Antenna device

Abstract

This disclosure provides an antenna device, comprising: a first metal layer having a main radiator, a collecting portion, and a first transmitting portion, the collecting portion being connected to the first transmitting portion; a first dielectric layer; a second metal layer; an adhesive layer; a third metal layer disposed at the bottom of the adhesive layer, the third metal layer having a loss portion; and a waveguide portion having a first surface electromagnetic wave transmission cavity formed between the first and second metal layers, and a second surface electromagnetic wave transmission cavity formed between the second and third metal layers; the first transmitting portion transmitting surface electromagnetic waves to the waveguide portion; the first surface electromagnetic wave transmission cavity transmitting surface electromagnetic waves to the second surface electromagnetic wave transmission cavity; and the second surface electromagnetic wave transmission cavity transmitting surface electromagnetic waves to the loss portion, thereby eliminating surface electromagnetic waves through the loss portion. According to the technical solution of this disclosure, the problems of bandwidth expansion and integration difficulty in the prior art can be solved, and a high-performance antenna device is provided.

Description

Technical Field

[0001] This disclosure relates to the field of wireless communication technology, and more particularly to an antenna device. Background Technology

[0002] Surface electromagnetic waves from an antenna are electromagnetic waves that propagate along the interface between the medium and air, with their energy mainly concentrated in the region near the surface. In specific frequency bands, especially the terahertz band and the high-frequency microwave band, planar antennas are prone to surface wave effects. This phenomenon causes some electromagnetic energy to be trapped inside the medium and repeatedly reflected, making it difficult to effectively radiate into free space. This results in a series of problems, including decreased antenna radiation efficiency, pattern distortion, increased sidelobe levels, and enhanced mutual coupling between array elements.

[0003] Related technologies suppress surface electromagnetic waves through methods such as material suppression, structural suppression, or algorithmic suppression. However, these methods face significant challenges in terms of bandwidth expansion and integration. Summary of the Invention

[0004] This disclosure provides an antenna device, as detailed below.

[0005] According to one aspect of this disclosure, an antenna device is provided, comprising: a first metal layer; the first metal layer having a main radiator, a collecting portion, and a first transmitting portion; the collecting portion being connected to the first transmitting portion; a first dielectric layer; the first dielectric layer being disposed at the bottom of the first metal layer; a second metal layer; the second metal layer being disposed at the bottom of the first dielectric layer; an adhesive layer; the adhesive layer being disposed at the bottom of the second metal layer; a third metal layer; the third metal layer being disposed at the bottom of the adhesive layer; the third metal layer having a loss portion and a second transmitting portion; the second transmitting portion being connected to the loss portion; a waveguide portion; one end of the waveguide portion being connected to the bottom of the first metal layer, and the other end of the waveguide portion being connected to the top of the third metal layer; the waveguide portion penetrating the first dielectric layer. The system comprises a second metal layer and an adhesive layer; a first surface electromagnetic wave transmission cavity is formed between the first metal layer and the second metal layer, and a second surface electromagnetic wave transmission cavity is formed between the second metal layer and the third metal layer; a coupling gap is disposed in the second metal layer and located inside the waveguide; a collection section collects surface electromagnetic waves from the main radiator; a first transmission section transmits surface electromagnetic waves to the first surface electromagnetic wave transmission cavity; the first surface electromagnetic wave transmission cavity transmits surface electromagnetic waves to the second surface electromagnetic wave transmission cavity through the coupling gap; the second surface electromagnetic wave transmission cavity transmits surface electromagnetic waves to the second transmission section; the second transmission section transmits surface electromagnetic waves to the loss section to eliminate surface electromagnetic waves through the loss section.

[0006] According to at least one embodiment of the antenna device of the present disclosure, the collecting part is provided with two collecting structures; the two collecting structures are symmetrically arranged on both sides of the main radiator.

[0007] According to the antenna device of this embodiment, the two collection structures are symmetrically arranged, which not only ensures that the radiation pattern emitted by the antenna device is symmetrical, but also facilitates the collection of surface electromagnetic waves from multiple main radiators through the two collection structures.

[0008] According to at least one embodiment of the antenna device of the present disclosure, the first transmission section is provided with two first transmission structures; the first transmission structures are connected to the collection structures; the first transmission structures and the collection structures correspond one-to-one.

[0009] According to the antenna device of this embodiment, by providing a corresponding first transmission structure for each collection structure, the surface electromagnetic waves collected by each collection structure are transmitted to the waveguide section through the first transmission structure.

[0010] According to at least one embodiment of the antenna device of the present disclosure, the loss section includes two loss structures; the second transmission section is provided with two second transmission structures; the loss structure is connected to the second transmission structure; the loss structure and the second transmission structure correspond one-to-one.

[0011] According to at least one embodiment of the antenna device of the present disclosure, the shape of the loss structure is curved.

[0012] The curved loss structure disclosed herein significantly extends the propagation path of surface electromagnetic waves. When surface electromagnetic waves propagate along the curved loss structure, conductor loss and dielectric loss accumulate with the path length, thereby eliminating surface electromagnetic waves.

[0013] According to at least one embodiment of the antenna device of the present disclosure, the waveguide section is provided with two waveguide structures; one end of the waveguide structure is connected to a first transmission structure; the other end of the waveguide structure is connected to a second transmission structure; one end of the waveguide structure corresponds one-to-one with the first transmission structure; and the other end of the waveguide structure corresponds one-to-one with the second transmission structure.

