Method, apparatus and equipment for preparing anti-glare polarized optical light strips

Abstract

This invention relates to the field of anti-glare light strip manufacturing technology, solving the technical problem of insufficient consistency in the internal optical path structure assembly during continuous manufacturing of existing anti-glare light strips, which leads to fluctuations in the anti-glare polarized light output effect. The invention provides a method for manufacturing an anti-glare polarized optical light strip, comprising: depositing solder and mounting light-emitting elements on a flexible substrate, followed by reflow soldering to form a light-emitting circuit substrate; connecting multiple segments of the light-emitting circuit substrate into a continuous light board structure after passing inspection; installing the continuous light board structure into a dimming component and sealing it to form a light strip blank; then installing the light strip blank into a shell and installing an anti-glare layer; and finally, after cutting, end sealing, powering on, aging, and optical inspection, outputting the finished light strip. This invention effectively reduces problems such as polarization angle changes, localized glare enhancement, and uneven light output caused by light board misalignment, uneven sealing, and anti-glare layer assembly deviations.

Description

Technical Field

[0001] This invention relates to the field of anti-glare light strip manufacturing technology, and in particular to a method, apparatus and equipment for manufacturing an anti-glare polarized optical light strip. Background Technology

[0002] Anti-glare polarized optical light strips are linear lighting products that achieve directional light emission and reduce direct glare through a combination of polarization adjustment and anti-glare structures. They are commonly used in indoor decorative lighting, commercial display lighting, cabinet lighting, and ambient lighting. Compared to ordinary flexible light strips, these strips not only require continuous light emission from light-emitting elements on a flexible substrate, but also need to use dimming devices to polarize the emitted light. Furthermore, an anti-glare layer located on the light emission direction side further reduces high-angle stray light and direct glare, thereby improving visual comfort and light uniformity while meeting lighting brightness requirements.

[0003] Chinese patent CN117366511A discloses an anti-glare light strip and its manufacturing process. The light strip includes a circuit board, LED chips, and a lampshade. The lampshade is concave and fixedly mounted on the top surface of the circuit board to cover the LED chips. A retractable patterned mesh is provided on the top of the lampshade. When the mesh extends upwards, it forms raised rings on the top of the lampshade; when it retracts downwards, it fits into the lampshade, making the top surface of the lampshade flat. The retraction of the patterned mesh is controlled by a driver, controller, and sensor. This solution mainly changes the shape of the light-emitting surface through the lampshade, patterned mesh, and related driving structures, thereby achieving a switch between anti-glare and visual effects. Its manufacturing process focuses on the independent molding, bonding, and embedding of the lampshade and patterned mesh, as well as the assembly of external control components. However, the aforementioned patented solutions do not address the overall design of the continuous manufacturing process of anti-glare polarized optical light strips, nor do they involve the manufacturing process of fitting the continuous light panel structure into a sealed cavity formed by light-shielding and light-transmitting components, and ensuring a stable correspondence between the light-emitting element, light-transmitting component, and anti-glare layer in the light-emitting direction. For light strips that require polarization adjustment via dimming components, positioning via a shell abutment and snap-fit ​​structure, and anti-glare treatment on the light-emitting side via an anti-glare layer, this solution struggles to solve the problems of positional misalignment, uneven coverage, unstable dimming component positioning, insufficient consistency in anti-glare layer assembly, and difficulty in simultaneously ensuring the electrical performance and anti-glare light emission performance of the finished product during the splicing, sealing, and assembly processes of the continuous light panel structure.

[0004] Therefore, how to ensure the assembly consistency of the internal optical path structure of the light strip during continuous manufacturing process in order to reduce the fluctuation of the anti-glare polarization light output effect is an urgent technical problem to be solved. Summary of the Invention

[0005] In view of this, embodiments of the present invention provide a method, apparatus and equipment for preparing anti-glare polarized optical light strips, in order to solve the technical problem that the existing anti-glare light strip preparation technology has insufficient consistency in the assembly of the internal optical path structure of the light strip during continuous preparation, which leads to fluctuations in the anti-glare polarized light output effect.

[0006] In a first aspect, embodiments of the present invention provide a method for preparing an anti-glare polarized optical light strip, applicable to anti-glare polarized optical light strips. The anti-glare polarized optical light strip includes a flexible substrate, a light-emitting element disposed on the flexible substrate, a dimming component for adjusting the polarization of the light emitted from the light-emitting element, a housing for accommodating the dimming component, and an anti-glare layer disposed on the light-emitting side of the housing. The dimming component includes a light-shielding component and a light-transmitting component, the light-shielding component and the light-transmitting component forming a sealed cavity for accommodating the light-emitting element. The housing has an internal cavity, and the inner sidewall of the housing is provided with an abutment portion, a first latching portion and a second latching portion along the height direction. The method includes: Solder deposition and light-emitting element mounting are performed on a flexible substrate, and a light-emitting circuit substrate is formed by reflow soldering. The light-emitting circuit board is subjected to electrical performance testing, and when the preset testing conditions are met, at least two sections of the light-emitting circuit board are connected along the length direction to form a continuous lamp board structure. The continuous lamp panel structure is installed into the sealed cavity of the dimming component, so that the light-emitting element is located at the bottom of the light-shielding component, and the light-transmitting component is located on the side of the light-emitting element in the light-emitting direction. The continuous lamp panel structure installed in the dimming element is sealed and molded, so that the fluid sealing medium covers the outer periphery of the continuous lamp panel structure and is cured to form a lamp strip blank with dimming element. The lamp strip blank with the dimming element is inserted into the inner cavity of the housing, so that the bottom of the dimming element abuts against the abutting part, and the fixing part of the outer wall of the dimming element is engaged with the first snap-fit ​​part. The anti-glare layer is installed on the light-emitting direction side of the housing, so that the edge of the anti-glare layer is engaged with the second snap-fit ​​part. The LED strip blank is lengthened and end-sealed to form a sealed connection structure at the end, thus obtaining a semi-finished LED strip. The semi-finished light strip is post-processed, and the finished light strip is output when the semi-finished light strip meets the preset electrical performance conditions and anti-glare light emission conditions. The post-processing includes power-on detection, aging treatment and optical detection.

[0007] Secondly, embodiments of the present invention provide an apparatus for preparing an anti-glare polarized optical light strip, applied to an anti-glare polarized optical light strip. The anti-glare polarized optical light strip includes a flexible substrate, a light-emitting element disposed on the flexible substrate, a dimming component for adjusting the polarization of the light emitted from the light-emitting element, a housing for accommodating the dimming component, and an anti-glare layer disposed on the light-emitting side of the housing. The dimming component includes a light-shielding component and a light-transmitting component, the light-shielding component and the light-transmitting component forming a sealed cavity for accommodating the light-emitting element. The housing has an internal cavity, and the inner sidewall of the housing is provided with an abutment portion, a first latching portion and a second latching portion along the height direction. The apparatus includes: The light-emitting circuit substrate fabrication module is used to perform solder deposition and light-emitting element mounting on a flexible substrate, and to form a light-emitting circuit substrate by reflow soldering. The panel module is used to perform electrical performance testing on the light-emitting circuit board, and when the preset testing conditions are met, to connect at least two sections of the light-emitting circuit board along the length direction to form a continuous lamp board structure. A dimming assembly module is used to install the continuous lamp panel structure into the sealed cavity of the dimming component, so that the light-emitting element is located at the bottom of the light-shielding component and the light-transmitting component is located on the light-emitting direction side of the light-emitting element. A sealing molding module is used to perform sealing molding on the continuous lamp panel structure installed in the dimming component, so that the fluid sealing medium covers the outer periphery of the continuous lamp panel structure and solidifies to form a lamp strip blank with a dimming component. The housing anti-glare assembly module is used to install the light strip blank with the dimming element into the internal cavity of the housing, so that the bottom of the dimming element abuts against the abutting part, and the fixing part of the outer wall of the dimming element is engaged with the first snap-fit ​​part, and the anti-glare layer is installed on the light emission direction side of the housing, so that the edge of the anti-glare layer is engaged with the second snap-fit ​​part; The cutting and packaging module is used to process the length of the LED strip blank and to package the ends, forming a sealed connection structure at the ends to obtain a semi-finished LED strip. The post-processing and testing module is used to perform post-processing on the semi-finished light strip and output the finished light strip when the semi-finished light strip meets the preset electrical performance conditions and anti-glare light emission conditions. The post-processing includes power-on testing, aging treatment and optical testing.

[0008] Thirdly, embodiments of the present invention provide an electronic device, including: at least one processor, at least one memory, and computer program instructions stored in the memory, which, when executed by the processor, implement the method of the first aspect described above.

[0009] In summary, the beneficial effects of the present invention are as follows: The method, apparatus, and equipment for preparing anti-glare polarized optical light strips provided in this invention control electrical connections, optical assembly, and structural fixation simultaneously during the preparation process. This allows the anti-glare polarized optical light strips to no longer rely solely on the later addition of an anti-glare layer to improve glare, but rather to establish a stable and corresponding optical path relationship between the light-emitting element, the light-transmitting element, and the anti-glare layer during the light strip forming process. The light-emitting circuit board undergoes electrical performance testing before being assembled into a continuous lamp panel structure. This reduces the likelihood of defective boards entering subsequent processes and ensures continuous light emission along the length of the lamp strip. After the continuous lamp panel structure is installed in the sealed cavity of the dimming component, the light-emitting element is confined to the bottom of the light-shielding component, with the light-transmitting component located on its light-emitting direction side. This allows the light emitted by the light-emitting element to enter the light-transmitting component along a predetermined path for polarization adjustment. The sealing molding process further fixes the continuous lamp panel structure within the dimming component, reducing the risk of lamp panel displacement during subsequent housing assembly, cutting, end sealing, and use. The abutment part and the first snap-fit ​​part of the housing provide height and lateral limits for the dimming component, while the second snap-fit ​​part provides stable installation for the anti-glare layer, making the relative position between the dimming component and the anti-glare layer less prone to change. Through the above process, problems such as changes in polarization angle, localized glare enhancement, and uneven light emission caused by lamp panel displacement, uneven sealing, and anti-glare layer assembly deviations can be effectively reduced. Attached Figure Description

[0010] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments of the present invention will be briefly introduced below. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, and these are all within the protection scope of the present invention.

[0011] Figure 1 This is a schematic diagram of the anti-glare polarized optical light strip in Embodiment 1 of the present invention; Figure 2 This is a schematic flowchart of the preparation method of the anti-glare polarized optical light strip in Embodiment 1 of the present invention; Figure 3 This is a schematic diagram of the structure of the apparatus for preparing the anti-glare polarized optical light strip in Embodiment 2 of the present invention; Figure 4 This is a schematic diagram of the electronic device in Embodiment 3 of the present invention; The numbers in the diagram are as follows: 1-Flexible substrate; 2-Light-emitting element; 3-Dimming component; 31-Light-shielding component; 32-Light-transmitting component; 33-Sealed cavity; 4-Outer shell; 41-Internal cavity; 42-Abutting part; 43-First snap-fit ​​part; 44-Second snap-fit ​​part; 5-Anti-glare layer. Detailed Implementation

[0012] The features and exemplary embodiments of various aspects of the present invention will now be described in detail. To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the invention.

