Circuit board assembly and electronic device

Abstract

Provided in the present application are a circuit board assembly and an electronic device. The circuit board assembly comprises a circuit board, a component, a support frame and a heat dissipation plate. The component and the support frame are fixed to the same surface of the circuit board. In the thickness direction of the circuit board, the surface of the support frame facing away from the circuit board is used for supporting the heat dissipation plate. The support frame comprises a penetrating through hole, and the through hole is used for allowing the component to extend into and make contact with the heat dissipation plate, or the through hole is used for allowing the component to extend into and be thermally connected to the heat dissipation plate by means of a thermally conductive layer. In the circuit board assembly of the present application, the through hole is arranged on the support frame, such that the component can extend into the through hole and be thermally connected to the heat dissipation plate, thereby avoiding impact of the support frame on the dimension between the heat dissipation plate and the component, and facilitating miniaturization of the circuit board assembly of the present application.

Description

Circuit board assemblies and electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202423017008.7, filed on December 5, 2024, entitled "Circuit Board Assembly and Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic technology, specifically to a circuit board assembly and an electronic device. Background Technology

[0003] When a circuit board assembly dissipates heat from its components via a heatsink, a support frame is used to fix the heatsink to the circuit board. The support frame needs to have a certain contact area with the heatsink to ensure reliable support. However, the support frame increases the overall thickness of the circuit board assembly, which is detrimental to the miniaturization of electronic devices. Summary of the Invention

[0004] This application provides a circuit board assembly and an electronic device. By placing a support frame around the components, the heat sink can be attached to the components through a thermally conductive layer or directly to the components, thereby reducing the distance between the heat sink and the circuit board and facilitating miniaturization.

[0005] In a first aspect, this application provides a circuit board assembly, which includes a circuit board, components, a support frame and a heat sink. The components and the support frame are fixed to the same surface of the circuit board. Along the thickness direction of the circuit board, the support frame is away from the surface of the circuit board to support the heat sink.

[0006] The support frame includes through holes for allowing components to extend into and contact the heat sink, or for allowing components to extend into and thermally connect to the heat sink through a thermally conductive layer.

[0007] The circuit board assembly provided in this application supports the heat sink by setting a support frame. The circuit board assembly also allows the heat sink to be directly attached to components or attached to components through a thermally conductive layer by providing through holes in the support frame. The thickness of the support frame does not increase the distance between the components and the heat sink, which helps to reduce the stack-up thickness between the heat sink and the circuit board, thus achieving miniaturization of the circuit board assembly of this application.

[0008] In one implementation, the support frame includes a support plate and a connector. The connector is disposed between the support plate and the circuit board along the thickness direction of the circuit board. A through hole is located on the support plate. The support plate is used to support the heat sink, and the connector is used to fix the support plate and the circuit board together.

[0009] In one implementation, along the thickness direction of the circuit board, the surface area of ​​the support plate away from the connector is greater than the surface area of ​​the connector away from the support plate.

[0010] In this implementation, the support plate is fixed to the surface of the heat sink facing the circuit board. The contact area between the support plate and the heat sink is greater than the contact area between the connector and the circuit board, thereby ensuring a relatively large contact area between the heat sink and the support frame, and ensuring that the support frame reliably supports the heat sink.

[0011] In one implementation, the supporting frame is made of one of stainless steel, titanium alloy, or diamond aluminum.

[0012] In one implementation, the elastic modulus of the support frame is greater than or equal to 110 GPa.

[0013] In one implementation, along the thickness direction of the circuit board, the surface of the support plate facing the connector is lower than the surface of the component away from the circuit board.

[0014] In this implementation, the support plate and the components partially overlap along the thickness direction of the circuit board, and the ends of the components away from the circuit board along the thickness direction of the circuit board are housed in through holes, making the structure of the circuit board assembly of this application more compact and conducive to the miniaturization of the circuit board assembly of this application.

[0015] In one implementation, the distance between the components and the heat sink is less than or equal to 0.05 mm along the thickness direction of the circuit board.

[0016] In this implementation, along the thickness direction of the circuit board, the distance between the surface of the component facing the heat sink and the surface of the heat sink facing the component is less than or equal to 0.05 mm.

[0017] In one implementation, the connector includes a leg that extends out of a support plate along the plane of the circuit board and is threadedly connected to the circuit board by bolts.

[0018] In this implementation, along the plane of the circuit board, the support leg extends out of the support plate to expose the positioning hole on the support leg, so that the bolt can be inserted into the positioning hole and the threaded hole on the circuit board in sequence to realize the threaded connection between the support leg and the circuit board.

[0019] In one implementation, the number of legs is at least three, and the at least three legs are distributed around the outer edge of the support plate.

[0020] In this implementation, at least three feet are spaced apart on the outer edge of the support plate to provide reliable support for the support plate, thereby providing reliable support for the heat sink by the connector.

[0021] In one implementation, each leg includes a positioning hole, and the circuit board includes multiple threaded holes. Each positioning hole is used to align with a threaded hole, and each bolt passes through the positioning hole and is threadedly connected to the threaded hole. The center of gravity of the closed shape formed by connecting the centers of the threaded holes along the plane of the circuit board is located on the component.

[0022] In this implementation, since each support foot is subjected to clamping force during the threaded connection with the circuit board, the center of gravity of the closed shape formed by connecting the centers of each threaded hole is set on the component. This allows the resultant force of the clamping force on each support foot to act on the component, thereby making the heat sink relatively uniformly stressed in the area where the component is located.

[0023] In one implementation, the connector includes multiple snap-fits and multiple retainers. The multiple snap-fits are fixed to a support plate, and the multiple retainers are fixed to a circuit board. Each snap-fit ​​is used to engage a retainer to securely connect the support plate and the circuit board.

[0024] In this implementation, along the thickness direction of the circuit board, the projection of the heat sink onto the circuit board covers multiple clips and multiple slots. Each clip is fixed to one slot to achieve a fixed connection between the support plate and the circuit board. The matching arrangement of multiple clips and multiple slots ensures reliable support of the heat sink by the support frame.

[0025] In one implementation, along a first direction, a latch and a base that are interlocked are located on one side of the component, and another latch and another base that are interlocked are located on the other side of the component. The distance between the two latches is greater than the distance between the two bases, and the first direction is parallel to the plane of the circuit board.

[0026] In this implementation, along the first direction, the surface of each latch facing the component is used to engage with the surface of each card holder facing away from the component. Since other components are usually arranged on the circuit board, placing two card holders between the two latches can reduce the distance between each card holder and the component, reduce the impact of the support frame on the arrangement of other components on the circuit board, and facilitate a compact arrangement of the components on the circuit board.

[0027] In one implementation, along the thickness direction of the circuit board, the buckle includes two opposing ends, one end of which includes a first engaging portion and the other end includes a first bent portion. The buckle engages with the card holder via the first engaging portion and is fixed to the support plate via the first bent portion.

[0028] In one implementation, along the thickness direction of the circuit board, the card holder includes two opposing ends, one end of which includes a second latching portion, and the other end includes a second bending portion. The card holder latches the first latching portion of the buckle through the second latching portion, and the second bending portion conforms to and supports the first bending portion.

[0029] In both implementations described above, the second bend is used to fit and support the first bend. The second bend, by fitting with the first bend, limits the displacement of the buckle relative to the card holder during engagement. The fitting of the first and second bends increases the contact area between the card holder and the buckle, thereby enhancing the connection strength between the support plate and the circuit board.

[0030] In one implementation, there are at least three card holders and the number of clips is equal to the number of card holders. The at least three card holders are distributed around the outer edge of the component. The center of gravity of the closed shape formed by the sequential connection of the geometric centers of the projections of the second contact portion of each card holder on the circuit board is located inside the component.

[0031] In this implementation, since the buckles are subjected to clamping force during the snap-fit ​​process, the center of gravity of the closed shape formed by connecting the geometric centers of the projections of the second snap-fit ​​parts of each buckle on the circuit board is set on the component. This allows the resultant force of the clamping force on each buckle to act on the component, thereby making the heat sink relatively uniformly stressed in the area where the component is located.

[0032] In one implementation, along the thickness direction of the circuit board, the minimum distance between the first latching portion and the first bending portion is less than or equal to 0.5 mm, and the minimum distance between the second latching portion and the second bending portion is equal to the minimum distance between the first latching portion and the first bending portion.

[0033] In this implementation, after the buckle and the holder are engaged, the first bent portion and the second bent portion fit together. During the engagement process, the smaller the minimum distance between the first engaging portion and the first bent portion, the smaller the relative displacement of the buckle and the holder during engagement, and correspondingly, the smaller the clamping force on the buckle. By limiting the minimum distance between the first engaging portion and the first bent portion to less than or equal to 0.5mm, it is possible to avoid excessive clamping force on the heat sink due to an excessively large minimum distance, which could lead to deformation or damage to the heat sink.

[0034] In one implementation, the connector further includes a first connecting plate and a second connecting plate. The first connecting plate surrounds the outer edge of the support plate and the component. Various clips are spaced apart along the plane of the circuit board on the surface of the first connecting plate facing the component. The second connecting plate is fixed to the surface of the circuit board where the component is located and surrounds the outer edge of the component. Various brackets are spaced apart along the plane of the circuit board on the surface of the second connecting plate facing away from the component. The sum of the heights of the first and second connecting plates along the thickness direction of the circuit board is greater than the distance between the support plate and the circuit board.

[0035] In this implementation, along the plane of the circuit board, both the first and second connecting plates are annular. The first connecting plate surrounds the second connecting plate and the components, while the second connecting plate surrounds the components. During the assembly of the circuit board assembly in this application, the second connecting plate extends into the first connecting plate, allowing the clips on the first connecting plate to engage with the corresponding slots on the second connecting plate, thus achieving a fixed connection between the support plate and the circuit board. The first and second connecting plates also cooperate with the heat sink and circuit board to enclose the components, preventing damage to the components.

[0036] In one embodiment, the distance between any two adjacent clips along the plane of the circuit board is greater than or equal to 5 mm.

[0037] In one implementation, both the first connecting plate and the second connecting plate are made of metallic materials.

[0038] In this implementation, the first connecting plate and the second connecting plate are used together to achieve electromagnetic shielding of the components.

[0039] In one implementation, the heat sink includes a housing with cavities for accommodating phase change material.

[0040] In this implementation, during the operation of the circuit board assembly, the heat generated by the components can be transferred to the heat sink via the thermally conductive layer, or the heat generated by the components can be directly transferred to the heat sink. The heat sink's housing is used to transfer the heat generated by the components to the phase change material, which absorbs the heat through its own phase change. This achieves the heat dissipation function of the heat sink.

[0041] In one implementation, the ratio of the thickness of the support plate to the wall thickness of the cavity is greater than or equal to 3 along the thickness direction of the circuit board.

[0042] In this implementation, a support plate is used to support the heat sink. Setting the thickness of the support plate to be greater than or equal to three times the cavity wall thickness helps to ensure reliable support of the heat sink by the support frame.

[0043] In one implementation, the thickness of the support plate is greater than or equal to 0.15 mm along the thickness direction of the circuit board. And / or, the thickness of the support plate is less than or equal to 0.25 mm along the thickness direction of the circuit board.

[0044] In one implementation, the distance between the surface of the support plate facing the circuit board and the circuit board along the thickness direction is greater than or equal to 0.5 mm.

[0045] In one implementation, the heat sink further includes heat dissipation fins, which are fixed to the housing of the heat sink and spaced apart from the support frame along the plane of the circuit board.

[0046] In this implementation, the heat dissipation fins are used to absorb the heat absorbed by the phase change material and dissipate that heat to the outside.

[0047] In one implementation, the circuit board assembly further includes a second component, which is arranged at intervals on the circuit board along the planar direction of the circuit board and is lower than the components along the thickness direction of the circuit board. The projection of the support frame on the circuit board accommodates the second component.

