Steerable directional antenna module

Abstract

This invention provides a modulated directional antenna module. The modulated directional antenna module includes a first carrier substrate, a second carrier substrate, a signal control chip, a shared conductive structure, and multiple antenna structures. The first and second carrier substrates can cooperate with each other so that they are arranged in an intersecting manner. The signal control chip is disposed on the first carrier substrate. The shared conductive structure is disposed on the first carrier substrate. Each antenna structure is disposed on either the first or second carrier substrate. The multiple antenna structures are electrically connected between the shared conductive structure and the signal control chip. Therefore, when the signal control chip is configured to control whether a voltage passes through at least one of the multiple antenna structures, the radiation pattern generated by the modulated directional antenna module can be adjusted according to the orientation or location of the user's portable electronic device.

Description

Technical Field

[0001] This invention relates to an antenna module, and more particularly to a modulated directional antenna module. Background Technology

[0002] In existing technologies, dipole antennas capable of generating an omnidirectional radiation field pattern allow users to perform point-to-point signal reception and transmission from different directions or locations. However, there is still room for improvement in dipole antennas capable of generating an omnidirectional radiation field pattern. Summary of the Invention

[0003] The problem that this invention aims to improve or solve is to provide a modulated directional antenna module that addresses the shortcomings of the prior art.

[0004] To improve or solve the above-mentioned problems, one technical means adopted by the present invention is to provide a modulated directional antenna module, which includes: a first carrier substrate, a second carrier substrate, a signal control chip, a shared conductive structure, a first antenna structure, a second antenna structure, a third antenna structure, a fourth antenna structure, and a signal feed structure. The first carrier substrate has a first mating portion. The second carrier substrate has a second mating portion corresponding to the first mating portion. The signal control chip is disposed on the first carrier substrate. The shared conductive structure is disposed on the first carrier substrate. The first antenna structure is disposed on the first carrier substrate and electrically connected between the shared conductive structure and the signal control chip. The second antenna structure is disposed on the first carrier substrate and electrically connected between the shared conductive structure and the signal control chip. The third antenna structure is disposed on the second carrier substrate and electrically connected between the shared conductive structure and the signal control chip. The fourth antenna structure is disposed on the second carrier substrate and electrically connected between the shared conductive structure and the signal control chip. The signal feed structure is disposed on the first carrier substrate and electrically connected to the shared conductive structure. When the first mating portion of the first carrier substrate and the second mating portion of the second carrier substrate mate with each other, the first carrier substrate and the second carrier substrate are arranged in a cross-shaped configuration.

[0005] To improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide a modulated directional antenna module, which includes: a first carrier substrate, a second carrier substrate, a signal control chip, a shared conductive structure, a first antenna structure, a second antenna structure, a third antenna structure, a fourth antenna structure, and a signal feed structure. The second carrier substrate cooperates with the first carrier substrate. The signal control chip is disposed on the first carrier substrate. The shared conductive structure is disposed on the first carrier substrate. The first antenna structure is disposed on the first carrier substrate and electrically connected between the shared conductive structure and the signal control chip. The second antenna structure is disposed on the first carrier substrate and electrically connected between the shared conductive structure and the signal control chip. The third antenna structure is disposed on the second carrier substrate and electrically connected between the shared conductive structure and the signal control chip. The fourth antenna structure is disposed on the second carrier substrate and electrically connected between the shared conductive structure and the signal control chip. The signal feed structure is disposed on the first carrier substrate and electrically connected to the shared conductive structure.

[0006] To improve or solve the above-mentioned problems, another technical means adopted by the present invention is to provide a modulated directional antenna module, which includes: a first carrier substrate, a second carrier substrate, a signal control chip, a shared conductive structure, and multiple antenna structures. The second carrier substrate cooperates with the first carrier substrate so that the first carrier substrate and the second carrier substrate are arranged in an intersecting manner. The signal control chip is disposed on the first carrier substrate. The shared conductive structure is disposed on the first carrier substrate. Each antenna structure is disposed on the first carrier substrate or the second carrier substrate, and the multiple antenna structures are electrically connected between the shared conductive structure and the signal control chip. The signal control chip is configured to control whether a voltage passes through at least one of the multiple antenna structures.

[0007] One of the beneficial effects of the present invention is that the modulated directional antenna module provided by the present invention can be configured to control whether voltage passes through at least one of the multiple antenna structures by means of the following technical solutions: "a signal control chip is disposed on a first carrier substrate", "a shared conductive structure is disposed on a first carrier substrate", "each antenna structure is disposed on a first carrier substrate or a second carrier substrate" and "multiple antenna structures are electrically connected between the shared conductive structure and the signal control chip".

[0008] Furthermore, the first carrier substrate has a first mating portion, and the second carrier substrate has a second mating portion corresponding to the first mating portion. Thus, when the first mating portion of the first carrier substrate and the second mating portion of the second carrier substrate mate with each other, the first carrier substrate and the second carrier substrate can be arranged in a mutually intersecting manner.

[0009] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the first antenna component of the modulated directional antenna module provided by the present invention.

[0011] Figure 2 This is a schematic diagram of the second antenna component of the modulated directional antenna module provided by the present invention.

