Single-phase immersion liquid cooling server heat dissipation structure and cabinet

Abstract

This invention discloses a single-phase immersion liquid-cooled server heat dissipation structure and cabinet. The heat dissipation structure includes a server, which comprises a PCB board, a heating element disposed on the PCB board, and a heat sink disposed on the heating element. A drain cover is provided on the PCB board, covering the heat sink and the heating element. One end of the drain cover is open, and the opposite end is closed, with a drain port at the other end, thereby forming a high-temperature fluid flow channel between the drain cover and the PCB board. The drain port is used to connect to a local drain pipe, facilitating the entry of coolant from the open end into the drain cover, flowing through the heating element and the heat sink, and quickly flowing out from the drain port to remove heat from the heating element. This invention effectively improves the heat dissipation effect of high-power components such as CPU chips and GPU chips, meeting their heat dissipation requirements, and also helps to reduce the mixing of high and low temperature coolants, thus improving cooling efficiency.

Description

Technical Field

[0001] This invention belongs to the field of server heat dissipation technology, and specifically relates to a single-phase immersion liquid-cooled server heat dissipation structure and cabinet. Background Technology

[0002] With the continuous development of artificial intelligence, high-performance computing, and cloud computing technologies, the thermal design power (TDP) of data center chips is showing a significant upward trend. Traditional air-cooling technology has gradually shown limitations in terms of heat dissipation efficiency and energy efficiency ratio, making it difficult to meet the heat dissipation requirements of high-power-density server racks. Liquid cooling technology, especially immersion liquid cooling technology, has become an important development direction for addressing the aforementioned heat dissipation challenges due to its high thermal conductivity.

[0003] Single-phase immersion liquid cooling technology involves directly immersing heat-generating electronic components in a dielectric coolant with a high boiling point, maintaining a liquid state during circulation. A circulating pump drives the low-temperature coolant through the heat-generating electronic components to absorb sensible heat. The heated liquid is then directed to a coolant distribution unit where it exchanges heat with an external cold source to cool down. The cooled liquid then flows back into the immersion chamber, forming a closed-loop circulation system. This architecture reduces system noise and energy consumption to some extent by eliminating the need for internal fan components in the server.

[0004] However, in actual operating conditions, the heat generated by a single-phase immersion server is highly concentrated in specific high-power components such as the CPU chip and GPU chip, while the heat generated by other auxiliary components is relatively low. Existing single-phase immersion servers generally adopt a rack-type cabinet structure, relying on the overall macroscopic circulation of coolant to remove heat. This is insufficient to meet the heat dissipation requirements of high-power components such as the CPU chip and GPU chip, and also results in low cooling efficiency. Summary of the Invention

[0005] In view of the above-mentioned shortcomings of the existing technology, the purpose of this invention is to provide a single-phase immersion liquid-cooled server heat dissipation structure and cabinet. This invention can effectively improve the heat dissipation effect of high-power components such as central processing unit chips and graphics processing unit chips, meet the heat dissipation requirements of high-power components such as central processing unit chips and graphics processing unit chips, and at the same time help to reduce the mixing of high and low temperature coolants and improve cooling efficiency.

[0006] The technical solution of this invention is implemented as follows:

[0007] A single-phase immersion liquid-cooled server heat dissipation structure includes a server comprising a PCB board, a heating element disposed on the PCB board, and a heat sink disposed on the heating element; a drain cover is provided on the PCB board, the drain cover covering the heat sink and the heating element, and one end of the drain cover is open, the other end opposite the open end is closed, and a drain port is provided at the other end, thereby forming a high-temperature fluid flow channel between the drain cover and the PCB board, the drain port being used to connect a local drain pipe, facilitating the coolant to enter the drain cover from the open end, flow through the heating element and the heat sink, and quickly flow out from the drain port to remove the heat from the heating element.

[0008] Furthermore, the drain cover is detachably mounted on the PCB board.

[0009] Furthermore, a sealing element is provided between the drain cover and the PCB board to ensure the airtightness of the drain cover and the PCB board.

[0010] Furthermore, the heat-generating components include a CPU chip and a GPU chip.

[0011] This invention also provides a single-phase immersion liquid-cooled server cabinet, including a housing, a flow equalization plate and several of the aforementioned single-phase immersion liquid-cooled server heat dissipation structures inside the housing; several liquid passage holes are evenly distributed on the flow equalization plate and are horizontally arranged at the lower part of the housing, thereby dividing the housing into a buffer chamber and a cooling chamber located below and above the flow equalization plate; the side wall of the housing corresponding to the buffer chamber is provided with a liquid inlet for connecting a liquid inlet pipe to introduce coolant; all servers are vertically arranged in the cooling chamber, with the open end of the drain cover facing downwards.