[0048] In this implementation, along the thickness direction of the circuit board, the support plate utilizes the height difference between the surface of the support plate facing the circuit board and the second component, so that the projection of the support plate on the circuit board covers the second component, thereby increasing the contact area between the support plate and the heat sink and ensuring that the support frame reliably supports the heat sink.

[0049] In one implementation, the distance between the support plate and the second component is greater than or equal to 0.3 mm along the thickness direction of the circuit board.

[0050] In one implementation, the circuit board assembly further includes a third component, which is spaced apart from other components on the circuit board along its planar direction. The height of the third component along the thickness direction of the circuit board is greater than the distance between the support frame's surface facing away from the circuit board and the circuit board itself. The support frame includes a through-hole, spaced apart from other through-holes. The heat sink includes through-holes with clearance holes aligned to allow the third component to extend into both the through-holes and clearance holes.

[0051] In this implementation, the support plate and the third component partially overlap along the thickness direction of the circuit board. The ends of the third component facing away from the circuit board are respectively housed in the second through hole and the clearance hole, which is beneficial to the miniaturization of the circuit board assembly of this application. Since the height dimension of the third component is larger than the height dimension of the component, the clearance hole is used to avoid interference between the heat sink and the third component.

[0052] In one implementation, the third component is higher than the height dimension of the heat sink along the thickness direction of the circuit board.

[0053] In one implementation, the circuit board assembly further includes a fourth component. The fourth component is spaced apart from other components on the circuit board along its planar direction. Along the thickness direction of the circuit board, the fourth component is higher than the height of the support frame, and its height is lower than the distance between the surface of the heat sink facing away from the circuit board and the circuit board. The support frame includes a third through-hole for partially exposing the surface of the heat sink facing the circuit board. The surface of the heat sink exposed relative to the support frame includes a second recessed hole. Along the thickness direction of the circuit board, the depth of the second recessed hole is less than the thickness of the heat sink. The second recessed hole is aligned with the third through-hole to allow the fourth component to extend into it.

[0054] In this implementation, along the thickness direction of the circuit board, the distance between the bottom of the second clearance hole and the circuit board is greater than the height of the fourth component. The end of the fourth component facing away from the circuit board is respectively housed in the third through hole and the second clearance hole, which is beneficial to the miniaturization of the circuit board assembly of this application. During the assembly process of the circuit board assembly of this application, the fourth component is used to pass through the support plate and extend into the clearance hole.

[0055] In one implementation, the circuit board assembly further includes a fifth component, which is arranged at intervals on the circuit board along the planar direction of the circuit board. Along the thickness direction of the circuit board, the surface of the fifth component facing away from the circuit board is higher than the surface of the support frame facing the circuit board. The height dimension of the fifth component is smaller than the distance between the surface of the support frame facing away from the circuit board and the circuit board. The support frame includes a fourth through hole for allowing the fifth component to extend into it.

[0056] In this implementation, the support plate and the fifth component partially overlap along the thickness direction of the circuit board, and the end of the fifth component away from the circuit board is housed in the fourth through hole, which is beneficial to the miniaturization of the circuit board assembly of this application.

[0057] In one implementation, the minimum spacing between any two of the components, the third component, the fourth component, and the fifth component along the plane of the circuit board is greater than or equal to 5 mm.

[0058] In one implementation, the minimum size of the support plate between any two of the components, the third component, the fourth component, and the fifth component along the plane of the circuit board is greater than or equal to 3 mm.

[0059] In one implementation, the circuit board assembly further includes a second thermally conductive layer, through which the heat sink is thermally connected to at least one of the second, fourth, and fifth components.

[0060] In one implementation, the material of the second thermally conductive layer is the same as that of the thermally conductive layer.

[0061] In one implementation, the thermally conductive layer includes a thermally conductive pad filled with a phase change material.

[0062] In one implementation, the thermally conductive layer includes thermally conductive adhesive.

[0063] In one implementation, a support plate has a protrusion on its surface facing the circuit board, and the protrusion surrounds the outer edge of the component. Along the thickness direction of the circuit board, the end of the protrusion away from the heat sink is sealed to the component with conductive foam to achieve electromagnetic shielding of the component.

[0064] In a second aspect, an electronic device includes a housing and a circuit board assembly, the circuit board assembly being housed within the housing.

[0065] The electronic device of this application, by including the circuit board assembly provided in any of the above implementations, has a reduced spacing between the heat sink and the components, which is beneficial for miniaturization. At the same time, the heat sink is thermally connected to or in contact with the components through a thermally conductive layer, improving heat dissipation efficiency. Attached Figure Description

[0066] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0067] Figure 1 is a schematic diagram of the external structure of the circuit board assembly provided in an embodiment of this application;

[0068] Figure 2 is an exploded view of the circuit board assembly provided in an embodiment of this application;

[0069] Figure 3 is a side view of the circuit board assembly provided in an embodiment of this application;

[0070] Figure 4 is a partial cross-sectional view of the circuit board assembly provided in an embodiment of this application;

[0071] Figure 5 is another partial cross-sectional view of the circuit board assembly provided in an embodiment of this application.

[0072] Figure 6 is a partially enlarged structural schematic diagram of the circuit board assembly provided in an embodiment of this application;

[0073] Figure 7 is a partial top view of the circuit board assembly provided in an embodiment of this application;

[0074] Figure 8 is another partially enlarged structural schematic diagram of the circuit board assembly provided in the embodiment of this application;

[0075] Figure 9 is a top view of the circuit board assembly provided in an embodiment of this application;

[0076] Figure 10 is another partial top view of the circuit board assembly provided in an embodiment of this application;

[0077] Figure 11 is a schematic diagram of another external structure of the circuit board assembly provided in an embodiment of this application;

[0078] Figure 12 is another exploded structural diagram of the circuit board assembly provided in an embodiment of this application;

[0079] Figure 13 is a schematic diagram of another side of the circuit board assembly provided in the embodiment of this application;

[0080] Figure 14 is another partial cross-sectional view of the circuit board assembly provided in the embodiment of this application;

[0081] Figure 15 is another partially enlarged structural schematic diagram of the circuit board assembly provided in the embodiment of this application;

[0082] Figure 16 is a cross-sectional view of the circuit board assembly provided in an embodiment of this application;

[0083] Figure 17 is another partial cross-sectional view of the circuit board assembly provided in the embodiment of this application;

[0084] Figure 18 is a cross-sectional view of the heat sink and part of the support frame in the circuit board assembly provided in the embodiment of this application;

[0085] Figure 19 is a bottom view of the heat sink and part of the support frame in the circuit board assembly provided in the embodiment of this application;

[0086] Figure 20 is a cross-sectional view of the circuit board and another supporting frame in the circuit board assembly provided in the embodiment of this application;

[0087] Figure 21 is a top view of the circuit board and another supporting frame in the circuit board assembly provided in the embodiment of this application;

[0088] Figure 22 is a partial cross-sectional view of the internal components of the circuit board assembly provided in the embodiment of this application;

[0089] Figure 23 is another bottom view of the heat sink and part of the support frame in the circuit board assembly provided in the embodiment of this application;

[0090] Figure 24 is a top view of another structural diagram of the circuit board and another part of the support frame in the circuit board assembly provided in the embodiment of this application;

[0091] Figure 25 is a schematic cross-sectional view of the connection between the heat sink and the support plate in the circuit board assembly provided in the embodiment of this application.

[0092] Figure 26 is another cross-sectional structural diagram of the circuit board assembly provided in the embodiment of this application;

[0093] Figure 27 is a schematic diagram of the arrangement structure of components and second components on the circuit board in the circuit board assembly provided in the embodiment of this application;

[0094] Figure 28 is another cross-sectional structural schematic diagram of the circuit board assembly provided in the embodiment of this application;

[0095] Figure 29 is a schematic diagram of the arrangement of components, second components and third components on the circuit board in the circuit board assembly provided in the embodiment of this application;

[0096] Figure 30 is a partial top view of the circuit board assembly provided in an embodiment of this application;

[0097] Figure 31 is a top view of the circuit board assembly provided in an embodiment of this application;

[0098] Figure 32 is another cross-sectional view of the circuit board assembly provided in the embodiment of this application;

[0099] Figure 33 is a cross-sectional schematic diagram of the circuit board assembly provided in an embodiment of this application;

[0100] Figure 34 is a schematic diagram of the arrangement structure of the components, second components, third components and fourth components on the circuit board in the circuit board assembly provided in the embodiment of this application;

[0101] Figure 35 is a top view of another part of the circuit board assembly provided in the embodiment of this application;

[0102] Figure 36 is another cross-sectional view of the circuit board assembly provided in an embodiment of this application;

[0103] Figure 37 is a schematic diagram of the arrangement structure of the components, second components, third components, fourth components and fifth components on the circuit board in the circuit board assembly provided in the embodiment of this application;

[0104] Figure 38 is a top view of another part of the circuit board assembly provided in the embodiment of this application;

[0105] Figure 39 is another cross-sectional view of the circuit board assembly provided in the embodiment of this application;

[0106] Figure 40 is another cross-sectional view of the circuit board assembly provided in the embodiment of this application;

[0107] Figure 41 is a schematic diagram of the connection structure between the support plate and the circuit board in the circuit board assembly provided in the embodiment of this application. Detailed Implementation

[0108] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0109] This application provides an electronic device including a housing and a circuit board assembly. The housing houses and protects the circuit board assembly. The circuit board assembly processes received instructions and, based on these instructions, controls modules of the electronic device to perform corresponding functions. In embodiments of this application, the electronic device provided can be a computer, a mobile phone, a tablet, or a wearable device.

[0110] Please refer to Figures 1-4, where Figure 1 is a schematic diagram of the external structure of the circuit board assembly 100 provided in an embodiment of this application. Figure 2 is an exploded structural diagram of the circuit board assembly 100 provided in an embodiment of this application. Figure 3 is a side structural diagram of the circuit board assembly 100 provided in an embodiment of this application. Figure 4 is a partial cross-sectional structural diagram of the circuit board assembly 100 provided in an embodiment of this application. For ease of description, Figure 4 is only used to illustrate the cross-sectional structural diagram of the area selected by the dashed line in Figure 3.

[0111] As shown in Figures 1-4, the circuit board assembly 100 of this application includes a circuit board 10, components 21, and a heat sink 30, which are stacked on the circuit board 10. Specifically, along the thickness direction of the circuit board 10, the components 21 are fixed to the circuit board 10, and the heat sink 30 is located on the side of the components 21 away from the circuit board 10, and is used for thermally connecting the components 21. In the embodiments of this application, when the components 21 are working, the heat generated by the components 21 can be transferred to the heat sink 30, which absorbs the heat conducted by the components 21 and dissipates it outward, thereby achieving heat dissipation for the components 21. This achieves the heat dissipation function of the circuit board assembly 100 of this application. In one embodiment, the heat sink 30 is a vapor chamber (VC). In another embodiment, the heat sink 30 can also be other structures with heat dissipation function, which are not particularly limited in this application.

[0112] In one embodiment, as shown in FIG. 4, the circuit board assembly 100 of this application further includes a thermally conductive layer 40, which fills the space between the heat sink 30 and the component 21 along the thickness direction of the circuit board 10. That is, the heat sink 30 is thermally connected to the component 21 through the thermally conductive layer 40. When the component 21 is working, the heat generated by the component 21 can be transferred to the heat sink 30 through the thermally conductive layer 40 and dissipated outward from the heat sink 30.

[0113] In one embodiment, along the thickness direction of the circuit board 10, the surface of the heat sink 30 facing the circuit board 10 is used to attach the component 21. In this embodiment, the attachment of the heat sink 30 to the component 21 can be direct or indirect.

[0114] For example, please refer to Figure 5, which shows another partial cross-sectional view of the circuit board assembly 100 provided in an embodiment of this application.

