A temperature-controlled head for chip testing

Abstract

The application discloses a temperature control head for chip testing, which comprises a cold plate, an electric heating wire and a heat conducting block, the heat conducting block is used for pressing the chip to be tested, the cold plate is arranged on the heat conducting block, the cold plate is used for circulating the cold source, the cold source flows through the cold plate to exchange heat, and the electric heating wire is embedded in the heat conducting block, so that the electric heating wire heats the heat conducting block to provide heat for the chip. The cold plate, the heat conducting block and the chip form a continuous heat transfer path, the heat transfer path does not need to pass through the embedded electric heating wire, so that the additional thermal interface caused by the introduction of the electric heating wire is avoided, the increase of the thermal resistance is avoided, the heat transfer effect is enhanced, and the rapid temperature control of the chip is realized.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to a temperature control head for chip testing. Background Technology

[0002] In chip testing systems, especially for high-power, high-heat-generating chips, testing programs require stable operation over an extremely wide temperature range to verify their performance. To meet this stringent wide-temperature-range testing requirement, the testing system must be able to apply rapid and accurate temperature excitation to the chip; that is, the temperature controller needs to possess excellent rapid temperature control capabilities. Therefore, if an electric heating element is sandwiched between the cold plate and the heatsink, the heat transfer path between the cold plate and the heatsink will pass through the electric heating element, introducing an additional thermal interface. This increases thermal resistance, weakens heat transfer efficiency, and slows down temperature response, making rapid temperature control impossible. Summary of the Invention

[0003] The main objective of this invention is to provide a temperature control head for chip testing, which aims to reduce interface thermal resistance while achieving rapid temperature control of the chip.

[0004] To achieve the above objectives, the present invention proposes a temperature control head for chip testing, comprising a cold plate, a heating wire, and a heat-conducting block. The heat-conducting block is used to press the chip to be tested. The cold plate is disposed on the heat-conducting block and is used to allow the flow of a cold source to exchange heat. The heating wire is embedded in the heat-conducting block to heat the heat-conducting block and provide heat to the chip.

[0005] Optionally, the heat-conducting block has a curved groove, and the heating wire is bent along the extension direction of the curved groove so that the heating wire is embedded in the heat-conducting block by being installed in the curved groove.

[0006] Optionally, the heating wire includes a heating section and two lead sections. The heating section is bent between the two lead sections and installed in the bent groove. The two lead sections protrude from the same sidewall of the heat-conducting block.

[0007] Optionally, the temperature control head includes a plurality of heating wires, the heat-conducting block has a plurality of curved grooves, and the plurality of heating wires are respectively installed in the plurality of curved grooves.

[0008] Optionally, the heat-conducting block includes a first heat-conducting block and a second heat-conducting block stacked together, the cold plate is disposed on the first heat-conducting block, and the first heat-conducting block and the second heat-conducting block are respectively formed with the curved groove.

[0009] Optionally, the heat-conducting block has two opposite sides, and the two sides of the heat-conducting block are respectively formed with the curved grooves, so that the plurality of heating wires heat the chip to be tested from the side end of the heat-conducting block.

[0010] Optionally, the heat-conducting block includes a bottom surface, a top surface, and two opposite sides. The bottom surface, top surface, and two opposite sides of the heat-conducting block are respectively provided with the curved grooves so that multiple heating wires heat the heat-conducting block respectively.

[0011] Optionally, the heat-conducting block is filled with an insulating heat-conducting layer, which covers the heating wire so that the heating wire passes through the insulating heat-conducting layer and is embedded in the heat-conducting block.

[0012] Optionally, the cold plate includes a flow collector layer and a microchannel layer connected in series. The flow collector layer is used to introduce a cold source, and the surface of the microchannel layer facing away from the flow collector layer is disposed on the heat-conducting block.

[0013] Optionally, a sealing ring is sandwiched between the current collection layer and the microchannel layer to seal the installation gap between the current collection layer and the microchannel layer.

