced convection circulation between the internal heat sink 32 and the refrigeration compartment.

[0025] In this embodiment, the internal heat sink 32 of the refrigeration unit assembly 3 is connected to the refrigeration compartment through the air duct structure 4 set inside the cabinet assembly 1. The internal fan 5 set inside the air duct structure 4 drives the air to form a forced convection circulation, thereby changing the traditional semiconductor refrigerator's cold energy transfer method that relies solely on natural convection or simple turbulence. This structure allows the cold energy generated by the internal heat sink 32 to be quickly and evenly transported to various areas of the refrigeration compartment through the air duct structure 4, effectively avoiding the serious loss of cold energy during transmission and uneven temperature distribution inside the cabinet caused by the simple combination of the refrigeration unit and the cabinet, and achieving a rapid and uniform cooling effect inside the refrigeration compartment.

[0026] Figure 1 and Figure 2 As shown, the cooling unit assembly 3 also includes an external heat sink 33 for dissipating heat from the hot end of the thermoelectric cooler 31 and an external fan 34 for driving airflow through the external heat sink 33. The thermoelectric cooler 31 is sandwiched between the internal heat sink 32 and the external heat sink 33 and is integrated into one unit through the cooling unit foaming component 35.

[0027] In this embodiment, by sandwiching the semiconductor cooling chip 31 between the internal heat sink 32 and the external heat sink 33, and integrating the three into a single cooling unit assembly 3 using the cooling unit foaming component 35, and simultaneously coordinating with the external fan 34 to drive airflow through the external heat sink 33, a highly efficient and compact hot-end heat dissipation system is constructed. This allows the heat generated at the hot end of the semiconductor cooling chip 31 to be quickly carried away by the external fan 34 through the external heat sink 33, effectively avoiding the negative impact of heat accumulation at the hot end on cooling efficiency. At the same time, the cooling unit foaming component 35 not only ensures reliable isolation and positioning between the internal heat sink 32 and the external heat sink 33, but also improves the structural stability and assembly consistency of the entire cooling unit assembly 3, thereby solving the problem of low overall cooling efficiency in traditional semiconductor refrigerators caused by the dispersed arrangement of various components of the cooling unit and poor heat dissipation at the hot end.

[0028] Figure 1 and Figure 3 As shown, the housing assembly 1 includes a foamed housing component 101, which has an installation through hole. The refrigeration unit component 3 is embedded in the installation through hole, with the internal radiator 32 facing the refrigeration chamber and the external radiator 33 facing the outside of the housing assembly 1.

[0029] In this embodiment, by opening an installation through hole on the foamed housing assembly 101 and embedding the refrigeration unit assembly 3 in the installation through hole, the internal radiator 32 faces the refrigeration chamber and the external radiator 33 faces the outside of the housing assembly 1. This achieves precise and compact assembly of the refrigeration unit assembly 3 and the housing assembly 1, reducing the space occupied. The thermal insulation material of the foamed housing assembly 101 itself effectively isolates the space where the internal radiator 32 and the external radiator 33 are located, blocking the path of heat conduction from the hot end to the cold end through the housing, avoiding the loss of cooling capacity caused by heat backflow. At the same time, this structure also ensures that the external radiator 33 can directly exchange heat with the external environment, significantly improving the heat dissipation efficiency.

[0030] Figure 1 and Figure 3 As shown, the door assembly 2 includes an outer door panel 201 and an inner door panel 202. The inner door panel 202 is connected to the housing assembly 1. A door frame sealing strip 203 is provided between the inner door panel 202 and the housing assembly 1. The outer door panel 201 is connected to the inner door panel 202. A decorative strip 204 is provided on the outer door panel 201.

[0031] In this embodiment, a double-layer door structure is formed by connecting the outer door panel 201 to the inner door panel 202, and an elastic compression seal is formed by the door frame sealing strip 203 between the inner door panel 202 and the cabinet assembly 1. At the same time, a decorative strip 204 is provided on the outer door panel 201. This allows the inner door panel 202 to be reliably connected to the cabinet assembly 1 as a structural support. The door frame sealing strip 203 is uniformly compressed when the door is closed, effectively filling the gap between the door and the cabinet and preventing cold air leakage. The outer door panel 201 and the decorative strip 204 on it not only enhance the overall structural strength of the door, but also improve the appearance and texture of the product. This solves the problems of poor sealing, reduced heat preservation performance, and monotonous appearance design caused by the single sealing structure of traditional refrigerator doors.

[0032] Figure 2 and Figure 3 As shown, the enclosure assembly 1 also includes a temperature probe 102 for detecting the temperature of the cooling room and a PCB board 103 for controlling the cooling and air supply. The temperature probe 102 and the fan 5 inside the enclosure are both electrically connected to the PCB board 103.