[0012] Figure 3 This is a three-dimensional exploded view of the first viewing angle of the modulated directional antenna module provided by the present invention.

[0013] Figure 4 This is a three-dimensional exploded view of the second viewing angle of the modulated directional antenna module provided by the present invention.

[0014] Figure 5 This is a three-dimensional combined schematic diagram of the first viewing angle of the modulated directional antenna module provided by the present invention.

[0015] Figure 6 This is a three-dimensional combined schematic diagram of the second viewing angle of the modulated directional antenna module provided by the present invention.

[0016] Figure 7 This is a three-dimensional combined schematic diagram of the third viewing angle of the modulated directional antenna module provided by the present invention.

[0017] Figure 8 The functional block diagram shows the modulated directional antenna module provided by the present invention electrically connected to an indicator light module. Detailed Implementation

[0018] The following specific embodiments illustrate the implementation of the "adjustable directional antenna module" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, it should be stated in advance that the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention. Additionally, the term "or" as used herein may, depending on the actual situation, include any combination of any one or more of the associated listed items.

[0019] See Figures 1 to 7 As shown, the present invention provides a modulated directional antenna module M, which may include at least: a first carrier substrate 1, a second carrier substrate 2, a signal control chip 3, a shared conductive structure 4, a first antenna structure 5, a second antenna structure 6, a third antenna structure 7, a fourth antenna structure 8, and a signal feed structure 9. For example, the signal control chip 3, the shared conductive structure 4 (e.g., a shared radiator), the first antenna structure 5 (e.g., a first radiator), the second antenna structure 6 (e.g., a second radiator), and the signal feed structure 9 can all be disposed on the same surface of the first carrier substrate 1 to form a first antenna assembly having a first radio frequency circuit. Furthermore, the third antenna structure 7 (e.g., a third radiator) and the fourth antenna structure 8 (e.g., a fourth radiator) can both be disposed on the same surface of the second carrier substrate 2 to form a second antenna assembly having a second radio frequency circuit. However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0020] Furthermore, in coordination Figures 1 to 4 As shown, the first carrier substrate 1 and the second carrier substrate 2 can be coupled to each other in any way. For example, the first carrier substrate 1 may have a first mating portion 101, and the second carrier substrate 2 may have a second mating portion 201 corresponding to the first mating portion 101. In this way, the coupling... Figures 5 to 7As shown, when the first mating portion 101 of the first carrier substrate 1 and the second mating portion 201 of the second carrier substrate 2 are mated together, the first carrier substrate 1 and the second carrier substrate 2 can be arranged in a cross-shaped configuration. Furthermore, in one feasible embodiment, the first mating portion 101 can be configured as a first slot (or a first recess), and the second mating portion 201 can be configured as a second slot (or a second recess) that mates with the first slot. Additionally, the first carrier substrate 1 can have a first insertion portion 102 (or a first strip-shaped embedding portion) corresponding to the second mating portion 201, and the second carrier substrate 2 can have a second insertion portion 202 (or a second strip-shaped embedding portion) corresponding to the first mating portion 101. Furthermore, the first insertion portion 102 of the first carrier substrate 1 can be accommodated within the second mating portion 201 of the second carrier substrate 2, and the second insertion portion 202 of the second carrier substrate 2 can be accommodated within the first mating portion 101 of the first carrier substrate 1, so that the first carrier substrate 1 and the second carrier substrate 2 can be arranged in a cross-shaped configuration. Thus, mating... Figures 5 to 7 As shown, when the first mating portion 101 of the first carrier substrate 1 and the second mating portion 201 of the second carrier substrate 2 are mated together, the first carrier substrate 1 and the second carrier substrate 2 can be arranged perpendicularly to each other. However, the examples given above are only one possible embodiment and are not intended to limit the present invention.

[0021] Furthermore, in coordination Figures 1 to 4 As shown, the signal control chip 3 can be disposed on the first carrier substrate 1, and the shared conductive structure 4 can also be disposed on the first carrier substrate 1. For example, the signal control chip 3 can be a central processing unit (CPU), digital signal processor (DSP), microprocessor (MPU), microcontroller (MCU), or any type of signal control chip. Furthermore, the shared conductive structure 4 can have a guiding portion 41, a gradually expanding portion 42 connected to the guiding portion 41, and a protruding portion 43 connected to the gradually expanding portion 42. The guiding portion 41 can be located away from the first antenna structure 5 and the second antenna structure 6. The area of ​​the gradually expanding portion 42 can gradually increase from the guiding portion 41 to the protruding portion 43, and the protruding portion 43 can be located between the first antenna structure 5 and the second antenna structure 6. However, the examples given above are merely one possible embodiment and are not intended to limit the present invention.

