High speed backplane connector assembly line

Abstract

The application discloses a high-speed backboard connector assembly line, which comprises a feeding rack module, a workbench, a cutting module, a transfer module, a shielding piece final pressing module, a cleaning module, a hot riveting module, a CCD detection module, a rivet point spring height detection module and a packaging and discharging module which are sequentially arranged on the workbench along the direction of the assembly line; the feeding rack module feeds needle bases and shielding pieces and the cutting module cuts the needle bases and the shielding pieces; the transfer module sequentially transfers the cut needle bases and shielding pieces to the shielding piece final pressing module, the cleaning module, the hot riveting module and the CCD detection module; the packaging and discharging module carries the assembled Wafer connector to the rivet point spring height detection module for spring height detection and carries the Wafer connector out by the packaging and discharging module. The application has the advantages of simple structure, efficient and reliable assembly and high practical value and popularization value in the technical field of connector assembly.

Description

Technical Field

[0001] This invention relates to the field of connector assembly technology, and in particular to a high-speed backplane connector assembly line. Background Technology

[0002] like Figure 1 As shown, this technology mainly assembles a pin header 100 (i.e., a wafer) and a shield 200, which are composed of metal terminals and a plastic base assembly. During assembly, the shield 200 needs to be pressed onto the pin header 100 and then hot-riveted. Currently, there is no corresponding automated assembly line in the existing technology; assembly relies solely on manual labor, resulting in low assembly efficiency, a low yield rate, and inconvenience for subsequent connector installation.

[0003] Therefore, there is an urgent need to propose a high-speed backplane connector assembly line that is simple in structure, efficient and reliable in assembly. Summary of the Invention

[0004] To address the above problems, the present invention aims to provide a high-speed backplane connector assembly line. The technical solution adopted by the present invention is as follows: A high-speed backplane connector assembly line assembles pin headers and shielding components to obtain wafer connectors. The line includes a feeding rack module and a worktable, and a cutting module, a transfer module, a shielding component final pressing module, a cleaning module, a hot riveting module, a CCD detection module, a rivet point spring height detection module, and a packaging and unloading module, all fixed on the worktable and arranged sequentially along the assembly line direction. The feeding rack module feeds the pin headers and shielding components, which are then cut by the cutting module. The transfer module sequentially transfers the cut pin headers and shielding components to the shielding component final pressing module, the cleaning module, the hot riveting module, and the CCD detection module. The packaging and unloading module transports the assembled wafer connectors to the rivet point spring height detection module for spring height detection and unloads them using the packaging and unloading module. The transfer module is provided with a transfer material tank; the transfer material tank is provided with a needle holder and a shielding component cut by the cutting module; the hot riveting module performs hot riveting on the needle holder and shielding component in the transfer material tank.

[0005] Compared with the prior art, the present invention has the following beneficial effects: (1) The present invention sets up a feeding rack module, which is driven by the material rack lateral moving component to move in the lateral direction, so as to be applicable to multiple cutting channels and cutting mold positions. The present invention uses a set of feeding rack modules for use. When changing molds, the feeding rack module is pushed to the corresponding module position that needs to be produced, ensuring its flexibility and reliability.

[0006] (2) The present invention sets up a cutting module and sets up a waste box, a cutting channel support frame, a cutting channel, a cutting mold and a waste cutting module on the cutting module. The cutting mold is used to cut the needle seat and the shielding part, and the waste cutting module is used to cut the strip after cutting the needle seat and the shielding part, so as to ensure reliable waste collection.

[0007] (3) The present invention provides a transfer module that transfers the pin holder and shielding component to the shielding component final pressing module, cleaning module, hot riveting module, and CCD detection module, ensuring reliable transmission. In addition, the transfer module of the present invention works in conjunction with the shielding component final pressing module and the cleaning module to ensure reliable assembly.

[0008] (4) By setting up a hot riveting module, the present invention uses a first motor to drive the hot melt assembly to move back and forth in the longitudinal direction, so as to press down and hot rivet the needle seat and shielding part in the transfer material tank to ensure its installation reliability.

