Preparation method of shale physical model and shale physical model

Abstract

This invention relates to the field of geophysical exploration technology, and discloses a method for preparing a shale physical model and the shale physical model itself. The method for preparing the shale physical model includes: providing several substrates of the same or different materials; each substrate is made of any one of phenolic resin board, fiberglass board, and unsaturated polyester composite board; stacking the substrates, with an adhesive between any two adjacent substrates; and applying pressure to the stacked substrates along the stacking direction to obtain the shale physical model, wherein the anisotropy parameter epsilon of the shale physical model is less than 0.2. The shale physical model possesses weak anisotropy characteristics, satisfying the physical simulation of shale reservoirs with weak anisotropic media.

Description

Technical Field

[0001] This invention relates to the field of geophysical exploration technology, and in particular to a method for preparing a shale physical model and the shale physical model itself. Background Technology

[0002] Shale reservoirs are typical anisotropic media, and their anisotropic characteristics significantly impact seismic imaging, prediction, and even engineering development and stimulation. The anisotropic intensity of shale reservoirs varies considerably across different regions. Seismic physical modeling technology primarily involves constructing suitable physical models and using ultrasonic waves to simulate seismic waves, studying the kinematic and dynamic characteristics of seismic wave propagation in shale reservoirs of different regions. It is an effective forward modeling method that provides guidance for seismic exploration and wavefield analysis. Selecting or adapting materials comparable to shale reservoirs and creating realistic physical models are among the key challenges to the success of seismic physical modeling technology.

[0003] With the development of earthquake physics simulation technology, current technology is relatively mature. The materials used to construct physical models are mainly composite materials such as epoxy resin and silicone rubber mixed in certain proportions. The preparation method mainly involves casting the composite materials of epoxy resin and silicone rubber into a mold and curing them into a certain shape. The physical models exhibit isotropic characteristics. However, this is insufficient for the physical simulation of shale reservoirs with anisotropic media.

[0004] Therefore, it is urgent to explore and develop shale physical models with anisotropic characteristics and their preparation methods. Summary of the Invention

[0005] The purpose of this invention is to provide at least one method for preparing a shale physical model and a shale physical model, which can at least solve the problem that existing physical models cannot meet the physical simulation requirements of shale reservoirs with anisotropic media.

[0006] To address the aforementioned technical problems, this invention provides a method for preparing a shale physical model, comprising: providing several substrates of the same or different materials; each substrate being made of any one of phenolic fabric board, fiberglass board, and unsaturated polyester composite board; stacking the several substrates, with an adhesive placed between any two adjacent substrates; and applying pressure to the stacked substrates along the stacking direction to obtain a shale physical model, wherein the anisotropy parameter epsilon of the shale physical model is less than 0.2.

[0007] The method for preparing a shale physical model provided by this invention uses a substrate made of any one of phenolic fabric board, fiberglass board, and unsaturated polyester composite board. Several substrates of the same or different materials are selected and stacked, with an adhesive placed between any two adjacent substrates. During the pressure treatment of the stacked substrates along the stacking direction, the substrates are only subjected to force parallel to the stacking direction, and not perpendicular to it. This results in differences in the properties of the substrates parallel and perpendicular to the stacking direction, ultimately producing a shale physical model with anisotropic characteristics, satisfying the physical simulation of shale reservoirs with anisotropic media. It is known that the parameter epsilon is used to characterize the anisotropy strength, and the value of epsilon is approximately between 0 and 0.8. A value of epsilon less than 0.2 can be considered weak anisotropy. Therefore, the shale physical model of this application possesses weak anisotropy characteristics, satisfying the physical simulation of shale reservoirs with weakly anisotropic media.

[0008] In addition, the pressure applied to the stacked substrates is 6 kPa to 8 kPa. This balances the requirements of good adhesion between the substrates, good weak anisotropy of the shale physical model, and substrate reliability.

[0009] In addition, the thickness of the shale physical model is 3cm to 10cm; the thickness of a single substrate is 0.1mm to 50mm. This meets the requirement of a shale physical model exhibiting good weak anisotropy characteristics.

[0010] In addition, the adhesive includes epoxy resin and epoxy curing agent; the epoxy curing agent in the adhesive accounts for 40% to 50% of the weight of the epoxy resin. This achieves a balance between high reliability and good performance in shale physical models with weak anisotropy.

