A potting tool and a potting method

Abstract

This invention relates to the field of electronic component potting technology, and discloses a potting fixture and potting method, including: a potting base plate and a positioning plate disposed on the potting base plate, further including: a positioning hole formed above the positioning plate; a positioning groove formed below the positioning plate; a positioning core fixed in the positioning groove; and an adjusting component fixed above the positioning plate. This invention achieves precise control of the potting process through the coordinated operation of a temperature sensor, a laser displacement sensor, an electric telescopic rod, a sensing box, a positive terminal, a negative terminal, a shape memory alloy wire, a rubber septum, and a strain gauge; applying a constant voltage to the positive and negative terminals controls the retraction of the shape memory alloy wire, driving the rubber septum to precisely reset; during the impact process, the surface flatness is monitored simultaneously by the laser displacement sensor until the sedimentation stabilizes, ensuring that the potting compound fully fills the gaps and lead areas, avoiding potting voids, and improving the electrical insulation and mechanical stability of the product.

Description

Technical Field

[0001] This invention relates to the field of electronic component potting technology, specifically to a potting tool and potting method. Background Technology

[0002] In the production and processing of electronic components, the potting process is a key step in ensuring the stability and reliability of electronic components. By injecting potting compound into the gap between the electronic component and the casing and then curing it, the electrical insulation performance, mechanical structural stability and resistance to environmental interference of the electronic component can be effectively improved, enabling the electronic component to adapt to complex working environments.

[0003] Current electronic component potting operations primarily rely on various potting fixtures for positioning and dispensing. However, these fixtures still suffer from several technical shortcomings in practical applications, the most prominent being the problem of potting voids. Specifically, existing potting fixtures often employ a single-volume dispensing method. Due to the dense distribution of electronic component pins and the typically narrow gaps between the component and its casing, the dispensing adhesive is easily obstructed by the pins during flow, preventing it from fully filling all gaps. Furthermore, air bubbles generated during flow and curing are difficult to expel, resulting in potting voids after curing. These voids deprive the corresponding areas of the electronic component of the protective and fixing effect of the potting adhesive. This significantly reduces the electrical insulation performance of the component, making it prone to short circuits and leakage, and weakens its mechanical structural strength. Under vibration and impact conditions, the component is susceptible to loosening and damage, severely impacting its lifespan and safety. Furthermore, existing potting fixtures lack precise monitoring and dynamic control mechanisms for the gel state of the potting adhesive, making it impossible to adjust the potting strategy according to the curing process of the adhesive. This further increases the probability of potting voids and makes it difficult to meet the potting quality requirements of high-precision electronic components. Summary of the Invention

[0004] This invention provides a potting tool and potting method for effectively potting electronic components.

[0005] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows: In a first aspect, a potting fixture includes: a potting base plate and a positioning plate disposed on the potting base plate, and further includes: A positioning hole is formed above the positioning plate; a positioning groove is formed below the positioning plate; a positioning core is fixed on the potting base plate and located in the positioning groove; an adjusting component is fixed above the positioning plate; and two sets of sensing components are provided, both sets of which are fixed on the adjusting component. The U-shaped plate is located above the positioning plate; the support frame is fixed on both sides of the U-shaped plate; the sliding column is fixed on the support frame; the sliding seat is slidably mounted on the sliding column on both sides; the electric telescopic rod has its non-telescopic end fixed on the sliding seat; and the docking frame is fixed on the telescopic end of the electric telescopic rod. A sensing box is fixed below the docking frame; a rubber groove is formed inside the sensing box; a mounting base is fixed inside the sensing box and located at the rubber groove; a rubber septum is fixed on the mounting base and located inside the rubber groove; two electrode seats are provided, and the two electrode seats are respectively fixed on both ends of the rubber septum; a positive electrode post is fixed on the first electrode seat; a negative electrode post is fixed on the second electrode seat; a shape memory alloy wire is fixed at one end to the positive electrode post and at the other end to the negative electrode post; a pneumatic channel is formed inside the sensing box; a pneumatic tube is fixed on the sensing box; a pneumatic cover is threaded onto the pneumatic tube; a pneumatic ring seat is fixed inside the pneumatic cover; an elastic diaphragm is fixed on the pneumatic ring seat; a strain gauge is fixed on the side of the elastic diaphragm away from the pneumatic tube; a temperature sensor is fixed inside the sensing box; and a laser displacement sensor is fixed on the sensing box.

[0006] Furthermore, it also includes: The first threaded hole is located at one of the four corners of the positioning plate; the second threaded hole is located at one of the four corners of the potting base plate; the first bolt is threaded into the first threaded hole and the second threaded hole.

[0007] Furthermore, the adjusting member also includes: Two docking plates are provided, and the two docking plates are respectively fixed at both ends of the U-shaped plate; two pin plates are provided, and the two pin plates are respectively slidably inserted into both ends of the positioning groove; tighten the nut, and screw it into the slide block.

[0008] Furthermore, the adjusting member also includes: The third threaded hole is located on the mating plate; the fourth threaded hole is located on the pin plate; the second bolt is threaded into the third and fourth threaded holes.

[0009] Furthermore, the adjusting member also includes: The threaded rod has threads on all four sides of the spiral plate; the torsion bar is fixed to the threaded rod; and the rubber block is fixed to the end of the threaded rod away from the torsion bar.

[0010] Furthermore, the sensing element also includes: The gas injection channel is located inside the sensor box; the gas injection tube is fixed to the sensor box; and the airtight cover is screwed onto the gas injection tube.

[0011] Furthermore, the sensing element also includes: A spring ring seat is fixed inside the air injection channel; an airtight ring is fixed inside the air injection pipe; an airtight core is located between the spring ring seat and the airtight ring; and an airtight spring is fixed at one end to the spring ring seat and at the other end to the airtight core.

