Power module for a vehicle comprising a capacitor assembly and motor drive comprising the module

Abstract

A power module for a vehicle is provided. The power module includes: a first circuit board including a first insulating layer and a first metal layer disposed on the first insulating layer; a lead frame including a plurality of direct current (DC) electrodes disposed on one side of the first circuit board; a first switching unit electrically connected to the plurality of DC electrodes and disposed on the first circuit board; and a capacitor assembly mounted on the lead frame in a manner electrically connected between the plurality of DC electrodes.

Description

Technical Field

[0001] This disclosure relates to a vehicle power module including a capacitor assembly and an electric motor drive including the power module. Background Technology

[0002] Environmentally friendly vehicles can include hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), electric vehicles (EVs), and fuel cell electric vehicles (FCEVs). The power module of an environmentally friendly vehicle receives DC (direct current) from a high-voltage battery, converts it to AC (alternating current), supplies it to the electric motor, and controls the motor's torque and speed by adjusting the magnitude and phase of the AC current. Summary of the Invention

[0003] Electrical paths in vehicle power modules may act as parasitic inductances, which can lead to instability in current and / or voltage (e.g., fluctuations, surges, or ringing).

[0004] One aspect of this disclosure provides a vehicle power module including a capacitor assembly and an electric motor drive including the power module, which can (e.g., efficiently) reduce the effects of parasitic inductance of the vehicle power module (e.g., voltage / current fluctuations, surges, or ringing due to power conversion) and improve the power conversion efficiency of the vehicle power module (e.g., a switching unit) or reduce required specifications (e.g., withstand voltage characteristics).

[0005] According to one aspect of this disclosure, a power module for a vehicle includes: a first circuit board including a first insulating layer and a first metal layer disposed on the first insulating layer; a lead frame including a plurality of direct current (DC) electrodes disposed on one side of the first circuit board; a first switching unit electrically connected to the plurality of DC electrodes and disposed on the first circuit board; and a capacitor assembly mounted on the lead frame in such a manner as to be electrically connected between the plurality of DC electrodes.

[0006] The power module may also include a fusion splice connected between the capacitor assembly and at least one of the plurality of DC electrodes, the fusion splice comprising a conductive material having a melting point lower than that of the plurality of DC electrodes.

[0007] The capacitor assembly can be disposed in a bridging structure bridging multiple DC electrodes, and the capacitor assembly can include a capacitor body and multiple capacitor electrodes disposed on the capacitor body. One of the multiple capacitor electrodes can be electrically connected to one of the multiple DC electrodes through a part of the fusion joint, and another capacitor electrode can be electrically connected to another of the multiple DC electrodes through another part of the fusion joint.

[0008] A capacitor assembly may include a capacitor body, a plurality of capacitor electrodes disposed on the capacitor body, and a capacitor bonding wire connected to one of the capacitor electrodes. Another capacitor among the capacitor electrodes may be electrically connected to one of the DC electrodes, and the capacitor bonding wire may connect one of the capacitor electrodes to another of the DC electrodes.

[0009] The power module may also include: a package material disposed on the first circuit board, which encapsulates the first switching unit and the capacitor assembly.

[0010] The power module may also include: a package material disposed on the first circuit board and encapsulating a first switching unit and a portion of each of the plurality of DC electrodes, wherein a capacitor assembly is separated from the package material.

[0011] The power module may further include: a second circuit board, including a second insulating layer and a second metal layer disposed on the second insulating layer, wherein the capacitor assembly does not overlap with the first circuit board and the second circuit board in a direction in which the first circuit board and the second circuit board face each other.

[0012] The power module may further include: a second circuit board including a second insulating layer and a second metal layer disposed on the second insulating layer, wherein one of the plurality of DC electrodes is electrically connected to the first metal layer, another of the plurality of DC electrodes is electrically connected to the second metal layer, and a capacitor assembly overlaps with the plurality of DC electrodes in a direction in which the plurality of DC electrodes face each other.

[0013] The power module may also include capacitor spacers disposed between the multiple DC electrodes in a manner that overlaps with the capacitor assembly in a direction in which the multiple DC electrodes face each other.

[0014] The capacitor assembly may include a capacitor body and a plurality of capacitor electrodes disposed on the capacitor body, wherein one of the capacitor electrodes may be electrically connected to one of the plurality of DC electrodes, and another capacitor electrode may be electrically connected to another of the plurality of DC electrodes.

[0015] The power module may also include: via spacers disposed between the first circuit board and the second circuit board to electrically connect the first metal layer to the second metal layer.

[0016] The power module may also include a switching unit spacer disposed between the first switching unit and the second circuit board to electrically connect the first switching unit to the second metal layer.

[0017] The lead frame may also include: multiple alternating current (AC) electrodes electrically connected to the first switching unit, and multiple DC electrodes may be adjacent to each other in such a manner that there are no multiple AC electrodes between them.

[0018] The power module may also include: signal leads electrically connected to the first switching unit and disposed on the other side of the first circuit board.

[0019] The lead frame may also include multiple DC buses electrically connected between the DC link capacitor and multiple DC electrodes, and the capacitor assembly may be mounted on at least one of the multiple DC buses.

[0020] The lead frame may also include an AC electrode electrically connected to the first switching unit, one end of each of the plurality of DC electrodes may be connected to each of the plurality of DC buses, and the distance from the other end of each of the plurality of DC electrodes to the capacitor assembly may be greater than the distance between one end of the AC electrode and the other end.

[0021] The power module may also include: capacitor spacers disposed between the multiple DC buses in a manner that overlaps with the capacitor assembly in a direction in which the multiple DC buses face each other, wherein the capacitor assembly is disposed between the multiple DC buses.

[0022] The power module may also include a second switching unit disposed on the first circuit board and a third switching unit disposed on the first circuit board, wherein the first switching unit includes a plurality of first semiconductor chips, the second switching unit includes a plurality of second semiconductor chips, and the third switching unit includes a third semiconductor chip.

