Monitoring system, monitoring method, monitoring device, and detection tape
By using a monitoring system with a detection belt in the cleanroom to detect whether floor tiles have been removed, the safety hazards caused by openings in the floor tiles have been resolved, achieving improvements in both safety and cost-effectiveness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2024-11-11
- Publication Date
- 2026-06-16
AI Technical Summary
In cleanrooms, when floor tiles are removed to create openings, there is a safety hazard of workers falling. Existing technologies require expensive surveillance cameras and complex setups, which are costly and inconvenient to operate.
A detection strip is used, which is configured across multiple floor tiles on the surface of the cleanroom floor tiles. It has a conductive layer and determines whether the floor tiles have been removed by detecting the electrical conductivity or signal current and voltage of the conductive layer, and issues an alarm in case of abnormality.
It improves safety when floor tiles are removed in cleanrooms, reduces the cost and operational complexity of monitoring systems, and is easy to build and maintain.
Smart Images
Figure CN122228533A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a monitoring system, monitoring method, monitoring device, and detection strip. Background Technology
[0002] Patent Document 1 discloses a monitoring device for a cleanroom, which monitors the interior of a cleanroom having a removable floor surface in the floor section. The monitoring device includes: a monitoring camera that captures images of the removable floor surface through which workers can pass; a monitoring unit that detects whether there is an opening formed by removing the removable floor surface based on the image signal obtained from the monitoring camera, and if an opening exists, detects whether there are workers approaching the opening based on the image signal from the monitoring camera, and outputs an alarm signal when the workers are detected; and an alarm generating unit that receives the alarm signal from the monitoring unit and issues an alarm.
[0003] Existing technical documents
[0004] Patent documents
[0005] Patent Document 1: Japanese Patent No. 6018821 Summary of the Invention
[0006] The technical problem that the invention aims to solve
[0007] The technology involved in this invention improves the safety of workers when floor tiles in a cleanroom are removed to create openings.
[0008] Technical solutions for solving technical problems
[0009] One aspect of the present invention is a monitoring system that monitors the area surrounding a substrate processing apparatus in a clean room. The monitoring system has a detection strip arranged across a plurality of floor tiles on the upper surface of some or all of the floor tiles surrounding the substrate processing apparatus. The detection strip has a conductive layer arranged along its length. The monitoring system includes an alarm unit that issues an alarm when the electrical conduction in the conductive layer is interrupted or when the voltage of the signal current flowing in the conductive layer is lower than a predetermined threshold.
[0010] Invention Effects
[0011] According to the present invention, the safety of workers can be improved when floor tiles in a clean room are removed and an opening is created in the floor surface. Attached Figure Description
[0012] Figure 1 This is a perspective view of the monitoring system implemented using the above method.
[0013] Figure 2 This is a schematic diagram illustrating the application of the implementation method to the monitoring system for illustrative purposes.
[0014] Figure 3 This is a frontal cross-sectional view of the detection strip viewed from the length direction.
[0015] Figure 4 This is a frontal cross-sectional view of the inspection zone involving other structures, viewed from the length direction.
[0016] Figure 5 It is a three-dimensional diagram showing the release and cutting of a detection strip that has been wound into a roll.
[0017] Figure 6 These are explanatory diagrams showing the steps of connecting the conductive layer at the end of the detection tape. (a) is a plan view of the end, (b) is a plan view with the protective layer of the end removed, (c) is an explanatory diagram showing the case where the connecting tape is pasted on the part where the protective layer has been removed, and (d) is a plan view showing the case after the connecting tape has been pasted.
[0018] Figure 7 This is a perspective view showing the situation where the end of the detection strip has been cut off.
[0019] Figure 8 It means from Figure 7 The image shows a 3D view of the protective layer being pressed from both sides with fingertips.
[0020] Figure 9 It means from Figure 8 The image shows the state after the protective layer is lifted with a fingertip.
[0021] Figure 10 It means from Figure 9 A 3D diagram showing the state of the protective layer being lifted by cutting with scissors.
[0022] Figure 11 It is a three-dimensional view showing the connection between the end of the test strip and the cable when viewed from the reverse side.
[0023] Figure 12 This is an illustration showing the situation where a pulse wave is sent from the controller to the conductive layer of the detection strip, and the controller receives the returned pulse wave.
[0024] Figure 13 This is an explanation Figure 12 A diagram illustrating the measurement status of the pulse wave.
[0025] Figure 14 This is a perspective view of the monitoring system implemented using the above method.
[0026] Figure 15 It means in Figure 14A 3D view of a worker cutting the inspection tape in the monitoring system.
[0027] Figure 16 It means in Figure 14 From the monitoring system, the operator Figure 14 A 3D diagram showing the state of a specific floor tile being lifted.
[0028] Figure 17 This is a perspective view showing the removal of the protective layers from the ends of the opposing detection strips and the attachment of connecting strips thereon.
[0029] Figure 18 It is a schematic representation. Figure 17 An explanatory diagram of the side cross-section in the desired state.
[0030] Figure 19 It is an illustrative representation of... Figure 18 The attached diagram shows a side cross-section of the situation after the connection tape was pasted.
[0031] Figure 20 This is a 3D diagram showing the situation after the connecting tape has been pasted.
