Electroplating apparatus

Abstract

This invention relates to the field of electroplating and discloses an electroplating apparatus. The apparatus includes an electroplating mechanism, a conveying mechanism, a control mechanism, and a power supply. The electroplating mechanism includes an electroplating tank filled with an electrolyte, and multiple top and bottom anodes arranged vertically within the tank. The conveying mechanism includes a first conveyor and a second conveyor, positioned on opposite sides of the electroplating tank, and equipped with multiple clamping members that can open and close vertically. The control mechanism controls the synchronous movement of the clamping members, the first conveyor, and the second conveyor. The power supply connects the top anode, the bottom anode, and the clamping members. By employing a dual-drive horizontal electroplating method, the clamping members bear the weight of the glass itself when clamping brittle materials, preventing excessive force from causing breakage. Furthermore, the horizontal electroplating approach facilitates integration with upstream and downstream processes and enables easier automation.

Description

Technical Field

[0001] This invention relates to the field of electroplating technology, and more particularly to an electroplating apparatus. Background Technology

[0002] In the field of flat panel displays, glass substrates are the optimal solution for signal transmission boards. During the processing of glass substrates, vacuum deposition technology is typically used to deposit materials such as metals and alloys in a gaseous state onto the glass surface, forming a thin film. This thin film can alter the physical and chemical properties of the glass, improving its performance.

[0003] Electroplating in the industry is mainly divided into horizontal electroplating and vertical electroplating. The main difference between horizontal and vertical electroplating lies in the placement of the substrate and the process flow. Vertical electroplating is simpler and less expensive, therefore it is currently the more commonly used electroplating solution. Vertical electroplating is suitable for organic boards with a flame retardant grade of FR4 or FR5. However, for brittle materials such as glass or ceramics, existing vertical electroplating methods, when clamping glass substrates or brittle materials like ceramics, do not consider other influencing factors such as vibration, liquid flow, and the pressure required for conductivity. The direction of the clamp's force is perpendicular to the direction of the glass's gravity. To keep the glass from shifting, the clamp needs to apply a greater force to overcome the influence of the material's gravity, as shown in the formula: f = μN, where f represents sliding friction, μ represents the coefficient of kinetic friction, and N represents normal force. Therefore, when μ is constant, f and N are positively correlated. To keep the glass from moving, f ≥ Gglass is required. The larger N is, the easier it is for the glass substrate to break.

[0004] Therefore, the problem of breakage in existing vertical electroplating technology is difficult to solve. The current vertical electroplating technology cannot be used in the industry because it cannot solve the breakage problem. It is necessary to consider developing a horizontal electroplating solution to adapt to the electroplating of brittle materials such as glass or ceramics. Summary of the Invention

[0005] This invention aims to solve at least one problem mentioned in the background art. To this end, this invention proposes an electroplating apparatus that employs a dual-drive horizontal electroplating method. When clamping brittle materials such as glass substrates / ceramics, the clamping members on both sides can support the weight of the glass itself, and the clamping members themselves do not exert much force on the brittle material, thereby effectively avoiding the problem of glass breakage caused by excessive force from the clamps. At the same time, the horizontal electroplating scheme is easy to integrate with upstream and downstream processes and is easier to automate.

[0006] According to a first aspect of the present invention, an electroplating apparatus includes an electroplating mechanism, a conveying mechanism, a control mechanism, and a power supply. The electroplating mechanism includes an electroplating tank filled with an electrolyte, and a plurality of top anodes and bottom anodes corresponding in the vertical direction are disposed in the electroplating tank. The conveying mechanism includes a first conveying member and a second conveying member, which are disposed on opposite sides of the electroplating tank. A plurality of clamping members that can open and close in the vertical direction are disposed on the first conveying member and the second conveying member. The control mechanism controls the clamping members, the first conveying member, and the second conveying member to move synchronously. The power supply is connected to the top anode, the bottom anode, and the clamping members.

[0007] Therefore, it can be seen that the horizontal electroplating method with dual drive is adopted in this solution. When clamping brittle materials such as glass substrates / ceramics, the clamping parts on both sides can bear the weight of the glass itself. The clamping parts themselves do not exert much force on the brittle materials, thus effectively avoiding the problem of glass breakage caused by excessive force from the clamps. At the same time, the horizontal electroplating solution is easy to connect with the upstream and downstream processes and is easier to automate.