[0014] In the technical solution of this invention, a cold plate is disposed on a heat-conducting block, and a heating wire is embedded in the heat-conducting block. The surface of the heat-conducting block facing away from the cold plate is pressed onto the chip. In this way, the cold plate, the heat-conducting block and the chip form a continuous heat transfer path. Since this heat transfer path does not need to pass through the embedded heating wire, the additional thermal interface introduced by the heating wire is avoided, thereby avoiding the increase in thermal resistance, enhancing the heat transfer effect and realizing rapid temperature control of the chip. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of a temperature control head and a chip according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the temperature control head and chip according to another embodiment of the present invention; Figure 3 for Figure 1 Exploded structure diagram; Figure 4 for Figure 2 Exploded structure diagram; Explanation of icon numbers: The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0018] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0019] See Figures 1 to 4 As shown, in one embodiment of the present invention, a temperature control head 1000 for chip testing includes a cold plate 100, a heating wire 300, and a heat-conducting block 500. The heat-conducting block 500 is used to press the chip to be tested. The cold plate 100 is disposed on the heat-conducting block 500 and is used to allow the flow of a cold source, so that the cold source flows through the cold plate 100 to perform heat exchange. The heating wire 300 is embedded in the heat-conducting block 500 so that the heating wire 300 heats the heat-conducting block 500 to provide heat to the chip.

[0020] In the technical solution of this invention, a cold plate 100 is disposed on a heat-conducting block 500, and a heating wire 300 is embedded in the heat-conducting block 500. The surface of the heat-conducting block 500 facing away from the cold plate 100 is pressed onto the chip. In this way, the cold plate 100, the heat-conducting block 500 and the chip form a continuous heat transfer path. Since this heat transfer path does not need to pass through the embedded heating wire 300, the additional thermal interface introduced by the heating wire 300 is avoided, thereby avoiding the increase in thermal resistance, enhancing the heat transfer effect, and realizing rapid temperature control of the chip.

[0021] It should be noted that in this embodiment, both the cold plate 100 and the heat-conducting block 500 are structural components formed from heat-conducting materials. The heat-conducting material can be a metal material, such as copper or aluminum. The cold plate 100 and the heat-conducting block 500 can be integrally formed or separate structural components. The heating wire 300 is embedded in the heat-conducting block 500. When performing low-temperature performance testing of the chip, the cold source is usually coolant. The coolant continuously flows to the cold plate 100, and the heat-conducting block 500 absorbs the heat from the chip surface and transfers the heat to the cold plate 100. In this way, solid-liquid heat exchange occurs inside the cold plate 100, thereby achieving the cooling of the chip. When performing high-temperature performance testing of the chip, the heating wire 300 heats the chip by heating the heat-conducting block 500, thereby achieving the heating of the chip. In this embodiment, the heating wire 300 can be embedded on the surface of the heat-conducting block 500 facing the cold plate 100, thereby utilizing the large area of ​​the cold plate 100 to arrange more curved and meandering heating wires 300, thus meeting the heating requirements of high-power scenarios. The heating wire 300 can also be placed on the surface of the heat-conducting block 500 away from the cold plate 100, and can also be placed on the side of the heat-conducting block 500, thereby achieving uniform heating of the chip. Of course, in this embodiment, the heating wire 300 can be bent and placed on the heat-conducting block 500, thereby increasing the heating power through multiple bends and meanders of the heating wire 300. Multiple heating wires 300 can also be set, and multiple heating wires 300 can simultaneously heat the heat-conducting block 500 to achieve rapid temperature control of the chip under test. This embodiment is not limited to these, and all of the above are within the protection scope of this invention.

[0022] See Figures 1 to 4 As shown, in one embodiment of the present invention, the heat-conducting block 500 has a curved groove 500a, and the heating wire 300 is bent along the extending direction of the curved groove 500a so that the heating wire 300 is embedded in the heat-conducting block 500 by being installed in the curved groove 500a. It should be noted that the curved groove 500a in this embodiment can have different shapes, such as a spiral groove, a serpentine groove, a loop groove, or a sawtooth groove. In this embodiment, the curved groove 500a can be set according to the actual heating requirements. Furthermore, the curved groove 500a can be set on the top surface, the bottom surface, or the side surface of the heat-conducting block 500, as long as the heating wire 300 achieves the heating function of the heat-conducting block 500 by being bent in the curved groove 500a, this embodiment is not limited to these, and all of the above are within the protection scope of the present invention. Specifically, when high-power heating is required, in this embodiment, a curved groove 500a can be provided on the top surface of the heat-conducting block 500; When low-power heating is required, this embodiment can provide a bending groove 500a on the bottom surface of the heat-conducting block 500; when high heating power is required, this embodiment provides a bending groove 500a on the side surface of the heat-conducting block 500. By providing bending grooves 500a at different positions on the heat-conducting block 500, heating wires 300 with different heating powers can be installed, ensuring uniform heating of the pressed chip while meeting the heating requirements of different testing scenarios. In this embodiment, the heating wire 300 is bent and embedded in the heat-conducting block 500. The continuous bending of the heating wire 300 improves its heating efficiency, avoiding wiring chaos caused by multiple wiring connections while achieving rapid temperature control of the chip under test.

