Probe pin and method of manufacturing the same

Abstract

A probe pin according to an embodiment of the present invention is used in a semiconductor testing apparatus for detecting a semiconductor chip by receiving an electrical signal from a tester. The probe pin includes: a connecting portion electrically connected to the tester; a spring portion, one end of which is connected to the connecting portion and applies a spring force when the probe pin contacts the semiconductor chip; and a contact portion, one end of which is connected to the other end of the spring portion and the other end of which contacts the semiconductor chip. The cross-sections of the connecting portion and the contact portion are rectangles with rounded corners at each vertex. The spring portion extends in the length direction and is recessed in the width direction, and can be bent in one or both directions.

Description

Technical Field

[0001] This invention relates to probe pins and their manufacturing methods. Background Technology

[0002] Unless otherwise specified in this specification, the content described in this section is not prior art to the claims of this application, and should not be considered prior art even if it is described in this section.

[0003] Semiconductor manufacturing processes consist of a front-end process that creates multiple semiconductor dies on a wafer and a back-end process that connects the semiconductor dies with wires to create a semiconductor package.

[0004] Generally, in order to detect the electrical characteristics of the individual semiconductor dies that make up a wafer, an electronic die sorting (EDS) process is performed.

[0005] Specifically, the probes on the probe card are brought into contact with the contact pads of the semiconductor die, and electrical signals from a separate semiconductor testing device are passed through the probes to read the output electrical signals and perform the EDS process.

[0006] Recently, due to the miniaturization of semiconductors, fine pitch is required not only at the wafer level but also at the semiconductor packaging level. As the pads on semiconductor packages become miniaturized, the probe tips used in test sockets for testing semiconductor packages (semiconductor chips) also need to be miniaturized.

[0007] To inspect such semiconductor packages, probe pins are used that contact the pads on the semiconductor package. Recently, microelectromechanical system (MEMS) probe pins, fabricated using MEMS (Micro Electro Mechanical System) technology, have become widely used.

[0008] Microelectromechanical system (MEMS) probe pins are probe pins manufactured using semiconductor manufacturing processes, such as photolithography and gold plating.

[0009] In addition, during the development or production of electronic products, probe pins are used to measure the state of various electrical components mounted on printed circuit boards (PCBs) to assess their performance, such as the current or voltage flowing through them. These electrical tests on PCBs also involve miniaturization. PCB testing probe pins are also trending towards miniaturization, which is generally achieved through microelectromechanical systems (MEMS) technology.

[0010] However, probe pins manufactured using microelectromechanical systems (MEMS) technology are not made by machining raw materials, but by processes such as gold plating. Therefore, they suffer from poor physical properties, difficulty in manufacturing probe pins into various shapes as a whole, and limitations in the application of alloy materials.

[0011] In addition, the probe pins made of plate-shaped materials described in Korean Patent No. 10-2292037 suffer from high wear rate after processing due to the use of pressing or bending methods.

[0012] 1. Korean Patent No. 10-2164020 (Published on October 13, 2020)

[0013] 2. Korean Patent No. 10-2349333 (Published on January 11, 2022)

[0014] 3. Korean Patent No. 10-2292037 (Published on August 23, 2021) Summary of the Invention

[0015] Technical issues

[0016] The present invention is intended to solve the problems described above, and its purpose is to provide a probe pin that can be formed in various shapes, contacts a semiconductor chip to detect the semiconductor chip, has excellent physical properties, and is applicable to alloy materials.

[0017] The problems to be solved by the present invention are not limited to those mentioned above, and those skilled in the art can clearly understand other problems not mentioned from the following description.

[0018] Technical solution

[0019] A probe pin according to an embodiment of the present invention is used in a semiconductor testing apparatus for detecting a semiconductor chip by receiving an electrical signal from a tester. The probe pin includes: a connecting portion electrically connected to the tester; a spring portion, one end of which is connected to the connecting portion and applies a spring force when the probe pin contacts the semiconductor chip; and a contact portion, one end of which is connected to the other end of the spring portion and the other end of which contacts the semiconductor chip. The cross-sections of the connecting portion and the contact portion are rectangles with rounded corners at each vertex. The spring portion extends in the length direction and is recessed in the width direction, and can be bent in one or both directions.