[0014] This disclosure achieves the transmission of each surface electromagnetic wave to the corresponding waveguide structure and the transmission of the surface electromagnetic wave to the second transmission structure through the waveguide structure by setting a corresponding first transmission structure and a second transmission structure for each waveguide structure.

[0015] According to at least one embodiment of the antenna device of the present disclosure, the waveguide structure includes a plurality of first copper pillars; the plurality of first copper pillars are arranged in an array.

[0016] According to at least one embodiment of the antenna device of the present disclosure, for each waveguide structure, the waveguide structure penetrates a first dielectric layer, a second metal layer, and an adhesive layer; one end of the waveguide structure is connected to the bottom of the first metal layer, and the other end of the waveguide structure is connected to the top of the third metal layer; a first surface electromagnetic wave transmission subcavity is formed between the first metal layer and the second metal layer, and a second surface electromagnetic wave transmission subcavity is formed between the second metal layer and the third metal layer; the first surface electromagnetic wave transmission subcavity is located above the second surface electromagnetic wave transmission subcavity.

[0017] According to at least one embodiment of the antenna device of the present disclosure, the coupling slot portion includes two coupling slot structures; the coupling slot structures are disposed inside the waveguide structure, and the coupling slot structures correspond one-to-one with the waveguide structures; the coupling slot structures are used to connect the first surface electromagnetic wave transmission sub-cavity and the second surface electromagnetic wave transmission sub-cavity.

[0018] The coupling gap structure disclosed herein connects the first surface electromagnetic wave transmission sub-cavity and the second surface electromagnetic wave transmission sub-cavity, so that the surface electromagnetic waves transmitted in the first surface electromagnetic wave transmission sub-cavity are transmitted to the second surface electromagnetic wave transmission sub-cavity through the coupling gap structure, and no leakage occurs when the surface electromagnetic waves pass through the layers, thereby ensuring that the surface electromagnetic waves collected by the collection structure can be transmitted to the second transmission part after passing through the first surface electromagnetic wave transmission sub-cavity, the coupling gap structure and the second surface electromagnetic wave transmission sub-cavity in sequence.

[0019] An antenna device according to at least one embodiment of the present disclosure further includes a second copper pillar; the second copper pillar corresponds one-to-one with a loss structure; one end of the second copper pillar penetrates the first dielectric layer, the second metal layer and the adhesive layer, and is connected to the first metal layer; the other end of the second copper pillar is connected to the loss structure.

[0020] An antenna device according to at least one embodiment of the present disclosure further includes a second dielectric layer; the second dielectric layer is disposed at the bottom of a third metal layer; a fourth metal layer; the fourth metal layer is disposed at the bottom of the second dielectric layer.

[0021] This disclosure eliminates surface electromagnetic waves (EMI) from the antenna through a closed-loop circuit of collection, guidance, penetration, and loss. After being collected by the collection section, the EMI is guided into the first transmission section, preventing further diffusion into the interlayer. The first and second EMI transmission cavities confine the EMI within a designated transmission path, transmitting it from the first dielectric layer to the adhesive layer in a closed manner, thus avoiding secondary leakage between layers. Finally, the EMI is completely attenuated in the loss section, physically eliminating the root cause of mutual coupling and achieving antenna decoupling. Furthermore, this disclosure places the waveguide structure in the interlayer, compared to related technologies where the decoupling structure is placed in the first metal layer. This releases some space in the first metal layer, further improving the performance of the antenna device. For example, the released space in the first metal layer can be used to increase the number of main radiators to further improve the performance of the antenna device, enabling its application in millimeter-wave and terahertz bands, as well as integration and miniaturization. Attached Figure Description

[0022] The accompanying drawings illustrate exemplary embodiments of the present disclosure and, together with the description thereof, serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0023] Figure 1 This is a schematic diagram of the antenna device according to one embodiment of the present disclosure.

[0024] Figure 2 This is a top view of the structure of the first metal layer according to one embodiment of the present disclosure.

[0025] Figure 3 This is a cross-sectional structural schematic diagram of an antenna device according to one embodiment of the present disclosure.

[0026] Figure 4 This is a top view of the third metal layer in one embodiment of the present disclosure.

[0027] Figure 5 This is a schematic diagram of S-parameters for one embodiment of this disclosure.

[0028] Figure 6 This is a schematic diagram comparing a radiation pattern of one embodiment of the present disclosure with radiation patterns of related technologies.

[0029] Figure 7 This is a schematic diagram of a periodically arranged EBG structure.

[0030] Figure 8 This is a schematic diagram of the structure of the second metal layer according to one embodiment of the present disclosure.

[0031] Figure 9This is a schematic diagram of the structure of the second metal layer according to another embodiment of this disclosure.

[0032] Explanation of reference numerals in the attached figures: 101 First metal layer; 102 First dielectric layer; 103 Second metal layer; 104 Adhesive layer; 105 Third metal layer; 106 Second dielectric layer; 107 Fourth metal layer; 108 Waveguide structure; 1081 First copper pillar; 109 First transmission structure; 110 Main radiator; 111 Loss structure; 112 Second copper pillar; 113 Coupled slot structure; 114 Collection structure; 115 Second transmission structure; 116 Slot; 117 Stub. Detailed Implementation

[0033] The present disclosure will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the disclosure. Furthermore, it should be noted that, for ease of description, only the parts relevant to the present disclosure are shown in the accompanying drawings.

