Touch panel, manufacturing method thereof and touch display device

Abstract

The application provides a touch panel and a manufacturing method thereof, and a touch display device. The touch panel comprises a substrate, a first insulating layer arranged on the substrate and provided with a plurality of hole-shaped bridge patterns, a plurality of conductive bridge line patterns, the conductive bridge line patterns are all located in the hole-shaped bridge patterns and have the same thickness as the first insulating layer, a second insulating layer arranged on the side of the first insulating layer and the conductive bridge line patterns away from the substrate and provided with a via hole for connecting the conductive bridge line patterns, a touch electrode layer arranged on the side of the second insulating layer away from the substrate and comprising a plurality of first touch signal lines and a plurality of second touch signal lines, the first touch signal lines comprising a plurality of connected first touch electrode blocks, the second touch signal lines comprising a plurality of independent second touch electrode blocks, and adjacent second touch electrode blocks being connected through the conductive bridge line patterns, and a third insulating layer arranged on the side of the touch electrode layer away from the substrate.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a touch panel, a method for manufacturing the same, and a touch display device. Background Technology

[0002] The touch screen panel (TSP) design of active-matrix organic light-emitting diode (AMOLED) products typically requires two sets of signal lines (Tx (transmit) signal lines and Rx (receive) signal lines) to achieve touch functionality. The touch circuit (Touch IC) of the touch panel actively transmits a standard signal through the Tx signal lines, while the Rx signal lines are responsible for collecting signals. When a person touches the touch panel with their finger, the parasitic capacitance introduced by the finger in the touch area causes a change in the signal collected by the Rx signal lines in the corresponding area. This change makes the signal inconsistent with the standard signal transmitted by the Tx signal. The Touch IC can then determine that this area needs to be activated and feed the signal back to the display panel's driver circuit (Driver IC) to perform the corresponding action.

[0003] In related technologies, the Tx signal lines and Rx signal lines of the touch panel are set on the same layer and both use ITO (indium tin oxide) material. Typically, the Rx signal lines are wired horizontally and the Tx signal lines are wired vertically. The Tx signal lines and Rx signal lines are intersected. In the intersecting area, the Tx signal lines need to be bridged to the Tx blocks in the vertical direction through conductive bridge wiring patterns.

[0004] The conductive bridge wiring pattern can be created using either dry or wet etching processes. Regardless of the process, a slope angle will be generated on both sides of the conductive bridge wiring pattern (the slope angle created by dry etching is approximately 90°, while the slope angle created by wet etching is smaller). This causes the Rx signal lines subsequently formed above the conductive bridge wiring pattern to have sharp points at the points with larger slopes.

[0005] When the external environment has a large amount of static electricity, the Rx signal line is prone to tip discharge, which can cause the film layer to break down and short-circuit between the Tx signal line and the Rx signal line, resulting in the failure of the touch panel's touch function. Summary of the Invention

[0006] This invention provides a touch panel and its manufacturing method, as well as a touch display device, to solve the problem that when the external environment has a large amount of static electricity, the Rx signal line is prone to tip discharge, which leads to film layer breakdown, causing a short circuit between the Tx signal line and the Rx signal line, resulting in the failure of the touch function of the touch panel.

[0007] To solve the above-mentioned technical problems, the present invention is implemented as follows:

[0008] In a first aspect, embodiments of the present invention provide a touch panel, comprising:

[0009] Substrate;

[0010] A first insulating layer is disposed on the substrate, and a plurality of hole-shaped bridging patterns are formed on the first insulating layer;

[0011] Multiple conductive bridge wiring patterns, all of which are located within the hole-shaped bridge pattern, and the thickness of each conductive bridge wiring pattern is the same as the thickness of the first insulating layer;

[0012] A second insulating layer is disposed on the side of the first insulating layer and the conductive bridge wiring pattern away from the substrate, and a via is formed on the second insulating layer for overlapping the conductive bridge wiring pattern.

[0013] A touch electrode layer is disposed on the side of the second insulating layer away from the substrate. The touch electrode layer includes multiple first touch signal lines and multiple second touch signal lines. The first touch signal lines and the second touch signal lines are arranged in a cross pattern. The first touch signal lines include multiple connected first touch electrode blocks. The second touch signal lines include multiple independent second touch electrode blocks. Adjacent second touch electrode blocks are connected by the conductive bridge wiring pattern.