[0009] (5) The present invention sets up a CCD detection module and a rivet spring height detection module to facilitate the detection of Wafer connectors, and coordinates with the packaging and unloading module for handling and sorting of good and bad products to ensure the quality and efficiency of assembly.

[0010] In summary, this invention has the advantages of simple structure and efficient and reliable assembly, and has high practical and promotional value in the field of connector assembly technology. Attached Figure Description

[0011] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope of protection. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the Wafer connector in this invention.

[0013] Figure 2 This is a schematic diagram of the structure of the present invention.

[0014] Figure 3 This is a schematic diagram of the material feeding rack module in this invention.

[0015] Figure 4 This is a schematic diagram of the cutting module in this invention.

[0016] Figure 5 This is a schematic diagram of the cutting channel structure in this invention.

[0017] Figure 6This is a schematic diagram of the feeding drive mechanism in this invention.

[0018] Figure 7 This is a schematic diagram of the waste material cutting module in this invention.

[0019] Figure 8 This is a schematic diagram of the waste cutting blade assembly in this invention.

[0020] Figure 9 This is a schematic diagram of the transfer module in this invention.

[0021] Figure 10 This is a schematic diagram of the material handling mechanism in this invention.

[0022] Figure 11 This is a schematic diagram of the transfer sliding module in this invention.

[0023] Figure 12 This is a schematic diagram of the material transfer tank in this invention.

[0024] Figure 13 This is a schematic diagram of the final pressure module of the shielding component in this invention.

[0025] Figure 14 This is a schematic diagram showing the layout of the transfer module, shielding component final pressure module, cleaning module, hot riveting module, CCD detection module, and rivet point spring height detection module in this invention.

[0026] Figure 15 This is a schematic diagram of the cleaning module in this invention.

[0027] Figure 16 This is a schematic diagram of the first angle of the hot riveting module in this invention.

[0028] Figure 17 This is a second-angle schematic diagram of the hot riveting module in this invention.

[0029] Figure 18 This is a schematic diagram of the hot riveting module from the third angle in this invention.

[0030] Figure 19 This is a schematic diagram of the hot riveting module after removing the hot melter mounting cover according to the present invention.

[0031] Figure 20 This is a schematic diagram of the CCD detection module in this invention.

[0032] Figure 21 This is a schematic diagram of the rivet spring height detection module in this invention.

[0033] Figure 22 This is a schematic diagram of the packaging dispensing module in this invention.

[0034] Figure 23 This is a schematic diagram of the structure of the unloading and handling robot and the unloading and picking module in this invention.

[0035] Figure 24 This is a schematic diagram of the material feeding and unloading module in this invention.

