Integrated heat dissipation and load bearing structure for dual-band phased array antenna

Abstract

This disclosure provides an integrated heat dissipation and support structure for a dual-band phased array antenna, comprising: a π-shaped frame consisting of a first cold plate (7), a second cold plate (8), and a third cold plate (9), wherein the second cold plate (8) and the third cold plate (9) are parallel and perpendicularly fixed to the back of the first cold plate (7); the front of the first cold plate (7) is used to install an L-band T / R assembly (1); a heat dissipation channel is formed between the second cold plate (8) and the third cold plate (9) for installing an X-band T / R assembly (10); the side of the second cold plate (8) facing away from the third cold plate (9) is used to install an integrated electronic module; the side of the third cold plate (9) facing away from the second cold plate (8) is used to install a subarray power module (6); the first cold plate (7), the second cold plate (8), and the third cold plate (9) are all provided with liquid cooling channels to provide heat dissipation for the corresponding installed components or modules.

Description

Technical Field

[0001] This disclosure relates to the field of radar equipment technology, and more specifically, to an integrated heat dissipation and support structure for a dual-band phased array antenna. Background Technology

[0002] Traditional single-band phased array radars face challenges in complex scenarios, including limited scanning range and the difficulty of simultaneously achieving long-range detection and high-resolution imaging with a single frequency band. To address these issues, dual-band phased array radars incorporating mechanical rotation have emerged, enabling multi-functionality through coordinated high and low-frequency operation.

[0003] However, in airborne platforms where space, weight, and power consumption are limited, the thermal management of this system faces severe challenges: First, dual-band integration significantly increases the number of T / R components and total power consumption, with higher heat flux density in high-frequency components and uneven heat distribution on the array surface, requiring differentiated cooling for different zones; Second, the airborne environment requires the cooling system to be extremely compact and lightweight while also withstanding mechanical loads and achieving efficient heat dissipation.

[0004] Therefore, how to achieve a synergistic design of efficient cooling and lightweight load-bearing under high heat flux density, non-uniform heat distribution and stringent airborne constraints has become a key technical problem that urgently needs to be solved. Summary of the Invention

[0005] In view of this, the present disclosure provides an integrated heat dissipation and load-bearing structure for a dual-band phased array antenna.

[0006] The first aspect of this disclosure provides an integrated heat dissipation and support structure for a dual-band phased array antenna, comprising: a π-shaped frame composed of a first cold plate, a second cold plate, and a third cold plate, wherein the second and third cold plates are parallel to each other and vertically fixed to the back of the first cold plate; the front of the first cold plate is used to mount the L-band T / R component of the dual-band phased array antenna; a heat dissipation channel is formed between the second and third cold plates for mounting the X-band T / R component of the dual-band phased array antenna; the side of the second cold plate opposite to the third cold plate is used to mount the integrated electronic module of the dual-band phased array antenna; the side of the third cold plate opposite to the second cold plate is used to mount the subarray power supply module of the dual-band phased array antenna; each of the first, second, and third cold plates has an independent liquid cooling channel inside, which is connected in parallel to form a cooling flow path system to provide differentiated heat dissipation for the corresponding mounted components or modules.

[0007] According to an embodiment of this disclosure, the two ends of the π-shaped frame are configured to be connected to the rotation drive mechanism of the dual-band phased array antenna to serve as the main load-bearing structure of the phased array antenna.

[0008] According to an embodiment of this disclosure, the cooling flow path system is configured such that the flow rate through the first cold plate accounts for 15%-25% of the total flow rate, the flow rate through the second cold plate and the third cold plate each accounts for 30%-40% of the total flow rate, and an independent integrated electronic cold plate is configured within the integrated electronic module, with the flow rate through the integrated electronic cold plate accounting for 5%-15% of the total flow rate.

[0009] According to embodiments of this disclosure, the liquid cooling channel inside the first cold plate includes a bend design for increasing flow resistance; the cross-sectional area of ​​the liquid cooling channel inside the second and third cold plates is larger than that of the channel in the first cold plate, and turbulent fins are provided inside the channel to enhance heat transfer and structural strength.

