A high-efficiency heat dissipation cold plate based on 3D flow channel and micro-jet impact composite structure

By combining a 3D flow channel with a micro-jet impact structure, the heat dissipation plate solves the problems of single heat dissipation method and uneven coolant distribution, achieving efficient and uniform heat dissipation, and is suitable for high-power electronic devices and multi-chip modules.

CN122248699APending Publication Date: 2026-06-19GUANGDONG ZKL TECHNOLOGY GROUP CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GUANGDONG ZKL TECHNOLOGY GROUP CO LTD
Filing Date
2026-04-28
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

Existing heat dissipation plates have a single heat dissipation method, resulting in insufficient heat exchange and an inability to cope with local hot spots or high-power scenarios. Furthermore, uneven distribution of coolant causes temperature gradients, affecting chip lifespan and stability. Low integration leads to bulky size or insufficient sealing reliability.

Method used

Combining 3D flow channels and micro-jet impact structures, it is designed as a closed-loop system of "flow equalization-jet-collection". The micro-jet directly impacts the chip surface and performs secondary heat dissipation through the meandering 3D flow channels. Combined with the sealing ring design, it ensures uniform distribution and sealing of the coolant.

Benefits of technology

It significantly improves heat dissipation efficiency, making it particularly suitable for high-power electronic devices. It solves the problems of high thermal resistance and poor uniformity in traditional heat dissipation methods, enhances heat dissipation capacity and system adaptability, and reduces maintenance costs.

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Abstract

This invention relates to the field of heat dissipation cold plate technology, and proposes a high-efficiency heat dissipation cold plate based on a 3D flow channel and micro-jet impact composite structure. The plate includes an upper plate assembly and a lower plate assembly. The upper plate assembly includes a first plate body, one end of which is fixedly connected to an inlet pipe for introducing coolant. One end of the inner side of the first plate body has a flow equalization cavity communicating with the inlet pipe, and the other end of the inner side of the first plate body has a flow splitting cavity. Several evenly distributed connecting holes are formed between the flow splitting cavity and the flow equalization cavity. A jet impact cavity is formed at the bottom of the first plate body, and a jetting element for spraying coolant is provided inside the jet impact cavity. The lower plate assembly is slidably fitted to the bottom of the first plate body. This invention, through innovative composite structure, achieves a comprehensive improvement in heat dissipation efficiency, reliability, and practicality, providing a reliable solution for high-power electronic devices.
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Description

Technical Field

[0001] This invention relates to the field of heat dissipation cold plate technology, specifically to a high-efficiency heat dissipation cold plate based on a composite structure of 3D flow channels and micro-jet impact. Background Technology

[0002] Heat sinks are key components in electronic device cooling systems, widely used in high-power chips, servers, aerospace, and other fields. As electronic devices evolve towards higher performance and miniaturization, heat flux density continues to increase, and existing cooling methods (such as air cooling or simple liquid cooling) are no longer sufficient to meet the demands for efficient heat dissipation, exhibiting certain technical shortcomings in their implementation. First, the single heat dissipation method of existing heat sinks (such as relying solely on micro-jet or 3D flow channels) may lead to insufficient heat exchange and be unable to cope with local hot spots or high-power scenarios; moreover, uneven distribution of coolant can easily cause temperature gradients, affecting chip lifespan and stability. Second, the existing composite heat dissipation structure of heat dissipation plates has low integration, resulting in large size or insufficient sealing reliability. In view of this, the present invention proposes a high-efficiency heat dissipation cold plate based on a composite structure of 3D flow channel and micro-jet impact. Summary of the Invention

[0003] This invention proposes a high-efficiency heat dissipation cold plate based on a composite structure of 3D flow channel and micro-jet impact, which solves the problem of poor heat dissipation effect caused by the single heat dissipation method of the heat dissipation cold plate in the prior art.