[0014] A third insulating layer is disposed on the side of the touch electrode layer away from the substrate.

[0015] Optionally, adjacent second touch electrode blocks are connected by at least two conductive bridge wiring patterns.

[0016] Optionally, the conductive bridge wiring pattern includes a first line segment, a second line segment, and a third line segment connected in sequence, wherein the first line segment is bent and connected to the first end of the second line segment, and the second end of the second line segment is bent and connected to the third line segment.

[0017] Optionally, the thickness of the second insulating layer is 4000-6000 angstroms.

[0018] Optionally, the conductive bridge wiring pattern is made of a metallic material, or the same transparent conductive material as the touch electrode layer.

[0019] Optionally, the first insulating layer, the second insulating layer, and the third insulating layer are made of the same material.

[0020] Secondly, embodiments of the present invention provide a touch display device, including the touch panel described in the first aspect above.

[0021] Thirdly, embodiments of the present invention provide a method for manufacturing a touch panel, comprising:

[0022] Provide substrates;

[0023] A first insulating layer is formed on the substrate, and a plurality of hole-shaped bridging patterns are formed on the first insulating layer;

[0024] Multiple conductive bridge wiring patterns are formed, all of which are located within the hole-shaped bridge pattern, and the thickness of the conductive bridge wiring pattern is the same as the thickness of the first insulating layer.

[0025] A second insulating layer is formed on the side of the first insulating layer and the conductive bridge wiring pattern away from the substrate, and a via for overlapping the conductive bridge wiring pattern is formed on the second insulating layer.

[0026] A touch electrode layer is formed on the side of the second insulating layer away from the substrate. The touch electrode layer includes multiple first touch signal lines and multiple second touch signal lines. The first touch signal lines and the second touch signal lines are arranged in a cross pattern. The first touch signal lines include multiple connected first touch electrode blocks. The second touch signal lines include multiple independent second touch electrode blocks. Adjacent second touch electrode blocks are connected by the conductive bridge wiring pattern.

[0027] A third insulating layer is formed on the side of the touch electrode layer away from the substrate.

[0028] Optionally, a plurality of hole-shaped bridging patterns are formed on the first insulating layer, including:

[0029] A negative photoresist film layer is formed on the first insulating layer;

[0030] Using a mask for forming the conductive bridge wiring pattern, the negative photoresist film layer is exposed and developed to form the negative photoresist pattern;

[0031] The first insulating layer is etched using a dry etching process, and the first insulating layer not covered by the negative photoresist pattern is etched away to form a hole-shaped bridging pattern.

[0032] The negative photoresist pattern is stripped away.

[0033] Optionally, multiple conductive bridge wiring patterns can be formed, including:

[0034] Forming a conductive material film;

[0035] A positive photoresist film layer is formed on the conductive material film layer;

[0036] Using a mask for forming the conductive bridge wiring pattern, the positive photoresist film layer is exposed and developed to form the positive photoresist pattern.

[0037] The conductive material film is etched using a wet or dry etching process, and the conductive material film not covered by the positive photoresist pattern is etched away to form the conductive bridge wiring pattern.

[0038] The positive photoresist pattern is stripped away.

[0039] In this embodiment of the invention, a first insulating layer with a hole-shaped bridging pattern is provided, and a conductive bridging pattern is placed inside the hole-shaped bridging pattern. The thickness of the first insulating layer is the same as the thickness of the conductive bridging pattern, making the film layer where the conductive bridging pattern is located a flat film layer. This ensures that the touch electrode layer formed above the conductive bridging pattern is not affected by the slope angle of the conductive bridging pattern, avoiding tip discharge when there is a large amount of static electricity in the external environment, improving the touch panel's resistance to air static discharge, and enhancing the stability of the touch panel. Attached Figure Description

[0040] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0041] Figure 1 Top view of the touch panel according to an embodiment of the present invention;

[0042] Figure 2 This is a partially enlarged schematic diagram of the touch panel according to an embodiment of the present invention;

[0043] Figure 3 for Figure 2 A cross-sectional view of the central touch panel at point A-A';

[0044] Figure 4 This is a partial enlarged view of the touch panel according to an embodiment of the present invention;

[0045] Figure 5 This is a cross-sectional view of a touch panel in related technologies;

[0046] Figure 6 This is a flowchart illustrating the manufacturing method of a touch panel according to an embodiment of the present invention.