[0010] According to an embodiment of this disclosure, the X-band T / R assembly is mounted between the opposing surfaces of the second and third cold plates via heat-conducting rails on both sides, forming a double-sided cooling structure based on the second and third cold plates.

[0011] According to an embodiment of this disclosure, the integrated electronic cold plate has a serpentine flow channel and is fitted between the X-band radio frequency integrated module and the digital integrated module in the integrated electronic module.

[0012] According to embodiments of this disclosure, the cooling flow path system further includes a liquid-cooled transfer plate configured to distribute coolant from the main inlet to the first cold plate, the second cold plate, and the third cold plate, and to merge the coolant flowing out of each cold plate to the main outlet.

[0013] According to embodiments of this disclosure, the L-band T / R component, the X-band T / R component, the integrated electronic module, and the subarray power module are arranged on the π-shaped frame with weight balancing, so that the center of mass of the integrated heat dissipation and load-bearing system is located on its rotation axis.

[0014] According to embodiments of this disclosure, thermally conductive interface material is filled between the L-band T / R assembly and the front surface of the first cold plate, between the X-band T / R assembly and the contact surfaces of the second and third cold plates, between the integrated electronic module and the corresponding surface of the second cold plate, and between the subarray power module and the corresponding surface of the third cold plate.

[0015] According to the embodiments of this disclosure, because the π-shaped cold plate skeleton structure and the differentiated parallel cooling flow path are designed in a coordinated manner, the technical problem of high heat flux density heat dissipation and lightweight load-bearing of dual-band phased array radar in airborne environment is at least partially overcome. Thus, the technical effect of achieving efficient partitioned heat dissipation, reducing system rotation torque and improving structural reliability under strict space and weight constraints is achieved. Attached Figure Description

[0016] The above and other objects, features and advantages of this disclosure will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0017] Figure 1A A schematic front plan view of an integrated heat dissipation and support structure for a dual-band phased array antenna according to an embodiment of the present disclosure is shown.

[0018] Figure 1B A schematic three-dimensional front view of an integrated heat dissipation and load-bearing structure according to an embodiment of the present disclosure is shown;

[0019] Figure 2A A schematic rear plan view of an integrated heat dissipation and load-bearing structure according to an embodiment of the present disclosure is shown;

[0020] Figure 2B A schematic three-dimensional rear view of the integrated heat dissipation and load-bearing structure according to an embodiment of the present disclosure is shown;

[0021] Figure 3A A schematic rear plan view of a π-shaped skeleton according to an embodiment of the present disclosure is shown;

[0022] Figure 3B A schematic three-dimensional rear view of a π-shaped skeleton according to an embodiment of the present disclosure is shown;

[0023] Figure 4A A schematic front view of a first cold plate according to an embodiment of the present disclosure is shown;

[0024] Figure 4B A schematic rear view of a first cold plate according to an embodiment of the present disclosure is shown;

[0025] Figure 5A A schematic front view of the second and third cold plates according to embodiments of the present disclosure is shown;

[0026] Figure 5B A schematic front cross-sectional view of the second and third cold plates according to embodiments of the present disclosure is shown.

[0027] Figure 5C The illustration schematically shows heat-conducting rails disposed on opposite sides of the second and third cold plates according to an embodiment of the present disclosure;

[0028] Figure 6A A schematic front plan view of an integrated electronic module according to an embodiment of the present disclosure is shown;

[0029] Figure 6B A schematic three-dimensional view of an integrated electronic module according to an embodiment of the present disclosure is shown;

[0030] Figure 7A A top plan view of an integrated electronic module cold plate according to an embodiment of the present disclosure is schematically shown;

[0031] Figure 7B A schematic top cross-sectional view of the integrated electronic module cold plate according to an embodiment of the present disclosure is shown;

[0032] Figure 8 A schematic diagram of a liquid cooling flow path system according to an embodiment of the present disclosure is shown.