[0023] The first switch unit can be located in the center of the first circuit board, the second switch unit can be located on the outside of the first switch unit on the first circuit board, and the third switch unit can be located on the outside of the first switch unit on the first circuit board.

[0024] According to another aspect of this disclosure, an electric motor drive device includes the aforementioned vehicle power module, wherein a first switching unit includes a 1-1 switching element and a 1-2 switching element, and corresponds to one arm of a first inverter; a second switching unit includes a 2-1 switching element and a 2-2 switching element, and corresponds to one arm of a second inverter; one end of a third switching unit is connected between the following nodes: a first node between the 1-1 switching element and the 1-2 switching element; and a second node between the 2-1 switching element and the 2-2 switching element, and constitutes part of a changeover switch. Attached Figure Description

[0025] The foregoing aspects and features, as well as other aspects and features of this disclosure, will be understood from the following detailed description taken in conjunction with the accompanying drawings.

[0026] Figure 1A This is a circuit diagram illustrating the capacitor assembly of a vehicle power module, according to an embodiment of the present disclosure, to cancel parasitic inductance.

[0027] Figure 1B This is a circuit diagram illustrating a vehicle power module and an electric motor drive device including the power module according to an embodiment of the present disclosure.

[0028] Figure 2 This is a plan view showing a power module for a vehicle according to an embodiment of the present disclosure.

[0029] Figure 3A , 3B 3C is a perspective view illustrating a power module for a vehicle according to an embodiment of the present disclosure.

[0030] Figure 4A , 4B 4C is a perspective view illustrating the structure of a capacitor assembly for a vehicle power module including capacitor bond wires according to an embodiment of the present disclosure.

[0031] Figure 5A , 5B 5C is a side view showing a power module for a vehicle according to an embodiment of the present disclosure.

[0032] Figure 6A , 6B Figures 6 and 6C are side views illustrating the structure of a capacitor assembly of a vehicle power module arranged between multiple DC electrodes (or multiple DC buses) according to an embodiment of the present disclosure.

[0033] Figure 7A , 7B 7C is a side view illustrating the combination of a capacitor assembly and a capacitor spacer in a vehicle power module according to an embodiment of the present disclosure. Detailed Implementation

[0034] Although this disclosure may be modified in various ways and may take various alternative forms, specific embodiments thereof are shown in the accompanying drawings and described in detail below. However, this disclosure is not limited to the specific forms disclosed; on the contrary, this disclosure covers modifications, equivalents, and substitutions that fall within the spirit and scope of this disclosure.

[0035] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements are not limited by these terms. These terms are used to distinguish one element from another. For example, a first element may be referred to as a second element without departing from the scope of this disclosure, and similarly, a second element may be referred to as a first element. As used herein, the term “and / or” includes a combination of one or more of the related listed items.

[0036] The terminology used herein to describe embodiments of this disclosure is not intended to limit the scope of this disclosure. The articles “a” and “an” are singular because they refer to only a single object; however, the use of the singular forms herein should not preclude the existence of more than one object. In other words, unless the context otherwise requires, elements of this disclosure referred to in the singular form may be one or more. It is also understood that the terms “comprise,” “comprising,” “include,” and / or “including” as used herein specify the presence of the stated features, numbers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, and / or combinations thereof.

[0037] Unless otherwise stated, the terms used herein (including technical and scientific terms) are consistent with the meanings understood by one of ordinary skill in the art to which this disclosure pertains. Such terms should be interpreted in the relevant technical context as having the same meaning as those in a general dictionary and should not be interpreted as having (e.g., ideal or overly) formal meanings unless specified in application.

[0038] In this specification, "vehicle" refers to any means of transport that moves objects, such as people, animals, or goods, from an origin to a destination. These vehicles are not limited to means of transport that travel on roads or tracks.

[0039] Embodiments of this disclosure will now be described with reference to the accompanying drawings.

[0040] Reference Figure 1A The vehicle power module according to embodiments of this disclosure may include a first inverter 10, which can be connected to multiple DC electrodes (e.g., Figure 2 410 and 420 in the figure are electrically connected to the DC link capacitor (C-link) and battery (BAT) outside the vehicle power module, and can be connected via the AC electrode (e.g., Figure 2 430) is electrically connected to the motor 2 external to the vehicle's power module. (See reference...) Figure 1B The vehicle power module may also include a second inverter 20 and a transfer switch 30, depending on the embodiment (e.g., design).

[0041] Reference Figure 1A and 1BThe first inverter 10 may include a first switching unit 200, and the first switching unit 200 may include three first switching units 200A, 200B and 200C respectively corresponding to the three phases. The three first switching units 200A, 200B and 200C may each include three 1-1 switching elements 210A, 210B and 210C and three 1-2 switching elements 220A, 220B and 220C, and may correspond to one arm of the first inverter 10.

[0042] The second inverter 20 may include a second switching unit 300, and the second switching unit 300 may include three second switching units 300A, 300B, and 300C, respectively corresponding to the three phases. The three second switching units 300A, 300B, and 300C may each include three 2-1 switching elements 310A, 310B, and 310C and three 2-2 switching elements 320A, 320B, and 320C, and may correspond to one arm of the second inverter 20.

[0043] The changeover switch 30 may include a third switch unit 700, and the third switch unit 700 may include three third switch units 700A, 700B, and 700C, respectively corresponding to the three phases. One end of each of the third switch units 700A, 700B, and 700C is connected between: a first node between 1-1 switch elements 210A, 210B, and 210C and 1-2 switch elements 220A, 220B, and 220C; and a second node between 2-1 switch elements 310A, 310B, and 310C and 2-2 switch elements 320A, 320B, and 320C, and may form part of the changeover switch 30.

[0044] When the direct current (DC) from the battery BAT in the electric vehicle is input to the vehicle motor drive unit 1, the vehicle motor drive unit 1 can convert the input DC current into alternating current (AC) and output it to the motor 2 to run the motor 2. The first inverter 10 and the second inverter 20 can convert the DC current into AC current.