[0047] Figure 7 This is a schematic diagram of a mask used to form the conductive bridge wiring pattern according to an embodiment of the present invention;

[0048] Figure 8 and Figure 9 This is a schematic diagram of a method for fabricating the first insulating layer according to an embodiment of the present invention;

[0049] Figure 10 and Figure 11 This is a schematic diagram of a method for fabricating a conductive bridge wiring pattern according to an embodiment of the present invention;

[0050] Explanation of reference numerals in the attached figures:

[0051] 10 Substrate; 11 First insulating layer; 12 Conductive bridge wiring pattern; 121 First line segment; 122 Second line segment; 123 Third line segment; 13 Second insulating layer; 14 Touch electrode layer; 141 First touch signal line; 1411 First touch electrode block; 142 Second touch signal line; 1421 Second touch electrode block; 15 Third insulating layer; 16 Touch signal line lead; 17 Bonding pad;

[0052] 20 The light-blocking body of the photomask; 21 The light-transmitting part of the photomask;

[0053] 30 Negative photoresist film layer; 31 Negative photoresist pattern;

[0054] 40 Positive photoresist film layer; 41 Positive photoresist pattern.

[0055] 12a Conductive material film layer. Detailed Implementation

[0056] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0057] Please refer to Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a top view of the touch panel according to an embodiment of the present invention. Figure 2 This is a partially enlarged schematic diagram of the touch panel according to an embodiment of the present invention. Figure 3 for Figure 2 A cross-sectional view of the touch panel along line A-A' in this embodiment of the invention. The touch panel includes:

[0058] Substrate 10; the substrate may be a rigid substrate, such as a glass substrate, or a flexible substrate, such as a polyimide (PI) substrate.

[0059] A first insulating layer 11 is disposed on the substrate 10, and a plurality of hole-shaped bridging patterns are formed on the first insulating layer 11; the first insulating layer 11 may be made of materials such as SiOx.

[0060] Multiple conductive bridge wiring patterns 12 are provided, all of which are located within the hole-shaped bridging pattern. The thickness of each conductive bridge wiring pattern 12 is the same as the thickness of the first insulating layer 11. The conductive bridge wiring patterns 12 can be made of metallic materials, such as molybdenum (Mo), or they can be made of the same transparent conductive material as the touch electrode layer, such as indium tin oxide (ITO).

[0061] The second insulating layer 13 is disposed on the side of the first insulating layer 11 and the conductive bridge wiring pattern 12 away from the substrate 10. The second insulating layer 13 has a via (not shown in the figure) for overlapping the conductive bridge wiring pattern. The second insulating layer 13 serves as an insulating layer and can be made of materials such as SiOx.

[0062] A touch electrode layer 14 is disposed on the side of the second insulating layer 13 away from the substrate 10. The touch electrode layer 14 includes multiple first touch signal lines 141 and multiple second touch signal lines 142. The first touch signal lines 141 and the second touch signal lines 142 are arranged intersectingly. The first touch signal lines 141 include multiple connected first touch electrode blocks 1411, and the second touch signal lines 142 include multiple independent second touch electrode blocks 1421. Adjacent second touch electrode blocks 1421 are connected by the conductive bridge wiring pattern 12. In some embodiments, optionally, the first touch signal lines 141 are wired horizontally, and the second touch signal lines 142 are wired vertically, with the first touch signal lines 141 and the second touch signal lines 142 arranged perpendicularly intersecting each other. In some embodiments, optionally, the first touch signal lines 141 are Rx signal lines, and the second touch signal lines 142 are Tx signal lines. In this embodiment of the invention, the first touch signal line 141 and the second touch signal line 142 are disposed on the same layer and use the same transparent conductive material, such as ITO.

[0063] The third insulating layer 15 is disposed on the side of the touch electrode layer 14 away from the substrate 10. The third insulating layer 15 is used to protect the touch electrode layer 14 and plays an insulating protection role. The third insulating layer 15 can be made of materials such as SiOx.