[0012] Furthermore, the shape memory alloy wire is fixed with a connecting block, which is fixed to the rubber septum.

[0013] Firstly, a potting method using a potting tool, the steps of which are as follows: S1. Insert the pins of the electronic component to be potted into the positioning holes of the positioning plate, so that the pins extend into the positioning core to achieve precise positioning; take the metal shell and put it on the outside of the electronic component, and place it stably on the positioning plate to ensure that a uniform gap is formed between the metal shell and the electronic component. S2. Insert the two pin plates into the two ends of the positioning groove respectively, place the U-shaped plate above the positioning plate, align the mating plate with the pin plate, and fix the U-shaped plate by screwing the first bolt into the third threaded hole and the fourth threaded hole; twist the torsion bar to drive the threaded rod to feed, so that the rubber block is tightly pressed against the outside of the metal shell, and the auxiliary fixing of the metal shell is completed. S3. Twist the airtight cover to open the gas injection pipe, and inject high-pressure gas into the induction box through the external gas injection device. This pushes the airtight core away from the airtight ring and compresses the airtight spring. After the induction box is full of gas, stop the gas injection. The airtight spring drives the airtight core to reset and seal the gas injection channel. At this time, the shape memory alloy wire is in a non-energized state and has no shrinkage deformation. The rubber diaphragm remains in a downward bulging state under the action of the high-pressure gas in the induction box. The initial gas pressure of the induction box is detected by the strain gauge, and the initial temperature is detected by the temperature sensor. The reference parameters are stored. Manually push the slide block to slide along the slide column so that the induction box is aligned between the electronic components and the metal shell. S4. Inject potting compound into the gap between the metal casing and electronic components in three batches according to the preset amount, and perform precise control of the gel state and adaptive filling optimization operation. S5. After the third injection, the surface height of the potting compound is detected in real time by a laser displacement sensor and compared with the preset total height to ensure that the height error is controlled within the preset threshold, thus confirming that the potting compound has reached the preset total height. At the same time, temperature and air pressure data in the sensing box are continuously collected by temperature sensors and strain gauges. If the fluctuation amplitude of temperature and air pressure data within the preset time is less than the corresponding preset threshold, the gel state is determined to be stable. The shape memory alloy wire is controlled to operate at a low amplitude on-off frequency. When energized, the shape memory alloy wire retracts and deforms, pulling the rubber spacer from the bulging state back to the horizontal state. When de-energized, the shape memory alloy wire loses its retraction force and returns to its initial length. Under the action of the pre-stored air pressure in the sensing box, the rubber spacer bulges downward again and gently taps the surface of the potting compound. The air pressure fluctuation in the sensing box is detected in real time by strain gauges. If the air pressure fluctuation is uniform and there are no abnormal sudden changes, it is confirmed that the potting compound has no surface depressions or internal void defects, and the potting operation is completed.

[0014] Furthermore, the precise control and adaptive filling optimization based on the gel state of S4 are as follows: S4.1 Based on the temperature data collected in real time by the temperature sensor, the waiting time is dynamically adjusted to ensure that the potting compound enters the initial gelation stage accurately; during this period, the amount of surface sedimentation of the potting compound is monitored by the laser displacement sensor, and the initial sedimentation data is recorded as the basis for subsequent filling compensation. S4.2 Start the electric telescopic rod to slowly extend, driving the induction box to move downwards in the vertical direction; the laser displacement sensor provides real-time feedback on the position coordinates of the potting compound surface, and the extension of the electric telescopic rod is adjusted in a closed loop to form a preset detection gap between the lower surface of the induction box and the surface of the potting compound, and the gap error is controlled within ±0.02mm; S4.3 Apply a constant voltage to the positive and negative terminals. When the shape memory alloy wire is energized, it undergoes a retraction deformation, pulling the rubber septum from the bulging state to a precise return to the horizontal state. Immediately afterward, the power supply is cut off, the shape memory alloy wire loses the voltage effect, the retraction deformation disappears, and it returns to its initial length. The pre-stored air pressure in the sensing box then pushes the rubber septum back up, and the rubber septum remains in the bulging state. The air pressure change data is collected in real time by the strain gauge, and the temperature data collected synchronously by the temperature sensor is combined for error compensation to generate a set of air pressure and temperature data. Based on this, the early, middle, and late gelation stages of the potting compound can be accurately determined. S4.4. Determined to be in the transition from the initial to the middle stage of gelation, based on the pressure and temperature data generated in S4.3, the on / off frequency of the shape memory alloy wire is dynamically adjusted. When energized, the shape memory alloy wire retracts, causing the rubber spacer to reset. When de-energized, the shape memory alloy wire resets, and the rubber spacer is lifted by the air pressure. Through this on / off cycle, the rubber spacer generates an adaptive amplitude up-and-down striking motion, continuously acting on the surface of the potting compound. During the on / off process, the air pressure fluctuation amplitude inside the sensing box is monitored in real time using strain gauges, and the on / off interval is adjusted in a closed loop to generate an adaptive amplitude striking motion of the rubber spacer. Simultaneously, the surface flatness of the potting compound is monitored by a laser displacement sensor during the striking process until the surface settlement stabilizes within a preset threshold, at which point the striking stops to ensure that the potting compound fully fills the gaps and the area around the pins. S4.5 When it is determined that the gel is in the transition from the middle stage to the late stage, the electric telescopic rod is started to retract at a constant speed, driving the docking frame and the sensing box back to the initial position. During the retraction process, the final surface height of the potting compound is detected again by the laser displacement sensor, and the actual filling height data after the injection is recorded. This provides a basis for the dosage correction of the next quantitative injection, ensuring that the cumulative height of the injections is accurately matched with the preset potting height.

