cooling plate

Abstract

The present invention provides a cooling plate that forms a flow path for coolant flow without increasing the number of components. The cooling plate (A) forms a plurality of mating surfaces that form the boundary between a first opposing surface (11a) formed on a first plate component (11) and a second opposing surface (10a) formed on a second plate component (10). The plurality of mating surfaces include: a first mating surface (M1) in which cooling flow path portions (P2, 21) as cooling flow paths are formed in each of two regions separated by the mating surface along the direction of the mating surface; and a second mating surface (M2) in which at least one of the two regions separated by the mating surface does not form cooling flow path portions along the direction of the mating surface. The second mating surface (M2) fixes the first opposing surface (11a) and the second opposing surface (10a). At least a portion of the first mating surface (M1) does not fix the first opposing surface (11a) and the second opposing surface (10a).

Description

Technical Field

[0001] This invention relates to a cooling plate. Background Technology

[0002] Patent Document 1 describes a power conversion device in which a heated component having semiconductor elements disposed on its surface and multiple cooling fins disposed inside overlaps with an inner cover having a flow path recess for accommodating the cooling fins of the heated component, and is connected by bolts.

[0003] This power conversion device can cool the semiconductor by supplying refrigerant to the recess in the flow path, and can prevent refrigerant leakage by clamping the sealing component into the contact area between the inner periphery of the heated component and the upper surface of the outer periphery of the inner cover.

[0004] In Patent Document 2, a front module and a rear module are provided on the upper surface of a substrate as semiconductor modules. An inverter device is described in which cooling passages are formed on the substrate at positions overlapping with the aforementioned modules, and connecting flow paths for supplying and discharging refrigerant to each cooling passage are arranged on the lower surface of the substrate.

[0005] The inverter device has a structure in which a substrate and a bottom cover disposed on its lower surface are overlapped. That is, by recessing a connection flow path on the upper surface of the bottom cover and overlapping the substrate with the upper surface of the bottom cover in a contact state, the refrigerant can flow through the recessed connection flow path. The inverter device described in Patent Document 2 prevents refrigerant leakage from the boundary surface by clamping a seal between the substrate and the bottom cover.

[0006] Patent Document 1: Japanese Patent Application Publication No. 2014-22490

[0007] Patent Document 2: Japanese Patent Application Publication No. 2021-29059

[0008] Taking hybrid electric vehicles (HEV), plug-in hybrid electric vehicles (PHEV), and battery electric vehicles (BEV) as examples, these vehicles are equipped with an electric control system that can control the power supplied to the driving motor and perform power control such as charging the vehicle's battery.

[0009] The vehicle's electrical control system includes inverters, DC-DC converters, and on-board chargers (OBCs). These components act as heat sources, causing the system temperature to rise. Therefore, a structure capable of effectively cooling these heat sources is needed. In particular, high-capacity inverters generate significant heat during operation, requiring efficient heat dissipation.

[0010] To achieve efficient cooling, as described in Patent Documents 1 and 2, fluids can be used to achieve effective cooling. However, such structures using fluids require flow paths for supplying coolant (refrigerant) to the object being cooled.

[0011] Therefore, as described in Patent Document 2, a structure in which multiple overlapping plates (in the document, a base plate and a bottom cover) are formed at the boundaries of the plates to create a flow path is also considered. This structure eliminates the need for pipe materials, thus reducing the number of components and preventing undesirable situations where fluid leakage occurs due to breakage of the pipe materials.

[0012] However, in structures where flow paths are formed by simply creating concave grooves at the boundaries of multiple plates, there is a concern that the number of components would increase due to the need for seals to prevent fluid leakage from the plate boundaries.

[0013] For this reason, a cooling plate is sought that creates a flow path for coolant without increasing the number of components. Summary of the Invention

[0014] The cooling plate of the present invention is characterized by the following aspect: it is capable of cooling electronic components of a cooling object by causing coolant to flow into a cooling flow path. The cooling plate comprises: a plate surface in contact with the electronic components and a plate component having a cooling flow path; the plate component having at least two components, a first plate component and a second plate component, and having a structure in which a first opposing surface formed on the first plate component and a second opposing surface formed on the second plate component overlap; a plurality of mating surfaces forming the boundary of the overlap of the first opposing surface and the second opposing surface include: a first mating surface having a cooling flow path portion formed in each of two regions separated by the mating surface along the direction of the mating surface; and a second mating surface not having a cooling flow path portion formed in at least one region of the two regions separated by the mating surface along the direction of the mating surface; the second mating surface joining the first opposing surface and the second opposing surface; and at least a portion of the first mating surface not joining the first opposing surface and the second opposing surface.

[0015] According to this structure, in the first mating surface among the plurality of mating surfaces that form the boundary where the first and second mating surfaces overlap, the first and second mating surfaces are not joined. Therefore, it achieves a structure that allows slight leakage of coolant passing between the first and second mating surfaces of the first mating surface into the cooling flow path without requiring a seal. In contrast, in the second mating surface among the plurality of mating surfaces, the first and second mating surfaces are joined. Therefore, it achieves a structure that integrates the first plate component and the second plate component, preventing leakage of coolant passing between the first and second mating surfaces of the second mating surface into the area where no cooling flow path is formed. Thus, seals are not required in at least a portion of the plurality of mating surfaces, thus avoiding an increase in manufacturing steps and costs. Therefore, a cooling plate is constructed that forms a flow path for coolant flow without increasing the number of components. Attached Figure Description

[0016] Figure 1 This is a perspective view showing a simplified structure of a power control unit including a cooling plate.

[0017] Figure 2 This is a three-dimensional view of the first plate component viewed from below.

[0018] Figure 3 This is a top view of the cooling space.

[0019] Figure 4 It is a longitudinal sectional side view of the first upper flow path, the supply flow path section, and the cooling space.

[0020] Figure 5 It is a top view showing the positional relationship between multiple supply holes and multiple needle-shaped fins.

[0021] Figure 6 It is a cross-sectional view showing the mating surfaces of the first plate component and the second plate component.