[0045] The first inverter 10 can operate (e.g., all) of the time, while the second inverter 20 can operate simultaneously with the first inverter 10 when the motor 2 requires high output. Accordingly, the vehicle motor drive unit 1 can improve overall efficiency over a wide output range of the motor 2. The transfer switch 30 can connect the first inverter 10 to the second inverter 20, and can be turned on (e.g., only) when the first inverter 10 is operating to provide a Y-connection between the phase windings of the motor 2, and can be turned off when the second inverter 20 is also operating.

[0046] Reference Figure 2The first switching unit 200 may include at least one of a plurality of first semiconductor chips 201, the second switching unit 300 may include at least one of a plurality of second semiconductor chips 301, and the third switching unit 700 may include a third semiconductor chip.

[0047] For example, the first switching unit 200 and the third switching unit 700 can be implemented as silicon carbide (SiC) chips, while the second switching unit 300 can be implemented as a silicon (Si) chip. The second switching unit 300 can be selectively turned off; therefore, the second switching unit 300 can be implemented as (e.g., relatively) low-performance Si chips. The operating frequency of the first switching unit 200 and the third switching unit 700 can be (e.g., relatively) higher than that of the second switching unit 300; therefore, the first switching unit 200 and the third switching unit 700 can be implemented as (e.g., relatively) high-performance SiC chips. The semiconductor type of each of the above switching elements is merely an example of this disclosure and is not necessarily limited thereto; various types of semiconductors can be applied.

[0048] The first switching unit 200 can be used more frequently than the second switching unit 300, and the number of switching elements in the first switching unit 200 can be greater than the number of switching elements in the third switching unit 700. Therefore, compared with the second switching unit 300 and the third switching unit 700, the first switching unit 200 can have a greater impact on the overall energy efficiency of the vehicle power module.

[0049] For example, the first switching unit 200 can be arranged in the center of the first circuit board 100, the second switching unit 300 can be disposed on the first circuit board 100 outside the first switching unit 200, and the third switching unit 700 can be disposed on the first circuit board 100 outside the first switching unit 200. Therefore, the electrical distance between the lead frame 400 and the first switching unit 200 can be shortened, and since the electrical path between the lead frame 400 and the first switching unit 200 is simplified, parasitic impedance can also be reduced. The shortened electrical distance can represent an improvement in energy efficiency, and the improved energy efficiency of the first switching unit 200 can represent an overall improvement in the energy efficiency of the vehicle power module. Furthermore, this structure can be used to minimize the insulation distance of the signal leads 500, and can also reduce the overall size of the vehicle power module.

[0050] For example, the 1-2 switching elements 220A, 220B, and 220C of the first switching unit 200 and the 2-2 switching elements 320A, 320B, and 320C of the second switching unit 300 can form the same potential difference. By arranging the 1-2 switching elements 220A, 220B, and 220C of the first switching unit 200 and the 2-2 switching elements 320A, 320B, and 320C of the second switching unit 300 adjacent to each other, the insulation distance other than the (e.g., required) insulation distance of the signal lead 500 can be eliminated, thereby reducing the size of the first circuit board 100.

[0051] The third switching unit 700 may be arranged adjacent to the 2-1 switching elements 310A, 310B, and 310C of the second switching unit 300. The third switching unit 700 may be configured to have the same potential difference as the 2-1 switching elements 310A, 310B, and 310C of the second switching unit 300, and since the third switching unit 700 is arranged adjacent to the 2-1 switching elements 310A, 310B, and 310C, the insulation distance other than the (e.g., required) insulation distance of the signal lead 500 can be eliminated, thereby reducing the size of the first circuit board 100.

[0052] By placing the signal lead 500 adjacent to the 1-2 switching elements 220A, 220B and 220C of the first switching unit 200, the insulation distance other than the (e.g., required) insulation distance of the signal lead 500 can be eliminated, thereby reducing the size of the first circuit board 100.

[0053] One end of the third switching unit 700 can be connected between the motor 2 and the second switching unit 300, and the other end can be connected to the lead frame 400, so that when they are connected to each other outside the vehicle power module, they can provide a Y-connection for each winding of the motor 2.

[0054] Reference Figure 1A , Figure 1B and Figure 2 Each of the following components can comprise a structure of transistors and diodes: three 1-1 switching elements 210A, 210B, and 210C; three 1-2 switching elements 220A, 220B, and 220C; three 2-1 switching elements 310A, 310B, and 310C; three 2-2 switching elements 320A, 320B, and 320C; and three third switching units 700A, 700B, and 700C (e.g., a total of 15). Furthermore, the components can be configured according to a lead frame (e.g., ...). Figure 2The 400 signal (from an external source of the vehicle power module) provides the switching operation of the transistor between the on and off states. For example, the transistor can be implemented as an insulated gate bipolar transistor (IGBT) or a metal-oxide-semiconductor field-effect transistor (MOSFET), but is not limited to these.

[0055] The switching operation of each switching element between the on and off states can cause rapid changes in the current flowing between the drain and source terminals of the switching element (e.g., recovery current of the switching element). The capacitance of the DC link capacitor (C-link) can stabilize the instability of the total DC current and total DC voltage of the first inverter 10 caused by rapid current changes (e.g., fluctuations, surges, or ringing) (e.g., balancing the instantaneous power difference between the battery and the first inverter).

[0056] The electrical path between the switching element and the DC link capacitor C-link can be considered as a parasitic inductance L-para. In circuit theory, the product of the parasitic inductance L-para and the rate of change of current caused by the switching operation of the switching element corresponds to the voltage generated in the parasitic inductance L-para. Therefore, as the parasitic inductance L-para increases, the rapid change of current caused by the switching operation of the switching element can increase voltage instability (e.g., fluctuations, surges, or ringing). In this way, the instability of DC current and the instability of DC voltage can complement each other. Therefore, as the parasitic inductance L-para decreases, the overall DC current and DC voltage can be further stabilized.