[0020] The length of the elastic portion can be extended to be longer than the length of the connecting portion and the contact portion.

[0021] The length of the elastic part can be formed to correspond to the length of the connecting part and the contact part.

[0022] The aforementioned elastic part may also include a through hole formed along the height direction.

[0023] One end and the other end of the aforementioned elastic part can be located in corresponding positions.

[0024] One end and the other end of the aforementioned elastic part can be arranged diagonally.

[0025] One end of the connecting portion and the other end of the contact portion can be configured as any one of the following: crown-shaped, blade-shaped, flat, N-shaped, circular, and NF-shaped.

[0026] The aforementioned connecting part, elastic part, and contact part can be made of alloy material.

[0027] The outer peripheral surface of the aforementioned elastic part can be coated with an insulating coating.

[0028] The aforementioned insulating coating can be composed of any one of parylene, acrylic, polyamide, and organic compounds.

[0029] A method for manufacturing a probe pin according to an embodiment of the present invention, used in a semiconductor testing apparatus for detecting a semiconductor chip by receiving an electrical signal from a tester, includes: a first step of drawing a component; a second step of processing the component processed in the drawing step into a rectangular shape with rounded corners at each vertex; and a third step of compressing the middle portion of the component processed in the second step in one or both directions.

[0030] It can also include: a step of cutting the middle part, which has been compressed in the third step above, into lengths corresponding to the upper and lower parts of the component.

[0031] It can also include: a step of performing through processing on the intermediate portion that was compressed in the third step above, along the height direction.

[0032] In the third step described above, compression processing can be performed to position the upper and lower parts of the component in corresponding locations.

[0033] In the third step described above, compression processing can be performed to make the upper and lower parts of the aforementioned component arranged at an angle.

[0034] It can also include the step of machining the two ends of the component processed in the third step above into any one of the following shapes: crown-shaped, blade-shaped, flat, N-shaped, round, and NF-shaped.

[0035] The aforementioned components can be made of alloy materials.

[0036] It may also include the step of applying an insulating coating to the outer peripheral surface of the middle portion of the component that has been compressed in one or both directions in the third step described above.

[0037] Invention Effects

[0038] According to an embodiment of the present invention, the probe pin integrates the connecting part, the elastic part, and the contact part, and forms the shape of the elastic part in various shapes, thereby ensuring excellent physical performance while maintaining the consistency of elastic movement when in contact with the semiconductor chip, and is able to cope with fine pitch.

[0039] The effects of the present invention are not limited to those mentioned above, and those skilled in the art will clearly understand other effects not mentioned from the following description. Attached Figure Description

[0040] Figure 1 This is a perspective view showing a probe pin based on an embodiment of the present invention.

[0041] Figure 2 This is a perspective view showing a through hole formed on a probe pin according to an embodiment of the present invention.

[0042] Figure 3a This is a perspective view showing a probe pin formed by bending in one direction based on another embodiment of the present invention.

[0043] Figure 3b This is a perspective view showing a probe pin formed by bending in two directions based on another embodiment of the present invention.

[0044] Figure 4 This is a perspective view showing a probe pin based on another embodiment of the present invention.

[0045] Figure 5 This is a diagram illustrating, by way of example, the shape of one end of the connecting portion and the other end of the contact portion in a probe pin based on an embodiment of the present invention.

[0046] Figure 6 This is a diagram showing the guide plate of the tester formed with the present invention.

[0047] Figure 7 This is a sequence diagram illustrating a method for manufacturing probe pins based on an embodiment of the present invention.

[0048] Figure 8 This is a sequence diagram illustrating a method for manufacturing probe pins based on another embodiment of the present invention. Detailed Implementation

[0049] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings to enable those skilled in the art to readily implement them. However, the present invention can be implemented in various different ways and is not limited to the embodiments described herein. Furthermore, for the purpose of clearly illustrating the present invention, parts unrelated to the description have been omitted from the drawings, and similar reference numerals have been used for similar parts throughout the specification.