[0013] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0014] It should be noted that all actions involving the acquisition of signals, information, or data in this invention are carried out in compliance with the relevant data protection laws and regulations of the locality and with authorization from the owner of the relevant device.

[0015] Example 1 This invention provides a method for preparing an anti-glare polarized optical light strip, applicable to anti-glare polarized optical light strips. Please refer to [link to relevant documentation]. Figure 1 The anti-glare polarized optical light strip includes a flexible substrate 1, a light-emitting element 2 disposed on the flexible substrate 1, a dimming component 3 for polarizing the emitted light of the light-emitting element 2, a housing 4 for accommodating the dimming component 3, and an anti-glare layer 5 disposed on the light-emitting side of the housing 4. The dimming component 3 includes a light-shielding component 31 and a light-transmitting component 32, which together form a sealed cavity 33 for accommodating the light-emitting element 2. The housing 4 has an internal cavity 41, and the inner sidewall of the housing 4 is provided with an abutment portion 42, a first latching portion 43, and a second latching portion 44 along the height direction. Specifically, the flexible substrate 1 is used to support the light-emitting element 2 and form a bendable LED strip circuit base. The light-emitting element 2 can be LED beads spaced apart along the length of the flexible substrate 1 or a light-emitting unit with a lens structure. The dimming element 3 is used to perform secondary optical adjustment on the light emitted by the light-emitting element 2, so that the light is no longer emitted directly outward with a large divergence angle, but is instead formed into emitted light with a polarized direction after being limited by the light-shielding element 31 and refracted or guided by the light-transmitting element 32. The light-shielding element 31 is mainly used to limit stray light from non-target directions. The light-transmitting element 32 is located on the light-emitting direction side of the light-emitting element 2 and can change the light propagation direction through curved surfaces, inclined surfaces or other light-transmitting surface shapes. The sealed cavity 33 formed by the two provides installation space for the light-emitting element 2 and the continuous lamp panel structure, so that the light-emitting element 2 has a relatively stable optical position inside the dimming element 3. The internal cavity 41 of the housing 4 is used to accommodate the dimming element 3 and its internal lamp panel structure. The abutment part 42 is used to support or limit the bottom height of the dimming element 3. The first snap-fit ​​part 43 is used to cooperate with the fixing part on the outer wall of the dimming element 3 to limit the movement of the dimming element 3 within the housing 4. The second snap-fit ​​part 44 is used to snap the edge of the anti-glare layer 5, so that the anti-glare layer is stably set on the light-emitting direction side of the housing 4. Through the above structural cooperation, the light-emitting element 2, the light-transmitting element 32, and the anti-glare layer 5 are arranged sequentially along the light-emitting path. The dimming element 3 and the anti-glare layer 5 are respectively fixed by the limiting structure inside the housing 4, thereby reducing the internal light path structure offset during the manufacturing and subsequent use of the lamp strip, ensuring that the polarization adjustment and anti-glare treatment have a stable structural foundation, which is conducive to improving the consistency of the anti-glare polarization light emission effect, assembly reliability, and overall sealing stability.

[0016] Please see Figure 2 The method includes: Solder deposition and light-emitting element mounting are performed on a flexible substrate, and a light-emitting circuit substrate is formed by reflow soldering. Specifically, the flexible substrate, serving as the carrier of the light-emitting circuit, typically has pre-set pad areas on its surface corresponding to the electrodes of the light-emitting element. During fabrication, it is crucial to ensure the substrate surface is clean, flat, and in a stable positioning state to prevent solder misalignment or mounting deviations from affecting the subsequent optical path position. During solder deposition, the solder distribution can be controlled according to the position and area of ​​the pad areas and the electrode size of the light-emitting element, ensuring the solder covers the area required for electrical connection without overflowing into adjacent circuits. When mounting the light-emitting element, its emitting surface should face the light-transmitting component of the subsequent dimming device, and the emitting center should correspond to the predetermined optical position on the flexible substrate. During reflow soldering, the solder melts upon heating and bonds to both the light-emitting element electrodes and the flexible substrate pads. After cooling, stable solder joints are formed, thus providing reliable electrical connection for the light-emitting element while maintaining a fixed position on the flexible substrate. This process provides a consistent light-emitting foundation for subsequent electrical performance testing, continuous connection, and dimming device assembly, reducing localized dimming, abnormal brightness, and polarized light incident position deviations caused by misalignment, cold solder joints, or uneven solder joints.

[0017] The light-emitting circuit board is subjected to electrical performance testing, and when the preset testing conditions are met, at least two sections of the light-emitting circuit board are connected along the length direction to form a continuous lamp board structure. Specifically, after the light-emitting circuit board is soldered, its electrical condition must be confirmed to meet the manufacturing requirements before proceeding to the subsequent splicing stage to avoid defective boards being carried into the sealing and assembly process. Electrical performance testing can be performed by applying a test voltage to the input terminal of the light-emitting circuit board, observing or collecting the light emission of each light-emitting element, and combining this with the operating current, terminal voltage, or segmented voltage drop to determine if there are any abnormalities such as open circuits, short circuits, reverse connections, or poor soldering. When light-emitting circuit boards that meet the preset testing conditions are connected along the length, attention should be paid to the correspondence between the polarity terminals and connecting pads of adjacent boards. The spacing between the light-emitting elements on both sides of the connection position should be kept as consistent as possible with the internal light-emitting pitch of the board to avoid forming obvious dark areas or abrupt changes in light spots. By testing before connecting, the continuous light board structure can not only form continuous light-emitting units suitable for the production of long strip lights, but also maintain good electrical continuity and light emission uniformity before entering the dimming component, providing a foundation for the consistency of subsequent polarization adjustment and anti-glare light emission.

[0018] The continuous lamp panel structure is installed into the sealed cavity of the dimming component, so that the light-emitting element is located at the bottom of the light-shielding component, and the light-transmitting component is located on the side of the light-emitting element in the light-emitting direction. Specifically, when installing the continuous lamp panel structure into the dimming component, the key is to establish a stable spatial correspondence between the light-emitting elements and the light-shielding and light-transmitting components. The sealed cavity of the dimming component is jointly defined by the light-shielding and light-transmitting components. The bottom of the light-shielding component is used to accommodate the continuous lamp panel structure and limit lateral stray light, while the light-transmitting component is located on the light-emitting side of the light-emitting elements and is used to refract, guide, or adjust the light emitted from the light-emitting elements. During assembly, the continuous lamp panel structure should be smoothly placed into the sealed cavity along the length of the dimming component, ensuring that the flexible substrate is in contact with or stably supported by the bottom of the light-shielding component, and that the light-emitting center of each light-emitting element corresponds to the effective light-incident area of ​​the light-transmitting component. If the continuous lamp panel structure is laterally offset, warped, or has inconsistent height, the light emitted by the light-emitting elements may not be able to enter the light-transmitting component along the predetermined path, resulting in changes in the polarization angle or increased local glare. By completing the optical positioning before sealing and molding, the basic optical path relationship between the light-emitting element, the light-shielding element and the light-transmitting element can be established first, so that the subsequent curing of the sealing medium and the assembly of the housing are less likely to destroy the correspondence, thereby improving the polarization stability and anti-glare consistency of the light strip along its length.

[0019] The continuous lamp panel structure installed in the dimming element is sealed and molded, so that the fluid sealing medium covers the outer periphery of the continuous lamp panel structure and is cured to form a lamp strip blank with dimming element. Specifically, the fluid sealing medium refers to a transparent or translucent colloidal material that can flow and fill the gaps around the continuous lamp panel structure before curing. Silicone, resin-based sealing materials, or other encapsulation media with insulating, moisture-proof, and light-transmitting properties can be used, compatible with the LED strip encapsulation process. This process is typically performed after the continuous lamp panel structure has been stably placed within the sealed cavity of the dimming element. During operation, the sealing medium needs to be evenly distributed along the length of the continuous lamp panel structure into the bottom or side areas of the sealed cavity, covering the flexible substrate, solder joints, connection areas, and edge gaps of the continuous lamp panel structure. Simultaneously, the filling height and flow range of the sealing medium should be controlled to prevent it from obstructing the effective light emission path between the light-emitting element and the light-transmitting element. During curing, depending on the material properties of the sealing medium, methods such as heat curing, room temperature curing, or light curing can be used to transform the sealing medium from a fluid state into a stable coating layer. This step not only improves the moisture resistance, insulation, and anti-loosening capabilities of the continuous lamp panel structure, but also fixes the continuous lamp panel structure inside the dimming component, reducing its offset or warping during subsequent installation into the housing, cutting, end sealing, and use, thereby ensuring a more stable light-incident position of the light-emitting element relative to the light-transmitting component.

[0020] The lamp strip blank with the dimming element is inserted into the inner cavity of the housing, so that the bottom of the dimming element abuts against the abutting part, and the fixing part of the outer wall of the dimming element is engaged with the first snap-fit ​​part. The anti-glare layer is installed on the light-emitting direction side of the housing, so that the edge of the anti-glare layer is engaged with the second snap-fit ​​part. Specifically, when the LED strip blank with the dimming element is installed into the housing, the internal cavity of the housing provides installation space for the dimming element. The abutment part mainly serves as height support and assembly reference, while the first snap-fit ​​part is used to cooperate with the fixing part on the outer wall of the dimming element, preventing the dimming element from shifting laterally or detaching vertically within the housing. During assembly, the LED strip blank can be smoothly pushed into the internal cavity along the length or opening direction of the housing, allowing the bottom of the dimming element to first rest on the abutment part to determine the installation position of the dimming element in the height direction of the housing. Then, the fixing part is engaged with the first snap-fit ​​part by pressing, sliding, or snapping, completing the limiting and fixing between the dimming element and the housing. The anti-glare layer is located on the light-emitting side of the housing, and its edge needs to match the shape of the second snap-fit ​​part. During assembly, the anti-glare layer is pressed into or inserted into the second snap-fit ​​part to cover the light-emitting side of the light-transmitting element and maintain a flat and continuous shape along the length of the LED strip. Through the layered cooperation of the abutment part, the first snap-fit ​​part, and the second snap-fit ​​part, the dimming component and the anti-glare layer can obtain stable installation positions respectively, so that the light-emitting element, the light-transmitting component, and the anti-glare layer remain relatively fixed in the light emission direction, reducing the changes in polarization angle, local glare enhancement, and uneven light emission caused by housing assembly deviation or loosening of the anti-glare layer.

[0021] The LED strip blank is lengthened and end-sealed to form a sealed connection structure at the end, thus obtaining a semi-finished LED strip. Specifically, length processing mainly involves cutting the LED strip blank, which has already been assembled with dimming components and housing, to a fixed length based on actual product specifications, installation scenarios, or order requirements. Before cutting, the target length and cuttable positions need to be determined, prioritizing positions located between adjacent light-emitting elements and avoiding welding areas, connection areas, and main light-emitting areas to prevent damage to the circuitry on the flexible substrate or causing abnormal end-lighting. After cutting, the ends of the LED strip will expose the flexible substrate, sealing medium, dimming components, or housing cross-section, thus requiring end-sealing. The end-sealing component can be an end cap, a sealing structure, or a sealing component adapted to the end of the housing. During assembly, it should cover the end opening, electrical connection area, and areas where water or dust may enter, and should fit tightly against the end of the LED strip body. The sealing and fixing process can be completed by pouring end sealant, hot pressing, fastening, and curing, so that the end-sealing component and the end of the LED strip body form a continuous sealed connection structure.