[0036] In the above figures, the component names corresponding to the reference numerals are as follows: 100. Needle holder; 200. Shielding component; 1. Feeding rack module; 2. Cutting module; 3. Transfer module; 4. Shielding component final pressing module; 5. Cleaning module; 6. Hot riveting module; 7. CCD detection module; 8. Rivet point spring height detection module; 9. Packaging discharge module; 10. Workbench; 11. Material rack base; 12. Material rack lateral movement assembly; 13. Feeding tray mounting frame; 14. Needle holder feeding tray assembly; 15. Shielding component feeding tray assembly; 21. Scrap box; 22. Cutting flow channel support frame; 23. Cutting flow channel; 24. Cutting mold; 25. Scrap cutting module; 231. Flow channel support frame; 232. Blowing brush assembly; 233. First dust suction assembly; 234. First position sensing detection mechanism 235. Feeding drive mechanism; 251. Scrap cutting blade assembly; 252. Scrap trough support frame; 253. Scrap trough; 254. Scrap receiving hopper; 2351. Feeding propulsion cylinder; 2352. Propulsion limit seat; 2353. Propulsion linkage plate; 2354. Positioning and moving cylinder; 2355. Positioning slider head; 2511. Scrap cylinder mounting base; 2512. Scrap cylinder; 2513. Fixed cutting blade head; 2514. Movable cutting blade head; 31. Transfer sliding module; 32. Material trough mounting base; 33. Picking support base; 34. Picking mechanism; 321. Transfer material trough; 341. Picking mechanism mounting base; 342. Picking sliding module; 343. Up and down picking cylinder Components; 344, Material suction nozzle fixing seat; 345, Material suction nozzle; 3211, Carrier; 3212, Carrier opening and closing cylinder; 3213, Carrier opening and closing linkage plate; 3214, Opening and closing slider; 3215, Carrier upper cover; 41, Shielding component final pressure mounting bracket; 42, Final pressure drive cylinder; 43, Final pressure mold; 51, Cleaning module mounting bracket; 52, Blowing assembly; 61, Hot riveting mounting bracket; 62, Hot riveting horizontal sliding module; 63, First horizontal sliding seat; 64, Motor mounting bracket; 65, First motor; 66, Hot melt assembly; 661, First longitudinal slide rail slider assembly; 662, First longitudinal slide plate; 663, Transverse strip hole; 664, Hot melt mounting bracket; 665, Hot melt machine mounting cover; 666. Hot melt machine; 71. CCD detection drive module; 72. Fisheye CCD detection camera assembly; 81. Spring-loaded CCD detection drive module; 82. Spring-loaded CCD detection camera assembly; 83. Snap-on CCD detection drive module; 84. Snap-on CCD detection camera assembly; 85. Finished product detection support frame; 91. Unloading and handling robot; 92. Unloading and picking module; 93. Discharge tray; 94. Defective product box; 95. Mold change detection sensor assembly; 921. Mold change connector; 922. Nozzle mounting support plate; 923. Tray suction nozzle assembly; 924. Discharge suction nozzle assembly; 9241. Second suction nozzle drive cylinder; 9242. Second suction nozzle mounting base; 9243. Second suction nozzle. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this application clearer, the present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of the present invention include, but are not limited to, the following embodiments. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0038] In this embodiment, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0039] The terms "first" and "second," etc., used in the specification and claims of this embodiment are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0040] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0041] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0042] like Figures 1 to 24As shown, this embodiment provides a high-speed backplane connector assembly line that assembles pin headers 100 and shielding components 200 to obtain a wafer connector. Specifically, the high-speed backplane connector assembly line includes a feeding rack module 1 and a worktable 10, as well as a cutting module 2, a transfer module 3, a shielding component final pressing module 4, a cleaning module 5, a hot riveting module 6, a CCD detection module 7, a rivet point spring height detection module 8, and a packaging and unloading module 9, which are fixed on the worktable 10 and arranged sequentially along the assembly line direction. The feeding rack module 1 feeds the pin headers 100 and shielding components 200 separately, and the cutting module 2 cuts them to obtain the pin headers 100 and shielding components 200. The transfer module 3 then sequentially transfers the cut pin headers 100 and shielding components 200 to the shielding component final pressing module 4, the cleaning module 5, the hot riveting module 6, and the CCD detection module 7. At the station where the shielding component final pressing module 4 is located, the pin header 100 and shielding component 200 in the transfer material tray 321 are pressed. Then, the cleaning module 5 cleans the pressed pin header 100 and shielding component 200, and the hot riveting module 6 hot rivets the pin header 100 and shielding component 200 in the transfer material tray 321. After the pin header 100 and shielding component 200 are hot riveted to form a wafer connector, the CCD detection module 7 and the riveting point spring height detection module 8 are used to perform a good product inspection after assembly, so that the packaging and unloading module 9 can classify the wafer connectors. Here, the packaging and unloading module 9 transports the assembled wafer connector to the riveting point spring height detection module 8 for spring height detection, and uses the packaging and unloading module 9 to unload the connector.

