A coupling device and method for optoelectronic devices
By constructing a clamping quality, coupling process, and deformation risk assessment model, and combining it with adaptive position calibration, the consistency and reliability issues in the coupling process of optoelectronic devices were resolved, achieving higher success rates and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 深圳市立汇通信技术有限公司
- Filing Date
- 2026-04-21
- Publication Date
- 2026-06-16
AI Technical Summary
The lack of real-time quantitative evaluation capabilities for multi-dimensional states in existing optoelectronic device coupling processes leads to poor coupling consistency, large fluctuations in yield, and potential long-term reliability risks.
By constructing a comprehensive clamping quality assessment model, a dynamic coupling process quality assessment model, and a deformation risk assessment model, and combining them with an adaptive position calibration control model, clamping force and position calibration are monitored and optimized in real time, thereby achieving comprehensive multi-factor assessment and adaptive adjustment.
It significantly improves the consistency and success rate of the optoelectronic device coupling process, enhances the long-term reliability of the product, and avoids device damage caused by improper clamping force and slippage caused by vibration.
Smart Images
Figure CN122218901A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of optoelectronic device packaging technology, and particularly relates to a coupling method for optoelectronic devices. Background Technology
[0002] The coupling process of optoelectronic devices is a core step in the manufacturing of optical communication modules. Its core objective is to achieve spatial alignment and fixation of the optical mode field and coupling interface of the optical device with sub-micron precision. This process directly determines key performance indicators such as insertion loss and return loss, as well as the long-term reliability of the product. In existing automated coupling systems, machine vision is commonly used for coarse positioning, combined with optical power feedback for precise positioning. However, this method has several significant drawbacks: The system lacks the ability to quantitatively evaluate the multi-dimensional states during the coupling process in real time, such as the six-degree-of-freedom deviation of the clamping, pushing jitter and changes in axial extrusion pressure. Although these factors do not immediately affect the optical power reading, they constitute potential sources of failure risk and cannot achieve early warning of deformation risk. The position correction strategy is too simplistic, only compensating proportionally based on position deviation, without comprehensively considering the current clamping stability, stress accumulation risk, and coupling process stability. This may introduce secondary stress or cause the coupling state to become unstable during the correction process.
[0003] The above-mentioned problems together lead to poor consistency in the coupling process, large fluctuations in yield, and create long-term reliability risks.
[0004] To address the aforementioned issues, existing technologies urgently need improvement. Summary of the Invention
[0005] The purpose of this invention is to provide a coupling method for optoelectronic devices, aiming to solve the above-mentioned problems.
[0006] This invention is implemented as follows: a coupling method for an optoelectronic device includes the following steps: S1: Fix and correct the position of the coupling shell, clamp the optoelectronic device through the mechanism, and push the optoelectronic device to the interface of the coupling shell and couple it. S2: Construct a comprehensive evaluation model for clamping quality based on the six-degree-of-freedom deviation vector, real-time clamping force, and anti-slip safety margin when clamping optical devices, and output the clamping quality index; S3: Based on the axial extrusion force, the pushing speed of the optical device and the coupling shell when they are docked, and the pushing jitter of the optical device, a dynamic coupling process quality assessment model is constructed, and the coupling process quality index is output. S4: Construct a deformation risk assessment model based on real-time ambient temperature, clamping mass index, coupling process mass index, and material stress accumulation factor of optoelectronic devices, and output the deformation risk index; S5: Based on the six-degree-of-freedom deviation vector, deformation risk index, and coupling process quality index of the optical device, an adaptive position calibration control model is constructed, and a calibration displacement vector is output. Then, the position of the optical device is corrected according to the calibration displacement vector.
[0007] A further technical solution is found in the comprehensive evaluation model of clamping quality in step S2: The clamping quality index is obtained by multiplying the following three factors: The first term is a negative exponential decay term based on the square of the L2 norm of the six-degree-of-freedom deviation vector; The second term is the ratio obtained by dividing the clamping force index by (1 plus the absolute value of the difference between the clamping force index and the preset optimal clamping force index); The third term is the linear enhancement term obtained by adding (1 to the product of the anti-slip safety margin and the gain coefficient).
[0008] In a further technical solution, the deviation of each degree of freedom in the six-degree-of-freedom deviation vector is normalized by dividing the actual deviation by the maximum permissible deviation of that degree of freedom.
[0009] A further technical solution is found in the dynamic coupling process quality assessment model of step S3: The coupling process quality index is calculated as follows: First, the product of the axial extrusion pressure index and the pushing speed index, as well as the pushing jitter index, are weighted and averaged; second, the above weighted average result is multiplied by a negative exponential decay factor, the exponent of which is the negative of the square of the difference between the axial extrusion pressure index and the set optimal axial extrusion pressure threshold. The push jitter index is calculated by using a negative exponential function to determine the push jitter.
[0010] A further technical solution involves calculating the push speed index as follows: When the measured push speed is lower than the optimal push speed, its value is linearly normalized between the minimum allowed push speed and the optimal push speed; when the measured push speed is higher than the optimal push speed, its value is linearly decreased and normalized between the optimal push speed and the maximum allowed push speed; the final value is limited to between 0 and 1.
[0011] A further technical solution, in step S4, is to subtract the set reference ambient temperature from the actual ambient temperature, and then divide the difference by the set ambient temperature range value to obtain the ambient temperature index; in the deformation risk assessment model: The deformation risk index is obtained by multiplying the weighted combination of the clamping quality index, the coupling process quality index, and the stress accumulation factor index by an exponential function of the absolute value of the ambient temperature index. The stress accumulation factor index is calculated from the material stress accumulation factor in the form of a negative exponential saturation curve.
[0012] A further technical solution is found in the adaptive position calibration control model of step S5: The calibration displacement vector is calculated as follows: multiply the six-degree-of-freedom deviation vector by a calibration gain matrix, and then multiply by an adjustment factor; the adjustment factor is 1 minus (the product of the deformation risk index and the deformation risk adjustment coefficient), plus (the product of the set coupling process quality adjustment coefficient and "1 minus the coupling process quality index").
[0013] Further technical solutions also include step S6, specifically: constructing an adaptive optimization control model for clamping force based on the deformation risk index, the current environmental vibration level, and the measured static friction threshold of the optical device, and outputting the target clamping force of the optical device.
[0014] A further technical solution involves dividing the actual environmental vibration level by a preset upper limit for the environmental vibration level to obtain the environmental vibration index; in the clamping force adaptive optimization control model: The target clamping force is obtained by multiplying the measured static friction threshold by the linear enhancement factor of the environmental vibration index and the linear reduction factor of the deformation risk index, and then adding the increment of the basic clamping force.