[0032] Figure 21 The diagrams show the conductive layers at the ends of the detection strips that are arranged at right angles to change direction. (a) is a plan view showing the conductive layers exposed after the protective layers at the ends of the two detection strips are removed. (b) is a bottom view of the connecting strip with the conductive layers arranged in an angular shape. (c) is a side sectional view of the connecting strip.
[0033] Figure 22 It means from Figure 21 The plan view of the situation after the connection tape is pasted in state (a). Detailed Implementation
[0034] Traditionally, in semiconductor production lines used to manufacture semiconductor devices, numerous semiconductor manufacturing devices, such as substrate processing units, are housed in cleanrooms with a clean atmosphere. In such cleanrooms, the floor is fitted with floor tiles (sometimes called grids) featuring numerous grid-like ventilation sections. Furthermore, piping, various electrical equipment, pumps, and chemical tanks are housed in the space beneath the floor tiles. For example, the floor tiles are removable because workers need to access this space to perform tasks related to the installation, maintenance, and troubleshooting of these pipes, electrical equipment, and pumps.
[0035] This allows workers to access the space beneath the floor tiles in a cleanroom after the tiles have been removed. However, with the tiles removed, there is a risk of workers falling through openings in the cleanroom floor, which is composed of numerous tiles, into the space below. This is particularly problematic for workers performing other tasks on the tiles, who may sometimes be unaware of the openings. Previously, measures were taken to warn workers of this.
[0036] The technology described in Patent Document 1 employs the following method: based on a surveillance camera that captures images of the floor tile surface and the image signal obtained by the surveillance camera, it detects whether there is an opening formed by the removal of floor tiles, and outputs an alarm signal and issues an alarm from an alarm generating device when there are workers present.
[0037] While this technology improves worker safety, it requires expensive equipment such as surveillance cameras, and a large number of cameras are needed to ensure no blind spots, resulting in cost and labor-intensive setup. Therefore, this invention provides a technology for easily constructing a monitoring system capable of detecting openings created by the removal of floor tiles. The following description applies to the monitoring system. Furthermore, in this specification and accompanying drawings, elements with substantially the same functional structure are labeled with the same reference numerals, omitting repeated descriptions.
[0038] Figure 1 This indicates the state of the monitoring system M surrounding the substrate processing device 1, constructed using the detection strip T of the monitoring system according to the configuration embodiment. The substrate processing device 1 is located in a clean room, and floor tiles F are laid horizontally and vertically on the floor surface surrounding it. The detection strip T has a flat shape, similar to a flat cable.
[0039] Figure 2 This is a schematic plan view of a simplified monitoring system M for ease of understanding. In this example, the detection band T is arranged across floor tiles F2 to F4. Each floor tile F2 to F4 has, for example, a square shape with one side of 60 cm.
[0040] like Figure 3As shown, the detection strip T has: an insulating base 10 having insulating adhesive layers on both sides; and conductive layers 11 and 12 disposed on the front side of the base 10 and arranged parallel to each other along the length direction of the detection strip T. For example, flat copper foil can be used as the conductive layers 11 and 12. Furthermore, in this example, the conductive layers 11 and 12 are disposed parallel to each other across an insulating non-adhesive region 13. The non-adhesive region 13 can be achieved, for example, by attaching an insulating strip, such as a peelable strip made of synthetic resin, to the central region of the base 10, so that its thickness and height are consistent with the conductive layers 11 and 12.
[0041] An insulating protective layer 15 is disposed on the conductive layers 11 and 12 and the non-adhesive region 13 to cover them, and the protective layer 15 is bonded to the base 10. However, since the non-adhesive region 13 is located between the conductive layers 11 and 12, the lower surface of the protective layer 15 is not bonded to the non-adhesive region 13, and this part can be peeled off. Furthermore, in this example, for ease of handling, the width TW of the detection band T is set to, for example, 100 mm or less. Of course, it is not limited to this. Considering the thickness and flexibility of the protective layer 15, the width C1 of the conductive layer 11, the width C2 of the conductive layer 12, the width N of the non-adhesive region 13, etc., the width TW of the detection band T can be arbitrarily set between, for example, 30 mm and 100 mm. The width TW of the detection band T is not originally limited to this range.
[0042] Furthermore, in this example, the adhesive force of each part is set so that the adhesion between the front side of the base 10 and the lower surface side of the protective layer 15 is stronger than the adhesion between the back side of the base 10, i.e., the adhesion between the base 10 and the surface of the floor tile F. Thus, for example, a structure can be achieved where the base 10 of the detection band T can be peeled off from the surface of the floor tile F, but the protective layer 15 is not easily peeled off from the base 10. Therefore, the detection band T is easily attached to or peeled off from the surface of the floor tile F, resulting in good workability. On the other hand, the situation where the protective layer 15 is not easily peeled off from the base 10, and the internal conductive layers 11 and 12 are easily exposed, is suppressed.