[0034] Explanation of reference numerals in the attached figures:

[0035] 1-L-band T / R module; 2-Slip ring device; 3-Pressure relief device; 4-Liquid cooling main outlet; 5-Liquid cooling main inlet; 6-Subarray power module; 7-First cold plate; 8-Second cold plate; 9-Third cold plate; 10- X-band T / R assembly; 11-Liquid cooling branch; 12-Another liquid cooling branch; 111-Liquid cooling branch inlet / outlet; 112-Liquid cooling branch inlet; 113-Liquid cooling branch outlet; 121-Another liquid cooling branch inlet / outlet; 122-Another liquid cooling branch inlet; 123-Another liquid cooling branch outlet; 13-Liquid cooling channel; 14-Turbulent flow fins; 15-Heat-conducting rail; 131-Liquid cooling channel inlet; 132-Liquid cooling channel outlet; 16-L-band RF integrated module; 17-X-band RF integrated module; 18-Integrated electronic cold plate; 19-Digital integrated module; 20-Integrated electronic cold plate water-cooled connector; 21-Serpentine flow channel; 211-Integrated electronic cold plate liquid cooling channel inlet; 212-Integrated electronic cold plate liquid cooling channel outlet; 22-Integrated electronic cold plate turbulent flow fins. Detailed Implementation

[0036] The embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the present disclosure for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0037] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0038] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0039] When using expressions such as "at least one of A, B and C", they should generally be interpreted in accordance with the meaning that is commonly understood by those skilled in the art (e.g., "a system having at least one of A, B and C" should include, but is not limited to, a system having A alone, a system having B alone, a system having C alone, a system having A and B, a system having A and C, a system having B and C, and / or a system having A, B and C, etc.).

[0040] This disclosure provides an integrated heat dissipation and load-bearing structure for a dual-band phased array antenna. The main heat-generating components and modules of the dual-band phased array antenna include an L-band T / R module 1, an X-band T / R module 10, a subarray power supply module 6, and a comprehensive electronic module. Generally, in a dual-band phased array, the module with the highest heat dissipation power is the X-band T / R module 10, which has the highest heat dissipation priority, followed by the L-band T / R module 1, then the subarray power supply module 6 and the comprehensive electronic module.

[0041] In this embodiment, the core of the integrated heat dissipation and load-bearing structure is a π-shaped skeleton composed of a first cold plate 7, a second cold plate 8, and a third cold plate 9.

[0042] like Figure 3A and Figure 3B As shown, the second cold plate 8 and the third cold plate 9 are parallel to each other and are vertically fixed to the back of the first cold plate 7. The π-shaped frame efficiently and physically isolates the internal space of the dual-band phased array antenna into four functional areas.

[0043] Firstly, such as Figure 1A and Figure 1B As shown, the front of the first cold plate 7 is used to mount the L-band T / R assembly 1 of the dual-band phased array antenna. This area can also be used to mount the X-band radiating array (not shown in the figure since it does not affect the heat dissipation design) and the L-band radiating array. This area is in close contact with the first cold plate 7 to ensure that the heat generated by the L-band T / R assembly 1 can be transferred to the cold plate through the shortest thermal path.

[0044] Secondly, such as Figure 2A and 2BAs shown, a heat dissipation channel is formed between the second cold plate 8 and the third cold plate 9 for mounting the X-band T / R assembly 10 of the dual-band phased array antenna. Due to its high operating frequency and dense integration, the X-band assembly has significantly higher heat dissipation per unit area than other modules, making its heat dissipation requirements the most urgent. This area is "sandwiched" between the second cold plate 8 and the third cold plate 9, forming a double-sided high-efficiency cooling channel to maximize its heat dissipation capacity.

[0045] Thirdly, such as Figure 2A and 2B As shown, the side of the second cold plate 8 facing away from the third cold plate 9 is used to install the integrated electronic module of the dual-band phased array antenna, as well as the power divider, feed network, etc. The second cold plate 8 mainly serves a supporting function and is specifically designed as a heat dissipation cold plate for the integrated electronic module.

[0046] Fourth, such as Figure 2A and 2B As shown, the side of the third cold plate 9 facing away from the second cold plate 8 is used to mount the subarray power module 6 of the dual-band phased array antenna. The power module typically has a high total heat dissipation but a relatively low density, and is cooled by the third cold plate 9.

[0047] The first cold plate 7, the second cold plate 8, and the third cold plate 9 each have independent liquid cooling channels inside, which are connected in parallel to form a cooling flow path system to provide differentiated heat dissipation for the corresponding installed components or modules.