[0115] As shown in Figure 5, the heat sink 30 achieves thermal conductivity with the component 21 through direct contact. When the component 21 is working, the heat generated by the component 21 can be transferred to the heat sink 30 and dissipated outwards by the heat sink 30, thereby achieving heat dissipation for the component 21.

[0116] In one embodiment, as shown in Figures 4 and 5, the circuit board assembly 100 of this application further includes a support frame 50, which is located between the circuit board 10 and the heat sink 30 along the thickness direction of the circuit board 10. The support frame 50 includes a through hole 511. As shown in Figure 4, the through hole 511 allows the component 21 to extend into and contact the heat sink 30 through the thermally conductive layer 40. As shown in Figure 5, the through hole 511 allows the component 21 to extend into and directly contact the heat sink 30.

[0117] During the assembly of the circuit board assembly 100 in this application, the component 21 can extend into the through hole 511. It is understood that the through hole 511 allows the component 21, the thermally conductive layer 40, and the heat sink 30 to be stacked sequentially on the surface of the circuit board 10, facilitating the contact between the heat sink 30 and the component 21 via the thermally conductive layer 40, or facilitating direct contact between the heat sink 30 and the component 21. This facilitates heat dissipation from the heat sink 30 to the component 21, thus achieving the heat dissipation function of the circuit board assembly 100 in this application.

[0118] In this embodiment, the greater the stacking thickness between the circuit board 10 and the heat sink 30, the greater the overall thickness of the circuit board assembly 100. The circuit board assembly 100, by providing through holes 511 on the support frame 50, allows the support frame 50 to avoid the component 21, and allows the component 21 to directly or indirectly contact the heat sink 30 through the through holes 511.

[0119] When component 21 is in direct contact with heat sink 30, the gap between component 21 and heat sink 30 disappears. At this time, the overall thickness of circuit board assembly 100 is equal to the sum of the height of component 21, the thickness of heat sink 30, and the thickness of circuit board 10. That is, the setting of support frame 50 does not affect the overall size of circuit board assembly 100 of this application.

[0120] When component 21 is in indirect contact with heat sink 30, the distance between component 21 and heat sink 30 is only related to the thickness of thermally conductive layer 40. At this time, the overall thickness of circuit board assembly 100 is equal to the sum of the height of component 21, the thickness of thermally conductive layer 40, the thickness of heat sink 30, and the thickness of circuit board 10. That is, the arrangement of support frame 50 does not affect the overall size of circuit board assembly 100 of this application.

[0121] Therefore, in this application, the circuit board assembly 100, while ensuring the supporting function of the support frame 50 for the heat sink 30, provides through holes 511 on the support frame 50. This allows the components 21 to achieve thermally conductive connection with the heat sink 30 through the through holes 511, thus ensuring that the thickness of the support frame 50 does not increase the distance between the components 21 and the heat sink 30, which is beneficial for reducing the stacking thickness between the heat sink 30 and the circuit board 10. This achieves the miniaturization of the circuit board assembly 100 of this application.

[0122] In one embodiment, the support frame 50 includes a support plate 52 and a connector 53. The connector 53 is disposed between the support plate 52 and the circuit board 10 along the thickness direction of the circuit board 10. A through hole 511 is located on the support plate 52. The support plate 52 is used to support the heat sink 30, and the connector 53 is used to fix the support plate 52 and the circuit board 10.

[0123] As shown in Figures 4 and 5, the support plate 52 is fixed to the surface of the heat sink 30 facing the circuit board 10, and the connector 53 is fixedly connected to the circuit board 10. During the assembly of the circuit board assembly 100 of this application, as the connector 53 is fixedly connected to the circuit board 10, the connector 53 will exert a clamping force in conjunction with the circuit board 10. At this time, the clamping force is transmitted to the heat sink 30 through the support plate 52, ensuring reliable adhesion between the heat sink 30 and the thermally conductive layer 40, making the structure of the circuit board assembly 100 of this application more compact and facilitating the miniaturization of the circuit board assembly 100 of this application.

[0124] In one embodiment, along the thickness direction of the circuit board 10, the surface area of ​​the support plate 52 away from the connector 53 is greater than the surface area of ​​the connector 53 away from the support plate 52.

[0125] As shown in Figures 4 and 5, the support frame 50 includes a first surface 50a and a second surface 50b facing away from each other. Along the thickness direction of the circuit board 10, the surface of the support frame 50 facing the circuit board 10 is the first surface 50a, which is used to adhere to the circuit board 10. That is, the surface of the support plate 52 facing away from the connector 53 is the first surface 50a, which is used to directly or indirectly adhere to the circuit board 10. A through hole 511 is provided on the first surface 50a and penetrates the support plate 52, so as to partially expose the surface of the heat sink 30 facing the circuit board 10. This facilitates the insertion of the component 21 into the through hole 511 for thermal connection with the heat sink 30, thereby reducing the thickness of the circuit board assembly 100 and contributing to the miniaturization of the circuit board assembly 100.

[0126] The surface of the support frame 50 that is in contact with the heat sink 30 is the second surface 50b. That is, the surface of the connector 53 that faces away from the support plate 52 and is in direct or indirect contact with the circuit board 10 is the second surface 50b. In this embodiment, the first surface 50a and the second surface 50b of the support frame 50 are used to fix the heat sink 30 to the circuit board 10 and the heat sink 30, respectively.

[0127] As shown in Figures 4 and 5, the area of ​​the first surface 50a is smaller than the area of ​​the second surface 50b. The circuit board assembly 100 of this application achieves reliable support for the heat sink 30 by fixing the second surface 50b of the support frame 50, which has a relatively large area, to the heat sink 30, thereby creating a relatively large contact area between the support frame 50 and the heat sink 30.

[0128] In this embodiment, during the fixed connection between the connector 53 and the circuit board 10, the connector 53 will exert a clamping force in conjunction with the circuit board 10. When the contact area between the heat sink 30 and the support frame 50 is too small, when the clamping force is transmitted to the support plate 52, the clamping force will act on a small contact area between the support plate 52 and the heat sink 30, resulting in a large local clamping force on the heat sink 30. On the one hand, excessive local clamping force may damage the heat sink 30, thereby affecting the heat dissipation efficiency of the heat sink 30. On the other hand, excessive local clamping force may also cause the contact portion between the heat sink 30 and the component 21 to bend away from the circuit board 10, thereby increasing the distance between the contact area between the heat sink 30 and the component 21, and thus affecting the heat dissipation efficiency of the heat sink 30.

[0129] Therefore, by creating a relatively large contact area between the support plate 52 and the heat sink 30, the circuit board assembly 100 of this application allows the clamping force to be relatively dispersed when transmitted to the support plate 52, thereby avoiding deformation or damage to the heat sink 30 due to excessive local clamping force. This ensures the structural integrity of the heat sink 30 and the heat dissipation function of the circuit board assembly 100 of this application.

[0130] In one embodiment, along the thickness direction of the circuit board 10, the height dimension of the support frame 50 is greater than or equal to the height dimension of the component 21.

[0131] Specifically, in one embodiment, as shown in FIG4, along the thickness direction of the circuit board 10, the height dimension of the support frame 50 is greater than the height dimension of the component 21, and the sum of the height dimension of the component 21 and the thickness dimension of the heat-conducting layer 40 is equal to the height dimension of the support frame 50. In another embodiment, as shown in FIG5, along the thickness direction of the circuit board 10, the height dimension of the support frame 50 is equal to the height dimension of the component 21. Correspondingly, the component 21 extends directly into the through hole 511 of the support frame 50 and is directly attached to the heat sink 30. It can be understood that, compared with the embodiment shown in FIG4, the embodiment of this application does not provide a heat-conducting layer 40, and the heat conduction connection between the component 21 and the heat sink 30 is achieved by direct contact between the component 21 and the heat sink 30.

[0132] For ease of description, in the subsequent embodiments and figures of this application, the heat sink 30 is thermally connected to the component 21 through the thermally conductive layer 40. That is, the subsequent embodiments and figures are all based on the thermally conductive connection method between the heat sink 30 and the component 21 shown in Figure 4.

[0133] It is worth noting that in the embodiments of this application and subsequent embodiments, the height dimension of the structure refers to the distance between the surface of the structure facing away from the circuit board 10 and the circuit board 10. For example, the height dimension of the support frame 50 refers to the distance between the second surface 50b of the support frame 50 facing away from the circuit board 10 and the circuit board 10, and the height dimension of the component 21 refers to the distance between the surface of the component 21 facing away from the circuit board 10 and the circuit board 10.

[0134] In one embodiment, the elastic modulus of the support frame 50 is greater than or equal to 110 GPa.

[0135] In one embodiment, the material of the support frame 50 includes stainless steel, titanium alloy, and aluminum alloy.

[0136] In one embodiment, along the thickness direction of the circuit board 10, the surface of the support plate 52 facing the connector 53 is lower than the surface of the component 21 facing away from the circuit board 10.

[0137] Please refer to Figures 6 and 7, where Figure 6 is a partially enlarged structural diagram of the circuit board assembly 100 provided in this embodiment, and Figure 7 is a partially top view structural diagram of the circuit board assembly 100 provided in this embodiment. Figure 6 is a partially enlarged structural diagram of the circular area outlined by the dotted line in Figure 4. For ease of description of the structure of the support frame 50, the heat sink 30 and the thermally conductive layer 40 are omitted in Figure 7 compared to Figure 4.

[0138] As shown in Figures 6 and 7, the support plate 52 partially overlaps with the component 21 along the thickness direction of the circuit board 10. Along the thickness direction of the circuit board 10, the end of the component 21 facing away from the circuit board 10 is housed within a through-hole 511 on the support plate 52. Compared to the prior art where a support plate is placed between the component and the heat sink, the circuit board assembly 100 of this application avoids the influence of the thickness of the support plate 52 on the distance between the component 21 and the heat sink 30 by providing a through-hole 511 on the support plate 52. This reduces the overall thickness of the circuit board assembly 100, which is beneficial for miniaturization. The shape and size of the through-hole are not specifically limited; the support frame can be designed to accommodate the size of the component 21. Furthermore, the component 21 can achieve a thermally conductive connection with the heat sink 30 through the through-hole 511, improving the heat dissipation efficiency of the heat sink 30 for the component 21, thereby improving the heat dissipation efficiency of the circuit board assembly 100.

[0139] In this embodiment, the through-hole 511 allows the support plate 52 to surround the periphery of the component 21, ensuring that the support plate 52 can fit against the area of ​​the heat sink 30 that is not in contact with the thermally conductive layer 40. This makes reasonable use of the space around the component 21 and ensures the contact area between the support plate 52 and the heat sink 30. This guarantees reliable support of the heat sink 30 by the support plate 52.

[0140] In one embodiment, the support plate 52 is bonded to the surface of the heat sink 30 facing the circuit board 10 using thermally conductive adhesive (not shown). In another embodiment, the support plate 52 is welded to the surface of the heat sink 30 facing the circuit board 10.

[0141] In one embodiment, the distance between component 21 and heat sink 30 along the thickness direction of circuit board 10 is less than or equal to 0.05 mm. Specifically, as shown in FIG6, the distance between component 21 and heat sink 30 is a first distance D1, which is less than or equal to 0.05 mm. When the first distance D1 is greater than 0.05 mm, the thermally conductive layer 40 may be spaced apart from the heat sink 30 and / or component 21, resulting in the first distance D1 being greater than the thickness of the thermally conductive layer 40, and an air gap existing between the heat sink 30 and component 21. In this case, the structural compactness of the circuit board assembly 100 of this application is poor. The increased stacking thickness between the heat sink 30 and circuit board 10 is not conducive to the miniaturization of the circuit board assembly 100.

[0142] On the other hand, the air gap between the heat sink 30 and the component 21 also increases the thermal resistance between the heat sink 30 and the component 21, making it difficult for the heat generated by the component 21 to be transferred to the heat sink 30 when it is working, thereby reducing the heat dissipation efficiency of the circuit board assembly 100 of this application.