[0043] Furthermore, the adhesion between the protective layer 15 and the base 10 also depends on the contact area between the lower surface of the protective layer 15 and the area outside the conductive layers 11 and 12 on the front side of the base 10, i.e. Figure 3The widths DN1 and DN2 shown can be adjusted to obtain an appropriate adhesive force corresponding to the width TW of the detection band T by modifying the adhesive force on the front side of the base 10, the adhesive force on the lower surface of the protective layer 15, and the widths DN1 and DN2 of the region outside the conductive layers 11 and 12 on the front side of the base 10. For example, the adhesive widths DN1 and DN2 between the base 10 and the protective layer 15 can be narrower than the widths C1 and C2 of the conductive layer 11 and 12, or narrower than the width N of the non-adhesive region 13. Furthermore, the widths C1 and C2 of the conductive layer 11 and 12 can also be set to be the same as the width N of the non-adhesive region 13. Thus, as described later... Figure 7 , Figure 8 As explained, gaps can easily form in the center of the detection band T. Furthermore, the widths C1 of conductive layer 11 and C2 of conductive layer 12 can be set to have the same width as or greater than the width N of the non-bonded region 13. Therefore, during the transmission / reception of pulse waves, as described later, noise propagation in conductive layers 11 and 12 can be suppressed.
[0044] In addition, the aforementioned Figure 3 The detection band T shown has the following structure: an insulating protective layer 15 is disposed on the conductive layers 11, 12 and the non-bonded region 13 in a manner that covers them. The protective layer 15 is directly bonded to the base 10, but it is not limited to this and other methods may also be proposed. Figure 4 The detection band T shown is... Figure 4 The detection strip T shown has a structure with a double-sided adhesive layer 14 on the lower surface of the protective layer 15. Therefore, the protective layer 15 is bonded to the base 10 via this double-sided adhesive layer 14. In this case, the non-adhesive region 13 is also located between the conductive layers 11 and 12, so the double-sided adhesive layer 14 on the lower surface of the protective layer 15 is not bonded to the non-adhesive region 13, and this portion can be peeled off.
[0045] Moreover, in Figure 4 In the test strip T shown, the adhesive force of each part is also set so that the adhesion between the front side of the base 10 and the lower surface of the double-sided adhesive layer 14 is stronger than the adhesion between the back side of the base 10, that is, the adhesion between the base 10 and the surface of the floor tile F. Therefore, similar to the previous example, the following structure can be achieved: the base 10 of the test strip T can be peeled off from the surface of the floor tile F, but the protective layer 15 is not easily peeled off from the base 10. Therefore, in Figure 4 In the case of the detection band T shown, it is easy to apply to or peel off the surface of the floor tile F, and the workability is good. In addition, the protective layer 15 is not easily peeled off from the base 10, and the situation where the internal conductive layers 11 and 12 are easily exposed is suppressed.
[0046] Of course, in this case, the adhesion between the protective layer 15 and the base 10 also depends on the contact area between the lower surface of the double-sided adhesive layer 14 on the lower surface of the protective layer 15 and the area outside the conductive layers 11 and 12 on the front side of the base 10, i.e. Figure 4 The widths DN1 and DN2 shown can be adjusted to obtain an appropriate adhesive force corresponding to the width TW of the detection band T by modifying the adhesive force on the front side of the base 10, the adhesive force on the lower surface of the double-sided adhesive layer 14, and the widths DN1 and DN2 of the region outside the conductive layers 11 and 12 on the front side of the base 10. Similarly, the adhesive widths DN1 and DN2 between the base 10 and the protective layer 15 can be narrower than the widths C1 and C2 of the conductive layer 11 and 12, or narrower than the width N of the non-adhesive region 13. Furthermore, the widths C1 and C2 of the conductive layer 11 and 12 can also be set to be the same as the width N of the non-adhesive region 13.
[0047] Detection band T with such structure Figure 5 As shown, it is wound into a roll and can be unwound in the direction of the arrow in the diagram when used. Furthermore, it can be cut to the desired length using scissors (H), a knife, or similar tools. Therefore, for example, as... Figure 2 As shown, to configure the detection strip T across floor tiles F2 to F4, simply attach one end to the surface of one end of floor tile F2 while pulling it to the required length, and then cut the detection strip T at the other end of floor tile F4. Therefore, the workability is extremely good. For example, when configuring the detection strip T across multiple floor tiles F, the operation can also be performed simply and quickly. Furthermore, as... Figure 5 As shown, in order to release the detection tape T from its rolled-up state, it is sufficient that the lower surface of the base 10 has the property of being able to peel off from the surface of the protective layer 15.
[0048] Furthermore, in this example, such as Figure 5 As shown, on the surface of the protective layer of the detection belt T, a logo L indicating, for example, the company name of the manufacturer or manager of the substrate processing device 1 is displayed at predetermined intervals, such as approximately 10cm to 50cm. By displaying the logo L indicating the company name of the manufacturer or manager of the substrate processing device 1 on the surface of the detection belt T, when the detection belt T is arranged across multiple floor tiles F, personnel entering the cleanroom will recognize the presence of something related to the substrate processing device 1 at floor tile F. This prevents situations where floor tiles F are removed without the manager's permission to create an opening, or where such an opening is ignored.
[0049] The detection strip T with the above structure is pasted and configured as described above, spanning the surfaces of multiple floor tiles F. Figure 2In this example, it is configured to span floor tiles F2 to F4. Furthermore, a controller 20, electrically connected to conductive layers 11 and 12, is provided at one end of the detection band T, and the ends of conductive layers 11 and 12 are electrically connected to each other at the other end of the detection band T, i.e., the terminal section. As described later, the controller 20 includes a transmitting unit, a receiving unit, a measuring unit, and an alarm unit, which are controlled by a control unit.