[0022] The semi-finished light strip is post-processed, and the finished light strip is output when the semi-finished light strip meets the preset electrical performance conditions and anti-glare light emission conditions. The post-processing includes power-on detection, aging treatment and optical detection.

[0023] Specifically, after the LED strip semi-finished product completes its structural assembly and end packaging, it still needs to undergo post-processing to confirm whether it can be output as a finished LED strip. Power-on testing is used to check whether the LED strip semi-finished product can light up normally under rated or preset test voltage. Testing may include input current, end voltage, segmented voltage drop, presence of dark areas, flickering, short circuits, or open circuits. Aging treatment involves continuously or cyclically operating the LED strip semi-finished product under preset voltage, preset time, and preset environmental conditions to expose potential problems such as loose solder joints, premature failure of light-emitting elements, and heat-induced deformation of the seal. Optical testing is used to confirm whether the anti-glare polarization performance meets the requirements. It can collect light angle, brightness distribution, glare evaluation value, illuminance uniformity, or the light spot status on the light-emitting side of the anti-glare layer at a fixed detection distance and angle. Only when the electrical performance is stable according to the power-on test and aging treatment, and the optical test results show that the polarization direction, anti-glare effect and light output uniformity meet the preset anti-glare light output conditions, will the finished light strip be output. This avoids using only being able to light up as the qualified standard, but also selects from both electrical reliability and anti-glare optical performance, thereby improving the consistency of the finished products.

[0024] Preferably, the process of performing solder deposition and light-emitting element mounting on a flexible substrate, followed by reflow soldering to form a light-emitting circuit substrate, includes: The flexible substrate is surface cleaned and positioned to obtain multiple pad areas on the flexible substrate. Based on the width of the sealed cavity of the dimming component and the light-incident area of ​​the light-transmitting component, the mounting position of the light-emitting element is determined in the pad area, so that the light-emitting center of the light-emitting element corresponds to the light-incident area of ​​the light-transmitting component. Solder is deposited on the pad area, and the position and amount of solder after deposition are detected. When the solder position and the amount of solder meet the preset solder deposition conditions, the light-emitting element is mounted on the corresponding pad area according to the mounting position. Position detection is performed on the mounted light-emitting element. When the mounting offset of the light-emitting element relative to the pad area meets the preset mounting offset condition, the flexible substrate with the mounted light-emitting element is reflow soldered to form the light-emitting circuit substrate.

[0025] Specifically, the flexible substrate needs to be in a stable and clean state before entering the mounting process. The flexible substrate is a bendable substrate used to support circuitry, pads, and light-emitting elements. The pad area is the metallized region on the flexible substrate used for soldering connections with the electrodes of the light-emitting elements. Surface cleaning removes dust, oil, oxides, or processing residues from the flexible substrate surface, preventing poor solder wetting or subsequent cold solder joints. Positioning and fixing can be achieved through positioning holes, edge references, adsorption platforms, or clamping limits, ensuring the flexible substrate remains flat, wrinkle-free, and without shifting during solder deposition and mounting. Multiple pad areas can be determined based on the circuit pattern, pad coordinates, or preset mounting program on the flexible substrate, providing a clear positional reference for subsequent solder deposition and light-emitting element mounting. This ensures that each light-emitting element is neatly arranged along the length of the LED strip and reduces mounting errors caused by deformation of the flexible substrate.

[0026] The mounting position of the light-emitting element (LED) is not simply a matter of mechanically placing it according to the pad positions. It also needs to be determined in conjunction with the width of the sealed cavity of the dimming component and the light-incident area of ​​the light-transmitting component. The width of the sealed cavity determines the lateral space that the LED can have inside the dimming component, while the light-incident area of ​​the light-transmitting component is the effective area where the light emitted from the LED enters the component and undergoes polarization adjustment. When determining the actual mounting position, the center line of the flexible substrate, the center of the pad area, or the mounting reference of the dimming component can be used as a reference. Then, based on the corresponding positions of the light-incident area of ​​the light-transmitting component in the width and height directions, the mounting center of the LED can be calibrated to ensure that the light-emitting center of the LED falls as close as possible to the corresponding position within the effective light-incident range of the light-transmitting component. This prevents the LED from being biased towards the side wall of the light-shielding component or deviating from the light-incident surface of the light-transmitting component after installation, even if the LED has a normal electrical connection. This avoids abnormal light incident angles, unstable polarization directions, or increased local glare.

[0027] Solder deposition is a preliminary step in forming reliable solder joints. The solder can be solder paste or other soldering materials suitable for mounting light-emitting components. During deposition, the solder must cover the corresponding pad area, and its shape, thickness, and volume must be controlled to avoid insufficient solder leading to inadequate solder strength, and excessive solder causing bridging, short circuits, or floating of the light-emitting components after mounting. Solder position detection after deposition can be performed using visual inspection, stencil comparison, or coordinate measurement to confirm whether the solder deviates from the pad area. Solder quantity detection can be performed using thickness, area, or volume to determine whether the solder meets the welding requirements. By screening the solder position and quantity before mounting, problems such as cold solder joints, bridging, and unstable electrical connections after reflow soldering can be reduced, resulting in a more reliable light-emitting circuit board with better conductivity.

[0028] After the solder position and amount meet the preset solder deposition conditions, the light-emitting elements are placed according to the determined mounting positions. This avoids continuing to mount in areas with abnormal solder deposition, which would cause subsequent rework. When mounting the light-emitting elements, their electrodes should be accurately aligned with the corresponding pad areas, and the light-emitting surface should face the direction of the subsequent light-transmitting component. For multiple light-emitting elements arranged continuously along the length, the pitch between adjacent light-emitting elements should be kept consistent to ensure that the light strip has a uniform light-emitting base along its length. During the mounting process, the light-emitting elements can be placed onto the solder using a nozzle, mounting head, or positioning fixture, and their position can be temporarily fixed by the adhesive properties of the solder. This step incorporates both the electrical connection position and the optical light incident position into the mounting control, ensuring that the position of the light-emitting elements formed by subsequent reflow soldering can balance conductivity reliability and polarization optical path matching.

[0029] Position detection after mounting is performed to detect any offset, rotation, or tilt of the light-emitting element relative to the pad area before reflow soldering. Mounting offset can include lateral, longitudinal, and angular deviations of the light-emitting element center relative to the pad area center. Preset mounting offset conditions are used to ensure that this offset does not affect electrode soldering and the correspondence between the light-emitting center and the light-incident area of ​​the light-transmitting component. Only when the mounting offset meets the requirements is reflow soldering performed, allowing the solder to melt and form a stable solder joint between the light-emitting element electrode and the flexible substrate pads. After cooling, the light-emitting element is fixed in the predetermined position on the flexible substrate, forming the light-emitting circuit substrate. By adding position confirmation before reflow soldering, the problem of difficult correction of misaligned components after soldering can be avoided, improving the fabrication yield of the light-emitting circuit substrate. Simultaneously, it ensures that the light-emitting element maintains a good correspondence with the light-incident area of ​​the light-transmitting component within the subsequent dimming component's sealed cavity, providing a foundation for consistent anti-glare polarized light output.

[0030] Preferably, the step of performing electrical performance testing on the light-emitting circuit substrate and, when preset testing conditions are met, connecting at least two segments of the light-emitting circuit substrate along the length direction to form a continuous lamp board structure includes: Connect the positive and negative terminals of the preset detection power supply to the positive and negative input pads of the light-emitting circuit board, respectively, and apply a preset test voltage to the light-emitting circuit board. The total operating current of the light-emitting circuit board under the preset test voltage, and the operating voltage across each of the light-emitting elements are collected. When the total operating current is within a preset total current range and the operating voltages at both ends of each light-emitting element are within a preset element voltage range, the corresponding light-emitting circuit board is determined as the board to be connected. Obtain the input positive pad, input negative pad, output positive pad, and output negative pad at the end of each substrate to be connected, and obtain the end distance from the center of the light-emitting element at the end of each substrate to be connected to the corresponding end connection pad; Based on the correspondence between the output positive pad and the input positive pad, and the output negative pad and the input negative pad of the two adjacent segments of the substrate to be connected, and the end spacing of the two adjacent segments of the substrate to be connected, the two adjacent segments of the substrate to be connected are joined end-to-end along the length direction, so that the distance between the centers of adjacent light-emitting elements on both sides of the joining position is within the preset light-emitting pitch range. Conductive connection is performed on the corresponding connection pads of the two adjacent segments of the substrate to be connected after the end docking. When the total working current after connection is within the preset total current range and the working voltages at both ends of the light-emitting elements on both sides of the connection are within the preset element voltage range, the continuous lamp board structure is formed.

[0031] Specifically, the preset test power supply is used to provide a stable voltage to the light-emitting circuit board under controlled conditions. The positive and negative input pads are the initial electrical connection points for connecting the light-emitting circuit board to the external power supply. During testing, the positive and negative terminals of the test power supply are connected to the corresponding pads, simulating the power supply state when the LED strip is actually working, ensuring that the circuitry and light-emitting elements on the light-emitting circuit board are in a detectable energized state. The preset test voltage needs to match the design operating voltage or test voltage of the light-emitting circuit board, ensuring that the light-emitting elements can enter the lighting state normally without damaging them due to excessive voltage. In this way, basic power supply verification of a single segment of the light-emitting circuit board can be performed before splicing, preventing boards with unconfirmed electrical reliability from directly entering subsequent connection, sealing, and assembly processes.

[0032] The total operating current reflects the overall power consumption of the entire light-emitting circuit board under a preset test voltage, while the operating voltage across each light-emitting element reflects whether the individual light-emitting element and its corresponding branch are in a normal conducting state. During actual testing, the current value of the entire board can be collected at the power supply output terminal, and the voltage value across each light-emitting element can be tested simultaneously. Alternatively, the operating voltage of the corresponding light-emitting element or unit can be obtained through segmented testing points. If the voltage across a certain light-emitting element deviates significantly from the normal range, it indicates that there may be problems such as poor soldering, short circuit, open circuit, abnormal polarity, or component damage at that location. If the total operating current is significantly higher or lower than normal, it may indicate that there is a short circuit, open circuit, or an abnormal number of light-emitting elements in the entire circuit. By simultaneously collecting the overall current and local voltages, a more comprehensive judgment can be made as to whether the light-emitting circuit board is suitable for the splicing process.