[0022] Furthermore, in coordination Figures 1 to 4As shown, the first antenna structure 5 can be disposed on the first carrier substrate 1 and electrically connected between the shared conductive structure 4 and the signal control chip 3; the second antenna structure 6 can be disposed on the first carrier substrate 1 and electrically connected between the shared conductive structure 4 and the signal control chip 3; the third antenna structure 7 can be disposed on the second carrier substrate 2 and electrically connected between the shared conductive structure 4 and the signal control chip 3; and the fourth antenna structure 8 can be disposed on the second carrier substrate 2 and electrically connected between the shared conductive structure 4 and the signal control chip 3. For example, the first antenna structure 5 may have a first body portion 51, a first vertical extension portion 52 extending vertically from the first body portion 51, and a first horizontal extension portion 53 extending horizontally from the first body portion 51. Furthermore, the second antenna structure 6 may have a second body portion 61, a second vertical extension portion 62 extending vertically from the second body portion 61, and a second horizontal extension portion 63 extending horizontally from the second body portion 61. Furthermore, the third antenna structure 7 may have a third body portion 71, a third vertical extension portion 72 extending vertically from the third body portion 71, and a third horizontal extension portion 73 extending horizontally from the third body portion 71. Additionally, the fourth antenna structure 8 may have a fourth body portion 81, a fourth vertical extension portion 82 extending vertically from the fourth body portion 81, and a fourth horizontal extension portion 83 extending horizontally from the fourth body portion 81. However, the examples described above are merely one possible embodiment and are not intended to limit the invention.

[0023] It is worth noting, for example, in conjunction with Figure 3 , Figure 4 and Figure 5 As shown, the signal feed structure 9 can be disposed on the first carrier substrate 1 and electrically connected to the shared conductive structure 4. The modulated directional antenna module M can further include a grounding structure G and a signal transmission line C (or a coaxial cable). More specifically, the signal feed structure 9 can be disposed between the shared conductive structure 4, the first antenna structure 5, the second antenna structure 6, and the grounding structure G. Furthermore, the grounding structure G can have a main body G11, a tapered portion G12 connected to the main body G11, and an extension portion G13 connected to the tapered portion G12. The main body G11 can be adjacent to the signal feed structure 9 and located between the first antenna structure 5 and the second antenna structure 6. The area of ​​the tapered portion G12 gradually decreases from the main body G11 to the extension portion G13, and the extension portion G13 can extend away from the signal feed structure 9. Additionally, the signal transmission line C can include a central conductive portion C11 (e.g., a metal lead) electrically connected to the signal feed structure 9 and a peripheral ground portion C12 (e.g., a metal braided mesh) electrically connected to the grounding structure G. However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0024] It is worth noting, for example, in conjunction with Figures 1 to 4 As shown, the first carrier substrate 1 may include a first conductive line layer 11 electrically connected between the first antenna structure 5 and the signal control chip 3, a second conductive line layer 12 electrically connected between the second antenna structure 6 and the signal control chip 3, and a fifth conductive line layer 13 electrically connected between the shared conductive structure 4 and the signal control chip 3. Furthermore, in one feasible embodiment, the first antenna structure 5 may be electrically connected to the signal control chip 3 sequentially via a first inductor component L1 (e.g., a chip inductor), a first diode component D1 (e.g., a diode chip), and a first resistor component R1 (e.g., a chip resistor). The first inductor component L1, the first diode component D1, and the first resistor component R1 may be disposed on and electrically connected to the first conductive line layer 11, and one end of the first inductor component L1 may be disposed on the first antenna structure 5. Furthermore, in one feasible embodiment, the second antenna structure 6 can be electrically connected to the signal control chip 3 sequentially via a second inductor component L2 (e.g., a chip inductor), a second diode component D2 (e.g., a diode chip), and a second resistor component R2 (e.g., a chip resistor). The second inductor component L2, the second diode component D2, and the second resistor component R2 can be disposed on and electrically connected to the second conductive line layer 12, and one end of the second inductor component L2 can be disposed on the second antenna structure 6. Additionally, in one feasible embodiment, the shared conductive structure 4 can be electrically connected to the signal control chip 3 via a fifth inductor component L5 (e.g., a chip inductor). The fifth inductor component L5 can be disposed on and electrically connected to the fifth conductive line layer 13, and one end of the fifth inductor component L5 can be disposed on the shared conductive structure 4. However, the examples described above are merely feasible embodiments and are not intended to limit the invention.

[0025] It is worth noting, for example, in conjunction with Figures 1 to 4As shown, the second carrier substrate 2 may include a third conductive line layer 21 electrically connected between the third antenna structure 7 and the signal control chip 3, and a fourth conductive line layer 22 electrically connected between the fourth antenna structure 8 and the signal control chip 3. Furthermore, in one feasible embodiment, the third antenna structure 7 may be electrically connected to the signal control chip 3 sequentially via a third inductor component L3 (e.g., a chip inductor), a third diode component D3 (e.g., a diode chip), and a third resistor component R3 (e.g., a chip resistor). The third inductor component L3, the third diode component D3, and the third resistor component R3 may be disposed on and electrically connected to the third conductive line layer 21, and one end of the third inductor component L3 may be disposed on the third antenna structure 7. In another feasible embodiment, the fourth antenna structure 8 can be electrically connected to the signal control chip 3 sequentially via a fourth inductor component L4 (e.g., a chip inductor), a fourth diode component D4 (e.g., a diode chip), and a fourth resistor component R4 (e.g., a chip resistor). The fourth inductor component L4, the fourth diode component D4, and the fourth resistor component R4 can be disposed on and electrically connected to the fourth conductive line layer 22, and one end of the fourth inductor component L4 can be disposed on the fourth antenna structure 8. However, the examples given above are merely feasible embodiments and are not intended to limit the present invention.