[0050] Throughout this specification, when a part is described as "comprising" a certain component, unless specifically stated otherwise, it means that other components are not excluded and can be included. Furthermore, when a part is described as "connected" to other parts throughout this specification, this includes not only direct connections but also connections where other components are inserted and connected in between, and electrical connections where other elements are electrically connected in between. Moreover, throughout this specification, when a component is described as being "on" other components, this includes not only contacts between the components but also the presence of other components between the two components. Additionally, the terms "first," "second," etc., used in this specification can describe various components regardless of order and / or importance, and are used only to distinguish one component from others; they do not limit the corresponding component and do not imply that they must be different components. For example, "first direction" and "second direction" can refer to the same direction or different directions.

[0051] Figure 1 This is a perspective view showing a probe pin 10 based on an embodiment of the present invention. Figure 2 This is a perspective view showing a through hole formed in the probe pin 10 according to an embodiment of the present invention. Figure 3a This is a perspective view showing a probe pin formed by bending in one or both directions according to another embodiment of the present invention. Figure 3b This is a perspective view showing a probe pin formed by bending in two directions according to another embodiment of the present invention. Figure 4 This is a perspective view showing a probe pin 10 based on another embodiment of the present invention.

[0052] like Figures 1 to 4 As shown, the probe pin 10 may include a connecting portion 100, a spring portion 200, and a contact portion 300.

[0053] Here, in order to form an electrical connection between the semiconductor chip being tested and the tester, the probe pin 10 can contact the semiconductor chip and connect to the tester side.

[0054] The connecting part 100 is electrically connected to the test instrument side that applies the electrical signal, and the cross-section of the connecting part 100 can be a rectangle with rounded corners at each vertex.

[0055] Figure 5This is a diagram illustrating the shape of one end of the connecting portion 100 and the other end of the contact portion 300 in a probe pin 10 based on an embodiment of the present invention.

[0056] One end of the connecting part 100 can be configured into various shapes depending on the contact shape on the tester side and the type of tester.

[0057] For example, such as Figure 5 As shown, one end of the connecting part 100 can be configured as any one of the following: crown-shaped (a), blade-shaped (b), flat (c), N-shaped (d), round (e), and NF-shaped (f).

[0058] As described above, one end of the connecting part 100 is configured in an optimal shape according to the contact shape on the tester side and the type of tester, so that it can be used in various testers.

[0059] The elastic part 200 is connected to the connecting part 100, and can apply elastic force when the probe pin 10 contacts the semiconductor chip.

[0060] like Figure 1 As shown, the elastic part 200 extends in the length direction and is recessed in the width direction, and can be bent in one or both directions.

[0061] Specifically, the length of the elastic part 200 extends in the length direction, the width of the elastic part 200 is more concave than the width of the connecting part 100, and it is bent in one direction. Therefore, compressive stress generated when the probe pin 10 connected to the tester side contacts the semiconductor chip can be generated on the elastic part 200, and the elastic part 200 bends to one side or both sides.

[0062] As described above, the configuration ensures that no interference occurs between adjacent probe pins 10 as the elastic part 200 bends in one direction, thereby improving the detection reliability of semiconductor chips with fine pitch.

[0063] Figure 6 This is a diagram showing the invention formed on the guide plate of the tester.

[0064] The elastic portion 200 is extended to be longer than the connecting portion 100 and the contact portion 300. As a result, the compressive stress generated when the probe pin 10 connected to the tester side contacts the semiconductor chip is generated in the elastic portion 200, which can reduce the force applied to the connecting portion 100 and the contact portion 300.

[0065] At this time, as Figure 6 As shown, the insertion hole formed on the guide plate of the tester in this invention can be configured as a rectangle.

[0066] In addition, such as Figure 4As shown, the length of the elastic part 200 can also be formed to correspond to the lengths of the connecting part 100 and the contact part 300.