[0015] A coupling device for an optoelectronic device, the coupling device comprising: Memory, used to store executable instructions; A processor, when executing executable instructions stored in the memory, implements the coupling method of the optoelectronic device according to any one of claims 1-9.
[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: This application achieves intelligent optimization of the coupling process for optoelectronic devices. Specifically, the generation of a clamping quality index optimizes clamping force control, matching it to real-time operating conditions; the output of a deformation risk index provides risk warning capabilities; and an adaptive calibration strategy integrates multiple factors for position adjustment. Overall, this device significantly improves the consistency, success rate, and long-term reliability of the coupling process.
[0017] The deformation risk assessment model comprehensively considers both mechanical operation quality and the inherent stress state of the material by weightedly combining the clamping quality index, coupling process quality index, and stress accumulation factor index. This makes the risk assessment more comprehensive. This precise and dynamic risk assessment capability allows the system to identify potential risk sources that could lead to device deformation or long-term reliability issues earlier and more accurately. This provides a more reliable basis for subsequent adaptive position calibration or clamping force optimization, effectively avoiding device damage caused by temperature fluctuations and improving the success rate of optoelectronic device coupling and the reliability of the final product.
[0018] The adaptive position calibration control model of this application achieves adaptive optimization of the calibration amount by dynamically combining the six-degree-of-freedom deviation vector of the optical device with the deformation risk index and the coupling process quality index. Specifically, the calculation of the calibration displacement vector not only performs preliminary adjustments to the six-degree-of-freedom deviation vector based on the calibration gain matrix, but more importantly, it introduces an adjustment factor composed of a deformation risk adjustment coefficient and a coupling process quality adjustment coefficient. This adjustment factor can dynamically correct the calibration amplitude according to the real-time evaluated deformation risk index and coupling process quality index.
[0019] This application enables adaptive optimization control of clamping force, solving the slippage or overstress problems caused by fixed clamping force or simple threshold control in traditional methods. Specifically, by introducing a deformation risk index, the system can sense the potential deformation risk of the device, and appropriately reduce the clamping force when the risk is high, effectively preventing damage to the device due to stress accumulation. Simultaneously, the clamping force is dynamically adjusted based on the current environmental vibration level, enhancing the device's anti-slip capability under vibration and ensuring the stability of the coupling process. Furthermore, by combining the measured static friction threshold of the optical device, the clamping force setting is made more closely aligned with the actual physical characteristics of the device, avoiding slippage due to insufficient clamping force or deformation due to excessive clamping force. By constructing an adaptive optimization control model for clamping force, comprehensively considering these key factors, the optimal target clamping force for the optical device is dynamically calculated and output, thereby achieving a dynamic balance between preventing device slippage and avoiding overstress, significantly improving the success rate, stability, and long-term reliability of the optoelectronic device coupling process. Attached Figure Description
[0020] Figure 1 This is a schematic diagram illustrating the steps of a coupling method for an optoelectronic device. Detailed Implementation
[0021] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.
[0022] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.
[0023] like Figure 1 As shown, a coupling method for an optoelectronic device according to an embodiment of the present invention includes the following steps: S1: Fix and correct the position of the coupling shell, clamp the optoelectronic device through the mechanism, and push the optoelectronic device to the interface of the coupling shell and couple it. S2: Construct a comprehensive evaluation model for clamping quality based on the six-degree-of-freedom deviation vector, real-time clamping force, and anti-slip safety margin when clamping optical devices, and output the clamping quality index; S3: Based on the axial extrusion force, the pushing speed of the optical device and the coupling shell when they are docked, and the pushing jitter of the optical device, a dynamic coupling process quality assessment model is constructed, and the coupling process quality index is output. S4: Construct a deformation risk assessment model based on real-time ambient temperature, clamping mass index, coupling process mass index, and material stress accumulation factor of optoelectronic devices, and output the deformation risk index; S5: Based on the six-degree-of-freedom deviation vector, deformation risk index, and coupling process quality index of the optical device, an adaptive position calibration control model is constructed, and a calibration displacement vector is output. Then, the position of the optical device is corrected according to the calibration displacement vector.
[0024] In this embodiment, optoelectronic devices refer to various devices capable of photoelectric signal conversion or optical signal processing, such as laser chips, fiber arrays, and waveguide devices. During coupling, their optical mode fields need to be precisely aligned with the external interface.
[0025] A coupling shell is an external structure used to house or connect optoelectronic devices. It typically has one or more interfaces to enable physical connection and optical alignment between optoelectronic devices and optical fibers, waveguides, or other optical elements.
[0026] A six-degree-of-freedom deviation vector is a mathematical representation of the translational (X, Y, Z axes) and rotational (about the X, Y, Z axes) deviations of an optoelectronic device relative to a target position in three-dimensional space. This vector is used to quantify the difference between the actual and ideal positions of the device.
[0027] A clamping quality comprehensive evaluation model is a mathematical model used to quantify the stability and accuracy of optoelectronic devices under clamping conditions. This model comprehensively considers multiple factors during the clamping process to generate an index reflecting the quality of the clamping condition. The clamping quality index is a numerical value output by the clamping quality comprehensive evaluation model, used to characterize the stability and positional accuracy of the optoelectronic device when clamped. A higher index value generally indicates a better clamping condition.
[0028] The dynamic coupling process quality assessment model is a mathematical model used to monitor and evaluate the mechanical state of optoelectronic devices during the pushing and docking process into a coupling shell in real time. This model focuses on the mechanical and kinematic parameters during the pushing process. The coupling process quality index is a numerical value output by the dynamic coupling process quality assessment model, used to characterize the stability and stress rationality of the optoelectronic devices during the pushing and docking process. A higher index value generally indicates a smoother and safer coupling process.
[0029] A deformation risk assessment model is a mathematical model used to predict the likelihood of physical deformation or damage to optoelectronic devices during coupling. This model comprehensively considers factors such as environment, mechanical stress, and material properties. The deformation risk index is a numerical value output by the deformation risk assessment model, used to characterize the potential risk of deformation of the optoelectronic device under current operating conditions. A higher index value generally indicates a higher deformation risk.
[0030] An adaptive position calibration control model is a mathematical model that dynamically adjusts the position calibration strategy of optoelectronic devices based on real-time evaluation results. This model can generate precise calibration commands based on multi-dimensional information. The calibration displacement vector, output by the adaptive position calibration control model, is a mathematical vector used to guide the mechanism in adjusting the position of the optoelectronic devices. This vector contains the specific displacement amounts in each degree of freedom.