[0057] A vehicle power module according to embodiments of this disclosure may include a capacitor assembly C-com. Current variations generated by switching elements may be affected by the output reactance of the switching elements, which can be reduced by canceling out a portion of the series parasitic inductance L-para (e.g., the corresponding portion between the capacitor assembly C-com and the DC link capacitor C-link) with the parallel capacitance of the capacitor assembly C-com. Therefore, the parasitic inductance L-para can be canceled (e.g., efficiently), and the effects of parasitic inductance in the vehicle power module (e.g., voltage / current fluctuations / surges / ringing caused by power conversion switching) can be reduced (e.g., efficiently). Furthermore, by reducing the parasitic inductance L-para, the vehicle power module can further improve power conversion efficiency (e.g., switching timing consistency among multiple switching elements) or reduce the required specifications of the vehicle power module (e.g., withstand voltage characteristics).

[0058] Reference Figure 2 and Figures 3A to 7CAt least one of the components, according to embodiments of the present disclosure, may include a first circuit board 100, a lead frame 400, a first switching unit 200, and capacitor assemblies C-com, C-com1, C-com2, C-com3, and C-com4. Depending on the embodiment (e.g., design), the vehicle power module may also include at least one of a second circuit board 150 and a second switching unit 300. The first switching unit 200 may include at least one first semiconductor chip 201, and the second switching unit 300 may include at least one second semiconductor chip 301.

[0059] The first circuit board 100 may include a first insulating layer 110 and a first metal layer 120 disposed on the first insulating layer 110. The second circuit board 150 may include a second insulating layer 160 and a second metal layer 170 disposed on the second insulating layer 160. For example, each of the first circuit board 100 and the second circuit board 150 may be implemented as an active metal brazing (AMB) substrate or a direct copper-clad (DBC) substrate, each of the first insulating layer 110 and the second insulating layer 160 may be implemented as a ceramic layer, and each of the first metal layer 120 and the second metal layer 170 may be implemented as a copper layer, but is not limited thereto.

[0060] A portion of each of the first insulating layer 110 and the second insulating layer 160 may overlap with each of the first metal layer 120 and the second metal layer 170 in the vertical direction (e.g., the Z direction), and another portion of each of the first insulating layer 110 and the second insulating layer 160 may not overlap with each of the first metal layer 120 and the second metal layer 170 in the vertical direction (e.g., the Z direction). For example, before patterning, each of the first metal layer and the second metal layer may be formed to overlap the entire area of ​​each of the first insulating layer 110 and the second insulating layer 160, and a portion of each of the first metal layer and the second metal layer before patterning may be removed by a patterning process (e.g., photolithography). After patterning, each of the first metal layer 120 and the second metal layer 170 may include a plurality of patterns 122, 123, 124, 125 and 128 that are separate from each other, and the plurality of patterns 122, 123, 124, 125 and 128 may provide a plurality of electrical connection paths for the first semiconductor chip 201 and the second semiconductor chip 301 of the first switching unit 200 and the second switching unit 300.

[0061] For example, the first circuit board 100 may further include a third metal layer 130, and the second circuit board 150 may further include a fourth metal layer 180. For example, the third metal layer 130 and the fourth metal layer 180 can dissipate heat generated by the first semiconductor chip 201 and the second semiconductor chip 301, as well as the first metal layer 120 and the second metal layer 170, to the outside of the vehicle power module, and can be electrically insulated from the first metal layer 120 and the second metal layer 170 through the first insulating layer 110 and the second insulating layer 160. Alternatively, the third metal layer 130 and the fourth metal layer 180 can provide grounding for the first switching unit 200 and the second switching unit 300, and can be electrically connected to certain patterns of the first metal layer 120 and the second metal layer 170 through conductive vias in the first insulating layer 110 and the second insulating layer 160. Although not shown, cooling channels for cooling the vehicle power module may contact the lower surface of the third metal layer 130 and the upper surface of the fourth metal layer 180.

[0062] The first switching unit 200 and the second switching unit 300 may be electrically connected to a plurality of DC electrodes 410 and 420 and arranged on the first circuit board 100 and the second circuit board 150 (e.g., arranged between the first circuit board 100 and the second circuit board 150). For example, the first semiconductor chip 201 of the first switching unit 200 and the second semiconductor chip 301 of the second switching unit 300 may be implemented as at least one of an integrated circuit, a chip, and a die. Switching of the first switching unit 200 and the second switching unit 300 may refer to switching between the on state and the off state of the semiconductor device.

[0063] The first switching unit 200 and the second switching unit 300 can receive control signals from outside the power module via signal leads 500, and can switch the on / off state of the semiconductor devices according to the control signals. Based on the switching of the first switching unit 200 and the second switching unit 300, the DC current input through the lead frame 400 can be converted into AC current.

[0064] For example, the first switching unit 200 and the second switching unit 300 can be mounted on the upper surface of the first circuit board 100 via the first connecting portion 215 and the second connecting portion 315, respectively. For example, the first connecting portion 215 and the second connecting portion 315 can be implemented as structures that also provide electrical connection paths, such as bumps or solder balls, or they can be implemented as adhesive layers that provide adhesion but do not provide electrical connection paths.

[0065] The lead frame 400 may include a plurality of DC electrodes 410 and 420 disposed on one side (e.g., along the -Y direction) of the first circuit board 100 and the second circuit board 150, and may also include an AC electrode 430. The plurality of DC electrodes 410 and 420 may include N-type electrodes and P-type electrodes. The plurality of DC electrodes 410 and 420 may be electrically connected to a battery (e.g., Figure 1A The BAT in the middle allows them to receive signals from the battery (e.g., Figure 1A The DC current (BAT in the first metal layer 120) is transmitted to the first semiconductor chip 201 and the second semiconductor chip 301 through at least two of the multiple patterns 122, 123, 124, 125 and 128 of the first metal layer 120. The AC electrode 430 can be electrically connected to a motor (e.g., Figure 1A Therefore, AC electrode 430 can receive AC current output from the first semiconductor chip 201 and the second semiconductor chip 301 through the first metal layer 120, and output it to the motor (e.g., Figure 1A 2).