[0064] In this embodiment of the invention, a first insulating layer with a hole-shaped bridging pattern is provided, and a conductive bridging pattern is placed inside the hole-shaped bridging pattern. The thickness of the first insulating layer is the same as the thickness of the conductive bridging pattern, so that the film layer where the conductive bridging pattern is located is a flat film layer. This ensures that the touch electrode layer formed above the conductive bridging pattern is not affected by the slope angle of the conductive bridging pattern, avoiding tip discharge when the external environment has high static electricity. This improves the touch panel's resistance to electrostatic discharge (ESD) and enhances the stability of the touch panel.

[0065] In some embodiments, optionally, adjacent second touch electrode blocks 1421 are connected by at least two conductive bridge wiring patterns 12, so that adjacent second touch electrode blocks 1421 are connected in parallel, thereby effectively reducing the overall resistance of the second touch signal line 142. In addition, if one of the conductive bridge wiring patterns 12 is open-circuited, the other conductive bridge wiring patterns 12 can still ensure the normal operation of the second touch signal line 142, thus improving the stability of the touch panel.

[0066] In some embodiments, alternatively, please refer to Figure 4 The conductive bridge wiring pattern 12 includes a first line segment 121, a second line segment 122, and a third line segment 123 connected in sequence. The first line segment 121 is bent and connected to the first end of the second line segment 122, and the second end of the second line segment 122 is bent and connected to the third line segment 123. In this structure, the bend connection between the first line segment 121 and the second line segment 122 is an obtuse angle α, and the bend connection between the second line segment 122 and the third line segment 123 is also an obtuse angle α. For related technologies, please refer to... Figure 5 During the formation of the conductive bridge wiring pattern 01, stress concentration occurs on the inner side of the obtuse angle of the photoresist, resulting in a slope angle of 45°~52° for the conductive bridge wiring pattern 01 at this location (e.g., Figure 5 In the example where b1 is 45° and b2 is 52°, the slope angle at other locations of the conductive bridge wiring pattern 01 is relatively small, approximately 7~15°. When the slope angle reaches 45°~52°, it will cause the upper touch electrode layer 02 to generate a sharp point at the slope angle, which will easily lead to point discharge. In this embodiment of the invention, the film layer containing the conductive bridge wiring pattern is a flat film layer, which eliminates the influence of the slope angle of the conductive bridge wiring pattern on the slope of the upper touch electrode layer. The upper touch electrode layer is also formed as a flat film layer accordingly, thereby avoiding point discharge.

[0067] In some embodiments, optionally, the thickness of the second insulating layer 13 is 4000-6000 angstroms. In related technologies, the thickness of the insulating layer above the conductive bridge wiring pattern is usually 3000 angstroms. In this embodiment of the invention, the thickness of the second insulating layer 13 is increased, thereby further improving the flatness of the film layer below the touch electrode layer and avoiding the formation of sharp points in the touch electrode layer.

[0068] In some embodiments, optionally, the first insulating layer 11, the second insulating layer, and the third insulating layer 15 of 13 are made of the same material, thereby reducing the cost of the touch panel.

[0069] Please refer to Figure 1 The touch panel in this embodiment of the invention may further include touch signal line leads 16 and bonding pads 17. The touch signal line leads include a first lead and a second lead. The first lead is connected to a first touch signal line 141 and is used to connect the first touch signal line 141 to a bonding pad 17 disposed in a non-display area of ​​the substrate 10. The bonding pad 17 is used to bond a touch circuit (Touch IC).

[0070] The touch panel in this embodiment of the invention can be an On-Cell structure touch panel or an In-Cell structure touch panel. On-Cell means that the touch panel is located on top of the display panel, while In-Cell means that the touch panel is located inside the display panel.

[0071] In some simulation experiments, the structure in the embodiments of the present invention can improve the anti-static discharge capability of the touch panel from 10 KeV to 24 KeV.

[0072] This invention also provides a touch display device, including the touch panel described in any of the above embodiments. The touch display device can be a wristband, watch, mobile phone, tablet, computer, etc.