[0034] It should be noted that, where there is no conflict, the embodiments and features described in this disclosure can be combined with each other. The technical solutions of this disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0035] Unless otherwise stated, the exemplary implementations / embodiments shown are to be understood as providing exemplary features of various details that provide ways in which the technical concepts of this disclosure can be implemented in practice. Therefore, unless otherwise stated, the features of various implementations / embodiments may be additionally combined, separated, interchanged and / or rearranged without departing from the technical concepts of this disclosure.

[0036] In related technologies, surface electromagnetic waves (SEM) are mainly suppressed through three methods: material suppression, structural suppression, and algorithmic suppression. Material suppression utilizes the photonic bandgap effect, introducing periodic refractive index changes in the medium to block surface SEM in specific frequency bands. Structural suppression reduces the effective dielectric constant by removing dielectric material around or inside the antenna, thereby suppressing surface SEM. Algorithmic suppression uses beamforming to optimize the amplitude and phase distribution of the antenna array, compensating for the radiation pattern distortion caused by surface SEM. While these methods have achieved certain technical results, they still face significant challenges in terms of frequency band expansion and integration.

[0037] To address at least one of the aforementioned technical problems, this disclosure provides an antenna device configured with a multi-layered structure. A collecting section collects surface electromagnetic waves from a main radiator; a first transmission section transmits the surface electromagnetic waves to a waveguide section. The waveguide section guides the surface electromagnetic waves to a second transmission section, which then transmits them to a loss section, thereby eliminating the surface electromagnetic waves and achieving antenna decoupling.

[0038] Figure 1 This is a schematic diagram of the antenna device according to one embodiment of the present disclosure.

[0039] like Figure 1 As shown, the antenna device of this disclosure includes a first metal layer 101, a first dielectric layer 102, a second metal layer 103, an adhesive layer 104, and a third metal layer 105. The first dielectric layer 102 is disposed at the bottom of the first metal layer 101, the second metal layer 103 is disposed at the bottom of the first dielectric layer 102, the adhesive layer 104 is disposed at the bottom of the second metal layer 103, and the third metal layer 105 is disposed at the bottom of the adhesive layer 104.

[0040] The antenna device disclosed herein adopts a multi-layer stacked architecture and operates primarily in the W-band. It can construct a closed surface electromagnetic wave transmission path in the vertical direction between layers, and the processing of surface electromagnetic waves is confined to the interlayer sandwich, thereby freeing up the physical space of the top layer of the antenna, which is beneficial for the miniaturization and high-density integration of the antenna array.

[0041] The antenna device disclosed herein also includes a second dielectric layer 106 and a fourth metal layer 107. The second dielectric layer 106 is disposed at the bottom of the third metal layer 105, and the fourth metal layer 107 is disposed at the bottom of the second dielectric layer 106. This is because a feed network or components are located on the back side of the last metal layer. When setting the loss section, it is necessary to avoid the feed network and components to prevent the loss section from interfering with these feed networks and components. Therefore, after setting the loss section on the third metal layer 105, this disclosure requires setting the second dielectric layer 106 and the fourth metal layer 107 below the third layer. By placing the loss section on the back side of the third metal layer 105 of the antenna device, the loss section can avoid conflict with components and feed networks, and can make full use of the interlayer space. In addition, since the loss section is located on the interlayer layer, it does not affect the overall aesthetics of the PCB.

[0042] The first metal layer 101, the first dielectric layer 102, the second metal layer 103, the adhesive layer 104, the third metal layer 105, the second dielectric layer 106, and the fourth metal layer 107 are stacked and connected sequentially from top to bottom. The top of the adhesive layer 104 is bonded to the bottom of the second metal layer 103, and the bottom of the adhesive layer 104 is bonded to the top of the third metal layer 105.

[0043] The thicknesses of the first metal layer 101, the second metal layer 103, the third metal layer 105, and the fourth metal layer 107 can be determined according to actual needs. For example, the thickness of the first metal layer 101, the second metal layer 103, the third metal layer 105, and the fourth metal layer 107 can all be 0.018 mm.

[0044] The first dielectric layer 102 and the second dielectric layer 106 are used to carry surface electromagnetic waves, conduct surface electromagnetic waves, and carry the power supply network. Depending on actual needs, the surface of the first dielectric layer 102 can be gold-plated to reduce conductor losses. For example, the first dielectric layer 102 uses Rogers 3003 G2 high-frequency substrate with a thickness of 0.127 mm.

[0045] This disclosure uses a gold-plated high-frequency substrate as the first dielectric layer 102 and the second dielectric layer 106, which can effectively reduce conductor loss in the high-frequency band, ensure the transmission efficiency of the main signal, and provide a low-loss dielectric environment for the closed conduction of surface electromagnetic waves.

[0046] The adhesive layer 104 is a prepreg used to bond to the top second metal layer 103 and the bottom third metal layer 105, and serves as a medium for transmitting surface electromagnetic waves. For example, the thickness of the adhesive layer 104 is 0.0889 mm.