[0004] The technical solution of the present invention is as follows: A high-efficiency heat dissipation cold plate based on a 3D flow channel and micro-jet impact composite structure, comprising an upper plate assembly and a lower plate assembly. The upper plate assembly includes a first plate body, one end of which is fixedly connected to an inlet pipe for introducing coolant. One end of the inner side of the first plate body is provided with a flow equalization cavity communicating with the inlet pipe. The other end of the inner side of the first plate body is provided with a flow splitting cavity. A plurality of evenly distributed connecting holes are provided between the flow splitting cavity and the flow equalization cavity. A jet impact cavity is provided at the bottom of the first plate body, and a jetting element for spraying coolant is provided on the inner side of the jet impact cavity. The lower plate assembly is slidably fitted to the bottom of the first plate body.

[0005] Preferably, a plurality of uniformly distributed flow dividers are fixedly connected to one side of the flow equalization cavity, and the connecting hole is located between two adjacent flow dividers.

[0006] Preferably, the jetting component includes a micro-nozzle plate fixedly connected to the top wall of the jetting impact chamber, and a plurality of nozzles distributed in an array are fixedly connected to the micro-nozzle plate.

[0007] Preferably, the micro-nozzle plate has a hexagonal structure, and the bottom of the flow-dividing cavity has a plurality of flow-dividing holes corresponding to the nozzles, and the plurality of flow-dividing holes are connected to the corresponding nozzles.

[0008] Preferably, the lower plate assembly includes a second plate body, which is slidably fitted with the first plate body and fixed by bolts. One end of the second plate body is provided with a flow collecting groove, and a chip is integrated on the inner side of the flow collecting groove. The chip is located directly below the jet element. A collection cavity is provided on the inner side of the second plate body, and a plurality of evenly distributed integrated 3D flow channels are provided between the collection cavity and the flow collecting groove. One end of the second plate body is fixedly connected to a liquid outlet pipe communicating with the inside of the collection cavity.

[0009] Preferably, the integrated 3D flow channel is composed of several intersecting, meandering branch channels, the inlets of several of the branch channels are connected to the collection trough, and the outlet of the integrated 3D flow channel is connected to the collection cavity.

[0010] Preferably, a sealing ring is provided at the connection between the second plate and the first plate, and the sealing ring is pressed by the second plate being fixed to the first plate.

[0011] Preferably, a plurality of flow guides for guiding coolant are provided at one end of the top of the second plate, and the plurality of flow guides are equidistantly distributed along the width direction of the second plate.

[0012] Preferably, the flow guide includes a partition fixedly connected to the top of the second plate, and a plurality of flow guide inclined plates are fixedly connected to one side of the partition, and the plurality of flow guide inclined plates are equidistantly distributed along the vertical direction.

[0013] Preferably, a plurality of heat dissipation fins are fixedly connected to the top of the first plate, and the plurality of heat dissipation fins are equidistantly distributed along the width direction of the first plate.

[0014] The beneficial effects of this invention are as follows: 1. This invention combines microjets impact cooling with 3D flow channel (three-dimensional vacuum cavity) heat dissipation technology to form a closed-loop system of "uniform flow-jet-collection". Coolant is introduced through the inlet pipe, evenly distributed in the uniform flow cavity, and then directly impacts the chip surface through microjets. It then undergoes secondary heat dissipation through the 3D flow channel before finally being discharged from the outlet pipe. This design significantly improves heat dissipation efficiency, making it particularly suitable for high-power electronic devices. It solves the problems of high thermal resistance and poor uniformity in traditional heat dissipation methods. The microjets rapidly cool local hot spots, while the 3D flow channel extends the coolant path, enhancing overall heat exchange. The complementary nature of these two technologies greatly improves heat dissipation capacity, making it suitable for high-frequency heat load scenarios such as 5G communication and high-performance computing.