[0143] Therefore, setting a first spacing D1 of less than or equal to 0.05 mm allows the two opposing surfaces of the thermally conductive layer 40 to adhere to the heat sink 30 and the component 21 respectively, resulting in a compact structure for the circuit board assembly 100 and facilitating its miniaturization. It also enables the thermally conductive layer 40 to eliminate the air gap between the heat sink 30 and the component 21, reducing the thermal resistance between them and ensuring the heat dissipation efficiency of the circuit board assembly 100.

[0144] In one embodiment, the distance between component 21 and heat sink 30 along the thickness direction of circuit board 10 is less than the thickness of support plate 52. In this embodiment, the distance between component 21 and heat sink 30 is the thickness of thermally conductive layer 40. It is understood that by providing through-holes 511 on support plate 52 to reduce the overall thickness of circuit board assembly 100, even with thermally conductive layer 40 between component 21 and heat sink 30, the overall thickness of circuit board assembly 100 can still be reduced because the thickness of thermally conductive layer 40 is less than the thickness of support plate 52.

[0145] In one embodiment, the thermally conductive layer 40 includes a thermally conductive pad filled with a phase change material. That is, the thermally conductive layer 40 transfers heat to the heat sink 30 through the phase change of the internal phase change material.

[0146] In one embodiment, the thermal conductive layer 40 includes a thermal conductive pad. Along the thickness direction of the circuit board 10, before the circuit board assembly 100 of this application is assembled, the thickness dimension of the thermal conductive layer 40 is greater than the first spacing D1, so as to ensure the contact between the thermal conductive layer 40 and the heat sink 30 and the component 21 when assembled between them.

[0147] In one embodiment, the thermally conductive layer 40 includes a thermally conductive adhesive. The thermal conductivity of the adhesive is greater than that of air. In another embodiment, the connector 53 includes a leg 531 extending from the support plate 52 along the plane of the circuit board 10 and threadedly connected to the circuit board 10 via bolts 60.

[0148] Please refer to Figures 8 and 9 for further details. Figure 8 is a partially enlarged structural diagram of the circuit board assembly 100 provided in this embodiment, and Figure 9 is a top view of the circuit board assembly 100 provided in this embodiment. Figure 8 is a partially enlarged structural diagram of the circular area outlined by dashed lines in Figure 4. To facilitate the description of the location of component 21, dashed lines are used to mark the location of component 21 in Figure 9.

[0149] As shown in Figures 8 and 9, the support leg 531 includes a positioning hole 5311. The circuit board 10 includes a threaded hole 11. Along the planar direction of the circuit board 10, the support leg 531 extends out of the support plate 52 to expose the positioning hole 5311 on the support leg 531, and the positioning hole 5311 is aligned with the threaded hole 11. In this embodiment, along the thickness direction of the circuit board 10, the positioning hole 5311 is exposed relative to the heat sink 30, which facilitates the bolt 60 to be inserted sequentially into the positioning hole 5311 and the threaded hole 11 to achieve a threaded connection between the support leg 531 and the circuit board 10.

[0150] In another embodiment, the circuit board assembly 100 of this application further includes a nut located on the surface of the support leg 531 facing away from the circuit board 10. The threaded hole 11 is a through hole, and a bolt 60 extends sequentially from the side of the circuit board 10 facing away from the support frame 50 into the threaded hole 11, the positioning hole 5311, and the nut, achieving a threaded connection between the circuit board 10 and the support leg 531 through the threaded connection of the bolt 60 and the nut. In this embodiment, the positioning hole 5311 is exposed relative to the heat sink 30 to facilitate the threaded connection of the nut and the bolt 60.

[0151] In one embodiment, the circuit board 10 includes positioning protrusions 12, which are spaced apart from the components 21 along the planar direction of the circuit board 10. Threaded holes 11 penetrate the positioning protrusions 12 and extend into the circuit board 10 along its thickness direction. A support leg 531 faces the surface of the circuit board 10 to fit the positioning protrusions 12 and aligns with the threaded holes 11. The positioning protrusions 12 increase the thickness of the connection area between the circuit board 10 and the support leg 531 to match the length of the bolt 60.

[0152] In one embodiment, the number of legs 531 is at least three, and the at least three legs 531 are distributed around the outer edge of the support plate 52. Specifically, in one embodiment, as shown in FIG9, the number of legs 531 is three, and three legs 531 are spaced apart on the outer edge of the support plate 52. Each leg 531 is threadedly connected to the circuit board 10, thereby improving the connection strength between the support plate 52 and the circuit board 10. This achieves reliable support of the support plate 52 by the connector 53, and reliable support of the heat sink 30 by the connector 53. In another embodiment, the number of legs 531 is greater than three, to further improve the connection strength between the support plate 52 and the circuit board 10, and ensure reliable support of the heat sink 30 by the connector 53.

[0153] In one embodiment, each leg 531 includes a positioning hole 5311, and the circuit board 10 includes a plurality of threaded holes 11. Each positioning hole 5311 is used to align with a threaded hole 11, and each bolt 60 passes through the positioning hole 5311 and is threadedly connected to the threaded hole 11. The center of gravity of the closed pattern formed by connecting the centers of the threaded holes 11 along the plane of the circuit board 10 is located on the component 21.

[0154] Please refer to Figure 10 for another partial top view of the circuit board assembly 100 provided in this embodiment of the application. In Figure 10, the heat sink 30 and bolts 60 are omitted compared to Figure 4. In Figure 10, the dotted lines are the lines connecting the centers of the threaded holes 11, and the dashed lines are the positioning lines of the centroid of the closed shape formed by connecting the centers of the threaded holes 11.

[0155] In one embodiment, as shown in FIG10, there are three feet 531, and the number of threaded holes 11 is equal to the number of positioning holes 5311. Along the thickness direction of the circuit board 10, the centers of the positioning holes 5311 and the threaded holes 11 coincide. That is, in the schematic diagram shown in FIG10, the endpoint of each dotted line can also be regarded as the center of the threaded hole 11.

[0156] In this embodiment, the centers of each threaded hole 11 are connected sequentially to form a closed shape. In the schematic diagram shown in Figure 10, this closed shape is a triangle. The centroid of this triangle is the first centroid P1, which is located on the component 21. During the assembly of the circuit board assembly 100 in this application, after the heat sink 30 is fixedly connected to the support plate 52 on the surface of the circuit board 10, the positioning holes 5311 of each support 531 are aligned with the corresponding threaded holes 11. At this time, a gap is left between each support 531 and the circuit board 10 along the thickness direction of the circuit board 10. After each positioning hole 5311 is aligned with each threaded hole 11, the bolt 60 extends into the positioning hole 5311 and screws into the threaded hole 11. During the process of screwing the bolt 60 into the threaded hole 11, the bolt 60 pushes the support 531 towards the circuit board 10. When the bolt 60 is fully screwed in, the bolt 60 pushes the support 531 to fit against the circuit board 10. This achieves a fixed connection between the support 531 and the circuit board 10.

[0157] Because there is a gap between each support 531 and the circuit board 10 before the threaded connection, each support 531 will be subjected to clamping force under the action of the bolt 60 during the threaded connection with the circuit board 10. In this embodiment, during the assembly of the circuit board assembly 100, the distance between each support 531 and the circuit board 10 is equal before each support 531 is fixedly connected to the circuit board 10. That is, the clamping force on each support 531 during the fixed connection with the circuit board 10 is the same. The circuit board assembly 100 sets the first center of gravity P1 on the component 21, so that the resultant force of the clamping force on each support 531 acts on the component 21. This makes the force on the heat sink 30 relatively uniform in the area aligned with the component 21, thereby avoiding the phenomenon that the heat sink 30 is damaged due to uneven force when in contact with the heat-conducting layer 40.

[0158] In one embodiment, each support leg 531 is integrally formed with the support plate 52. In another embodiment, the support frame 50 can be manufactured by a stamping process during the fabrication of the circuit board assembly 100 of this application.

[0159] In one embodiment, the connector 53 includes a plurality of snap fasteners 532 and a plurality of slots 533. The plurality of snap fasteners 532 are fixed to the support plate 52, and the plurality of slots 533 are fixed to the circuit board 10. Each snap fastener 532 is used to snap onto a slot 533 to fix the support plate 52 and the circuit board 10.

[0160] Please refer to Figures 11-14 for further details. Figure 11 is a schematic diagram of another external structure of the circuit board assembly 100 provided in this embodiment. Figure 12 is a schematic diagram of another exploded structure of the circuit board assembly 100 provided in this embodiment. Figure 13 is a schematic diagram of another side view of the circuit board assembly 100 provided in this embodiment. Figure 14 is a schematic diagram of yet another partial cross-sectional structure of the circuit board assembly 100 provided in this embodiment. For ease of description, Figure 14 is only used to illustrate the cross-sectional structure of the area highlighted by the dashed line in Figure 13.

[0161] As shown in Figures 11-14, along the thickness direction of the circuit board 10, the projection of the heat sink 30 onto the circuit board 10 covers multiple clips 532 and multiple mounting brackets 533. The number of clips 532 is the same as the number of mounting brackets 533, with each clip 532 engaging and fixing to one mounting bracket 533 to achieve a fixed connection between the support plate 52 and the circuit board 10. In this embodiment, the matching arrangement of multiple clips 532 and multiple mounting brackets 533 improves the connection stability between the support plate 52 and the circuit board 10, ensuring reliable support of the heat sink 30 by the support frame 50.

[0162] In one embodiment, along the first direction 001, a snap fastener 532 and a card holder 533 that are interlocked are located on one side of the component 21, and another snap fastener 532 and another card holder 533 that are interlocked are located on the other side of the component 21. The distance between the two snap fasteners 532 is greater than the distance between the two card holders 533. The first direction 001 is parallel to the plane direction of the circuit board 10.

[0163] For ease of description, the two latches 532 in this embodiment are defined as the first latch 532a and the second latch 532b, and the two card holders 533 that match the two latches 532 in this embodiment are defined as the first card holder 533a and the second card holder 533b. The first latch 532a is used to engage the first card holder 533a, and the second latch 532b is used to engage the second card holder 533b.

[0164] As shown in Figure 14, along the first direction 001, the first latch 533a and the second latch 533b are arranged on opposite sides of the component 21. The first latch 532a is located on the side of the first latch 533a facing away from the component 21, and the second latch 532b is located on the side of the second latch 533b facing away from the component 21. That is, along the first direction 001, the surface of the first latch 532a facing the component 21 is used to engage with the surface of the first latch 533a facing away from the component 21, and the surface of the second latch 532b facing the component 21 is used to engage with the surface of the second latch 533b facing away from the component 21.

[0165] The circuit board assembly 100 also includes multiple components (not shown in the figure), which are fixed at intervals on the circuit board 10 and arranged outside the support frame 50 along the first direction 001. It is understood that placing the two card holders 533 between the two latches 532 reduces the distance between the card holders 533 and the components 21, thereby reducing the impact of the support frame 50 on the arrangement of other components on the circuit board 10 and facilitating a compact arrangement of the components on the circuit board 10. This makes the structure of the circuit board assembly 100 of this application more compact, which is beneficial for the miniaturization of the circuit board assembly 100 of this application.

[0166] In one embodiment, along the planar direction of the circuit board 10, each latch 532 is located on the side of the latch 533 that it matches, away from the component 21. In another embodiment, along the planar direction of the circuit board 10, at least a portion of the latches 532 are located between the latch 533 that it matches and the component 21.

[0167] In one embodiment, along the thickness direction of the circuit board 10, the latch 532 includes two opposing ends, one end of which includes a first latching portion 5321 and the other end includes a first bending portion 5322. The latch 532 latches onto the card holder 533 through the first latching portion 5321 and is fixed to the support plate 52 by the first bending portion 5322.