[0050] The operation of electrically connecting the terminals of conductive layers 11 and 12 to each other in this way is, for example, according to... Figure 6 The steps shown in (a) to (d) are performed. That is, in Figure 6 As shown in (a), the end of the test strip T has been affixed to the surface of the floor tile F, as Figure 6 As shown in (b), only the protective layer 15 at the end is cut off by about 3 cm from the end. As mentioned above, the protective layer 15 is bonded to the base 10, so removing only the base 10 3 cm from the end is usually a laborious and troublesome operation.
[0051] However, in the detection band T of this invention, as described above, the non-adhesive region 13 is located between the conductive layers 11 and 12, and is not bonded to the double-sided adhesive layer 14 on the lower surface of the protective layer 15. Furthermore, it can be peeled off from the double-sided adhesive layer 14 on the lower surface of the protective layer 15 at this non-adhesive region 13. Therefore, if from... Figure 7 A flat state, for example, Figure 8 As shown, when the protective layer 15 of the detection band T is pinched between the two sides and pressed inward (in the direction of the arrow in the figure), the central part of the detection band T bulges out, creating a gap, as shown in the figure. Then, if a thin object, such as the tip of a screwdriver 18 as shown, is inserted into this gap and the protective layer 15 is lifted, the gap widens. Next, as... Figure 9 As shown, for example, the end of the protective layer 15 can be lifted with a finger. This maintains the lifted state of the protective layer 15 at the end. Then, as... Figure 10 As shown, simply cut off the end of the raised protective layer 15 at a length of approximately 3 cm using scissors H, a knife, or similar tools.
[0052] Through the above steps, from Figure 6 The state of the detection band T shown in (a) becomes as follows Figure 6 As shown in (b), the protective layer 15 of the terminal portion is, for example, removed by about 3 cm. Afterwards, as... Figure 6 As shown in (c), simply attach the terminal-specific connecting tape TE to the conductive layers 11, 12 and the non-adhesive area 13 exposed at the end of the detection tape T.
[0053] like Figure 6 As shown in (c) (in) Figure 6In (c), the connection tape TE is depicted as viewed from the reverse side. The connection tape TE has an adhesive layer 21 on the lower surface of the insulating protective layer 15. On the lower surface of the adhesive layer 21, a conductive layer 22 is provided in a region narrower than the adhesive layer 21. The conductive layer 22 has a width and length that allows the two conductive layers 11 and 12 at the end of the detection tape T to conduct to each other. By attaching such a connection tape TE to the conductive layers 11 and 12 exposed at the end of the detection tape T and the non-adhesive region 13, the conductive layers 11 and 12 are electrically connected at the end. Figure 6 (d) indicates the state in which the connecting tape TE is attached to the end of the detection tape T.
[0054] In addition, such as Figure 2 As shown, a controller 20 electrically connected to conductive layers 11 and 12 is provided at the starting end of the detection band T. When connecting the conductive layers 11 and 12 of the detection band T to the controller 20, for example... Figure 11 As shown, the connecting tape TS is used as the starting tape. Figure 11 This is a perspective view of the connection band TS from the reverse side. On the adhesive layer of the lower surface of the insulating protective layer 30, conductive layers 31 and 32 are provided, which are electrically connected to the conductive layers 11 and 12 of the detection band T. Conductive layers 31 and 32, like conductive layers 11 and 12, are made of, for example, copper foil.
[0055] By soldering, for example, the conductive layers 11 and 12 of the detection band T to the controller 20 with the lead portions 34 and 35 of the cable 33 connected to the controller 20, the conductive layers 11 and 12 can be electrically connected to the controller 20. For example, an insulating protective tape 36 can be pasted at the connection points between the lead portions 34 and 35 and the conductive layers 31 and 32.
[0056] In the monitoring system M constructed by configuring the detection band T with the above structure, such as Figure 12 As shown, a pulse wave is transmitted from the transmitting unit 20a equipped in the controller 20 to the conductive layer 11, and the pulse wave travels from the end of the detection band T through the conductive layer 12 to the receiving unit 20b equipped in the controller 20. Therefore, in this example, the conductive layer 11 disposed in the detection band T of the floor tile F constitutes the transmission path, and the conductive layer 12 constitutes the receiving path.
[0057] The controller 20 is provided with a measuring unit 20c that measures the pulse wave returned from the conductive layer 12, which serves as the receiving path, and based on the measurement results from the measuring unit 20c, a specified alarm or alarm signal is issued from the alarm unit 20d.
[0058] In this example, the oscillation frequency of the pulse wave is set to 1 kHz, such as Figure 13As shown, the period t of the pulse wave is 1000 μS. Additionally, the voltage value e is set to 3V. The current value is set to 0.62mA. The pulse wave from the receiving path is measured by the measuring unit 20c at the measuring position Z, as shown... Figure 13 As shown, the voltage value at a 1 / 4 wavelength position is measured. When the voltage value is lower than a specified threshold (for example, the voltage value at a delay time of 80 μS is lower than half of the rated value, i.e., 1.5V), an abnormality is determined, and a specified alarm or alarm signal is issued from the alarm unit 20d. Of course, an alarm or alarm signal is also issued if the receiving unit 20b cannot receive the signal itself. The transmitting unit 20a, receiving unit 20b, measuring unit 20c, and alarm unit 20d included in the controller 20 are controlled by the control unit 20e provided in the controller 20.