[0015] 2. The flow equalization chamber divides the coolant into multiple small channels through a manifold, ensuring uniform flow through the connecting holes into the chamber. This avoids flow dead zones or turbulence caused by uneven pressure, reduces the risk of localized overheating, and makes the coolant distribution more stable, improving heat dissipation consistency. The jetting component uses an array of nozzles on a micro-nozzle plate to generate high-speed micro-jet that directly impacts the chip surface. The micro-jet can disrupt the thermal boundary layer, multiplying the convective heat transfer coefficient, making it particularly suitable for high heat flux density areas (such as CPU / GPU cores). The compact hexagonal nozzle layout reduces flow resistance, provides high spray precision, and enables faster heat dissipation response.

[0016] 3. After impacting the chip, the coolant flows into the manifold, where it extends the heat exchange path through a meandering 3D flow channel. The staggered channel design creates turbulence, enhancing thermal mixing and ensuring uniform heat transfer to the board, preventing heat accumulation. This structure simulates capillary action, supporting phase change heat dissipation (such as evaporation), and its heat dissipation efficiency is significantly improved compared to straight-through channels, making it suitable for multi-chip modules. The flow guides use baffles and inclined guide plates to guide the coolant in layers, ensuring uniform penetration to the bottom of the manifold and reducing stratification. This improves flow uniformity, adapts to variable power applications, and enhances system adaptability.

[0017] 4. The upper and lower plate assemblies are fixed together by sliding fit and bolts, and are pressed together with a sealing ring to effectively prevent coolant leakage. The sealing ring is made of elastic material, maintaining reliability under long-term operation, reducing maintenance costs, and improving product durability. Attached Figure Description

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0019] Figure 1 This is a schematic diagram of the structure of a high-efficiency heat dissipation cold plate based on a 3D flow channel and micro-jet impact composite structure according to an embodiment of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the structure of a high-efficiency heat dissipation cold plate based on a 3D flow channel and micro-jet impact composite structure according to an embodiment of the present invention. Figure 2 ; Figure 3 This is a schematic diagram of the upper plate assembly according to an embodiment of the present invention. Figure 1 ; Figure 4 This is a schematic diagram of the upper plate assembly according to an embodiment of the present invention. Figure 2 ; Figure 5 This is a schematic diagram of the lower plate assembly according to an embodiment of the present invention; Figure 6 This is a cross-sectional view of the second plate body according to an embodiment of the present invention; Figure 7This is a schematic diagram of the integrated 3D flow channel structure according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the flow guide component according to an embodiment of the present invention.

[0020] In the diagram: 10. Upper plate assembly; 101. First plate; 102. Flow equalization chamber; 103. Liquid inlet pipe; 104. Flow splitting chamber; 105. Connecting hole; 106. Flow splitting plate; 107. Flow splitting hole; 108. Jet impact chamber; 109. Micro nozzle plate; 100. Nozzle; 20. Lower plate assembly; 201. Second plate; 202. Sealing ring; 203. Chip; 204. Flow guide; 2041. Partition; 2042. Flow guide ramp; 205. Flow collecting groove; 206. Integrated 3D flow channel; 207. Collection chamber; 208. Liquid outlet pipe; 30. Heat dissipation fins. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0022] like Figures 1 to 8 As shown, this embodiment proposes a high-efficiency heat dissipation cold plate based on a 3D flow channel and micro-jet impact composite structure, including an upper plate assembly 10 and a lower plate assembly 20. The upper plate assembly 10 includes a first plate body 101, one end of which is fixedly connected to an inlet pipe 103 for introducing coolant. One end of the inner side of the first plate body 101 is provided with a flow equalization cavity 102 communicating with the inlet pipe 103. The other end of the inner side of the first plate body 101 is provided with a flow splitting cavity 104. A plurality of evenly distributed connecting holes 105 are provided between the flow splitting cavity 104 and the flow equalization cavity 102. A jet impact cavity 108 is provided at the bottom of the first plate body 101, and a jetting element for spraying coolant is provided on the inner side of the jet impact cavity 108. The lower plate assembly 20 is slidably fitted to the bottom of the first plate body 101.