[0022] Explanation of reference numerals in the attached figures

[0023] 10: Second plate component, 10a: Second opposing surface, 11: First plate component, 11a: First opposing surface, 21: First upper flow path (downstream cooling flow path), 22: Second upper flow path (downstream cooling flow path), 23: Supply flow path, A: Cooling plate, F: Coolant, P: Cooling flow path, P2: Second flow path (upstream cooling flow path), P8: Eighth flow path (downstream cooling flow path), M1: First mating surface, M2: Second mating surface, S: Cooling space (other cooling flow path), T: Near the front end. Detailed Implementation

[0024] Hereinafter, embodiments of the cooling plate of the present invention will be described with reference to the accompanying drawings. In these embodiments, the invention is not limited to the following embodiments, and various modifications can be made without departing from its spirit.

[0025] The embodiments of the present invention will now be described with reference to the accompanying drawings. In the following description, the up-down direction refers to the up-down direction in the direction of gravity.

[0026] [Basic Structure]

[0027] exist Figure 1 The diagram shows an electric control unit B, which includes a cooling plate A installed in vehicles (not shown) that are capable of operating on electricity, such as hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), and battery electric vehicles (BEVs).

[0028] like Figure 1 As shown, the power control unit B of this embodiment includes a cooling plate A and electronic components that are cooled by the cooling plate A, namely, a pair of primary power modules 1, a secondary power module 2, a transformer coil 3, a first FET 4, a PFC coil 5, a second FET 6, a secondary coil 7, and an inverter 8 (an example of electronic components). Although each of the pair of primary power modules 1, secondary power modules 2, transformer coil 3, first FET 4, PFC coil 5, second FET 6, and secondary coil 7 is formed with a predetermined dimension in the vertical direction, in this figure, the aforementioned electronic components are depicted as plate-shaped.

[0029] Cooling plate A is composed of plate components 10 and 11. Details will be described later, but the plate components are formed by joining the outer peripheries of a pair of upper plate components 10 (an example of a second plate component) and lower plate components 11 (an example of a first plate component) by welding or the like. This cooling plate A is formed to cool the heat generated by the multiple electronic components constituting the power control unit B. Figure 3 , Figure 4 The cooling flow path P is shown as the flow path of the coolant F. The lower plate component 11 has a supply port Pa at one end of the cooling flow path P and an outlet Pb at the other end of the cooling flow path P. Although the coolant F is assumed to be water, it also includes antifreeze with ethylene glycol as the main component, long-life coolant (LLC) containing propylene glycol, or cooling oil composed of insulating oils such as paraffin wax. That is, coolant F is a general term for both cooling water and cooling oil.

[0030] Cooling plate A Figure 1The posture shown is set in the vehicle. Therefore, the vertical relationship of each part of the cooling plate A will be explained based on this posture. Hereinafter, the vertical direction will be referred to as the Z direction, the side and direction in which the upper plate member 10 is disposed relative to the lower plate member 11 will be referred to as the Z1 side and the Z1 direction, and the side and direction in which the lower plate member 11 is disposed relative to the upper plate member 10 will be referred to as the Z2 side and the Z2 direction. At this time, the Z2 direction is the direction of gravity.

[0031] like Figure 1 As shown, the upper plate component 10 has a plate surface 10b that contacts (or can approach) each of the primary power module 1, secondary power module 2, transformer coil 3, first FET 4, PFC coil 5, second FET 6, and secondary coil 7. The plate surface 10b is a part of the first cooling section C1 (contacting the primary power module 1), the second cooling section C2 (contacting the secondary power module 2), the third cooling section C3 (contacting the transformer coil 3), the fourth cooling section C4 (contacting the first FET), the fifth cooling section C5 (contacting the PFC coil), the sixth cooling section C6 (contacting the second FET), and the seventh cooling section C7 (contacting the secondary coil 7). The lower plate component 11 is a part of the eighth cooling section C8, where the lower surface 15a (an example of a plate surface) of the plate-like body 15 integrated with the Z2 side contacts the inverter 8. Sometimes, these first cooling sections C1 to eighth cooling sections C8 are collectively referred to as cooling sections C.

[0032] The cooling flow path P is provided with a first flow path P1, a second flow path P2, a third flow path P3, a fourth flow path P4, a fifth flow path P5, a sixth flow path P6, a seventh flow path P7, and an eighth flow path P8 in order to supply coolant F to the vicinity of multiple cooling sections C. Sometimes, these first flow path sections P1 to eighth flow path sections P8 are collectively referred to as the cooling flow path P.

[0033] That is, in the multiple cooling flow paths P, for the first flow path section P1 to the seventh flow path section P7, the electronic components that come into contact with (or are close to) the cooling section C can be cooled by the flow of coolant F near the heat exchange plate surface 10b of the upper plate component 10. Specifically, the first flow path section P1 to the seventh flow path section P7 are formed directly below (on the Z2 side) the plate surface 10b of the upper plate component 10 of each of the first cooling section C1 to the seventh cooling section C7. The thickness of the wall between the plate surface 10b of the upper plate component 10 and the cooling flow path P (the distance between the plate surface 10b and the cooling flow path P) is preferably as thin as possible while ensuring the required strength of the upper plate component 10. As a result, the coolant F flowing in the cooling flow path P can effectively cool the electronic components. In addition, the structure of the eighth cooling section C8 will be described later.

[0034] Because of this configuration, cooling plate A supplies coolant F to supply port Pa. Coolant F flows through the first flow path P1 to the eighth flow path P8, where it removes heat from the electronic components in the corresponding first cooling section C1 to eighth cooling section C8. After cooling multiple electronic components, it is discharged from outlet Pb.

[0035] In particular, the electronic components such as primary power module 1, secondary power module 2, transformer coil 3, first FET 4, PFC coil 5, second FET 6, and secondary coil 7 are supported by one or more substrates.

[0036] According to this structure, the cooling plate A is configured such that each of the primary power module 1, secondary power module 2, transformer coil 3, first FET 4, PFC coil 5, second FET 6, and secondary coil 7 is in contact with or close to the corresponding first cooling section C1, second cooling section C2, third cooling section C3, fourth cooling section C4, fifth cooling section C5, sixth cooling section C6, and seventh cooling section C7, thereby setting the positional relationship between the substrate and the upper plate component 10.