[0011] In addition, the adhesive includes silicone rubber and silicone rubber curing agent; the weight of the silicone rubber curing agent in the adhesive is 2% to 5% of the weight of the silicone rubber. This achieves a balance between high reliability and good performance in shale physical models with weak anisotropy.

[0012] Furthermore, before applying the adhesive between any two adjacent substrates, the surfaces of the substrates to which the adhesive will be applied are cleaned. This improves the adhesion between the substrates, thereby enhancing the reliability of the shale physical model; it also prevents stains from forming on the surfaces of the substrates to which the adhesive will be applied, thus avoiding impacts on the internal structural features and stress distribution of the shale physical model and improving the model's ability to achieve weak anisotropy characteristics.

[0013] In addition, the process of applying pressure to several stacked substrates to obtain a shale physical model includes: providing a mold, placing the stacked substrates in the mold; applying pressure to the stacked substrates in the mold; and removing the mold after the pressure treatment is completed. Applying pressure to the stacked substrates in the mold helps to improve the manufacturing accuracy and quality of the shale physical model and enhances the effect of the shale physical model in achieving weak anisotropy characteristics.

[0014] Additionally, after the pressure treatment is completed and before the mold is removed, the process includes curing the adhesive. This improves the bonding strength between the substrates and enhances the stability of the shale physical model.

[0015] In addition, before placing the stacked substrates into the mold, a release agent is formed on the inner surface of the mold to facilitate subsequent mold removal.

[0016] This invention also provides a shale physical model, comprising: preparation using the method for preparing a shale physical model provided by this invention. Based on the above description, the shale physical model possesses weak anisotropy characteristics, satisfying the physical simulation of shale reservoirs with weak anisotropic media. Attached Figure Description

[0017] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0018] Figure 1 This is a schematic flowchart of a method for preparing a shale physical model according to an embodiment of the present invention;

[0019] Figures 2 to 6 This is a schematic diagram of the structure during the preparation process of a shale physical model provided in an embodiment of the present invention. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been presented in the various embodiments of the present invention to enable the reader to better understand the present invention. However, the technical solutions claimed in the present invention can be implemented even without these technical details and various changes and modifications based on the following embodiments.

[0021] refer to Figure 1 An embodiment of the present invention provides a method for preparing a shale physical model, comprising:

[0022] S1: Provide several substrates of the same or different materials; each substrate is made of any one of phenolic cloth board, fiberglass board and unsaturated polyester composite board;

[0023] S2: Stack several substrates together, and apply an adhesive between any two adjacent substrates;

[0024] S3: Along the stacking direction, pressure is applied to several stacked substrates to obtain a shale physical model. The anisotropy parameter epsilon of the shale physical model has a value of less than 0.2.

[0025] In this embodiment, the substrate material is any one of phenolic fabric board, fiberglass board, and unsaturated polyester composite board. Several substrates of the same or different materials are selected and stacked, with an adhesive placed between any two adjacent substrates. During the pressure treatment of the stacked substrates along the stacking direction, the substrates are only subjected to force parallel to the stacking direction, and not perpendicular to the stacking direction. This causes the properties of the substrates to differ between the parallel and perpendicular stacking directions, resulting in a shale physical model with anisotropic characteristics, which satisfies the physical simulation of shale reservoirs with anisotropic media. It is known that the value of the parameter epsilon is used to characterize the anisotropy intensity, and the value of epsilon is approximately between 0 and 0.8. A value of epsilon less than 0.2 can be considered as weak anisotropy. Therefore, the shale physical model of this application has weak anisotropic characteristics, which satisfies the physical simulation of shale reservoirs with weak anisotropic media.

[0026] In addition, phenolic fabric boards, fiberglass boards, and unsaturated polyester composite boards themselves have relatively certain anisotropic characteristics, which provide basic materials for the physical simulation of shale reservoirs in weakly anisotropic media. This is of great significance for clarifying the seismic response characteristics of shale and expanding the experimental capabilities of shale physical simulation.