[0059] Thus, in the monitoring system M disclosed herein, since the voltage value at measurement position Z is measured at the moment the detection band T is cut, even if noise voltage is picked up when the detection band T is cut, appropriate monitoring can be performed because half of the voltage value e, i.e., 1.5V, is set as the threshold. More specifically, for example, when the total length of the detection band T configured in the monitoring system M is 60m, it is confirmed that the voltage of the return pulse measured in the receiving path is approximately 2.8V, which is not significantly reduced. Therefore, when setting the threshold, starting from approximately 1.5V, roughly in the middle of the oscillation voltage of 3V, the lower the value, the more susceptible it is to noise; conversely, the higher the value, the more susceptible it is to the effect of the return voltage reduction itself. Therefore, by setting the threshold to 1.5V, as shown in this example, it is possible to have both strong tolerance to noise and the ability to cope with voltage reduction. Thus, the influence of noise can be suppressed and the cutting of the detection band T can be detected appropriately. Of course, even if the return voltage itself is not detected, it can still be judged as an anomaly. Furthermore, abnormalities can be detected when conductive layers 11 and 12 are exposed or otherwise improperly used, or when the connection between conductive layers 11 and 12 is peeled off.
[0060] In addition, such as from Figure 12 It is also known that the conductive layer 11 constituting the transmission path and the conductive layer 12 constituting the receiving path are arranged in parallel in the detection band T. However, if, for example, a pulse wave of extremely high frequency flows through the conductive layers 11 and 12, accurate measurement may not be possible due to capacitive coupling. To prevent this, for example, the distance d between the conductive layers 11 and 12 (the width of the non-bonded area 13) can be increased. However, this would increase the width of the detection band T, causing problems in terms of processing and practicality.
[0061] On the other hand, cleanrooms contain numerous electrical appliances that use commercial frequencies such as 50Hz or 60Hz, as well as conductive paths and locations for the flow of current at those commercial frequencies. Furthermore, floor tiles F are generally made of conductive materials. Therefore, the pulse wave transmitted from the transmitting unit 20a needs to be set to a frequency unaffected by such commercial frequencies and high enough to be clearly distinguishable from them.
[0062] From this perspective, in this example of the invention, the oscillation frequency of the pulse wave is set to 1 kHz. Furthermore, the width of the detection band T is set to 40 mm, and the conductive layers 11 and 12, and the distance d between conductive layers 11 and 12 (the width of the non-adhesive region 13) are each set to 8 mm. However, this is not the only limitation; a pulse wave with an oscillation frequency that does not propagate across conductive layers 11 and 12 can also be used, depending on the distance d between conductive layers 11 and 12.
[0063] Furthermore, the pulse wave current value is set at 0.62mA for the following reasons: As will be explained later, when it is necessary to lift a floor tile F to create an opening for work purposes, the detection strip T, which is arranged across multiple floor tiles F, needs to be cut using scissors, shears, or similar tools. This is because current may flow into the worker's body through the scissors or shears held by the worker. In this situation, if the current value is large (e.g., above 5mA), it could endanger the worker's health. Therefore, the pulse wave current value is set to below 1mA, which is generally considered to pose no safety risk to the human body.
[0064] In the monitoring system M constructed as described above, such as Figure 14 As shown, in a detection strip T arranged across floor tiles F2 to F4, a logo L indicating the company name and management of the substrate processing device 1 is displayed on the surface of the detection strip T. Therefore, as described above, it is possible to prevent people entering the cleanroom from removing floor tiles F to create an opening, or from ignoring such an opening.
[0065] However, since one inspection strip T is affixed across floor tiles F2 to F4, if worker P needs to work on the underside of floor tile F, for example, the space on the underside of floor tile F3, then... Figure 15 As shown, first, scissors or a cutting knife are needed to cut the detection strip T at both ends of the floor tile F3. Then, it must be done as follows... Figure 16 As shown, lift the floor tile F3.
[0066] As described above, in monitoring system M, such as Figure 12As shown, a pulse wave is sent from the transmitting unit 20a of the controller 20 to the conductive layer 11 within the detection band T. This pulse wave returns to the receiving unit 20b of the controller 20 via the conductive layer 12. Furthermore, since the measuring unit 20c of the controller 20 monitors the returned pulse wave, an alarm is triggered when the detection band T is partially cut at both ends of the floor tile F3. Therefore, not only the operator P, but also other operators in the vicinity can be aware that an opening has been created in the floor tile F, thus improving operator safety.
[0067] Furthermore, to construct such a monitoring system M, as described above, it is only necessary to attach the detection strip T across multiple floor tiles F. Moreover, since the detection strip T... Figure 5 The detection tape T is wound into a roll, allowing for easy unwinding. Since the base of the lower surface of the detection tape T is adhesive, the unwound detection tape T can be directly adhered to the surface of the floor tile F. Therefore, the detection tape T can be cut only at the end portion of the floor tile F to which it is to be placed. Afterwards, the aforementioned... Figure 6 The terminal unit shown can be connected using a dedicated TE connector. Therefore, a monitoring system M can be easily constructed.