[0031] First, the coupling shell is fixed and its position is calibrated. Specifically, the coupling shell can be placed in a preset fixture and fixed by a mechanical limiting structure, and its position is calibrated using a laser pointer or optical microscope. Then, the optoelectronic device is clamped by a mechanism. Finally, a pushing device pushes and couples the optoelectronic device to the interface of the coupling shell; its pushing speed and acceleration are controlled by a preset fixing program.
[0032] In a preferred embodiment of the present invention, in the clamping quality comprehensive evaluation model of step S2: ; in This is the bias sensitivity coefficient. ; This is the safety margin gain coefficient. ; This is a six-degree-of-freedom deviation vector; The clamping force index, The preset optimal clamping force index, To provide a safety margin against slippage, For clamping quality index.
[0033] In this embodiment, the deviation sensitivity coefficient It is a positive parameter used to adjust the six-degree-of-freedom bias vector. Clamping quality index The degree of sensitivity to influence, and its magnitude, determines the clamping quality index when the clamping position of the optoelectronic device deviates from the ideal state. The rate of descent. This coefficient can be determined through experimental calibration or simulation optimization, for example, by performing clamping tests under different deviation conditions and fitting the result to the desired quality index response curve; or by setting it based on the geometry, material properties, and coupling accuracy requirements of the optoelectronic device, using engineering experience or an expert system.
[0034] Safety margin gain coefficient It is a positive parameter used to adjust the anti-slip safety margin. Clamping quality index The weight of the influence, and its magnitude, determines the safety margin against slippage. To improve the clamping quality index The degree of contribution. This coefficient can be determined by testing the clamping stability under different anti-slip safety margins and combining it with the requirements for anti-slip performance in actual production, through iterative optimization or machine learning algorithms; or it can be set by theoretical analysis or empirical rules based on factors such as the surface friction characteristics of optoelectronic devices, the structural characteristics of the clamping mechanism, and the external vibration environment.
[0035] Six-degree-of-freedom deviation vector This vector represents the deviation of the optoelectronic device from its ideal position and orientation during clamping. It includes three translational degrees of freedom (X, Y, Z) and three rotational degrees of freedom (rotation about the X, Y, and Z axes), and is used to quantify the positional accuracy of the optoelectronic device during clamping. This vector can be obtained in real time by a high-precision vision measurement system (such as a CCD camera combined with image processing algorithms) or a laser displacement sensor array to acquire the six-degree-of-freedom position information of the optoelectronic device and compare it with the preset ideal position to calculate the deviation vector.
[0036] Clamping force index This is a dimensionless value of the actual clamping force after normalization, used to represent the magnitude of the current clamping force and quantify the force exerted on the optoelectronic device during clamping. This index can be normalized by installing a force sensor (such as a piezoelectric sensor or strain gauge sensor) on the clamping mechanism to monitor the clamping force in real time, and then dividing the measured force value by a preset maximum allowable clamping force or reference clamping force.
[0037] Preset optimal clamping force index This is a normalized ideal clamping force value, representing the clamping force that minimizes damage to optoelectronic devices while ensuring clamping stability, and serves as a benchmark for clamping force evaluation. This index can be determined through extensive experiments on the damage (such as surface scratches and internal stress) and slippage risk of optoelectronic devices under different clamping forces, combined with indicators such as optical power coupling efficiency, to establish an optimal clamping force range, which is then normalized. Alternatively, finite element analysis can be used to simulate the stress distribution of optoelectronic devices under different clamping forces, combined with the material's yield strength and fatigue limit, to determine a safe and effective clamping force, which is then normalized.
[0038] Anti-slip safety margin This is a normalized, dimensionless value used to represent the ability of an optoelectronic device to resist slippage caused by external disturbances (such as vibration or pushing force) while in a clamped state, quantifying the stability of the clamping. This margin can be calculated by measuring the static friction force at the contact surface between the optoelectronic device and the clamping mechanism, comparing it to the expected maximum external disturbance force, and then normalizing it; or by applying controlled external disturbances during clamping and monitoring whether the optoelectronic device slips, thereby assessing its anti-slip capability and quantifying it as a safety margin index.
[0039] Clamping quality index It is a dimensionless value output by the clamping quality comprehensive evaluation model, used to comprehensively reflect the overall quality status of optoelectronic devices during the clamping process, and serves as the input for subsequent coupling processes and calibration control.
[0040] Through the above technical solution, this model can accurately quantify the combined impact of six-degree-of-freedom positional deviation, clamping force exponent, and anti-slip safety margin on clamping quality. Among these, the exponential decay term... This ensures that even minor positional deviations can lead to a significant decrease in the quality index, thus promptly reflecting potential minor skew risks. (Fractional item) This allows for effective evaluation of the actual clamping force and the preset optimal clamping force index. The degree of matching is considered; this term contributes most when the actual clamping force is close to the optimal value, and its contribution decreases when the force is far from the optimal value, thus avoiding evaluation distortion caused by excessively tight or loose clamping forces. Linear gain term. Through the safety margin gain coefficient Increase anti-slip safety margin This enhances the model's consideration of anti-slip capability and improves the comprehensiveness of clamping stability assessment. Overall, the model combines the three key factors of positional deviation, clamping force state, and anti-slip capability through multiplication, resulting in a higher clamping quality index. It can dynamically and comprehensively reflect the clamping state of optoelectronic devices.
[0041] By providing such a precise and comprehensive clamping quality index The optoelectronic device coupling method of this application can more accurately assess the quality state of the optoelectronic device during clamping in step S2. This allows the subsequent deformation risk assessment model (step S4) and adaptive position calibration control model (step S5) to obtain more reliable input, thereby improving the intelligence and adaptability of the entire coupling process. This scheme effectively reduces the problem of inaccurate assessment caused by empirical preset values, significantly reduces the risk of coupling efficiency fluctuations and physical damage to optoelectronic devices, thereby improving the consistency, success rate, and long-term reliability of the coupling process.
[0042] As a preferred embodiment of the present invention Composed of 6 composition, , , For the first Degrees of freedom deviation, Maximum permissible deviation for each degree of freedom.