[0008] According to another embodiment of the present invention, the clamping member includes a first clamping part, a second clamping part, and a fixing part, wherein the first clamping part is fixedly connected to the fixing part, and the second clamping part can move vertically relative to the first clamping part and the fixing part.

[0009] According to another embodiment of the present invention, the clamping member further includes a mating portion disposed on the top of the second clamping portion.

[0010] According to another embodiment of the present invention, the electroplating tank is provided with a lifting member, which lifts the mating part during the movement of the mating part, thereby driving the second clamping part to move relative to the first clamping part.

[0011] According to another embodiment of the present invention, the number of clamping members on the first conveyor and the second conveyor are the same and they are arranged correspondingly in the horizontal direction.

[0012] According to another embodiment of the present invention, the clamping members on the first conveyor and the second conveyor are evenly distributed.

[0013] According to another embodiment of the present invention, the distance between two adjacent clamping members on the first and second conveying members is 5-15 mm.

[0014] According to another embodiment of the present invention, both the first conveyor and the second conveyor are tracks.

[0015] According to another embodiment of the present invention, the clamping member is provided with an insulating protective layer, which is disposed around the first clamping part, the second clamping part and the fixing part.

[0016] According to another embodiment of the present invention, it further includes a feeding mechanism and a discharging mechanism, the feeding mechanism and the discharging mechanism being connected to both ends of the electroplating mechanism, respectively.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] This invention discloses an electroplating apparatus, including an electroplating mechanism, a conveying mechanism, a control mechanism, and a power supply. The electroplating mechanism includes an electroplating tank filled with an electrolyte, and multiple top and bottom anodes vertically aligned within the tank. The conveying mechanism includes a first conveyor and a second conveyor, positioned on opposite sides of the electroplating tank, and equipped with multiple clamping members that can open and close vertically. The control mechanism controls the synchronous movement of the clamping members, the first conveyor, and the second conveyor. The power supply connects the top anode, the bottom anode, and the clamping members. This solution employs a dual-drive horizontal electroplating method. When clamping brittle materials such as glass substrates / ceramics, the clamping members on both sides can support the weight of the glass itself, and the clamping members themselves exert minimal force on the brittle material, effectively preventing excessive force from causing glass breakage. Furthermore, the horizontal electroplating method is easily integrated with upstream and downstream processes, facilitating automation.

[0019] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0021] Figure 1 A schematic diagram of an embodiment of the electroplating apparatus provided in this application;

[0022] Figure 2 Another schematic diagram of an embodiment of the electroplating apparatus provided in this application;

[0023] Figure 3 A schematic diagram of an embodiment of the clamping member of the electroplating apparatus provided in this application;

[0024] Figure 4 This is a schematic diagram of an embodiment of the electroplating apparatus provided in this application, showing the cooperation between the lifting member and the clamping member; the meanings of the markings in the diagram are as follows:

[0025] 100. Electroplating equipment;

[0026] 110. Electroplating mechanism; 111. Electroplating tank; 1111. Lifting component; 112. Electrolyte;

[0027] 113. Top anode; 114. Bottom anode;

[0028] 120. Conveying mechanism; 121. First conveying component; 122. Second conveying component; 123. Clamping component;

[0029] 1231, First clamping part; 1232, Second clamping part; 1233, Fixing part; 1234, Fitting part; 1235, Insulating protective layer. Detailed Implementation

[0030] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0031] In the description of this invention, it should be understood that features specified as "first" or "second" may explicitly or implicitly include one or more of those features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0032] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0033] To illustrate the electroplating apparatus provided in this application, a detailed description is provided below in conjunction with the accompanying drawings and textual descriptions of the embodiments.