[0043] In this embodiment, the feeding rack module 1 includes a feeding rack base 11, a feeding rack lateral movement assembly 12 disposed on the feeding rack base 11, a feeding tray mounting frame 13 disposed on the feeding rack base 11 and moved by the feeding rack lateral movement assembly 12, and a needle seat feeding tray assembly 14 and a shielding component feeding tray assembly 15 disposed on the feeding tray mounting frame 13. Here, the needle seat feeding tray assembly 14 feeds out the needle seat material strip, and the shielding component feeding tray assembly 15 feeds out the shielding component material strip; the needle seat material strip and the shielding component material strip respectively enter the cutting module 2 for cutting to obtain the needle seat 100 and the shielding component 200.

[0044] Here, the cutting module 2 includes a waste box 21 fixed on the workbench 10, a cutting channel support frame 22 set on the waste box 21, a cutting channel 23 and a cutting mold 24 set on top of the cutting channel support frame 22 for cutting the material fed from the feeding rack module 1, and a waste cutting module 25 set on the waste box 21. The cutting channel support frame 22, the cutting channel 23, the cutting mold 24 and the waste cutting module 25 are arranged in an array, which cuts the needle seat material strip and the shielding material strip respectively.

[0045] Taking the needle seat material strip as an example, it enters the cutting channel 23 and is cut into a needle seat 100 using the cutting mold 24; the cut waste material enters the waste material cutting module 25 for waste material cutting. Specifically, the cutting channel 23 includes a channel support frame 231 fixed on the cutting channel support frame 22, and a blowing brush assembly 232, a first dust suction assembly 233, a first position sensing detection mechanism 234, and a feeding drive mechanism 235 arranged sequentially on the channel support frame 231 along the channel transmission direction. The feeding drive mechanism 235 includes a feeding cylinder 2351 and a feeding limit seat 2352 fixed on the flow channel support frame 231, a feeding linkage plate 2353 connected to the feeding cylinder 2351 and limited within the feeding limit seat 2352, a positioning and moving cylinder 2354 fixed longitudinally on the feeding linkage plate 2353, and a positioning slider head 2355 disposed at the bottom of the positioning and moving cylinder 2354. Here, the positioning and moving cylinder 2354 drives the positioning slider head 2355 to insert into the needle seat material strip on the flow channel support frame 231, and the feeding cylinder 2351 pushes the needle seat material strip forward, so that the cutting die 24 can cut the needle seats 100 one by one.

[0046] After the needle holders 100 on the needle holder material strip are cut, the waste material enters the waste cutting knife assembly 251 along the waste material tray 253 and the waste material receiving hopper 254. Here, the waste cutting module 25 includes a waste material tray support frame 252 fixed to the lower part of the cutting channel support frame 22, and the waste cutting knife assembly 251, the waste material tray 253, and the waste material receiving hopper 254 are arranged on the waste material tray support frame 252 from bottom to top. The waste material receiving hopper 254 and the waste material tray 253 receive the waste material cut by the cutting mold 24, and the waste material is cut by the waste material cutting knife assembly 251. The waste material cutting assembly 251 includes a waste cylinder mounting base 2511 and a fixed cutting head 2513 fixed on the waste material trough support frame 252, a waste cylinder 2512 fixed on the waste cylinder mounting base 2511, and a movable cutting head 2514 disposed at the front end of the waste cylinder 2512 and opposite to the fixed cutting head 2513. Under the pushing action of the waste cylinder 2512, the movable cutting head 2514 moves closer to the fixed cutting head 2513 and cuts the waste material. The cut waste material enters the waste box 21, ensuring reliable storage.

[0047] In this embodiment, the cut needle base 100 and shielding component 200 need to undergo final assembly, hot riveting, and other operations. Therefore, the transfer module 3 includes a transfer sliding module 31 fixed on the worktable 10 and a material picking support 33, a material tray mounting base 32 disposed on the transfer sliding module 31, and a material picking mechanism 34 disposed on the material picking support 33 for transporting the needle base 100 and shielding component 200 cut by the cutting module 2. Several transfer material trays 321 are disposed on the material tray mounting base 32. Here, the material picking mechanism 34 is used to transport the needle base 100 and shielding component 200 cut by the cutting mold 24 into the transfer material trays 321.