[0023] See Figures 1 to 4 As shown, in one embodiment of the present invention, the heating wire 300 includes a heating section 310 and two lead sections 330. The heating section 310 is bent between the two lead sections 330 and installed in a bending groove 500a. The two lead sections 330 protrude from the same sidewall of the heat-conducting block 500. It should be noted that in this embodiment, the two lead sections 330 protrude from the same sidewall of the heat-conducting block 500. Thus, the heat-conducting block 500 is arranged adjacent to the temperature control power supply, and the heat-conducting block 500 is connected to the positive and negative terminals of the temperature control power supply through the two lead sections 330, thereby realizing the heating function of the heating wire 300. This embodiment improves the heating efficiency of the heating wire 300 by repeatedly bending and meandering the heating section 310, while effectively avoiding circuit chaos, achieving simple wiring, and facilitating adaptation to the testing requirements of different chip scenarios.

[0024] See Figures 1 to 4 As shown, in one embodiment of the present invention, the temperature control head 1000 includes a plurality of heating wires 300, and the heat-conducting block 500 has a plurality of curved grooves 500a, with the plurality of heating wires 300 respectively mounted in the plurality of curved grooves 500a. It should be noted that in this embodiment, the heat-conducting block 500 is used to press the chip to be tested. The heat-conducting block 500 has a plurality of curved grooves 500a, which are spaced apart. This allows the plurality of heating wires 300 to simultaneously heat the pressed chip, facilitating rapid temperature control of the chip and improving the effectiveness of high-temperature performance testing. Of course, the multiple curved grooves 500a can be spaced apart inside the temperature control head 1000, or spaced apart on multiple surfaces of the temperature control head 1000. Specifically, the multiple curved grooves 500a can be respectively provided on the top and bottom surfaces of the heat-conducting block 500, or on the two sides of the heat-conducting block 500 facing away from each other, or on the bottom surface and the two sides facing away from each other, or even on the bottom surface, top surface and the two sides facing away from each other. This embodiment is not limited to these, and all of the above are within the protection scope of the present invention.

[0025] See Figures 1 to 4As shown, in one embodiment of the present invention, the heat-conducting block 500 includes a first heat-conducting block 510 and a second heat-conducting block 530 stacked together. A cold plate 100 is disposed on the first heat-conducting block 510. The first heat-conducting block 510 and the second heat-conducting block 530 are respectively formed with curved grooves 500a. It should be noted that, in this embodiment, the curved grooves 500a can be respectively formed inside the first heat-conducting block 510 and the second heat-conducting block 530, or the curved grooves 500a can be formed on the surface of the first heat-conducting block 510 away from the surface of the second heat-conducting block 530, or the curved grooves 500a can be formed on the surface of the second heat-conducting block 530 away from the surface of the first heat-conducting block 510. This embodiment is not limited to these, and all of the above are within the protection scope of the present invention. In this embodiment, the heat-conducting block 500 includes a bottom surface, a top surface, and multiple side surfaces. The surface of the first heat-conducting block 510 facing away from the surface of the second heat-conducting block 530 forms the top surface of the heat-conducting block 500. The surface of the second heat-conducting block 530 facing away from the surface of the first heat-conducting block 510 forms the bottom surface of the heat-conducting block 500. The chip to be tested is pressed onto the bottom surface of the heat-conducting block 500. Both the bottom and top surfaces of the heat-conducting block 500 have curved grooves 500a. Multiple heating wires 300 heat the bottom and top surfaces of the heat-conducting block 500 respectively, so that the heat-conducting block 500 is heated evenly. In this way, the heat-conducting block 500 transfers heat to the pressed chip, thereby achieving uniform heat transfer to the chip. This allows for precise temperature control of the chip to be tested, which is beneficial for achieving stable testing of the chip's high-temperature performance.