[0043] In this embodiment, wherein, This vector represents the deviation of the optoelectronic device from its ideal position in six degrees of freedom during clamping. These six degrees of freedom typically include three translational degrees of freedom (X, Y, and Z directions) and three rotational degrees of freedom (rotation about the X, Y, and Z axes). This vector quantifies the degree of position and orientation deviation of the optoelectronic device during clamping and is a key input parameter for evaluating clamping quality. It can be implemented by using a high-precision vision measurement system (such as an industrial camera equipped with sub-pixel-level image processing algorithms) combined with the device's geometric model for real-time position and orientation calculation, or by directly measuring the relative position and angle between the device and the clamp using a contact sensor array (such as a miniature force sensor or displacement sensor).
[0044] It is for the six-degree-of-freedom deviation vector The result of normalization processing performed on each component. It represents the result of normalization processing on the first component. Actual deviation in each degree of freedom The maximum permissible deviation relative to that degree of freedom The proportion. This normalization process eliminates the differences in units and dimensions between different degrees of freedom, allowing all deviation components to be compared and evaluated on a unified, dimensionless scale. This can be achieved by determining the maximum permissible deviation threshold for each degree of freedom (e.g., translation in the X direction, rotation in the Y direction, etc.) through experiments or simulation during system initialization or calibration. And the actual deviation was measured in real time. Then, through calculation The normalized value is obtained.
[0045] This refers to the moment when an optoelectronic device is held in place. The deviation between the actual measured position or attitude and the ideal position or attitude in each degree of freedom. For example, when When =1, This may represent a translational deviation in the X direction; when When =4, This may represent rotational deviation around the X-axis. These deviation values are typically acquired in real time by high-precision sensors. This can be achieved by directly measuring the displacement of the optoelectronic device in various directions using non-contact displacement sensors such as laser displacement sensors and eddy current sensors, or by using a machine vision system to identify and track the feature points of the optoelectronic device, and then calculating its actual deviation in the six degrees of freedom.
[0046] It is aimed at optoelectronic devices in the first The maximum permissible deviation value for each degree of freedom. This value is preset based on the structural characteristics of the optoelectronic device, coupling accuracy requirements, process window, and reliability standards. Exceeding this maximum permissible deviation may lead to coupling failure, performance degradation, or device damage. It can be determined through engineering experience, design specifications, finite element analysis, or actual process experiments. For example, for a certain optoelectronic device, the maximum permissible deviation for translation in the X-axis might be set to 0.5 micrometers, while the maximum permissible deviation for rotation around the Z-axis might be set to 0.1 degrees. These maximum permissible deviation values are typically stored in the parameter database of the control system as a reference for normalization calculations.
[0047] Through the above technical solution, this application introduces a normalization mechanism to address the quantization problem of six-degree-of-freedom bias vectors. Specifically, the six-degree-of-freedom bias vectors... Decomposed into 6 independent normalized components Each component is obtained by measuring the actual number of components. Degrees of freedom deviation Divide by the preset maximum permissible deviation of each degree of freedom This method effectively solves the inconsistency in units and dimensions of deviations of different degrees of freedom, ensuring that all deviation components are represented on a unified, dimensionless scale [0,1]. Therefore, when the normalized six-degree-of-freedom deviation vector... When incorporated into the aforementioned comprehensive clamping quality evaluation model, the model can fairly and accurately assess the impact of deviations in each degree of freedom on the overall clamping quality. By eliminating dimensional differences, the model is neither overly sensitive nor insensitive to deviations in a particular degree of freedom, thus avoiding evaluation bias caused by inconsistent scales of the original deviation data. This makes the clamping quality index... The calculations are more accurate and robust, and can more realistically reflect the actual positional deviation of optoelectronic devices during the clamping process. By providing a standardized and comparable method for quantifying deviations, this application significantly improves the accuracy and reliability of clamping quality assessment, providing a more solid and reliable data foundation for subsequent adaptive position calibration and clamping force optimization, thereby ensuring the stability of the optoelectronic device coupling process and the performance consistency of the final product.
[0048] In a preferred embodiment of the present invention, in the dynamic coupling process quality assessment model of step S3: ; in For collaborative weighting coefficients, To push the jitter weighting coefficient, , All are greater than 0. For control coefficients, , The axial compressive stress index. For push speed index, To push the jitter index, ,in To push jitter (unit: mm / s) 2 ), jitter characteristic parameters (units) same), The optimal axial compressive force threshold is set. Dimensionless, and , This is the quality index of the coupling process.
[0049] In this embodiment, the dynamic coupling process quality assessment model aims to quantify the quality status of optoelectronic devices in real time during the process of pushing and coupling with the coupling shell interface. Its function is to provide a unified quality index by comprehensively considering multiple key dynamic parameters, so as to promptly identify potential coupling risks and guide subsequent calibration or intervention. This model can be implemented through software algorithms, such as running on an embedded controller or industrial PC, receiving sensor data and performing calculations. The Coupling Process Quality Index (CQI) is the output of this model, used to characterize the quality of the current coupling process. Its value typically ranges from 0 to 1, where 1 represents the best coupling process quality and 0 represents the worst. This index can be used as a decision-making basis, for example, to determine whether position calibration is needed, push parameters need adjustment, or risk warnings need to be issued.
[0050] Collaborative weighting coefficient And push jitter weighting coefficient This is used to balance the relative importance of the axial compressive force index, push speed index, and push jitter index in the quality assessment of the coupling process. For example, these indices can be set through expert experience or obtained by training and optimizing historical coupling data using machine learning algorithms. In practical applications, the ratio of these two coefficients can be adjusted according to the characteristics of different optoelectronic devices or coupling process requirements to highlight the influence of specific factors.
[0051] Axial compressive stress index This represents the magnitude of the axial compressive force experienced by the optoelectronic device during coupling and normalizes it to a standard range (e.g., 0 to 1). It can be calculated by dividing the real-time measured axial compressive force by a preset maximum allowable compressive force, or by converting it to a dimensionless exponent using a mapping function. For example, a force sensor can be used to monitor the axial compressive force in real time, followed by normalization.
[0052] Push speed index This represents the pushing speed of the optoelectronic device during the coupling process and normalizes it to a standard range. The calculation method can be to divide the real-time measured pushing speed by a preset maximum allowable speed, or to map it to a range of 0 to 1 using a piecewise function. For example, the pushing speed can be measured using an encoder or vision system and then normalized. The specific calculation method will be described in further detail in subsequent embodiments.