[0033] The preset total current range and preset component voltage range are predetermined qualification criteria based on the circuit design of the light-emitting circuit board, the number of light-emitting components, the rated parameters of the light-emitting components, and the detection voltage. Only when the total operating current is within the preset total current range can it be said that the overall load state of the entire board is basically consistent with the design value; if the operating voltage across each light-emitting component is within the preset component voltage range, it indicates that there are no obvious electrical abnormalities at the location of each light-emitting component. Identifying light-emitting circuit boards that meet the above conditions as the boards to be connected allows for quality screening before splicing, ensuring that the subsequent continuous lamp board structure is composed of electrically qualified boards. This reduces the risk of defective boards being difficult to repair after packaging and also helps to ensure the brightness continuity and operational stability of the continuous lamp board structure along its length.

[0034] The input positive pad, input negative pad, output positive pad, and output negative pad at the ends of the substrates to be connected are the corresponding end connection positions required for electrical connection between adjacent substrates. Obtaining the position and polarity of these pads can prevent incorrect polarity connection during connection and ensure that the current can be transmitted along the designed path along the length of the continuous lamp board structure. The end distance from the center of the end light-emitting element to the corresponding end connection pad is used to determine whether the distance between adjacent light-emitting elements on both sides of the connection position will change significantly after the two substrates to be connected are spliced. If only the pad connection is considered and the end distance is ignored, there may be problems such as normal electrical connection but excessively large or small light-emitting pitch at the connection position, resulting in dark areas, bright spots, or discontinuous light spots in the lamp strip at that position. Therefore, obtaining this parameter can combine the electrical connection requirements with the subsequent light output continuity requirements.

[0035] When connecting two adjacent substrate segments at their ends, both polarity correspondence and continuous light emission pitch must be met simultaneously. The correspondence between the output positive pad and the input positive pad, and between the output negative pad and the input negative pad, ensures correct circuit orientation. The end spacing determines the docking position of the two substrate segments along their length, ensuring that the distance between the centers of adjacent light-emitting elements on both sides of the docking position falls within a preset light emission pitch range. The preset light emission pitch range can be determined based on the design spacing between adjacent light-emitting elements within the same substrate, allowing for certain processing errors, but should not cause a visible abrupt change in light emission. In this way, the continuous lamp board structure not only maintains continuous electrical connection at the connection position but also maintains the continuity of the light-emitting element arrangement pitch, providing a foundation for uniform polarized light emission after the subsequent installation of dimming components.

[0036] Conductive connection processing is used to reliably connect the corresponding connection pads after mating. This can be accomplished using welding, conductive connecting pieces, conductive adhesive, or other electrical connection methods suitable for flexible substrates. After connection, the total operating current and the operating voltage across the light-emitting elements on both sides of the connection point are checked again to confirm that the splicing operation did not introduce problems such as cold solder joints, bridging, poor contact, or abnormal voltage drop at the connection point. If the total operating current after connection remains within the preset total current range, it indicates that the overall load condition after splicing meets the requirements. If the operating voltage across the light-emitting elements on both sides of the connection point is within the preset element voltage range, it indicates that the light-emitting elements near the connection area can operate normally, and the connection position does not affect the power supply of adjacent light-emitting units.

[0037] Preferably, the sealing and molding process of the continuous lamp panel structure installed in the dimming element, wherein a fluid sealing medium covers the outer periphery of the continuous lamp panel structure and cures it to form a lamp strip blank with a dimming element, includes: The viscosity of the fluid sealing medium is adjusted to a preset injection viscosity range, and the temperature of the fluid sealing medium is adjusted to a preset injection temperature range; Based on the installation height of the continuous lamp panel structure at the bottom of the sealed cavity, the highest point height of the light-emitting element, and the light incident surface height of the light-transmitting element, the target filling height of the fluid-like sealing medium is determined, wherein the target filling height is higher than the upper surface of the continuous lamp panel structure and lower than the light exit path between the light-emitting element and the light-transmitting element. Along the length of the continuous light panel structure, the fluid sealing medium is injected into the sealed cavity at a preset injection speed and a preset injection pressure, and the volume of the fluid sealing medium injected per unit length is matched with the volume of the space to be covered on the outer periphery of the continuous light panel structure. During the injection process, the real-time liquid level of the fluid sealing medium is detected. When the real-time liquid level reaches the target filling height, the injection at the corresponding position is stopped, so that the fluid sealing medium covers the welding area, side area and bottom area of ​​the continuous lamp panel structure. The injected fluid sealing medium is subjected to negative pressure defoaming treatment, wherein the pressure and time of the negative pressure defoaming treatment are within a preset defoaming pressure range and a preset defoaming time range, respectively. The fluid sealing medium after degassing is cured according to the preset curing temperature and preset curing time. When the upper surface of the cured sealing medium is lower than the light emission path between the light-emitting element and the light-transmitting element, and the fluid sealing medium covers the outer periphery of the continuous lamp panel structure, the lamp strip blank with dimming element is formed.

[0038] Specifically, the viscosity and temperature of the fluid sealing medium are adjusted before entering the sealed cavity to ensure it has a suitable flow state for pouring and coating. If the viscosity is too high, the sealing medium will not flow uniformly along the length of the continuous lamp panel structure, easily forming voids in the welding area, side area, or bottom area; if the viscosity is too low, it may overflow the predetermined coating range and flow into the light-emitting path between the light-emitting element and the light-transmitting element. Temperature directly affects the fluidity and pre-curing stability of the sealing medium. Therefore, adjusting it to a preset pouring temperature range before pouring ensures that the sealing medium maintains a relatively stable viscosity during injection. By controlling these two parameters before pouring, problems such as discontinuous injection, local accumulation, or excessive flow can be reduced, providing a material state basis for the subsequent formation of a uniform coating layer.

[0039] Determining the target filling height is crucial for balancing sealing effectiveness with light path avoidance in this sealing process. The installation height of the continuous lamp panel structure at the bottom of the sealed cavity determines the position of the flexible substrate and the welding area. The height of the highest point of the light-emitting element reflects the height occupied by the light source structure within the sealed cavity, while the height of the light-incident surface of the light-transmitting element corresponds to the effective optical area before the light enters the light-transmitting element. In practice, the bottom of the sealed cavity can be used as a height reference to measure or pre-calibrate the relative heights of the upper surface of the continuous lamp panel structure, the highest point of the light-emitting element, and the light-incident surface of the light-transmitting element. Then, the filling height of the sealing medium is limited to a height that covers the upper surface of the continuous lamp panel structure and the welding area, while being lower than the effective light-emitting path between the light-emitting element and the light-transmitting element. This ensures that the flexible substrate, welding points, and edge areas are sealed and protected, while preventing the sealing medium from entering the light path and causing light blocking, abnormal refraction, or changes in the polarization direction, thereby maintaining the stability of the polarized light output inside the dimming element.

[0040] When injecting the fluid sealing medium along the length of the continuous light panel structure, preset injection speed and pressure are used to control the amount of sealing medium entering the sealed cavity per unit time and its flow distance. The space to be covered on the outer periphery of the continuous light panel structure refers to the area between the continuous light panel structure and the bottom and side walls of the light shield that needs to be filled with the sealing medium. Matching the injection volume per unit length with the volume of this space to be covered can prevent insufficient adhesive in certain length sections from failing to cover the welding area, and can also prevent excessive adhesive from raising the liquid level and affecting the light path. In practice, the injection port moves along the length of the light strip or injects in segments, allowing the sealing medium to continuously enter the sealed cavity and fill the bottom, sides, and welding gaps of the continuous light panel structure under pressure. This method can make the sealing medium form a more uniform coating state along the length direction, reducing the impact of local missing adhesive, overflow adhesive, and inconsistent coating thickness on structural stability and light output consistency.

[0041] Monitoring the real-time liquid level during injection is crucial for ensuring the target filling height is accurately controlled during the actual molding process. The real-time liquid level can be obtained through liquid level sensing, visual inspection, laser ranging, or liquid level calibration corresponding to the mold position. This information is used to determine whether the sealing medium has reached the predetermined height at the current injection position. When the real-time liquid level reaches the target filling height, injection at that position is stopped, ensuring the sealing medium remains within a height range that covers the welding area, side areas, and bottom area of ​​the continuous light panel structure without entering the effective light emission path. This process monitoring and stopping control avoids height errors caused by relying solely on fixed injection time or volume. It is particularly suitable for continuous light panel structures with slight differences in installation height or the space to be covered along their length, improving the consistency of the sealing layer height across the entire light strip.

[0042] Negative pressure degassing is used to remove air bubbles trapped inside or at the interface of the injected sealing medium. Air is easily trapped during the flow, filling, and coating of the weld joints of the sealing medium. If bubbles remain near the weld area, they weaken the moisture-proof and insulating protective effects of the sealing medium. If bubbles are located near the light-emitting element or close to the light-receiving area of ​​the light-transmitting component, they may cause localized scattering, bright spots, or uneven light output. During negative pressure degassing, the dimming component with injected sealing medium is placed in an environment below atmospheric pressure, causing the bubbles to expand and escape from the sealing medium. The degassing pressure and time are controlled within a preset range, balancing sufficient degassing with structural stability, and preventing excessive negative pressure from causing the sealing medium to overflow or the liquid surface to collapse. This treatment improves the density and transparency uniformity of the cured sealing layer, thereby enhancing sealing reliability and reducing optical defects.

[0043] The curing process transforms the fluid sealing medium after defoaming into a stable sealing medium layer. The preset curing temperature and time need to match the characteristics of the sealing medium material to ensure full curing without excessive shrinkage, cracking, or internal stress. After curing, it should be confirmed that the upper surface of the sealing medium is still lower than the light path between the light-emitting element and the light-transmitting element, and that the outer periphery of the continuous lamp panel structure is reliably covered. At this point, the cured structure is no longer in a fluid state; in the actual instruction manual, this can be described as the cured sealing medium covering the outer periphery of the continuous lamp panel structure. This final confirmation ensures that the lamp strip blank provides fixation, insulation, and moisture protection for the continuous lamp panel structure without disrupting the polarized light path from the light-emitting element to the light-transmitting element.

[0044] Preferably, determining the target filling height of the fluid-like sealing medium based on the installation height of the continuous lamp panel structure at the bottom of the sealed cavity, the highest point height of the light-emitting element, and the light incident surface height of the light-transmitting element includes: Using the bottom bearing surface of the sealed cavity as a height reference surface, the installation height of the continuous lamp panel structure relative to the height reference surface is obtained, and the height of the upper surface of the continuous lamp panel structure is determined according to the thickness of the continuous lamp panel structure. Obtain the highest point height of the light-emitting element relative to the height reference plane, and the lowest point height of the light-incident surface of the light-transmitting element relative to the height reference plane; The sum of the upper surface height of the continuous lamp panel structure and the preset covering allowance is determined as the lower limit filling height. The lower limit filling height is used to make the fluid sealing medium cover the upper surface and welding area of ​​the continuous lamp panel structure. The first upper limit height is obtained by subtracting the first clearance allowance from the highest point height of the light-emitting element, and the second upper limit height is obtained by subtracting the second clearance allowance from the lowest point height of the light-incident surface of the light-transmitting element. The smaller value between the first upper limit height and the second upper limit height is determined as the upper limit filling height. When the lower limit filling height is not higher than the upper limit filling height, the height value between the lower limit filling height and the upper limit filling height is determined as the target filling height, so that the target filling height is higher than the upper surface of the continuous lamp panel structure and lower than the light emission path between the light-emitting element and the light-transmitting element.