[0033] In this embodiment, the temperature inside the refrigerator is detected in real time by the temperature probe 102, and the temperature signal is transmitted to the PCB board 103. The PCB board 103 precisely controls the start, stop and speed of the fan 5 inside the refrigerator according to the preset temperature logic, and at the same time coordinates the working state of the refrigeration unit component 3. This closed-loop control system ensures that the fan 5 inside the refrigerator only runs with an appropriate air volume when cooling is needed, avoiding unnecessary continuous operation and overshoot of cooling capacity, and ensuring the accurate and constant temperature of the refrigerator room. At the same time, through the coordinated management of refrigeration and air supply by the PCB board 103, energy waste and temperature fluctuations caused by the lack or simplification of control logic are effectively reduced, solving the problems of traditional semiconductor refrigerators that are difficult to achieve precise temperature control and have high energy consumption.

[0034] Figure 3 and Figure 4 As shown, the cabinet assembly 1 is provided with a drawer assembly 6. The drawer 61 of the drawer assembly 6 is slidably disposed in the refrigeration room through a slide rail mechanism. The slide rail mechanism includes a slide rail 62 installed on the drawer 61 and a guide rail mounting seat 63 installed on the cabinet assembly 1.

[0035] In this embodiment, the drawer 61 of the drawer assembly 6 is slidably mounted in the refrigeration chamber using a slide rail mechanism. The structure in which the slide rail 62 installed on the drawer 61 cooperates with the guide rail mounting seat 63 installed on the cabinet assembly 1 achieves a reliable sliding connection between the drawer 61 and the cabinet assembly 1. This allows the drawer 61 to be pushed and pulled in and out smoothly, making it convenient for users to store and retrieve items. At the same time, the precise cooperation between the slide rail 62 and the guide rail mounting seat 63 ensures the stability of the drawer 61 during the sliding process, avoiding shaking or jamming, and improving the smoothness of user operation.

[0036] The guide rail mounting base 63 is equipped with a damper and a buffer pin to provide cushioning and damping force when the drawer assembly 6 is closed. By integrating the damper and buffer pin into the guide rail mounting base 63, when the drawer assembly 6 is closed to the predetermined stroke, the damper first intervenes and provides a linearly increasing damping force, effectively slowing down the closing speed of the drawer 61 and avoiding violent impact caused by rapid closing. At the moment the drawer assembly 6 is fully closed, the buffer pin, with its elastic material, contacts the corresponding part of the drawer 61 or the slide rail 62 to form a soft stop, further absorbing residual impact energy. This achieves smooth and quiet control throughout the entire drawer closing process, significantly improving the smoothness and quality of user operation, while effectively preventing deformation or damage to components such as the drawer 61 and slide rail 62 caused by long-term violent collisions.

[0037] Figure 3 and Figure 5 As shown, a refrigerator door lock assembly 7 is provided on the cabinet assembly 1. The refrigerator door lock assembly 7 includes a lock base 71 and a lock tongue 72 connected thereto. The lock tongue 72 is rotatably connected to the cabinet assembly 1 through a rotating shaft 73, and a refrigerator coil spring 74 is sleeved on the rotating shaft 73. A door return spring 75 for driving the lock tongue 72 to reset is provided on the lock base 71. A corresponding latch structure that cooperates with the lock tongue 72 is provided on the door assembly 2.

[0038] In this embodiment, the latch 72 is rotatably connected to the cabinet assembly 1 via a pivot 73, and a refrigerator coil spring 74 is sleeved on the pivot 73. Simultaneously, a door return spring 75 is installed on the lock base 71, cooperating with the latch structure on the door assembly 2. When the door is closed, the latch structure pushes the latch 72 to rotate around the pivot 73 and compresses the door return spring 75 until the latch passes the latch 72. Then, the door return spring 75 drives the latch 72 to automatically return to its original position, achieving locking. Simultaneously, the refrigerator coil spring 74 continuously provides closing torque during door closing, ensuring the door sealing strip is fully compressed. This achieves automatic locking and reliable sealing of the door, preventing cold air leakage due to insufficient closing force. Furthermore, the door return spring 75 ensures that the latch 72 automatically returns to its original position after unlocking, improving the smoothness and reliability of operation and solving the problems of complex structure, unreliable closing force, or easy jamming of traditional refrigerator door locks.

[0039] Figure 2 and Figure 3 As shown, the refrigerator door lock assembly 7 also includes an unlock button 76, which is connected to the latch 72 and is used to drive the latch 72 to rotate so as to disengage from the locked state of the latch structure.

[0040] In this embodiment, by setting an unlock button 76 that is connected to the latch 72, when the user presses the unlock button 76, its driving force is directly transmitted to the latch 72, causing the latch 72 to rotate around the pivot 73 and disengage from the latch structure on the door assembly 2, thereby easily opening the door. This realizes a one-button unlocking function, which is convenient and labor-saving, avoiding the inconvenience of traditional door locks that require manually moving the latch or pulling the door to unlock. At the same time, the unlock button 76 and the door reset spring 75 work together to ensure that the latch 72 can automatically return to the locked state after the unlock button 76 is released, improving the smoothness of user operation and the intelligent experience of the product, and solving the problems of cumbersome unlocking operation and poor feel of traditional refrigerator door locks.