[0012] A liquid outlet is provided on the top side wall of the housing for connecting to a low-temperature liquid outlet pipe to discharge coolant outside all high-temperature fluid channels; a high-temperature liquid outlet pipe is provided horizontally on the top of the housing, and the drain ports of all drain covers are connected to the high-temperature liquid outlet pipe through local drain pipes, with one end of the high-temperature liquid outlet pipe closed and the other end extending out of the housing to discharge coolant inside all high-temperature fluid channels.

[0013] Furthermore, each server is mounted inside the housing via a mounting plate, with the PCB board fixedly connected to the mounting plate, and the upper end of the mounting plate connected to the housing.

[0014] Furthermore, valves are provided on the inlet pipe, the low-temperature outlet pipe, and the high-temperature outlet pipe, and the valves are manual valves or electric valves.

[0015] Furthermore, the local drainage pipe is a flexible pipe or a rigid pipe.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. This invention, by installing a drain cover outside the heat sink of high-power heat-generating components such as central processing unit (CPU) chips and graphics processing unit (GPU) chips, effectively creates a localized high-temperature, high-speed fluid channel on the surface of these components. On one hand, the drain cover reduces the flow cross-section of the coolant, significantly increasing the local flow velocity of the coolant across the surface of the heat-generating components while maintaining a constant total coolant flow rate. This improves heat exchange efficiency and enhances the heat dissipation efficiency of the heat-generating components. On the other hand, the drain cover physically isolates the high-temperature coolant absorbing heat from the heat-generating components from the remaining low-temperature coolant within the cabinet, preventing mixing and effectively improving cooling efficiency while reducing the energy consumption of external cooling sources.

[0018] 2. The drain cover of the present invention can be detachably installed on the PCB board of the server, which facilitates quick disassembly of the drain cover for server maintenance and replacement, and also facilitates the selection of appropriate drain covers according to different models or layouts of heating elements. Attached Figure Description

[0019] Figure 1 -Schematic diagram of the motherboard described in this invention Figure 1 .

[0020] Figure 2-Figure 1 Exploded view.

[0021] Figure 3 -Schematic diagram of the motherboard described in this invention Figure 2 .

[0022] Figures 4-3 Exploded view.

[0023] Figure 5 - A schematic diagram of the structure of the server described in this invention.

[0024] Figure 6 - An internal schematic diagram of the server described in this invention.

[0025] Wherein: 1-Drainage cover; 2-Local drainage pipe; 3-PCB board; 4-Radiator; 5-Fixing plate; 6-Shell; 7-High temperature outlet pipe; 8-Low temperature outlet pipe; 9-Inlet pipe; 10-Flow equalization plate; 11-Buffer chamber; 12-Cooling chamber; 13-Valve. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to represent selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0027] It should be noted that similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the figures, or the orientation or positional relationship commonly used when the product is in use. They are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. In addition, the terms "horizontal," "vertical," etc., do not indicate that the component is required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted. In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0028] While single-phase immersion servers eliminate the fan assembly, reducing operating noise and energy consumption to some extent, in actual operation, the heat generated by a single-phase immersion server is highly concentrated in specific high-power components such as the CPU and GPU chips, while the heat generated by other auxiliary components is relatively low. Existing single-phase immersion servers generally adopt a rack-type cabinet structure, relying on the overall macroscopic circulation of coolant to remove heat. This overall circulation mode is insufficient for achieving efficient localized enhanced heat transfer for the aforementioned high-heat-generating components, failing to meet the heat dissipation requirements of high-power components such as the CPU and GPU chips, and the severe mixing of high and low temperature coolant at the outlet leads to low cooling utilization.

[0029] Based on this, the present invention provides a single-phase immersion liquid-cooled server heat dissipation structure, see [link to relevant documentation]. Figures 1-4 The heat dissipation structure includes a server, which includes a PCB board 3, a heating element disposed on the PCB board 3, and a heat sink 4 disposed on the heating element. A drain cover 1 is provided on the PCB board 3, which covers the heat sink 4 and the heating element. One end of the drain cover 1 is open, and the other end opposite to the open end is closed, with a drain port at the other end, thereby forming a high-temperature fluid flow channel between the drain cover 1 and the PCB board 3. The drain port is used to connect to a local drain pipe 2, so that coolant can enter the drain cover 1 from the open end, flow through the heating element and the heat sink, and quickly flow out from the drain port to remove the heat from the heating element.