[0067] The elastic part 200 may also include a through hole 210 formed along the height direction.

[0068] like Figure 3a and Figure 3b As shown, since the elastic part 200 also includes a through hole 210 formed along the height direction, more compressive stress is generated on the elastic part 200 when the probe pin 10 connected to the tester side contacts the semiconductor chip, thereby reducing the force applied to the connection part 100 and the contact part 300.

[0069] refer to Figure 1 , Figure 2 as well as Figure 4 One end of the elastic part 200 and the other end of the elastic part 200 are located in corresponding positions, or as follows: Figure 3a and Figure 3b As shown, one end of the elastic part 200 and the other end of the elastic part 200 can be arranged diagonally.

[0070] At this time, in the manufacturing method of the probe pin 10 based on an embodiment of the present invention described later, during compression processing, depending on the shape of the lower end of the press or the position of the fixing part, one end of the elastic part 200 and the other end of the elastic part 200 are located at corresponding positions, or one end of the elastic part 200 and the other end of the elastic part 200 can be arranged diagonally.

[0071] On the other hand, the outer peripheral surface of the elastic part 200 can be coated with an insulating coating.

[0072] Insulating coatings can be made of parylene, acrylic, polyimide, and other organic compounds. However, they are not limited to these; for example, insulating coatings can be made of organic compounds such as polyurethane and polyester.

[0073] As described above, since the outer peripheral surface of the elastic part 200 is coated with an insulating coating, short circuits can be prevented when the semiconductor chip is tested by receiving electrical signals from the tester.

[0074] One end of the contact portion 300 can be connected to the other end of the elastic portion 200 and the other end can be in contact with the semiconductor chip. The cross-section of the contact portion 300 can be configured as an elongated hole shape.

[0075] For example, such as Figures 1 to 6As shown, the cross-section of the contact portion can be configured as a circular shape extending in the length direction so that it can be inserted into the insertion hole on the guide plate.

[0076] Specifically, such as Figures 1 to 6 As shown, the elongated hole shape is formed when a circular shape is compressed in the vertical direction, with both sides curving outwards and the upper and lower parts forming a straight shape.

[0077] The other end of the contact portion 300 can be configured into various shapes depending on the contact shape of the semiconductor chip and the type of semiconductor chip.

[0078] For example, such as Figure 5 As shown, one end of the connecting part 100 can be configured as any one of the following: crown-shaped (a), blade-shaped (b), flat (c), N-shaped (d), round (e), and NF-shaped (f).

[0079] As described above, the other end of the contact portion 300 can be configured into an optimal shape according to the contact shape of the semiconductor chip and the type of semiconductor chip, so that it can be used in various test instruments.

[0080] The connecting part 100, the elastic part 200, and the contact part 300 can be made of alloy material.

[0081] The probe pins manufactured using existing microelectromechanical systems (MEMS) processes have layers of vapor-deposited material, resulting in unstable physical properties and requiring a separate gold plating process. In contrast, the connecting part 100, the elastic part 200, and the contact part 300 are made of alloy material, thus eliminating the need for a separate gold plating process and preventing the formation of layers, thereby providing stable physical properties. However, this is not a limitation; for example, a separate gold plating process can be performed to improve electrical properties.

[0082] For example, alloy materials can also be single metals or composite alloys composed of any one of vanadium alloys, rhodium alloys, or palladium alloys.

[0083] Compared to probe pins made of any one or a composite alloy of vanadium, rhodium, and palladium alloys and manufactured using microelectromechanical systems (MEMS) technology, these probe pins exhibit superior electrical and mechanical properties.

[0084] Figure 7 This is a sequence diagram illustrating a method for manufacturing a probe pin 10 based on an embodiment of the present invention.

[0085] like Figure 7As shown, a method for manufacturing a probe pin 10 according to an embodiment of the present invention can include a first step (S710) of drawing a component, a second step (S720) of machining the cross-section of the component processed in the first step into an elongated hole shape, and a third step (S730) of compressing the middle portion of the component processed in the second step in one direction.

