power module

Abstract

This invention provides a power conversion module and its magnetic component. The magnetic component includes a magnetic core assembly, comprising a top surface, a bottom surface, a first sidewall, a second sidewall, a third sidewall, a fourth sidewall, a central post, and two side posts. The first, second, third, and fourth sidewalls are located between the top and bottom surfaces, with the first and third sidewalls facing each other and the second and fourth sidewalls facing each other. The central post is located between the two side posts, and the central post and the two side posts define a first winding channel and a second winding channel, respectively. The two openings of the first winding channel are exposed to the first and fourth sidewalls, respectively, and the two openings of the second winding channel are exposed to the second and third sidewalls, respectively. The module also includes two windings, each winding being at least partially disposed within a corresponding winding channel.

Description

Technical Field

[0001] This invention relates to the field of power electronic equipment technology, and more particularly to a power conversion module and its magnetic components. Background Technology

[0002] Modern power electronic devices, as a crucial component of power conversion, are widely used in the power, electronics, motor, and energy industries. Ensuring the long-term stable operation of power electronic devices and improving their power conversion efficiency have always been important goals pursued by those skilled in the art.

[0003] With the rapid development of technologies such as mobile communication and cloud computing, high-power DC / DC power conversion modules have been widely used in communication products. Due to the increasing power and miniaturization of these products, new challenges have been posed to the conversion efficiency and size of power conversion modules. Therefore, designing a reasonable structure and layout for power conversion modules to improve their conversion efficiency and reduce their size is one of the hot topics in this technical field.

[0004] To achieve the advantages of reducing the capacity of the output filter and increasing the system output power, traditional power conversion modules typically use a parallel circuit architecture, which includes at least two power conversion circuits connected in parallel, such as two buck power conversion circuits connected in parallel. In order to optimize the ripple characteristics of the output current of multiple parallel circuits, magnetic integration technology is used to make the multiple inductors of the two power conversion circuits in the power conversion module form a magnetically integrated coupling relationship, that is, the two inductors of the two power conversion circuits constitute two-phase coupled inductors.

[0005] However, because the magnetic components used in traditional power conversion modules in magnetic integration technology include common E-type magnetic cores, where the two opposite channel openings of one winding and the two opposite channel openings of the other winding are exposed on the two opposite sidewalls of the E-type magnetic core, the distance between the two-phase coupled inductors formed by the two windings and the E-type magnetic core and the output terminals of the power conversion module will be inconsistent due to different placement positions. As a result, the equivalent DC series resistance of the two-phase coupled inductors will be asymmetrical, and the current of the two-phase coupled inductors will be uneven. This will lead to a large DC flux on the side posts of the E-type magnetic core, which will easily cause flux saturation of the side posts of the E-type magnetic core, which is not conducive to improving the performance of the power conversion module.

[0006] Therefore, how to develop a power conversion module and its magnetic components to solve the problems faced by the existing technology and achieve the goal of optimizing the power conversion module is a topic that urgently needs to be addressed in this field. Summary of the Invention

[0007] The purpose of this invention is to provide a power conversion module and its magnetic components to solve the problem that in traditional power conversion modules, the two opposite channel openings of the two winding channels of the E-type magnetic core are exposed on the two opposite sidewalls of the E-type magnetic core, resulting in inconsistent distances between the two-phase coupled inductors and the output terminals of the power conversion module. This leads to asymmetrical equivalent DC series resistance of the two-phase coupled inductors, uneven current in the two-phase coupled inductors, and consequently, easy saturation of the magnetic flux of the side posts of the E-type magnetic core, which is detrimental to the performance improvement of the power conversion module.

[0008] To achieve the aforementioned objectives, the present invention provides a magnetic assembly comprising: a magnetic core assembly including a top surface, a bottom surface, a first sidewall, a second sidewall, a third sidewall, a fourth sidewall, a central post, and two side posts, wherein the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall are respectively located between the top surface and the bottom surface, and the first sidewall is opposite to the third sidewall and the second sidewall is opposite to the fourth sidewall; the central post is located between the two side posts, and the central post and the two side posts define a first winding channel and a second winding channel, respectively; the two openings of the first winding channel are exposed to the first sidewall and the fourth sidewall, respectively; and the two openings of the second winding channel are exposed to the second sidewall and the third sidewall, respectively; and two windings, each winding being at least partially disposed within a corresponding winding channel.

[0009] To achieve the aforementioned objectives, the present invention further provides a power conversion module, comprising: at least one inductor composed of a magnetic component, wherein the magnetic component comprises: a main body layer including a first surface and a second surface, the first surface and the second surface being two opposing surfaces; a magnetic core assembly including a top surface, a bottom surface, a first sidewall, a second sidewall, a third sidewall, a fourth sidewall, a central post, and two side posts, wherein the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall are respectively located between the top surface and the bottom surface, and the first sidewall is opposite to the third sidewall, the second sidewall is opposite to the fourth sidewall, the central post is located between the two side posts, and the central post and the two side posts define a first winding. The system comprises a channel and a second winding channel, wherein the two openings of the first winding channel are exposed on the first sidewall and the fourth sidewall, respectively, and the two openings of the second winding channel are exposed on the second sidewall and the third sidewall, respectively; a conductor, embedded between the first and second surfaces of the main body layer and at least partially exposed on the first, second, third, and fourth sidewalls, and comprising two windings, each winding being at least partially disposed within the corresponding winding channel; and a power device layer disposed on the first surface of the main body layer, wherein the power device layer comprises at least one power device, the at least one power device being electrically connected to the conductor; wherein the currents on the two windings are in opposite directions.