[0030] By installing a drain shroud outside the heatsink, a localized high-temperature fluid channel is created on the surface of the heat-generating components. The drain shroud reduces the flow cross-section of the coolant, significantly increasing the local flow velocity of the coolant flowing over the server chip surface while maintaining the total coolant flow rate. This improves heat exchange efficiency and enhances the heat dissipation efficiency of the server chips. Simultaneously, this physically isolates the high-temperature coolant absorbing heat from the rest of the coolant in the server rack, preventing mixing and effectively improving cooling efficiency while reducing the energy consumption of the external cooling source. For example, without a drain shroud, the coolant on the CPU and GPU chip surfaces can reach a temperature of 60°C after absorbing heat, while the coolant flowing through low-temperature areas such as memory and capacitors is only about 35°C. When these two coolants mix, the coolant temperature becomes 50°C. If the external cooling source temperature is 25°C, the temperature difference between the coolant and the external cooling source is 25°C. With the drain hood installed, the high-temperature coolant returns directly to the external cold source without mixing with the low-temperature coolant, and the heat exchange temperature difference between it and the external cold source can reach 35°C. In comparison, the heat exchange temperature difference can be increased by 10°C, thereby effectively improving heat exchange efficiency, reducing the operating energy consumption of the refrigeration unit, and increasing cooling efficiency by more than 30%.

[0031] Figure 1 and Figure 3 This refers to the arrangement of the drain cover under different server chip layouts. In this embodiment... Figure 1 and Figure 2 This corresponds to the CPU server chip. Figure 3 and Figure 4 This corresponds to GPU server chips. However, in practical applications, the arrangement of server chips is not limited to the two methods mentioned above. Drainage covers can be set up according to actual needs.

[0032] In practice, the drain cover 1 is detachably mounted on the PCB board 3.

[0033] Here, the drain cover is detachably mounted on the PCB board. When the server's heat-generating components or heat sinks need maintenance or replacement, the drain cover can be removed for operation, avoiding the need to replace the entire motherboard due to damage to the heat-generating components or heat sinks. Furthermore, a suitable drain cover can be selected based on the model or layout of the heat-generating components. For the detachable drain cover, a connecting plate with mounting holes can be installed on the edge of the drain cover, and studs can be provided on the PCB board for bolt fixation. Alternatively, a clip can be installed on the drain cover, and a corresponding slot on the PCB board can be used for snap-fit ​​attachment. Another option is to have a magnet on the drain cover and a metal suction cup on the PCB board for magnetic fixation. Of course, to ensure a tight seal between the drain cover and the PCB board, a sealing gasket can be placed between them.

[0034] In practice, the heat-generating components include, but are not limited to, CPU chips and GPU chips. When other chips also generate significant heat, a drain cover can be installed.

[0035] This invention also provides a single-phase immersion liquid-cooled server rack, see [link to relevant documentation]. Figures 1-6 The system includes a cabinet 6, which contains a flow equalization plate 10 and several single-phase immersion liquid-cooled server heat dissipation structures as described above. The flow equalization plate 10 has several liquid passage holes evenly distributed on it and is horizontally arranged at the lower part of the housing 6, thereby dividing the housing 6 into a buffer chamber 11 located below and above the flow equalization plate 10 and a cooling chamber 12 located above and below the flow equalization plate 10. The side wall of the housing corresponding to the buffer chamber 11 is provided with a liquid inlet for connecting the liquid inlet pipe 9 to introduce coolant. All servers are vertically arranged in the cooling chamber 12, with the open end of the drain cover 1 facing downwards.

[0036] A liquid outlet is provided on the top side wall of the housing 6 for connecting to the low-temperature liquid outlet pipe 8 to discharge the coolant outside all high-temperature fluid channels; a horizontal high-temperature liquid outlet pipe 7 is provided on the top of the housing 6, and the liquid outlets of all drain covers 1 are connected to the high-temperature liquid outlet pipe 7 through the local drain pipe 2, and one end of the high-temperature liquid outlet pipe 7 is closed and the other end extends out of the housing 6 to discharge the coolant in all high-temperature fluid channels.