[0015] The above-described solution of the present invention has at least the following beneficial effects: This invention achieves precise control of the potting process through the coordinated operation of a temperature sensor, a laser displacement sensor, an electric telescopic rod, an induction box, a positive electrode post, a negative electrode post, a shape memory alloy wire, a rubber spacer, and a strain gauge. A gel state detection system is constructed using the air pressure within the induction box. This system, combined with pressure data collected by the strain gauge and temperature data from the temperature sensor to compensate for errors, generates a set of pressure and temperature data that accurately determines the gelation stage of the potting adhesive. Compared to traditional detection methods, this significantly improves detection accuracy and efficiency. The pressure and temperature data set adjusts the rubber spacer to generate adaptive amplitude tapping motion. Specifically, during the transition from the initial to the middle gelation stage, the on / off frequency of the shape memory alloy wire is dynamically adjusted, and the interval is adjusted in a closed loop to monitor pressure fluctuations using the strain gauge. This allows the tapping amplitude of the rubber spacer to change with the gelation process. The system adapts to the glue's state in real time; it dynamically adjusts the waiting time using real-time temperature data from a temperature sensor to ensure the potting compound accurately enters the initial gelation stage; it simultaneously monitors and records the surface sedimentation of the potting compound using a laser displacement sensor, providing a basis for filling compensation and avoiding insufficient filling; an electric telescopic rod moves the sensing box, and in conjunction with real-time feedback from the laser displacement sensor, it achieves closed-loop adjustment, controlling the detection gap error within ±0.02mm, further ensuring detection stability; a constant voltage is applied to the positive and negative terminals to control the retraction of the shape memory alloy wire, causing the rubber spacer to accurately reset; during the tapping process, the surface flatness is monitored simultaneously using a laser displacement sensor until the sedimentation stabilizes, ensuring that the potting compound fully fills the gaps and pin areas, avoiding potting voids, and improving the product's electrical insulation and mechanical stability. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of a potting tool provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of a positioning plate structure for a potting tool provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the filling base plate structure of a filling tool provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the spiral plate structure of a potting tool provided in an embodiment of the present invention; Figure 5 A potting tool provided in an embodiment of the present invention Figure 4 Enlarged view of point A; Figure 6 This is a schematic diagram of the induction box structure of a potting tool provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of the shape memory alloy wire structure of a potting tool provided in an embodiment of the present invention; Figure 8 A potting tool provided in an embodiment of the present invention Figure 7 Enlarged view of point B; Figure 9 A potting tool provided in an embodiment of the present invention Figure 7 Enlarged view of point C; Figure 10 A potting tool provided in an embodiment of the present invention Figure 7 Enlarged view of point D; Figure 11 This is a schematic diagram of the pin plate structure of a potting tool provided in an embodiment of the present invention.

[0017] Explanation of reference numerals in the attached figures: In the diagram: 1. Encapsulation base plate; 2. Positioning plate; 3. Positioning hole; 4. Positioning groove; 5. Positioning core; 6. Adjusting component; 601. U-shaped plate; 602. Support frame; 603. Sliding column; 604. Sliding seat; 605. Electric telescopic rod; 606. Connecting frame; 607. Connecting plate; 608. Pin plate; 609. Tightening nut; 6010. Third threaded hole; 6011. Fourth threaded hole; 6012. Second bolt; 6013. Threaded rod; 6014. Torsion bar; 6015. Rubber block; 7. Sensing component; 701. Sensing box; 702. Rubber groove; 703. Mounting base; 704. Rubber septum; 70 5. Electrode holder; 706. Positive electrode post; 707. Negative electrode post; 708. Shape memory alloy wire; 709. Air pressure channel; 7010. Air pressure tube; 7011. Air pressure cover; 7012. Air pressure ring seat; 7013. Elastic diaphragm; 7014. Strain gauge; 7015. Temperature sensor; 7016. Laser displacement sensor; 7017. Air injection channel; 7018. Air injection tube; 7019. Airtight cover; 7020. Spring ring seat; 7021. Airtight ring; 7022. Airtight core; 7023. Airtight spring; 7024. Connecting block; 8. First threaded hole; 9. Second threaded hole; 10. First bolt. Detailed Implementation

[0018] Exemplary embodiments of the invention will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0019] like Figures 1 to 11 As shown, an embodiment of the present invention provides a potting fixture, including: a potting base plate 1 and a positioning plate 2 disposed on the potting base plate 1, and further including: Positioning hole 3 is formed above positioning plate 2; positioning groove 4 is formed below positioning plate 2; positioning core 5 is fixed on potting base plate 1 and located in positioning groove 4; adjusting component 6 is fixed above positioning plate 2; sensing component 7 is provided in two sets, and both sets of sensing components 7 are fixed on adjusting component 6; first threaded hole 8 is formed on the four corners of positioning plate 2; second threaded hole 9 is formed on the four corners of potting base plate 1; first bolt 10 is threaded into the first threaded hole 8 and the second threaded hole 9.

[0020] Specifically, the potting base plate 1 and the positioning plate 2 are detachably fixed by screwing the first bolt 10 into the corresponding first threaded hole 8 and second threaded hole 9 to ensure the stability of the overall structure; the positioning hole 3 is used to insert the pins of the potting electronic components, and together with the positioning core 5, the pins are accurately positioned to avoid the components from shifting during the potting process.