[0048] like Figure 1A and Figure 1B The two ends of the π-shaped frame are configured to connect to the rotation drive mechanism of the dual-band phased array antenna, serving as the main load-bearing structure of the phased array antenna. Specifically, the two ends of the π-shaped cold plate frame are rigidly connected directly to the rotation drive mechanism of the radar array via high-strength, low-thermal-resistance mechanical interfaces. The rotation drive mechanism can be as follows: Figure 1B The slide ring device 2, bearing housing, drive motor mounting base, etc., are shown. The frame itself bears the main mechanical loads (such as gravity, inertial force, vibration and shock) from the radar array (including all installed component modules) and transmits them to the rotating mechanism. This design eliminates the need for an additional structural support frame, significantly reducing the system weight.

[0049] In this embodiment, the weight balancing calculation and control of each functional area on the π-shaped frame are strictly performed during the partitioned layout design. By precisely arranging the positions of each module, selecting lightweight materials, and optimizing the thickness of the cold plate / reinforcing rib layout, the torque deviation of the mass of the four areas relative to the axis is controlled within ±10%. This symmetrical and balanced weight distribution ensures that the center of mass of the entire phased array antenna is stably located on or near the rotation axis. That is, the weight balancing of the L-band T / R component 1, X-band T / R component 10, integrated electronic module, and the module layout on the π-shaped frame ensures that the center of mass of the integrated heat dissipation and load-bearing structure is located on its rotation axis. Its core advantages are: significantly reducing the starting torque and holding torque required for rotation drive, reducing the power requirements of the drive motor, improving the dynamic response performance of the system, reducing vibration and unbalanced stress during rotation, and improving the reliability of the system in complex airborne mechanical environments.

[0050] In this embodiment of the disclosure, in order to accurately address the problems of large differences in heat dissipation between the two frequency bands (X band >> L band) and uneven distribution of regional heat flow, this embodiment of the disclosure adopts a multi-branch parallel design to control the flow of different functional areas and meet the heat dissipation requirements of different functional areas.

[0051] like Figure 4A and Figure 4B As shown in this embodiment, the first cold plate 7 has two branch channels, wherein the liquid cooling branch 11 and liquid cooling branch 12 are symmetrically designed. The coolant from these two branches flows in parallel across the surface of the first cold plate 7 to dissipate heat from the L-band T / R assembly 1. The L-band T / R assembly 1 has relatively low heat consumption, but it covers a relatively wide area. The cooling channels within the first cold plate 7 are designed with bends to increase flow resistance, thereby increasing the flow area and ensuring uniform heat dissipation. The bends also increase the flow resistance of the fluid in the channel, reducing the percentage of flow into the first cold plate 7 and reserving more flow for high heat dissipation areas. The flow through the first cold plate 7 accounts for 15%-25% of the total flow; in this embodiment, the flow through the cold plate accounts for approximately 20% of the total flow.

[0052] like Figure 4B As shown in this embodiment, liquid cooling branch 11 and liquid cooling branch 12 are provided with their liquid cooling branch inlet / outlet 111 (including inlet 112 and outlet 113) and liquid cooling inlet / outlet 121 (including inlet 122 and outlet 123) on the same side, so as to unify the management interface and improve the system integration.

[0053] like Figure 5A , Figure 5B and Figure 5CAs shown in this embodiment, both the second cold plate 8 and the third cold plate 9 contain four liquid-cooled channels 13. Although there are four liquid-cooled channel outlets 132 and four inlets 131, the inlets and outlets on the side furthest from the main fluid inlet are sealed with covers to facilitate fluid exchange. The coolant in this branch primarily cools the X-band T / R module 10, while also assisting in heat dissipation for the integrated electronic module. The X-band T / R module 10 is positioned between the opposing surfaces of the second cold plate 8 and the third cold plate 9 via thermally conductive rails 15 on both sides, dissipating heat based on the double-sided cooling structure formed by the second cold plate 8 and the third cold plate 9. The integrated electronic module exchanges heat through contact with the second cold plate 8 on its surface. The sub-array power module 6 exchanges heat through its contact surface with the third cold plate 9. The second cold plate 8 and the third cold plate 9 have high heat dissipation pressure, requiring sufficient channel cross-sectional area and minimizing bends in the design to reduce flow resistance. Furthermore, the cross-sectional area of ​​the liquid cooling channels inside the second cold plate 8 and the third cold plate 9 is larger than that of the channel in the first cold plate 7, and turbulent fins 14 are provided inside these channels to enhance heat transfer and structural strength, thereby increasing the heat transfer intensity between the fluid and the cold plate structure, and simultaneously increasing structural strength. The flow rate through the second cold plate 8 and the third cold plate 9 each accounts for 30%-40% of the total flow rate. In this embodiment of the present disclosure, the flow rate through the second cold plate 8 and the third cold plate 9 accounts for approximately 35% of the total flow rate.