[0026] It is worth noting, for example, in conjunction with Figures 1 to 4 As shown, the shared conductive structure 4 can be electrically connected to the first antenna structure 5 via a first bridging electronic component E1, to the second antenna structure 6 via a second bridging electronic component E2, to the third antenna structure 7 via a third bridging electronic component E3, to the fourth antenna structure 8 via a fourth bridging electronic component E4, and to the signal feed structure 9 via a fifth bridging electronic component E5. Furthermore, the first bridging electronic component E1, the second bridging electronic component E2, the third bridging electronic component E3, and the fourth bridging electronic component E4 can all be diode components (e.g., diode chips), and the fifth bridging electronic component E5 can be a capacitor component (e.g., a chip capacitor). However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0027] It is worth noting, for example, in conjunction with Figures 1 to 4As shown, the shared conductive structure 4 may have a conductive through-structure 40 penetrating the first carrier substrate 1, and the conductive through-structure 40 may have a first padding area 401 and a second padding area 402 opposite to the first padding area 401. Furthermore, the second carrier substrate 2 may have a first bridging line layer 23 electrically connected to the first padding area 401 and a second bridging line layer 24 electrically connected to the second padding area 402. A third bridging electronic component E3 may be disposed between the third antenna structure 7 and the first bridging line layer 23, and a fourth bridging electronic component E4 may be disposed between the fourth antenna structure 8 and the second bridging line layer 24. Additionally, the first carrier substrate 1 may have a front conductive line layer 14 and a back conductive line layer 15 opposite to the front conductive line layer 14. The third conductive line layer 21 can be electrically connected to the signal control chip 3 through the front conductive line layer 14, and the fourth conductive line layer 22 can be electrically connected to the signal control chip 3 through the back conductive line layer 15. However, the examples given above are merely one possible embodiment and are not intended to limit the invention.

[0028] Furthermore, in coordination Figures 1 to 7As shown, the first antenna structure 5, the shared conductive structure 4, the first conductive line layer 11, and the fifth conductive line layer 13 can cooperate (electrically cooperate) to form a first signal loop electrically connected to the signal control chip 3. Furthermore, the second antenna structure 6, the shared conductive structure 4, the second conductive line layer 12, and the fifth conductive line layer 13 can cooperate (electrically cooperate) to form a second signal loop electrically connected to the signal control chip 3. Additionally, the third antenna structure 7, the shared conductive structure 4, the third conductive line layer 21, and the fifth conductive line layer 13 can cooperate (electrically cooperate) to form a third signal loop electrically connected to the signal control chip 3. Finally, the fourth antenna structure 8, the shared conductive structure 4, the fourth conductive line layer 22, and the fifth conductive line layer 13 can cooperate (electrically cooperate) to form a fourth signal loop electrically connected to the signal control chip 3. Therefore, the signal control chip 3 can be configured to control whether the voltage passes through at least one of the first signal loop, the second signal loop, the third signal loop, and the fourth signal loop (or, the signal control chip 3 can be configured to control whether the voltage passes through at least one of the first antenna structure 5, the second antenna structure 6, the third antenna structure 7, and the fourth antenna structure 8). In one feasible embodiment, when the signal control chip 3 is used with an algorithm to intelligently determine the location of the antenna signal source (or the location of the user using a portable electronic device with wireless transceiver capabilities), the signal control chip 3 can control the voltage to pass through at least one of the first signal loop, the second signal loop, the third signal loop, and the fourth signal loop (i.e., control the current path) based on the location of the antenna signal source (or the location of the user using a portable electronic device with wireless transceiver capabilities). Therefore, the radiation pattern generated by the modulated directional antenna module M can be automatically adjusted, thereby enabling the modulated directional antenna module M and the antenna signal source (or the portable electronic device with wireless transceiver capabilities) to transmit signals more efficiently. In other words, without adjusting the orientation or position of the modulated directional antenna module M, the antenna performance (signal reception and signal transmission performance) of the modulated directional antenna module M can be adaptively or automatically adjusted to the optimal state by controlling whether the voltage is controlled through at least one of the first antenna structure 5, the second antenna structure 6, the third antenna structure 7, and the fourth antenna structure 8. This allows users to receive and transmit signals point-to-point from different orientations or positions using portable electronic devices.