[0026] See Figures 1 to 4 As shown, in one embodiment of the present invention, the heat-conducting block 500 has two back-to-back sides, and curved grooves 500a are formed on each of the two sides of the heat-conducting block 500, so that multiple heating wires 300 heat the chip to be tested from the side of the heat-conducting block 500. It should be noted that in this embodiment, the top surface of the heat-conducting block 500 is surrounded by four sides, which are divided into two groups of back-to-back sides. In this embodiment, curved grooves 500a can be formed on both groups of back-to-back sides, or curved grooves 500a can be formed on only one group of back-to-back sides. In this embodiment, curved grooves 500a can be formed on the sides of the heat-conducting block 500 as needed. This embodiment is not limited to any particular type, and all of the above are within the protection scope of the present invention. In this embodiment, two heating wires 300 heat the back-to-back sides of the heat-conducting block 500 respectively, so that the heat-conducting block 500 uniformly transfers heat to the chip, thereby accurately controlling the temperature of the chip to be tested, which is beneficial for achieving stable testing of the chip's high-temperature performance.

[0027] See Figures 1 to 4As shown, in one embodiment of the present invention, the heat-conducting block 500 includes a bottom surface, a top surface, and two opposite sides. The bottom surface, top surface, and two opposite sides of the heat-conducting block 500 are respectively provided with curved grooves 500a so that multiple heating wires 300 respectively heat the heat-conducting block 500. It should be noted that in this embodiment, bending grooves 500a are respectively provided on the bottom surface, top surface, and two opposite sides of the heat-conducting block 500. Multiple heating wires 300 are respectively provided on the bending grooves 500a on the bottom surface, top surface, and two opposite sides of the heat-conducting block 500. When high-power heating is required, this embodiment can control the heating wires 300 on the top surface of the heat-conducting block 500 to heat the heat-conducting block 500; when low-power heating is required, this embodiment can control the heating wires 300 on the bottom surface of the heat-conducting block 500 to heat the heat-conducting block 500; when heating power is required, this embodiment can control the heating wires 300 on the sides of the heat-conducting block 500 to heat the heat-conducting block 500. In this way, by controlling the heating of the heating wires 300 at different positions of the heat-conducting block 500, the uniform heating of the pressed chip is ensured, thereby meeting the heating requirements of different testing scenarios.

[0028] See Figures 1 to 4 As shown, in one embodiment of the present invention, the heat-conducting block 500 is filled with an insulating thermally conductive layer, which covers the heating wire 300 so that the heating wire 300 passes through the insulating thermally conductive layer and is embedded in the heat-conducting block 500. It should be noted that the heat-conducting block 500 in this embodiment has a curved groove 500a, which is filled with an insulating thermally conductive layer. The insulating thermally conductive layer can be an aluminum oxide powder layer, a boron nitride powder layer, or a magnesium oxide powder layer, as long as the filling structure has insulating thermally conductive properties. Of course, the surface of the heat-conducting block 500 with the curved groove 500a can be filled with metal solder and polished to reduce thermal resistance and ensure heat transfer between the heat-conducting block 500 and the chip. This embodiment is not limited to this, and all of the above are within the protection scope of the present invention. In this embodiment, an insulating and thermally conductive layer is wrapped around the heating wire 300, which prevents safety accidents caused by accidental electric shock, while also facilitating heat transfer between the heat-conducting block 500 and the chip, thereby achieving rapid temperature control of the chip.

[0029] See Figures 1 to 4As shown, in one embodiment of the present invention, the cold plate 100 includes a current collection layer 110 and a microchannel layer 130 connected in series. The current collection layer 110 is used to introduce a cold source, and the surface of the microchannel layer 130 facing away from the current collection layer 110 is disposed on the heat-conducting block 500. It should be noted that in this embodiment, the manifold 110 is used to introduce coolant. The manifold 110 has a fluid inlet 110a, through which coolant is introduced into the manifold 110. The manifold 110 and the microchannel layer 130 are stacked, and the microchannel layer 130 forms microchannels 130a. The manifold 110 is connected to the microchannel 130a, so that coolant flows from the manifold 110 to the microchannel 130a. The coolant undergoes solid-liquid heat exchange in the microchannel 130a. Of course, in this embodiment, the fluid outlet 110b can be spaced apart from the fluid outlet 110b in the manifold 110. In this way, the coolant after heat exchange flows back to the manifold 110 due to the influence of fluid pressure and flows out through the fluid outlet 110b of the manifold 110, thereby achieving rapid temperature control of the chip under test and meeting the low-temperature performance testing requirements of the chip. This embodiment achieves rapid temperature control by independently setting the microchannel 130a and the heating wire 300, thereby meeting the requirements for wide temperature range testing.