[0054] like Figure 6A and Figure 6B As shown, an independent integrated electronic cooling plate 18 is configured within the integrated electronic module. The integrated electronic cooling plate 18 is located within the integrated electronic module, which consists of an L-band RF integrated module 16, an X-band RF integrated module 17, and a digital integrated module 19. Specifically, the integrated electronic cooling plate 18 is located between the X-band RF integrated module 17 and the digital integrated module 19, completely fitting these two modules to increase the heat dissipation area.

[0055] like Figure 7A and Figure 7B As shown, the cold plate contains a flow channel, employing a serpentine flow channel 21 design, and is fitted between the X-band RF integrated module 17 and the digital integrated module 19 in the integrated electronic module. The flow channel area covers the entire heat dissipation surface as much as possible, and includes integrated electronic cold plate turbulence fins 22 in the middle to increase heat exchange efficiency. The integrated electronic cold plate 18 is supplied with liquid cooling pipes, and the flow rate can be controlled by the pipe diameter. The flow rate through the integrated electronic cold plate 18 accounts for 5%-15% of the total flow rate. In this embodiment of the present disclosure, the flow rate through the cold plate accounts for approximately 10% of the total flow rate.

[0056] In this embodiment, the cooling flow path system further includes a liquid-cooled transfer plate, configured to distribute coolant from the main inlet to the first cold plate 7, the second cold plate 8, and the third cold plate 9, and to collect the coolant flowing out of each cold plate to the main outlet. Specifically, the liquid-cooled transfer plate integrates distribution channels and collection channels. The transfer plate is provided with inlet and outlet ports corresponding to the first, second, and third cold plates, respectively. The liquid-cooled branches of each cold plate are quickly connected to the transfer plate via standard hydraulic connectors. After entering the transfer plate through the main inlet, the coolant is distributed to each cold plate through its internal distribution channels. After heat exchange, the coolant flowing out of each cold plate is collected through the collection channels within the transfer plate and then discharged uniformly through the main outlet to enter the external cooling unit for heat dissipation. Optionally, the liquid-cooled transfer plate does not actively adjust the flow rate of each branch; its flow rate is automatically adjusted by the flow resistance of each cold plate branch. After the coolant is collected, it flows out uniformly to enter the external cooling unit for heat dissipation. Depending on actual needs, a flow control unit can also be set up to adjust the flow resistance of each cold plate branch.

[0057] like Figure 1B As shown, the cooling flow path system is equipped with a liquid cooling main outlet 4 and a liquid cooling main inlet 5. The liquid cooling main inlet 5 is connected to the inlet of the liquid cooling channel of each cold plate, and the liquid cooling main outlet 4 is connected to the outlet of the liquid cooling channel of each cold plate. The cooling flow path system is also equipped with a pressure relief device 3, which is connected to the liquid cooling channel in each cold plate to release excessive pressure in the channel to ensure equipment safety.

[0058] Figure 8 A schematic diagram of a liquid cooling flow path system according to an embodiment of the present disclosure is shown.