[0021] In another preferred embodiment of the present invention, the adjusting member 6 includes: a U-shaped plate 601 located above the positioning plate 2; a support frame 602 fixed on both sides of the U-shaped plate 601; a sliding column 603 fixed on the support frame 602; a sliding seat 604 slidably disposed on the sliding column 603 on both sides; an electric telescopic rod 605 with its non-telescopic end fixed on the sliding seat 604; and a docking frame 606 fixed on the telescopic end of the electric telescopic rod 605. The adjusting component 6 also includes: two docking plates 607, which are fixed to both ends of the U-shaped plate 601; two pin plates 608, which are slidably inserted into both ends of the positioning groove 4; a tightening nut 609, which is threaded into the slide block 604; a third threaded hole 6010, which is formed on the docking plate 607; a fourth threaded hole 6011, which is formed on the pin plate 608; a second bolt 6012, which is threaded into the third threaded hole 6010 and the fourth threaded hole 6011; a threaded rod 6013, which is threaded on all four sides of the U-shaped plate 601; a torsion bar 6014, which is fixed to the threaded rod 6013; and a rubber block 6015, which is fixed to the end of the threaded rod 6013 away from the torsion bar 6014.

[0022] Specifically, the slide 604 slides along the slide column 603 to adjust the lateral position of the sensor 7. Tightening the nut 609 positions the slide 604. The electric telescopic rod 605 can drive the docking frame 606 and the sensor 7 to adjust their height, meeting the monitoring position requirements of different dispensing stages.

[0023] In another preferred embodiment of the present invention, the sensing element 7 includes: a sensing box 701 fixed below the docking frame 606; a rubber groove 702 formed inside the sensing box 701; a mounting base 703 fixed inside the sensing box 701 and located at the rubber groove 702; a rubber partition 704 fixed on the mounting base 703 and located inside the rubber groove 702; two electrode seats 705, respectively fixed at both ends of the rubber partition 704; a positive electrode post 706 fixed on the first electrode seat 705; a negative electrode post 707 fixed on the second electrode seat 705; and a shape memory alloy wire 708. One end is fixed to the positive terminal 706, and the other end is fixed to the negative terminal 707; a pressure channel 709 is opened inside the sensing box 701; a pressure tube 7010 is fixed to the sensing box 701; a pressure cover 7011 is screwed onto the pressure tube 7010; a pressure ring seat 7012 is fixed inside the pressure cover 7011; an elastic diaphragm 7013 is fixed to the pressure ring seat 7012; a strain gauge 7014 is fixed on the side of the elastic diaphragm 7013 away from the pressure tube 7010; a temperature sensor 7015 is fixed inside the sensing box 701; and a laser displacement sensor 7016 is fixed to the sensing box 701.

[0024] The sensing element 7 also includes: an air injection channel 7017, which is opened inside the sensing box 701; an air injection tube 7018, which is fixed to the sensing box 701; an airtight cover 7019, which is threaded onto the air injection tube 7018; a spring ring seat 7020, which is fixed inside the air injection channel 7017; an airtight ring 7021, which is fixed inside the air injection tube 7018; an airtight core 7022, which is located between the spring ring seat 7020 and the airtight ring 7021; an airtight spring 7023, which is fixed at one end to the spring ring seat 7020 and at the other end to the airtight core 7022; and a shape memory alloy wire 708 with a connecting block 7024 fixed to it, the connecting block 7024 being fixed to the rubber diaphragm 704.

[0025] Specifically, the shape memory alloy wire 708 is controlled to extend and retract by switching the positive terminal 706 and the negative terminal 707 on and off, which in turn causes the rubber septum 704 to deform; the air pressure inside the sensing box 701 is transmitted to the elastic diaphragm 7013 through the air pressure channel 709, and the strain gauge 7014 senses the deformation of the diaphragm to obtain air pressure data. Combined with the temperature data detected by the temperature sensor 7015, the gel state of the potting compound can be determined; the laser displacement sensor 7016 can monitor the position of the potting compound surface in real time to ensure that the amount of potting compound is accurate and controllable.

[0026] The pins of the electronic component to be potted are inserted into the positioning holes 3 of the positioning plate 2, and the pins extend into the positioning core 5 for precise positioning. After pin positioning is completed, the metal casing is removed and placed on the outside of the electronic component, ensuring that the metal casing is placed stably above the positioning plate 2, with a uniform gap between the metal casing and the electronic component. Subsequently, potting compound is poured into the gap. The potting fixture of this invention uses a three-stage pouring method for the potting compound. This method can effectively avoid insufficient filling of the gaps and around the pins when the potting compound is poured in at once, thereby preventing the formation of potting voids after the potting compound solidifies. Potting voids will cause the corresponding area to be unable to be fixed and protected by the potting compound, seriously damaging the electrical insulation performance and mechanical structural stability of the product, affecting the product's service life and safety.

[0027] Twisting the airtight cover 7019 opens the air injection pipe 7018, allowing the external inflation device to inject high-pressure gas into the device through the air injection pipe 7018. The high-pressure gas acts on the airtight core 7022, pushing it away from the airtight ring 7021. Simultaneously, the airtight core 7022 compresses the airtight spring 7023, generating elastic potential energy. The high-pressure gas then enters the sensor box 701 through the air injection pipe 7018 and the air injection channel 7017, causing the rubber diaphragm 704 to bulge downwards. Once the sensor box 701 is filled with high-pressure gas, the external inflation device stops operating, and the airtight spring 7023 releases its elastic potential energy, generating a rebound force that resets the airtight core 7022. The airtight ring 7021 is then re-attached to seal the air injection channel 7017. The air pressure inside the sensing box 701 enters the air pressure cover 7011 through the air pressure channel 709 and the air pressure pipe 7010. The air pressure pushes the elastic diaphragm 7013 upward, and the strain gauge 7014 senses the deformation of the elastic diaphragm 7013, thereby detecting the initial air pressure data inside the sensing box 701. At the same time, the temperature sensor 7015 is activated to detect the initial temperature data inside the sensing box 701, providing reference parameters for subsequent detection.