[0168] In one embodiment, along the thickness direction of the circuit board 10, the card holder 533 includes two opposing ends, one end of which includes a second latching portion 5331, and the other end includes a second bending portion 5332. The card holder 533 engages with the first latching portion 5321 of the buckle 532 via the second latching portion 5331, and supports the first bending portion 5322 via the second bending portion 5332.

[0169] Please refer to Figure 15 for another partially enlarged schematic diagram of the circuit board assembly 100 provided in the embodiment of this application. Figure 15 is a partially enlarged schematic diagram of the circular area outlined by the dotted line in Figure 14.

[0170] As shown in Figure 15, along the thickness direction of the circuit board 100, the first bending portion 5322 is located between the second bending portion 5332 and the support plate 52, and the second bending portion 5332 is located between the first bending portion 5322 and the circuit board 10. Along the planar direction of the circuit board 100, the first latching portion 5321 is located on the side of the second latching portion 5331 away from the component 21.

[0171] During the assembly of the circuit board assembly 100 of this application, the first latching portion 5321 moves along the thickness direction of the circuit board 100, and the first latching portion 5321 and the second latching portion 5331 cooperate with each other to achieve latching between the first latching portion 5321 and the second latching portion 5331. Specifically, in the example shown in FIG15, the first latching portion 5321 is formed as a protrusion on the connector 53, and the second latching portion 5331 is formed as a groove on the connector 53. During the assembly of the circuit board assembly 100 of this application, the latching between the first latching portion 5321 and the second latching portion 5331 is achieved as the protrusion is inserted into the groove.

[0172] In another embodiment, the first latching portion 5321 is formed as a groove on the connector 53, and the second latching portion 5331 is formed as a protrusion on the connector 53. During the assembly of the circuit board assembly 100, the first latching portion 5321 and the second latching portion 5331 are latched together as the groove is embedded into the protrusion.

[0173] In one embodiment, the second bend 5332 is used to fit and support the first bend 5322. During the assembly of the circuit board assembly 100 of this application, as the first snap-fit ​​portion 5321 and the second snap-fit ​​portion 5331 engage, the distance between the second bend 5332 and the first bend 5322 gradually decreases. It can be understood that when the second bend 5332 and the first bend 5322 are fitted together, the second bend 5332 can limit the displacement of the first bend 5322 along the thickness direction of the circuit board 10, thereby limiting the relative displacement between the latch 532 and the holder 533. That is, the cooperation between the second bending part 5332 and the first bending part 5322 limits the relative displacement between the buckle 532 and the card seat 533 when the buckle 532 and the card seat 533 are engaged, avoiding the situation where the buckle 532 and the card seat 533 are displaced due to external force, thereby ensuring that the support frame 50 supports the heat sink 30 reliably.

[0174] When the latch 532 and the card holder 533 are engaged, the first engaging portion 5321 and the second engaging portion 5331 partially overlap along the thickness direction of the circuit board 10. Understandably, the mutual contact between the second bent portion 5332 and the first bent portion 5322 increases the contact area between the latch 532 and the card holder 533 when they are engaged, thereby improving the connection strength between the support plate 52 and the circuit board 10 and ensuring the reliable connection between the support frame 50 and the heat sink 30.

[0175] In one embodiment, the number of card holders 533 is at least three, the number of buckles 532 is equal to the number of card holders 533, and at least three card holders 533 are distributed around the outer edge of the component 21. The center of gravity of the closed pattern formed by the sequential connection of the geometric centers of the projections of the second snap-fit ​​portion 5331 of each card holder 533 on the circuit board 10 is located inside the component 21.

[0176] Please refer to Figure 16 for a cross-sectional view of the circuit board assembly 100 provided in this embodiment of the application. Figure 16 is a top view of the cross-sectional structure obtained after cutting along section line L in Figure 14. In the schematic diagram shown in Figure 16, the dashed lines are the lines connecting the geometric centers of each of the second latching parts 5331, and the dashed lines are the positioning lines of the centroid of the closed shape formed by connecting the geometric centers of the projections of each of the second latching parts 5331 on the circuit board 10 in sequence.

[0177] In one embodiment, as shown in FIG16, there are three card holders 533. The geometric centers of the second latching portions 5331 of the three card holders 533 are connected sequentially to form a closed shape. In the schematic diagram shown in FIG16, the closed shape is a triangle. The centroid of the triangle is the second centroid P2, which is located on the component 21. During the assembly of the circuit board assembly 100 of this application, after the heat sink 30 is fixedly connected to the support plate 52 on the surface of the circuit board 10, the first latching portion 5321 of each buckle 532 is placed on the side of the corresponding second latching portion 5331 facing away from the component 21. At this time, along the thickness direction of the circuit board 10, there is a gap between the first bent portion 5322 of each buckle 532 and the second bent portion 5332 of the corresponding card holder 533.

[0178] As the first latching portion 5321 engages with the second latching portion 5331, the gap between the first bending portion 5322 and the second bending portion 5332 gradually disappears. During the engagement of each latch 532 with its corresponding holder 533, each latch 532 experiences a clamping force. In this embodiment, during the assembly of the circuit board assembly 100, before the latches 532 engage with the holders 533, the distance between the first bending portion 5322 of each latch 532 and the second bending portion 5332 of the corresponding holder 533 is equal. That is, the clamping force experienced by each latch 532 during engagement with the holder 533 is the same. The circuit board assembly 100 of this application sets the second center of gravity P2 on the component 21, enabling the clamping force experienced by each latch 532 to be applied appropriately to the component 21. This ensures that the heat sink 30 is subjected to relatively uniform force in the area aligned with the component 21, thereby avoiding damage to the heat sink 30 due to uneven force when it comes into contact with the heat-conducting layer 40.

[0179] In one embodiment, along the thickness direction of the circuit board 10, the minimum distance between the first latching portion 5321 and the first bending portion 5322 is less than or equal to 0.5 mm, and the minimum distance between the second latching portion 5331 and the second bending portion 5332 is equal to the minimum distance between the first latching portion 5321 and the first bending portion 5322.

[0180] As shown in Figure 15, the first latching portion 5321 is formed as a protrusion. Along the thickness direction of the circuit board 10, the minimum distance between the first latching portion 5321 and the first bending portion 5322 is the first height dimension H1 between the protrusion and the surface of the first bending portion 5322 facing the circuit board 10. The second latching portion 5331 is formed as a groove. Along the thickness direction of the circuit board 10, the minimum distance between the second latching portion 5331 and the second bending portion 5332 is the second height dimension H2 between the groove wall and the surface of the second bending portion 5332 facing away from the circuit board 10.

[0181] During the assembly of the circuit board assembly 100 in this application, when no clamping force is applied between the latch 532 and the holder 533, the first latching portion 5321 and the second latching portion 5331 partially overlap along the thickness direction of the circuit board 10, resulting in a gap between the first bent portion 5322 and the second bent portion 5332. When the first height dimension H1 is greater than 0.5mm, the gap between the first bent portion 5322 and the second bent portion 5332 is larger. Correspondingly, when a clamping force is subsequently applied to engage the latch 532 and the holder 533, the clamping force applied to the latch 532 is greater, resulting in a greater local clamping force on the heat sink 30 during the assembly of the circuit board assembly 100. This may damage the heat sink 30 or cause deformation of the heat sink 30, affecting the contact between the heat sink 30 and the heat-conducting layer 40.

[0182] Therefore, by limiting the first height dimension H1 to less than or equal to 0.5 mm, the circuit board assembly 100 of this application can avoid deformation or damage to the heat sink 30 due to excessive clamping force during assembly. This ensures the structural integrity of the heat sink 30 and the heat dissipation function of the circuit board assembly 100 of this application.

[0183] In one embodiment, along the thickness direction of the circuit board 10, the overlap dimension of the projection of the first latching portion 5321 on the circuit board 10 and the projection of the second latching portion 5331 on the circuit board 10 along the first direction 001 is greater than or equal to 0.15 mm.

[0184] For example, as shown in Figures 14 and 15, the first latching portion 5321 is formed as a protrusion, and the second latching portion 5331 is formed as a groove. After the circuit board assembly 100 of this application is assembled, the first latching portion 5321 is used to extend into the second latching portion 5331 along the first direction 001. Along the first direction 001, there is an insertion dimension S between the first latching portion 5321 and the second latching portion 5331, which is greater than or equal to 0.15 mm. It is understood that if the insertion dimension S is too small, the first latching portion 5321 and the second latching portion 5331 may detach during use of the circuit board assembly 100 of this application. That is, the circuit board assembly 100 of this application ensures reliable connection between the support frame 50 and the heat sink 30 by limiting the insertion dimension S between the first latching portion 5321 and the second latching portion 5331.

[0185] In one embodiment, the first latching portion 5321 is formed as a protrusion, and the cross-section of the protrusion is arc-shaped along the thickness direction of the circuit board 10. The diameter of the arc-shaped cross-section is greater than or equal to 0.6 mm. For example, in the cross-section shown in FIG. 15, the cross-sectional shape of the first latching portion 5321 is arc-shaped. In this embodiment, the first latching portion 5321 has an arc-shaped surface for extending into the second latching portion 5331. By limiting the diameter, the shape of the first latching portion 5321 is limited to reduce the curvature of the first latching portion 5321, facilitating the latching of the first latching portion 5321 and the second latching portion 5331. This improves the installation efficiency of the circuit board assembly 100 of this application.

[0186] In one embodiment, along the thickness direction of the circuit board 10, the distance between the surface of the latch 532 facing the circuit board 10 and the circuit board 10 is greater than or equal to 0.5 mm. As shown in FIG15, along the thickness direction of the circuit board 10, the latch 532 is spaced apart from the circuit board 10, and there is a third height dimension H3 between the surface of the latch 532 facing the circuit board 10 and the circuit board 10, the third height dimension H3 being greater than or equal to 0.5 mm, so as to avoid interference between the latch 532 and the circuit board 10 during the installation of the circuit board assembly 100 of this application.

[0187] In one embodiment, the first height dimension H1 is equal to the second height dimension H2, ensuring that when the first snap-fit ​​portion 5321 and the second snap-fit ​​portion 5331 are snapped together, the first bending portion 5322 and the second bending portion 5332 fit together, thereby ensuring the matching setting of the buckle 532 and the card seat 533, and ensuring the fixed connection of the connector 53 to the support plate 52 and the circuit board 10.

[0188] In one embodiment, each snap-fit ​​532 is integrally formed with the support plate 52.

[0189] In one embodiment, each card holder 533 is soldered to the surface of the circuit board 10 using surface mount technology (SMT).

[0190] In one embodiment, the connector 53 further includes a first connecting plate 534 and a second connecting plate 535. The first connecting plate 534 surrounds the outer edge of the support plate 52 and surrounds the component 21. Various latches 532 are spaced apart along the plane of the circuit board 10 on the surface of the first connecting plate 534 facing the component 21. The second connecting plate 535 is fixed to the surface of the circuit board 10 where the component 21 is located and surrounds the outer edge of the component 21. Various brackets 533 are spaced apart along the plane of the circuit board 10 on the surface of the second connecting plate 535 away from the component 21. The sum of the heights of the first connecting plate 534 and the second connecting plate 535 along the thickness direction of the circuit board 10 is greater than the distance between the support plate 52 and the circuit board 10.

[0191] Please refer to Figures 17-21. Figure 17 is a partial cross-sectional view of the circuit board assembly 100 provided in this embodiment of the application. Figure 18 is a cross-sectional view of the heat sink 30 and part of the support frame 50 in the circuit board assembly 100 provided in this embodiment of the application. Figure 19 is a bottom view of the heat sink 30 and part of the support frame 50 in the circuit board assembly 100 provided in this embodiment of the application. Figure 20 is a cross-sectional view of the circuit board 10 and another part of the support frame 50 in the circuit board assembly 100 provided in this embodiment of the application. Figure 21 is a top view of the circuit board 10 and another part of the support frame 50 in the circuit board assembly 100 provided in this embodiment of the application.