[0059] like Figure 8 As shown in the figure, this diagram further illustrates the flow channel orientation and parallel relationship within the first cold plate 7, the second cold plate 8, the third cold plate 9, and the integrated electronic cold plate 18. Combined with... Figure 1B The arrangement of the liquid cooling main outlet 4 and liquid cooling main inlet 5 clearly shows that the liquid cooling main inlet 5 connects to the liquid cooling channel inlets of each cold plate, and the liquid cooling main outlet 4 connects to the liquid cooling channel outlets of each cold plate, forming a complete parallel cooling loop. Each cold plate has a differentiated internal flow channel structure designed according to the heat dissipation requirements of its area. The liquid cooling branch 11 of the first cold plate 7 adopts a curved design to increase flow resistance and temperature uniformity. The liquid cooling channels 13 of the second cold plate 8 and the third cold plate 9 adopt large-section straight channels and are equipped with turbulent fins 14 to enhance heat transfer. The integrated electronic cold plate 18 uses a serpentine flow channel 21 to cover key heat-generating modules. These multiple parallel cooling loops together achieve precise thermal management of the dual-band phased array antenna.

[0060] High-performance thermally conductive interface material is filled between the front surface of the L-band T / R component 1 and the first cold plate 7, between the contact surfaces of the X-band T / R component 10 and the second and third cold plates 8 and 9, between the integrated electronic module and the corresponding surface of the second cold plate 8, and between the sub-array power module 6 and the corresponding surface of the third cold plate 9 to improve heat dissipation efficiency.

[0061] For example, high-performance thermal grease or ultra-thin flexible thermal pads are used to fill the space between all heating modules (especially X and L band T / R components 1) and the corresponding cold plate surface to minimize contact thermal resistance.

[0062] In a specific embodiment of this disclosure, the heat dissipation performance of a dual-band phased array antenna with a total heat dissipation of 6kW was verified. The test conditions were: coolant inlet temperature 55℃ and total system flow rate 5L / min. The measured results showed that the highest overall antenna temperature, located at the X-band T / R component with the most stringent heat dissipation requirements, was only 85℃, and the temperature difference between the various X-band T / R components was controlled within 7℃. This fully verifies the efficient double-sided cooling capability of the π-shaped frame structure of this disclosure for high heat flux density areas and the temperature uniformity of the multi-branch parallel design. It should be noted that the cooling flow path system of this disclosure has a wide flow rate adaptability, supporting a flow rate input range of 5L / min to 15L / min, and can be flexibly adjusted according to actual heat dissipation changes to ensure the cooling efficiency and reliability of the system under different operating conditions.

[0063] The π-shaped frame, combined with two parallel cooling paths, effectively blocks the radiative heat transfer and heat conduction path from the high heat density area (the area where the X-band T / R component 10 is located) to the low heat density area (such as the area where the integrated electronic module is located), preventing heat from accumulating inside and interfering with each other.

[0064] The π-shaped frame highly integrates three major functions: heat dissipation, support, and partitioning. It eliminates redundant structures, significantly reduces system weight, and perfectly meets the extreme space and weight requirements of airborne platforms.

[0065] In this embodiment, the cold plate itself is made of high-strength aluminum alloy, and through reasonable thickness design and internal reinforcing ribs (optimized in conjunction with the flow channel layout), it provides structural stiffness and strength that meet the mechanical requirements of the airborne environment (vibration, shock, overload) while ensuring efficient heat dissipation. The connection point between the cold plate and the rotating mechanism is locally reinforced.

[0066] According to the integrated heat dissipation and load-bearing structure provided in this disclosure, a high degree of integration of heat dissipation, support, and zoning functions is achieved for the first time in a dual-band phased array antenna through a π-shaped frame structure. This structure, through the vertical arrangement of the first, second, and third cold plates, not only directly supports the various functional modules of the antenna as the main load-bearing frame and transfers the load to the rotation drive mechanism, but also utilizes its zoning design to place the high-heat-dissipation X-band T / R components in double-sided cooling channels, while arranging the lower-heat-dissipation L-band T / R components, integrated electronic modules, and power modules on the surfaces of each cold plate, achieving precise zoning management of heat sources. Furthermore, the parallel liquid cooling channels integrated within the π-shaped frame can distribute cooling flow according to the differences in heat dissipation in each area, thus addressing the differentiated heat dissipation needs of components in different frequency bands within the same structure. In addition, by balancing the weight of each functional area, the center of gravity of the entire antenna system is stably located on the rotation axis, effectively reducing the starting torque required for rotation drive, reducing rotation drive power requirements, and improving the dynamic response performance and reliability of the system in airborne environments. This π-shaped integrated skeleton design achieves the simultaneous attainment of three major goals: weight reduction, integration, and low inertia. This technical approach, which integrates and optimizes thermal control, structure, and dynamic performance, brings about a comprehensive performance improvement that is unpredictable and unattainable by U-shaped structures with single heat dissipation and conventional modular layouts.