[0066] Capacitor assemblies C-com, C-com1, C-com2, C-com3, and C-com4 can be mounted on the lead frame 400 in a manner electrically connected between multiple DC electrodes 410 and 420. The capacitor assemblies C-com, C-com1, C-com2, C-com3, and C-com4 can be manufactured separately from the vehicle power module, allowing them to be designed (e.g., efficiently) to form capacitors, and can be supplied during the manufacturing process of the vehicle power module, and can be connected and secured to the lead frame 400. This can be referred to as mounting.

[0067] For example, the parasitic inductance of a vehicle power module assembled with other structures (e.g., circuit boards, switching units, and lead frames) besides capacitor assemblies C-com, C-com1, C-com2, C-com3, and C-com4. Figure 1A The L-para in the figure can vary slightly depending on the specifications and / or process layout of other structural embodiments (e.g., design). Capacitor assemblies C-com, C-com1, C-com2, C-com3, and C-com4 can be additionally provided in vehicle power modules assembled with other structures, and can be selected as optimized types among various capacitor assembly types, such that they can provide optimized capacitance (and / or other characteristics, such as withstand voltage or temperature characteristics) for vehicle power modules to offset current parasitic inductance (e.g., Figure 1A L-para in (the text).

[0068] For example, capacitor components can be implemented as one of, but are not limited to, multilayer ceramic capacitors (MLCCs), solid electrolytic (or tantalum) capacitors, film capacitors, and silicon-based capacitors. For example, MLCCs can be provided in various capacitor component models, and vehicle power module manufacturers can select capacitor component models from the various capacitor component models whose characteristics are optimized for the current requirements of vehicle power modules.

[0069] For example, a portion of the lead frame 400 may be configured to overlap with at least one of the first insulating layer 110 and the first metal layer 120 in a direction (e.g., the Z direction) in which the first insulating layer 110 and the first metal layer 120 face each other, and capacitor assemblies C-com, C-com1, C-com2, C-com3 and C-com4 may not overlap with the first circuit board 100 and the second circuit board 150 in a direction (e.g., the Z direction) in which the first insulating layer 110 and the first metal layer 120 face each other.

[0070] For example, the AC electrode 430 of the lead frame 400 may also include multiple AC electrodes 430 electrically connected to the first switching unit 200 and / or the second switching unit 300, and the multiple DC electrodes 410 and 420 may be arranged in a manner where there are no multiple AC electrodes 430 between them (e.g., adjacent). Therefore, the electrical distance between the multiple DC electrodes 410 and 420 and the first switching unit 200 can be shortened, and transmission efficiency can be improved. Compared to the transmission efficiency of AC current, the transmission efficiency of DC current can have a greater impact on the overall energy efficiency of the power module for vehicles.

[0071] As the electrical distance between the multiple DC electrodes 410 and 420 and the first switching unit 200 decreases, the parasitic inductance corresponding to the electrical distance also decreases, and the required capacitance values ​​of the capacitor assemblies C-com, C-com1, C-com2, C-com3 and C-com4 used to cancel the parasitic inductance also decrease.

[0072] For example, the number of DC electrodes 410 and 420 can be three, and the number of AC electrodes 430 can be three, but is not limited to these. For example, among the multiple DC electrodes 410 and 420, the two DC electrodes 420 on both sides can be N-type electrodes (or P-type electrodes), and among the multiple DC electrodes 410 and 420, the middle DC electrode 410 can be a P-type electrode (or N-type electrode). This structure can be provided as an NPN bus structure (or a PNP bus structure).

[0073] Reference Figures 3A to 3C at least one of them and Figures 5A to 5CAt least one of the vehicle power modules according to embodiments of the present disclosure may further include a welded portion 75 connecting the plurality of DC electrodes 410 and 420 to the capacitor assembly C-com1, and the welded portion 75 includes a conductive material with a melting point lower than that of the plurality of DC electrodes 410 and 420. For example, for a structure in which the capacitor assembly C-com1 is disposed on at least one of the plurality of DC electrodes 410 and 420, the welded portion 75 may be made of a welding material or a sintering material, and may be formed by a reflow process or a thermo-press bonding (TCB) process.

[0074] For example, capacitor assembly C-com1 may include capacitor body 60 and a plurality of capacitor electrodes 70 and 80 disposed on capacitor body 60. Capacitor body 60 may have a structure for forming capacitance (e.g., a structure where a metal-dielectric-metal structure is efficiently compressed). The plurality of capacitor electrodes 70 and 80 may provide an electrical path for transferring the capacitance of capacitor body 60 to the outside of capacitor assembly C-com1 and may be electrically connected to a plurality of DC electrodes 410 and 420, respectively.

[0075] The capacitor assembly C-com1 can be configured in a bridging structure spanning multiple DC electrodes 410 and 420. For example, one of the multiple capacitor electrodes 70 and 80 can be electrically connected to one of the DC electrodes 410 and 420 via a portion of the fusion joint 75, and another of the capacitor electrodes 70 and 80 can be electrically connected to the other of the DC electrodes 410 and 420 via another portion of the fusion joint 75. Therefore, the space between the multiple DC electrodes 410 and 420 can be utilized (e.g., efficiently) (to ensure the space required for capacitor formation), and short circuits between the multiple DC electrodes 410 and 420 (or between one portion of the fusion joint 75 and another portion) can be reliably prevented.