[0037] In addition, in order to remove heat from electronic components, the cooling plate A can also be configured to sandwich a heat-conducting sheet and a gap-filling material between the heat exchange cooling section C, the substrate, and electronic components.

[0038] [Board Components]

[0039] like Figure 1 , Figure 2 , Figure 4As shown, the plate components are a lower plate component 11 (an example of a first plate component) made of a metal material such as aluminum, and an upper plate component 10 (a second plate component) overlapping the lower plate component 11. The boundary surface where the first opposing surface 11a of the lower plate component 11 and the second opposing surface 10a of the upper plate component 10 contact is called a mating surface. Multiple mating surfaces are formed. Among these mating surfaces, there is a first mating surface M1 in which cooling flow path portions (e.g., the first upper flow path 21 and the second upper flow path 22 described later) are formed in each of two regions separated by the mating surface along the direction of the mating surface, and a second mating surface M2 in which no cooling flow path portion is formed in at least one of the two regions separated by the mating surface along the direction of the mating surface. The second mating surface M2 fixes the first opposing surface 11a and the second opposing surface 10a, while at least a portion of the first mating surface M1 does not fix the first opposing surface 11a and the second opposing surface 10a. The lower plate member 11 has a plate-shaped base 11b and a rectangular protrusion 11c that protrudes rectangularly from the side of the base 11b opposite to the upper plate member 10 (Z2 side). In this embodiment, the lower plate member 11 has a first opposing surface 11a in both the base 11b and the rectangular protrusion 11c.

[0040] like Figure 4 As shown, the mating surface formed between the first upper flow path 21 and the second flow path portion P2 is the first mating surface M1. Additionally, at the left end of the figure, the mating surface formed between the lower plate member 11 and the upper plate member 10 is the second mating surface M2. In this embodiment, the second mating surface M2 has a first upper flow path 21 (eighth flow path portion) forming a flow path in a region on one side of the second mating surface M2 along the direction of the second mating surface M2. Although the first mating surface M1 is configured with the first opposing surface 11a and the second opposing surface 10a in a contact state, it is permissible to have a close proximity with a small gap due to tolerances.

[0041] like Figure 4 As shown, the cooling flow path P is formed by a concave space of the mating surfaces of at least one of the first opposing surface 11a of the lower plate component 11 and the second opposing surface 10a of the upper plate component 10. Furthermore, the concave space is a recess formed in at least one of the first opposing surface 11a and the second opposing surface 10a, and the recess includes a groove, a cutout, or a hole.

[0042] The cooling plate A is positioned so that the first opposing surface 11a formed on the lower plate member 11 overlaps with the second opposing surface 10a formed on the upper plate member 10, while the sealing element is clamped in place. The outer periphery of the mating surface (in the top view, the outer periphery of the cooling plate A) is welded by a laser beam. The mating surface welded by the laser beam is the second mating surface M2. Furthermore, the second mating surface M2 is not limited to welding; it can be joined in a sealed contact state by means of bolt fastening, adhesive bonding, or other methods.

[0043] Through this welding, the cooling plate A integrates the lower plate component 11 and the upper plate component 10, and fixes the position of the cooling flow path P formed at the boundary between the first opposing surface 11a and the second opposing surface 10a. Furthermore, the second mating surface M2 connects and fixes the first opposing surface 11a and the second opposing surface 10a in a tight-fitting state, thus suppressing the phenomenon of a portion of the coolant F flowing into the cooling flow path P flowing out along the second mating surface M2. That is, in the cooling plate A of this embodiment, leakage of coolant F through the second mating surface M2 to the outside can be suppressed, and even if leakage of coolant F through the cooling flow path portion between the first mating surface M1 (in this embodiment, between the first upper flow path 21 and the second flow path portion P2) is allowed, the impact is minimal, so a structure that does not require a seal on the first mating surface M1 can be achieved.

[0044] The mating surfaces of the first opposing surfaces 11a and the second opposing surfaces 10a of the two plate components 10 and 11 are not limited to being formed as a single plane. For example, in order to make the mating surfaces in the vertical direction of the cooling flow path P have different positions, multiple plate components with different positions of the opposing surfaces in the vertical direction can be used to form the cooling plate A.

[0045] Alternatively, the plate components 10 and 11 constituting the cooling plate A can also be connected by multiple mating surfaces with different positions in the vertical direction through mating surfaces in an inclined posture, and the cooling plate A can be constituted by multiple plate components 10 and 11 with opposing surfaces.

[0046] like Figure 4 As shown, the cooling plate A has a second flow path P2 formed in a groove shape on the second opposing surface 10a of the upper plate member 10, and a first upper flow path 21 (eighth flow path P8) and a second upper flow path 22 (eighth flow path P8) formed in a groove shape. Additionally, a cooling space S with an opening opening to the lower surface (Z2 side) of the lower plate member 11 is formed at a location corresponding to the rectangular protrusion 11c of the lower plate member 11. Although details will be described later, the opening of the cooling space S is blocked by the plate-like body 15.

[0047] The second flow path P2 is an upstream cooling flow path in the cooling flow path P, located upstream of the first upper flow path 21 and the second upper flow path 22. The first upper flow path 21 and the second upper flow path 22 become downstream cooling flow paths. These upstream and downstream cooling flow paths are positioned in a non-overlapping relationship in the top view (viewed along the Z direction), suppressing the flow of coolant F between these flow paths. Specifically, the temperature of the coolant F in the second flow path P2 (upstream cooling flow path) is lower than the temperature of the coolant F in the first upper flow path 21 (downstream cooling flow path) and the second upper flow path 22 (downstream cooling flow path). Furthermore, the second flow path P2 is located above the first mating surface M1, while the first upper flow path 21 and the second upper flow path 22 are located below the first mating surface M1. That is, the second flow path P2 is located above the first upper flow path 21 and the second upper flow path 22.

[0048] It is also believed that even if the cooling plate A forms the first opposing surface 11a and the second opposing surface 10a within the specified tolerances during manufacturing, such as Figure 6 As shown, tiny gaps are formed between the contact surfaces, and coolant F leaks only slightly into these gaps.