[0067] The embodiments of this disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this disclosure, and all such substitutions and modifications should fall within the scope of this disclosure.

Claims

1. An integrated heat dissipation and load-bearing structure for a dual-band phased array antenna, characterized in that, include: A π-shaped frame is formed by a first cold plate (7), a second cold plate (8) and a third cold plate (9). The second cold plate (8) and the third cold plate (9) are parallel to each other and are fixed vertically to the back of the first cold plate (7). The front side of the first cold plate (7) is used to mount the L-band T / R assembly (1) of the dual-band phased array antenna. A heat dissipation channel is formed between the second cold plate (8) and the third cold plate (9) for mounting the X-band T / R assembly (10) of the dual-band phased array antenna; The side of the second cold plate (8) facing away from the third cold plate (9) is used to install the integrated electronic module of the dual-band phased array antenna; The side of the third cold plate (9) facing away from the second cold plate (8) is used to install the subarray power supply module (6) of the dual-band phased array antenna. The first cold plate (7), the second cold plate (8) and the third cold plate (9) are each provided with independent liquid cooling channels, and are connected in parallel to form a cooling flow path system to provide differentiated heat dissipation for the corresponding installed components or modules.

2. The structure according to claim 1, characterized in that, The two ends of the π-shaped frame are configured to be connected to the rotation drive mechanism of the dual-band phased array antenna to serve as the main load-bearing structure of the phased array antenna.

3. The structure according to claim 1, characterized in that, The cooling flow path system is configured as follows: The flow rate through the first cold plate (7) accounts for 15%-25% of the total flow rate. The flow rates through the second cold plate (8) and the third cold plate (9) each account for 30%-40% of the total flow rate. The integrated electronic module is equipped with an independent integrated electronic cold plate (18), and the flow rate through the integrated electronic cold plate (18) accounts for 5%-15% of the total flow rate.

4. The structure according to claim 3, characterized in that, The liquid cooling channel inside the first cold plate (7) includes a bend design to increase flow resistance; the cross-sectional area of ​​the liquid cooling channel inside the second cold plate (8) and the third cold plate (9) is larger than that of the channel of the first cold plate (7), and turbulent fins (14) are provided in the channel to enhance heat exchange and structural strength.

5. The structure according to claim 1, characterized in that, The X-band T / R component (10) is mounted between the opposing surfaces of the second cold plate (8) and the third cold plate (9) via heat-conducting rails (15) on both sides, forming a double-sided cooling structure based on the second cold plate (8) and the third cold plate (9).

6. The structure according to claim 3, characterized in that, The integrated electronic cold plate (18) has a serpentine flow channel (21) and is fitted between the X-band radio frequency integrated module (17) and the digital integrated module (19) in the integrated electronic module.

7. The structure according to claim 1, characterized in that, The cooling flow path system also includes a liquid cooling adapter plate, which is configured to distribute coolant from the main inlet to the first cold plate (7), the second cold plate (8) and the third cold plate (9), and to merge the coolant flowing out from each cold plate to the main outlet.

8. The structure according to claim 1, characterized in that, The L-band T / R component (1), the X-band T / R component (10), the integrated electronic module and the subarray power module (6) are arranged on the π-shaped frame with weight balancing so that the center of mass of the integrated heat dissipation and load-bearing system is located on its rotation axis.

9. The structure according to claim 1, characterized in that, Thermally conductive interface material is filled between the front surface of the L-band T / R assembly (1) and the first cold plate (7), between the contact surfaces of the X-band T / R assembly (10) and the second cold plate (8) and the third cold plate (9), between the integrated electronic module and the corresponding surface of the second cold plate (8), and between the sub-array power module (6) and the corresponding surface of the third cold plate (9).

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