[0010] The beneficial effect of this invention is that it provides a power conversion module and its magnetic component. Since the two opposite openings of the first winding channel of the magnetic core assembly are exposed to the first and fourth sidewalls respectively, and the two opposite openings of the second winding channel are exposed to the second and third sidewalls respectively, in other words, the two opposite openings of the first and second winding channels are exposed to the four different sidewalls of the magnetic core assembly. This allows the two coupled inductors formed by the two windings disposed in the first and second winding channels to be distributed relatively symmetrically in their structural layout. Therefore, the distance between the output terminals of the two coupled inductors and the output terminals of the power conversion module can be approximately equal. This significantly reduces the asymmetry of the equivalent DC series resistance of the two coupled inductors, making the currents of the two coupled inductors approximately equal. This avoids the DC flux of the side posts of the magnetic core assembly from increasing, thus reducing the flux saturation phenomenon of the side posts and improving the performance of the power conversion module. Attached Figure Description

[0011] Figure 1A and Figure 1B These are three-dimensional structural diagrams of the power conversion module of the first preferred embodiment of the present invention from different perspectives. Figure 2A and Figure 2B for Figure 1A The power conversion module shown is an exploded view from different perspectives. Figure 3A This is a perspective structural diagram of a first preferred embodiment of the magnetic core assembly of the power conversion module of the present invention. Figure 3B for Figure 3A A perspective view of the magnetic core assembly shown. Figure 4 This is the circuit topology corresponding to the power conversion module of the present invention; Figure 5A To disclose an exemplary prefabricated structure of the conductor of the present invention; Figure 5B To disclose an exemplary structure of the conductor of the present invention; Figure 6 This is a perspective structural diagram of a second preferred embodiment of the magnetic core assembly of the power conversion module of the present invention; Figure 7 This is a perspective structural diagram of a third preferred embodiment of the magnetic core assembly of the present invention; Figure 8A , Figure 8B for Figure 2A Another variation of the magnetic component is shown in a three-dimensional structural diagram from different perspectives; Figure 9A and Figure 9BThese are three-dimensional structural diagrams of the power conversion module of the second preferred embodiment of the present invention from different perspectives; Figure 10A and Figure 10B for Figure 9A The power conversion module shown is an exploded view from different perspectives. Figure 11A and Figure 11B These are three-dimensional and partial perspective structural diagrams of the power conversion module of the third preferred embodiment of the present invention from different perspectives; Figure 12A and Figure 12B for Figure 11A The power conversion module shown is an exploded view from different perspectives. Figure 13A and Figure 13B These are three-dimensional and partial perspective structural diagrams of the power conversion module of the fourth preferred embodiment of the present invention from different perspectives; Figure 14A and Figure 14B for Figure 13A The power conversion module shown is an exploded view from different perspectives. Figure 15A and Figure 15B These are three-dimensional structural diagrams of the power conversion module of the fifth preferred embodiment of the present invention from different perspectives; Figure 16A and Figure 16B for Figure 15A The power conversion module shown is an exploded view from different perspectives. Figure 17A and Figure 17B These are three-dimensional and perspective structural diagrams of the power conversion module of the sixth preferred embodiment of the present invention from different perspectives.

[0012] The attached figures are labeled as follows: 1, 1b, 1c, 1d, 1e: Power conversion modules 2: Magnetic components 5: Power Device Layer 20, 20a: Magnetic core assembly 231a, 231b: Windings 21, 80: Top surface 22, 81: Bottom surface 23, 82: First sidewall 24, 83: Second sidewall 25, 84: Third sidewall 26, 85: Fourth sidewall 27: Central Pillar 28: Side Post 29a: First winding channel 29b: Second winding channel L 0A L 0N :inductance 30: Main body layer 40: Conductor 31: First Page 32: Second page 50a, 50b: Power devices Q 1A Q 2A Q 1N Q 2N :switch Cin: Input capacitance 51: Control Components 52: Circuit Board 520, 60, 88, 90, 9b: First surface 521, 61, 89, 91, 9c: Second surface 6: Joint layer 62: Input positive terminal pin 63: Positive output pin 64: Output negative terminal pin 65: Signal control pin 66: Feedback signal pin Vin+: Input positive character Vin-: Negative input terminal Vo+: Positive output terminal 23a: Prefabricated structure 241: First connecting part 242: Second connecting part SW: Connector 243: Third connecting part 244: Fourth connecting part 200, 202: Type E magnetic core 270: Air gap 201: Type I magnetic core 86: Fifth sidewall 87: Sixth lateral wall 7, 8, 9, 9a: Packaging Unit 70: Output capacitor element Co: Output capacitor 41: Power device pin face 42: Input positive terminal pin face 43: Output positive terminal connection surface 44: Output negative terminal pin 45: Signal control pin face 46: Feedback signal pin 531: Power device contact terminal; 532: Positive input contact terminal 534: Output negative terminal contact terminal 535: Signal control contact terminal 536: Feedback signal contact terminal Detailed Implementation

[0013] Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can be varied in different ways without departing from the scope of the invention, and the description and drawings herein are for illustrative purposes only and are not intended to limit the invention.