[0076] Reference Figures 4A to 4C The capacitor assembly C-com2 may also include a capacitor bonding wire 90 connected to one of the plurality of capacitor electrodes 70 and 80. One of the plurality of capacitor electrodes 70 and 80 may be electrically connected to one of the plurality of DC electrodes 410 and 420 via the capacitor bonding wire 90, and another of the plurality of capacitor electrodes 70 and 80 may be electrically connected to another of the plurality of DC electrodes 410 and 420. Therefore, the shape and arrangement freedom of the capacitor assembly C-com2 can be increased. For example, the capacitor bonding wire 90 may include, but is not limited to, a material with high conductivity, ductility, and malleability, such as gold (Au).

[0077] Reference Figures 6A to 6C at least one of them and Figures 7A to 7CAt least one of the plurality of DC electrodes 410 and 420 may be electrically connected to the first metal layer 120, another of the plurality of DC electrodes 410 and 420 may be electrically connected to the second metal layer 170, and capacitor assemblies C-com3 and C-com4 may overlap with the plurality of DC electrodes 410 and 420 in a direction (e.g., the Z direction) in which the plurality of DC electrodes 410 and 420 face each other.

[0078] One of the multiple capacitor electrodes 70 and 80 of capacitor assemblies C-com3 and C-com4 can be electrically connected to one of the multiple DC electrodes 410 and 420, and another of the multiple capacitor electrodes 70 and 80 can be electrically connected to another of the multiple DC electrodes 410 and 420. Therefore, the space between the first circuit board 100 and the second circuit board 150 can be utilized (e.g., efficiently).

[0079] For example, since multiple DC electrodes 410 and 420 can support capacitor assemblies C-com3 and C-com4 in the vertical direction, capacitor assemblies C-com3 and C-com4 can be mounted on multiple DC electrodes 410 and 420 without the need for a separate structure (e.g., a welded section) for fixing to multiple DC electrodes 410 and 420.

[0080] Reference Figures 7A to 7C According to embodiments of the present disclosure, the vehicle power module may further include a capacitor spacer 630 disposed between a plurality of DC electrodes 410 and 420 (or between a plurality of DC buses 450) to overlap with the capacitor assembly C-com4 in a direction in which the plurality of DC electrodes 410 and 420 face each other (e.g., the Z direction). Since the capacitor spacer 630 can support the capacitor assembly C-com4 in the vertical direction, the capacitor assembly C-com4 can be mounted on one of the plurality of DC electrodes 410 and 420 without the need for a separate structure (e.g., a weld) for fixing it to one of the plurality of DC electrodes 410 and 420.

[0081] One of the multiple capacitor electrodes 70 and 80 of the capacitor assembly C-com4 can be electrically connected to one of the multiple DC electrodes 410 and 420, and another of the multiple capacitor electrodes 70 and 80 can be electrically connected to another of the multiple DC electrodes 410 and 420 via capacitor spacer 630.

[0082] For example, the capacitor spacer 630 can be implemented as a block made of conductive material, or as a structure coupled to a conductive post and an insulating block surrounding the conductive post, but is not limited thereto. For example, the capacitor spacer 630 can be connected and bonded to the capacitor assembly C-com4 and the DC electrode 420 via a spacer connection. The thickness of the capacitor spacer 630 can correspond to the difference between the gap between the plurality of DC electrodes 410 and 420 and the thickness of the capacitor assembly C-com4, thereby stabilizing the arrangement of the capacitor element C-com4 by supporting the capacitor assembly C-com4 downward.

[0083] A vehicle power module according to an embodiment of the present disclosure may include a switch unit spacer 610 and / or a via spacer 620. Both the switch unit spacer 610 and the via spacer 620 can provide an electrical connection path for the second circuit board 150, such that the capacitor electrodes 80 of the capacitor assemblies C-com3 and C-com4 can be electrically connected to the first semiconductor chip 201 and the second semiconductor chip 301 or the first metal layer 120.

[0084] A switch unit spacer 610 may be disposed between the first semiconductor chip 201 of the first switch unit 200 and the second circuit board 150 to electrically connect the first switch unit 200 to the second metal layer 170. A via spacer 620 may be disposed between the first circuit board 100 and the second circuit board 150 to electrically connect the first metal layer 120 to the second metal layer 170.

[0085] The spacer connection portions 615 and 625 can connect the switch unit spacer 610 and / or the via spacer 620 to the second metal layer 170, connect the switch unit spacer 610 to the first semiconductor chip 201 of the first switch unit 200, and connect the via spacer 620 to the first metal layer 120. For example, the spacer connection portions 615 and 625 can be implemented as blocks made of conductive material, or as a structure combining a conductive post and an insulating block surrounding the conductive post, but are not limited thereto.

[0086] The switch unit spacer 610 can stabilize the arrangement of the first semiconductor chip 201 by supporting the first semiconductor chip 201 of the first switch unit 200 downwards, and can also provide a path for dissipating the heat generated by the first semiconductor chip 201 upwards.

[0087] Reference Figure 3A , 4AAt least one of 5A, 6A, and 7A, the encapsulation material (encapsulation component) 650 may be disposed on the first circuit board 100, may be disposed between the first circuit board 100 and the second circuit board 150, and may encapsulate the first switching unit 200, the second switching unit 300, and the third switching unit 700, as well as the capacitor assemblies C-com, C-com1, C-com2, C-com3, and C-com4. The encapsulation material 650 may protect the first switching unit 200, the second switching unit 300, and the third switching unit 700 from external influences of the vehicle power module, and may also protect the capacitor assemblies C-com, C-com1, C-com2, C-com3, and C-com4. For example, the encapsulation material 650 may include, but is not limited to, a molding material such as epoxy molding compound (EMC) or silicone.

[0088] Reference Figure 3B , 4B At least one of 5B, 6B and 7B, the package material 650 may be disposed on the first circuit board 100, may be disposed between the first circuit board 100 and the second circuit board 150, may encapsulate the first switching unit 200, the second switching unit 300 and the third switching unit 700, and may encapsulate a portion of each of the plurality of DC electrodes 410 and 420, but the capacitor assemblies C-com, C-com1, C-com2, C-com3 and C-com4 may be spaced apart from the package material 650.