[0086] The part being drawn in the first step (S710) can be a cylindrical shape with a circular cross-section and extending in the length direction.

[0087] like Figure 7 As shown, the second step (S720) can process the cross-section of the part processed in the first step into an elongated hole shape. At this time, it is not limited to processing by compression in four directions or processing by grinding the outer peripheral surface of the part processed in the first step into a cuboid shape.

[0088] The third step (S730) can perform compression processing on the middle part of the component processed in the second step in one direction.

[0089] On the other hand, such as Figure 4 As shown, it can also include a step of cutting the middle part that is compressed in the third step (S730) to correspond to the length of the upper and lower parts of the component.

[0090] In addition, such as Figure 2 As shown, it can also include a step of through-processing the intermediate portion that was compressed in the third step (S730) along the height direction.

[0091] In addition, such as Figures 1 to 4 As shown, the third step can perform compression processing so that the upper and lower parts of the component are in corresponding positions, or so that the upper and lower parts of the component are arranged at an angle.

[0092] For example, compression processing can be performed based on the shape of the lower end of the press or the position of the fixed part, so that the upper and lower parts of the component are located in corresponding positions, or the upper and lower parts of the component are arranged at an angle.

[0093] Additionally, it can also include machining the two ends of the component processed in the third step (S730) as follows: Figure 5 The fourth step (S740) of either the coronal (a) or blade-shaped (b) shown.

[0094] As described above, since the two ends of the component processed in the third step (S730) can be processed into various shapes, it can be processed and used according to the type of semiconductor chip and tester.

[0095] Figure 8This is a sequence diagram illustrating a method for manufacturing probe pins based on another embodiment of the present invention.

[0096] like Figure 8 As shown, a method for manufacturing a probe pin 10 according to another embodiment of the present invention can include a first step (S810) of drawing a component, a second step (S820) of processing one end of the component processed in the first step into any one of a flat shape (c), an NF shape (d), and a circular shape (e), a third step (S830) of processing the component processed in the second step into a rectangular shape with rounded corners at each vertex, and a fourth step (S840) of compressing the middle portion of the component processed in the third step in one or both directions.

[0097] As described above, one end of the connecting portion 100 can be configured as any one of a crown shape (a), a blade shape (b), a flat shape (c), an NF shape (d), and a circular shape (e). As one embodiment, when one end of the connecting portion 100 is crown-shaped (a) or blade-shaped (b), it can be configured according to... Figure 7 The method for manufacturing a probe pin based on one embodiment is shown. As another embodiment, when one end of the connecting portion 100 is flat (c), NF-shaped (d), or round (e), it can be manufactured according to... Figure 8 The method shown is based on another embodiment for manufacturing probe pins.

[0098] The components used in manufacturing the probe pin 10 can be made of raw materials or alloy materials.

[0099] Because the components are made of alloy materials, no separate gold plating step is required and no layer is formed, thus providing stable physical properties.

[0100] However, it is not limited to this. For example, a separate gold plating process can be performed to improve electrical properties.

[0101] In addition, the alloy material can be composed of any one of vanadium alloys, rhodium alloys, palladium alloys, or composite materials.

[0102] Compared to probe pin 10, which is made of vanadium, rhodium, palladium and their alloys and manufactured using MEMS technology, it has superior electrical properties and mechanical characteristics.

[0103] As described above, according to the probe pin 10 of the present invention, the connecting part 100, the elastic part 200, and the contact part 300 are formed as one piece, and the elastic part 200 is formed in various shapes, so that when in contact with the semiconductor chip, excellent physical performance can be ensured while maintaining the consistency of elastic movement, and it can cope with fine pitch.

[0104] In addition, the elastic part 200 is extended to be longer than the length of the connecting part 100 and the contact part 300, or the elastic part 200 also includes a through hole 210 formed along the height direction, so that the compressive stress generated when the probe pin 10 connected to the tester side contacts the semiconductor chip is dispersed to the elastic part 200, thereby reducing the force applied to the connecting part 100 and the contact part 300.