[0047] The second dielectric layer 106 can also serve as a medium for transmitting surface electromagnetic waves in some scenarios. For example, the second dielectric layer 106 is a 5575 layer with a thickness of 0.254 mm.

[0048] Figure 2 This is a top view of the structure of the first metal layer 101 according to one embodiment of the present disclosure.

[0049] like Figure 2 As shown, the first metal layer 101 is provided with a main radiator 110, a collecting part, and a first transmitting part. The collecting part is connected to the first transmitting part.

[0050] like Figure 2 As shown, the collection section has two collection structures 114. The two collection structures 114 are symmetrically arranged on both sides of the main radiator 110.

[0051] For example, the number of main radiators 110 can be determined according to actual needs. Generally, regardless of how many main radiators 110 are provided in the first metal layer 101, a collection structure 114 is provided on both sides of the multiple main radiators 110, and the two collection structures 114 are symmetrically arranged. This design not only ensures that the radiation pattern radiated by the antenna device is symmetrical, but also facilitates the collection of surface electromagnetic waves from the multiple main radiators 110 through the two collection structures 114. For example, the collection structure 114 is implemented based on a coupled dummy element antenna.

[0052] like Figure 2 As shown, the first transmission section has two first transmission structures 109. The first transmission structure 109 is connected to the collection structure 114. The first transmission structure 109 and the collection structure 114 correspond one-to-one. For example, the first transmission structure 109 is implemented based on a microstrip-to-substrate integrated waveguide (SIW) structure.

[0053] This disclosure achieves the transmission of surface electromagnetic waves collected by each collection structure 114 to the waveguide section through the first transmission structure 109 by setting a corresponding first transmission structure 109 for each collection structure 114.

[0054] Figure 3 This is a cross-sectional structural schematic diagram of an antenna device according to one embodiment of the present disclosure.

[0055] like Figure 2 and Figure 3As shown, this disclosure also includes a waveguide section. One end of the waveguide section is connected to the bottom of the first metal layer 101, and the other end is connected to the top of the third metal layer 105. The waveguide section penetrates the first dielectric layer 102, the second metal layer 103, and the adhesive layer 104; a first surface electromagnetic wave transmission cavity is formed between the first metal layer 101 and the second metal layer 103, and a second surface electromagnetic wave transmission cavity is formed between the second metal layer 103 and the third metal layer 105. This design is intended to form a closed cavity through the waveguide section, the first metal layer 101, and the second metal layer 103. The first dielectric layer 102 and the adhesive layer 104 provide transmission media, i.e., transmission paths, for the surface electromagnetic waves entering the closed cavity, allowing the surface electromagnetic waves entering the closed cavity to propagate along the first dielectric layer 102 and the adhesive layer 104, thereby forming the first surface electromagnetic wave transmission cavity and the second surface electromagnetic wave transmission cavity. A closed transmission path for surface electromagnetic waves is provided through the first and second surface electromagnetic wave transmission cavities, confining the transmission of surface electromagnetic waves within this closed path and preventing leakage into the interlayer. That is, all surface electromagnetic waves collected by the collecting unit are transmitted through the first to the second surface electromagnetic wave transmission cavity, facilitating subsequent cancellation of the surface electromagnetic waves. For example, the waveguide is based on SIW (Signal-Insulated Wave). Since SIW generally has a wide bandwidth, the antenna device disclosed herein is suitable for multi-band and wide-band applications and is readily fabricable.

[0056] The working principle of the antenna device disclosed herein is as follows: A collecting section collects surface electromagnetic waves from the main radiator 110. A first transmitting section transmits the surface electromagnetic waves to a first surface electromagnetic wave transmitting cavity. The first surface electromagnetic wave transmitting cavity transmits the surface electromagnetic waves to a second surface electromagnetic wave transmitting cavity. The second surface electromagnetic wave transmitting cavity transmits the surface electromagnetic waves to a second transmitting section. The second transmitting section transmits the surface electromagnetic waves to a loss section, whereby the surface electromagnetic waves are eliminated.

[0057] For example, such as Figure 3 As shown, to ensure a compact antenna structure and reduce its area, the first surface electromagnetic wave transmission cavity of this disclosure is located directly above the second surface electromagnetic wave transmission cavity. This allows the surface electromagnetic wave to travel a certain distance in the first surface electromagnetic wave transmission cavity, after which its transmission direction changes from parallel to the second metal layer 103 to perpendicular to the second metal layer 103. After entering the second surface electromagnetic wave transmission cavity, the transmission direction changes from perpendicular to the second metal layer 103 to parallel to the second metal layer 103, and the transmission direction of the surface electromagnetic wave in the second surface electromagnetic wave transmission cavity is opposite to that in the first surface electromagnetic wave transmission cavity. This not only achieves closed transmission of surface electromagnetic waves between layers but also saves the area of ​​the antenna device.

[0058] The waveguide section has two waveguide structures 108; one end of the waveguide structure 108 is connected to the first transmission structure 109; the other end of the waveguide structure 108 is connected to the second transmission structure 115; one end of the waveguide structure 108 corresponds one-to-one with the first transmission structure 109. The other end of the waveguide structure 108 corresponds one-to-one with the second transmission structure 115.