[0089] Reference Figure 3C , 4C At least one of 5C, 6C, and 7C, the lead frame 400 may also include multiple DC buses 450 electrically connected between the multiple DC electrodes 410 and 420 and the DC link capacitor C-link, and capacitor assemblies C-com1, C-com2, C-com3, and C-com4 may be mounted on at least one of the multiple DC buses 450. Therefore, capacitor assemblies C-com1, C-com2, C-com3, and C-com4 can be configured independently of the vehicle power module, and thus can also have optimized characteristics.

[0090] Since multiple DC buses 450 and multiple DC electrodes 410 and 420 may need to allow high-voltage DC current (e.g., efficiently and stably) to flow through them, the multiple DC buses 450 can be implemented in a similar manner to the multiple DC electrodes 410 and 420 (e.g., similar shape / width / thickness / material).

[0091] One end of the plurality of DC electrodes 410 and 420 (e.g., one end along the -Y direction) may be connected to a plurality of DC buses 450. For example, the plurality of DC buses 450 may at least electrically connect the plurality of DC electrodes 410 and 420 to a battery (e.g., Figure 1A It is part of the bus structure of the BAT (Block Actuator) or can be connected in parallel to the bus structure. For example, one end of each of the plurality of DC buses 450 (e.g., the end along the +Y direction) can be physically joined (e.g., fixed, bonded) to one end of the plurality of DC electrodes 410 and 420 through a plurality of through holes formed in one end of the plurality of DC electrodes 410 and 420 (e.g., the end along the -Y direction).

[0092] The distance from the other end of each of the plurality of DC electrodes 410 and 420 to the capacitor assemblies C-com1, C-com2, C-com3, and C-com4 (e.g., the length beyond each of the plurality of DC electrodes 410 and 420 along the Y direction) can be greater than the distance between one end and the other end of the AC electrode 430 (e.g., the length of the AC electrode 430 along the Y direction). For example, the lengths of the plurality of DC electrodes 410 and 420 along the Y direction can be substantially the same as the lengths of the plurality of AC electrodes 430 along the Y direction, and in the -Y direction, most of the DC buses 450 can be located further away than one end of the AC electrode 430 in the -Y direction, such that the capacitor assemblies C-com1, C-com2, C-com3, and C-com4 can also be located further away than one end of the AC electrode 430 in the -Y direction.

[0093] The capacitor spacer 630 can be disposed between the multiple DC buses 450 in a direction in which the multiple DC buses 450 face each other (e.g., in the Z direction). The capacitor assembly C-com4 can be disposed between the multiple DC buses 450. Therefore, when the multiple DC buses 450 are connected to the multiple DC electrodes 410 and 420, electrical short circuits between the multiple DC buses 450 can be stably prevented, and the capacitor assembly C-com4 can also be stably prevented from disengaging from the multiple DC buses 450.

[0094] Reference Figure 2 as well as Figures 3A to 7C At least one of them, the vehicle power module according to embodiments of the present disclosure may further include a current sensor (e.g., Figure 2 At least one of the following: 800, bonding wire 900, and signal lead 500.

[0095] Current sensor (e.g., Figure 2The 800 in the middle can sense the current flowing through the first metal layer 120 and can be disposed between the first circuit board 100 and the second circuit board 150. For example, a current sensor (e.g., Figure 2 The 800 in the figure can be implemented as a current and / or voltage sensing resistor connected in parallel with the first metal layer 120, or it can be implemented as a Hall sensor, but is not limited thereto.

[0096] One end of the bonding wire 900 can be connected to the first switching unit 200, the second switching unit 300, and the third switching unit 700, as well as a current sensor (e.g., Figure 2 The bonding wire 900 can be connected to the first metal layer 120 or the signal lead 500. For example, the bonding wire 900 can include, but is not limited to, a material with high conductivity, ductility and electrical conductivity, such as gold (Au).

[0097] Signal lead 500 can be electrically connected to the first switching unit 200, the second switching unit 300, and the third switching unit 700, and can be disposed on the opposite side of the first circuit board 100 and the second circuit board 150 (e.g., in the +Y direction). Signal lead 500 can be configured to offset from the center of the first circuit board 100 and the second circuit board 150 along the +Y direction. Signal lead 500 can receive control signals from an external (e.g., controller) source of the vehicle power module and transmit these control signals to the first switching unit 200, the second switching unit 300, and the third switching unit 700. Furthermore, signal lead 500 can connect to a current sensor (e.g., Figure 2 The current value sensed by the 800 is sent to the outside of the vehicle power module (e.g., the controller).

[0098] The vehicle power module including a capacitor assembly and the motor drive device including the power module according to embodiments of the present disclosure can (e.g., efficiently) reduce the effects of parasitic inductance of the vehicle power module (e.g., voltage / current fluctuations / surges / ringing caused by power conversion switching) and can improve the power conversion efficiency of the vehicle power module (e.g., switching unit) or reduce required specifications (e.g., withstand voltage characteristics).

[0099] For example, the parasitic inductance of a vehicle power module assembled with other structures besides the capacitor assembly may vary slightly depending on the specifications of the embodiments (e.g., design) and / or process layout of the other structures. The capacitor assembly can be additionally provided in the vehicle power module assembled with other structures, and an optimized type can be selected from various capacitor assembly types to provide more optimized capacitance for the vehicle power module to counteract current parasitic inductance.

[0100] Although embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as provided in the appended claims.

Claims

1. A power module for a vehicle, comprising: The first circuit board includes a first insulating layer and a first metal layer disposed on the first insulating layer; The lead frame includes a plurality of DC electrodes disposed on one side of the first circuit board; A first switching unit is electrically connected to the plurality of DC electrodes and is disposed on the first circuit board; and A capacitor assembly is disposed on the lead frame in such a way that it is electrically connected between the plurality of DC electrodes.