[0105] The above description of the present invention is illustrative and should be understood as follows: those skilled in the art can easily modify it into other specific embodiments without changing the technical concept or essential technical features of the invention. Therefore, it should be understood that the embodiments described above are illustrative and not limiting in all respects. For example, the constituent elements described in a single form can also be implemented separately, and similarly, the constituent elements described in a separate form can also be implemented in combination.

[0106] Furthermore, the scope of this invention is indicated by the claims rather than the detailed description above, and should be interpreted as including all modifications or variations derived from the meaning and scope of the claims and their equivalents.

[0107] Explanation of reference numerals in the attached figures

[0108] 10: Probe pin

[0109] 100: Connecting part

[0110] 200: Elastic part

[0111] 210: Through hole

[0112] 300: Contact Department.

Claims

1. A probe pin used in a semiconductor testing apparatus for testing a semiconductor chip by receiving an electrical signal from a test instrument, the probe pin comprising: The connecting part is electrically connected to the tester side; The elastic part is connected to the connecting part at one end, and applies elastic force when the probe pin contacts the semiconductor chip; as well as The contact portion has one end connected to the other end of the elastic portion, and the other end in contact with the semiconductor chip. The cross-sections of the connecting portion and the contact portion are configured as elongated holes. The elastic part extends in the length direction, is recessed in the width direction, and is formed by bending in one or both directions.

2. The probe pin according to claim 1, wherein, The elastic portion is extended to be longer than the connecting portion and the contact portion.

3. The probe pin according to claim 1, wherein, The length of the elastic part is formed to correspond to the lengths of the connecting part and the contact part.

4. The probe pin according to claim 1, wherein, The elastic part also includes a through hole formed along the height direction.

5. The probe pin according to claim 1, wherein, One end of the elastic part and the other end are located in corresponding positions.

6. The probe pin according to claim 1, wherein, One end and the other end of the elastic part are arranged diagonally.

7. The probe pin according to claim 1, wherein, One end of the connecting portion and the other end of the contact portion are configured as any one of the following: crown-shaped, blade-shaped, flat, N-shaped, round, and NF-shaped.

8. The probe pin according to claim 1, wherein, The connecting part, the elastic part, and the contact part are made of alloy material.

9. The probe pin according to claim 1, wherein, The outer peripheral surface of the elastic part is coated with an insulating coating.

10. The probe pin according to claim 9, wherein, The insulating coating is composed of any one of parylene, acrylic, polyamide, and organic compounds.

11. A method for manufacturing a probe pin, used in a semiconductor testing apparatus for detecting a semiconductor chip by receiving an electrical signal from a test instrument, comprising: The first step in the drawing process of the component; The second step involves machining the cross-section of the component processed in the first step into the shape of an elongated hole. as well as A third step involves compressing the middle portion of the component processed in the second step in one or both directions.

12. The method for manufacturing a probe pin according to claim 11, wherein, Also includes: The step of cutting the middle part, which was compressed in the third step, into lengths corresponding to the upper and lower parts of the component.

13. The method for manufacturing a probe pin according to claim 11, wherein, Also includes: The step of performing through-processing along the height direction on the middle part that was compressed in the third step.

14. The method for manufacturing a probe pin according to claim 11, wherein, In the third step, compression processing is performed to position the upper and lower parts of the component in corresponding locations.

15. The method for manufacturing a probe pin according to claim 11, wherein, In the third step, compression processing is performed to make the upper and lower parts of the component be arranged at an angle.

16. The method for manufacturing a probe pin according to claim 11, wherein, Also includes: The fourth step involves machining the two ends of the component processed in the third step into either a crown shape or a blade shape.

17. The method for manufacturing a probe pin according to claim 11, wherein, The component is made of alloy material.

18. The method for manufacturing a probe pin according to claim 11, wherein, Also includes: The step of applying an insulating coating to the outer peripheral surface of the middle portion of the component that has been compressed in one or both directions in the third step.

19. The method for manufacturing a probe pin according to claim 18, wherein, The insulating coating is composed of any one of parylene, acrylic, polyamide, and organic compounds.

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