[0023] In this embodiment, during operation, coolant enters the flow equalization chamber 102 from the inlet pipe 103 and flows evenly into the distribution chamber 104 through the connecting hole 105 under pressure. Subsequently, the coolant enters the jet impact chamber 108 and is sprayed downward by the jet component, directly impacting the surface of the chip 203 on the lower plate assembly 20, achieving micro-jet cooling. After impact, the coolant flows into the collection groove 205 of the lower plate assembly and undergoes secondary heat dissipation through the integrated 3D flow channel 206, finally being discharged from the outlet pipe 208. The entire process realizes a "flow equalization-jet-collection" cycle; through the composite structure, the local high heat flux density cooling of micro-jet impact is combined with the uniform heat dissipation of the 3D flow channel, significantly improving heat dissipation efficiency.

[0024] In a further preferred embodiment of the present invention, a plurality of uniformly distributed flow dividers 106 are fixedly connected to one side of the flow equalization cavity 102, and the connecting hole 105 is located between two adjacent flow dividers 106.

[0025] In this embodiment, the flow divider 106 forms an obstruction within the flow equalization cavity 102. When coolant flows in, the flow divider 106 divides the flow into multiple small channels, allowing the liquid to flow more evenly through the connecting hole 105 into the flow divider cavity 104. This avoids flow dead zones or turbulence caused by uneven inlet pressure; the structure of the flow divider 106 optimizes the flow distribution, ensuring that the coolant pressure is balanced before entering the jet component, reducing the risk of local overheating.

[0026] In a further preferred embodiment of the present invention, the jet component includes a micro-nozzle plate 109 fixedly connected to the top wall of the jet impact cavity 108. A plurality of arrayed nozzles 100 are fixedly connected to the micro-nozzle plate 109. The micro-nozzle plate 109 has a hexagonal structure. A plurality of diversion holes 107 corresponding to the nozzles 100 are opened at the bottom of the diversion cavity 104. The plurality of diversion holes 107 are connected to the corresponding nozzles 100.

[0027] In this embodiment, coolant is sprayed downward from the distribution chamber 104 through the nozzle 100 of the micro-nozzle plate 109. The nozzle 100 has a micron-level aperture to generate a high-speed microjet that directly impacts the surface of the chip 203. The impact force breaks the thermal boundary layer, achieving efficient convective heat transfer. The jet impact chamber 108 provides a buffer space to avoid pressure fluctuations. The microjet impact significantly improves the heat exchange coefficient, making it particularly suitable for hot spots. The hexagonal structure allows for a more compact distribution of the nozzles 100, reducing flow resistance. The flow divider orifice 107 directly guides the coolant from the flow divider chamber 104 into the corresponding nozzle 100, forming an ordered jet path. This geometric optimization avoids cross-flow and improves spray accuracy; the hexagonal layout increases nozzle density and enhances impact uniformity; the corresponding design of the flow divider orifice 107 reduces pressure loss, significantly increasing coolant flow rate. This structure is suitable for high-density integrated circuits, providing better heat dissipation consistency.

[0028] In a further preferred embodiment of the present invention, the lower plate assembly 20 includes a second plate 201, which is slidably fitted with and fixed to the first plate 101 by bolts. A sealing ring 202 is provided at the connection between the second plate 201 and the first plate 101. The sealing ring 202 is pressed by the second plate 201 being fixed to the first plate 101. A flow collecting groove 205 is provided at one end of the second plate 201. A chip 203 is integrated on the inner side of the flow collecting groove 205. The chip 203 is located directly below the jet element. A collection cavity 207 is provided on the inner side of the second plate 201. A plurality of evenly distributed integrated 3D flow channels 206 are provided between the collection cavity 207 and the flow collecting groove 205. One end of the second plate 201 is fixedly connected to an outlet pipe 208 that communicates with the inside of the collection cavity 207.