[0027] In one embodiment, the pressure applied to the stacked substrates is 6 kPa to 8 kPa, for example, 6 kPa, 7 kPa, or 8 kPa. If the pressure applied to the stacked substrates is less than 6 kPa, the adhesion between the substrates is poor, and the properties of the substrates parallel to and perpendicular to the stacking direction differ, resulting in a poor effect on the shale physical model's weak anisotropy characteristics. If the pressure applied to the stacked substrates is greater than 8 kPa, the substrates are prone to breakage. Therefore, a pressure of 6 kPa to 8 kPa is sufficient to balance good adhesion between the substrates, good weak anisotropy characteristics of the shale physical model, and substrate reliability. It should be noted that in other embodiments, the pressure applied to the stacked substrates is not limited to this.

[0028] In one embodiment, the thickness of the shale physical model is 3cm to 10cm, for example, 3cm, 5cm, 7cm, 8cm, or 10cm. If the thickness of the shale physical model is less than 3cm, the internal structural features of the shale physical model cannot be fully displayed, and the difference in properties parallel to and perpendicular to the stacking direction is not obvious, resulting in poor performance of the shale physical model in exhibiting weak anisotropy. If the thickness of the shale physical model is greater than 10cm, uneven stress distribution is likely to occur inside the shale physical model, affecting the performance of the shale physical model in exhibiting weak anisotropy. Therefore, a thickness of 3cm to 10cm for the shale physical model can meet the requirement of good performance in exhibiting weak anisotropy. It should be noted that in other embodiments, the thickness of the shale physical model is not limited to this.

[0029] The thickness of the shale physical model is the sum of the thicknesses of several substrates and the adhesive. Given a fixed thickness for the shale physical model, a larger thickness for each individual substrate and a smaller thickness for the adhesive results in a greater anisotropic strength for the shale physical model. The thicknesses of the individual substrates and the adhesive can be set according to the anisotropic strength requirements of the actual shale physical model. In other embodiments, the thickness of each individual substrate can be set to be relatively small, while the thickness of the adhesive can be set to be relatively large.

[0030] In one embodiment, the thickness of a single substrate is 0.1 mm to 50 mm, for example, 0.1 mm, 10 mm, 20 mm, 30 mm, 40 mm, or 50 mm. Several substrates of the above thicknesses are bonded together with an adhesive, resulting in a shale physical model thickness in the range of 3 cm to 10 cm. This enables the anisotropy parameter epsilon of the shale physical model to be greater than 0.2, thus enhancing the weak anisotropy characteristics of the shale physical model. It should be noted that in other embodiments, the thickness of a single substrate is not limited to this.

[0031] In one embodiment, the substrate is provided by Zhejiang Haodesheng Insulation Materials Co., Ltd. The phenolic fabric board is formed by pressing phenolic resin and cotton cloth together; the fiberglass board is prepared by placing unwound fiberglass into a glue tank using guide rollers, with the glue impregnation amount controlled by extrusion rollers within the tank. After impregnation, the fiberglass cloth enters an oven to remove solvents and other volatiles, ultimately yielding the fiberglass board; the unsaturated polyester composite board (SMC composite board) is made from SMC special yarn, unsaturated resin, low-shrinkage additives, fillers, and various auxiliaries, and is produced by compression molding. In other embodiments, the substrate material is not limited to these.

[0032] In one embodiment, the adhesive comprises epoxy resin and epoxy curing agent; the weight of the epoxy curing agent in the adhesive is 40% to 50% of the weight of the epoxy resin. For example, the weight of the epoxy curing agent in the adhesive is 40%, 45%, or 50% of the weight of the epoxy resin. If the weight of the epoxy curing agent in the adhesive is less than 40% of the weight of the epoxy resin, the adhesive cannot cure completely, its performance is unstable, leading to separation between any two adjacent substrates, poor reliability of the shale physical model, and affecting the weak anisotropy characteristics of the shale physical model. If the weight of the epoxy curing agent in the adhesive is greater than 50% of the weight of the epoxy resin, the excessive epoxy curing agent will affect the mechanical properties of the adhesive, resulting in poor performance of the shale physical model in exhibiting weak anisotropy characteristics. Therefore, a weight of 40% to 50% of the weight of the epoxy curing agent in the adhesive can balance the requirements of high reliability and good performance of weak anisotropy characteristics in the shale physical model. It should be noted that in other embodiments, the weight of the epoxy curing agent in the adhesive is not limited to this value.

[0033] In one embodiment, the adhesive contains 50 parts by weight of epoxy curing agent and 100 parts by weight of epoxy resin. In other embodiments, the weight percentages of epoxy curing agent and epoxy resin in the adhesive are not limited thereto.