[0014] Figure 1A and Figure 1B These are three-dimensional structural diagrams of the power conversion module of the first preferred embodiment of the present invention from different perspectives. Figure 2A and Figure 2B for Figure 1A The diagram shown is an exploded view of the power conversion module from different perspectives. Figure 3A This is a perspective structural diagram of a first preferred embodiment of the magnetic core assembly of the power conversion module of the present invention. Figure 3B for Figure 3A The diagram shows a perspective view of the magnetic core assembly. Figure 4 This is the circuit topology corresponding to the power conversion module of the present invention. In this embodiment, the circuit topology formed by the power conversion module 1 can be similar to... Figure 4 As shown, the power conversion module 1 can be a circuit topology consisting of two step-down power conversion circuits connected in parallel. The power conversion module 1 includes a magnetic component 2 and a power device layer 5. The magnetic component 2 includes a magnetic core component 20 and two windings 231a and 231b. The magnetic core component 20 includes a top surface 21, a bottom surface 22, a first sidewall 23, a second sidewall 24, a third sidewall 25, a fourth sidewall 26, a central pillar 27, and two side pillars 28. The top surface 21 is opposite to the bottom surface 22. The first sidewall 23, the second sidewall 24, the third sidewall 25, and the fourth sidewall 26 are located between the top surface 21 and the bottom surface 22, respectively. The first sidewall 23 is opposite to the third sidewall 25, and the second sidewall 24 is opposite to the fourth sidewall 26. The term "opposite sidewalls" here generally refers to at least one additional sidewall between two opposing sidewalls. This additional sidewall can be a plane or an arc surface, but is not limited to these. The central post 27 is located between the two side posts 28, and the central post 27 and the two side posts 28 define a first winding channel 29a and a second winding channel 29b, respectively. The two opposite channel openings of the first winding channel 29a are exposed to the first side wall 23 and the fourth side wall 26, respectively, and the two opposite channel openings of the second winding channel 29b are exposed to the second side wall 24 and the third side wall 25, respectively.

[0015] Either of the two windings 231a and 231b is at least partially disposed in the corresponding winding channel of the first winding channel 29a and the second winding channel 29b. For example, winding 231a is at least partially disposed in the first winding channel 29a, and winding 231b is at least partially disposed in the second winding channel 29b. The currents flowing through the two windings 231a and 231b are in opposite directions to achieve DC magnetic flux superposition and AC magnetic flux subtraction, thereby achieving the advantage of significantly suppressing current ripple and greatly increasing the equivalent inductance. In addition, the two windings 231a and 231b together with the magnetic core assembly 20 form two coupled inductors, for example... Figure 4 The inductor L shown 0A L 0N However, this is not the limitation; the two windings 231a and 231b and the magnetic core assembly 20 can also be used together to form a transformer.

[0016] In some embodiments, the magnetic component 2 further includes a main body layer 30 and a conductor 40. The main body layer 30 may be, for example, but not limited to, a plate structure, and the structural shape of the main body layer 30 generally corresponds to the structural shape of the magnetic core component 20. It includes a first surface 31 and a second surface 32, which are two opposing surfaces. The magnetic core component 20 is embedded in the main body layer 30, wherein the top surface 21 of the magnetic core component 20 is adjacent to the first surface 31 of the main body layer 30, and the bottom surface 22 of the magnetic core component 20 is adjacent to the second surface 32 of the main body layer 30. The conductor 40 is embedded between the first surface 31 and the second surface 32 of the main body layer 30, and is circumferentially and at least partially exposed on the first sidewall 23, the second sidewall 24, the third sidewall 25, and the fourth sidewall 26 of the magnetic core component 20. Furthermore, part of the structure of the conductor 40 may form two windings 231a and 231b.

[0017] The power device layer 5 may be a board structure and, for example, be attached to the first surface 31 of the main body layer 30. The power device layer 5 includes at least one power device, such as power devices 50a and 50b. Each power device 50a and 50b includes two switches and forms a half-bridge arm (for example, power device 50a may be configured as follows). Figure 4 The diagram shows a switch Q. 1A Q 2A The half-bridge arm, with power devices 50b, can be configured as follows: Figure 4 The diagram shows a switch Q. 1N Q 2N (half-bridge arms), each half-bridge arm can be connected to the input capacitor Cin (see [link to relevant documentation]). Figure 4Electrical connection. In other embodiments, the power device layer 5 may further include a control component 51 and a circuit board 52. The circuit board 52 includes a first surface 520 and a second surface 521 opposite to each other, with the second surface 521 adjacent to the first surface 31 of the main body layer 30. The control component 51 and power devices 50a and 50b are respectively disposed on the first surface 520 of the circuit board 52, and the control component 51 is used to control the operation of the power devices 50a and 50b. In some embodiments, the two power devices 50a and 50b constituting the two half-bridge arms may be symmetrically disposed on the first surface 520 of the circuit board 52 along a diagonal. In other embodiments, the power devices 50a and 50b are the highest surfaces in the power conversion module 1 to facilitate the installation of a heat sink (not shown). At least one power device contact terminal 531, at least one positive input contact terminal 532, at least one negative output contact terminal 534, at least one signal control contact terminal 535, and at least one feedback signal contact terminal 536 are disposed on the second surface 521. The power device contact 531 is electrically connected to the power device pins SW of power devices 50a and 50b, which correspond to... Figure 4 The symbol SW corresponds to the positive terminal contact 532. Figure 4 The positive input terminal Vin+ and the negative output terminal contact terminal 534 correspond to... Figure 4 The output negative terminal Vo- (i.e., the GND of the power conversion module 1) and the signal control contact terminal 535 are used to transmit control signals, and the feedback signal contact terminal 536 is used to transmit sampling signals.