[0049] That is, such as Figure 6 As shown, sometimes a slight gap is formed between the first mating surface M1 of the first opposing surface 11a of the rectangular protrusion 11c in the lower plate component 11 and the second opposing surface 10a of the upper plate component 10. Because of this gap, coolant F may sometimes leak between the second flow path P2 and the first upper flow path 21. In the event of such leakage, coolant F tends to flow from the upper second flow path P2 to the lower first upper flow path 21 due to its own weight. As described above, in this embodiment, the temperature of the coolant F flowing in the second flow path P2 is lower than that of the coolant F flowing in the first upper flow path 21. Therefore, even in the event of leakage, the coolant F flowing in the first upper flow path 21 is supplied to the cooling space S while suppressing temperature rise, thus preventing a decrease in cooling performance.

[0050] Similarly, for example, in the cooling flow path P, even if the coolant F flows from the upstream flow path to the downstream flow path, the cooling performance will not be reduced. That is, even if a portion of the first opposing surface 11a of the lower plate member 11 and the second opposing surface 10a of the upper plate member 10 are not properly in contact, the flow rate of coolant F flowing to the entire cooling plate A due to leakage will not change, and the cooling performance will not be reduced. In this way, it is not necessary to excessively increase the tolerance of the first opposing surface 11a and the second opposing surface 10a during manufacturing, and a structure that does not require a seal for the mating surface (in this embodiment, the first mating surface M1) can be achieved with a simple manufacturing process.

[0051] like Figure 6 As shown, in the first mating surface M1 formed between the first upper flow path 21 and the second flow path P2, a near-front end T of the longitudinal end having an upstream side in the flow direction of the coolant F in the first upper flow path 21 is formed on the lower plate member 11 (first plate member). The lower plate member 11 is formed with a supply flow path 23 in an inclined posture that causes the coolant F flowing to the first upper flow path 21 to flow obliquely downward. The supply flow path 23 is formed by five supply holes 23a, and is connected to the first upper flow path 21 at the connection point U upstream of the near-front end T at the upper end position in the flow direction of the coolant F. More specifically, the upstream opening end of the supply flow path 23 is formed to connect to the first upper flow path 21 such that the connection point U, which is the lower end, is upstream of the near-front end T, which is the upper end.

[0052] In this structure, the near-front end T comes into contact with the coolant F flowing into the first upper flow path 21, which increases the flow path resistance. However, since the connection point U on the upstream side of the near-front end T is connected to the first upper flow path 21, the situation where the near-front end T restricts the flow of coolant F and the undesirable situation where a portion of the coolant F in the first upper flow path 21 leaks out through the first mating surface M1 can be suppressed.

[0053] In addition, the cooling plate A may also have a recovery flow path that recovers the coolant F leaking through the first mating surface M1 and guides it to the outlet Pb.

[0054] Because the cooling plate A does not use internal piping material, it does not increase the number of components and can be constructed compactly. Furthermore, the cooling plate A forms the cooling flow path P by creating concave spaces at the mating surfaces. Therefore, even if the flow rate of the coolant F per unit time increases due to specifications, only a design change to increase the cross-sectional shape of the concave spaces is needed, avoiding the inconvenience of using large-diameter piping materials as with structures using piping materials.

[0055] [Inverter cooling structure]

[0056] like Figure 4 As shown, inverter 8 is a component that generates three-phase alternating current based on the power supplied from the power source (not shown) and controls the supply to the driving motor, and becomes a heat-generating part that generates a lot of heat during control.

[0057] The eighth flow path P8 for cooling the inverter 8 consists of a first upper flow path 21 (an example of a first cooling flow path), a cooling space S (an example of a second cooling flow path) located below the first cooling flow path and downstream of the flow direction of the coolant F, and a supply flow path 23 that slopes downwards in a manner connecting them.

[0058] Figure 2 This diagram clearly shows the structure of the eighth flow path section P8 when viewed from below (Z2 side) of the lower plate component 11. Specifically, it clarifies the five supply holes 23a constituting the supply flow path section 23 and the sidewall 25 forming the cooling space S (see reference). Figure 3 The inverter 8, plate 15, and five discharge holes 24a constituting the discharge flow path 24 are depicted in a three-dimensional view by removing their wall portions. Therefore, this Figure 2 The shape of the lower plate component 11 is different from the actual shape when viewed from below.

[0059] like Figure 3 , Figure 4 As shown, the inverter 8 connects a flat plate-shaped body 15, which conducts heat from the electronic components, to its upper surface. The plate-shaped body 15 has multiple needle-shaped fins 16 formed on its surface. The plate-shaped body 15 and the multiple needle-shaped fins 16 are formed of a metallic material such as aluminum, which has high thermal conductivity.

[0060] The details of the flow of coolant F will be described later, but the cooling plate A contacts the plate-shaped body 15 and the multiple needle-shaped fins 16 through the coolant F flowing to the eighth flow path section P8. The coolant F removes the heat generated by the inverter 8, thus cooling the inverter 8. The eighth cooling section C8 is formed in this way by supplying coolant F to cool the inverter 8.

[0061] In addition, a plurality of needle-shaped fins 16 are formed on the plate-shaped body 15 in an orthogonal position to the plate surface of the plate-shaped body 15 using needle-shaped members with a circular cross-sectional shape.

[0062] like Figure 4As shown, a plate-like body 15 is provided on the lower surface side of the lower plate member 11. Specifically, the plate-like body 15 is installed to close the opening of the cooling space S formed in the lower plate member 11. The plate-like body 15 has the size to close the opening of the cooling space S. In this way, the plate-like body 15 and the lower plate member 11 together form the cooling space S as a second cooling flow path, so it can also be regarded as part of the lower plate member 11.

[0063] The plate-shaped body 15 is fixed to the lower plate member 11 from the lower surface side using bolts or the like (not shown) to seal the opening of the cooling space S. Furthermore, the plate surface of the plate-shaped body 15, which is thus fixed, is horizontal, and multiple needle-shaped fins 16 are vertically housed inside the cooling space S. Additionally, an annular seal 17 is embedded in the area surrounding the opening of the cooling space S on the lower surface of the lower plate member 11.