[0029] In this embodiment, after the microjet impacts the chip 203, the coolant is collected in the manifold 205 and then flows into the integrated 3D flow channel 206. The flow channel adopts a three-dimensional structure, extending the coolant path and increasing the heat exchange area with the plate. Finally, the coolant enters the collection chamber 207 and is discharged from the outlet pipe 208. The chip 203 is directly integrated into the manifold 205, ensuring close contact between the heat source and the coolant; the integrated 3D flow channel provides secondary heat dissipation, avoiding heat accumulation; the chip's built-in design reduces thermal resistance, significantly lowering the overall thermal resistance. This structure is suitable for multi-chip modules and supports high-power operation. The sealing ring 202 is made of an elastic material (such as rubber) that deforms under bolt tightening to fill the gaps between the plates and prevent coolant leakage. The sliding fit design allows the plates to be aligned before being pressed, ensuring a uniform seal. The design of the sealing ring 202 improves reliability, greatly reduces the leakage rate, and is suitable for long-term operation. It is easy to disassemble, reducing maintenance costs. This design enhances the durability and safety of the product.

[0030] In a further preferred embodiment of the present invention, the integrated 3D flow channel 206 is composed of several interlaced, meandering branch channels, the inlets of several branch channels are connected to the collection groove 205, and the outlet of the integrated 3D flow channel 206 is connected to the collection cavity 207.

[0031] In this embodiment, the coolant enters the meandering branch channels from the manifold 205, extending the flow path and increasing the residence time. The staggered distribution of the branch channels creates turbulence, enhancing thermal mixing and allowing heat to be transferred more evenly to the plate. The 3D channel structure simulates capillary action, promoting phase change heat dissipation (such as liquid evaporation). The meandering channels maximize the heat exchange area, significantly improving heat dissipation efficiency compared to straight-through channels. The staggered design reduces flow dead zones, ensuring temperature uniformity, a design particularly significant in high-temperature environments.

[0032] In a further preferred embodiment of the present invention, a plurality of flow guides 204 for guiding coolant are provided at one end of the top of the second plate 201. The plurality of flow guides 204 are equidistantly distributed along the width direction of the second plate 201. The flow guides 204 include a partition 2041 fixedly connected to the top of the second plate 201. A plurality of flow guide inclined plates 2042 are fixedly connected to one side of the partition 2041. The plurality of flow guide inclined plates 2042 are equidistantly distributed along the vertical direction.

[0033] In this embodiment, the baffle 2041 divides the flow into multiple channels, and the guide plate 2042 is inclined to guide the coolant downwards layer by layer, forming a stratification effect. This allows the liquid flow to penetrate more evenly to the bottom of the collection tank 205, reducing stratification; the design of the guide plate 2042 improves the guiding accuracy, greatly enhances the flow uniformity, and its vertical distribution adapts to different flow rates, enhancing adaptability. This embodiment is particularly suitable for variable power applications.

[0034] In a further preferred embodiment of the present invention, a plurality of heat dissipation fins 30 are fixedly connected to the top of the first plate 101, and the plurality of heat dissipation fins 30 are equidistantly distributed along the width direction of the first plate 101.

[0035] In this embodiment, the heat dissipation fins 30 increase the surface area of ​​the first plate 101 and assist in heat dissipation through natural convection or forced air cooling. When the coolant flows inside, the heat dissipation fins 30 dissipate some of the heat to the environment, forming a "liquid cooling + air cooling" composite heat dissipation. The fins greatly improve the overall heat dissipation capacity, especially at low flow rates, to compensate for insufficient liquid cooling. The structure is simple and the cost is low. This design expands the application scenarios, such as outdoor equipment or space-constrained environments.