[0041] Figure 1 and Figure 2 As shown, a radiator protective cover 8 is provided on the external radiator 33, and protective foam 9 is provided on both sides of the radiator protective cover 8.

[0042] In this embodiment, a radiator protective cover 8 is provided on the external radiator 33, and protective foam 9 is provided on both sides of the radiator protective cover 8 to form a comprehensive protective structure for the heat dissipation components at the hot end. The radiator protective cover 8, as a rigid protective layer, effectively prevents foreign objects from directly contacting or damaging the fins of the external radiator 33 when the external fan 34 is running or during user use, ensuring unobstructed airflow. At the same time, the protective foam 9 on both sides not only plays an elastic buffering role, absorbing vibration energy during transportation and use, and preventing hard collision noise between the radiator protective cover 8 and the cabinet assembly 1 or other components, but also plays an auxiliary sealing role, guiding the airflow generated by the external fan 34 to pass more concentratedly through the external radiator 33, further improving heat dissipation efficiency, and solving the problems of the traditional semiconductor refrigerator's external radiator 33 being exposed and easily damaged, easily accumulating dust, and having high operating noise.

[0043] The above-disclosed embodiments are merely a few specific examples of the present invention. However, the embodiments of the present invention are not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. An air-cooled semiconductor refrigerator, characterized by comprising: include: The housing assembly (1) has a refrigeration compartment inside; The door assembly (2) is movably connected to the cabinet assembly (1) and is used to open and close the refrigeration compartment; The refrigeration unit assembly (3) is disposed in the housing assembly (1) and is used to generate cooling capacity. The refrigeration unit assembly (3) includes a semiconductor refrigeration chip (31) and an internal heat sink (32) thermally connected to the cold end of the semiconductor refrigeration chip (31). The air duct structure (4) is formed inside the housing assembly (1) and is connected to the cooling chamber and the internal radiator (32); An internal fan (5) is installed inside the air duct structure (4) to drive air to form a forced convection circulation between the internal radiator (32) and the cooling chamber.

2. The air-cooled semiconductor refrigerator according to claim 1, characterized in that, The cooling unit assembly (3) further includes an external heat sink (33) for dissipating heat from the hot end of the semiconductor cooling chip (31) and an external fan (34) for driving airflow through the external heat sink (33). The semiconductor cooling chip (31) is sandwiched between the internal heat sink (32) and the external heat sink (33) and is integrated into one unit through the cooling unit foaming component (35).

3. The air-cooled semiconductor refrigerator according to claim 2, wherein The housing assembly (1) includes a foamed housing component (101), which has an installation through hole. The refrigeration unit component (3) is embedded in the installation through hole. The internal radiator (32) faces the refrigeration chamber, and the external radiator (33) faces the outside of the housing assembly (1).

4. The air-cooled semiconductor refrigerator according to claim 1, wherein The door assembly (2) includes an outer door panel (201) and an inner door panel (202). The inner door panel (202) is connected to the housing assembly (1). A door frame sealing strip (203) is provided between the inner door panel (202) and the housing assembly (1). The outer door panel (201) is connected to the inner door panel (202). A decorative strip (204) is provided on the outer door panel (201).

5. The air-cooled semiconductor refrigerator according to claim 1, wherein The enclosure assembly (1) also includes a temperature probe (102) for detecting the temperature of the refrigeration chamber and a PCB board (103) for controlling the refrigeration and air supply. The temperature probe (102) and the fan (5) inside the enclosure are both electrically connected to the PCB board (103).

6. The air-cooled semiconductor refrigerator according to claim 1, wherein The cabinet assembly (1) is provided with a drawer assembly (6). The drawer (61) of the drawer assembly (6) is slidably disposed in the refrigeration room via a slide rail mechanism. The slide rail mechanism includes a slide rail (62) installed on the drawer (61) and a guide rail mounting seat (63) installed on the cabinet assembly (1).

7. The air-cooled semiconductor refrigerator according to claim 6, wherein The guide rail mounting base (63) is provided with a damper and a buffer pin to provide buffering and damping force when the drawer assembly (6) is closed in place.

8. The air-cooled semiconductor refrigerator according to claim 1, wherein The cabinet assembly (1) is provided with a refrigerator door lock assembly (7). The refrigerator door lock assembly (7) includes a lock base (71) and a lock tongue (72) connected thereto. The lock tongue (72) is rotatably connected to the cabinet assembly (1) via a rotating shaft (73). A refrigerator coil spring (74) is sleeved on the rotating shaft (73). A door reset spring (75) for driving the lock tongue (72) to reset is provided on the lock base (71). A latch structure corresponding to the lock tongue (72) is provided on the door assembly (2).

9. The air-cooled semiconductor refrigerator according to claim 8, wherein The refrigerator door lock assembly (7) also includes an unlock button (76), which is connected to the latch (72) and is used to drive the latch (72) to rotate so as to disengage from the locked state of the latch structure.

10. The air-cooled semiconductor refrigerator according to claim 2, wherein The external radiator (33) is provided with a radiator protective cover (8), and protective foam (9) is provided on both sides of the radiator protective cover (8).

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