[0018] In some embodiments, the power conversion module 1 further includes a pin layer 6 adjacent to the second surface 32 of the main body layer 30 and attached to the bottom surface 22 of the magnetic core assembly 20. The pin layer 6 includes a first surface 60 and a second surface 61 opposite to each other, and at least one positive input pin 62, at least one positive output pin 63, at least one negative output pin 64, at least one signal control pin 65, and at least one feedback signal pin 66 disposed on the first surface 60. The positive input pin 62 corresponds to… Figure 4 The positive input terminal Vin+ and the negative output terminal pin 64 correspond to... Figure 4 The output negative terminal Vo- (i.e., GND of the power conversion module 1) and the output positive terminal pin 63 correspond to Figure 4 The positive output terminal Vo+ is connected to the power converter module 1, and the aforementioned three pins are electrically connected to external pins on the second surface 32 of the main body layer 30 via wiring within the pin layer 6, thereby providing electrical connections for input and output of the power converter module 1. The signal control pin 65 is used to transmit control signals. The feedback signal pin 66 is used to transmit sampling signals.

[0019] Of course, the power conversion module 1 also includes an input capacitor layer or at least one input capacitor element to form Figure 4The input capacitance Cin shown is (in) Figure 2B The above example illustrates an input capacitor (Cin) composed of an input capacitor element, wherein the input capacitor layer or input capacitor element is connected across the input terminal of the power conversion module 1. Structurally, the input capacitor layer or input capacitor element is preferably positioned close to the power devices 50a and 50b. In some embodiments, the input capacitor layer or input capacitor element is disposed between the power device layer 5 and the magnetic component 20, for example, disposed on the second surface 521 of the circuit board 52 and located between the power device layer 5 and the magnetic component 20, or disposed between the power device layer 5 and the main body layer 30, and further located between the power device layer 5 and the magnetic component 20. It should be noted that during the switching process of the power devices 50a and 50b, the parasitic parameters between the input capacitor Cin and the power devices 50a and 50b will generate high-frequency parasitic oscillations with the equivalent parameters of the power devices, affecting the switching process and the magnitude of losses of the power devices 50a and 50b. Therefore, the design of the input capacitor layer or input capacitor element close to the power devices 50a and 50b in this invention helps to reduce the influence of parasitic parameters and further achieves the purpose of reducing the size of the power conversion module 1 and increasing the overall power density of the power conversion module 1. In addition, to further reduce the distributed inductance between the input capacitor Cin and each half-bridge arm of the power conversion module 1, the input capacitor Cin can be placed between the two half-bridge arms and the two coupled inductors. Furthermore, the projection of the input capacitor Cin onto the horizontal plane overlaps with the projection of the magnetic core assembly 20 onto the horizontal plane. The power conversion module 1 may also include... Figure 4 The output capacitor Co shown can be positioned between the magnetic component 2 and the lead layer 6. Furthermore, Figure 4 The output capacitor Co shown can be set on the system board instead of in the power conversion module 1, but it is not limited to this and can also be formed in the power conversion module 1. The second end of the output capacitor Co is connected to the positive output pin 63, and the first end is connected to the negative output pin 64.

[0020] As can be seen from the above, compared to the E-type magnetic core of a traditional power conversion module where the two opposite channel openings of one winding channel and the two opposite channel openings of the other winding channel are exposed to the two opposite sidewalls of the E-type magnetic core (similar to the first sidewall 23 and the third sidewall 25 of the magnetic core assembly 20 of the present invention, or the second sidewall 24 and the fourth sidewall 26 of the magnetic core assembly 20), since the two opposite channel openings of the first winding channel 29a of the magnetic core assembly 20 of the power conversion module 1 of the present invention are exposed to the first sidewall 23 and the fourth sidewall 26 respectively, the second winding channel 29b... Two opposing channel openings are exposed on the second sidewall 24 and the third sidewall 25, respectively. In other words, the two opposing channel openings of the first winding channel 29a and the two opposing channel openings of the second winding channel 29b are exposed on the four different sidewalls of the magnetic core assembly. This allows the two coupled inductors formed by the two windings 231a and 231b disposed in the first winding channel 29a and the second winding channel 29b to be distributed relatively symmetrically in the structural layout. Therefore, the output terminals of the two coupled inductors (i.e., the output positive terminal connection surface 43 mentioned below) and the output terminals of the power conversion module 1 (see [link to relevant documentation]) are connected in a more symmetrical manner. Figure 2B The output terminal 613 is indicated, and this output terminal 613 is also... Figure 4 The distance between the output terminals Vo+ shown can be approximately equal. In this way, the asymmetry of the equivalent DC series resistance of the two coupled inductors can be greatly reduced, making the current of the two coupled inductors approximately equal. This can avoid the DC flux of the side column of the magnetic core assembly from increasing and reduce the flux saturation phenomenon of the side column, thereby improving the performance of the power conversion module 1.