[0192] As shown in Figures 17-21, along the planar direction of the circuit board 10, the first connecting plate 534 is annular, and the second connecting plate 535 is annular. The first connecting plate 534 surrounds the second connecting plate 535 and the component 21, and the second connecting plate 535 surrounds the component 21. During the assembly process of the circuit board assembly 100 of this application, the second connecting plate 535 extends into the first connecting plate 534, so that each of the clips 532 on the first connecting plate 534 can be respectively engaged with each of the slots 533 on the second connecting plate 535, thereby achieving a fixed connection between the support plate 52 and the circuit board 10.

[0193] In this embodiment, along the thickness direction of the circuit board 10, the height dimension of the first connecting plate 534 refers to the distance between the surface of the first connecting plate 534 in contact with the support plate 52 and the circuit board 10, and the height dimension of the second connecting plate 535 refers to the distance between the surface of the second connecting plate 535 facing away from the circuit board 10 and the circuit board 10. Since the sum of the height dimensions of the first connecting plate 534 and the second connecting plate 535 is greater than the distance between the support plate 52 and the circuit board 10, that is, the first connecting plate 534 and the second connecting plate 535 overlap in the thickness direction of the circuit board 10. This ensures the engagement between each latch 532 and each latch 533 while reducing the space occupied by the connector 53 between the circuit board 10 and the heat sink 30, thereby reducing the overall size of the circuit board assembly 100 and facilitating its miniaturization.

[0194] After the circuit board assembly 100 is assembled, the first connecting plate 534 and the second connecting plate 535 surround the periphery of the component 21. The heat sink 30 and the circuit board 10 are located on both sides of the component 21 along the thickness direction of the circuit board 10, and are respectively attached to the first connecting plate 534 and the second connecting plate 535. That is, the first connecting plate 534 and the second connecting plate 535 also cooperate with the heat sink 30 and the circuit board 10 to seal the component 21, preventing external impurities from contacting the component 21 and causing damage to the component 21.

[0195] In one embodiment, the distance between any two adjacent snap fasteners 532 along the plane of the circuit board 10 is greater than or equal to 5 mm. When the distance between two snap fasteners 532 is less than 5 mm, the distance between adjacent snap fasteners 532 on the first connecting plate 534 is reduced. During the fabrication of the support frame 50, the circuit board assembly 100 of this application uses a stamping process to fabricate each snap fastener 532 on the first connecting plate 534. The reduced distance between two adjacent snap fasteners 532 may make it difficult to control the distance between two adjacent snap fasteners 532 during the fabrication of the support frame 50, thereby affecting the positional accuracy of each snap fastener 532 on the support frame 50, which is not conducive to the assembly of the circuit board assembly 100 of this application.

[0196] In one embodiment, both the first connecting plate 534 and the second connecting plate 535 are made of metallic materials. Since metallic materials possess electromagnetic shielding capabilities, the first connecting plate 534 and the second connecting plate 535, in conjunction with the heat sink 30 and the circuit board 10, effectively enclose the component 21. The use of metallic materials in the fabrication of the first connecting plate 534 and the second connecting plate 535 ensures that they can work together to provide electromagnetic shielding for the component 21.

[0197] In one embodiment, the first connecting plate 534 and the support plate 52 are integrally formed.

[0198] In one embodiment, the second connecting plate 535 is soldered to the surface of the circuit board 10 using surface mount technology (SMT).

[0199] In one embodiment, the connector 53 further includes a baffle plate 536, which, in conjunction with the second connecting plate 535, surrounds the periphery of the component 21. Along the thickness direction of the circuit board 10, the height of the baffle plate 536 is equal to the distance between the surface of the support plate 52 facing the circuit board 10 and the circuit board 10.

[0200] Please refer to Figures 22-24 for details. Figure 22 is a partial cross-sectional view of the internal components of the circuit board assembly 100 provided in this embodiment of the application. Figure 23 is another bottom view of the heat sink 30 and part of the support frame 50 in the circuit board assembly 100 provided in this embodiment of the application. Figure 24 is another top view of the circuit board 10, components 21, and another part of the support frame 50 in the circuit board assembly 100 provided in this embodiment of the application. To facilitate the description of the relative positions of the second component 22 and component 21, the relative positions of component 21 and the second component 22 are indicated by dashed lines in Figure 23.

[0201] As shown in Figures 22-24, the circuit board assembly 100 of this application includes a second component 22. Along the planar direction of the circuit board 10, the second component 22 is spaced apart from the component 21 on the circuit board 10. Along the thickness direction of the circuit board 10, the second component 22 is lower than the component 21. The projection of the support frame 50 on the circuit board 10 accommodates the second component 22. Along the planar direction of the circuit board 10, a baffle plate 536 is used to separate the component 21 and the second component 22.

[0202] In this embodiment, when components 21 and second components 22 are arranged on the circuit board 10, the blocking plate 536, in conjunction with the second connecting plate 535 and the support plate 52, seals the components 21 to protect them. In one embodiment, the blocking plate 536 is made of metal, and the blocking plate 536, in conjunction with the second connecting plate 535 and the support plate 52, provides electromagnetic shielding for the components 21.

[0203] In one embodiment, the heat sink 30 includes a housing 31 having a cavity 32 for accommodating a phase change material.

[0204] Please refer to Figure 25 for a schematic cross-sectional view of the connection between the heat sink 30 and the support plate 52 in the circuit board assembly 100 of this application. Figure 25 is a schematic cross-sectional view of the connection of the circular area outlined by the dashed line in Figure 14.

[0205] As shown in Figure 25, the housing 31 of the heat sink 30 is used to adhere to the thermally conductive layer 40. During the operation of the circuit board assembly 100 of this application, the heat generated by the component 21 can be transferred to the housing 31 through the thermally conductive layer 40. The housing 31 is used to absorb the heat transferred by the thermally conductive layer 40 and transfer the heat to the phase change material. The phase change material absorbs the heat through its own phase change. This achieves the heat dissipation function of the heat sink 30.

[0206] In one embodiment, the ratio of the thickness of the support plate 52 to the wall thickness of the cavity 32 along the thickness direction of the circuit board 10 is greater than or equal to 3. Specifically, as shown in FIG22, the support plate 52 has a first thickness T1, and the dimension between the inner wall of the cavity 32 near the circuit board 10 and the outer surface of the housing 31 facing the circuit board 10 along the thickness direction of the circuit board 10 is a second thickness T2. The ratio of the first thickness T1 to the second thickness T2 is greater than or equal to 3.

[0207] When the ratio of the first thickness T1 to the second thickness T2 is less than 3, the thickness of the support plate 52 decreases, making it difficult for the support plate 52 to reliably support the heat sink 30. That is, in this embodiment, by setting the ratio of the first thickness T1 to the second thickness T2 to be greater than or equal to 3, the reliable support of the heat sink 30 by the support frame 50 can be guaranteed.

[0208] In one embodiment, the thickness of the support plate 52 is greater than or equal to 0.15 mm along the thickness direction of the circuit board 10. That is, the first thickness T1 is greater than or equal to 0.15 mm to ensure reliable support of the heat sink 30 by the support frame 50.

[0209] In one embodiment, along the thickness direction of the circuit board 10, the distance between the surface of the support plate 52 facing the circuit board 10 and the circuit board 10 is greater than or equal to 0.5 mm. When the distance between the surface of the support plate 52 facing the circuit board 10 and the circuit board 10 is too small, interference may occur between the support plate 52 and the circuit board 10 during the assembly of the circuit board assembly 100 of this application, thereby damaging the circuit board 10 and affecting the function of the circuit board assembly 100 of this application.

[0210] In this embodiment, when the distance between the surface of the support plate 52 facing the circuit board 10 and the circuit board 10 is less than 0.5 mm, the space between the support plate 52 and the circuit board 10 is small, which is not conducive to arranging other components on the circuit board 10 covered by the support plate 52. As a result, the circuit board assembly 100 of this application can only arrange other components on the circuit board 10 outside the support frame 50, which is not conducive to the miniaturization of the circuit board assembly 10 of this application.

[0211] In one embodiment, the thickness of the support plate 52 along the thickness direction of the circuit board 10 is less than or equal to 0.25 mm. Since the heat sink 30 needs to be attached to the thermally conductive layer 40, the circuit board assembly 100 of this application controls the spacing between the surface of the support plate 52 facing the circuit board 10 and the circuit board 10 by limiting the thickness of the support plate 52 to less than or equal to 0.25 mm. This avoids interference between the support plate 52 and the circuit board 10, facilitates the arrangement of other components on the circuit board 10 covered by the support plate 52, making the structure of the circuit board assembly 100 of this application more compact and contributing to the miniaturization of the circuit board assembly 10.

[0212] Therefore, based on the limitations of the above embodiments, the circuit board assembly 100 of this application securely connects the second surface of the support frame 50, which has a relatively large area, to the heat sink 30 to ensure the contact area between the support frame 50 and the heat sink 30, thereby achieving reliable support of the heat sink 30 by the support frame 50. Furthermore, by placing the support frame 50 outside the component 21, the thickness of the support frame 50 does not increase the distance between the component 21 and the heat sink 30, which is beneficial for miniaturizing the circuit board assembly 100 of this application.

[0213] By placing the support frame 50 outside the component 21, the circuit board assembly 100 of this application avoids the influence of the support frame 50 on the stacking thickness between the heat sink 30 and the circuit board 10, which is beneficial to the miniaturization of the circuit board assembly 100. When the circuit board assembly 100 of this application is applied to electronic devices, the miniaturized design of the circuit board assembly 100 also contributes to the miniaturization of the electronic devices.

[0214] This application provides an electronic device including the aforementioned circuit board assembly 100, which thus offers advantages such as improved heat dissipation efficiency and miniaturization. In this embodiment, the electronic device includes at least one of a tablet, computer, mobile phone, or wearable device. This application does not impose any particular limitation. Because the support frame 50 of the circuit board assembly 100 is located outside the component 21, the support frame 50 can ensure reliable support for the heat sink 30 without increasing the distance between the component 21 and the heat sink 30, thus facilitating miniaturization. In other application scenarios, electronic devices using the circuit board assembly 100 of this application have a more compact structure, more reliable connections, and are more conducive to miniaturization.

[0215] In one embodiment, the heat sink 30 further includes heat dissipation fins 33, which are fixed to the housing 31 of the heat sink 30 and spaced apart from the support frame 50 along the plane of the circuit board 10.

[0216] Referring back to Figures 1-3, along the planar direction of the circuit board 10, the heat dissipation fins 33 are spaced apart from the circuit board 10. In one embodiment, along the thickness direction of the circuit board 10, the heat dissipation fins 33 are fixed to the side of the heat sink 30 that is attached to the support frame 50. In this embodiment, the heat dissipation fins 33 absorb the heat absorbed by the phase change material through the housing 31 during the phase change process and dissipate this heat outward. After releasing heat to the heat dissipation fins 33, the phase change material housed in the cavity 32 returns to its previous phase state, so as to absorb heat again.

[0217] In one embodiment, the circuit board assembly 100 further includes a second component 22, which is arranged at intervals with component 21 on the circuit board 10 along the planar direction of the circuit board 10. The second component 22 is lower than component 21 along the thickness direction of the circuit board 10. The projection of the support frame 50 on the circuit board 10 accommodates the second component 22.

[0218] Please refer to Figures 26 and 27 for reference. Figure 26 is a schematic cross-sectional view of the circuit board assembly 100 provided in this embodiment of the application, and Figure 27 is a schematic diagram of the arrangement of components 21 and second components 22 on the circuit board 10 in the circuit board assembly 100 provided in this embodiment of the application.

[0219] As shown in Figures 26 and 27, the second component 22 and component 21 are arranged at intervals along the planar direction of the circuit board 10. Along the thickness direction of the circuit board 10, the second component 22 is located between the circuit board 10 and the support plate 52. In this embodiment, along the thickness direction of the circuit board 10, the support plate 52 utilizes the height difference between its surface facing the circuit board 10 and the second component 22, so that the projection of the support plate 52 onto the circuit board 10 covers the second component 22, thereby causing the surface of the heat sink 30 covering the second component 22 to contact the support plate 52. This increases the contact area between the support plate 52 and the heat sink 30, ensuring reliable support of the heat sink 30 by the support frame 50.