[0053] Push jitter index Used to quantify the stability of optoelectronic devices during the deployment process. It employs an exponential function. The original push jitter Convert to an exponent between 0 and 1, where jitter The larger, The smaller the value, the more unstable the push process. This exponential form effectively suppresses the excessive influence of extreme jitter values on the evaluation results, while maintaining sensitivity to jitter changes. Push Jitter This is an indicator that measures the instantaneous velocity or position fluctuation of an optoelectronic device during its movement, measured in mm / s². It can be obtained by acquiring motion data of the optoelectronic device in real time using high-precision displacement sensors, accelerometers, or visual tracking systems, and calculating the variance, standard deviation, or maximum instantaneous rate of change of its velocity or acceleration. (Jitter characteristic parameter) Used to adjust push jitter right The sensitivity to the influence. It is a positive value, with units of [missing information]. The same. For example, it can be calibrated experimentally to observe different levels of jitter. The changing trend, thereby determining a suitable... This value allows the model to have good discrimination over key jitter ranges. Optimal axial compressive force threshold. This represents the ideal axial compressive force level when the optoelectronic device contacts the coupling shell interface during coupling. It is a dimensionless normalized value, typically between 0 and 1. It can be determined, for example, through extensive experimental data analysis, finite element simulation, or expert experience, to ensure good coupling while avoiding excessive mechanical stress on the device.
[0054] Control coefficients in exponential functions Used to adjust the axial compressive force index Deviation from the optimal axial compressive stress threshold At that time, the quality index of the coupling process The degree of punishment. The larger the value, the more severe the penalty for deviating from the optimal compressive force. The faster the decline. For example, it can be calibrated experimentally, set according to the requirements for sensitivity to extrusion pressure, to ensure that the model can accurately reflect the quality loss caused by extrusion pressure deviation.
[0055] Through the above technical solution, this application can more precisely quantify the dynamic quality in the coupling process of optoelectronic devices. Specifically, by introducing a cooperative weighting coefficient... And push jitter weighting coefficient The model can flexibly balance the impact of three key factors—axial compression force, pushing speed, and pushing jitter—on coupling quality, overcoming the limitations of traditional methods such as fixed parameters and lack of adaptability. Furthermore, it utilizes an exponential function... The penalty for deviations of the axial extrusion force from the optimal threshold ensures that the coupling process occurs within the ideal extrusion force range, effectively preventing device damage or poor coupling caused by excessive or insufficient extrusion force. Furthermore, the push jitter index... The introduction of this technology enables the model to sensitively capture minute vibrations during the pushing process and transform them into quantifiable quality indicators, thereby achieving real-time early warning of potential failure risks. Overall, by comprehensively considering multi-dimensional dynamic parameters, this model improves the accuracy and precision of coupling process quality assessment, providing a reliable basis for subsequent adaptive position calibration and clamping force optimization, and thus improving the success rate and long-term reliability of optoelectronic device coupling.
[0056] As a preferred embodiment of the present invention The calculation method is as follows: ; in To test the push speed, To minimize the allowed push speed, To maximize the allowed push speed, For optimal push speed, , , as well as The units are all mm / s.
[0057] In this embodiment, the above The measured push speed refers to the actual speed of movement of the optoelectronic device as it is pushed towards the coupling shell interface by the pushing device during the coupling process. This speed is a key parameter in the dynamic coupling process, directly reflecting the execution of the pushing operation. The measured push speed can be obtained in various ways. For example, an encoder or grating ruler installed on the pushing mechanism can be used to monitor the displacement changes of the pushing mechanism in real time, and the speed can be obtained by differentiating the displacement; alternatively, a laser displacement sensor or machine vision system can be used to track the motion trajectory of the optoelectronic device, thereby calculating its instantaneous speed.
[0058] The above The minimum permissible pushing speed is defined as the lowest possible pushing speed that can be achieved while ensuring the stability and efficiency of the coupling process. Speeds below this limit may lead to excessively long coupling times, excessive friction, or unstable "stick-slip" phenomena, thus affecting the coupling quality. The determination of this minimum permissible pushing speed is typically based on experimental data, material property analysis, or simulation to ensure that good coupling conditions can be maintained even at low speeds.
[0059] The above The maximum permissible pushing speed is defined as the highest speed that can be allowed without causing physical damage to optoelectronic devices or leading to coupling instability. Exceeding this speed may result in excessive impact force, device deformation, decreased positioning accuracy, or insufficient system response, thereby introducing new risks. The determination of this maximum permissible pushing speed also needs to comprehensively consider the mechanical strength of the device, the tolerance of the coupling interface, and the dynamic response capability of the pushing mechanism, and is usually obtained through experimental verification or safety margin calculations.
[0060] The above The optimal push speed represents the ideal push speed that achieves the best coupling effect (e.g., lowest insertion loss, minimum stress accumulation, and highest success rate) under specific coupling tasks and device conditions. At this speed, the contact and alignment process between the optoelectronic device and the coupling shell interface is most stable and efficient. The optimal push speed can be determined through extensive experimental optimization, parameter optimization based on machine learning, or by analyzing the coupling dynamics using theoretical models.
[0061] The above The calculation method, i.e., the mathematical formula, is designed to calculate the measured push speed. Transform into a normalized, dimensionless exponent. This index quantifies the "quality" or "appropriateness" of the current push speed. The formula cleverly combines measured speed data. With the preset minimum allowed push speed Optimal push speed and maximum allowed push speed This enables accurate assessment of speed quality. Specifically, when the measured speed... Between and When in between, in the formula Some parts will calculate their relative position, and this value varies. The measured speed increases from 0 to 1; Between Some parts will calculate their relative position, and this value varies. The value increases from 1 to close to 0. The min function takes the smaller of these two calculated values, ensuring... exist It reaches its peak value (ideally 1) at that point, and then... Deviation And decrease. Meanwhile, max(0, ...) ensures... Negative values will not occur, and min(1, ...) ensures that... It will not exceed 1, thus making It is strictly normalized to the range [0, 1]. This calculation method can be implemented in the control unit of the coupled system using a software algorithm.
[0062] Through the above technical solution, this application provides a precise and adaptive push speed index. The calculation method effectively solves the problem of inaccurate velocity parameters in the quality assessment of dynamic coupling processes. This method can accurately calculate the measured push velocity. It is dynamically mapped to a normalized exponent between 0 and 1, where 1 represents the optimal speed and 0 represents a speed far from the allowable range. This normalization process allows the quality of the push speed to be standardized and quantified, thus enabling seamless integration into the quality assessment model of the dynamically coupled process.