[0021] In addition, the first end of winding 231a is electrically connected to one of the two power devices 50a and 50b (i.e., electrically connected to one of the two half-bridge arms), and the first end of the other winding 231b is electrically connected to the other power device 50a and 50b (i.e., electrically connected to the other half-bridge arm). The projection of each half-bridge arm on the horizontal plane of circuit board 52 overlaps with the projection of the winding electrically connected to the other half-bridge arm on the horizontal plane of circuit board 52.

[0022] In some embodiments, the magnetic core assembly 20 may be a hexahedral structure, wherein one side of the first sidewall 23 is adjacent to one side of the second sidewall 24, the other side of the second sidewall 24 is adjacent to one side of the third sidewall 25, the other side of the third sidewall 25 is adjacent to one side of the fourth sidewall 26, and the other side of the fourth sidewall 26 is adjacent to the other side of the first sidewall 23. The angle between the first sidewall 23 and the second sidewall 24, or the angle between the first sidewall 23 and the fourth sidewall 26, may be, but is not limited to, less than or equal to 120 degrees. Furthermore, the first winding channel 29a and the second winding channel 29b are preferably parallel to each other, but are not limited thereto. Moreover, the direction of the line connecting the two opposite openings of the first winding channel 29a (e.g., ...) Figure 3B The direction A shown is not perpendicular to the first sidewall 23 and the fourth sidewall 26, that is, it does not intersect the first sidewall 23 and the fourth sidewall 26 perpendicularly. The direction of the line connecting the two opposite channel openings of the second winding channel 29b (as shown) Figure 3B The direction shown (B) is not perpendicular to the second sidewall 24 and the third sidewall 25, that is, it does not intersect the second sidewall 24 and the third sidewall 25 perpendicularly.

[0023] Figure 5A This invention discloses an exemplary prefabricated structure for the conductor of the present invention. Figure 5B To disclose an exemplary structure of the conductor of the present invention, in some embodiments, the conductor 40 may be composed of, for example, at least one copper layer or at least one copper block, and is pre-embedded in the main body layer 30. The conductor 40 may be constructed by first embedding a prefabricated structure 23a, for example, composed of a copper block, into a circuit board structure, and then by processes such as controlled depth milling. Figure 5A The prefabricated structure 23a shown is milled Figure 5B The conductor 40 shown has the following structure. The conductor 40 may include a first connecting portion 241 and a second connecting portion 242. The first connecting portion 241 and the second connecting portion 242 are respectively embedded in at least two walls of the main body layer 30 and located between the first surface 31 and the second surface 32. At least one winding 231a, 231b is transversely connected between the first connecting portion 241 and the second connecting portion 242. The first end face of the first connecting portion 241 is at least partially exposed on the first surface 31, for example, forming the power device pin surface 41 in the power conversion module 1, to achieve connection with… Figure 4 The power devices 50a and 50b are connected to their respective power device pins SW. The second end face of the first connection portion 241 may selectively be exposed on the second surface 32; this is not limited here. The second end face of the second connection portion 242 is at least partially exposed on the second surface 32, for example, forming the output positive terminal pin 43 in the power conversion module 1, to achieve... Figure 4The positive terminal Vo+ is connected and then connected to the second terminal of the output capacitor Co. The first end face of the second connection portion 242 may selectively be exposed on the first surface 31; this is not limited here. In other embodiments, the height of the first surface 31 is higher than the top surface 21 of the magnetic core assembly 20, and the height of the second surface 32 is lower than the bottom surface 22 of the magnetic core assembly 20. In some embodiments, the main body layer 30 and the conductor 40 of the magnetic assembly 20 can be integrally formed by molding. The main body layer 30 may be made of, for example, epoxy molding compound or printed circuit board material; this invention is not limited thereto.

[0024] The conductor 40 may further include a third connecting portion 243 and a fourth connecting portion 244. The third connecting portion 243 and the fourth connecting portion 244 are respectively embedded in two opposing walls of the main body layer 30 and located between the first surface 31 and the second surface 32. The first end face of the third connecting portion 243 and the first end face of the fourth connecting portion 244 are at least partially exposed on the first surface 31, for example, each forming an input positive terminal pin 42 and an output negative terminal pin 44 in the power conversion module 1. The second end face of the third connecting portion 243 and the second end face of the fourth connecting portion 244 are at least partially exposed on the second surface 32, for example, each forming an input positive terminal pin 42 and an output negative terminal pin 44 in the power conversion module 1. The input positive terminal pin 42 is used to realize… Figure 4 The connection of the positive input terminal Vin+ is shown, and the negative output terminal pin 44 is used to achieve... Figure 4 The output negative terminal Vo- is connected upwards to the GND network of power device layer 5 and downwards to the GND network of pin layer 6. The conductor 40 may also include other connections, wherein the first end face of a plurality of connections is at least partially exposed on the first surface 31, and its second end face is at least partially exposed on the second surface 32, thereby forming a signal control pin surface 45 and a feedback signal pin surface 46 (e.g., ...). Figure 2A As shown), the signal control pin 45 is used to realize the signal connection between the power switch layer 5 and the pin layer 6 of the power conversion module 1, or to realize the transmission of control signals between at least one power device in the power conversion module 1 and the system board. The feedback signal pin 46 is used to realize the electrical connection of the sampling signal of the power conversion module 1.