[0034] The following is for reference. Figures 1-4 The electroplating apparatus 100 according to an embodiment of the first aspect of the present invention is described as follows: Figures 1-4As shown, the electroplating apparatus 100 includes an electroplating mechanism 110, a conveying mechanism 120, a control mechanism (not shown in the figure), and a power supply (not shown in the figure). Specifically, the electroplating mechanism 110 includes an electroplating tank 111, which is filled with an electrolyte 112. The electroplating tank 111 also has multiple top anodes 113 and bottom anodes 114 arranged vertically. It can be understood that by simultaneously setting anodes at the top and bottom, the workpiece to be electroplated can achieve double-sided coating, thereby improving electroplating efficiency. Further, the conveying mechanism 120 includes a first conveyor 121 and a second conveyor 122. Specifically, the first conveyor 121 and the second conveyor 122 are disposed on both sides of the electroplating tank 111. The 122 is equipped with multiple clamping members 123 that can open and close vertically. By providing clamping members 123 that open and close vertically, the workpiece to be electroplated can be horizontally electroplated, making the electroplating process easier. Furthermore, the control mechanism controls the clamping members 123, the first conveyor 121, and the second conveyor 122 to move synchronously. By making the clamping members 123, the first conveyor 121, and the second conveyor 122 move synchronously, the stability of the electroplating process can be ensured. Furthermore, the power supply connects the top anode 113, the bottom anode 114, and the clamping members 123. By connecting the top anode 113 and the bottom anode 114 to the power supply, and simultaneously connecting the workpiece to be electroplated as the cathode to the power supply, the electroplating process can proceed smoothly. Therefore, this solution adopts a horizontal electroplating method with dual transmission. When clamping brittle materials such as glass substrates or ceramics, the clamping parts 123 on both sides can bear the weight of the brittle materials themselves. The clamping parts 123 themselves do not exert much force on the brittle materials, thus effectively avoiding the problem of glass breakage caused by excessive force from the clamps. At the same time, the horizontal electroplating solution is easy to connect with the preceding and following processes and is easier to automate.

[0035] It should be noted that the clamping member 123 is used to fix and support the workpiece to be electroplated. By setting a corresponding number of clamping members 123 on both sides of the workpiece to be electroplated, the clamping effect can be made more stable, thereby making the electroplating process more stable.

[0036] It should be noted that the structures of the first conveyor 121 and the second conveyor 122 can be the same or different, as long as the conveying speed of the first conveyor 121 and the second conveyor 122 for the workpiece to be electroplated is the same.

[0037] It should be noted that the electroplating process is as follows: In the electroplating tank 111 containing electrolyte 112, the anode and cathode are connected to the negative and positive terminals of the power supply, respectively. Positively charged metal cations are released to the cathode surface, and after gaining electrons, they are reduced to metal atoms and deposited on the cathode plate surface to form an electroplating layer.

[0038] According to one embodiment of the present invention, such as Figure 3 and Figure 4 As shown, the clamping member 123 includes a first clamping part 1231, a second clamping part 1232, and a fixing part 1233. The first clamping part 1231 is fixedly connected to the fixing part 1233. The second clamping part 1232 can move vertically relative to the first clamping part 1231 and the fixing part 1233. It can be understood that by setting the second clamping part 1232 to be able to move vertically relative to the first clamping part 1231, the clamping member 123 can be fixed in the vertical direction to be electroplated, thereby realizing electroplating of the part to be electroplated in the horizontal direction.

[0039] According to one embodiment of the present invention, such as Figure 3 and Figure 4 As shown, the clamping member 123 also includes a mating part 1234 disposed on the top of the second clamping part 1232. Furthermore, a lifting member 1111 is disposed on the electroplating tank 111. During the movement of the mating part 1234, the lifting member 1111 lifts the mating part 1234, causing the second clamping part 1232 to move relative to the first clamping part 1231. This allows the clamping member 123 to open before the workpiece to be electroplated enters the electroplating area, and to close after entering, thereby fixing the workpiece to be electroplated.

[0040] According to one embodiment of the present invention, such as Figures 1-4 As shown, the number of clamping members 123 on the first conveyor 121 and the second conveyor 122 is the same and they are arranged correspondingly in the horizontal direction. It can be understood that by setting the same number of clamping members 123 on the first conveyor 121 and the second conveyor 122, the clamping effect on both sides of the workpiece to be electroplated can be the same.

[0041] It should be noted that in some other embodiments, the number of clamping members 123 on the first conveyor 121 and the second conveyor 122 is different, but the clamping effect on both sides of the workpiece to be electroplated is basically consistent. For example, the number of clamping members 123 on the first conveyor 121 is twice that on the second conveyor 122, and the clamping effect on both sides is basically the same.

[0042] According to one embodiment of the present invention, such as Figures 1-4 As shown, the clamping members 123 on the first conveyor 121 and the second conveyor 122 are evenly distributed. It can be understood that by setting the clamping members 123 on the first conveyor 121 and the second conveyor 122 to be evenly distributed, the clamping effect on the workpiece to be electroplated can be consistent at any time during the conveying process, thereby ensuring the stability of the workpiece to be electroplated during the electroplating process.