[0059] Exemplarily, the waveguide structure 108 includes a plurality of first copper pillars 1081. The plurality of first copper pillars 1081 are arranged in an array. This array of first copper pillars 1081 forms a rectangular waveguide cavity. The rectangular waveguide cavity includes a first array, a second array, and a third array; the first array and the third array are symmetrically arranged; the second array is perpendicular to both the first and third arrays. That is, the rectangular waveguide cavity includes three copper pillar walls, and the other side is an opening facing the main radiator 110, used to receive surface electromagnetic waves transmitted by the first transmission structure 109. The transmission direction of the surface electromagnetic waves is parallel to the first and third arrays and perpendicular to the second array.

[0060] The cross-sectional size of each copper pillar and the spacing between any two pillars are determined based on the wavelength of the surface electromagnetic wave. It should be noted that the method for determining the cross-sectional size of each copper pillar and the spacing between any two pillars based on the wavelength of the surface electromagnetic wave can be directly obtained from relevant technologies, such as simulation.

[0061] This disclosure achieves the transmission of each surface electromagnetic wave to the corresponding waveguide structure 108 and the transmission of the surface electromagnetic wave to the second transmission structure 115 through the waveguide structure 108 by providing a corresponding first transmission structure 109 and a second transmission structure 115 for each waveguide structure 108. In addition, the array of multiple first copper pillars 1081 facilitates the formation of a closed cavity.

[0062] For each waveguide structure 108, the waveguide structure 108 extends through the first dielectric layer 102, the second metal layer 103, and the adhesive layer 104. One end of the waveguide structure 108 is connected to the bottom of the first metal layer 101, and the other end of the waveguide structure 108 is connected to the top of the third metal layer 105. A first surface electromagnetic wave transmission sub-cavity is formed between the first metal layer 101 and the second metal layer 103, and a second surface electromagnetic wave transmission sub-cavity is formed between the second metal layer 103 and the third metal layer 105. The first surface electromagnetic wave transmission sub-cavity is located above the second surface electromagnetic wave transmission sub-cavity. It can be understood that the first surface electromagnetic wave transmission includes two first surface electromagnetic wave transmission sub-cavities.

[0063] For example, a waveguide structure 108 is used as an example for explanation. Multiple arrayed copper pillars of the waveguide structure 108 penetrate the first dielectric layer 102, the second metal layer 103, and the adhesive layer 104. One end of each copper pillar is connected to the bottom of the first metal layer 101, and the other end of each copper pillar is connected to the top of the third metal layer 105. The multiple arrayed copper pillars surround a portion of the first dielectric layer 102 and the adhesive layer 104, forming a first surface electromagnetic wave transmission sub-cavity and a second surface electromagnetic wave transmission sub-cavity, with the first surface electromagnetic wave transmission sub-cavity located directly above the second surface electromagnetic wave transmission sub-cavity.

[0064] This disclosure eliminates surface electromagnetic waves (SEM) from the antenna based on a closed-loop circuit. After being collected by the collection unit, the SEM is guided into the first transmission unit, preventing further diffusion into the interlayer. The first and second SEM transmission cavities confine the SEM within a designated transmission path, transmitting it in a closed manner from the first dielectric layer 102 to the adhesive layer 104, thus preventing secondary leakage between layers. Ultimately, the SEM is completely attenuated in the loss unit, physically eliminating the root cause of mutual coupling and achieving antenna decoupling. Furthermore, this disclosure places the waveguide structure 108 in the interlayer, compared to related technologies where the decoupling structure is placed in the first metal layer 101. This releases some space in the first metal layer 101, further improving the performance of the antenna device. For example, the number of main radiators 110 can be increased in the released space of the first metal layer 101 to further improve the performance of the antenna device, enabling its application in millimeter-wave and terahertz bands, as well as integration and miniaturization.

[0065] In some examples, such as Figure 2 and Figure 3 As shown, a coupling slot is provided in the second metal layer 103. The coupling slot is located inside the waveguide and is used to connect the first surface electromagnetic wave transmission cavity and the second surface electromagnetic wave transmission cavity. The first surface electromagnetic wave transmission cavity transmits surface electromagnetic waves to the second surface electromagnetic wave transmission cavity through the coupling slot.

[0066] For example, the coupling slot portion includes two coupling slot structures 113. The coupling slot structures 113 are disposed inside the waveguide structure 108, and each coupling slot structure 113 corresponds to a waveguide structure 108. The coupling slot structures 113 are used to connect the first surface electromagnetic wave transmission sub-cavity and the second surface electromagnetic wave transmission sub-cavity.

[0067] It should be noted that the specific location and shape of the coupling slot structure 113 are determined based on the wavelength of the surface electromagnetic wave. The method for determining the specific location and shape of the coupling slot structure 113 based on the wavelength of the surface electromagnetic wave can be directly obtained from related technologies, such as through simulation.

[0068] The coupling gap structure 113 of this disclosure connects the first surface electromagnetic wave transmission sub-cavity and the second surface electromagnetic wave transmission sub-cavity, so that the surface electromagnetic waves transmitted in the first surface electromagnetic wave transmission sub-cavity are transmitted to the second surface electromagnetic wave transmission sub-cavity through the coupling gap structure 113, and there is no leakage when the surface electromagnetic waves pass through the layers, thereby ensuring that the surface electromagnetic waves collected by the collecting structure 114 can be transmitted to the second transmission section after passing through the first surface electromagnetic wave transmission sub-cavity, the coupling gap structure 113 and the second surface electromagnetic wave transmission sub-cavity in sequence.