[0073] Please refer to the control Figure 6 This invention also provides a method for manufacturing a touch panel, comprising:

[0074] Step S1: Provide a substrate;

[0075] Step S2: A first insulating layer is formed on the substrate, and a plurality of hole-shaped bridging patterns are formed on the first insulating layer;

[0076] Step S3: Form multiple conductive bridge wiring patterns, all of which are located within the hole-shaped bridge pattern, and the thickness of the conductive bridge wiring patterns is the same as the thickness of the first insulating layer;

[0077] Step S4: A second insulating layer is formed on the side of the first insulating layer and the conductive bridge wiring pattern away from the substrate, and a via for overlapping the conductive bridge wiring pattern is formed on the second insulating layer;

[0078] Step S5: A touch electrode layer is formed on the side of the second insulating layer away from the substrate. The touch electrode layer includes multiple first touch signal lines and multiple second touch signal lines. The first touch signal lines and the second touch signal lines are arranged in a cross pattern. The first touch signal lines include multiple connected first touch electrode blocks. The second touch signal lines include multiple independent second touch electrode blocks. Adjacent second touch electrode blocks are connected by the conductive bridge wiring pattern.

[0079] Step S6: A third insulating layer is formed on the side of the touch electrode layer away from the substrate.

[0080] In this embodiment of the invention, before forming the conductive bridge wiring pattern, a first insulating layer with a hole-shaped bridging pattern is first formed. The conductive bridge wiring pattern is then formed on the hole-shaped bridging pattern. The thickness of the first insulating layer is the same as the thickness of the conductive bridge wiring pattern, making the film layer on which the conductive bridge wiring pattern is located a flat film layer. This ensures that the touch electrode layer formed above the conductive bridge wiring pattern is not affected by the slope angle of the conductive bridge wiring pattern, avoiding tip discharge when there is a large amount of static electricity in the external environment. This improves the touch panel's resistance to air static discharge and enhances the stability of the touch panel.

[0081] In some embodiments, alternatively, please refer to Figure 7 , Figure 8 and Figure 9 Multiple hole-shaped bridging patterns are formed on the first insulating layer, including:

[0082] Step S21: Form a negative photoresist film layer 30 on the first insulating layer 11;

[0083] Step S22: Please refer to Figure 7 and Figure 8 Using a photomask for forming the conductive bridge wiring pattern, the negative photoresist film layer 30 is exposed and developed to form the negative photoresist pattern 31. Please refer to... Figure 7 , Figure 7 This is a schematic diagram of a photomask used to form the conductive bridge wiring pattern according to an embodiment of the present invention. The photomask includes a light-shielding body 20 and a light-transmitting portion 21 disposed on the light-shielding body 20. When the negative photoresist film layer 30 is exposed using the photomask of the present invention, light passes through the light-transmitting portion 21 and irradiates the negative photoresist film layer 30. In the development process, the irradiated negative photoresist film layer 30 is not developed away, while the unirradiated negative photoresist film layer 30 is developed away.

[0084] Step S23: Please refer to Figure 9 The first insulating layer 11 is etched using a dry etching process, and the first insulating layer 11 not covered by the negative photoresist pattern 30 is etched away to form a hole-shaped bridging pattern 111.

[0085] Step S24: Strip the negative photoresist pattern 31.

[0086] In some embodiments, alternatively, please refer to Figure 10 and Figure 11 This forms multiple conductive bridge wiring patterns, including:

[0087] Step S31: Form a conductive material film layer 12a;

[0088] Step S32: Form a positive photoresist film layer 40 on the conductive material film layer 12a;

[0089] Step S33: Using a mask for forming the conductive bridge wiring pattern, the positive photoresist film layer 40 is exposed and developed to form the positive photoresist pattern 41; please refer to Figure 7 , Figure 7 The mask used in this embodiment of the invention for forming the conductive bridge wiring pattern includes a light-shielding body 20 and a light-transmitting portion 21 disposed on the light-shielding body 20. When the mask of this embodiment of the invention is used to expose the positive photoresist film layer 40, light shines on the positive photoresist film layer 40 through the light-transmitting portion 21. In the development process, the exposed positive photoresist film layer 40 is developed away, while the unexposed positive photoresist film layer 40 is not developed away, which is exactly the opposite of negative photoresist.

[0090] Step S34: The conductive material film 12a is etched using a wet etching or dry etching process. The conductive material film 12a not covered by the positive photoresist pattern 40 is etched away to form the conductive bridge wiring pattern 12.

[0091] Step S35: Peel off the positive photoresist pattern 40.

[0092] In this embodiment of the invention, optionally, the first insulating layer, the second insulating layer and the third insulating layer can be formed by chemical vapor deposition (CVD) process. If etching is required, the pattern can be formed on the insulating layer by dry etching process.