[0048] The material handling mechanism 34 includes a material handling mechanism mounting base 341 fixed on the material handling support base 33, a material handling sliding module 342 disposed on the material handling mechanism mounting base 341, an upper and lower material handling cylinder assembly 343 disposed on and driven by the material handling sliding module 342, a material handling suction nozzle fixing base 344 disposed on the upper and lower material handling cylinder assembly 343, and a material handling suction nozzle 345 disposed at the bottom of the material handling suction nozzle fixing base 344. The material handling suction nozzle 345 adsorbs the needle seat 100 and the shield 200.

[0049] In this embodiment, to ensure reliable handling of the transfer module 3 and facilitate subsequent final pressing and hot riveting operations, the transfer material tank 321 includes a carrier 3211 and a carrier opening / closing cylinder 3212 disposed on the material tank mounting base 32, a carrier opening / closing linkage plate 3213 connected to the carrier opening / closing cylinder 3212, an opening / closing slider 3214 disposed through one side of the carrier 3211 and connected to the carrier opening / closing linkage plate 3213, and a carrier upper cover 3215 disposed on the carrier 3211. The carrier opening / closing cylinder 3212 pushes the opening / closing slider 3214 to compress the needle seat 100 and the shield 200 inside the carrier 3211.

[0050] In this embodiment, a final pressing module 4 is used to perform a final pressing operation on the needle holder 100 and the shield 200. The final pressing module 4 includes a final pressing mounting bracket 41 fixed on the worktable 10, a final pressing drive cylinder 42 disposed on the final pressing mounting bracket 41, and a final pressing mold 43 disposed at the bottom of the final pressing drive cylinder 42. The final pressing mold 43 compresses the needle holder 100 and the shield 200 in the transfer material tank 321.

[0051] In this embodiment, after the needle holder 100 and the shield 200 are pressed together, they are cleaned using the cleaning module 5. The cleaning module 5 includes a cleaning module mounting bracket 51 fixed on the workbench 10, and a blowing assembly disposed on the cleaning module mounting bracket 51.

[0052] After the needle holder 100 and shielding member 200 are cleaned, a hot riveting operation is performed using the hot riveting module 6. The hot riveting module 6 includes a hot riveting mounting bracket 61, a hot riveting horizontal sliding module 62 mounted on the hot riveting mounting bracket 61, a first horizontal sliding seat 63 mounted on and driven by the hot riveting horizontal sliding module 62, a motor mounting seat 64 fixed on the first horizontal sliding seat 63, a first motor 65 fixed on the motor mounting seat 64, and a hot melt assembly 66 mounted on the motor mounting seat 64 and driven by the first motor 65 to reciprocate longitudinally. Here, the hot melt assembly 66 moves downwards to perform hot riveting on the needle holder 100 and shielding member 200. The hot melt assembly 66 includes a first longitudinal slide rail slider assembly 661 fixed in the longitudinal direction to the motor mounting base 64, a first longitudinal slide plate 662 connected to the first longitudinal slide rail slider assembly 661, a transverse strip hole 663 formed in the first longitudinal slide plate 662, a hot melt mounting base 664 fixed to the lower part of the first longitudinal slide plate 662, and a hot melt device 666 disposed at the lower part of the hot melt mounting base 664. A hot melt device mounting cover 665 is fitted onto the hot melt device 666.

[0053] In this embodiment, a circular turntable is provided on the first motor 65, and a drive roller is provided on the circular turntable. The drive roller is located on the edge of the circular turntable, and the front end of the drive roller is placed in the transverse strip hole 663. When the first motor 65 drives the circular turntable to rotate, the rotation of the circular turntable drives the drive roller to move along the transverse strip hole 663, and drives the hot melt mounting base 664 to reciprocate in the longitudinal direction, so as to drive the hot melt machine 666 to perform hot riveting processing on the pin seat 100 and the shield 200.