[0068] However, as Figure 15 , Figure 16 As shown, the temporarily cut detection band T is in a state where both the transmitting and receiving paths are cut off and the pulse wave does not flow. Therefore, after the prescribed work is completed in the space below the floor tile F, the removed floor tile F3 needs to be restored, and the transmitting and receiving paths need to be electrically connected again. In this case, simply setting the floor tile F3 back to its original position is insufficient to properly connect the conductive layers 11 and 12 at the cut ends of the cut detection band T.
[0069] In this case, firstly as Figure 17 As shown, according to the aforementioned Figures 7-10 The method shown involves removing, for example, about 3 cm from the protective layer 15 of each end of the cut detection strip T, exposing the conductive layers 11 and 12. Furthermore, the dashed lines in the figure represent the mating surfaces of the floor tiles F.
[0070] Next, using the Figure 18The connecting strip TB for reconnection of the structure shown electrically connects the ends of the cut detection strips T to each other. An adhesive layer 42 is provided on the lower surface of the insulating protective layer 41 of the connecting strip TB. On the lower surface of the adhesive layer 42, in a region narrower than the adhesive layer 42, conductive layers 44 and 45 are provided parallel to each other across a non-adhesive region 43. Furthermore, an adjustment layer 46 for height adjustment is provided between the conductive layers 44 and 45 and the adhesive layer 42. The conductive layers 44 and 45 are, for example, made of copper foil. The length of the connecting strip TB is longer than the relative distance Y between the portions of the detection strip T on the floor tile F where the protective layer 15 has been removed, and the length of the conductive layers 44 and 45 in the extending direction is consistent with this distance Y.
[0071] according to Figure 18 It is also known that the conductive layers 11 and 12 at the ends of the detection tape T, exposed by removing the protective layer 15, need to be reliably electrically connected to the conductive layers 44 and 45 located on the lower surface of the connecting tape TB. However, the length of the connecting tape TB is longer than the relative distance Y between the portions where the protective layer 15 is removed. Therefore, even if the connecting tape TB is pasted onto the exposed portions of the conductive layers 12 and 13, it is possible that the conductive layers 11 and 12 of the detection tape T and the conductive layers 44 and 45 of the connecting tape TB are not electrically connected.
[0072] Therefore, the connecting tape TB has an adjustment layer 46 for height adjustment between the conductive layers 44, 45 and the adhesive layer 42. Thus, when the connecting tape TB is adhered to the exposed portions of the conductive layers 12, 13, as... Figure 19 As shown, the combined thickness of conductive layers 44, 45 and adjustment layer 46 is made to match the height of the protective layer 15 on the upper surface of the detection band T, and conductive layers 11, 12 are reliably electrically connected to conductive layers 44, 45 with connecting band TB.
[0073] Furthermore, in the case where the connecting tape TB is pasted onto the exposed portions of the conductive layers 11 and 12 in the detection tape T, it is also as follows: Figure 20 It is shown that the end of the protective layer 41 of the connecting tape TB is higher than the protective layer 15 on the upper surface of the detection tape T, creating a height difference as shown. However, even with this height difference, the detection tape T and the connecting tape TB are originally flat. In addition, the connecting tape TB is attached to the protective layer 15 of the detection tape T through the adhesive layer 42 on the lower surface of the protective layer 41. Therefore, considering that people usually walk on the floor tile F, this level of height difference will not cause any obstruction.
[0074] The aforementioned adjustment layer 46 can also be set on an existing layer. Figure 6 The terminal section is described in detail with a dedicated connection band TE, and the angled connection band TC, which rotates 90 degrees when viewed from above, is described later.
[0075] However, depending on the location where the monitoring system M is installed, it is sometimes necessary to bend the extension direction of the detection strip T at a right angle on the floor tile F to configure the detection strip T. Figure 20 This indicates the appropriate response in this situation. Figure 21 (a) indicates a state where the protective layer 15 at each end of two detection strips T1 and T2, which are arranged perpendicular to each other on the floor tile F, is removed by a predetermined length, for example, about 3 cm. As shown, the conductive layers 11 and 12 at the ends of each detection strip T1 and T2 are exposed. Furthermore, removing the protective layer 15 at each end of the two detection strips T1 and T2 by the predetermined length is done as described above. Figures 7-10 The method shown can be followed.
[0076] When electrically connecting the conductive layers 11 and 12 at the so-called corner portion of the detection band T, which are thus bent into a right-angle configuration, using Figure 21 The connection shown in (b) uses TC. Figure 21 (b) is a diagram showing the connection from the reverse side, marked with TC. Figure 21 (c) is a sectional view of the side with TC attached.
[0077] As can be seen from these figures, an adhesive layer 42 is provided on the lower surface of the insulating protective layer 41 for connection with TC. On the lower surface of the adhesive layer 42, two conductive layers 44 and 45 are provided parallel to each other in a region narrower than the adhesive layer 42 and separated by a non-adhesive region 43. The conductive layers 44 and 45 are, for example, made of copper foil. The conductive layers 44 and 45 are provided on an insulating base 47 that has adhesive on both sides. Furthermore, the conductive layers 44 and 45 are angled at 90 degrees when viewed from above.