[0045] Specifically, using the bottom bearing surface of the sealed cavity as the height reference surface is equivalent to establishing a unified measurement starting point for the continuous lamp panel structure, light-emitting elements, and light-transmitting components, avoiding inconsistencies in filling height judgment caused by differences in the placement angle of the dimming components, substrate thickness, or assembly position. For example, when the installation height of the bottom surface of the continuous lamp panel structure relative to the bottom bearing surface of the sealed cavity is 0.2mm, and the thickness of the continuous lamp panel structure is 0.3mm, its upper surface height can be determined to be 0.5mm. If the highest point height of the light-emitting element is 1.2mm, and the lowest point height of the light-incident surface of the light-transmitting component is 1.5mm, then the target filling height of the sealing medium cannot simply be determined by filling the sealed cavity based on experience, but must cover the continuous lamp panel structure while avoiding the light path space between the light-emitting elements and the light-transmitting component.

[0046] The lower limit fill height is used to ensure that the sealing medium effectively covers the upper surface and welding area of ​​the continuous lamp panel structure. The preset coverage allowance can be determined based on the weld height, substrate warpage, and sealing medium curing shrinkage. For example, if the upper surface height of the continuous lamp panel structure is 0.5mm, and the highest point of the weld is slightly higher than the upper surface, and the preset coverage allowance is set to 0.15mm, then the lower limit fill height can be determined to be 0.65mm. This ensures that the sealing medium covers the weld and substrate surface, preventing the welding area from being exposed and affecting insulation, moisture protection, and fixation. If this coverage allowance is not set, the sealing medium may only be flush with the substrate surface, making it difficult to fully protect the welding area. Subsequently, when the lamp strip is bent, exposed to moisture, or heated for a long time, problems such as weld oxidation, local loosening, or decreased electrical connection reliability may occur.

[0047] The upper limit filling height is used to prevent the sealing medium from entering the polarized light emission path. It is constrained by the height of the highest point of the light-emitting element and the height of the lowest point of the light-incident surface of the light-transmitting element. For example, if the height of the highest point of the light-emitting element is 1.2 mm and the first clearance allowance is set to 0.2 mm, then the first upper limit height is 1.0 mm; if the height of the lowest point of the light-incident surface of the light-transmitting element is 1.5 mm and the second clearance allowance is set to 0.3 mm, then the second upper limit height is 1.2 mm. In this case, the smaller value of 1.0 mm is taken as the upper limit filling height. With this control, even if there are slight liquid level fluctuations or solidification shrinkage changes in the sealing medium after injection, it is unlikely to come into contact with the light-emitting side of the light-emitting element or the light-incident surface of the light-transmitting element. This avoids the sealing medium forming additional refractive surfaces, scattering points, or blocking areas in the light path, ensuring that the light-transmitting element can polarize the emitted light in a predetermined manner.

[0048] When the lower limit filling height is not higher than the upper limit filling height, it indicates that there is a usable height range within the sealed cavity that satisfies both sealing coverage and light path avoidance. In this case, the target filling height can be selected within this range. Taking the above values ​​as an example, if the lower limit filling height is 0.65mm and the upper limit filling height is 1.0mm, the target filling height can be 0.75mm, 0.8mm, or other height values ​​within this range. If you want to save sealing medium and reduce the risk of over-adhesion, you can select a position closer to the lower limit. If you want to increase the coverage allowance for the welding area, you can select a position closer to the middle of the range. In this way, the sealing molding process no longer relies on the operator visually estimating the amount of adhesive. Instead, the filling height is determined based on the actual spatial relationship between the sealed cavity, the continuous lamp panel structure, the light-emitting element, and the light-transmitting element. This reduces problems such as insufficient coverage, over-adhesion shading, and unstable polarized light output, allowing the light strip to maintain a more consistent sealing state and anti-glare polarization effect along its length.

[0049] Preferably, the step of injecting the fluid-like sealing medium into the sealed cavity along the length direction of the continuous lamp panel structure at a preset injection speed and preset injection pressure, and ensuring that the volume of the fluid-like sealing medium injected per unit length matches the volume of the space to be covered on the outer periphery of the continuous lamp panel structure, includes: Calculate the cross-sectional area to be filled per unit length based on the cross-sectional area of ​​the sealed cavity below the target filling height and the cross-sectional area occupied by the continuous light panel structure below the target filling height; The amount of adhesive injected per unit time is determined based on the unit length of the cross-sectional area to be filled and the preset adhesive injection speed. According to the reference unit time injection volume, preset injection pressure and preset injection travel speed, the injection device is controlled to move along the length direction of the continuous light panel structure and inject the fluid sealing medium. During the injection process, the real-time liquid level of the fluid sealing medium is collected at a preset sampling interval, and the liquid level deviation value is calculated based on the real-time liquid level and the target filling height. When the liquid level deviation value is within the preset allowable deviation range, the injection is performed while maintaining the reference unit time injection volume, the preset injection pressure, and the preset injection travel speed; When the real-time liquid level is lower than the target filling height and the liquid level deviation exceeds the preset allowable deviation range, the first correction unit time injection amount is determined according to the liquid level deviation, and the injection device is controlled to continue injecting the fluid sealing medium according to the first correction unit time injection amount. When the real-time liquid level is higher than the target filling height and the liquid level deviation exceeds the preset allowable deviation range, the second corrected unit time injection amount is determined according to the liquid level deviation, and the injection device is controlled to continue injecting the fluid sealing medium according to the second corrected unit time injection amount. Wherein, the first corrected unit time injection volume is greater than the baseline unit time injection volume, and the second corrected unit time injection volume is less than the baseline unit time injection volume.

[0050] Specifically, the injection process of the sealing medium is controlled by the cross-sectional area to be filled per unit length and the benchmark injection volume per unit time. This ensures that the injection volume no longer relies solely on fixed time or manual experience, but rather matches the actual space that needs to be covered within the sealed cavity. The cross-sectional area to be filled per unit length can be understood as the fillable cross-sectional area within the sealed cavity that is below the target filling height and not occupied by the continuous lamp panel structure when the lamp strip extends by one unit length. Its calculation requires first determining the cross-sectional area of ​​the sealed cavity below the target filling height, then subtracting the cross-sectional area actually occupied by the continuous lamp panel structure below that height to obtain the effective space that the fluid-like sealing medium should fill. For example, if the cross-sectional area of ​​the sealed cavity below the target filling height is 12 mm², and the continuous lamp panel structure and its local protrusions occupy 4 mm² below that height, then the cross-sectional area to be filled per unit length is 8 mm². When the preset injection speed is 50 mm / s, the benchmark injection volume per unit time can be determined as 8 mm² × 50 mm / s, which is 400 mm³ / s. Using this calculation method, when the glue injection device moves along the length of the continuous lamp panel structure, the amount of sealing medium injected per unit time can correspond to the volume of the space to be covered, thereby reducing uneven coverage caused by local glue shortages or excessive glue.

[0051] During the actual injection process, the baseline injection volume per unit time, the preset injection pressure, and the preset injection travel speed jointly determine the speed, continuity, and filling stability of the sealing medium entering the sealed cavity. The injection device can move continuously along the length of the continuous lamp panel structure or in segments, completing the injection of the corresponding length segment after each preset length. To avoid liquid level deviations caused by fluctuations in the viscosity of the sealing medium, dimensional tolerances of the sealed cavity, local height differences in the continuous lamp panel structure, or changes in injection port pressure, it is necessary to collect real-time liquid level heights at preset sampling intervals during the injection process and compare them with the target filling height to obtain the liquid level deviation value. The preset sampling interval can be set according to the lamp strip length, injection speed, and detection accuracy. For example, the liquid level height can be collected every 10mm or 20mm; if the target filling height is 0.8mm and the real-time liquid level height is 0.76mm, the liquid level deviation value is 0.04mm. Through continuous collection and comparison, it is possible to promptly detect whether the liquid level of the sealing medium in a certain length segment deviates from the target height, avoiding the discovery of inconsistent coverage heights only after the entire lamp strip has cured.

[0052] When the liquid level deviation is within the preset allowable deviation range, it indicates that the current amount of adhesive injected is basically matched with the space to be covered. Injection can continue using the baseline unit time injection volume, preset injection pressure, and preset injection travel speed to maintain process continuity and stability. If the real-time liquid level is lower than the target filling height and the deviation exceeds the allowable range, it indicates insufficient sealing medium at the corresponding location, which may lead to inadequate coverage of the welding area, side area, or bottom area. In this case, a first corrected unit time injection volume is determined based on the liquid level deviation, and this first corrected unit time injection volume is greater than the baseline unit time injection volume, so that subsequent injection volumes can compensate for the insufficient filling volume in this section. If the real-time liquid level is higher than the target filling height and the deviation exceeds the allowable range, it indicates a risk of over-insertion at the corresponding location. The sealing medium may approach or even enter the light emission path between the light-emitting element and the light-transmitting element. Therefore, a second corrected unit time injection volume, less than the baseline unit time injection volume, is determined based on the liquid level deviation to limit the subsequent injection volume. By using this correction control based on liquid level deviation, a more uniform coating layer can be formed along the length of the light strip. This ensures that the outer periphery of the continuous light panel structure is fully sealed and reduces the risk of the sealing medium blocking the polarized light path, thereby improving the structural stability of the light strip blank with dimming components and the consistency of anti-glare polarized light output.

[0053] Specifically, by combining the control of the adhesive layer height and the adhesive injection process during sealing molding, the filling of the fluid sealing medium no longer relies on manual experience or a fixed amount of adhesive. Instead, the target filling height is first determined based on the actual height relationship between the continuous lamp panel structure, the light-emitting element, and the light-transmitting element. Then, the amount of adhesive is calculated based on the fillable space below the target filling height, and the adhesive injection process is corrected through real-time liquid level feedback. This ensures that the sealing medium fully covers the upper surface, welding area, and outer peripheral gap of the continuous lamp panel structure, improving the insulation, moisture protection, and fixation of the lamp panel within the dimming element. It also prevents the sealing medium from being filled too high and entering the light emission path between the light-emitting element and the light-transmitting element, reducing problems such as light blocking, scattering, and polarization angle deviation. As a result, the sealing layer is more likely to form a structure with consistent height, sufficient coverage, and no interference with the light path along the length of the lamp strip.

[0054] Preferably, the length processing and end-sealing processing of the LED strip blank to form a sealed connection structure at its ends, resulting in a semi-finished LED strip, includes: Obtain the target length information of the LED strip blank, and determine the target cutting position of the LED strip blank based on the target length information and the preset cutting position in the continuous LED panel structure; According to the target cutting position, the LED strip blank is cut to form an LED strip body with a target length, wherein the target cutting position is located in the non-light-emitting area between two adjacent light-emitting elements; An end-capsulation component is assembled at least one end of the cut LED strip body, such that the end-capsulation component covers the continuous lamp panel structure and the housing end of the LED strip body, and avoids the light-emitting area of ​​the anti-glare layer. An end sealing medium is filled into the gap between the end package and the end of the light strip body, and the end sealing medium is cured to form a sealed connection structure between the end package and the end of the light strip body. The sealing integrity of the sealing connection structure is tested, and the semi-finished light strip is obtained when the sealing connection structure meets the preset end sealing conditions.