[0025] In addition, the positive input pin 62 of the pin layer 6 is electrically connected to the positive input pin surface 42 of the conductor 40 exposed on the second surface 32, the positive output pin 63 is electrically connected to the positive output pin surface 43 of the conductor 40 exposed on the second surface 32, the negative output pin 64 is electrically connected to the negative output pin surface 44 of the conductor 40 exposed on the second surface 32, the signal control pin 65 is electrically connected to the signal control pin surface 45 of the conductor 40 exposed on the second surface 32, and the feedback signal pin 66 is electrically connected to the feedback signal pin surface 46 of the conductor 40 exposed on the second surface 32. The positive input contact 532 of the power device layer 5 is electrically connected to the positive input pin 42 of the conductor 40 exposed on the first surface 31; the power device contact 531 is electrically connected to the power device pin 41 of the conductor 40 exposed on the first surface 31; the negative output contact 534 is electrically connected to the negative output pin 44 of the conductor 40 exposed on the first surface 31; the signal control contact 535 is electrically connected to the signal control pin 45 of the conductor 40 exposed on the first surface 31; and the feedback signal contact 536 is electrically connected to the feedback signal pin 46 of the conductor 40 exposed on the first surface 31.

[0026] Of course, the aforementioned multiple output positive terminal pins 43, input positive terminal pins 42, output negative terminal pins 44, signal control pins 45 and feedback signal pins 46 exposed on the second surface 32 can be used as external pins of the power conversion module 1 and directly electrically connected to the system board. Therefore, the power conversion module 1 may not include the pin layer 6, which can reduce the thickness of the power conversion module 1.

[0027] Furthermore, regarding the configuration of the core assembly 20, the material of the central pillar 27 may differ from that of the rest of the core assembly 20. For example, the central pillar 27 may be made of iron powder material with distributed air gaps, while the rest of the core assembly 20 may be made of ferrite material. This results in low core loss for the core assembly 20, without a significant increase in core loss for the central pillar 27. In some embodiments, the cross-sectional area of ​​the central pillar 27 may, for example, be equal to the cross-sectional area of ​​the side pillar 28.

[0028] In some embodiments, such as Figure 2A , 2B As shown in Figure 3A, the magnetic core assembly 20 includes two E-type magnetic cores 200. Each E-type magnetic core 200 includes three pillars, one of which is located between the other two pillars and forms part of the central pillar 27, while the other two pillars form parts of the two side pillars 28, respectively. The two E-type magnetic cores 200 are arranged opposite to each other, and one side of one E-type magnetic core 200 forms either the top surface 21 or the bottom surface 22 of the magnetic core assembly 20, while one side of the other E-type magnetic core 200 forms the other of the top surface 21 or the bottom surface 22.

[0029] Figure 6This is a perspective view of a second preferred embodiment of the magnetic core assembly of the power conversion module of the present invention. Furthermore, in order to further increase the magnetic reluctance of the central post 27, reduce the magnetic flux density of the central post 27 and the side posts 28, and improve the anti-current saturation performance of the magnetic component 2, in some embodiments, the central post 27 of the magnetic core assembly 20 may include an air gap 270. The air gap 270 may be located in the upper region of the central post 27 and adjacent to the top surface 21 of the magnetic core assembly 20, but is not limited thereto. The air gap 270 may also be located in the lower region of the central post 27 and adjacent to the bottom surface 22 of the magnetic core assembly 20, or the air gap 270 may be located in the middle region of the central post 27.

[0030] Figure 7 This is a perspective structural diagram of a third preferred embodiment of the magnetic core assembly of the present invention. Figure 7 As shown, the magnetic core assembly 20 is not limited to the configuration of two E-type magnetic cores as described above. In other embodiments, the magnetic core assembly 20 may also include an I-type magnetic core 201 and an E-type magnetic core 202. The E-type magnetic core 202 includes three pillars, one of which is located between the other two pillars and forms a central pillar 27, while the other two pillars form two side pillars 28. The I-type magnetic core 201 and the E-type magnetic core 202 are arranged opposite to each other, and one side of the I-type magnetic core 201 forms one of the top surface 21 or the bottom surface 22 of the magnetic core assembly 20, while one side of the E-type magnetic core 202 forms the other of the top surface 21 or the bottom surface 22 of the magnetic core assembly 20.

[0031] Figure 8A , Figure 8B for Figure 2A The diagram shows another variation of the magnetic component, a three-dimensional structural image from different perspectives. Of course, the magnetic core assembly of magnetic component 2 is not limited to a hexahedral structure; it can be a structure exceeding six hexahedral dimensions, for example… Figure 8A and 8B As shown, the magnetic core assembly 20a of the magnetic component 2 can be an octahedral structure. Therefore, in addition to the top surface 80, bottom surface 81, and first sidewalls 82 to fourth sidewalls 85, the magnetic core assembly 20a also includes a fifth sidewall 86 and a sixth sidewall 87. The fifth sidewall 86 and the sixth sidewall 87 are located between the top surface 80 and the bottom surface 81. The fifth sidewall 86 is adjacent to the first sidewall 82 and the second sidewall 83, and the sixth sidewall 87 is adjacent to the third sidewall 84 and the fourth sidewall 85.