[0064] like Figure 4 As shown, the eighth flow path P8 includes a cooling space S, a first upper flow path 21 located upstream of the coolant F in the flow direction across the cooling space S in the top view, and a second upper flow path 22 located downstream. The eighth flow path P8 also includes a supply flow path 23 disposed at an angle between the first upper flow path 21 and the cooling space S, and a discharge flow path 24 disposed at an angle between the cooling space S and the second upper flow path 22. In this embodiment, the cooling space S corresponds to "another cooling flow path located downstream of the downstream cooling flow path in the flow direction of the coolant."

[0065] Each of the first upper flow path 21 and the second upper flow path 22 is formed as a concave space on the second opposing surface 10a of the upper plate member 10 and a groove-shaped concave space on the first opposing surface 11a of the lower plate member 11, along one side of the first mating surface M1. These first upper flow paths 21 and the second upper flow path 22 are arranged at a position higher than the cooling space S.

[0066] That is, the upstream side of the supply flow path 23 communicates with the first upper flow path 21, which is a groove-shaped concave space formed on the second opposing surface 10a, and the downstream end communicates with the cooling space S. Similarly, the upstream end of the discharge flow path 24 communicates with the cooling space S, and the downstream side communicates with the second upper flow path 22, which is a groove-shaped concave space formed on the second opposing surface 10a.

[0067] Furthermore, the second flow path portion P2 is formed on the upper side of the cooling space S, opposite to the first upper flow path 21 and the second upper flow path 22, separated by the first mating surface M1, as a groove-shaped concave space that opens to the second opposing surface 10a of the upper plate member 10. This second flow path portion P2 is positioned in a position that does not communicate with the first upper flow path 21 and the second upper flow path 22.

[0068] In cooling plate A, the temperature of the coolant F flowing into the first upper flow path 21 is lower than the temperature of the coolant F flowing into the cooling space S, the discharge flow path 24, and the second upper flow path 22.

[0069] As described above, the supply flow path 23 is composed of a plurality of (five) supply holes 23a formed in a straight line in an inclined posture, which supplies coolant F from the first upper flow path 21 into the cooling space S. Furthermore, the plurality of (five) supply holes 23a are each formed with an equal inner diameter. The discharge flow path 24 is composed of a plurality of (five) discharge holes 24a formed in a straight line in an inclined posture, which discharge coolant F flowing into the cooling space S into the second upper flow path 22.

[0070] In particular, the plurality of discharge holes 24a and the plurality of supply holes 23a constituting the discharge flow path 24 are formed in the same number and in the top view, the plurality of holes are arranged coaxially with each other in the same shape.

[0071] Five supply holes 23a and discharge holes 24a are arranged side by side in a direction orthogonal to the flow direction of the coolant F, and are provided through the lower plate component 11 in a parallel manner.

[0072] like Figure 4 As shown, when the center of the flow path of the supply hole 23a is set as the supply side centerline L1 and the center of the flow path of the discharge hole 24a is set as the discharge side centerline L2, in the side view, the supply side tilt angle θ1 of the supply side centerline L1 relative to the plate surface of the plate body 15 and the discharge side tilt angle θ2 of the discharge side centerline L2 relative to the plate surface of the plate body 15 are set to equal values.

[0073] Furthermore, the supply-side tilt angle θ1 and the discharge-side tilt angle θ2 do not need to be set to equal values; they can be set to different values. The discharge flow path 24 does not need to be composed of multiple discharge holes 24a; for example, it can be formed as a simple single hole with a width equal to the cooling space S. Additionally, even when the discharge flow path 24 is composed of multiple discharge holes 24a, the number of cooling plates A can be different from the number of supply holes 23a.

[0074] The inverter 8 has a structure in which multiple power control elements (electronic components) such as MOSFETs are supported on the underside of a plate-shaped body 15 while being mounted on a substrate or the like. Thus, during power control of the inverter 8, heat from the multiple power control elements is conducted to the plate-shaped body 15 via heat conduction. Furthermore, to ensure efficient heat conduction, a heat-conducting sheet may be sandwiched between the plate-shaped body 15 and the electronic components (substrate).

[0075] like Figure 3 , Figure 5 As shown, the first upper flow path 21 supplies coolant F to the supply flow path section 23 after passing through the curved flow path section in the top view. In addition, the cooling plate A slightly increases the pressure of the coolant F in the supply holes 23a by making the total cross-sectional area of ​​the multiple (five) supply holes 23a less than the cross-sectional area of ​​the first upper flow path 21 located upstream of the supply flow path section 23, thereby increasing the flow rate and averaging the flow rate of coolant F flowing to each of the multiple (five) supply holes 23a.

[0076] That is, the first upper flow path 21 upstream of the supply flow path 23 is curved in the top view, so the flow velocity of the coolant F is different on the side of the curvature center of the curved flow path and on its outer side, and the flow rate of the coolant F per unit time is different in the width direction of the flow path. In contrast, by setting the cross-sectional area of ​​the flow path, the pressure acting on the upstream end of the plurality of (five) supply holes 23a is slightly increased, thereby achieving uniformity of the flow rate of the coolant F per unit time of each of the plurality of (five) supply holes 23a.

[0077] like Figure 4 As shown, the cooling space S is rectangular in the side view with its lower opening closed by the plate-like body 15. Furthermore, the downstream ends of the plurality of supply holes 23a communicate with the upper corner portions of the cooling space S.

[0078] like Figure 4 As shown in the side view, the point where the supply side centerline L1 intersects with the upper surface of the plate 15 (intersection point) is called the high-temperature region H. The location of this high-temperature region H is the part of the plate surface of the plate 15 where the temperature rises more easily than other plate surfaces due to the heat from the inverter 8.

[0079] By arranging the supply hole 23a in this way, efficient cooling can be achieved by directly supplying coolant F to the high-temperature region H of the plate-shaped body 15. In addition, since the supply hole 23a is connected to the cooling space S in this manner, the downstream end of the supply hole 23a is located at a position separated from the lower surface of the cooling space S by a predetermined distance.

[0080] As described above, the posture of the discharge port 24a is the same as that of the supply port 23a (a linearly symmetrical posture in the side view), so the downstream end of the discharge port 24a is located at a position separated from the bottom wall (the surface of the needle fin 16) of the cooling space S by a set distance upward.