[0069] In some examples, such as Figure 2 and 3 As shown, it also includes a second copper pillar 112. The second copper pillar 112 corresponds one-to-one with the loss structure 111. One end of the second copper pillar 112 passes through the first dielectric layer 102, the second metal layer 103, and the adhesive layer 104, and is connected to the first metal layer 101. The other end of the second copper pillar 112 is connected to the loss structure 111.

[0070] In this disclosure, one end of the second copper pillar 112, which is connected to one end of the loss structure 111, extends upward through the adhesive layer 104, the second metal layer 103, the first dielectric layer 102, and the first metal layer 101 to form a closed loop. This closed loop can prevent surface electromagnetic waves from being reflected or re-radiated due to open circuits, thereby further improving the decoupling effect.

[0071] Figure 4 This is a top view of the third metal layer 105 according to one embodiment of the present disclosure.

[0072] like Figure 4 As shown, the third metal layer 105 is provided with a loss section and a second transmission section; the second transmission section is connected to the loss section. The loss section includes two loss structures 111. The loss structure 111 is connected to the second transmission structure 115. The loss structure 111 and the second transmission structure 115 correspond one-to-one.

[0073] For example, the loss structure 111 has a curved shape. The length and degree of curvature of the loss structure 111 can be determined according to actual needs. It is understood that, where space allows in the third metal layer 105, the longer and more curved the loss structure 111, the more beneficial it is for attenuating and eliminating surface electromagnetic waves. For example, the loss structure 111 may have a serpentine shape.

[0074] The curved loss structure 111 of this disclosure significantly extends the transmission path of surface electromagnetic waves. When the surface electromagnetic waves propagate along the curved loss structure 111, the conductor loss and dielectric loss accumulate with the path length, thereby eliminating the surface electromagnetic waves.

[0075] The above embodiment is explained using a four-layer metal structure as an example. In other examples, the antenna device can have more layers. In this case, the waveguide structure 108 needs to penetrate more layers, and a coupling slot structure 113 is formed on each metal layer penetrated by the waveguide structure 108, with multiple coupling slot structures 113 facing each other. That is, the metal layers that need to have the coupling slot structure 113 have the coupling slot structure 113 in the same position. For example, when the antenna device has eight metal layers, a loss structure 111 is formed on the sixth metal layer. The surface electromagnetic wave propagates laterally in the first surface electromagnetic wave transmission subcavity between the first metal layer 101 and the second metal layer 103. After propagating to the coupling slot structure 113 of the second metal layer 103, the surface electromagnetic wave propagates vertically to the second surface electromagnetic wave transmission subcavity between the second metal layer 103 and the third metal layer 105; then it continues to propagate vertically between layers until it passes through the coupling slot structure 113 of the fifth metal layer and propagates to the fifth surface electromagnetic wave transmission subcavity between the fifth and sixth metal layers. Then, the surface electromagnetic wave is transmitted laterally to the second transmission structure 115, and then transmitted through the second transmission structure 115 to the loss structure 111, where it is attenuated by the loss structure 111, thereby eliminating the surface electromagnetic wave.

[0076] Based on the above analysis, it can be seen that the antenna device disclosed herein is applicable to PCBs with various numbers of metal layers. Regardless of the number of metal layers, as long as the waveguide structure 108 penetrates the corresponding metal layer, dielectric layer, and adhesive layer 104, and a coupling slot structure 113 is opened at the corresponding position of the metal layer through which the surface electromagnetic wave needs to pass, the surface electromagnetic wave collected by the collecting unit can be transmitted to the waveguide structure 108 through the first transmission structure 109, then to the second transmission structure 115 through the waveguide structure 108, and finally to the loss structure 111 through the second transmission structure 115, thereby eliminating the surface electromagnetic wave and achieving antenna decoupling. Furthermore, since the antenna device is configured as a multi-layer stacked structure, its area will not change regardless of the number of metal layers, thus saving the area of ​​the antenna device.

[0077] This disclosure tests the transmission effect of a transmission path from the entrance of a first surface electromagnetic wave transmission sub-cavity to the exit of a second surface electromagnetic wave transmission sub-cavity.

[0078] Figure 5 This is a schematic diagram of S-parameters for one embodiment of this disclosure.

[0079] For example, this disclosure tests the transmission effect of the transmission path through simulation. For instance, this disclosure obtains S-parameters through simulation and determines the transmission effect using the S-parameters. The S-parameters include the insertion loss value and the reflection coefficient. A smaller insertion loss value and a better reflection coefficient result in a better transmission effect. Figure 5 As shown, the insertion loss is -1.6dB and the reflection coefficient is -15dB, indicating that the surface electromagnetic wave is transmitted from the entrance of the first surface electromagnetic wave transmission sub-cavity to the exit of the second surface electromagnetic wave transmission sub-cavity, that is, the transmission effect is good.

[0080] This disclosure obtains the radiation pattern of an antenna device and the radiation pattern of an antenna device of the related art, and compares the two radiation patterns to determine the effectiveness of the antenna device of this disclosure.