[0055] Specifically, the target length information typically corresponds to the required length of the finished LED strip, derived from order specifications, product model, or installation scenario requirements. The preset cutting position is a pre-defined cuttable area in the continuous LED panel structure design, generally located between two adjacent light-emitting elements, avoiding light-emitting elements, welding areas, conductive connections, and main light-emitting areas. When determining the target cutting position, it is not advisable to cut directly according to the target length. Instead, the target length information should first be matched with the preset cutting position in the continuous LED panel structure so that the final cutting point falls within the non-light-emitting area where cutting is permitted. For example, when multiple adjacent cutting marks exist near the target length position, the cutting mark closest to the target length that will not disrupt the continuity of the circuit can be selected as the target cutting position. This avoids the cutting tool damaging the light-emitting elements or cutting unintended circuits, while ensuring that the cut LED strip still has a complete electrical connection and a continuous light-emitting foundation.

[0056] The cutting process requires creating a flat and regular end face on the LED strip blank at the target cutting position to facilitate the subsequent mating of the end-capsule with the end of the LED strip body. Since the LED strip blank already includes a continuous LED panel structure, dimming components, housing, and anti-glare layer, the integrity of both the internal circuitry and external optical structures must be considered during cutting. It is preferable to use a cutter, punching die, or fixed-length cutting equipment that is compatible with the LED strip cross-section, and to limit the LED strip blank during the cutting process to prevent stretching of the flexible substrate, deformation of the housing, or displacement of the anti-glare layer. The target cutting position is located in the non-light-emitting area between two adjacent light-emitting elements. This ensures that the cutting end does not directly damage the mounting position of the light-emitting elements and does not create abnormal bright spots or obvious dark areas at the end, thus guaranteeing good light output continuity of the LED strip body within the target length range after cutting.

[0057] End-mount packages are used to seal the exposed ends of the LED strip body after cutting. Their structure can be adapted to the shape of the housing end, the position of the continuous LED panel structure, and the end wire connection area. During assembly, the end-mount package needs to cover the continuous LED panel structure and the housing end of the LED strip body, ensuring that the flexible substrate, pads, conductive connection areas, and housing openings at the cut end are covered or shielded, reducing the possibility of moisture, dust, and external forces entering the LED strip. Simultaneously, the end-mount package should avoid the light-emitting area of ​​the anti-glare layer, preventing it from obstructing the surface of the anti-glare layer or altering the light path on the light-emitting side. For structures requiring wire soldering at the ends, the wires can be connected to the end pads of the continuous LED panel structure first, then the end-mount package can cover the connection area, with provisions for wire exit, to balance power supply connection and end sealing.

[0058] The end sealing medium is used to fill any gaps that may exist between the end package and the end of the LED strip body. Its function is to combine the end package, the outer shell end face, the end of the continuous lamp panel structure, and the necessary wire penetration areas into a unified sealed structure. During filling, the end sealing medium must fully enter the end gaps, the perimeter of the cut section, and around the wire roots, without any voids, breaks in the adhesive, or local detachment. At the same time, the filling amount should be controlled to prevent the end sealing medium from overflowing into the light-emitting area of ​​the anti-glare layer or contaminating the light-transmitting component or the surface of the anti-glare layer. Curing can be performed at room temperature, by heating, or by light curing, depending on the material properties of the end sealing medium, to form a stable elastic or hard seal. After this treatment, the end package and the end of the LED strip body are no longer just mechanically fitted, but form a continuous sealed connection structure through the sealing medium, which helps improve the end's moisture resistance, dust resistance, tensile strength, and resistance to loosening.

[0059] Sealing integrity testing is used to confirm whether the end-sealing process meets the preset end-sealing conditions, preventing products with defects such as end gaps, insufficient curing of the sealing medium, misalignment of the end-sealing components, or incomplete sealing at the root of the wires from entering subsequent finished product testing. During testing, visual inspection, end-press inspection, airtight or watertight sampling inspection, and wire tensile testing can be combined to determine whether the sealing connection structure is continuous, firm, and free of obvious defects. For anti-glare polarized optical light strips, it is also necessary to observe whether the end-sealing components intrude into the light-emitting area of ​​the anti-glare layer to avoid light blocking or abnormal glare at the end. Only when the sealing connection structure meets the preset end-sealing conditions can the cut light strip body be used as a semi-finished product for subsequent power-on testing, aging treatment, and optical testing.

[0060] Preferably, the post-processing of the semi-finished light strip and the output of the finished light strip when the semi-finished light strip meets the preset electrical performance conditions and anti-glare light emission conditions includes: The LED strip semi-finished product is connected to a preset detection voltage to perform an initial power-on test on the LED strip semi-finished product, and the input current, input terminal voltage and voltage drop value of each detection segment of the LED strip semi-finished product are collected. When the input current is within a preset input current range, the input terminal voltage is within a preset input voltage range, and the voltage drop value of each detection segment is within a preset voltage drop range, the LED strip semi-finished product is determined as an LED strip to be aged. The light strip to be aged is subjected to aging treatment according to the preset aging voltage, preset aging time, and preset number of on / off cycles, and the working current and surface temperature of the light strip to be aged are collected during the aging treatment process. After the aging process is completed, the LED strip to be aged is powered on again for testing to obtain the input current and voltage drop values ​​of each detection segment after aging. If the input current after aging is within the preset input current range, the voltage drop values ​​of each detection segment after aging are within the preset voltage drop range, and the working current and the surface temperature do not exceed the corresponding preset aging monitoring range during the aging process, the LED strip semi-finished product is determined to meet the preset electrical performance conditions. The semi-finished LED strip that meets the preset electrical performance conditions is fixed at the optical detection position, and the anti-glare layer is oriented towards the optical acquisition device. Light up the semi-finished light strip and collect the main light emission angle, the brightness value at the preset observation angle, and the illuminance value at different detection points on the light emission surface after the light is emitted through the light-transmitting component and the anti-glare layer; When the main light emission angle is within the preset polarization angle range, and the brightness value at the preset observation angle is not greater than the preset anti-glare brightness threshold, and the illuminance uniformity determined according to the illuminance values ​​at different detection points on the light emission surface meets the preset uniformity condition, the semi-finished light strip is determined to meet the anti-glare light emission condition, and the finished light strip is output.

[0061] Specifically, the voltage is usually set according to the design operating voltage or test standard of the LED strip. The input current reflects whether the load of the entire LED strip semi-finished product matches the design value. The input voltage is used to confirm whether the actual load on the power supply is stable. The voltage drop value of each test section is used to determine whether there is excessive local resistance, poor solder joint contact, or abnormal connection area along the length of the LED strip. In actual testing, the input terminal of the LED strip semi-finished product can be connected to the test power supply, and test points can be arranged in sections according to the preset length or preset circuit. The voltage difference between the two ends of each test section can be collected. If the voltage drop of a certain test section is significantly larger, it usually indicates that there may be poor contact in that section of the line, splicing position, or welding area. If the voltage drop is significantly smaller, there may be a local short circuit or the light-emitting element is not properly connected. By collecting these parameters before aging, semi-finished products with obvious electrical abnormalities can be eliminated in advance, avoiding invalid tests in subsequent aging and optical testing stages.

[0062] Comparing the input current, input terminal voltage, and voltage drop values ​​of each detection segment with preset ranges establishes clear screening criteria for aging. The preset input current range can be determined based on the strip length, number of light-emitting elements, and rated power. The preset input voltage range ensures that there is no undervoltage or overvoltage at the power supply terminal during testing, while the preset voltage drop range ensures that the power supply distribution of each detection segment remains consistent. Only when all the above parameters fall within their corresponding ranges can the strip semi-finished product be considered to have the basic conditions for aging treatment in its initial state. This screening process prevents defects such as open circuits, short circuits, weak connections, and abnormal local voltage drops from being masked by the subsequent aging process, while also reducing the amount of defective semi-finished products occupying the aging equipment, improving testing efficiency and finished product yield.

[0063] The aging process simulates the continuous power-on, heat accumulation, and repeated start-stop conditions of the LED strip in actual use. The preset aging voltage, preset aging time, and preset number of on / off cycles can be set according to product specifications and reliability requirements. During the aging process, the LED strip is continuously or intermittently lit. The operating current reflects the load change of the light-emitting circuit after thermal stabilization, and the surface temperature is used to determine whether the heat dissipation between the light-emitting element, sealing medium, dimming component, and housing is normal.

[0064] For example, during the on / off cycle, if the operating current of a certain LED strip gradually increases abnormally, it may indicate a local short circuit or component deterioration. If the surface temperature exceeds the preset monitoring range, it may indicate poor heat dissipation of the light-emitting element, abnormal sealing medium coverage, or overheating risk in the internal electrical connections. By simultaneously collecting the operating current and surface temperature during the aging process, early failures that are not easily detected in the initial inspection can be exposed in advance, improving the long-term reliability of the finished LED strip. The re-power-on test after aging is used to confirm whether the electrical performance of the semi-finished LED strip remains stable after experiencing thermal load and on / off cycles. If the input current and voltage drop values ​​of each detection segment after aging are still within the corresponding preset range, it indicates that the overall load and segmented power supply status of the LED strip have not deteriorated significantly due to the aging process. At the same time, if the operating current and surface temperature do not exceed the preset aging monitoring range during the aging process, it indicates that the LED strip has not experienced abnormal heating, contact deterioration, or component failure under continuous operation and cyclic start-stop conditions. By combining two power-on tests with aging process monitoring, the electrical stability of the LED strip semi-finished product can be evaluated from three perspectives: initial state, working process, and post-aging state. This avoids simply relying on a single successful lighting test to produce a finished product, thereby improving the safety and reliability of the product in actual use.

[0065] The optical detection position provides a fixed spatial reference for anti-glare emission testing, allowing comparisons of different LED strip semi-finished products at the same distance, angle, and installation posture. After fixing the LED strip semi-finished product that meets electrical performance requirements, aligning the anti-glare layer with the optical acquisition device ensures that the collected light is the actual working light after polarization adjustment by the light-transmitting element and emission through the anti-glare layer, rather than side leakage light or stray light without anti-glare treatment. The fixing method can employ clamps or positioning grooves adapted to the LED strip housing, preventing twisting, warping, or positional shift of the LED strip during testing. This process reduces detection errors, making subsequent judgments of the main emission angle, brightness value, and illuminance uniformity more accurately reflect the true polarization and anti-glare performance of the LED strip.

[0066] Collecting the brightness values ​​at the main light emission angle, the preset observation angle, and the illuminance values ​​at different detection points on the light-emitting surface after illuminating the semi-finished light strip is crucial for quantitatively evaluating the anti-glare light emission conditions. The main light emission angle reflects the main direction of light emission after passing through the light-transmitting component and the anti-glare layer, and is used to determine whether the polarization adjustment meets expectations. The brightness value at the preset observation angle can be measured by selecting observation directions that are prone to direct glare, and is used to evaluate whether there is excessively strong glare in that direction. The illuminance values ​​at different detection points reflect the light distribution on the light surface or the illuminated surface, and can be used to calculate the illuminance uniformity.

