Encapsulated electronic module and method of manufacturing the same

Abstract

The present invention relates to packaging electronic modules and methods of manufacturing the same. The present invention assembles multiple electronic components on a flexible printed circuit along with an integrated circuit chip and a contact plate into a module. The module can then be embedded into a plastic card by a card manufacturer using conventional milling techniques. The method packages multiple electronic components into a module. The present invention provides the ability for businesses to avoid the additional capital expenditure required for specialized equipment and enables all existing card manufacturers to manufacture smart cards with embedded electronics.

Description

[0001] This application is a divisional application of Chinese patent application No. 202080020267.0, with an international filing date of March 11, 2020, entitled "Encapsulated Electronic Module and Manufacturing Method Thereof".

[0002] Cross-reference to related applications This application is a continuation-in-part of U.S. Patent Application No. 15 / 645,234, filed July 10, 2017, the entire contents of which are incorporated herein by reference for all purposes. Technical Field

[0003] This invention relates to electronic modules, and more specifically, to packaged electronic modules with embedded electronic devices for smart cards. Background Technology

[0004] Semiconductor technology has made tremendous progress over the past few decades. Contactless smart cards are now widely used in many sectors, such as transportation and banking, for identifying people and objects. Smart cards, also known as chip cards or IC cards, are plastic cards containing one or more semiconductor chips. In most applications, smart cards are contactless, meaning they utilize radio frequency (RF) technology to perform data transmission between the card and the receiver / transmitter. Furthermore, dual-interface cards can simultaneously possess the functionality of a single-chip module. Generally, smart cards or integrated circuit cards have many different application areas, such as personal identification (ID cards, access cards, authorization cards), data encryption (code cards), personal use (bank smart cards, payment cards), and similar fields.

[0005] With advancements in the electronics industry, electronic products are trending towards miniaturization and multifunctionality. Consequently, various package types have been developed. Electronic packaging refers to the encapsulation of integrated circuit chips or dies. Materials play a crucial role in electronic packaging; much of the work on electronic packaging concerns packaging schemes rather than materials. The traditional approach to electronic packaging and interconnection involves encapsulating individual integrated circuit (IC) chips into single packages and attaching these packages to printed circuit boards to provide interconnections between the individual IC chips.

[0006] Another approach describes a hybrid contact-contact smart card double-sided electronic module designed to be placed within a cavity in which the card is incorporated into a preform in a specific manufacturing format. The apparatus includes a unit for depositing and pre-bonding a protective layer on at least one preform, a lamination unit containing means for pressing, heating, and cooling at least one preform, and a unit for cutting the preform into a smart card. The pressing, heating, and cooling means include two supports positioned opposite each other and movable toward each other to apply pressure to the preform. Each support includes at least one ceramic heating and cooling means comprising a stack of ceramic blocks and metal laminates. However, this method is highly likely to damage the components due to the inclusion of hot or cold lamination steps. Furthermore, lamination requires additional capital expenditure and specialized equipment.

[0007] Another approach describes an integrated circuit (IC) film with conventional packaging steps, and specifically, it does not require any covering with packaging molding material. The IC chip is directly mounted on a flexible printed circuit (FPC) board. The IC chip is placed on the FPC board and bonded to the FPC board's leads, thereby achieving electrical connection with it. Furthermore, a flexible plastic substrate is required to mount the components into the FPC, increasing the cost of the FPC. Additionally, extra operations, such as pre-lamination and lamination, are required before embedding the IC chip.

[0008] Another method describes a procedure for manufacturing a smart card module, the arrangement of which includes arranging the smart card module on a first carrier layer, wherein the first carrier layer does not have a pre-fabricated smart card module socket opening for receiving the smart card module, and wherein the first carrier layer may comprise plastic (polymer). The smart card module includes a substrate, a chip on the substrate, and a first mechanical reinforcement structure between the chip and the substrate. The smart card module can be embedded between the first carrier layer and a second carrier layer. Embedding of the smart card module can be achieved, for example, by lamination (e.g., by cold lamination or hot lamination) or by lamination and additional pressing. Furthermore, the smart card module can be embedded by pressing. The substrate (or carrier) used to provide the smart card module can be formed of a flexible material (e.g., plastic or polymer) and / or have a corresponding thickness such that the substrate is flexible. However, this method does not include embedded electronics. Furthermore, this method of manufacturing cards by lamination is difficult to perform, and only a few card manufacturers are able to do it correctly.