[0081] Furthermore, by connecting the supply hole 23a and the discharge hole 24a at such positions, interference with the seal 17 is avoided. In addition, the area in the plate-shaped body 15 where the temperature rises due to the heat of the inverter 8 is not limited to one location. In the case of multiple locations, the intersection of one of these locations with the supply side centerline L1 is set as the high-temperature area H.

[0082] like Figure 3 , Figure 5 As shown, in the top view (viewed along the Z direction), a plurality of needle-shaped fins 16 are arranged side by side at predetermined intervals in a width direction orthogonal to the direction of coolant F flow, and are arranged in an alternating shape with a predetermined interval in the direction of coolant F flow. Among the plurality of needle-shaped fins 16, the needle-shaped fins arranged at the outer ends in the width direction are separated from the inner side of the sidewall 25 of the cooling space S by a predetermined distance.

[0083] like Figure 5 As shown, in the plurality of supply hole portions 23a, the opening of the supply hole portion 23a located at the central position in the width direction of the cooling space S (position disposed in the central region) is centrally opposed to the middle of the middle of the plurality of needle-shaped fins 16 disposed at the upstream end of the plurality of needle-shaped fins 16 that are adjacent to each other in the width direction.

[0084] That is, the supply flow path section 23 sets the relative positional relationship between the opening of the supply hole section 23a and the needle-shaped fins 16 in such a way that the central flow path center Xc of the supply hole section 23a located in the central position in the width direction is located in the central region (1 / 2 position of the interval between the pair of needle-shaped fins 16) of the adjacent pair of needle-shaped fins 16 in the width direction. As a result, the coolant F supplied from the opening of the supply hole section 23a flows between the pair of needle-shaped fins 16 corresponding to the opening.

[0085] Furthermore, the openings of the multiple supply holes 23a located at both ends in the width direction of the cooling space S are positioned opposite to the multiple needle-shaped fins 16 located at their upstream ends. This establishes a relative positional relationship so that coolant F is directly supplied to the needle-shaped fins 16.

[0086] That is, the relative positional relationship between the supply hole 23a and the needle-shaped fin 16 is set such that the end flow path center Xs of the supply hole 23a arranged at both ends in the width direction intersects with the center of the needle-shaped member constituting the needle-shaped fin 16 in the top view. As a result, the coolant F supplied from the opening of the supply hole 23a flows in a manner that collides with the corresponding needle-shaped fin 16.

[0087] By setting the positional relationship between the multiple supply holes 23a and the multiple needle-shaped fins 16 in this way, the coolant F supplied from the supply hole 23a located in the central region of the width direction of the cooling space S along the central flow path center Xc passes through the middle of the needle-shaped fins 16 arranged at the upstream end of the multiple needle-shaped fins 16, and flows smoothly without stagnating at the upper end of the cooling space S in the supply direction of the coolant F, thereby increasing the contact area between the coolant F and the needle-shaped fins 16.

[0088] In contrast, the coolant F supplied from the supply holes 23a located at both ends of the cooling space S in the width direction along the end flow path center Xs contacts the needle fins 16 arranged on the upstream side of the plurality of needle fins 16 in such a way that it collides with them, separates from the outer and inner sides of the cooling space S in the width direction, and a portion flows in contact with the sidewall 25 of the cooling space S.

[0089] The coolant F flowing into the cooling space S passes through multiple discharge holes 24a in the discharge flow path 24 and is discharged from the discharge port Pb.

[0090] [Effects of the Implementation Method]

[0091] Cooling plate A supplies coolant F to the internal cooling flow path P, and removes heat from the electronic components in the heat exchange plates 10b and 15a, thereby achieving cooling of the electronic components.

[0092] Cooling plate A is a structure in which the lower plate component 11 and the upper plate component 10 are overlapped, and a cooling flow path P is formed on the mating surface. Therefore, for example, a groove or hole can be formed along the mating surface of the lower plate component 11 and the upper plate component 10, and the lower plate component 11 and the upper plate component 10 can be overlapped to create a cooling flow path P.

[0093] For example, compared to a structure in which flow paths are created internally by processing such as perforating a metal block, the cooling plate A of a structure in which the lower plate component 11 and the upper plate component 10 overlap can be formed into a complex-shaped cooling flow path P through relatively easy processing.

[0094] This design forms multiple mating surfaces that overlap the first opposing surface 11a and the second opposing surface 10a. In this design, at least a portion of the first mating surface M1 does not fix the first opposing surface 11a and the second opposing surface 10a. Therefore, leakage of coolant F between the second flow path P2, the first upper flow path 21, and the second upper flow path 22, passing between the first opposing surface 11a and the second opposing surface 10a of the first mating surface M1, is allowed without the need for a seal. Furthermore, in the second mating surface M2, the first opposing surface 11a and the second opposing surface 10a are fixed, thus integrating the lower plate component 11 and the upper plate component 10 and preventing leakage of coolant F passing between the first opposing surface 11a and the second opposing surface 10a of the second mating surface M2 to the outside.

[0095] The cooling plate A formed by overlapping the lower plate component 11 and the upper plate component 10 can, for example, be configured as a second mating surface M2 by overlapping the outer periphery of the lower plate component 11 and the upper plate component 10 in a top view and welding the outer periphery to fix it. In addition, by arranging a plurality of first mating surfaces M1 on the inner side of the outer periphery region, even if coolant F leaks out in the first mating surfaces M1, the cooling performance will not be significantly reduced.

[0096] In the cooling plate A, in the eighth flow path section P8 of the cooling inverter 8, the total value obtained by adding the flow path cross-sectional areas of the plurality of supply hole sections 23a constituting the supply flow path section 23 is set to be less than the flow path cross-sectional area of ​​the first upper flow path 21 located upstream of the supply flow path section 23.

[0097] Therefore, when supplying coolant F from the first upper flow path 21 to the supply flow path 23, the flow rate of coolant F in the supply orifice 23a is increased, while the flow rate of coolant F flowing to each of the multiple (five) supply orifices 23a is averaged per unit time. As a result, if the cooling space S is considered to be a space in the width direction, supplying an equal amount of coolant F to each space can eliminate the deviation in cooling performance in the width direction.