[0220] In one embodiment, the distance between the support plate 52 and the second component 22 along the thickness direction of the circuit board 10 is greater than or equal to 0.3 mm. Specifically, as shown in FIG26, the distance between the support plate 52 and the second component 22 is a second distance D2, which is greater than or equal to 0.3 mm. When the second distance D2 is less than 0.3 mm, interference may occur between the support plate 52 and the second component 22 during the assembly of the circuit board assembly 100 of this application, thereby causing damage to the second component 22.

[0221] In one embodiment, there are multiple second components 22, which are arranged at intervals outside the components 21 along the plane of the circuit board 10.

[0222] In one embodiment, the circuit board assembly 100 further includes a third component 23, which is spaced apart from components 21 on the circuit board 10 along the planar direction of the circuit board 10. The height of the third component 23 along the thickness direction of the circuit board 100 is greater than the distance between the surface of the support frame 50 facing away from the circuit board 10 and the circuit board 10. The support frame 50 includes a through second through hole 512, which is spaced apart from through holes 511. The heat sink 30 includes a through clearance hole 341, which is aligned with the second through hole 512 to allow the third component 23 to extend into the second through hole 512 and the clearance hole 341.

[0223] Please refer to Figures 28-31 for further details. Figure 28 is another cross-sectional view of the circuit board assembly 100 provided in this embodiment of the application. Figure 29 is a schematic diagram showing the arrangement of components 21, the second component 22, and the third component 23 on the circuit board 10 of the circuit board assembly 100 provided in this embodiment of the application. Figure 30 is a partial top view of the circuit board assembly 100 provided in this embodiment of the application. Figure 31 is a top view of the circuit board assembly 100 provided in this embodiment of the application. Figure 30 omits the heat sink 30 and the thermally conductive layer 40. To facilitate the description of the positions of components 21 and 22, dashed lines are used to indicate the positions of components 21 and 22 in Figures 30 and 31.

[0224] In one embodiment, as shown in Figures 28-31, the circuit board assembly 100 of this application further includes a second component 22 and a third component 23. Along the planar direction of the circuit board 10, the second component 22 and the third component 23 are distributed around the periphery of component 21. The third component 23 partially overlaps with the support plate 52, and the support plate 52 surrounds the periphery of the third component 23 to make reasonable use of the space around the third component 23 and further ensure the contact area between the support plate 52 and the heat sink 30, thereby ensuring reliable support of the heat sink 30 by the support frame 50. This also contributes to the miniaturization of the circuit board assembly 100 of this application.

[0225] In the illustration shown in Figure 28, the height of the third component 23 is greater than the distance between the surface of the support frame 50 facing away from the circuit board 10 and the circuit board 10. In this embodiment, along the thickness direction of the circuit board 10, the ends of the third component 23 facing away from the circuit board 10 are respectively housed in the second through hole 512 and the clearance hole 341, so that the third component 23 is only partially located in the space between the heat sink 30 and the circuit board 10. That is, the provision of the second through hole 512 on the support frame 50 and the clearance hole 341 on the heat sink 30 can allow the third component 23 to be installed on the surface of the circuit board 10 facing the heat sink 30 while ensuring that the distance between the heat sink 30 and the circuit board 10 remains unchanged, and avoids interference between the heat sink 30 and the support frame 50 and the third component 23, thereby ensuring the structural integrity of the third component 23 during the assembly of the circuit board assembly 100 in this application.

[0226] In another embodiment, the component surrounding the component 21 in the circuit board assembly 100 of this application is a third component 23. That is, the surfaces of the circuit board 10 and the heat sink 30 opposite each other are fixed with the component 21 and the third component 23 at intervals.

[0227] In one embodiment, as shown in FIG32, the third component 23 is higher than the height dimension of the heat sink 30 along the thickness direction of the circuit board 10. A recessed hole 341 extends through the heat sink 30 to allow the third component 23 to protrude from the recessed hole 341.

[0228] In one embodiment, there are multiple third components 23. The multiple third components 23 are arranged at intervals on the circuit board 10 along the planar direction of the circuit board 10.

[0229] In one embodiment, the circuit board assembly 100 further includes a fourth component 24, which is spaced apart from components 22 on the circuit board 10 along the planar direction of the circuit board 10. The fourth component 24 is higher than the height of the support frame 50 along the thickness direction of the circuit board 10, and its height is lower than the distance between the surface of the heat sink 30 facing away from the circuit board 10 and the circuit board 10. The support frame 50 includes a third through-hole 513 for partially exposing the surface of the heat sink 30 facing the circuit board 10. The surface of the heat sink 30 exposed relative to the support frame 50 includes a second recessed hole 342. Along the thickness direction of the circuit board 10, the depth of the second recessed hole 342 is less than the thickness of the heat sink 30. The second recessed hole 342 is aligned with the third through-hole 513 to allow the fourth component 24 to extend into it.

[0230] Please refer to Figures 33-35, where Figure 33 is a cross-sectional view of the circuit board assembly 100 provided in this embodiment, Figure 34 is a schematic diagram of the arrangement of components 21, second component 22, third component 23, and fourth component 24 on the circuit board 10 of the circuit board assembly 100 provided in this embodiment, and Figure 35 is a top view of another part of the circuit board assembly 100 provided in this embodiment. To facilitate the description of the position of the second component 22, the position of the second component 22 is indicated by dashed lines in Figure 35.

[0231] In one embodiment, as shown in Figures 33-35, the circuit board assembly 100 of this application further includes a second component 22, a third component 23, and a fourth component 24. Along the planar direction of the circuit board 10, the second component 22, the third component 23, and the fourth component 24 are distributed around the periphery of component 21. A support plate 52 surrounds the periphery of the second clearance hole 342 to make reasonable use of the space around the fourth component 24, further ensuring the contact area between the support plate 52 and the heat sink 30, thereby ensuring reliable support of the heat sink 30 by the support frame 50. This also contributes to the miniaturization of the circuit board assembly 100 of this application.

[0232] In the illustration shown in Figure 33, along the thickness direction of the circuit board 10, the distance between the bottom 3421 of the second clearance hole 342 and the circuit board 10 is greater than the height of the fourth component 24. In this embodiment, along the thickness direction of the circuit board 10, the ends of the fourth component 24 facing away from the circuit board 10 are respectively housed in the third through hole 513 and the second clearance hole 342, so that the fourth component 24 is only partially located in the space between the heat sink 30 and the circuit board 10. That is, the arrangement of the third through hole 513 on the support frame 50 and the clearance hole 341 on the heat sink 30 can allow the fourth component 24 to be mounted on the surface of the circuit board 10 facing the heat sink 30 while ensuring that the distance between the heat sink 30 and the circuit board 10 remains unchanged, and avoid interference between the heat sink 30 and the support frame 50 and the fourth component 24, thereby ensuring the structural integrity of the fourth component 24 during the assembly of the circuit board assembly 100 in this application.

[0233] In this embodiment, during the assembly of the circuit board assembly 100, the fourth component 24 is used to pass through the third through hole 513 and extend into the second clearance hole 342. Along the thickness direction of the circuit board 10, the bottom 3421 of the second clearance hole 342 and the fourth component 24 are spaced apart to avoid interference between the bottom 3421 and the fourth component 24, thereby ensuring the structural integrity of the fourth component 24 during the assembly of the circuit board assembly 100.

[0234] In other embodiments, the components surrounding the component 21 in the circuit board assembly 100 of this application are the fourth component 24 and the second component 22, or the components surrounding the component 21 in the circuit board assembly 100 of this application are the fourth component 24 and the third component 23, or the components surrounding the component 21 in the circuit board assembly 100 of this application are the fourth component 24.

[0235] In one embodiment, there are multiple fourth components 24. The multiple fourth components 24 are arranged at intervals on the circuit board 10 along the planar direction of the circuit board 10.

[0236] In one embodiment, the circuit board assembly 100 further includes a fifth component 25, which is spaced apart from the component 21 on the circuit board 10 along the planar direction of the circuit board 10. The fifth component 25 is higher than the surface of the support plate 52 facing the circuit board 10 along the thickness direction of the circuit board 10. The height dimension of the fifth component 25 is smaller than the distance between the surface of the support frame 50 facing away from the circuit board 10 and the circuit board 10. The support frame 50 includes a fourth through hole 514 for allowing the fifth component 25 to extend into it.

[0237] Please refer to Figures 36-38. Figure 36 is another cross-sectional view of the circuit board assembly 100 provided in this embodiment of the application. Figure 37 is a schematic diagram of the arrangement of components 21, 22, 23, 24, and 25 on the circuit board 10 in the circuit board assembly 100 provided in this embodiment of the application. Figure 38 is a top view of another part of the circuit board assembly 100 provided in this embodiment of the application. To facilitate the description of the position of the second component 22, the position of the second component 22 is indicated by dashed lines in Figure 38.

[0238] In one embodiment, as shown in Figures 36-38, the circuit board assembly 100 of this application further includes a second component 22, a third component 23, a fourth component 24, and a fifth component 25. Along the planar direction of the circuit board 10, the second component 22, the third component 23, the fourth component 24, and the fifth component 25 are distributed around the periphery of component 21. The support plate 52 partially overlaps with the fifth component 25, and surrounds the periphery of the fifth component 25 to make reasonable use of the space around the fifth component 25, further ensuring the contact area between the support plate 52 and the heat sink 30, thereby ensuring reliable support of the heat sink 30 by the support frame 50. This also contributes to the miniaturization of the circuit board assembly 100 of this application.

[0239] In the illustration shown in Figure 36, the fifth component 25 and the heat sink 30 are spaced apart along the thickness direction of the circuit board 10. In this embodiment, along the thickness direction of the circuit board 10, the end of the fifth component 25 facing away from the circuit board 10 is housed in the fourth through hole 514, so that the fifth component 25 is only partially located in the space between the support plate 52 and the circuit board 10. That is, the fourth through hole 514 allows the fifth component 25 to be mounted on the surface of the circuit board 10 facing the heat sink 30 while keeping the distance between the support plate 52 and the circuit board 10 unchanged, and avoids interference between the support frame 50 and the fifth component 25, thereby ensuring the structural integrity of the fifth component 25 during the assembly of the circuit board assembly 100 in this application.

[0240] In other embodiments, the components surrounding the component 21 in the circuit board assembly 100 of this application are the fifth component 25 and the second component 22; or, the components surrounding the component 21 in the circuit board assembly 100 of this application are the fifth component 25 and the third component 23; or, the components surrounding the component 21 in the circuit board assembly 100 of this application are the fifth component 25 and the fourth component 24; or, the components surrounding the component 21 in the circuit board assembly 100 of this application are the fifth component 25.

[0241] In one embodiment, there are multiple fifth components 25. The multiple fifth components 25 are arranged at intervals on the circuit board 10 along the planar direction of the circuit board 10.

[0242] In one embodiment, along the planar direction of the circuit board 10, the minimum spacing between any two of the components 21, 23, 24 and 25 is greater than or equal to 5 mm.

[0243] As shown in Figure 38, the third component 23, the fourth component 24, and the fifth component 25 are sequentially spaced around the periphery of component 21. A support plate 52 is used to surround components 21, 23, 24, and 25 respectively, ensuring that a support plate 52 exists between any two adjacent components 21, 23, 24, and 25. This rationally utilizes the space between components 21, 23, 24, and 25, further ensuring the contact area between the support plate 52 and the heat sink 30, which is beneficial for the miniaturization of the circuit board assembly 100 of this application.