[0028] First, insert one end of each of the two pin plates 608 into the two ends of the positioning groove 4 to achieve initial positioning of the adjusting component 6 and the positioning plate 2. Then, place the U-shaped plate 601 on top of the positioning plate 2 and adjust its position so that the mating plates 607 at both ends of the U-shaped plate 601 are precisely aligned with the corresponding pin plates 608. Next, screw the first bolt 10 into the third threaded hole 6010 of the mating plate 607 and the fourth threaded hole 6011 of the pin plate 608 to firmly fix the U-shaped plate 601 onto the positioning plate 2 through the threaded fastening action. Twist the torsion bar 6014, which drives the threaded rod 6013 to perform a spiral feeding motion on the four sides of the U-shaped plate 601. The feeding of the threaded rod 6013 drives the rubber block 6015 to gradually approach the metal shell until the rubber block 6015 is tightly pressed against the outer wall of the metal shell, thereby achieving auxiliary fixation of the metal shell and preventing the metal shell from shifting during the potting process.

[0029] The slide block 604 is manually pushed along the slide post 603 to move the sensor box 701 synchronously until the sensor box 701 is precisely aligned with both sides of the electronic component. After the adjustment is completed, the screw nut 609 is turned and tightened so that the threaded end of the screw nut 609 is tightly pressed against the surface of the slide post 603. The friction force fixes the slide block 604 on the slide post 603, ensuring that the sensor box 701 is kept in the set detection position.

[0030] This invention's potting fixture completes the operation by pouring potting compound in three stages. Each stage involves pouring a preset quantitative amount of potting compound. This quantitative, staged potting method significantly reduces the probability of potting voids that occur when pouring the potting compound all at once. After each pour, a set time is waited until the potting compound is in a gel state. Then, the electric telescopic rod 605 is activated, extending its telescopic end and causing the docking frame 606 to move downwards. Simultaneously, the docking frame 606 moves the sensing box 701 downwards. Finally, the laser displacement sensor 7016 is activated to detect the potting compound's position using laser light. Based on the detection data, the extension of the electric telescopic rod 605 is adjusted to ensure that the sensing box 701 is tightly attached to the top of the potting compound, while maintaining a set gap between them. During the extension of the electric telescopic rod 605, power is supplied to the positive terminal 706 and the negative terminal 707. After the shape memory alloy wire 708 is energized, it undergoes a retraction deformation. The retraction force pulls the bulging rubber septum 704 back to a parallel state, no longer maintaining the bulging shape. The temperature sensor 7015 detects the real-time temperature data inside the sensing box 701 and detects the air expansion rate when the internal temperature of the sensing box 701 rises.

[0031] During the potting compound gel state detection and auxiliary filling stage, the power supply to the shape memory alloy wire 708 is cut off. The original air pressure inside the sensing box 701 pushes up the rubber septum 704 again. The bulging rubber septum 704 is blocked by the potting compound in the gel state. At this time, the air pressure inside the sensing box 701 is the detection air pressure corresponding to the gel state. Through the deformation transmission of the elastic diaphragm 7013, the strain gauge 7014 detects the air pressure data value inside the sensing box 701, and determines whether the gel state of the potting compound is in the early stage of gelation, the middle stage of gelation, or the late stage of gelation.

[0032] During the transition from the initial gelation stage to the middle gelation stage of the potting compound, the energizing and de-energizing states of the shape memory alloy wire 708 are rapidly switched. When the shape memory alloy wire 708 is energized, it contracts and tightens the rubber spacer 704. After de-energizing, the air pressure in the sensing box 701 pushes the rubber spacer 704 back up. Through this rapid switching between energizing and de-energizing, the rubber spacer 704 generates a continuous tapping motion. The tapping motion acts on the potting compound in the initial gelation stage, when the bottom of the potting compound has not yet completely solidified. The vibration generated by the tapping can promote the flow of the potting compound to the gaps and around the pins, effectively filling the areas that were not filled in place before, and further avoiding the generation of potting voids.

[0033] When the potting compound transitions from the mid-gel stage to the late-gel stage, the electric telescopic rod 605 is activated again. The telescopic end of the electric telescopic rod 605 retracts, driving the docking frame 606 and the sensing box 701 back to their initial positions. During the transition of the potting compound from the mid-gel stage to the late-gel stage, a measured amount of potting compound is poured into the gap between the electronic components and the metal casing using manual or automated filling equipment. Then, the above-mentioned gel state detection and rubber septum 704 tapping filling operations are repeated to complete the filling of all potting compound in three stages.

[0034] The amount and target position of the three potting compounds are set as follows: The first time the potting compound is poured, the liquid level reaches the top of the electronic component pin, forming the base structure of the potting compound and providing a stable foundation for subsequent potting; the second time the potting compound is poured, the liquid level reaches two-thirds of the preset total potting height, gradually filling the gaps; the third time the potting compound is poured, the liquid level completely reaches the specified potting height, completing the entire potting operation.