[0032] The following will further illustrate various possible implementations of the power conversion module, and since the structures of the power conversion modules in the following implementations are all similar... Figure 1A , 1B The power conversion modules shown in 2A and 2B will be referred to by the same symbols to indicate that the components have similar structures and functions, and will not be described in detail hereafter. Figure 9A and Figure 9BThese are three-dimensional structural diagrams of the power conversion module of the second preferred embodiment of the present invention from different perspectives. Figure 10A and Figure 10B for Figure 9A The diagram shows the exploded structure of the power conversion module from different perspectives. The structure of the power conversion module 1a in this embodiment is similar to that of... Figure 1A , 1B The power conversion module 1 shown is different from the power conversion module 1a in this embodiment, which is composed of... Figure 2A The two half-bridge arms formed by the power devices 50a and 50b shown are packaged as a package unit 7. This package unit 7 can be soldered onto the first surface 520 of the circuit board 52 of the power device layer 5. Additionally, the power conversion module 1a also includes at least one output capacitor element 70. This output capacitor element 70 is disposed on the first surface 60 of the lead layer 6, located between the magnetic component 20 and the lead layer 6, and is used to form... Figure 4 The output capacitor Co is shown. By placing the output capacitor element 70 between the magnetic component 20 and the lead layer 6, output voltage ripple can be reduced. In some embodiments, the projection of the output capacitor Co onto the horizontal plane overlaps with the projection of the magnetic core component 20 onto the horizontal plane.

[0033] Figure 11A and Figure 11B These are three-dimensional and partial perspective structural diagrams of the power conversion module of the third preferred embodiment of the present invention from different perspectives. Figure 12A and Figure 12B for Figure 11A The diagram shows the exploded structure of the power conversion module from different perspectives. The power conversion module 1b in this embodiment is... Figure 1A , 1B The difference in power conversion module 1 shown is that power conversion module 1b will be composed of... Figure 2A The two half-bridge arms formed by the power devices 50a and 50b shown, as well as the control component 51, are all embedded in the circuit board 52, thereby reducing the process difficulty of the rate conversion module 1b in the printed circuit board assembly (PCBA). There are no electronic components on the first surface 520 of the circuit board 52, which is conducive to the installation of the heat sink (not shown).

[0034] Figure 13A and Figure 13B These are three-dimensional and partial perspective structural diagrams of the power conversion module of the fourth preferred embodiment of the present invention from different perspectives. Figure 14A and Figure 14B for Figure 13A The diagram shows the exploded structure of the power conversion module from different perspectives. The power conversion module 1c in this embodiment and... Figure 1A ,1B The difference in the power conversion module 1 shown is that, in order to reduce the height of the power conversion module 1c, the magnetic component 2 and the circuit board 52 are packaged into a package unit 8. The package unit 8 includes a first surface 88 and a second surface 89 that are opposite each other. The first surface 88 of the package unit 88 is adjacent to the first surface (not shown) of the circuit board 52, and is composed of... Figure 2A The two half-bridge arms formed by the power devices 50a and 50b shown, and the control component 51 are soldered onto the first surface 88 of the package unit 8. The second surface 89 of the package unit 8 can be attached to the lead layer 6, and the aforementioned input positive lead surface, output negative lead surface, signal control lead surface, and feedback signal lead surface can be formed on the second surface 89.

[0035] Figure 15A and Figure 15B These are three-dimensional structural diagrams of the power conversion module of the fifth preferred embodiment of the present invention from different perspectives. Figure 16A and Figure 16B for Figure 15A The diagram shows the exploded structure of the power conversion module from different perspectives. The power conversion module 1d in this embodiment is... Figure 13A The difference in the power conversion module 1c shown is that, in order to further reduce the height of the power conversion module 1d, the power conversion module 1d encapsulates the magnetic component 2, the circuit board 52, the two half-bridge arms composed of power devices 50a and 50b disposed on the first surface 520 of the circuit board 52, and the control component 51 together into a package unit 9. The package unit 9 includes a first surface 90 and a second surface 91 that are opposite to each other. The first surface 90 of the package unit 9 is adjacent to the first surface of the circuit board 52 (not shown), and since the first surface 90 of the package unit 9 does not have any electronic components, it is beneficial for the installation of a heat sink (not shown). The second surface 91 of the package unit 9 can be attached to the pin layer 6, and the aforementioned input positive terminal pin surface, output negative terminal pin surface, signal control pin surface, and feedback signal pin surface can be formed on the second surface 91.