[0054] After the pin holder 100 and shield 200 are heat-riveted to form the wafer connector, the assembly quality of the wafer connector needs to be inspected. This is done using a CCD detection module 7 and a rivet point spring-up detection module 8. The CCD detection module 7 includes a CCD detection drive module 71 fixed on the worktable 10, and a fisheye CCD detection camera assembly 72 mounted on the CCD detection drive module 71; the fisheye CCD detection camera assembly 72 faces the wafer connector. The rivet point spring-up detection module 8 includes a spring-up CCD detection drive module 81, a snap-fit ​​CCD detection drive module 83, and a finished product inspection support frame 85 fixed on the worktable 10; the spring-up CCD detection camera assembly 82 mounted on the spring-up CCD detection drive module 81; and a snap-fit ​​CCD detection camera assembly 84 mounted on the snap-fit ​​CCD detection drive module 83. Among them, the spring-loaded CCD inspection camera assembly 82 and the snap-on CCD inspection camera assembly 84 are arranged vertically and both face the Wafer connector on the finished product inspection support frame 85.

[0055] After the wafer connectors are inspected, good and defective products need to be classified, and good products need to be placed on the unloading tray 93. Here, the packaging unloading module 9 includes a material handling robot 91 fixed to the worktable 10, an unloading tray 93, a defective product box 94, and a mold change detection sensor assembly 95, as well as a material unloading and picking module 92 mounted on the material handling robot 91. Here, the material handling robot 91 and the material unloading and picking module 92 are used to handle the wafer connectors on the rivet spring height detection module 8. Here, the material unloading and picking module 92 includes a mold change connector 921 connected to the material handling robot 91, a nozzle mounting support plate 922 located below the mold change connector 921, and a tray suction nozzle assembly 923 and an unloading suction nozzle assembly 924, which are identical in structure and mounted on the suction nozzle mounting support plate 922. The discharge nozzle assembly 924 includes a second nozzle drive cylinder 9241 fixed in the longitudinal direction on the nozzle mounting support plate 922, a second nozzle mounting seat 9242 disposed on the second nozzle drive cylinder 9241, and a second nozzle 9243 disposed at the bottom of the second nozzle mounting seat 9242 and adsorbing the Wafer connector.

[0056] The above embodiments are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any changes made based on the design principles of the present invention, or any non-creative modifications made thereon, shall fall within the scope of protection of the present invention.

Claims

1. A high-speed backplane connector assembly line, comprising assembling a pin header (100) and a shield (200) to obtain a wafer connector, characterized in that, The assembly includes a feeding rack module (1) and a workbench (10), as well as a cutting module (2), a transfer module (3), a shielding component final pressing module (4), a cleaning module (5), a hot riveting module (6), a CCD detection module (7), a rivet point spring height detection module (8), and a packaging discharge module (9) which are fixed on the workbench (10) and arranged sequentially along the assembly line direction; the feeding rack module (1) feeds the needle holder (100) and the shielding component (200). The cut-off pins (100) and shielding components (200) are cut by the cutting module (2); the transfer module (3) sequentially transfers the cut pins (100) and shielding components (200) to the shielding component final pressing module (4), the cleaning module (5), the hot riveting module (6), and the CCD detection module (7); the packaging and unloading module (9) transports the assembled Wafer connector to the rivet point spring height detection module (8) for spring height detection, and uses the packaging and unloading module (9) for unloading. The transfer module (3) is provided with a transfer material tray (321); the transfer material tray (321) is provided with a needle holder (100) and a shield (200) cut by the cutting module (2); the hot riveting module (6) hot rivets the needle holder (100) and the shield (200) in the transfer material tray (321).