[0034] In one embodiment, the epoxy resin is a bisphenol A type liquid epoxy resin. The bisphenol A type liquid epoxy resin has an epoxy equivalent of 184 g / mol to 195 g / mol; and a viscosity of 10000 mPas to 16000 mPas at 25°C. In other embodiments, the epoxy resin is another type of epoxy resin.

[0035] In one embodiment, the epoxy curing agent is an R-2269 type curing agent. Preferably, the R-2269 type curing agent comprises isophorone diamine, benzyl alcohol, and epoxy resin; wherein the weight percentage of isophorone diamine in the R-2269 type curing agent is 50% to 60%, the weight percentage of benzyl alcohol in the R-2269 type curing agent is 20% to 25%, and the weight percentage of epoxy resin in the R-2269 type curing agent is 20% to 25%. In other embodiments, the epoxy curing agent is another type of curing agent.

[0036] In one embodiment, the adhesive comprises silicone rubber and a silicone rubber curing agent; the weight of the silicone rubber curing agent in the adhesive is 2% to 5% of the weight of the silicone rubber. For example, the weight of the silicone rubber curing agent in the adhesive is 2%, 3%, 4%, or 5% of the weight of the silicone rubber. If the weight of the silicone rubber curing agent in the adhesive is less than 2% of the weight of the silicone rubber, the adhesive cannot cure completely, the adhesive performance is unstable, leading to separation between any two adjacent substrates, poor reliability of the shale physical model, and affecting the weak anisotropy characteristics of the shale physical model. If the weight of the silicone rubber curing agent in the adhesive is greater than 5% of the weight of the silicone rubber, the excessive silicone rubber curing agent will affect the mechanical properties of the adhesive, resulting in poor performance of the shale physical model in exhibiting weak anisotropy characteristics. Therefore, a weight of 2% to 5% of the weight of the silicone rubber curing agent in the adhesive can balance the requirements of high reliability and good performance of the shale physical model in exhibiting weak anisotropy characteristics. It should be noted that in other embodiments, the weight of the silicone rubber curing agent in the adhesive is not limited to this value.

[0037] In one embodiment, the adhesive contains 2 to 5 parts by weight of silicone rubber curing agent and 100 parts by weight of silicone rubber. In other embodiments, the weight percentages of silicone rubber curing agent and silicone rubber in the adhesive are not limited thereto.

[0038] In one embodiment, the silicone rubber is 107 silicone rubber produced by Shandong Bogang Biotechnology Co., Ltd.; its viscosity is 750 mPas at 25°C. In other embodiments, the silicone rubber is other types of silicone rubber.

[0039] In one embodiment, the silicone rubber curing agent is a silicone rubber curing agent produced by Shandong Bogang Biotechnology Co., Ltd. In other embodiments, the silicone rubber curing agent is another type of silicone rubber curing agent.

[0040] In other embodiments, the adhesive includes other adhesives.

[0041] In one embodiment, the surface of the substrate to be coated with adhesive is cleaned before applying the adhesive between any two adjacent substrates. This improves the adhesion between the substrates, thereby enhancing the reliability of the shale physical model; it also prevents stains on the surface of the substrate from affecting the internal structural features and stress distribution of the shale physical model, thus improving the model's ability to achieve weak anisotropy.

[0042] In one embodiment, applying pressure to a plurality of stacked substrates to obtain a shale physical model includes: providing a mold, placing the stacked substrates in the mold; applying pressure to the stacked substrates in the mold; and removing the mold after the pressure treatment is completed. Applying pressure to the stacked substrates in the mold helps improve the manufacturing accuracy and quality of the shale physical model and enhances the effect of the shale physical model in achieving weak anisotropy characteristics.

[0043] In one embodiment, after the pressure application is completed and before the mold is removed, the process further includes: curing the adhesive. This improves the bonding strength between the substrates and enhances the stability of the shale physical model.

[0044] In one embodiment, the curing process is performed by static curing; the curing temperature is room temperature, and the curing time is 24 hours.

[0045] In one embodiment, before placing the stacked substrates into the mold, the method further includes forming a release agent on the inner surface of the mold to facilitate subsequent mold removal.

[0046] In one embodiment, the release agent includes, but is not limited to, petrolatum.