[0036] Figure 17A and Figure 17B These are three-dimensional and perspective structural diagrams of the power conversion module of the sixth preferred embodiment of the present invention from different viewpoints. The power conversion module 1e of this embodiment and... Figure 15AThe difference in the power conversion module 1d shown is that, in order to further reduce the height of the power conversion module 1e, the power conversion module 1e encapsulates the magnetic component 2, the circuit board 52 and the pin layer 6 together into a package unit 9a. The package unit 9a includes a first surface 9b and a second surface 9c that are opposite to each other. The first surface 9b of the package unit 9a is adjacent to the first surface of the circuit board 52 (not shown), and since the first surface 9b of the package unit 9b does not have any electronic components, it is beneficial for the installation of a heat sink (not shown).

[0037] In some embodiments, the two half-bridge arms formed by power devices 50a and 50b and the control component 51, which are disposed on the first surface 520 of the circuit board 52, may also be disposed within the packaging unit 9a, and the top surface of each half-bridge arm (or power device 50a, 50b) is lower than the first surface 9b of the packaging unit 9a. Of course, in other embodiments, the two half-bridge arms formed by power devices 50a and 50b and the control component 51 may also be disposed on the first surface 9b of the packaging unit 9a.

[0038] In summary, the present invention provides a power conversion module and its magnetic component. Since the two opposite openings of the first winding channel of the magnetic core assembly are exposed to the first and fourth sidewalls respectively, and the two opposite openings of the second winding channel are exposed to the second and third sidewalls respectively, in other words, the two opposite openings of the first and second winding channels are exposed to the four different sidewalls of the magnetic core assembly. This allows the two coupled inductors formed by the two windings disposed in the first and second winding channels to be distributed relatively symmetrically in their structural layout. Therefore, the distance between the output terminals of the two coupled inductors and the output terminals of the power conversion module can be approximately equal. This significantly reduces the asymmetry of the equivalent DC series resistance of the two coupled inductors, making the currents of the two coupled inductors approximately equal. This avoids the increase in DC flux of the side posts of the magnetic core assembly, reducing the flux saturation phenomenon of the side posts, thereby improving the performance of the power conversion module.

[0039] This invention may be modified in various ways by those skilled in the art, but all such modifications shall not depart from the protection sought by the appended claims.

Claims

1. A power module, comprising: A power device layer includes at least one power device and a first circuit board; as well as A passive device layer includes a second circuit board and a magnetic component, wherein the magnetic component is attached to a lower surface of a first circuit board and a lower surface of the second circuit board, and the magnetic component includes a winding electrically connected to the at least one power device, wherein a conductor of the passive device layer is disposed between the lower surface of the first circuit board and the lower surface of the second circuit board to provide an electrical connection between the second circuit board and the first circuit board.

2. The power module of claim 1, wherein each of the power devices comprises a half-bridge arm, the half-bridge arm comprising two switches.

3. The power module of claim 1, wherein the at least one power device comprises two of the power devices.

4. The power module of claim 1, wherein the power module includes at least one input capacitor disposed between the at least one power device and the magnetic component.

5. The power module of claim 4, wherein the projection of the input capacitor on a horizontal plane overlaps with the projection of the magnetic component on the horizontal plane.

6. The power module of claim 1, wherein the passive device layer comprises a first surface and a second surface opposite to each other, and the conductor is embedded between the first surface and the second surface of the passive device layer.

7. The power module of claim 1, wherein the magnetic component is embedded in the passive device layer.

8. The power module of claim 1, wherein the at least one power device is embedded in the first circuit board.

9. The power module of claim 1, wherein the at least one power device is disposed on an upper surface of the first circuit board.

10. The power module of claim 1, wherein the power device layer includes a control component.

11. The power module of claim 1, wherein no other electronic devices are disposed on one upper surface of the first circuit board.

12. The power module of claim 1, wherein the lower surface of the first circuit board and an upper surface of the second circuit board are respectively provided with a plurality of electrical connection structures, and a portion of the electrical connection structures on the lower surface of the first circuit board corresponds to a portion of the electrical connection structures on the upper surface of the second circuit board.

13. The power module of claim 1, wherein the power module includes at least one power device contact terminal, at least one positive input contact terminal, and at least one negative output contact terminal, the at least one power device contact terminal, the at least one positive input contact terminal, and the at least one negative output contact terminal are disposed on the lower surface of the first circuit board, wherein the at least one power device contact terminal is electrically connected to a power device pin of the at least one power device, the at least one positive input contact terminal serves as at least one positive input terminal of the power module, and the at least one negative output contact terminal serves as at least one negative output terminal of the power module.

14. The power module of claim 1, wherein the power module includes a pin layer adjacent to the lower surface of the second circuit board.

15. The power module of claim 14, wherein the pin layer includes a first surface and a second surface disposed opposite to each other, the pin layer includes at least one positive input pin, at least one positive output pin and at least one negative output pin, the at least one positive input pin, the at least one positive output pin and the at least one negative output pin are disposed on the first surface of the pin layer, wherein the at least one positive input pin, the at least one positive output pin and the at least one negative output pin are electrically connected to corresponding external pins to electrically connect the power module to an external circuit.

16. The power module of claim 14, wherein the power module includes at least one output capacitor disposed between the pin layer and the magnetic component.

17. The power module of claim 14, wherein the magnetic component, the first circuit board and the pin layer are disposed in a packaging unit.

18. The power module of claim 1, wherein the magnetic component and the first circuit board are disposed in a package unit.

19. The power module of claim 18, wherein the first circuit board and the second circuit board are integrated into a single circuit board.

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