[0081] Figure 6 This is a schematic diagram comparing a radiation pattern of one embodiment of the present disclosure with radiation patterns of related technologies.

[0082] For example, this disclosure loads an antenna device in a simulated manner to obtain the radiation pattern of the antenna device; and does not load an antenna device to obtain the radiation pattern of an antenna device in the related art. Figure 6 As shown, compared to the radiation pattern without an antenna (blue line), the radiation pattern with an antenna (red line) exhibits a smoother gain drop over a wide angle range greater than -50 degrees; and the gain jitter oscillation is significantly reduced within the -100 to +100 degree range. In other words, the radiation pattern with an antenna (red line) shows less jitter compared to the pattern without an antenna, and the gain flatness of the radiation pattern is effectively improved over a wider range.

[0083] In some examples, the antenna device of this disclosure has the characteristics of high isolation, low crosstalk, strong field confinement and high integration, so it can be widely used in high frequency and high density radio frequency systems.

[0084] For example, the antenna device can effectively suppress inter-port self-interference through the coupling slot structure 113 and the loss structure 111. Therefore, it can be applied to 5G / 6G base stations and terminals as well as high isolation antennas, providing key radio frequency isolation protection for millimeter wave full-duplex communication systems (In-Band Full-Duplex, IBFD).

[0085] For example, the antenna device can suppress electromagnetic coupling between elements, and therefore can be applied to high-density MIMO antenna arrays. Examples include 5G Massive MIMO, smart terminals, and radar arrays.

[0086] For example, the antenna device can be directionally applied in designs such as dual-band / multi-band filters and directional couplers.

[0087] For example, antenna devices can be used for transmit / receive channel isolation, reducing self-interference of the transmitted signal to the receiver and improving the target detection dynamic range. In terahertz communication systems, the low radiation loss and high Q-value characteristics of SIW make it an ideal transmission medium, thus enabling the construction of compact transceiver front-ends. For instance, it can be applied to 77GHz automotive radar and 92GHz traffic radar. The high Q-value indicates that energy is efficiently stored in the structure at resonance, with very little energy dissipated as heat or radiation loss.

[0088] For example, in the field of chip-level integration, antenna devices can be used to construct on-chip interconnect, filtering, and isolation modules, replacing coaxial or microstrip structures in related technologies. Furthermore, in terms of adapting to low-temperature co-fired ceramic (LTCC) and printed circuit board (PCB) processes, antenna devices can support multi-layer stacking to achieve leadless integration of the RF front end, thereby reducing parasitic effects and improving system stability.

[0089] The antenna device disclosed herein features a waveguide structure 108 disposed between layers. This effectively eliminates surface electromagnetic waves while freeing up some space in the first metal layer 101, thereby improving the overall performance of the antenna device. Furthermore, the design and fabrication of this antenna device are relatively simple, making it highly practical. In addition, since the loss structure 111, waveguide structure 108, and coupling slot structure 113 are all concealed within the layers, the space between the layers can be fully utilized, allowing for wide application in highly integrated and miniaturized structures.

[0090] In order to block residual surface electromagnetic waves that are not fully collected by the collecting unit, or to suppress surface electromagnetic waves of other frequency bands, this disclosure provides a periodically arranged electromagnetic band gap (EBG) structure on the top of the first metal layer 101 between the main radiator 110 and the collecting unit, so as to form an auxiliary suppression band for surface electromagnetic waves through the EBG structure.

[0091] Figure 7 This is a schematic diagram of a periodically arranged EBG structure.

[0092] like Figure 7 As shown, the left side is a side view of the EBG structure with regular periodic cells, and the right side is a top view of the EBG structure with regular periodic cells. The EBG structure is mushroom-shaped and includes periodically arranged metal patches and metallized vias that pass through the first dielectric layer 102 and connect to the second metal layer 103.

[0093] For example, one or more rows of EBG units are arranged on the left and right sides of the main radiator 110 and on the inner sides of the two symmetrically arranged collection structures 114 to pre-suppress surface electromagnetic waves radiated directly outward from the edge of the main radiator 110, thereby reducing the burden on the collection structures 114. The collection structures 114 collect surface electromagnetic waves in the main frequency band and transmit them to the waveguide structure 108. The EBG structure forms an auxiliary bandgap, which on the one hand suppresses surface electromagnetic waves that the collection unit fails to capture, and on the other hand suppresses surface electromagnetic waves in other interfering frequency bands, thereby achieving broadband or multi-band decoupling. This not only makes full use of the space of the released first metal layer 101, but also does not increase the overall size of the antenna device.

[0094] To cut off residual coupling current propagating through the second metal layer 103 and introduce additional resonance to enhance isolation in a specific frequency band, this disclosure provides not only coupling slots for connecting the upper and lower cavities on the second metal layer 103, but also a Defected Ground Structure (DGS). The DGS is located between two adjacent waveguide structures 108. The DGS is a slot 116 or a branch 117 etched into the ground plane.

[0095] Figure 8 This is a schematic diagram of the structure of the second metal layer according to one embodiment of the present disclosure.

[0096] like Figure 8 As shown, in the second metal layer 103, between the two waveguide structures 108, and in the area located on the second metal layer 103, slots 116 in the shape of an "I", a spiral (not shown) or a dumbbell (not shown) are etched.