[0029] It is worth noting that, in conjunction with Figures 1 to 7As shown, in one feasible embodiment, the present invention provides a modulated directional antenna module M, which may include at least: a first carrier substrate 1, a second carrier substrate 2, a signal control chip 3, a shared conductive structure 4, and multiple antenna structures (e.g., at least one of a first antenna structure 5, a second antenna structure 6, a third antenna structure 7, and a fourth antenna structure 8). Furthermore, the first carrier substrate 1 and the second carrier substrate 2 can cooperate with each other such that they are arranged in a cross configuration. Additionally, the signal control chip 3 can be disposed on the first carrier substrate 1, and the shared conductive structure 4 can be disposed on the first carrier substrate 1. Furthermore, each antenna structure can be disposed on the first carrier substrate 1 or the second carrier substrate 2, and the multiple antenna structures can be electrically connected between the shared conductive structure 4 and the signal control chip 3. Thus, when the signal control chip 3 is configured to control whether voltage passes through at least one of the multiple antenna structures, the radiation pattern generated by the modulated directional antenna module M can be adjusted according to the orientation or location of the user's portable electronic device. In one feasible embodiment, when the signal control chip 3, in conjunction with an algorithm, intelligently determines the location of the antenna signal source (or the location of the user using a portable electronic device with wireless transceiver capabilities), the signal control chip 3 can control the voltage through one or more specific antenna structures (i.e., control the current path) based on the location of the antenna signal source (or the location of the user using a portable electronic device with wireless transceiver capabilities). Therefore, the radiation pattern generated by the modulated directional antenna module M can be automatically adjusted, thereby enabling more efficient signal transmission between the modulated directional antenna module M and the antenna signal source (or the portable electronic device with wireless transceiver capabilities). In other words, without adjusting the orientation or location of the modulated directional antenna module M, the antenna performance (signal reception and signal transmission performance) of the modulated directional antenna module M can be adaptively or automatically adjusted to its optimal state by "controlling whether the voltage passes through at least one of the multiple antenna structures," thereby allowing the user to perform point-to-point signal reception and transmission through the portable electronic device at different orientations or locations.

[0030] It is worth noting, for example, such as Figure 8 As shown, the modulated directional antenna module M provided by the present invention can be electrically connected to an indicator light module L, which may include multiple LED light sources, via wires, and the signal reception strength or signal transmission strength of the modulated directional antenna module M can be indicated by the indicator light module L to provide a reference for the user.

[0031] Beneficial effects of the embodiments

[0032] One of the beneficial effects of the present invention is that the modulated directional antenna module M provided by the present invention can be configured to control whether the voltage passes through at least one of the multiple antenna structures (e.g., at least one of a first antenna structure 5, a second antenna structure 6, a third antenna structure 7, and a fourth antenna structure 8) through the technical solutions of "signal control chip 3 can be disposed on the first carrier substrate 1", "shared conductive structure 4 can be disposed on the first carrier substrate 1", "each antenna structure can be disposed on the first carrier substrate 1 or the second carrier substrate 2" and "multiple antenna structures are electrically connected between the shared conductive structure 4 and the signal control chip 3).

[0033] Furthermore, the first carrier substrate 1 may have a first mating portion 101, and the second carrier substrate 2 may have a second mating portion 201 corresponding to the first mating portion 101. Thus, when the first mating portion 101 of the first carrier substrate 1 and the second mating portion 201 of the second carrier substrate 2 are mated together, the first carrier substrate 1 and the second carrier substrate 2 may be arranged in a mutually intersecting manner.

[0034] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of protection of the claims of the present invention. Therefore, all equivalent technical changes made based on the content of the present invention specification and drawings are included within the scope of protection of the claims of the present invention.

Claims

1. A modulated directional antenna module, characterized in that, The modulated directional antenna module includes: A first carrier substrate, the first carrier substrate having a first mating portion; A second carrier substrate, the second carrier substrate having a second mating portion corresponding to the first mating portion; A signal control chip is disposed on the first carrier substrate; A shared conductive structure is disposed on the first carrier substrate; A first antenna structure is disposed on the first carrier substrate and electrically connected between the shared conductive structure and the signal control chip; A second antenna structure is disposed on the first carrier substrate and electrically connected between the shared conductive structure and the signal control chip; A third antenna structure is disposed on the second carrier substrate and electrically connected between the shared conductive structure and the signal control chip; A fourth antenna structure, wherein the fourth antenna structure is disposed on the second carrier substrate and electrically connected between the shared conductive structure and the signal control chip; and A signal feeding structure is disposed on the first carrier substrate and electrically connected to the shared conductive structure; When the first mating portion of the first carrier substrate and the second mating portion of the second carrier substrate mate with each other, the first carrier substrate and the second carrier substrate are arranged in a cross configuration.