[0078] Through such Figure 22 The corner portions of the detection band T, where the conductive layers 11 and 12 of the connecting tape TC are adhered to the floor tile F, allow for electrical connection between the conductive layers 44 and 45 of the connecting tape TC and the exposed conductive layers 11 and 12 at the ends of the detection bands T1 and T2. Therefore, workability is extremely good. Because the insulating base 47 is located at the corner of the lower surface of the connecting tape TC, the conductive layers 44 and 45 do not directly contact the floor tile F.
[0079] In the example described above, in addition to the detection tape T which can be wound into a roll as the basic form, there are also connection tapes such as TS for connecting to the controller 20 as the starting tape, TB for connecting when reconnecting, TE for connection of the terminal section, and TC for connection when changing the direction by 90 degrees when looking down. Therefore, the setup of the monitoring system is flexible and a suitable monitoring system can be built according to the devices installed in the clean room and their installation conditions.
[0080] In the aforementioned example, a pulse wave is passed through the detection band T, and the voltage value of the pulse wave measured in the receiving path is compared with a preset threshold. The presence or absence of the pulse wave is used to detect whether an opening has been created by the removal of floor tile F. Alternatively, the impedance of conductive layers 11 and 12 can be continuously monitored. If the impedance changes significantly beyond a preset threshold, it can be determined that an opening has been created by the removal of floor tile F.
[0081] More specifically, in order to detect anomalies based on impedance changes, the system can be configured such that, after setting the detection band T, the bridge circuit in the controller 20 is pre-balanced, even if the variable resistance of the circuit is matched with the impedance of the line to achieve a balanced state (calibration), and an anomaly is detected when the conductive layers 11 and 12 of the detection band T become disconnected and the balance of the circuit is disrupted.
[0082] The embodiments disclosed above are illustrative in all respects and are not restrictive. The above embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the claims.
[0083] Furthermore, the following configurations fall within the scope of the present invention. Additionally, configurations formed by combining the contents described in (1) to (15) below without contradiction also fall within the scope of the present invention.
[0084] (1) A monitoring system that monitors the area around a substrate processing apparatus in a clean room, the monitoring system having a detection strip arranged across a plurality of floor tiles on the upper surface of a portion or all of the floor tiles around the substrate processing apparatus, the detection strip having a conductive layer arranged along the length of the strip, the monitoring system including an alarm unit that issues an alarm when the electrical conduction state in the conductive layer is interrupted or when the voltage of the signal current flowing in the conductive layer is lower than a predetermined threshold.
[0085] (2) The monitoring system described in (1) wherein the conductive layer has a transmission path and a reception path.
[0086] (3) According to the monitoring system described in (2), the alarm unit is connected to one end of the transmission path and the receiving path, and the other end of the transmission path and the receiving path is electrically connected.
[0087] (4) According to the monitoring system described in (3), the other end of the above-mentioned transmission path and the above-mentioned receiving path are connected by an angular connection that changes direction by 90 degrees when viewed from above.
[0088] (5) The monitoring system according to (4) includes: a transmitting unit that transmits a pulse signal to the transmitting path; a receiving unit that receives a pulse signal from the receiving path; and a measuring unit that measures the pulse signal from the receiving path.
[0089] (6) According to the monitoring system described in (5), the above alarm is issued when the above pulse signal is not received or when the pulse signal from the above receiving path measured in the above measuring unit is lower than a predetermined threshold.
[0090] (7) The monitoring system described in (6) wherein the current value of the pulse signal is less than 1mA.
[0091] (8) The monitoring system described in (6) or (7), wherein the pulse signal is a frequency that does not propagate across the transmission path and the reception path.
[0092] (9) According to the monitoring system described in (1), the alarm unit issues an alarm based on the change in impedance in the conductive layer.
[0093] (10) The monitoring system according to any one of (1) to (7) and (9), wherein the detection strip has: an insulating base having an insulating adhesive layer on both sides; a conductive layer disposed on the front side of the base and arranged along the length direction of the detection strip; an insulating non-adhesive area arranged along the length direction of the detection strip in contact with or close to the conductive layer; and an insulating protective layer covering the conductive layer and the non-adhesive area and bonded to the base, wherein the detection strip can be released from a wound state.
[0094] (11) The detection strip of the monitoring system described in (10) wherein the bonding between the base and the protective layer is performed by an insulating double-sided adhesive member disposed on the lower surface side of the protective layer.
[0095] (12) A monitoring method for monitoring the area around a substrate processing device in a clean room, wherein a detection strip having a conductive layer along its length is arranged across a plurality of floor tiles on the upper surface of some or all of the floor tiles around the substrate processing device, and an alarm is triggered when the electrical conduction state in the conductive layer is interrupted or when the voltage of the signal current flowing in the conductive layer is lower than a predetermined threshold.
[0096] (13) According to the monitoring method described in (12), the determination of whether the electrical conduction state in the conductive layer is disconnected is carried out based on whether a signal current flowing in the conductive layer is received, or by comparing the measured value of the signal current with a predetermined threshold.
[0097] (14) According to the monitoring method described in (13), the above signal current is a pulse wave.
[0098] (15) A monitoring device for monitoring the area around a substrate processing apparatus installed in a clean room, the monitoring device comprising: a detection strip arranged across a plurality of floor tiles on the upper surface of a portion or all of the floor tiles around the substrate processing apparatus, and having a conductive layer arranged along the length direction; and an alarm unit that issues an alarm when the electrical conduction state in the conductive layer is interrupted or when the voltage of the signal current flowing in the conductive layer is lower than a predetermined threshold.