[0093] In this embodiment of the invention, optionally, the touch electrode layer can first be formed into an ITO film layer using a sputtering process, then exposed and developed using a corresponding mask, and finally formed into the first touch signal line and the second touch signal line of the touch electrode layer using a dry etching process.

[0094] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

Claims

1. A touch panel, characterized in that, include: Substrate; A first insulating layer is disposed on the substrate, and a plurality of hole-shaped bridging patterns are formed on the first insulating layer; Multiple conductive bridge wiring patterns, all of which are located within the hole-shaped bridge pattern, and the thickness of each conductive bridge wiring pattern is the same as the thickness of the first insulating layer; A second insulating layer is disposed on the side of the first insulating layer and the conductive bridge wiring pattern away from the substrate, and a via is formed on the second insulating layer for overlapping the conductive bridge wiring pattern. A touch electrode layer is disposed on the side of the second insulating layer away from the substrate. The touch electrode layer includes multiple first touch signal lines and multiple second touch signal lines. The first touch signal lines and the second touch signal lines are arranged in a cross pattern. The first touch signal lines include multiple connected first touch electrode blocks. The second touch signal lines include multiple independent second touch electrode blocks. Adjacent second touch electrode blocks are connected by the conductive bridge wiring pattern. A third insulating layer is disposed on the side of the touch electrode layer away from the substrate.

2. The touch panel according to claim 1, characterized in that, Adjacent second touch electrode blocks are connected by at least two conductive bridge wiring patterns.

3. The touch panel according to claim 1, characterized in that, The conductive bridge wiring diagram includes a first line segment, a second line segment, and a third line segment connected in sequence. The first line segment is bent and connected to the first end of the second line segment, and the second end of the second line segment is bent and connected to the third line segment.

4. The touch panel according to claim 1, characterized in that, The thickness of the second insulating layer is 4000-6000 angstroms.

5. The touch panel according to claim 1, characterized in that, The conductive bridge wiring pattern is made of a metallic material, or the same transparent conductive material as the touch electrode layer.

6. The touch panel according to claim 1, characterized in that, The first insulating layer, the second insulating layer, and the third insulating layer are made of the same material.

7. A touch display device, characterized in that, Including the touch panel as described in any one of claims 1-4.

8. A method for manufacturing a touch panel, characterized in that, include: Provide substrates; A first insulating layer is formed on the substrate, and a plurality of hole-shaped bridging patterns are formed on the first insulating layer; Multiple conductive bridge wiring patterns are formed, all of which are located within the hole-shaped bridge pattern, and the thickness of the conductive bridge wiring pattern is the same as the thickness of the first insulating layer. A second insulating layer is formed on the side of the first insulating layer and the conductive bridge wiring pattern away from the substrate, and a via for overlapping the conductive bridge wiring pattern is formed on the second insulating layer. A touch electrode layer is formed on the side of the second insulating layer away from the substrate. The touch electrode layer includes multiple first touch signal lines and multiple second touch signal lines. The first touch signal lines and the second touch signal lines are arranged in a cross pattern. The first touch signal lines include multiple connected first touch electrode blocks. The second touch signal lines include multiple independent second touch electrode blocks. Adjacent second touch electrode blocks are connected by the conductive bridge wiring pattern. A third insulating layer is formed on the side of the touch electrode layer away from the substrate.

9. The method for manufacturing a touch panel according to claim 8, characterized in that, Multiple hole-shaped bridging patterns are formed on the first insulating layer, including: A negative photoresist film layer is formed on the first insulating layer; Using a mask for forming the conductive bridge wiring pattern, the negative photoresist film layer is exposed and developed to form the negative photoresist pattern. The first insulating layer is etched using a dry etching process, and the first insulating layer not covered by the negative photoresist pattern is etched away to form a hole-like bridging pattern. The negative photoresist pattern is stripped away.

10. The method for manufacturing a touch panel according to claim 8, characterized in that, Multiple conductive bridge wiring patterns are formed, including: Forming a conductive material film; A positive photoresist film layer is formed on the conductive material film layer; Using a mask for forming the conductive bridge wiring pattern, the positive photoresist film layer is exposed and developed to form the positive photoresist pattern. The conductive material film is etched using a wet or dry etching process, and the conductive material film not covered by the positive photoresist pattern is etched away to form the conductive bridge wiring pattern. The positive photoresist pattern is stripped away.

Images