2. The modulated directional antenna module according to claim 1, characterized in that, in, The first mating part is configured as a first slot, and the second mating part is configured as a second slot that mates with the first slot; The first carrier substrate has a first insertion portion corresponding to the second mating portion, and the second carrier substrate has a second insertion portion corresponding to the first mating portion. Wherein, the first insertion portion of the first carrier substrate is accommodated in the second mating portion of the second carrier substrate, and the second insertion portion of the second carrier substrate is accommodated in the first mating portion of the first carrier substrate, so that the first carrier substrate and the second carrier substrate are mutually cross-fitted. Wherein, when the first mating portion of the first carrier substrate and the second mating portion of the second carrier substrate are mated together, the first carrier substrate and the second carrier substrate are arranged perpendicular to each other. The signal control chip, the shared conductive structure, the first antenna structure, the second antenna structure, and the signal feed structure are all disposed on the same surface of the first carrier substrate. The third antenna structure and the fourth antenna structure are both disposed on the same surface of the second carrier substrate; The shared conductive structure has a guiding portion, a gradually expanding portion connected to the guiding portion, and a protruding portion connected to the gradually expanding portion. The guiding portion is away from the first antenna structure and the second antenna structure. The area of ​​the gradually expanding portion gradually increases from the guiding portion to the protruding portion, and the protruding portion is located between the first antenna structure and the second antenna structure. The first antenna structure has a first body portion, a first vertical extension portion extending vertically from the first body portion, and a first horizontal extension portion extending horizontally from the first body portion. The second antenna structure has a second body portion, a second vertical extension portion extending vertically from the second body portion, and a second horizontal extension portion extending horizontally from the second body portion. The third antenna structure includes a third body portion, a third vertical extension portion extending vertically from the third body portion, and a third horizontal extension portion extending horizontally from the third body portion. The fourth antenna structure includes a fourth body portion, a fourth vertical extension portion extending vertically from the fourth body portion, and a fourth horizontal extension portion extending horizontally from the fourth body portion. The modulated directional antenna module further includes a grounding structure, which has a main body, a tapered portion connected to the main body, and an extension portion connected to the tapered portion. The main body is adjacent to the signal feed structure and is located between the first antenna structure and the second antenna structure. The area of ​​the tapered portion gradually decreases from the main body to the extension portion, and the extension portion extends in a direction away from the signal feed structure. The signal feed structure is disposed between the shared conductive structure, the first antenna structure, the second antenna structure and the grounding structure; The modulated directional antenna module further includes a signal transmission line, and the signal transmission line includes a central conductive part electrically connected to the signal feed structure and a peripheral grounding part electrically connected to the grounding structure.

3. The modulated directional antenna module according to claim 1, characterized in that, in, The first carrier substrate includes a first conductive line layer electrically connected between the first antenna structure and the signal control chip, and a second conductive line layer electrically connected between the second antenna structure and the signal control chip; The second carrier substrate includes a third conductive line layer electrically connected between the third antenna structure and the signal control chip, and a fourth conductive line layer electrically connected between the fourth antenna structure and the signal control chip. The first carrier substrate includes a fifth conductive line layer electrically connected between the shared conductive structure and the signal control chip; The first antenna structure is electrically connected to the signal control chip via a first inductor component, a first diode component, and a first resistor component in sequence. The first inductor component, the first diode component, and the first resistor component are disposed on the first conductive line layer and electrically connected to the first conductive line layer, and one end of the first inductor component is disposed on the first antenna structure. The second antenna structure is electrically connected to the signal control chip via a second inductor component, a second diode component, and a second resistor component in sequence. The second inductor component, the second diode component, and the second resistor component are disposed on the second conductive line layer and electrically connected to the second conductive line layer, and one end of the second inductor component is disposed on the second antenna structure. The third antenna structure is electrically connected to the signal control chip via a third inductor component, a third diode component, and a third resistor component in sequence. The third inductor component, the third diode component, and the third resistor component are disposed on the third conductive line layer and electrically connected to the third conductive line layer. One end of the third inductor component is disposed on the third antenna structure. The fourth antenna structure is electrically connected to the signal control chip via a fourth inductor component, a fourth diode component, and a fourth resistor component in sequence. The fourth inductor component, the fourth diode component, and the fourth resistor component are disposed on the fourth conductive line layer and electrically connected to the fourth conductive line layer. One end of the fourth inductor component is disposed on the fourth antenna structure. The shared conductive structure is electrically connected to the signal control chip via a fifth inductor component. The fifth inductor component is disposed on and electrically connected to the fifth conductive line layer, and one end of the fifth inductor component is disposed on the shared conductive structure. The first antenna structure, the shared conductive structure, the first conductive line layer, and the fifth conductive line layer cooperate with each other to form a first signal loop electrically connected to the signal control chip. The second antenna structure, the shared conductive structure, the second conductive line layer, and the fifth conductive line layer cooperate with each other to form a second signal loop electrically connected to the signal control chip. The third antenna structure, the shared conductive structure, the third conductive line layer, and the fifth conductive line layer cooperate with each other to form a third signal loop electrically connected to the signal control chip; The fourth antenna structure, the shared conductive structure, the fourth conductive line layer, and the fifth conductive line layer cooperate with each other to form a fourth signal loop electrically connected to the signal control chip. The signal control chip is configured to control whether the voltage passes through at least one of the first signal circuit, the second signal circuit, the third signal circuit, and the fourth signal circuit.