[0067] For example, if the main light emission angle deviates from the preset polarization angle range, it may indicate that the corresponding positions of the light-emitting element and the light-transmitting element are unstable; if the brightness value is too high at the preset viewing angle, it may indicate that the anti-glare layer is not assembled evenly or the honeycomb anti-glare structure does not effectively block high-angle light; if the illuminance uniformity is insufficient, it may be related to the splicing pitch of the continuous light panel, the obstruction of the sealing medium, or the local optical path offset. Through these optical parameters, the anti-glare effect can be transformed from subjective observation into detectable light emission conditions. When finally outputting the finished light strip, the brightness value and illuminance uniformity at the main light emission angle, preset viewing angle, and preset polarization angle must meet the corresponding conditions to ensure that the light strip can not only light up normally and work stably, but also has the required polarization anti-glare light emission performance. The preset polarization angle range is used to ensure that the light is emitted in the designed direction, the preset anti-glare brightness threshold is used to limit the brightness in the viewing direction that is prone to causing glare, and the preset uniformity condition is used to control the brightness distribution of the light emission surface. Only when all these conditions are met simultaneously can the semi-finished light strip be determined to meet the anti-glare light emission conditions and output as a finished light strip. This judgment method can effectively solve the problem that traditional LED strip factory inspection only focuses on electrical qualification and ignores anti-glare optical effect, so that finished product screening covers electrical reliability and anti-glare polarization consistency at the same time, thereby improving the visual comfort, light output stability and batch consistency of the final product.

[0068] Example 2 Please see Figure 3This invention provides an apparatus for manufacturing an anti-glare polarized optical light strip, applicable to anti-glare polarized optical light strips. The anti-glare polarized optical light strip includes a flexible substrate, a light-emitting element disposed on the flexible substrate, a dimming component for adjusting the polarization of the light emitted from the light-emitting element, a housing for accommodating the dimming component, and an anti-glare layer disposed on the light-emitting side of the housing. The dimming component includes a light-shielding component and a light-transmitting component, the light-shielding component and the light-transmitting component forming a sealed cavity for accommodating the light-emitting element. The housing has an internal cavity, and the inner sidewall of the housing is provided with an abutment portion, a first latching portion and a second latching portion along the height direction. The apparatus includes: The light-emitting circuit substrate fabrication module is used to perform solder deposition and light-emitting element mounting on a flexible substrate, and to form a light-emitting circuit substrate by reflow soldering. The panel module is used to perform electrical performance testing on the light-emitting circuit board, and when the preset testing conditions are met, to connect at least two sections of the light-emitting circuit board along the length direction to form a continuous lamp board structure. A dimming assembly module is used to install the continuous lamp panel structure into the sealed cavity of the dimming component, so that the light-emitting element is located at the bottom of the light-shielding component and the light-transmitting component is located on the light-emitting direction side of the light-emitting element. A sealing molding module is used to perform sealing molding on the continuous lamp panel structure installed in the dimming component, so that the fluid sealing medium covers the outer periphery of the continuous lamp panel structure and solidifies to form a lamp strip blank with a dimming component. The housing anti-glare assembly module is used to install the light strip blank with the dimming element into the internal cavity of the housing, so that the bottom of the dimming element abuts against the abutting part, and the fixing part of the outer wall of the dimming element is engaged with the first snap-fit ​​part, and the anti-glare layer is installed on the light emission direction side of the housing, so that the edge of the anti-glare layer is engaged with the second snap-fit ​​part; The cutting and packaging module is used to process the length of the LED strip blank and to package the ends, forming a sealed connection structure at the ends to obtain a semi-finished LED strip. The post-processing and testing module is used to perform post-processing on the semi-finished light strip and output the finished light strip when the semi-finished light strip meets the preset electrical performance conditions and anti-glare light emission conditions. The post-processing includes power-on testing, aging treatment and optical testing.

[0069] It should be noted that each module and unit in the apparatus for preparing the anti-glare polarized optical light strip in this embodiment corresponds one-to-one with each step in the method for preparing the anti-glare polarized optical light strip in the aforementioned embodiment. Therefore, the specific implementation of this embodiment can refer to the implementation of the aforementioned method for preparing the anti-glare polarized optical light strip, and will not be repeated here.

[0070] Example 3 In addition, combined Figure 1 The method for preparing the anti-glare polarized optical light strip described in this embodiment of the invention can be implemented by an electronic device. Figure 4 A schematic diagram of the hardware structure of an electronic device provided in an embodiment of the present invention is shown.

[0071] Electronic devices may include processors and memory storing computer program instructions.

[0072] Specifically, the processor may include a central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more integrated circuits that can be configured to implement embodiments of the present invention.

[0073] Memory may include non-persistent memory in computer-readable media, such as random access memory (RAM) and / or non-volatile memory, such as read-only memory (ROM) or flash RAM. Memory is an example of computer-readable media.

[0074] Computer-readable media include both permanent and non-permanent, removable and non-removable media, which can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transferable medium that can be used to store information accessible by a computing device. As defined herein, computer-readable media does not include transient media, such as modulated communication signals and carrier waves.

[0075] The processor reads and executes computer program instructions stored in the memory to implement any of the methods for preparing anti-glare polarized optical light strips in the above embodiments.

[0076] In one example, the electronic device may also include a communication interface and a bus. For example, Figure 4 As shown, the processor 401, memory 402, and communication interface 403 are connected through bus 410 and complete communication with each other.

[0077] The communication interface is mainly used to enable communication between various modules, devices, units and / or equipment in the embodiments of the present invention.

[0078] A bus, including hardware, software, or both, couples components of an electronic device together. For example, and not limitingly, a bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Enhanced Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), HyperTransport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an Infinite Bandwidth Interconnect, a Low Pin Count (LPC) bus, a memory bus, a Microchannel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable buses, or combinations of two or more of these. Where appropriate, a bus may include one or more buses. While specific buses are described and illustrated in embodiments of the invention, the invention contemplates any suitable bus or interconnect.

[0079] In summary, the embodiments of the present invention provide a method, apparatus, and equipment for preparing an anti-glare polarized optical light strip.

[0080] It should be clarified that the present invention is not limited to the specific configurations and processes described above and shown in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown. Those skilled in the art can make various changes, modifications, and additions, or change the order of steps, after understanding the spirit of the present invention.

[0081] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0082] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0083] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0084] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0085] It should also be noted that the exemplary embodiments mentioned in this invention describe methods or systems based on a series of steps or apparatus. However, this invention is not limited to the order of the steps described above; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

[0086] The above description is merely a specific embodiment of the present invention. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the protection scope of the present invention.

Claims

1. A method for preparing an anti-glare polarized optical light strip, applied to an anti-glare polarized optical light strip, the anti-glare polarized optical light strip comprising a flexible substrate, a light-emitting element disposed on the flexible substrate, a dimming component for adjusting the polarization of the light emitted from the light-emitting element, a housing for accommodating the dimming component, and an anti-glare layer disposed on the light-emitting side of the housing, the dimming component comprising a light-shielding component and a light-transmitting component, the light-shielding component and the light-transmitting component forming a sealed cavity for accommodating the light-emitting element, the housing having an internal cavity, and the inner sidewall of the housing having an abutment portion, a first latching portion and a second latching portion along the height direction, characterized in that... The method includes: Solder deposition and light-emitting element mounting are performed on a flexible substrate, and a light-emitting circuit substrate is formed by reflow soldering. The light-emitting circuit board is subjected to electrical performance testing, and when the preset testing conditions are met, at least two sections of the light-emitting circuit board are connected along the length direction to form a continuous lamp board structure. The continuous lamp panel structure is installed into the sealed cavity of the dimming component, so that the light-emitting element is located at the bottom of the light-shielding component, and the light-transmitting component is located on the side of the light-emitting element in the light-emitting direction. The continuous lamp panel structure installed in the dimming element is sealed and molded, so that the fluid sealing medium covers the outer periphery of the continuous lamp panel structure and is cured to form a lamp strip blank with dimming element. The lamp strip blank with the dimming element is inserted into the inner cavity of the housing, so that the bottom of the dimming element abuts against the abutting part, and the fixing part of the outer wall of the dimming element is engaged with the first snap-fit ​​part. The anti-glare layer is installed on the light-emitting direction side of the housing, so that the edge of the anti-glare layer is engaged with the second snap-fit ​​part. The LED strip blank is lengthened and end-sealed to form a sealed connection structure at the end, thus obtaining a semi-finished LED strip. The semi-finished light strip is post-processed, and the finished light strip is output when the semi-finished light strip meets the preset electrical performance conditions and anti-glare light emission conditions. The post-processing includes power-on detection, aging treatment and optical detection.

2. The method for preparing the anti-glare polarized optical light strip according to claim 1, characterized in that, The process of depositing solder and mounting light-emitting elements on a flexible substrate, followed by reflow soldering to form a light-emitting circuit substrate, includes: The flexible substrate is surface cleaned and positioned to obtain multiple pad areas on the flexible substrate. Based on the width of the sealed cavity of the dimming component and the light-incident area of ​​the light-transmitting component, the mounting position of the light-emitting element is determined in the pad area, so that the light-emitting center of the light-emitting element corresponds to the light-incident area of ​​the light-transmitting component. Solder is deposited on the pad area, and the position and amount of solder after deposition are detected. When the solder position and the amount of solder meet the preset solder deposition conditions, the light-emitting element is mounted on the corresponding pad area according to the mounting position. Position detection is performed on the mounted light-emitting element. When the mounting offset of the light-emitting element relative to the pad area meets the preset mounting offset condition, the flexible substrate with the mounted light-emitting element is reflow soldered to form the light-emitting circuit substrate.

3. The method for preparing the anti-glare polarized optical light strip according to claim 1, characterized in that, The step of performing electrical performance testing on the light-emitting circuit substrate, and connecting at least two segments of the light-emitting circuit substrate along the length direction to form a continuous lamp board structure when preset testing conditions are met, includes: Connect the positive and negative terminals of the preset detection power supply to the positive and negative input pads of the light-emitting circuit board, respectively, and apply a preset test voltage to the light-emitting circuit board. The total operating current of the light-emitting circuit board under the preset test voltage, and the operating voltage across each of the light-emitting elements are collected. When the total operating current is within a preset total current range and the operating voltages at both ends of each light-emitting element are within a preset element voltage range, the corresponding light-emitting circuit board is determined as the board to be connected. Obtain the input positive pad, input negative pad, output positive pad, and output negative pad at the end of each substrate to be connected, and obtain the end distance from the center of the light-emitting element at the end of each substrate to be connected to the corresponding end connection pad; Based on the correspondence between the output positive pad and the input positive pad, and the output negative pad and the input negative pad of the two adjacent segments of the substrate to be connected, and the end spacing of the two adjacent segments of the substrate to be connected, the two adjacent segments of the substrate to be connected are joined end-to-end along the length direction, so that the distance between the centers of adjacent light-emitting elements on both sides of the joining position is within the preset light-emitting pitch range. Conductive connection is performed on the corresponding connection pads of the two adjacent segments of the substrate to be connected after the end docking. When the total working current after connection is within the preset total current range and the working voltages at both ends of the light-emitting elements on both sides of the connection are within the preset element voltage range, the continuous lamp board structure is formed.