[0035] An embodiment of the present invention provides a filling method for a filling tool, the steps of which are as follows: S1. Insert the pins of the electronic component to be potted into the positioning holes 3 of the positioning plate 2, so that the pins extend into the positioning core 5 to achieve precise positioning; take the metal shell and put it on the outside of the electronic component, and place it stably on the positioning plate 2 to ensure that a uniform gap is formed between the metal shell and the electronic component. S2. Insert the two pin plates 608 into the two ends of the positioning groove 4 respectively, place the U-shaped plate 601 above the positioning plate 2, align the mating plate 607 with the pin plates 608, and fix the U-shaped plate 601 by screwing the first bolt 10 into the third threaded hole 6010 and the fourth threaded hole 6011; twist the torsion bar 6014 to drive the threaded rod 6013 to feed, so that the rubber block 6015 tightly presses against the outside of the metal shell, and completes the auxiliary fixation of the metal shell. S3. Twist the airtight cover 7019 to open the gas injection pipe 7018, and inject high-pressure gas into the induction box 701 through the external gas injection device, pushing the airtight core 7022 out of the airtight ring 7021 and compressing the airtight spring 7023; after the induction box 701 is full of gas, stop the gas injection, and the airtight spring 7023 drives the airtight core 7022 to reset and seal the gas injection channel 7017; at this time, the shape memory alloy wire 708 is in a non-energized state and has no shrinkage deformation, and the rubber diaphragm 704 remains in a downward bulging state under the action of the high-pressure gas in the induction box 701; the initial air pressure of the induction box 701 is detected by the strain gauge 7014, the initial temperature is detected by the temperature sensor 7015, and the reference parameters are stored; manually push the slide 604 to slide along the slide column 603 so that the induction box 701 is aligned with both sides of the electronic components. S4. Inject potting compound into the gap between the metal casing and electronic components in three batches according to the preset amount, and perform precise control of the gel state and adaptive filling optimization operation. S5. After the third potting is completed, the laser displacement sensor 7016 detects the surface height of the potting compound in real time and compares it with the preset total height to ensure that the height error is controlled within the preset threshold, thus confirming that the potting compound has reached the preset total height. At the same time, the temperature sensor 7015 and strain gauge 7014 continuously collect temperature and air pressure data in the sensing box 701. If the fluctuation amplitude of temperature and air pressure data within a preset time is less than the corresponding preset threshold, the gel state is determined to be stable. The shape memory alloy wire 708 is controlled to operate at a low amplitude on / off frequency. When energized, the shape memory alloy wire 708 undergoes a retraction deformation, pulling the rubber septum 704 from its bulging state back to a horizontal state. When de-energized, the shape memory alloy wire 708 loses its retraction force and returns to its initial length. Under the action of the pre-stored air pressure in the sensing box 701, the rubber septum 704 bulges downward again, gently tapping the surface of the potting compound. The air pressure fluctuation in the sensing box 701 is detected in real time by the strain gauge 7014. If the air pressure fluctuation is uniform and there are no abnormal sudden changes, it is confirmed that the potting compound has no surface depressions or internal void defects, and the potting operation is completed.

[0036] Based on the precise control and adaptive filling optimization of the gel state of S4, the following operations are performed: S4.1 Based on the temperature data collected in real time by the temperature sensor 7015, the waiting time is dynamically adjusted to ensure that the potting compound enters the initial gelation stage accurately; during this period, the surface settlement of the potting compound is monitored by the laser displacement sensor 7016, and the initial settlement data is recorded as the basis for subsequent filling compensation. S4.2 Start the electric telescopic rod 605 to extend slowly, driving the sensing box 701 to move downward in the vertical direction; the laser displacement sensor 7016 provides real-time feedback on the position coordinates of the potting compound surface, and the extension of the electric telescopic rod 605 is adjusted in a closed loop to make the lower surface of the sensing box 701 and the potting compound surface form a preset detection gap, and the gap error is controlled within ±0.02mm. S4.3. A constant voltage is applied to the positive terminal 706 and the negative terminal 707. After the shape memory alloy wire 708 is energized, it undergoes a retraction deformation, pulling the rubber septum 704 from the bulging state to a precise return to the horizontal state. Then, the power supply is cut off, the shape memory alloy wire 708 loses the voltage effect, the retraction deformation disappears, and it returns to its initial length. The pre-stored air pressure in the sensing box 701 pushes the rubber septum 704 up again, and the rubber septum 704 remains in the bulging state. The air pressure change data is collected in real time by the strain gauge 7014, and the temperature data collected synchronously by the temperature sensor 7015 is combined for error compensation to generate an air pressure and temperature data set. Based on this, the early stage, middle stage and late stage of gelation of the potting compound can be accurately determined. S4.4. Determined to be in the transition from the initial to the middle stage of gelation, based on the pressure and temperature data generated in S4.3, the on / off frequency of the shape memory alloy wire 708 is dynamically adjusted. When energized, the shape memory alloy wire 708 retracts, causing the rubber spacer 704 to reset. When de-energized, the shape memory alloy wire 708 resets, and the rubber spacer 704 is lifted by the air pressure. Through this on / off cycle, the rubber spacer 704 generates an adaptive amplitude up-and-down striking motion, continuously acting on the surface of the potting compound. During the on / off process, the air pressure fluctuation amplitude inside the sensing box 701 is monitored in real time by the strain gauge 7014, and the on / off interval is adjusted in a closed loop to generate an adaptive amplitude striking motion of the rubber spacer 704. During the striking process, the surface flatness of the potting compound is monitored simultaneously by the laser displacement sensor 7016 until the surface settlement stabilizes within a preset threshold, at which point the striking stops to ensure that the potting compound fully fills the gaps and the area around the pins. S4.5. When it is determined that the gel is transitioning from the mid-stage to the late-stage of gelation, the electric telescopic rod 605 is activated to retract at a constant speed, driving the docking frame 606 and the sensing box 701 back to their initial positions. During the retraction process, the final surface height of the potting compound is detected again by the laser displacement sensor 7016, and the actual filling height data after injection is recorded. This provides a basis for the dosage correction of the next quantitative injection, ensuring that the cumulative height of the injections is accurately matched with the preset potting height.