4. The modulated directional antenna module according to claim 1, characterized in that, in, The shared conductive structure is electrically connected to the first antenna structure via a first bridging electronic component, the shared conductive structure is electrically connected to the second antenna structure via a second bridging electronic component, the shared conductive structure is electrically connected to the third antenna structure via a third bridging electronic component, the shared conductive structure is electrically connected to the fourth antenna structure via a fourth bridging electronic component, and the shared conductive structure is electrically connected to the signal feed structure via a fifth bridging electronic component. Wherein, the first bridging electronic component, the second bridging electronic component, the third bridging electronic component and the fourth bridging electronic component are all diode components, and the fifth bridging electronic component is a capacitor component; The shared conductive structure has a conductive through-structure that penetrates the first carrier substrate, and the conductive through-structure has a first padding area and a second padding area opposite to the first padding area. The second carrier substrate has a first bridging line layer electrically connected to the first padding area and a second bridging line layer electrically connected to the second padding area. The third bridging electronic component is disposed between the third antenna structure and the first bridging line layer, and the fourth bridging electronic component is disposed between the fourth antenna structure and the second bridging line layer. The first carrier substrate includes a first conductive line layer electrically connected between the first antenna structure and the signal control chip, and a second conductive line layer electrically connected between the second antenna structure and the signal control chip; the second carrier substrate includes a third conductive line layer electrically connected between the third antenna structure and the signal control chip, and a fourth conductive line layer electrically connected between the fourth antenna structure and the signal control chip. The first carrier substrate has a front conductive line layer and a back conductive line layer opposite to the front conductive line layer, and the third conductive line layer is electrically connected to the signal control chip through the front conductive line layer, and the fourth conductive line layer is electrically connected to the signal control chip through the back conductive line layer. The signal control chip is configured to control whether the voltage passes through at least one of the first antenna structure, the second antenna structure, the third antenna structure, and the fourth antenna structure.

5. A modulated directional antenna module, characterized in that, The modulated directional antenna module includes: A first carrier substrate; A second carrier substrate, which cooperates with the first carrier substrate; A signal control chip is disposed on the first carrier substrate; A shared conductive structure is disposed on the first carrier substrate; A first antenna structure is disposed on the first carrier substrate and electrically connected between the shared conductive structure and the signal control chip; A second antenna structure is disposed on the first carrier substrate and electrically connected between the shared conductive structure and the signal control chip; A third antenna structure is disposed on the second carrier substrate and electrically connected between the shared conductive structure and the signal control chip; A fourth antenna structure, wherein the fourth antenna structure is disposed on the second carrier substrate and electrically connected between the shared conductive structure and the signal control chip; and A signal feed structure is disposed on the first carrier substrate and electrically connected to the shared conductive structure.

6. The modulated directional antenna module according to claim 5, characterized in that, in, The signal control chip, the shared conductive structure, the first antenna structure, the second antenna structure, and the signal feed structure are all disposed on the same surface of the first carrier substrate; The third antenna structure and the fourth antenna structure are both disposed on the same surface of the second carrier substrate; The shared conductive structure has a guiding portion, a gradually expanding portion connected to the guiding portion, and a protruding portion connected to the gradually expanding portion. The guiding portion is away from the first antenna structure and the second antenna structure. The area of ​​the gradually expanding portion gradually increases from the guiding portion to the protruding portion, and the protruding portion is located between the first antenna structure and the second antenna structure. The first antenna structure has a first body portion, a first vertical extension portion extending vertically from the first body portion, and a first horizontal extension portion extending horizontally from the first body portion. The second antenna structure has a second body portion, a second vertical extension portion extending vertically from the second body portion, and a second horizontal extension portion extending horizontally from the second body portion. The third antenna structure includes a third body portion, a third vertical extension portion extending vertically from the third body portion, and a third horizontal extension portion extending horizontally from the third body portion. The fourth antenna structure includes a fourth body portion, a fourth vertical extension portion extending vertically from the fourth body portion, and a fourth horizontal extension portion extending horizontally from the fourth body portion. The modulated directional antenna module further includes a grounding structure, which has a main body, a tapered portion connected to the main body, and an extension portion connected to the tapered portion. The main body is adjacent to the signal feed structure and is located between the first antenna structure and the second antenna structure. The area of ​​the tapered portion gradually decreases from the main body to the extension portion, and the extension portion extends in a direction away from the signal feed structure. The signal feed structure is disposed between the shared conductive structure, the first antenna structure, the second antenna structure and the grounding structure; The modulated directional antenna module further includes a signal transmission line, and the signal transmission line includes a central conductive part electrically connected to the signal feed structure and a peripheral grounding part electrically connected to the grounding structure.