2. The high-speed backplane connector assembly line according to claim 1, characterized in that, The hot riveting module (6) includes a hot riveting mounting bracket (61), a hot riveting horizontal sliding module (62) mounted on the hot riveting mounting bracket (61), a first horizontal sliding seat (63) mounted on the hot riveting horizontal sliding module (62) and driven by the hot riveting horizontal sliding module (62), a motor mounting seat (64) fixed on the first horizontal sliding seat (63), a first motor (65) fixed on the motor mounting seat (64), and a hot melt assembly (66) mounted on the motor mounting seat (64) and driven by the first motor (65) to reciprocate in the longitudinal direction; the hot melt assembly (66) moves downward and hot rivets the pin seat (100) and the shield (200); The hot melt assembly (66) includes a first longitudinal slide rail slider assembly (661) fixed in the longitudinal direction on the motor mounting base (64), a first longitudinal slide plate (662) connected to the first longitudinal slide rail slider assembly (661), a transverse strip hole (663) opened on the first longitudinal slide plate (662), a hot melt mounting base (664) fixed at the lower part of the first longitudinal slide plate (662), and a hot melter (666) disposed at the lower part of the hot melt mounting base (664); a hot melter mounting cover (665) is sleeved on the hot melter (666). The first motor (65) is provided with a circular turntable; the circular turntable is provided with a drive roller; the drive roller is located on the edge of the circular turntable; the front end of the drive roller is placed in the transverse strip hole (663); the rotation of the circular turntable drives the drive roller to move along the transverse strip hole (663).

3. A high-speed backplane connector assembly line according to claim 1 or 2, characterized in that, The cutting module (2) includes a waste box (21) fixed on the workbench (10), a cutting channel support frame (22) set on the waste box (21), a cutting channel (23) and a cutting mold (24) set on the top of the cutting channel support frame (22) and cutting the material fed by the feeding rack module (1), and a waste cutting module (25) set on the waste box (21). The cutting channel (23) includes a channel support frame (231) fixed on the cutting channel support frame (22), a blowing brush assembly (232), a first dust suction assembly (233), a first position sensing detection mechanism (234) and a feeding drive mechanism (235) arranged sequentially on the channel support frame (231) along the channel transmission direction. The feeding drive mechanism (235) includes a feeding propulsion cylinder (2351) and a propulsion limit seat (2352) fixed on the flow channel support frame (231), a propulsion linkage plate (2353) connected to the feeding propulsion cylinder (2351) and limited in the propulsion limit seat (2352), a positioning and moving cylinder (2354) fixed in the longitudinal direction on the propulsion linkage plate (2353), and a positioning slider head (2355) disposed at the bottom of the positioning and moving cylinder (2354).

4. A high-speed backplane connector assembly line according to claim 3, characterized in that, The waste cutting module (25) includes a waste trough support frame (252) fixed at the lower part of the cutting channel support frame (22), a waste cutting blade assembly (251), a waste trough (253) and a waste receiving hopper (254) arranged on the waste trough support frame (252) from bottom to top; the waste receiving hopper (254) and the waste trough (253) receive the waste material after it is cut by the cutting mold (24), and the waste cutting blade assembly (251) cuts the waste material. The waste cutting blade assembly (251) includes a waste cylinder mounting base (2511) and a cutting fixed blade head (2513) fixed on the waste cylinder support frame (252), a waste cylinder (2512) fixed on the waste cylinder mounting base (2511), and a cutting movable blade head (2514) disposed at the front end of the waste cylinder (2512) and opposite to the cutting fixed blade head (2513).

5. A high-speed backplane connector assembly line according to claim 1 or 2, characterized in that, The transfer module (3) includes a transfer sliding module (31) and a material picking support (33) fixed on the workbench (10), a material trough mounting base (32) set on the transfer sliding module (31), and a material picking mechanism (34) set on the material picking support (33) for transporting the needle holder (100) and shielding component (200) cut by the cutting module (2); the transfer material trough (321) is set on the material trough mounting base (32); the material picking mechanism (34) transports the needle holder (100) and shielding component (200) into the transfer material trough (321); The material handling mechanism (34) includes a material handling mechanism mounting base (341) fixed on the material handling support base (33), a material handling sliding module (342) disposed on the material handling mechanism mounting base (341), an upper and lower material handling cylinder assembly (343) disposed on the material handling sliding module (342) and driven by the material handling sliding module (342), a material handling suction nozzle fixing base (344) disposed on the upper and lower material handling cylinder assembly (343), and a material handling suction nozzle (345) disposed at the bottom of the material handling suction nozzle fixing base (344); the material handling suction nozzle (345) adsorbs the needle seat (100) and the shield (200).