4. The method for preparing the anti-glare polarized optical light strip according to claim 1, characterized in that, The sealing and molding process of the continuous lamp panel structure installed in the dimming element, in which a fluid sealing medium covers the outer periphery of the continuous lamp panel structure and solidifies to form a lamp strip blank with a dimming element, includes: The viscosity of the fluid sealing medium is adjusted to a preset injection viscosity range, and the temperature of the fluid sealing medium is adjusted to a preset injection temperature range; Based on the installation height of the continuous lamp panel structure at the bottom of the sealed cavity, the highest point height of the light-emitting element, and the light incident surface height of the light-transmitting element, the target filling height of the fluid-like sealing medium is determined, wherein the target filling height is higher than the upper surface of the continuous lamp panel structure and lower than the light exit path between the light-emitting element and the light-transmitting element. Along the length of the continuous light panel structure, the fluid sealing medium is injected into the sealed cavity at a preset injection speed and a preset injection pressure, and the volume of the fluid sealing medium injected per unit length is matched with the volume of the space to be covered on the outer periphery of the continuous light panel structure. During the injection process, the real-time liquid level of the fluid sealing medium is detected. When the real-time liquid level reaches the target filling height, the injection at the corresponding position is stopped, so that the fluid sealing medium covers the welding area, side area and bottom area of ​​the continuous lamp panel structure. The injected fluid sealing medium is subjected to negative pressure defoaming treatment, wherein the pressure and time of the negative pressure defoaming treatment are within a preset defoaming pressure range and a preset defoaming time range, respectively. The fluid sealing medium after degassing is cured according to the preset curing temperature and preset curing time. When the upper surface of the cured sealing medium is lower than the light emission path between the light-emitting element and the light-transmitting element, and the fluid sealing medium covers the outer periphery of the continuous lamp panel structure, the lamp strip blank with dimming element is formed.

5. The method for preparing the anti-glare polarized optical light strip according to claim 4, characterized in that, The step of determining the target filling height of the fluid-like sealing medium based on the installation height of the continuous lamp panel structure at the bottom of the sealed cavity, the highest point height of the light-emitting element, and the light incident surface height of the light-transmitting element includes: Using the bottom bearing surface of the sealed cavity as a height reference surface, the installation height of the continuous lamp panel structure relative to the height reference surface is obtained, and the height of the upper surface of the continuous lamp panel structure is determined according to the thickness of the continuous lamp panel structure. Obtain the highest point height of the light-emitting element relative to the height reference plane, and the lowest point height of the light-incident surface of the light-transmitting element relative to the height reference plane; The sum of the upper surface height of the continuous lamp panel structure and the preset covering allowance is determined as the lower limit filling height. The lower limit filling height is used to make the fluid sealing medium cover the upper surface and welding area of ​​the continuous lamp panel structure. The first upper limit height is obtained by subtracting the first clearance allowance from the highest point height of the light-emitting element, and the second upper limit height is obtained by subtracting the second clearance allowance from the lowest point height of the light-incident surface of the light-transmitting element. The smaller value between the first upper limit height and the second upper limit height is determined as the upper limit filling height. When the lower limit filling height is not higher than the upper limit filling height, the height value between the lower limit filling height and the upper limit filling height is determined as the target filling height, so that the target filling height is higher than the upper surface of the continuous lamp panel structure and lower than the light emission path between the light-emitting element and the light-transmitting element.

6. The method for preparing the anti-glare polarized optical light strip according to claim 5, characterized in that, The step of injecting the fluid-like sealing medium into the sealed cavity along the length of the continuous lamp panel structure at a preset injection speed and preset injection pressure, and ensuring that the volume of the fluid-like sealing medium injected per unit length matches the volume of the space to be covered on the outer periphery of the continuous lamp panel structure, includes: Calculate the cross-sectional area to be filled per unit length based on the cross-sectional area of ​​the sealed cavity below the target filling height and the cross-sectional area occupied by the continuous light panel structure below the target filling height; The amount of adhesive injected per unit time is determined based on the unit length of the cross-sectional area to be filled and the preset adhesive injection speed. According to the reference unit time injection volume, preset injection pressure and preset injection travel speed, the injection device is controlled to move along the length direction of the continuous light panel structure and inject the fluid sealing medium. During the injection process, the real-time liquid level of the fluid sealing medium is collected at a preset sampling interval, and the liquid level deviation value is calculated based on the real-time liquid level and the target filling height. When the liquid level deviation value is within the preset allowable deviation range, the injection is performed while maintaining the reference unit time injection volume, the preset injection pressure, and the preset injection travel speed; When the real-time liquid level is lower than the target filling height and the liquid level deviation exceeds the preset allowable deviation range, the first correction unit time injection amount is determined according to the liquid level deviation, and the injection device is controlled to continue injecting the fluid sealing medium according to the first correction unit time injection amount. When the real-time liquid level is higher than the target filling height and the liquid level deviation exceeds the preset allowable deviation range, the second corrected unit time injection amount is determined according to the liquid level deviation, and the injection device is controlled to continue injecting the fluid sealing medium according to the second corrected unit time injection amount. Wherein, the first corrected unit time injection volume is greater than the baseline unit time injection volume, and the second corrected unit time injection volume is less than the baseline unit time injection volume.

7. The method for preparing the anti-glare polarized optical light strip according to claim 1, characterized in that, The process of lengthening and end-sealing the LED strip blank to form a sealed connection structure at its ends, resulting in a semi-finished LED strip, includes: Obtain the target length information of the LED strip blank, and determine the target cutting position of the LED strip blank based on the target length information and the preset cutting position in the continuous LED panel structure; According to the target cutting position, the LED strip blank is cut to form an LED strip body with a target length, wherein the target cutting position is located in the non-light-emitting area between two adjacent light-emitting elements; An end-capsulation component is assembled at least one end of the cut LED strip body, such that the end-capsulation component covers the continuous lamp panel structure and the housing end of the LED strip body, and avoids the light-emitting area of ​​the anti-glare layer. An end sealing medium is filled into the gap between the end package and the end of the light strip body, and the end sealing medium is cured to form a sealed connection structure between the end package and the end of the light strip body. The sealing integrity of the sealing connection structure is tested, and the semi-finished light strip is obtained when the sealing connection structure meets the preset end sealing conditions.

8. The method for preparing the anti-glare polarized optical light strip according to any one of claims 1-7, characterized in that, The post-processing of the semi-finished light strip, and the output of the finished light strip when the semi-finished light strip meets the preset electrical performance conditions and anti-glare light emission conditions, includes: The LED strip semi-finished product is connected to a preset detection voltage to perform an initial power-on test on the LED strip semi-finished product, and the input current, input terminal voltage and voltage drop value of each detection segment of the LED strip semi-finished product are collected. When the input current is within a preset input current range, the input terminal voltage is within a preset input voltage range, and the voltage drop value of each detection segment is within a preset voltage drop range, the LED strip semi-finished product is determined as an LED strip to be aged. The light strip to be aged is subjected to aging treatment according to the preset aging voltage, preset aging time, and preset number of on / off cycles, and the working current and surface temperature of the light strip to be aged are collected during the aging treatment process. After the aging process is completed, the LED strip to be aged is powered on again for testing to obtain the input current and voltage drop values ​​of each detection segment after aging. If the input current after aging is within the preset input current range, the voltage drop values ​​of each detection segment after aging are within the preset voltage drop range, and the working current and the surface temperature do not exceed the corresponding preset aging monitoring range during the aging process, the LED strip semi-finished product is determined to meet the preset electrical performance conditions. The semi-finished LED strip that meets the preset electrical performance conditions is fixed at the optical detection position, and the anti-glare layer is oriented towards the optical acquisition device. Light up the semi-finished light strip and collect the main light emission angle, the brightness value at the preset observation angle, and the illuminance value at different detection points on the light emission surface after the light is emitted through the light-transmitting component and the anti-glare layer; When the main light emission angle is within the preset polarization angle range, and the brightness value at the preset observation angle is not greater than the preset anti-glare brightness threshold, and the illuminance uniformity determined according to the illuminance values ​​at different detection points on the light emission surface meets the preset uniformity condition, the semi-finished light strip is determined to meet the anti-glare light emission condition, and the finished light strip is output.

9. An apparatus for manufacturing an anti-glare polarized optical light strip, applied to an anti-glare polarized optical light strip, the anti-glare polarized optical light strip comprising a flexible substrate, a light-emitting element disposed on the flexible substrate, a dimming component for adjusting the polarization of the light emitted from the light-emitting element, a housing for accommodating the dimming component, and an anti-glare layer disposed on the light-emitting side of the housing, the dimming component comprising a light-shielding component and a light-transmitting component, the light-shielding component and the light-transmitting component forming a sealed cavity for accommodating the light-emitting element, the housing having an internal cavity, and the inner sidewall of the housing having an abutment portion, a first latching portion and a second latching portion along the height direction, characterized in that... The device includes: The light-emitting circuit substrate fabrication module is used to perform solder deposition and light-emitting element mounting on a flexible substrate, and to form a light-emitting circuit substrate by reflow soldering. The panel module is used to perform electrical performance testing on the light-emitting circuit board, and when the preset testing conditions are met, to connect at least two sections of the light-emitting circuit board along the length direction to form a continuous lamp board structure. A dimming assembly module is used to install the continuous lamp panel structure into the sealed cavity of the dimming component, so that the light-emitting element is located at the bottom of the light-shielding component and the light-transmitting component is located on the light-emitting direction side of the light-emitting element. A sealing molding module is used to perform sealing molding on the continuous lamp panel structure installed in the dimming component, so that the fluid sealing medium covers the outer periphery of the continuous lamp panel structure and solidifies to form a lamp strip blank with a dimming component. The housing anti-glare assembly module is used to install the light strip blank with the dimming element into the internal cavity of the housing, so that the bottom of the dimming element abuts against the abutting part, and the fixing part of the outer wall of the dimming element is engaged with the first snap-fit ​​part, and the anti-glare layer is installed on the light emission direction side of the housing, so that the edge of the anti-glare layer is engaged with the second snap-fit ​​part; The cutting and packaging module is used to process the length of the LED strip blank and to package the ends, forming a sealed connection structure at the ends to obtain a semi-finished LED strip. The post-processing and testing module is used to perform post-processing on the semi-finished light strip and output the finished light strip when the semi-finished light strip meets the preset electrical performance conditions and anti-glare light emission conditions. The post-processing includes power-on testing, aging treatment and optical testing.

10. An electronic device, characterized in that, include: At least one processor, at least one memory, and computer program instructions stored in the memory, which, when executed by the processor, implement the method as described in any one of claims 1-8.

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