2. The power module according to claim 1, further comprising: A fusion joint is provided between the capacitor assembly and at least one of the plurality of DC electrodes. The welded portion includes a conductive material with a melting point lower than that of each of the plurality of DC electrodes.

3. The power module according to claim 2, wherein, The capacitor assembly is configured as a bridging structure across the plurality of DC electrodes, and The capacitor assembly includes a capacitor body and a plurality of capacitor electrodes disposed on the capacitor body, and At least one of the plurality of capacitor electrodes is electrically connected to at least one of the plurality of DC electrodes through a first portion of the fusion joint, and at least one of the plurality of capacitor electrodes is electrically connected to at least one of the plurality of DC electrodes through a second portion of the fusion joint.

4. The power module according to claim 1, wherein, The capacitor assembly includes a capacitor body, a plurality of capacitor electrodes disposed on the capacitor body, and a capacitor bonding wire connected to at least one of the plurality of capacitor electrodes. At least one of the plurality of capacitor electrodes is electrically connected to at least one of the plurality of DC electrodes, and The capacitor bonding wire connects at least one of the plurality of capacitor electrodes to at least one of the plurality of DC electrodes.

5. The power module according to claim 1, further comprising: A packaging material is disposed on the first circuit board and encapsulates the first switching unit and the capacitor assembly.

6. The power module according to claim 1, further comprising: A packaging material is disposed on the first circuit board and encapsulates the first switching unit and a portion of each of the plurality of DC electrodes. The capacitor assembly is separated from the encapsulation material.

7. The power module according to claim 1, further comprising: The second circuit board includes a second insulating layer and a second metal layer disposed on the second insulating layer. The capacitor assembly does not overlap with the first and second circuit boards in the direction in which the first and second circuit boards face each other.

8. The power module according to claim 1, further comprising: The second circuit board includes a second insulating layer and a second metal layer disposed on the second insulating layer. Wherein, at least one of the plurality of DC electrodes is electrically connected to the first metal layer, and at least one of the plurality of DC electrodes is electrically connected to the second metal layer, and The capacitor assembly overlaps with the plurality of DC electrodes in the direction in which the plurality of DC electrodes face each other.

9. The power module according to claim 8, further comprising: A capacitor spacer is disposed between the plurality of DC electrodes in such a manner that it overlaps with the capacitor assembly in a direction in which the plurality of DC electrodes face each other.

10. The power module according to claim 9, wherein, The capacitor assembly includes a capacitor body and a plurality of capacitor electrodes disposed on the capacitor body. The first capacitor electrode of the plurality of capacitor electrodes is electrically connected to the first DC electrode of the plurality of DC electrodes, and The second capacitor electrode of the plurality of capacitor electrodes is electrically connected to the second DC electrode of the plurality of DC electrodes.

11. The power module according to claim 8, further comprising: A via spacer is disposed between the first circuit board and the second circuit board to electrically connect the first metal layer to the second metal layer.

12. The power module according to claim 8, further comprising: A switch unit spacer is disposed between the first switch unit and the second circuit board to electrically connect the first switch unit to the second metal layer.

13. The power module according to claim 1, wherein, The lead frame also includes a plurality of AC electrodes electrically connected to the first switching unit, and The plurality of DC electrodes are adjacent to each other in such a manner that there are no plurality of AC electrodes between them.

14. The power module according to claim 13, further comprising: The signal lead is electrically connected to the first switching unit and is located on the other side of the first circuit board.

15. The power module according to claim 1, wherein, The lead frame also includes multiple DC buses electrically connected between the DC link capacitor and the plurality of DC electrodes, and The capacitor assembly is disposed on at least one of the plurality of DC buses.

16. The power module according to claim 15, wherein, The lead frame also includes an AC electrode electrically connected to the first switching unit. The first end of each of the plurality of DC electrodes is connected to each of the plurality of DC buses, and The distance from the second end of each of the plurality of DC electrodes to the capacitor assembly is greater than the distance between the first and second ends of the AC electrode.

17. The power module according to claim 15, further comprising: Capacitor spacers are disposed between the plurality of DC buses in a manner that overlaps with the capacitor assembly in a direction in which the plurality of DC buses face each other. The capacitor assembly is disposed between the plurality of DC buses.

18. The power module according to claim 1, further comprising: A second switching unit disposed on the first circuit board; and The third switch unit is disposed on the first circuit board. The first switching unit includes a plurality of first semiconductor chips, the second switching unit includes a plurality of second semiconductor chips, and the third switching unit includes a third semiconductor chip.

19. The power module according to claim 18, wherein, The first switch unit is located in the center of the first circuit board. The second switching unit is disposed on the outside of the first switching unit on the first circuit board, and The third switching unit is disposed on the outside of the first switching unit on the first circuit board.

20. An electric motor drive device, comprising: Power module, including: The first circuit board includes a first insulating layer and a first metal layer disposed on the first insulating layer; The lead frame includes a plurality of DC electrodes disposed on one side of the first circuit board; A first switching unit is electrically connected to the plurality of DC electrodes and is disposed on the first circuit board; A capacitor assembly is disposed on the lead frame in such a manner as to be electrically connected between the plurality of DC electrodes; The second switching unit is disposed on the first circuit board; and The third switching unit is mounted on the first circuit board. The first switching unit includes multiple first semiconductor chips, the second switching unit includes multiple second semiconductor chips, and the third switching unit includes a third semiconductor chip. The first switching unit includes a 1-1 switching element and a 1-2 switching element, and corresponds to one arm of the first inverter. The second switching unit includes a 2-1 switching element and a 2-2 switching element, and corresponds to one arm of the second inverter. At least one end of the third switching unit is connected between the following nodes: a first node between the 1-1 switching element and the 1-2 switching element; and a second node between the 2-1 switching element and the 2-2 switching element, and forms part of a changeover switch.

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