[0063] In a preferred embodiment of the present invention, in step S4, the difference between the actual ambient temperature and the set reference ambient temperature is subtracted and then divided by the set ambient temperature range value to obtain the ambient temperature index; in the deformation risk assessment model: ; in For clamping mass weighting coefficient, For the quality weighting coefficient of the coupling process, For stress accumulation weighting coefficient, ,and , as well as All are greater than 0; For temperature sensitivity coefficient, , To hold the quality index, This is a quality index for the coupling process. This is the stress accumulation factor index. ,in The material stress accumulation factor. This is the characteristic value of stress accumulation. The ambient temperature index. This is the deformation risk index.
[0064] In this embodiment, the ambient temperature index The purpose of obtaining this value is to transform real-time ambient temperature fluctuations into a standardized, dimensionless numerical value for quantification within the deformation risk assessment model. One approach is to acquire ambient temperature data in real time using a high-precision temperature sensor, compare this data with a pre-set reference ambient temperature, calculate the temperature deviation, and then divide this deviation by a set ambient temperature range value to obtain the desired value. For example, the reference ambient temperature can be set to 25℃, and the ambient temperature range can be set to 10℃ (i.e., allowing fluctuations of ±5℃). If the actual temperature is 28℃, then... = (28-25) / 10 = 0.3. Another implementation method is to establish a temperature-index mapping table based on historical temperature data or specific process requirements. When the real-time ambient temperature falls within a certain range, the corresponding ambient temperature index can be obtained directly by looking up the table.
[0065] Clamping mass weighting coefficient in deformation risk assessment model Coupling process quality weighting coefficient and stress accumulation weighting coefficient These weighting coefficients are used to balance the contribution of different risk sources to the overall deformation risk. The setting of these weighting coefficients typically requires comprehensive analysis and experimental verification based on the material properties, structural design, process sensitivity, and historical failure data of the optoelectronic device. For example, for fragile devices or devices sensitive to clamping forces, the weighting coefficients can be appropriately increased. The value can be increased; for devices prone to microcracks during coupling, the value can be improved. The value; for devices that may suffer fatigue damage during long-term service, it can be increased. The values of these coefficients can be optimized through offline experiments, finite element analysis, or machine learning methods to ensure that the model accurately reflects the deformation risk characteristics of a specific device.
[0066] Temperature sensitivity coefficient It is a key parameter that determines the ambient temperature index. Deformation risk index The strength of the nonlinear amplification effect. This coefficient reflects the sensitivity of optoelectronic device materials to temperature changes, such as the material's coefficient of thermal expansion and thermal stress response. The higher the value, the more sensitive the device is to temperature fluctuations; even small temperature deviations can lead to a significant increase in the risk of deformation. The risk level is typically determined through materials science experiments, thermomechanical coupling simulation analysis, or device coupling tests at different temperature environments. For example, by measuring the deformation or stress changes of the device at different temperatures, an exponential relationship between temperature and risk can be fitted, thereby determining the risk level. value.
[0067] Stress accumulation factor index This is used to quantify the cumulative stress state experienced by optoelectronic devices throughout the entire manufacturing and coupling process. Material stress accumulation factor. Stress accumulation characteristics can originate from mechanical loads experienced by the device during manufacturing, handling, clamping, and pushing, as well as environmental factors such as temperature cycling. It is a normalized parameter representing the threshold or characteristic point at which a material's properties begin to significantly degrade when it reaches a certain stress level. This is achieved through an exponential function. The original stress accumulation factor can be used. Mapped to a dimensionless exponent between 0 and 1, where A higher value indicates greater accumulated stress inside the device, and a higher risk of deformation or failure. For example, It can be estimated by integrating historical load data and combining it with material fatigue models, and The value can be determined based on parameters such as the material's yield strength and fatigue limit.
[0068] Through the above technical solution, this application can accurately quantify the impact of ambient temperature changes on the deformation risk of optoelectronic devices. This is achieved by introducing an ambient temperature index. This effect is incorporated exponentially into the deformation risk assessment model, enabling the model to capture the nonlinear, amplified effect of temperature fluctuations on material stress accumulation and device deformation. This solves the problem of insufficient quantification of temperature effects in traditional methods, significantly improving the accuracy and comprehensiveness of deformation risk assessment. When the ambient temperature deviates from the reference value, even a small deviation can be detected through the temperature sensitivity coefficient. The exponential amplification effect leads to a higher deformation risk index. The significant increase in [data / information] allows for timely warnings of potential risks.
[0069] In a preferred embodiment of the present invention, in the adaptive position calibration control model of step S5: ; in This is the deformation risk adjustment coefficient. This is the quality adjustment coefficient for the coupling process. , All are greater than 0. To calibrate the gain matrix, Dimensionless This is a six-degree-of-freedom deviation vector. The deformation risk index, This is a quality index for the coupling process. To calibrate the displacement vector.
[0070] In this embodiment, the displacement vector is calibrated. This is a specific displacement command output by the adaptive position calibration control model, used to guide the position correction of optical devices. It quantifies the adjustments required for the optical device in six degrees of freedom to eliminate or reduce the current position deviation, while also considering risk factors in the coupling process. This vector can be directly input as a control command to a high-precision motion actuator, such as a piezoelectric ceramic platform or a six-axis robot, to drive the mechanism holding the optical device to perform precise position adjustments.
[0071] Calibration gain matrix It is a dimensionless matrix used to represent the six-degree-of-freedom deviation vector. Mapped to calibration displacement vector The initial amplitude. It determines the response strength to a given deviation and can be preset or adjusted online according to the dynamic characteristics of the system and the calibration accuracy requirements. For example, It can be a diagonal matrix, with its diagonal elements corresponding to the gain coefficients of each degree of freedom; or it can be a non-diagonal matrix used to achieve coupling calibration between the degrees of freedom. Its specific values can be determined through experimental calibration or simulation optimization.
[0072] Deformation risk adjustment coefficient and coupling process quality adjustment coefficient It is used for dynamically adjusting the calibration displacement vector. The adjustment coefficients are all positive. Used according to deformation risk index To suppress calibration values in order to avoid applying excessive stress under high-risk conditions; Used to determine the quality index of the coupling process To enhance calibration parameters and compensate for process instability, these coefficients can be determined through experimental calibration, expert experience, or machine learning-based optimization methods.