[0043] According to one embodiment of the present invention, such as Figures 1-4 As shown, the distance between two adjacent clamping members 123 on the first conveyor 121 and the second conveyor 122 is 5-15mm. It can be understood that by reasonably setting the distance between two adjacent clamping members 123, the number of clamping members 123 can meet the requirements of clamping stability, thereby ensuring the stability of the workpiece to be electroplated during the electroplating process. Preferably, the distance between two adjacent clamping members 123 on the first conveyor 121 and the second conveyor 122 is 10mm.

[0044] According to one embodiment of the present invention, such as Figures 1-4 As shown, both the first conveyor 121 and the second conveyor 122 are tracks capable of periodic movement. It is understood that by setting the first conveyor 121 and the second conveyor 122 as the same component, the synchronization of their movement can be increased, thereby ensuring the stability of the workpiece to be electroplated during the electroplating process.

[0045] According to one embodiment of the present invention, such as Figures 2-4 As shown, the clamping member 123 is provided with an insulating protective layer 1235. The insulating protective layer 1235 is disposed on the periphery of the first clamping part 1231, the second clamping part 1232 and the fixing part 1233. It can be understood that by providing an insulating protective layer 1235 on the periphery of the first clamping part 1231, the second clamping part 1232 and the fixing part 1233, the internal first clamping part 1231, the second clamping part 1232 and the fixing part 1233 can be protected, and at the same time, it can provide insulation.

[0046] It should be noted that the clamping component 123 is a metal component, which enables it to act as a cathode and be connected to the power supply during the electroplating process, thereby completing the electroplating process.

[0047] According to one embodiment of the present invention, such as Figures 1-4 As shown, it also includes a feeding mechanism (not shown in the figure) and a discharging mechanism (not shown in the figure). The feeding mechanism and the discharging mechanism are respectively connected to both ends of the electroplating mechanism 110. It can be understood that the feeding mechanism realizes the conveying of the workpiece to be electroplated into the electroplating mechanism 110, and the discharging mechanism realizes the conveying of the workpiece to be electroplated after electroplating from the electroplating mechanism 110.

[0048] The above-described electroplating apparatus provided in this application is a preferred embodiment and should not be construed as limiting the scope of protection of this application. Those skilled in the art should know that various improvements or substitutions can be made without departing from the concept of this application, and all improvements or substitutions should be within the scope of protection of this application, that is, the scope of protection of this application should be determined by the claims.

[0049] Where there is no conflict, the above embodiments and features described herein can be combined with each other.

Claims

1. An electroplating apparatus characterized by comprising: include: An electroplating mechanism, comprising an electroplating tank filled with an electrolyte, and multiple top anodes and bottom anodes corresponding in the vertical direction disposed within the electroplating tank; The conveying mechanism includes a first conveying component and a second conveying component, which are disposed on both sides of the electroplating tank. The first conveying component and the second conveying component are provided with a plurality of clamping components that can open and close in the vertical direction. A control mechanism that controls the clamping member, the first conveyor member, and the second conveyor member to move synchronously. A power source connected to the top anode, the bottom anode, and the clamping member.

2. The electroplating apparatus of claim 1, wherein The clamping member includes a first clamping part, a second clamping part, and a fixing part. The first clamping part is fixedly connected to the fixing part, and the second clamping part can move vertically relative to the first clamping part and the fixing part.

3. The electroplating apparatus of claim 2, wherein The clamping member also includes a mating part disposed on the top of the second clamping part.

4. The electroplating apparatus of claim 3, wherein The electroplating tank is provided with a lifting member, which lifts the mating part during the movement of the mating part, thereby driving the second clamping part to move relative to the first clamping part.

5. The electroplating apparatus of claim 1, wherein The number of clamping elements on the first and second conveyors is the same and they are arranged correspondingly in the horizontal direction.

6. The electroplating apparatus as described in claim 1, characterized in that, The clamping elements on the first and second conveyors are evenly distributed.

7. The electroplating apparatus as described in claim 1, characterized in that, The distance between two adjacent clamping members on the first and second conveying members is 5-15mm.

8. The electroplating apparatus as described in claim 1, characterized in that, Both the first and second conveyor components are tracks.

9. The electroplating apparatus as described in claim 1, characterized in that, The clamping member is provided with an insulating protective layer, which is disposed around the first clamping part, the second clamping part and the fixing part.

10. The electroplating apparatus as claimed in claim 1, characterized in that, It also includes a feeding mechanism and a discharging mechanism, which are respectively connected to both ends of the electroplating mechanism.

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