7. The modulated directional antenna module according to claim 5, characterized in that, in, The first carrier substrate includes a first conductive line layer electrically connected between the first antenna structure and the signal control chip, and a second conductive line layer electrically connected between the second antenna structure and the signal control chip; The second carrier substrate includes a third conductive line layer electrically connected between the third antenna structure and the signal control chip, and a fourth conductive line layer electrically connected between the fourth antenna structure and the signal control chip. The first carrier substrate includes a fifth conductive line layer electrically connected between the shared conductive structure and the signal control chip; The first antenna structure is electrically connected to the signal control chip via a first inductor component, a first diode component, and a first resistor component in sequence. The first inductor component, the first diode component, and the first resistor component are disposed on the first conductive line layer and electrically connected to the first conductive line layer, and one end of the first inductor component is disposed on the first antenna structure. The second antenna structure is electrically connected to the signal control chip via a second inductor component, a second diode component, and a second resistor component in sequence. The second inductor component, the second diode component, and the second resistor component are disposed on the second conductive line layer and electrically connected to the second conductive line layer, and one end of the second inductor component is disposed on the second antenna structure. The third antenna structure is electrically connected to the signal control chip via a third inductor component, a third diode component, and a third resistor component in sequence. The third inductor component, the third diode component, and the third resistor component are disposed on the third conductive line layer and electrically connected to the third conductive line layer. One end of the third inductor component is disposed on the third antenna structure. The fourth antenna structure is electrically connected to the signal control chip via a fourth inductor component, a fourth diode component, and a fourth resistor component in sequence. The fourth inductor component, the fourth diode component, and the fourth resistor component are disposed on the fourth conductive line layer and electrically connected to the fourth conductive line layer. One end of the fourth inductor component is disposed on the fourth antenna structure. The shared conductive structure is electrically connected to the signal control chip via a fifth inductor component. The fifth inductor component is disposed on and electrically connected to the fifth conductive line layer, and one end of the fifth inductor component is disposed on the shared conductive structure. The first antenna structure, the shared conductive structure, the first conductive line layer, and the fifth conductive line layer cooperate with each other to form a first signal loop electrically connected to the signal control chip. The second antenna structure, the shared conductive structure, the second conductive line layer, and the fifth conductive line layer cooperate with each other to form a second signal loop electrically connected to the signal control chip. The third antenna structure, the shared conductive structure, the third conductive line layer, and the fifth conductive line layer cooperate with each other to form a third signal loop electrically connected to the signal control chip; The fourth antenna structure, the shared conductive structure, the fourth conductive line layer, and the fifth conductive line layer cooperate with each other to form a fourth signal loop electrically connected to the signal control chip. The signal control chip is configured to control whether the voltage passes through at least one of the first signal circuit, the second signal circuit, the third signal circuit, and the fourth signal circuit.

8. The modulated directional antenna module according to claim 5, characterized in that, in, The shared conductive structure is electrically connected to the first antenna structure via a first bridging electronic component, the shared conductive structure is electrically connected to the second antenna structure via a second bridging electronic component, the shared conductive structure is electrically connected to the third antenna structure via a third bridging electronic component, the shared conductive structure is electrically connected to the fourth antenna structure via a fourth bridging electronic component, and the shared conductive structure is electrically connected to the signal feed structure via a fifth bridging electronic component. Wherein, the first bridging electronic component, the second bridging electronic component, the third bridging electronic component and the fourth bridging electronic component are all diode components, and the fifth bridging electronic component is a capacitor component; The shared conductive structure has a conductive through-structure that penetrates the first carrier substrate, and the conductive through-structure has a first padding area and a second padding area opposite to the first padding area. The second carrier substrate has a first bridging line layer electrically connected to the first padding area and a second bridging line layer electrically connected to the second padding area. The third bridging electronic component is disposed between the third antenna structure and the first bridging line layer, and the fourth bridging electronic component is disposed between the fourth antenna structure and the second bridging line layer. The first carrier substrate includes a first conductive line layer electrically connected between the first antenna structure and the signal control chip, and a second conductive line layer electrically connected between the second antenna structure and the signal control chip; the second carrier substrate includes a third conductive line layer electrically connected between the third antenna structure and the signal control chip, and a fourth conductive line layer electrically connected between the fourth antenna structure and the signal control chip. The first carrier substrate has a front conductive line layer and a back conductive line layer opposite to the front conductive line layer, and the third conductive line layer is electrically connected to the signal control chip through the front conductive line layer, and the fourth conductive line layer is electrically connected to the signal control chip through the back conductive line layer. The signal control chip is configured to control whether the voltage passes through at least one of the first antenna structure, the second antenna structure, the third antenna structure, and the fourth antenna structure.

9. A modulated directional antenna module, characterized in that, The modulated directional antenna module includes: A first carrier substrate; A second carrier substrate, which cooperates with the first carrier substrate so that the first carrier substrate and the second carrier substrate are arranged to cross each other; A signal control chip is disposed on the first carrier substrate; A shared conductive structure, the shared conductive structure being disposed on the first carrier substrate; and Multiple antenna structures are provided, each of which is disposed on the first carrier substrate or the second carrier substrate, and the multiple antenna structures are electrically connected between the shared conductive structure and the signal control chip. The signal control chip is configured to control whether voltage passes through at least one of the plurality of antenna structures.

10. The modulated directional antenna module according to claim 9, characterized in that, in, The first carrier substrate has a first mating portion, and the second carrier substrate has a second mating portion corresponding to the first mating portion; Wherein, the first mating part is configured as a first slot, and the second mating part is configured as a second slot that mates with the first slot; The first carrier substrate has a first insertion portion corresponding to the second mating portion, and the second carrier substrate has a second insertion portion corresponding to the first mating portion. Wherein, the first insertion portion of the first carrier substrate is accommodated in the second mating portion of the second carrier substrate, and the second insertion portion of the second carrier substrate is accommodated in the first mating portion of the first carrier substrate, so that the first carrier substrate and the second carrier substrate are mutually cross-fitted. When the first mating portion of the first carrier substrate and the second mating portion of the second carrier substrate are mated together, the first carrier substrate and the second carrier substrate are arranged perpendicular to each other.

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