[0073] Through the above technical solution, the adaptive position calibration control model of this application uses the six-degree-of-freedom deviation vector of the optical device. With deformation risk index Coupling process quality index Dynamic combination enables adaptive optimization of calibration quantities. Specifically, the calibration displacement vector... The calculation is based not only on the calibration gain matrix For the six-degree-of-freedom deviation vector Preliminary adjustments were made, and more importantly, a deformation risk adjustment coefficient was introduced. and coupling process quality adjustment coefficient The adjustment factor is determined based on the real-time assessed deformation risk index. and coupling process quality index The calibration amplitude is dynamically adjusted. When the deformation risk index... When the value is high, the deformation risk adjustment coefficient This will reduce the adjustment factor, thereby moderately reducing the calibration displacement vector. The magnitude of the stress is adjusted to avoid applying excessive correction stress when the device is in a high-risk deformation state, effectively preventing secondary stress or device damage. Conversely, when the coupling process quality index... A low value indicates instability in the coupling process, at which point the mass adjustment coefficient of the coupling process is... This effect increases the adjustment factor, thereby enhancing the calibration displacement vector. The amplitude of the adjustment is increased to more actively compensate for instabilities in the process and ensure the smooth operation of the coupling process. Through this adaptive adjustment mechanism, the calibration strategy of this application not only responds to the positional deviation of the optical device, but also integrates potential deformation risks and dynamic quality of the coupling process in real time. This avoids the problems that may be introduced into the calibration process or cause instability of the coupling state that may be caused by traditional single deviation compensation strategies, thereby achieving more accurate, stable and safe coupling alignment.
[0074] As a preferred embodiment of the present invention, step S6 is further included, specifically: constructing an adaptive optimization control model for clamping force based on the deformation risk index, the current environmental vibration level, and the measured static friction threshold of the optical device, and outputting the target clamping force of the optical device; dividing the actual environmental vibration level by a preset upper limit of the environmental vibration level to obtain the environmental vibration index; in the adaptive optimization control model for clamping force: ; in This is the environmental vibration influence coefficient. The deformation risk impact coefficient, , All are greater than 0. This is the measured static friction threshold of the optical device. The environmental vibration index, The deformation risk index, Based on the increase in clamping force, As a preset constant, The clamping force for optical devices.
[0075] In this embodiment, This is the environmental vibration influence coefficient, used to adjust the gain effect of environmental vibration on the target clamping force. This is the deformation risk impact coefficient, used to adjust the effect of deformation risk on the suppression of clamping force. , Initial values can be calculated through experimental calibration. Specifically, under controlled conditions, the sliding critical force caused by vibration and the deformation safety force caused by risk are tested separately, and the parameter values are directly calculated through linear regression. Then, an adaptive online learning algorithm dynamically adjusts the parameters, specifically, updating the parameters in real time based on actual sliding or deformation events. Finally, through a system-level multi-objective optimization framework, the parameters are optimized overall to minimize sliding, deformation events, and energy consumption.
[0076] Environmental vibration index The environmental vibration index is a dimensionless index used to quantify the impact of environmental vibration on the coupling process. Its function is to standardize complex environmental vibration data so that the clamping force adaptive optimization control model can uniformly handle vibration data under different operating conditions. This index can be obtained in several ways. For example, it can be calculated by real-time acquisition of the actual environmental vibration level measured by accelerometers or vibration sensors and dividing it by a preset upper limit value for the environmental vibration level. This upper limit value can be determined based on equipment design specifications, process requirements, or historical data statistical analysis results. Another method is to perform spectral analysis on the environmental vibration signal, extract the vibration energy within a specific frequency range, and normalize it to obtain the environmental vibration index.
[0077] Measured static tribology threshold of optical devices This refers to the maximum static friction force that can be withstood between the contact surfaces of the optical device and the clamping mechanism before relative sliding occurs. Its function is to serve as the basis for calculating the target clamping force of the optical device, ensuring that the applied clamping force is sufficient to resist potential sliding. This threshold can be determined by pre-testing each optical device before coupling, i.e., by applying gradually increasing forces and monitoring for relative sliding. Alternatively, it can be estimated by establishing an empirical model of parameters such as the optical device material, surface roughness, clamping material, and static friction coefficient, combined with the geometric parameters of the clamping mechanism.
[0078] Deformation Risk Index In clamping force optimization, this index is used to guide the reduction of the risk of device deformation or damage due to excessive clamping force. This index is typically output by a deformation risk assessment model, which comprehensively considers multiple factors such as clamping quality, coupling process quality, material stress accumulation, and ambient temperature.
[0079] Basic clamping force increment This is a preset constant that provides an additional safety margin on top of the calculated target clamping force. This ensures that even at the minimum safe clamping force calculated by the model, there is sufficient redundancy to cope with unexpected situations or model errors, effectively preventing accidental slippage. This increment can be determined through extensive experimental data and process verification to establish a fixed value that provides a reliable safety margin under various operating conditions. Furthermore, a conservative increment ensuring high reliability can be set based on the value of the optical device, coupling success rate requirements, and potential failure costs.
[0080] Optical device target clamping force This is the ideal clamping force for actual clamping of optoelectronic devices, calculated by the adaptive optimization control model of clamping force by comprehensively considering various real-time operating parameters. Its function is to minimize the clamping force while ensuring that the optoelectronic device does not slip, thereby reducing the risk of device deformation or damage. This force is calculated in real time based on the above formula, comprehensively considering the measured static friction threshold, environmental vibration index, deformation risk index, and basic clamping force increment.
[0081] The adaptive clamping force optimization control model is a mathematical model used to dynamically adjust the clamping force of optoelectronic devices based on real-time operating conditions. Its function is to achieve the optimal balance between anti-slip and anti-overstress clamping force, thereby improving coupling success rate and device reliability. This model can be implemented using an embedded controller or industrial PC, acquiring real-time sensor data (such as vibration and temperature), running the model to calculate the target clamping force, and driving the clamping actuator to adjust the clamping force. Alternatively, the model can be integrated into the control system of automated coupling equipment, using closed-loop control to adjust the target clamping force of the optoelectronic device based on the model's output. Dynamically adjust the clamping force.
[0082] Through the above technical solution, this application effectively solves the problem of how to accurately calculate and dynamically adjust the clamping force to adapt to real-time operating conditions during the coupling process of optoelectronic devices. Specifically, this is achieved by converting the actual environmental vibration level into an environmental vibration index. The adaptive optimization control model for clamping force can quantify the impact of external vibration on clamping stability. This is based on the measured static friction threshold of the optical device. This ensures that the base value of the clamping force can effectively prevent the device from sliding. Multiplication factors in the model. This allows the clamping force to increase appropriately according to the increase in environmental vibration intensity, thereby enhancing the anti-slip capability. Simultaneously, the multiplication factor... This allows the clamping force to be adjusted according to the deformation risk index. The clamping force increases and decreases accordingly, effectively preventing device deformation or damage caused by excessive clamping force. Furthermore, the basic clamping force increment... The introduction of this feature provides an additional safety margin for the clamping force, further enhancing the reliability of the coupling process. Overall, by combining the vibration index, risk index, and measured threshold, this model achieves dynamic and intelligent optimization of the clamping force, effectively balancing the contradiction between anti-slip and anti-overstress, and significantly improving the success rate, stability, and long-term reliability of optoelectronic device coupling.