6. A high-speed backplane connector assembly line according to claim 5, characterized in that, The material transfer box (321) includes a carrier (3211) and a carrier opening and closing cylinder (3212) disposed on the material transfer box mounting base (32), a carrier opening and closing linkage plate (3213) connected to the carrier opening and closing cylinder (3212), an opening and closing slider (3214) disposed through one side of the carrier (3211) and connected to the carrier opening and closing linkage plate (3213), and a carrier upper cover (3215) disposed on the carrier (3211); the carrier opening and closing cylinder (3212) pushes the opening and closing slider (3214) to squeeze the needle seat (100) and the shield (200) inside the carrier (3211).

7. A high-speed backplane connector assembly line according to claim 1 or 2, characterized in that, The shielding component final pressure module (4) includes a shielding component final pressure mounting bracket (41) fixed on the workbench (10), a final pressure driving cylinder (42) set on the shielding component final pressure mounting bracket (41), and a final pressure mold (43) set at the bottom of the final pressure driving cylinder (42); the final pressure mold (43) squeezes the needle seat (100) and the shielding component (200) in the transfer material tank (321).

8. A high-speed backplane connector assembly line according to claim 1 or 2, characterized in that, The CCD detection module (7) includes a CCD detection driving module (71) fixed on the worktable (10) and a fisheye CCD detection camera assembly (72) disposed on the CCD detection driving module (71); the fisheye CCD detection camera assembly (72) faces the Wafer connector. The rivet height detection module (8) includes a height CCD detection drive module (81), a snap-fit ​​CCD detection drive module (83), and a finished product detection support frame (85) fixed on the workbench (10), a height CCD detection camera assembly (82) set on the height CCD detection drive module (81), and a snap-fit ​​CCD detection camera assembly (84) set on the snap-fit ​​CCD detection drive module (83); the height CCD detection camera assembly (82) and the snap-fit ​​CCD detection camera assembly (84) are arranged vertically and both face the Wafer connector on the finished product detection support frame (85).

9. A high-speed backplane connector assembly line according to claim 1 or 2, characterized in that, The packaging discharge module (9) includes a material handling robot (91), a discharge tray (93), a defective product box (94), and a mold change detection sensor assembly (95) fixed on the workbench (10), as well as a material handling module (92) set on the material handling robot (91); the material handling module (92) handles the Wafer connector on the rivet spring height detection module (8); The unloading and picking module (92) includes a mold changing connector (921) connected to the unloading and handling robot (91), a suction nozzle mounting support plate (922) located at the lower part of the mold changing connector (921), and a swivel suction nozzle assembly (923) and a discharge suction nozzle assembly (924) with the same structure located on the suction nozzle mounting support plate (922). The discharge nozzle assembly (924) includes a second nozzle drive cylinder (9241) fixed in the longitudinal direction on the nozzle mounting support plate (922), a second nozzle mounting seat (9242) disposed on the second nozzle drive cylinder (9241), and a second nozzle (9243) disposed at the bottom of the second nozzle mounting seat (9242) and adsorbing the Wafer connector.

10. A high-speed backplane connector assembly line according to claim 1 or 2, characterized in that, The feeding rack module (1) includes a feeding rack base (11), a feeding rack lateral movement component (12) disposed on the feeding rack base (11), a feeding tray mounting frame (13) disposed on the feeding rack base (11) and moved by the feeding rack lateral movement component (12), and a pin seat feeding tray assembly (14) and a shield feeding tray assembly (15) disposed on the feeding tray mounting frame (13).

Images