[0030] See Figures 1 to 4 As shown, in one embodiment of the present invention, a sealing ring 120 is sandwiched between the current collection layer 110 and the microchannel layer 130 to seal the installation gap between the current collection layer 110 and the microchannel layer 130. It should be noted that in this embodiment, the sealing ring 120 can be installed on either the current collection layer 110 or the microchannel layer 130, as long as the sealing ring 120 achieves the seal between the current collection layer 110 and the microchannel layer 130. This embodiment is not limited to this, and all of the above are within the protection scope of the present invention. Specifically, in this embodiment, the microfluidic layer 130 forms microfluidic channels 130a, and an installation groove is provided around the microfluidic channel 130a. The sealing ring 120 is installed on the microfluidic layer 130 through the installation groove, and the current collector layer 110 is covered on the microfluidic layer 130 by abutting against the sealing ring 120. Of course, a limiting groove can also be provided on the surface of the current collector layer 110 facing the microfluidic layer 130, and the sealing ring 120 protrudes from the microfluidic layer 130, with part of the sealing ring 120 housed in the limiting groove, so that the current collector layer 110 and the microfluidic layer 130 are limited in their installation. In this embodiment, the setting of the sealing ring 120 realizes the flow of coolant inside the microfluidic channel 130a, thereby realizing solid-liquid heat exchange through the flow of coolant, thus realizing rapid temperature control of the chip under test, thereby meeting the requirements of wide temperature range testing.

[0031] The above description is merely an optional embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A temperature control head for chip testing, characterized in that, It includes a cold plate, a heating wire, and a heat-conducting block. The heat-conducting block is used to press the chip to be tested. The cold plate is disposed on the heat-conducting block and is used to allow the cold source to flow through the cold plate for heat exchange. The heating wire is embedded in the heat-conducting block to heat the heat-conducting block and provide heat to the chip.

2. The temperature control head for chip testing as described in claim 1, characterized in that, The heat-conducting block has a curved groove, and the heating wire is bent along the extension direction of the curved groove so that the heating wire is embedded in the heat-conducting block by being installed in the curved groove.

3. The temperature control head for chip testing as described in claim 2, characterized in that, The heating wire includes a heating section and two lead sections. The heating section is bent between the two lead sections and installed in the bent groove. The two lead sections protrude from the same side wall of the heat-conducting block.

4. The temperature control head for chip testing as described in claim 2, characterized in that, The temperature control head includes a plurality of heating wires, and the heat-conducting block has a plurality of curved grooves, with the plurality of heating wires respectively installed in the plurality of curved grooves.

5. The temperature control head for chip testing as described in claim 4, characterized in that, The heat-conducting block includes a first heat-conducting block and a second heat-conducting block stacked together. The cold plate is disposed on the first heat-conducting block, and the first heat-conducting block and the second heat-conducting block are respectively formed with the curved groove.

6. The temperature control head for chip testing as described in claim 4, characterized in that, The heat-conducting block has two sides facing away from each other, and the two sides of the heat-conducting block are respectively formed with the curved grooves, so that the multiple heating wires heat the chip to be tested from the side end of the heat-conducting block.

7. The temperature control head for chip testing as described in claim 4, characterized in that, The heat-conducting block includes a bottom surface, a top surface, and two opposite sides. The bottom surface, top surface, and two opposite sides of the heat-conducting block are respectively provided with the curved grooves so that multiple heating wires can heat the heat-conducting block respectively.

8. The temperature control head for chip testing as described in any one of claims 1 to 7, characterized in that, The heat-conducting block is filled with an insulating heat-conducting layer, which covers the heating wire so that the heating wire passes through the insulating heat-conducting layer and is embedded in the heat-conducting block.

9. The temperature control head for chip testing as described in any one of claims 1 to 7, characterized in that, The cold plate includes a flow collector layer and a microchannel layer connected together. The flow collector layer is used to introduce a cold source, and the surface of the microchannel layer facing away from the flow collector layer is disposed on the heat-conducting block.

10. The temperature control head for chip testing as described in claim 9, characterized in that, A sealing ring is sandwiched between the current collection layer and the microchannel layer to seal the installation gap between the current collection layer and the microchannel layer.

Images