[0244] In this embodiment, the minimum spacing between any two of component 21, third component 23, fourth component 24, and fifth component 25 is greater than or equal to 5 mm. Correspondingly, the minimum spacing between any two of through holes 511, second through hole 512, third through hole 513, and fourth through hole 514 is greater than or equal to 5 mm. This ensures that the solid structure dimension of the support plate 52 between any two of through holes 511, second through hole 512, third through hole 513, and fourth through hole 514 is greater than or equal to 5 mm, thereby guaranteeing that the connection areas between different holes in the support plate 52 have relatively large connection strength. This ensures that the structure of the support plate 52 remains intact during the assembly of the circuit board assembly 100 in this application, which is beneficial for ensuring reliable support of the heat sink 30.

[0245] In one embodiment, along the plane of the circuit board 10, the minimum dimension of the support plate 52 between any two of the components 21, 23, 24, and 25 is greater than or equal to 3 mm. In the illustration shown in Figure 35, the minimum dimension of the support plate 52 between any two of the components 21, 23, 24, and 25 is the width dimension W, which is greater than or equal to 3 mm. This ensures the connection strength of the support plate 52 between any two of the components 21, 23, 24, and 25, thereby ensuring reliable support of the heat sink 30 by the support frame 50.

[0246] It is worth noting that the second component 22, the third component 23, the fourth component 24, and the fifth component 25 proposed in the above embodiments of this application are not named solely based on their height dimensions. In actual assembly, some components with height dimensions lower than the distance between the surface of the support frame 50 facing the circuit board 10 and the circuit board 10 may not be covered by the support plate 52, resulting in the projection of the support plate 52 onto the circuit board 10 surrounding multiple components. In this application, the second component 22, the third component 23, the fourth component 24, and the fifth component 25 refer to components whose height dimensions and arrangement positions satisfy the limitations of the above embodiments. For example, regarding the third component 23, among the components surrounded by the projection of the support plate 52 onto the circuit board 10, there may be components with height dimensions lower than the height dimension of the support frame 50 and the third component 23 simultaneously. This application does not impose any particular limitation on this.

[0247] In one embodiment, the circuit board assembly 100 further includes a second thermally conductive layer 70, through which the heat sink 30 is thermally connected to at least one of the second component 22, the fourth component 24, and the fifth component 25.

[0248] Please refer to Figures 39 and 40 for further details. Figure 39 is another cross-sectional view of the circuit board assembly 100 provided in the embodiment of this application, and Figure 40 is yet another cross-sectional view of the circuit board assembly 100 provided in the embodiment of this application.

[0249] In one embodiment, as shown in Figures 39 and 40, the heat sink 30 is thermally connected to the second component 22, the fourth component 24, and the fifth component 25 via the second thermally conductive layer 70. During the operation of the circuit board assembly 100 of this application, the heat generated by the second component 22, the fourth component 24, and the fifth component 25 can be transferred to the heat sink 30 via the second thermally conductive layer 70, and then dissipated outwards via the phase change material within the heat sink 30 and the heat dissipation fins 33 of the heat sink 30.

[0250] In another embodiment, the heat sink 30 is thermally connected to one of the second component 22, the fourth component 24, and the fifth component 25 through the second thermally conductive layer 70; or, the heat sink 30 is thermally connected to two of the second component 22, the fourth component 24, and the fifth component 25 through the second thermally conductive layer 70.

[0251] In one embodiment, the material of the second thermally conductive layer 70 is the same as that of the thermally conductive layer 40.

[0252] In one embodiment, the support plate 52 has a protrusion 521 on its surface facing the circuit board 10, and the protrusion 521 surrounds the outer edge of the component 21. Along the thickness direction of the circuit board 10, the end of the protrusion 521 away from the heat sink 30 is sealed to the component 21 by conductive foam 80 to achieve electromagnetic shielding of the component 21.

[0253] Please refer to Figure 41 for a schematic diagram of the connection structure between the support plate 52 and the circuit board 10 in the circuit board assembly 100 provided in this embodiment of the application.

[0254] As shown in Figure 41, along the planar direction of the circuit board 10, the protrusion 521 and the conductive foam 80 surround the periphery of the component 21 and are spaced apart from the second component 22, the third component 23, the fourth component 24, and the fifth component 25. Along the thickness direction of the circuit board 10, the end of the protrusion 521 away from the heat sink 30 is spaced apart from the circuit board 10, and the conductive foam 80 fills the space between the protrusion 521 and the circuit board 10.

[0255] In this embodiment, the material of the protrusion 521 includes a metal material. The protrusion 521 is used to cooperate with the conductive foam 80 to seal the component 21 and achieve electromagnetic shielding of the component 21.

[0256] In one embodiment, component 24 is a central processing unit (CPU).

[0257] In one embodiment, the second component 22, the third component 23, the fourth component 24, and the fifth component 25 are at least one of components such as resistors, capacitors, and crystal oscillators.

[0258] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of protection of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A circuit board assembly, characterized in that, The circuit board assembly includes a circuit board, components, a support frame, and a heat sink. The components and the support frame are fixed to the same surface of the circuit board. Along the thickness direction of the circuit board, the support frame faces away from the surface of the circuit board to support the heat sink. The support frame includes a through hole for allowing the component to extend into and contact the heat sink, or for allowing the component to extend into and thermally connect to the heat sink through a thermally conductive layer.

2. The circuit board assembly according to claim 1, characterized in that, The support frame includes a support plate and a connector. The connector is disposed between the support plate and the circuit board along the thickness direction of the circuit board. The through hole is located on the support plate. The support plate is used to support the heat sink. The connector is used to fix the support plate and the circuit board together.

3. The circuit board assembly according to claim 2, characterized in that, Along the thickness direction of the circuit board, the surface area of ​​the support plate facing away from the connector is greater than the surface area of ​​the connector facing away from the support plate.

4. The circuit board assembly according to claim 2, characterized in that, The support frame is made of one of stainless steel, titanium alloy, or aluminum alloy.

5. The circuit board assembly according to claim 2, characterized in that, The elastic modulus of the support frame is greater than or equal to 110 GPa.

6. The circuit board assembly according to any one of claims 2-5, characterized in that, Along the thickness direction of the circuit board, the surface of the support plate facing the connector is lower than the surface of the component facing away from the circuit board.

7. The circuit board assembly according to any one of claims 2-5, characterized in that, Along the thickness direction of the circuit board, the distance between the component and the heat sink is less than or equal to 0.05 mm.

8. The circuit board assembly according to any one of claims 2-5, characterized in that, The connector includes a support leg that extends out of the support plate along the plane of the circuit board and is threadedly connected to the circuit board by bolts.

9. The circuit board assembly according to claim 8, characterized in that, The number of legs is at least three, and the at least three legs are distributed around the outer edge of the support plate.

10. The circuit board assembly according to claim 9, characterized in that, Each of the aforementioned legs includes a positioning hole, and the circuit board includes a plurality of threaded holes. Each positioning hole is used to align with one of the threaded holes, and each of the aforementioned bolts passes through the positioning hole and is threadedly connected to the threaded hole. Along the plane of the circuit board, the center of gravity of the closed pattern formed by connecting the centers of the threaded holes is located on the component.

11. The circuit board assembly according to any one of claims 2-5, characterized in that, The connector includes multiple buckles and multiple card holders. The multiple buckles are fixed to the support plate, and the multiple card holders are fixed to the circuit board. Each buckle is used to engage one of the card holders to fix the support plate and the circuit board together.

12. The circuit board assembly according to claim 11, characterized in that, Along a first direction, one of the latches and one of the card holders are located on one side of the component, and another latch and another card holder are located on the other side of the component. The distance between the two latches is greater than the distance between the two card holders. The first direction is parallel to the plane direction of the circuit board.

13. The circuit board assembly according to claim 12, characterized in that, Along the thickness direction of the circuit board, the buckle includes two opposing ends, one end of which includes a first snap-fit ​​portion and the other end includes a first bend portion; the buckle snaps into the card holder through the first snap-fit ​​portion and is fixed to the support plate through the first bend portion.

14. The circuit board assembly according to claim 13, characterized in that, Along the thickness direction of the circuit board, the card holder includes two opposing ends, one end of which includes a second snap-fit ​​portion and the other end includes a second bend portion; the card holder snaps the first snap-fit ​​portion of the buckle through the second snap-fit ​​portion, and supports the first bend portion by means of the second bend portion.

15. The circuit board assembly according to claim 14, characterized in that, The number of card holders is at least three, and the number of buckles is equal to the number of card holders. The at least three card holders are distributed around the outer edge of the component. The center of gravity of the closed shape formed by the sequential connection of the geometric centers of the projections of the second card contacts of each card holder on the circuit board is located inside the component.

16. The circuit board assembly according to claim 14, characterized in that, Along the thickness direction of the circuit board, the minimum distance between the first snap-fit ​​portion and the first bend portion is less than or equal to 0.5 mm, and the minimum distance between the second snap-fit ​​portion and the second bend portion is equal to the minimum distance between the first snap-fit ​​portion and the first bend portion.

17. The circuit board assembly according to claim 11, characterized in that, The connector further includes a first connecting plate and a second connecting plate. The first connecting plate surrounds the outer edge of the support plate and surrounds the component. Each of the buckles is arranged at intervals along the plane of the circuit board on the surface of the first connecting plate facing the component. The second connecting plate is fixed to the surface of the circuit board where the components are located, and surrounds the outer edge of the components. Each of the card holders is arranged at intervals along the plane of the circuit board on the surface of the second connecting plate opposite to the components; wherein, Along the thickness direction of the circuit board, the sum of the height dimensions of the first connecting plate and the second connecting plate is greater than the distance between the support plate and the circuit board.

18. The circuit board assembly according to claim 17, characterized in that, Along the plane of the circuit board, the distance between any two adjacent clips is greater than or equal to 5mm.

19. The circuit board assembly according to claim 17, characterized in that, Both the first connecting plate and the second connecting plate are made of metal.

20. The circuit board assembly according to any one of claims 2-5, characterized in that, The heat sink includes a housing with a cavity for accommodating a phase change material.

21. The circuit board assembly according to claim 20, characterized in that, Along the thickness direction of the circuit board, the ratio of the thickness of the support plate to the wall thickness of the cavity is greater than or equal to 3.

22. The circuit board assembly according to claim 20, characterized in that, The heat sink also includes heat dissipation fins, which are fixed to the housing of the heat sink and spaced apart from the support frame along the plane of the circuit board.

23. The circuit board assembly according to any one of claims 2-5, characterized in that, Along the thickness direction of the circuit board, the thickness of the support plate is greater than or equal to 0.15 mm; and / or, along the thickness direction of the circuit board, the thickness of the support plate is less than or equal to 0.25 mm.

24. The circuit board assembly according to any one of claims 2-5, characterized in that, Along the thickness direction of the circuit board, the distance between the surface of the support plate facing the circuit board and the circuit board is greater than or equal to 0.5 mm.

25. The circuit board assembly according to any one of claims 2-5, characterized in that, The circuit board assembly further includes a second component, which is arranged at intervals on the circuit board along the plane of the circuit board and is lower than the component along the thickness of the circuit board. The projection of the support frame on the circuit board accommodates the second component.

26. The circuit board assembly according to claim 25, characterized in that, Along the thickness direction of the circuit board, the distance between the support plate and the second component is greater than or equal to 0.3 mm.

27. The circuit board assembly according to any one of claims 2-5, characterized in that, The circuit board assembly further includes a third component, which is arranged at intervals on the circuit board along the plane of the circuit board, and the height of the third component along the thickness of the circuit board is greater than the distance between the surface of the support frame away from the circuit board and the circuit board. The support frame includes a through second through hole, the second through hole being spaced apart from the through hole, and the heat sink includes a through clearance hole, the second through hole being aligned with the clearance hole to allow the third component to extend into the second through hole and the clearance hole.

28. An electronic device, characterized in that, The electronic device includes a housing and a circuit board assembly as described in any one of claims 1-27, the circuit board assembly being housed within the housing.

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