[0047] The following is for reference. Figures 2 to 6 This section details the preparation method of shale physical models.

[0048] refer to Figure 2 It provides several substrates 100, adhesives 200 and molds 300.

[0049] In one embodiment, the adhesive 200 comprises an epoxy resin and an epoxy curing agent; the step of providing the adhesive 200 comprises: weighing the epoxy curing agent and the epoxy resin separately; mixing the epoxy curing agent and the epoxy resin and stirring evenly to form the adhesive 200.

[0050] The ratio of the weight of the epoxy curing agent to the weight of the epoxy resin in adhesive 200 is described in the foregoing embodiments.

[0051] In another embodiment, adhesive 200 includes silicone rubber and silicone rubber curing agent; the step of providing adhesive 200 includes: weighing silicone rubber and silicone rubber curing agent separately; mixing silicone rubber and silicone rubber curing agent and stirring evenly to form adhesive 200.

[0052] The ratio of the weight of silicone rubber to the weight of silicone rubber curing agent in adhesive 200 is described in the foregoing embodiments.

[0053] In one embodiment, the surface of the substrate 100 to which the adhesive 200 is to be applied is cleaned. In other embodiments, cleaning may not be required.

[0054] In one embodiment, a release agent (not shown) is formed on the inner surface of the mold 300. In other embodiments, a release agent may not be formed on the inner surface of the mold.

[0055] For material and thickness descriptions of each substrate, please refer to the description in the foregoing embodiments.

[0056] refer to Figure 3 Adhesive 200 is applied to the surface of substrate 100 on which the adhesive is to be applied.

[0057] In one embodiment, the process of applying the adhesive 200 to the surface of the substrate 100 on which the adhesive 200 is to be applied includes an application process. In other embodiments, the process of applying the adhesive to the surface of the substrate on which the adhesive is to be applied includes other processes.

[0058] refer to Figure 4 Several substrates 100 are stacked, and an adhesive 200 is placed between any two adjacent substrates 100.

[0059] In one embodiment, the total thickness of the stacked substrates 100 and adhesive 200 is 3 cm to 10 cm. In other embodiments, the total thickness of the stacked substrates and adhesive is not limited to this.

[0060] refer to Figure 5 Several stacked substrates 100 are placed in a mold 300; pressure is applied to the stacked substrates 100 in the mold 300. During the pressure application process, excess adhesive between any two adjacent substrates 100 is extruded.

[0061] The description of the pressure used to apply pressure to the stacked substrates 100 is given in the description of the foregoing embodiments.

[0062] In one embodiment, the adhesive is cured after the pressure treatment is completed.

[0063] For a description of the curing time and temperature, please refer to the description in the foregoing embodiments.

[0064] refer to Figure 6 Remove mold 300 to obtain shale physical model 100a.

[0065] In one embodiment, after removing the mold 300, the surface of the shale physical model 100a is cleaned; in other embodiments, cleaning may not be performed.

[0066] Test Example 1

[0067] The method for preparing the shale physical model in Test Example 1 includes the method for preparing the shale physical model described in the above embodiments. Specifically:

[0068] Provide several substrates 100 of the same material; each substrate 100 is made of phenolic fabric board.

[0069] Adhesive 200 includes epoxy resin and epoxy curing agent; the weight of epoxy curing agent in adhesive 200 is 50% of the weight of epoxy resin; or, adhesive includes silicone rubber and silicone rubber curing agent; the weight of silicone rubber curing agent in adhesive 200 is 4% of the weight of silicone rubber.

[0070] All other aspects of this test case are the same as those in the previous embodiment, and the details of the same aspects will not be described again.

[0071] Test Example 2

[0072] The difference between Test Example 2 and Test Example 1 is that each substrate 100 is made of fiberglass board.

[0073] All other aspects of this test case are the same as those of the previous test case, and the details of the same aspects will not be repeated here.

[0074] Test Example 3

[0075] The difference between Test Example 3 and Test Example 1 is that each substrate 100 is made of unsaturated polyester composite board.

[0076] All other aspects of this test case are the same as those of the previous test case, and the details of the same aspects will not be repeated here.