[0037] The measurement principle for determining the stage of potting compound is as follows: Twist the airtight cover 7019 to open the air injection pipe 7018. The external air inflation device injects high-pressure gas into the induction box 701. After the induction box 701 is full of gas, the inflation stops. The airtight spring 7023 drives the airtight core 7022 to reset and seal the air injection channel 7017. At this time, the shape memory alloy wire 708 is not energized and the rubber diaphragm 704 is in a downward bulging state. The air pressure inside the induction box 701 detected by the strain gauge 7014 is the initial reference air pressure.

[0038] The viscosity and hardness of the potting compound vary significantly at different gelation stages. When the rubber spacer 704 is lifted by the high-pressure gas inside the sensing box 701 and comes into contact with the surface of the potting compound, the reaction force of the potting compound on the rubber spacer 704 will hinder the bulging amplitude of the rubber spacer 704, thereby changing the gas pressure inside the sensing box 701. In the initial gelation stage, the potting compound has low viscosity and low hardness, resulting in a small reaction force on the rubber spacer 704, a large bulging amplitude of the rubber spacer 704, a small decrease in gas pressure inside the sensing box 701, and the gas pressure data collected by the strain gauge 7014 is close to the initial reference gas pressure. In the middle gelation stage, the potting compound has moderate viscosity and hardness, which helps to reduce the bulging amplitude of the rubber spacer 704. The reaction force of the rubber septum 704 is moderate, the bulging amplitude of the rubber septum 704 is moderate, the air pressure drop in the sensing box 701 is moderate, and the air pressure data collected by the strain gauge 7014 is in the middle range. In the later stage of gelation, the potting compound has high viscosity and high hardness, resulting in a large reaction force on the rubber septum 704, a small bulging amplitude of the rubber septum 704, a large air pressure drop in the sensing box 701, and the air pressure data collected by the strain gauge 7014 is significantly lower than the initial reference air pressure. By combining the temperature data collected by the temperature sensor 7015 to compensate for the influence of temperature changes on air pressure, the three gelation stages of the potting compound can be accurately distinguished by the air pressure change data.

[0039] The above description represents the preferred embodiments of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A potting tool, comprising: The potting base plate and the positioning plate disposed on the potting base plate are characterized in that they further include: A positioning hole is formed above the positioning plate; a positioning groove is formed below the positioning plate; a positioning core is fixed on the potting base plate and located in the positioning groove; an adjusting component is fixed above the positioning plate; and two sets of sensing components are provided, both sets of which are fixed on the adjusting component. The U-shaped plate is located above the positioning plate; the support frame is fixed on both sides of the U-shaped plate; the sliding column is fixed on the support frame; the sliding seat is slidably mounted on the sliding column on both sides; the electric telescopic rod has its non-telescopic end fixed on the sliding seat; and the docking frame is fixed on the telescopic end of the electric telescopic rod. A sensing box is fixed below the docking frame; a rubber groove is formed inside the sensing box; a mounting base is fixed inside the sensing box and located at the rubber groove; a rubber septum is fixed on the mounting base and located inside the rubber groove; two electrode seats are provided, and the two electrode seats are respectively fixed on both ends of the rubber septum; a positive electrode post is fixed on the first electrode seat; a negative electrode post is fixed on the second electrode seat; a shape memory alloy wire is fixed at one end to the positive electrode post and at the other end to the negative electrode post; a pneumatic channel is formed inside the sensing box; a pneumatic tube is fixed on the sensing box; a pneumatic cover is threaded onto the pneumatic tube; a pneumatic ring seat is fixed inside the pneumatic cover; an elastic diaphragm is fixed on the pneumatic ring seat; a strain gauge is fixed on the side of the elastic diaphragm away from the pneumatic tube; a temperature sensor is fixed inside the sensing box; and a laser displacement sensor is fixed on the sensing box.

2. The potting tooling according to claim 1, characterized in that, Also includes: The first threaded hole is made on the four corners of the positioning plate; the second threaded hole is made on the four corners of the potting base plate. The first bolt is threaded into the first threaded hole and the second threaded hole.

3. The potting tooling according to claim 1, characterized in that, The adjusting component further includes: Two docking plates are provided, and the two docking plates are respectively fixed at both ends of the U-shaped plate; two pin plates are provided, and the two pin plates are respectively slidably inserted into both ends of the positioning groove; tighten the nut, and screw it into the slide block.

4. The potting tooling according to claim 3, characterized in that, The adjusting component further includes: The third threaded hole is located on the mating plate; the fourth threaded hole is located on the pin plate; the second bolt is threaded into the third and fourth threaded holes.

5. A potting fixture according to claim 4, characterized in that, The adjusting component further includes: The threaded rod has threads on all four sides of the spiral plate; the torsion bar is fixed to the threaded rod; and the rubber block is fixed to the end of the threaded rod away from the torsion bar.

6. The potting tooling according to claim 1, characterized in that, The sensing element also includes: The gas injection channel is located inside the sensor box; the gas injection tube is fixed to the sensor box; and the airtight cover is screwed onto the gas injection tube.

7. A potting fixture according to claim 6, characterized in that, The sensing element also includes: A spring ring seat is fixed inside the air injection channel; an airtight ring is fixed inside the air injection pipe; an airtight core is located between the spring ring seat and the airtight ring; and an airtight spring is fixed at one end to the spring ring seat and at the other end to the airtight core.

8. A potting fixture according to claim 1, characterized in that, The shape memory alloy wire is fixed with a connecting block, which is fixed on a rubber septum.