[0036] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-efficiency heat dissipation cold plate based on 3D flow channel and micro-jet impact composite structure, comprising an upper plate assembly (10) and a lower plate assembly (20), characterized in that, The upper plate assembly (10) includes a first plate (101), one end of which is fixedly connected to an inlet pipe (103) for introducing coolant. One end of the inner side of the first plate (101) is provided with a flow equalization chamber (102) communicating with the inlet pipe (103). The other end of the inner side of the first plate (101) is provided with a flow splitting chamber (104). A plurality of evenly distributed connecting holes (105) are provided between the flow splitting chamber (104) and the flow equalization chamber (102). A jet impact chamber (108) is provided at the bottom of the first plate (101). A jetting element for spraying coolant is provided on the inner side of the jet impact chamber (108). The bottom of the first plate (101) is slidably fitted with a lower plate assembly (20).

2. The high-efficiency cooling plate based on 3D flow channel and micro-jet impact composite structure according to claim 1, characterized in that, A number of uniformly distributed flow dividers (106) are fixedly connected to one side of the flow equalization cavity (102), and the connecting hole (105) is located between two adjacent flow dividers (106).

3. The high-efficiency heat dissipation cold plate based on a 3D flow channel and micro-jet impact composite structure according to claim 1, characterized in that, The jet component includes a micro-nozzle plate (109) fixedly connected to the top wall of the jet impact chamber (108), and a plurality of arrayed nozzles (100) are fixedly connected to the micro-nozzle plate (109).

4. The high-efficiency heat dissipation cold plate based on a 3D flow channel and micro-jet impact composite structure according to claim 3, characterized in that, The micro-nozzle plate (109) has a hexagonal structure, and the bottom of the flow-dividing cavity (104) is provided with a plurality of flow-dividing holes (107) corresponding to the nozzles (100) one by one. The plurality of flow-dividing holes (107) are connected to the corresponding nozzles (100).

5. The high-efficiency heat dissipation cold plate based on a 3D flow channel and micro-jet impact composite structure according to claim 1, characterized in that, The lower plate assembly (20) includes a second plate (201), which is slidably fitted with the first plate (101) and fixed by bolts. One end of the second plate (201) is provided with a flow collecting groove (205). A chip (203) is integrated inside the flow collecting groove (205). The chip (203) is located directly below the jet component. A collection cavity (207) is provided inside the second plate (201). A plurality of evenly distributed integrated 3D flow channels (206) are provided between the collection cavity (207) and the flow collecting groove (205). One end of the second plate (201) is fixedly connected to an outlet pipe (208) that communicates with the inside of the collection cavity (207).

6. The high-efficiency heat dissipation cold plate based on a 3D flow channel and micro-jet impact composite structure according to claim 5, characterized in that, The integrated 3D flow channel (206) is composed of several intersecting, meandering branch channels. The inlets of several of the branch channels are connected to the collection trough (205), and the outlet of the integrated 3D flow channel (206) is connected to the collection chamber (207).

7. The high-efficiency heat dissipation cold plate based on a 3D flow channel and micro-jet impact composite structure according to claim 5, characterized in that, A sealing ring (202) is provided at the connection between the second plate (201) and the first plate (101). The second plate (201) presses the sealing ring (202) together with the first plate (101).

8. The high-efficiency heat dissipation cold plate based on a 3D flow channel and micro-jet impact composite structure according to claim 5, characterized in that, The top end of the second plate (201) is provided with a plurality of flow guides (204) for guiding the coolant, and the plurality of flow guides (204) are equidistantly distributed along the width direction of the second plate (201).

9. A high-efficiency heat dissipation cold plate based on a 3D flow channel and micro-jet impact composite structure according to claim 8, characterized in that, The flow guide (204) includes a partition (2041) fixedly connected to the top of the second plate (201), and a plurality of flow guide inclined plates (2042) are fixedly connected to one side of the partition (2041), and the plurality of flow guide inclined plates (2042) are equidistantly distributed along the vertical direction.

10. The high-efficiency heat dissipation cold plate based on a 3D flow channel and micro-jet impact composite structure according to claim 1, characterized in that, A plurality of heat dissipation fins (30) are fixedly connected to the top of the first plate (101), and the plurality of heat dissipation fins (30) are equidistantly distributed along the width direction of the first plate (101).