[0098] In addition, the supply flow path 23 is composed of multiple supply holes 23a in an inclined position that becomes lower as it moves downstream. Therefore, the flow rate of the coolant F increases due to its own weight, thereby suppressing the decrease in flow rate when it comes into contact with the multiple needle-shaped fins 16 in the cooling space S.

[0099] The eighth flow path P8 causes the coolant F supplied from the supply hole 23a located in the central region of the width direction of the supply flow path 23 in the plurality of supply hole sections 23a to flow in the plurality of needle-shaped fins 16 in a manner that does not cause a decrease in flow rate, thereby suppressing the stagnation of coolant F inside the cooling space S.

[0100] Furthermore, the eighth flow path section P8 diverts the coolant F by actively contacting the coolant F supplied from the multiple supply holes 23a located at both ends in the width direction of the supply flow path section 23 with the needle-shaped fins 16 arranged at the upstream end of the multiple needle-shaped fins 16, and makes a portion of the diverted coolant F contact the inner surface of the side wall 25 of the cooling space S, thereby increasing the cooling efficiency of the inverter 8.

[0101] In plate-shaped body 15, by along Figure 4 The supply-side centerline L1 shown supplies coolant F in a straight line to the high-temperature region H, where the temperature of the board surface is higher than that of other board surfaces due to heat conduction from the electronic components, thereby enabling efficient cooling of the inverter 8.

[0102] [Other Implementation Methods]

[0103] In addition to the embodiments described above, the present invention may also be configured as follows (components having the same functions as those in the embodiments are labeled with the same numbers and reference numerals as those in the embodiments).

[0104] (a) Cooling plate A may also be a component consisting of three or more stacked plate components. Additionally, the plate components may be made of resin material. The cooling flow path P formed on cooling plate A is not limited to the shape described in the embodiment; for example, it may be configured to a shape corresponding to specifications.

[0105] (b) In the embodiment, although the cooling flow path P is formed as a single flow path from the supply port Pa to the discharge port Pb, it can also be configured, for example, to form a branch point in a part of the cooling flow path P, so that the coolant F flows in a branched manner. In this way, as a structure in which a branch point is formed in a part of the cooling flow path P, the shape of the groove can be set so that the flow path formed in the groove shape (as a concave space) at the mating surface branches at the mating surface.

[0106] (c) As described in some embodiments, when a structure is adopted in which the mating surfaces are formed at different positions (heights) in the vertical direction, for example, the upstream portion of the cooling flow path P is arranged on the mating surface at the higher position, and the downstream portion of the cooling flow path P is arranged on the mating surface at a lower position. With this arrangement, if the coolant F flows to the mating surface due to leakage, the coolant F can be easily made to flow from the cooling flow path P at the higher position to the cooling flow path P at the lower position, and backflow is less likely to occur.

[0107] (d) As for the fins, it is also considered to replace the needle-shaped fins 16 with multiple plate-shaped fins and a plate formed into a corrugated shape. When multiple fins are formed on the plate-shaped body 15, the relative position of each fin to the multiple supply holes 23a can also be arbitrarily set.

[0108] While this does not limit the fins to a specific shape, it is preferable to arrange the fins at predetermined intervals in the width direction within the cooling space S. Furthermore, the arrangement of multiple fins is not limited to an alternating arrangement; they can also be arranged at predetermined intervals in both the width direction and the flow direction of the coolant F, or multiple fins can be randomly arranged in a top view.

[0109] (e) The plurality of supply holes 23a constituting the supply flow path 23 are not limited to a configuration arranged in a row in the width direction. For example, the plurality of supply holes 23a may be arranged in multiple layers. In addition, the flow path cross-sectional areas of the plurality of supply holes 23a may be different. Furthermore, the plurality of supply holes 23a do not need to have the same supply-side tilt angle θ1. The plurality of supply holes 23a may also have different supply-side tilt angles θ1.

[0110] Furthermore, the structures disclosed in the above embodiments (including other embodiments, the same below) can be combined with the structures disclosed in other embodiments as long as they do not create contradictions. In addition, the embodiments disclosed in this specification are examples, and the embodiments of the present invention are not limited thereto. They can be appropriately modified without departing from the purpose of the present invention.

[0111] In the above embodiments, the following structure can be conceived.

[0112] (1) A cooling plate A, which is capable of cooling electronic components (secondary power module 2 and inverter 8) by allowing coolant F to flow into a cooling flow path P, comprises: a plate component having a plate surface that contacts the electronic components (secondary power module 2 and inverter 8) and having a cooling flow path P formed thereon; the plate component having at least two components, a first plate component (lower plate component 11) and a second plate component (upper plate component 10); and having a first opposing surface 11a formed on the first plate component (lower plate component 11) and a second opposing surface 10a formed on the second plate component (upper plate component 10). The overlapping structure forms multiple mating surfaces that form the boundary of the overlap between the first opposing surface 11a and the second opposing surface 10a. The multiple mating surfaces do not have: a first mating surface M1 in each of the two regions separated by the mating surface along the direction of the mating surface, forming a cooling flow path P; and a second mating surface M2 in at least one of the two regions separated by the mating surface along the direction of the mating surface, not forming a cooling flow path P. The second mating surface M2 fixes the first opposing surface 11a and the second opposing surface 10a. At least a portion of the first mating surface M1 does not fix the first opposing surface 11a and the second opposing surface 10a.

[0113] Accordingly, a plurality of mating surfaces are formed with boundaries that overlap the first opposing surface 11a and the second opposing surface 10a. In at least a portion of the first mating surface M1, the first opposing surface 11a and the second opposing surface 10a are not fixed. Therefore, a structure is formed that allows coolant F passing between the first opposing surface 11a and the second opposing surface 10a of the first mating surface M1 to leak into the cooling flow path (between the second flow path P2 and the eighth flow path P8 (the first upper flow path 21 and the second upper flow path 22)) without requiring a seal. Furthermore, in the second mating surface M2, the first opposing surface 11a and the second opposing surface 10a are fixed. Therefore, a structure is formed that integrates the lower plate member 11 (first plate member) and the upper plate member 10 (second plate member), preventing coolant F passing between the first opposing surface 11a and the second opposing surface 10a of the second mating surface M2 from leaking into the area (external) where no cooling flow path is formed. In this way, since it is not necessary to install seals on at least a portion of the multiple mating surfaces, it does not lead to an increase in manufacturing steps or costs. Therefore, it is possible to create a cooling plate that forms a flow path for coolant without increasing the number of components.