[0099] (16) A detection strip that can be used in the monitoring system of (1) above, having: an insulating base having an insulating adhesive layer on both sides; a conductive layer disposed on the front side of the base and arranged along the length direction of the detection strip; an insulating non-adhesive area arranged along the length direction of the detection strip in contact with or close to the conductive layer; and an insulating protective layer covering the conductive layer and the non-adhesive area and bonded to the base, wherein the detection strip can be released from a wound state.
[0100] Explanation of reference numerals in the attached figures
[0101] 1. Substrate processing device
[0102] 10 Base
[0103] 11, 12 Conductive layers
[0104] 13 Non-bonded areas
[0105] 14 Double-sided adhesive layer
[0106] 15 Protective Layers
[0107] 20 Controllers
[0108] F Floor Tiles
[0109] T-band
[0110] TB, TC, TE, TS connecting tape.
Claims
1. A monitoring system, characterized in that: The monitoring system monitors the area surrounding the substrate processing unit located within the cleanroom. The monitoring system has a detection band that is configured across multiple floor tiles on the upper surface of a portion or all of the floor tiles surrounding the substrate processing device. The detection strip has a conductive layer arranged along the length of the strip. The monitoring system includes an alarm unit that issues an alarm when the electrical conduction state in the conductive layer is broken or when the voltage of the signal current flowing in the conductive layer is lower than a predetermined threshold.
2. The monitoring system according to claim 1, characterized in that: The conductive layer has a transmission path and a reception path.
3. The monitoring system according to claim 2, characterized in that: The alarm unit is connected to one end of both the transmitting path and the receiving path. The other end of each of the transmitting path and the receiving path is electrically connected.
4. The monitoring system according to claim 3, characterized in that: The other ends of the transmitting path and the receiving path are electrically connected via an angled connection that is 90 degrees when viewed from above.
5. The monitoring system according to claim 4, characterized in that, have: The transmitting unit sends pulse signals to the transmitting path; A receiving unit that receives pulse signals from the receiving path; and The measuring unit measures the pulse signal from the receiving path.
6. The monitoring system according to claim 5, characterized in that: The alarm is issued if the pulse signal is not received, or if the pulse signal from the receiving path measured in the measuring unit is lower than a predetermined threshold.
7. The monitoring system according to claim 6, characterized in that: The current value of the pulse signal is less than 1mA.
8. The monitoring system according to claim 6 or 7, characterized in that: The pulse signal is a frequency that does not propagate across the transmission path and the reception path.
9. The monitoring system according to claim 1, characterized in that: The alarm unit issues an alarm based on the change in impedance in the conductive layer.
10. The monitoring system according to any one of claims 1 to 7 and 9, characterized in that: The detection band has: An insulating base, which has an insulating adhesive layer on both sides; A conductive layer is disposed on the front side of the base and arranged along the length direction of the detection strip; An insulating, non-adhesive region, which is arranged along the length of the detection strip in a manner that contacts or is close to the conductive layer; and An insulating protective layer covers the conductive layer and the non-adhesive area, and is bonded to the base. The detection strip can be released from its wound state.
11. The monitoring system according to claim 10, characterized in that: The bonding between the base and the protective layer is performed by an insulating double-sided adhesive component disposed on the lower surface side of the protective layer.
12. A monitoring method, characterized in that: The monitoring method monitors the area surrounding the substrate processing device located in the cleanroom. On the upper surface of some or all of the floor tiles surrounding the substrate processing apparatus, a detection strip having a conductive layer along its length is configured across multiple floor tiles. An alarm is triggered when the electrical conduction state in the conductive layer is broken, or when the voltage of the signal current flowing in the conductive layer is lower than a specified threshold.
13. The monitoring method according to claim 12, characterized in that: The determination of whether the electrical conduction state in the conductive layer is broken is carried out based on whether a signal current flowing in the conductive layer is received, or by comparing the measured value of the signal current with a predetermined threshold.
14. The monitoring method according to claim 13, characterized in that: The signal current is a pulse wave.
15. A monitoring device, characterized in that: The monitoring device monitors the area surrounding the substrate processing unit located in the cleanroom and has the following features: The detection strip is arranged across multiple floor tiles on the upper surface of a portion or all of the floor tiles surrounding the substrate processing device and has a conductive layer arranged along its length. and The alarm unit issues an alarm when the electrical conduction state in the conductive layer is broken, or when the voltage of the signal current flowing in the conductive layer is lower than a predetermined threshold.
16. A detection strip, characterized in that: The detection strip can be used in a monitoring system that monitors the area surrounding the substrate processing unit located in a cleanroom. The monitoring system includes an alarm unit that issues an alarm when the electrical conduction in the conductive layer of the detection strip is interrupted, or when the voltage of the signal current flowing in the conductive layer is lower than a predetermined threshold. The detection strip is configured across a portion or all of the upper surface of the floor tiles surrounding the substrate processing device. The detection band also has: An insulating base having insulating adhesive layers on both sides; a conductive layer disposed on the front side of the base and arranged along the length direction of the detection strip; an insulating non-adhesive region arranged along the length direction of the detection strip in contact with or close to the conductive layer; and an insulating protective layer covering the conductive layer and the non-adhesive region and bonded to the base. The detection strip can also be released from its wound state.