9. A filling method for a filling tool, applied to a filling tool as described in any one of claims 1-8, characterized in that, The potting process steps are as follows: S1. Insert the pins of the electronic component to be potted into the positioning holes of the positioning plate, so that the pins extend into the positioning core to achieve precise positioning; take the metal shell and put it on the outside of the electronic component, and place it stably on the positioning plate to ensure that a uniform gap is formed between the metal shell and the electronic component. S2. Insert the two pin plates into the two ends of the positioning groove respectively, place the U-shaped plate above the positioning plate, align the mating plate with the pin plate, and fix the U-shaped plate by screwing the first bolt into the third threaded hole and the fourth threaded hole; twist the torsion bar to drive the threaded rod to feed, so that the rubber block is tightly pressed against the outside of the metal shell, and the auxiliary fixing of the metal shell is completed. S3. Twist the airtight cover to open the gas injection pipe, and inject high-pressure gas into the induction box through the external gas injection device. This pushes the airtight core away from the airtight ring and compresses the airtight spring. After the induction box is full of gas, stop the gas injection. The airtight spring drives the airtight core to reset and seal the gas injection channel. At this time, the shape memory alloy wire is in a non-energized state and has no shrinkage deformation. The rubber diaphragm remains in a downward bulging state under the action of the high-pressure gas in the induction box. The initial gas pressure of the induction box is detected by the strain gauge, and the initial temperature is detected by the temperature sensor. The reference parameters are stored. Manually push the slide block to slide along the slide column so that the induction box is aligned between the electronic components and the metal shell. S4. Inject potting compound into the gap between the metal casing and electronic components in three batches according to the preset amount, and perform precise control of the gel state and adaptive filling optimization operation. S5. After the third injection, the surface height of the potting compound is detected in real time by a laser displacement sensor and compared with the preset total height to ensure that the height error is controlled within the preset threshold, thus confirming that the potting compound has reached the preset total height. At the same time, temperature and air pressure data in the sensing box are continuously collected by temperature sensors and strain gauges. If the fluctuation amplitude of temperature and air pressure data within the preset time is less than the corresponding preset threshold, the gel state is determined to be stable. The shape memory alloy wire is controlled to operate at a low amplitude on-off frequency. When energized, the shape memory alloy wire retracts and deforms, pulling the rubber spacer from the bulging state back to the horizontal state. When de-energized, the shape memory alloy wire loses its retraction force and returns to its initial length. Under the action of the pre-stored air pressure in the sensing box, the rubber spacer bulges downward again and gently taps the surface of the potting compound. The air pressure fluctuation in the sensing box is detected in real time by strain gauges. If the air pressure fluctuation is uniform and there are no abnormal sudden changes, it is confirmed that the potting compound has no surface depressions or internal void defects, and the potting operation is completed.

10. The filling method of the filling tool according to claim 9, characterized in that, Based on the precise control and adaptive filling optimization of the gel state of S4, the following operations are performed: S4.1 Based on the temperature data collected in real time by the temperature sensor, the waiting time is dynamically adjusted to ensure that the potting compound enters the initial gelation stage accurately; during this period, the amount of surface sedimentation of the potting compound is monitored by the laser displacement sensor, and the initial sedimentation data is recorded as the basis for subsequent filling compensation. S4.2 Start the electric telescopic rod to slowly extend, driving the induction box to move downwards in the vertical direction; the laser displacement sensor provides real-time feedback on the position coordinates of the potting compound surface, and the extension of the electric telescopic rod is adjusted in a closed loop to form a preset detection gap between the lower surface of the induction box and the surface of the potting compound, and the gap error is controlled within ±0.02mm; S4.3 Apply a constant voltage to the positive and negative terminals. When the shape memory alloy wire is energized, it undergoes a retraction deformation, pulling the rubber septum from the bulging state to a precise return to the horizontal state. Immediately afterward, the power supply is cut off, the shape memory alloy wire loses the voltage effect, the retraction deformation disappears, and it returns to its initial length. The pre-stored air pressure in the sensing box then pushes the rubber septum back up, and the rubber septum remains in the bulging state. The air pressure change data is collected in real time by the strain gauge, and the temperature data collected synchronously by the temperature sensor is combined for error compensation to generate a set of air pressure and temperature data. Based on this, the early, middle, and late gelation stages of the potting compound can be accurately determined. S4.

4. If the process is in the transition from the initial stage to the middle stage of gelation, the on / off frequency of the shape memory alloy wire is dynamically adjusted based on the air pressure and temperature data generated in S4.

3. When the power is applied, the shape memory alloy wire retracts, causing the rubber spacer to reset. When the power is de-energized, the shape memory alloy wire resets, and the rubber spacer is lifted by the air pressure. Through this on / off cycle, the rubber spacer generates an adaptive amplitude up-and-down slapping motion, which continuously acts on the surface of the potting compound. During the power-on and power-off process, the air pressure fluctuation amplitude inside the sensing box is monitored in real time by strain gauges, and the power-on and power-off interval is adjusted in a closed loop to make the rubber septum generate an adaptive amplitude tapping motion; during the tapping process, the surface flatness of the potting compound is monitored simultaneously by a laser displacement sensor until the surface settlement stabilizes within the preset threshold, and the tapping is stopped to ensure that the potting compound fully fills the gap and the area around the pins. S4.5 When it is determined that the gel is in the transition from the middle stage to the late stage, the electric telescopic rod is started to retract at a constant speed, driving the docking frame and the sensing box back to the initial position. During the retraction process, the final surface height of the potting compound is detected again by the laser displacement sensor, and the actual filling height data after the injection is recorded. This provides a basis for the dosage correction of the next quantitative injection, ensuring that the cumulative height of the injections is accurately matched with the preset potting height.

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