[0114] (2) In the cooling plate A of (1), preferably a cooling flow path P includes two cooling flow path sections (second flow path section P2 and eighth flow path section P8 (first upper flow path 21 and second upper flow path 22)) separated by the first mating surface M1. One of the two cooling flow path sections is the upstream cooling flow path section (second flow path section P2), and the other cooling flow path section is the downstream cooling flow path section (eighth flow path section P8 (first upper flow path 21 and second upper flow path 22)) located downstream of the cooling liquid F in the flow direction of the cooling liquid.

[0115] Accordingly, the two cooling flow paths (the second flow path P2 and the eighth flow path P8 (the first upper flow path 21 and the second upper flow path 22)) separated by the first mating surface M1 are contained within a single cooling flow path P. Therefore, even if coolant F leaks through the first mating surface M1 between the two cooling flow paths (between the second flow path P2 and the eighth flow path P8 (the first upper flow path 21 and the second upper flow path 22)), the overall coolant flow rate of the cooling plate A will not change, and the cooling performance will not deteriorate.

[0116] (3) In the cooling plate A of (2), preferably the upstream cooling flow path (second flow path P2) is located above the first mating surface M1, and the downstream cooling flow path (eighth flow path P8) is located below the first mating surface M1. The temperature of the coolant flowing to the upstream cooling flow path (second flow path P2) is lower than the temperature of the coolant F flowing to the downstream cooling flow path (eighth flow path P8).

[0117] Accordingly, for example, the coolant F flows through the first mating surface M1 from either the upstream cooling flow path (second flow path P2) or the downstream cooling flow path (eighth flow path P8 (first upper flow path 21 and second upper flow path 22)). Even if it flows into the other flow path, the overall flow rate of coolant F in the cooling plate A will not change, and the cooling performance will not deteriorate. Furthermore, the upstream cooling flow path (second flow path P2) is located above the first mating surface M1, which is closer to the downstream cooling flow path (eighth flow path P8). Therefore, it is easy for coolant F to leak from the upstream cooling flow path (second flow path P2) to the downstream cooling flow path (eighth flow path P8) through the first mating surface M1. However, according to this structure, the temperature of the coolant F flowing in the upstream cooling flow path section (second flow path section P2) is lower than the temperature of the coolant F flowing in the downstream cooling flow path section (eighth flow path section P8), so the temperature rise of the coolant F flowing in the downstream cooling flow path section (eighth flow path section P8) is suppressed, and the reduction in cooling performance is suppressed.

[0118] (4) In the cooling plate A of (3), the cooling flow path P preferably also has a supply flow path 23 that is inclined downward in a manner that connects the downstream cooling flow path section (the first upper flow path 21 of the eighth flow path section P8) and other cooling flow path sections (cooling space S) located downstream of the downstream cooling flow path section (the first upper flow path 21 of the eighth flow path section P8) in the flow direction of the coolant F. The supply flow path 23 is connected to the upstream side of the end near the front end T of the first mating surface M1 in the flow direction of the coolant F in the flow direction of the coolant F.

[0119] Accordingly, coolant F from the downstream cooling flow path (first upper flow path 21 of the eighth flow path P8) can be supplied to other cooling flow paths (cooling spaces S) located downstream in the flow direction via the inclined supply flow path 23. At this time, the supply flow path 23 is connected to the upstream side of the near-front end T of the first mating surface M1 of the downstream cooling flow path (first upper flow path 21 of the eighth flow path P8) in the flow direction of coolant F. In this structure, the coolant F flowing into the downstream cooling flow path (first upper flow path 21 of the eighth flow path P8) comes into contact with the near-front end T, which easily leads to an increase in flow resistance. However, since the supply flow path 23 is connected to the upstream side of the near-front end T, the coolant F flowing in the downstream cooling flow path (first upper flow path 21 of the eighth flow path P8) easily flows along the downwardly inclined supply flow path 23. Therefore, it is less likely that the coolant F flowing through the upstream cooling flow path (second flow path P2) of the first mating surface M1 will leak out.

[0120] [Potential for industrial applications]

[0121] This invention can be used for cooling plates.

Claims

1. A cooling plate that cools electronic components by directing coolant flow into a cooling path, characterized in that, The aforementioned cooling plate includes a plate surface with contacts to the aforementioned electronic components and a plate component with the aforementioned cooling flow path. The aforementioned plate component has at least two components, a first plate component and a second plate component, and has a structure in which a first opposing surface formed on the first plate component and a second opposing surface formed on the second plate component overlap. The plurality of mating surfaces that form the boundary where the first opposing surface and the second opposing surface overlap include: a first mating surface in each of two regions separated by the mating surface along the direction of the mating surface having a cooling flow path portion formed thereas, and a second mating surface in at least one of the two regions separated by the mating surface along the direction of the mating surface not having the cooling flow path portion formed therein. The second mating surface joins the first opposing surface and the second opposing surface, and at least a portion of the first mating surface does not join the first opposing surface and the second opposing surface.

2. The cooling plate according to claim 1, characterized in that, One of the aforementioned cooling flow paths includes two cooling flow path portions separated by the aforementioned first mating surface. One of the two aforementioned cooling flow paths is an upstream cooling flow path, and the other is a downstream cooling flow path located downstream of the coolant flow direction from one of the aforementioned cooling flow paths.

3. The cooling plate according to claim 2, characterized in that, In the direction of gravity, the upstream cooling flow path is located above the first mating surface, and the downstream cooling flow path is located below the first mating surface. The temperature of the coolant flowing in the upstream cooling flow path is lower than the temperature of the coolant flowing in the downstream cooling flow path.

4. The cooling plate according to claim 3, characterized in that, The aforementioned cooling flow path also includes a supply flow path, which is inclined downwards in a manner that connects the aforementioned downstream cooling flow path and other aforementioned cooling flow paths located downstream of the aforementioned downstream cooling flow path in the flow direction of the coolant. The aforementioned supply flow path is connected to the upstream side of the end near the front end of the aforementioned first mating surface that is upstream in the flow direction of the coolant.

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