[0037] In practice, each server motherboard is mounted inside the housing 6 via a mounting plate 5. The PCB board is fixedly connected to the mounting plate 6, and the upper end of the mounting plate 6 is connected to the top of the housing 6. Specifically, the PCB board is fixedly connected to the mounting plate with screws. All mounting plates are arranged horizontally and longitudinally along the rack. The upper end of the mounting plate has two outwardly extending overlapping lugs. Correspondingly, the corresponding side walls of the housing have overlapping grooves. The mounting plates overlap into the overlapping grooves through the overlapping lugs, thereby allowing the server to be mounted inside the rack.

[0038] Meanwhile, valves 13 are installed on the inlet pipe, the cryogenic outlet pipe, and the high-temperature outlet pipe to control the opening and closing of the corresponding pipes and their degree of opening. These valves are neither manual nor electric.

[0039] In practice, the local drainage pipe 2 can be a flexible pipe or a rigid pipe. When it is a flexible pipe, it is easier to disassemble.

[0040] The single-phase immersion liquid-cooled server rack described in this invention allows coolant to enter the rack through the inlet pipe. After passing through the buffer chamber and the flow equalization plate, the coolant flows from bottom to top at a uniform flow rate. Part of the coolant enters the high-temperature fluid channel and quickly flows through the heat-generating elements and radiators, carrying away the heat from the heat-generating elements. It is then discharged from the rack through the local drain pipe and the high-temperature outlet pipe. Part of the coolant flows through the area outside the high-temperature fluid channel, carrying away the heat from devices with low heat generation, and is discharged from the rack through the low-temperature outlet pipe.

[0041] Finally, it should be noted that the above embodiments of the present invention are merely illustrative examples and not intended to limit the implementation of the invention. Those skilled in the art can make other variations and modifications based on the above description. It is impossible to exhaustively list all possible implementations here. All obvious variations or modifications derived from the technical solutions of this invention are still within the scope of protection of this invention.

Claims

1. A single-phase immersion liquid-cooled server heat dissipation structure, comprising a server including a PCB board, a heat-generating element disposed on the PCB board, and a heat sink disposed on the heat-generating element; characterized in that, A drain cover is provided on the PCB board, which covers the heat sink and the heating element. One end of the drain cover is open, and the other end opposite the open end is closed, with a drain port at the other end, thereby forming a high-temperature fluid flow channel between the drain cover and the PCB board. The drain port is used to connect a local drain pipe, so that the coolant can enter the drain cover from the open end, flow through the heating element and the heat sink, and quickly flow out from the drain port to remove the heat from the heating element.

2. The heat dissipation structure for a single-phase immersion liquid-cooled server according to claim 1, characterized in that, The drain cover is detachably mounted on the PCB board.

3. The heat dissipation structure for a single-phase immersion liquid-cooled server according to claim 2, characterized in that, A sealing element is installed between the drain cover and the PCB board to ensure the airtightness of the drain cover and the PCB board.

4. The heat dissipation structure for a single-phase immersion liquid-cooled server according to claim 1, characterized in that, The heat-generating components include a CPU chip and a GPU chip.

5. A single-phase immersion liquid-cooled server rack, comprising a housing, characterized in that, The housing is provided with a flow equalization plate and several single-phase immersion liquid-cooled server heat dissipation structures as described in any one of claims 1-4; several liquid passage holes are evenly distributed on the flow equalization plate and are horizontally arranged in the lower part of the housing, thereby dividing the housing into a buffer chamber and a cooling chamber located below and above the flow equalization plate; the side wall of the housing corresponding to the buffer chamber is provided with a liquid inlet for connecting a liquid inlet pipe to introduce coolant; all servers are vertically arranged in the cooling chamber, and the open end of the drain cover faces downward; A liquid outlet is provided on the top side wall of the housing for connecting to a low-temperature liquid outlet pipe to discharge coolant outside all high-temperature fluid channels; a high-temperature liquid outlet pipe is provided horizontally on the top of the housing, and the drain ports of all drain covers are connected to the high-temperature liquid outlet pipe through local drain pipes, with one end of the high-temperature liquid outlet pipe closed and the other end extending out of the housing to discharge coolant inside all high-temperature fluid channels.

6. A single-phase immersion liquid-cooled server rack according to claim 5, characterized in that, Each server is mounted inside the housing via a mounting plate. The PCB board is fixedly connected to the mounting plate, and the upper end of the mounting plate is connected to the housing.

7. A single-phase immersion liquid-cooled server rack according to claim 5, characterized in that, Valves are provided on the inlet pipe, the low-temperature outlet pipe, and the high-temperature outlet pipe. The valves are manual valves or electric valves.

8. A single-phase immersion liquid-cooled server rack according to claim 1, characterized in that, The local drainage pipe can be a flexible pipe or a rigid pipe.

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