[0097] Figure 9 This is a schematic diagram of the structure of the second metal layer according to another embodiment of this disclosure.

[0098] like Figure 9 As shown, one or more stubs 117 are provided in the region between the array of first copper pillars 1081 of two side-by-side waveguide structures 108 and on the second metal layer 103. These stubs 117 are perpendicular to the line connecting the two waveguide structures 108 and are used to block the flow of ground current from one waveguide structure 108 to the other waveguide structure 108.

[0099] This disclosure designs the DGS in the second metal layer 103, rather than the first metal layer 101, to avoid direct impact on antenna radiation matching and the feed network. Furthermore, the DGS provides an additional coupling current blocking mechanism, complementing the main decoupling path in the vertical direction.

[0100] In the description of this specification, the references to terms such as "one embodiment / mode," "some embodiments / modes," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment / mode or example is included in at least one embodiment / mode or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment / mode or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments / modes or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments / modes or examples described in this specification, as well as the features of different embodiments / modes or examples.

[0101] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this disclosure, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0102] Those skilled in the art should understand that the above embodiments are merely for illustrating the present disclosure and are not intended to limit the scope of the disclosure. Those skilled in the art can make other changes or modifications based on the above disclosure, and these changes or modifications still fall within the scope of the present disclosure.

Claims

1. An antenna device, characterized in that, include: A first metal layer, wherein the first metal layer is provided with a main radiator, a collecting part and a first transmitting part; The collecting unit is connected to the first transferring unit; A first dielectric layer is disposed at the bottom of the first metal layer; A second metal layer is disposed at the bottom of the first dielectric layer; An adhesive layer is disposed at the bottom of the second metal layer; A third metal layer is disposed at the bottom of the adhesive layer. The third metal layer has a loss section and a second transmission section, and the second transmission section is connected to the loss section. A waveguide portion, one end of which is connected to the bottom of the first metal layer and the other end of which is connected to the top of the third metal layer, the waveguide portion passing through the first dielectric layer, the second metal layer and the adhesive layer, forming a first surface electromagnetic wave transmission cavity between the first metal layer and the second metal layer, and forming a second surface electromagnetic wave transmission cavity between the second metal layer and the third metal layer; Coupling slot; the coupling slot is disposed in the second metal layer and located inside the waveguide portion; The collecting part collects the surface electromagnetic waves of the main radiator. The first transmitting part transmits the surface electromagnetic waves to the first surface electromagnetic wave transmitting cavity. The first surface electromagnetic wave transmitting cavity transmits the surface electromagnetic waves to the second surface electromagnetic wave transmitting cavity through the coupling gap. The second surface electromagnetic wave transmitting cavity transmits the surface electromagnetic waves to the second transmitting part. The second transmitting part transmits the surface electromagnetic waves to the loss part so as to eliminate the surface electromagnetic waves through the loss part.

2. The antenna device according to claim 1, characterized in that, The collecting part is provided with two collecting structures; the two collecting structures are symmetrically arranged on both sides of the main radiator.

3. The antenna device according to claim 2, characterized in that, The first transmission unit is provided with two first transmission structures, which are connected to the collection structure, and the first transmission structure corresponds to the collection structure one-to-one.

4. The antenna device according to claim 3, characterized in that, The loss section includes two loss structures, and the second transmission section has two second transmission structures. The loss structures are connected to the second transmission structures, and the loss structures correspond one-to-one with the second transmission structures.

5. The antenna device according to claim 4, characterized in that, The loss structure has a curved shape.

6. The antenna device according to claim 4, characterized in that, The waveguide section has two waveguide structures. One end of the waveguide structure is connected to the first transmission structure, and the other end of the waveguide structure is connected to the second transmission structure. One end of the waveguide structure corresponds to the first transmission structure, and the other end of the waveguide structure corresponds to the second transmission structure.

7. The antenna device according to claim 6, characterized in that, The waveguide structure includes multiple first copper pillars, and the multiple first copper pillars are arranged in an array.

8. The antenna device according to claim 6, characterized in that, For each of the waveguide structures, the waveguide structure extends through the first dielectric layer, the second metal layer, and the adhesive layer. One end of the waveguide structure is connected to the bottom of the first metal layer, and the other end of the waveguide structure is connected to the top of the third metal layer. A first surface electromagnetic wave transmission sub-cavity is formed between the first metal layer and the second metal layer, and a second surface electromagnetic wave transmission sub-cavity is formed between the second metal layer and the third metal layer. The first surface electromagnetic wave transmission sub-cavity is located above the second surface electromagnetic wave transmission sub-cavity.

9. The antenna device according to claim 8, characterized in that, The coupling slot portion includes two coupling slot structures, which are disposed inside the waveguide structure, and the coupling slot structures correspond one-to-one with the waveguide structure; The coupling gap structure is used to connect the first surface electromagnetic wave transmission sub-cavity and the second surface electromagnetic wave transmission sub-cavity.

10. The antenna device according to claim 4, characterized in that, It also includes a second copper pillar; the second copper pillar corresponds one-to-one with the loss structure; one end of the second copper pillar passes through the first dielectric layer, the second metal layer and the adhesive layer, and is connected to the first metal layer; the other end of the second copper pillar is connected to the loss structure.

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