[0083] A coupling device for an optoelectronic device includes a memory for storing executable instructions and a processor for executing the executable instructions stored in the memory to implement the coupling method of the optoelectronic device. The core innovation of this embodiment lies in combining the use of the memory to store executable instructions with the use of the processor to execute instructions and dynamically process coupling process data. This achieves multi-dimensional real-time evaluation of clamping quality, coupling process quality, and deformation risk, and generates an adaptive calibration strategy based on the evaluation results, thereby optimizing clamping force control, avoiding device damage, and improving coupling reliability.
[0084] Specifically, the executable instructions stored in memory provide a programmable storage mechanism, allowing the device to save and recall specific method logic. Because these instructions are designed based on the aforementioned coupling method, they can dynamically adapt to individual device differences and environmental changes, thus solving the problem of traditional parameter fixation. When the processor executes these instructions, it generates a clamping quality index, a coupling process quality index, and a deformation risk index based on real-time input data such as the six-degree-of-freedom deviation vector, real-time clamping force, and ambient temperature. Based on these indices, the processor further generates a calibration displacement vector to achieve intelligent position correction. Because the correction strategy comprehensively considers deformation risk and process quality, rather than relying solely on position deviation, it avoids the introduction of secondary stress and ensures the stability of the coupling state.
[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A coupling method for an optoelectronic device, characterized in that, Includes the following steps: S1: Fix and correct the position of the coupling shell, clamp the optoelectronic device through the mechanism, and push the optoelectronic device to the interface of the coupling shell and couple it. S2: Construct a comprehensive evaluation model for clamping quality based on the six-degree-of-freedom deviation vector, real-time clamping force, and anti-slip safety margin when clamping optical devices, and output the clamping quality index; S3: Based on the axial extrusion force, the pushing speed of the optical device and the coupling shell when they are docked, and the pushing jitter of the optical device, a dynamic coupling process quality assessment model is constructed, and the coupling process quality index is output. S4: Construct a deformation risk assessment model based on real-time ambient temperature, clamping mass index, coupling process mass index, and material stress accumulation factor of optoelectronic devices, and output the deformation risk index; S5: Based on the six-degree-of-freedom deviation vector, deformation risk index, and coupling process quality index of the optical device, an adaptive position calibration control model is constructed, and a calibration displacement vector is output. Then, the position of the optical device is corrected according to the calibration displacement vector.
2. The coupling method for the optoelectronic device according to claim 1, characterized in that, In the comprehensive evaluation model of clamping quality in step S2: The clamping quality index is obtained by multiplying the following three factors: The first term is a negative exponential decay term based on the square of the L2 norm of the six-degree-of-freedom deviation vector; The second term is the ratio obtained by dividing the clamping force index by (1 plus the absolute value of the difference between the clamping force index and the preset optimal clamping force index); The third term is the linear enhancement term obtained by adding (1 to the product of the anti-slip safety margin and the gain coefficient).
3. The coupling method for the optoelectronic device according to claim 2, characterized in that, Each degree of freedom deviation in the six-degree-of-freedom deviation vector is normalized by dividing the actual deviation by the maximum permissible deviation for that degree of freedom.
4. The coupling method for the optoelectronic device according to claim 1, characterized in that, In the dynamic coupling process quality assessment model of step S3: The coupling process quality index is calculated as follows: First, the product of the axial extrusion pressure index and the pushing speed index, as well as the pushing jitter index, are weighted and averaged; second, the above weighted average result is multiplied by a negative exponential decay factor, the exponent of which is the negative of the square of the difference between the axial extrusion pressure index and the set optimal axial extrusion pressure threshold. The push jitter index is calculated by using a negative exponential function to determine the push jitter.
5. The coupling method for the optoelectronic device according to claim 4, characterized in that, The calculation method for the push speed index is as follows: When the measured push speed is lower than the optimal push speed, its value is linearly normalized between the minimum allowed push speed and the optimal push speed; when the measured push speed is higher than the optimal push speed, its value is linearly decreased and normalized between the optimal push speed and the maximum allowed push speed; the final value is limited to between 0 and 1.
6. The coupling method for the optoelectronic device according to claim 1, characterized in that, In step S4, the difference between the actual ambient temperature and the set reference ambient temperature is subtracted, and then divided by the set ambient temperature range value to obtain the ambient temperature index; in the deformation risk assessment model: The deformation risk index is obtained by multiplying the weighted combination of the clamping quality index, the coupling process quality index, and the stress accumulation factor index by an exponential function of the absolute value of the ambient temperature index. The stress accumulation factor index is calculated from the material stress accumulation factor in the form of a negative exponential saturation curve.
7. The coupling method for the optoelectronic device according to claim 1, characterized in that, In the adaptive position calibration control model of step S5: The calibration displacement vector is calculated as follows: multiply the six-degree-of-freedom deviation vector by a calibration gain matrix, and then multiply by an adjustment factor; the adjustment factor is 1 minus (the product of the deformation risk index and the deformation risk adjustment coefficient), plus (the product of the set coupling process quality adjustment coefficient and "1 minus the coupling process quality index").
8. The coupling method for the optoelectronic device according to claim 1, characterized in that, It also includes step S6, which specifically involves: constructing an adaptive optimization control model for clamping force based on the deformation risk index, the current environmental vibration level, and the measured static friction threshold of the optical device, and outputting the target clamping force of the optical device.
9. The coupling method for the optoelectronic device according to claim 8, characterized in that, The environmental vibration index is obtained by dividing the actual environmental vibration level by the preset upper limit of the environmental vibration level; in the clamping force adaptive optimization control model: The target clamping force is obtained by multiplying the measured static friction threshold by the linear enhancement factor of the environmental vibration index and the linear reduction factor of the deformation risk index, and then adding the increment of the basic clamping force.
10. A coupling device for an optoelectronic device, characterized in that, The coupling device of the optoelectronic device includes: Memory, used to store executable instructions; A processor, when executing executable instructions stored in the memory, implements the coupling method of the optoelectronic device according to any one of claims 1-9.