[0077] The shear wave velocity and longitudinal wave velocity of the shale physical models prepared using the methods provided in Test Example 1, Test Example 2, and Test Example 3 were tested respectively, and the value of the parameter epsilon was calculated. Here, the shear wave velocity of the shale physical model refers to the wave velocity perpendicular to the stacking direction; the longitudinal wave velocity of the shale physical model refers to the wave velocity parallel to the stacking direction. The test and calculation results are shown in Table 1 below:

[0078] Table 1

[0079] Shear wave velocity / m / s Longitudinal wave velocity / m / s The value of the parameter epsilon Test Example 1 2550 2614 -0.02 Test Example 2 4317 3655 0.2 Test Example 3 3216 2768 0.18

[0080] Test and calculation results show that the anisotropy parameter epsilon of the shale physical model prepared using the method of Test Example 1 exceeds the range of 0–0.8, while the anisotropy parameter epsilon of the shale physical model prepared using the methods of Test Examples 2 and 3 is within the range of 0–0.8. Furthermore, the anisotropy parameter epsilon values ​​of the shale physical models prepared using the methods of Test Examples 1, 2, and 3 are all less than 0.2. Therefore, using any one of the following materials as the substrate—phenolic resin board, fiberglass board, or unsaturated polyester composite board—can meet the requirements for physical simulation of shale reservoirs with weak anisotropy. Preferably, each substrate is made of fiberglass board or unsaturated polyester composite board, as the test and numerical calculation results of the anisotropy parameter epsilon more closely approximate the actual seismic wave propagation characteristics (weak anisotropy characteristics), thus offering significant advantages in seismic exploration.

[0081] refer to Figure 6 Another embodiment of the present invention also provides a shale physical model, comprising: preparing the shale physical model using the above-described method. Based on the description of the foregoing embodiments, the shale physical model possesses weak anisotropy characteristics, satisfying the physical simulation of shale reservoirs with weak anisotropic media.

[0082] It should be understood that the terms "mechanism," "device," "component," etc., used in this application are merely one method of distinguishing different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they can be replaced by other expressions.

[0083] Those skilled in the art will understand that the above embodiments are specific examples of implementing the present invention. In practical applications, the technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification, and various changes can be made to them in form and detail without departing from the spirit and scope of the present invention.

Claims

1. A method for preparing a shale physical model, characterized in that, include: Provide several substrates of the same or different materials; each of the substrates is made of any one of phenolic cloth board, fiberglass board and unsaturated polyester composite board; The plurality of substrates are stacked, and an adhesive is provided between any two adjacent substrates; Along the stacking direction, pressure is applied to the stacked substrates to obtain a shale physical model, wherein the anisotropy parameter epsilon of the shale physical model is less than 0.

2.

2. The method for preparing the shale physical model according to claim 1, characterized in that, The pressure applied to the stacked substrates is 6 kPa to 8 kPa.

3. The method for preparing the shale physical model according to claim 1, characterized in that, The thickness of the shale physical model is 3cm to 10cm; wherein the thickness of a single substrate is 0.1mm to 50mm.

4. The method for preparing the shale physical model according to claim 1, characterized in that, The adhesive comprises epoxy resin and epoxy curing agent; The epoxy curing agent in the adhesive comprises 40% to 50% of the weight of the epoxy resin.

5. The method for preparing the shale physical model according to claim 1, characterized in that, The adhesive includes silicone rubber and a silicone rubber curing agent; The weight of the silicone rubber curing agent in the adhesive is 2% to 5% of the weight of the silicone rubber.

6. The method for preparing the shale physical model according to claim 1, characterized in that, Before applying the adhesive between any two adjacent substrates, the surfaces of the substrates to which the adhesive is to be applied are cleaned.

7. The method for preparing the shale physical model according to claim 1, characterized in that, The stacked substrates are subjected to pressure treatment to obtain the shale physical model, which includes: A mold is provided, and the stacked substrates are placed in the mold; pressure is applied to the stacked substrates in the mold. After the pressure treatment is completed, the mold is removed.

8. The method for preparing the shale physical model according to claim 7, characterized in that, After the pressure treatment is completed and before the mold is removed, the process also includes: The adhesive is then cured.

9. The method for preparing the shale physical model according to claim 7, characterized in that, Before placing the stacked substrates into the mold, the method further includes: A release agent is formed on the inner surface of the mold.

10. A shale physical model, characterized in that, include: It is prepared using the method for preparing the shale physical model as described in any one of claims 1 to 9.

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