[0009] Therefore, there is a need for an efficient electronic packaging module and its manufacturing method. This method assembles all the necessary electronic components into a module, rather than assembling them onto a flexible printed circuit (FPC). The cost of this module will be lower than that of an FPC. This method does not require a flexible plastic substrate to mount the components. Furthermore, this method eliminates any lamination steps, thereby reducing the risk of component damage. Therefore, this method will provide companies with the ability to avoid the additional capital expenditure required for dedicated equipment. This necessary method will reduce the unit cost of packaged chips. This implementation will enable all existing card manufacturers to manufacture smart cards with embedded electronics. This implementation overcomes the shortcomings in this field by achieving these key objectives. Summary of the Invention

[0010] To minimize the limitations of the prior art, and other limitations that are obvious when reading the specification, the present invention is a packaged electronic module with embedded electronics for smart cards. This invention is a novel packaged electronic module for manufacturing value-added smart cards with embedded electronics. This packaged electronic module encapsulates all electronic components typically located on a flexible printed circuit (FPC), along with integrated circuit chips and contact plates, into a module. Card manufacturers can then embed this module into a plastic card using conventional milling techniques.

[0011] This invention provides a high-efficiency electronic packaging module and its manufacturing method. This method assembles all necessary electronic components into a module rather than onto a flexible printed circuit (FPC). This invention provides businesses with the ability to avoid the additional capital expenditure required for dedicated equipment. Furthermore, this invention reduces the unit cost of packaged chips and enables all existing card manufacturers to produce smart cards with embedded electronics.

[0012] Other features and advantages of the invention will become apparent from the following more detailed description taken in conjunction with the accompanying drawings, which illustrate the principles of the invention by way of example. Attached Figure Description

[0013] The elements in the accompanying drawings are not necessarily drawn to scale in order to improve clarity and enhance understanding of these different elements and embodiments of the invention. Furthermore, to provide a clear view of the various embodiments of the invention, elements known to those skilled in the art are not depicted; therefore, for clarity and brevity, the drawings are simplified in form.

[0014] Figure 1 An exploded perspective view of a smart card according to a preferred embodiment of the present invention; Figure 2 This represents a first component of a packaged electronic module according to a preferred embodiment of the present invention; Figures 2A to 2BThis illustrates a preferred embodiment of the present invention. Figure 2 A schematic diagram of the embedding of the first component shown; Figure 3 This represents a second component of the packaged electronic module according to a preferred embodiment of the present invention; Figure 3A This illustrates the invention according to the present invention. Figure 3 A schematic diagram showing the embedding of the second component; Figure 4 This refers to a third component of a packaged electronic module according to a preferred embodiment of the present invention; Figure 4A This illustrates the invention according to the present invention. Figure 4 A schematic diagram showing the embedding of the third component; Figure 5 This refers to the fourth component of the packaged electronic module according to a preferred embodiment of the present invention; Figure 5A This illustrates the invention according to the present invention. Figure 5 A schematic diagram showing the embedding of the fourth component; Figure 6 This refers to the fifth component of the packaged electronic module according to a preferred embodiment of the present invention; Figure 6A This illustrates the invention according to the present invention. Figure 6 The diagram shows the embedding of the fifth component.

[0015] Figures 7A to 7C Aspects of a packaged electronic module according to an exemplary embodiment of the present invention are illustrated; Figure 8 The present invention illustrates an exemplary embodiment of the present invention. Figures 7A to 7C The aspect of embedding smart cards into packaged electronic modules; Figures 9A to 9C Aspects of a packaged electronic module according to an exemplary embodiment of the present invention are illustrated; Figure 10 The present invention illustrates an exemplary embodiment of the present invention. Figures 9A to 9C The aspect of embedding smart cards into packaged electronic modules; Figures 11A to 11C Aspects of a packaged electronic module according to an exemplary embodiment of the present invention are illustrated; Figure 12 The present invention illustrates an exemplary embodiment of the present invention. Figures 11A to 11C The aspect of embedding smart cards into packaged electronic modules; Figures 13A to 13C Aspects of a packaged electronic module according to an exemplary embodiment of the present invention are illustrated; Figure 14 The present invention illustrates an exemplary embodiment of the present invention. Figures 13A to 13CThe aspect of embedding smart cards into packaged electronic modules; and Figures 15A to 15C Aspects of a packaged electronic module according to an exemplary embodiment of the present invention are shown. Detailed Implementation

[0016] In the following discussion of various embodiments and applications of the invention, reference is made to the accompanying drawings, which form part of the invention and are illustrated by way of specific embodiments through which the invention can be practiced. It should be understood that other embodiments may be utilized and modifications may be made without departing from the scope of the invention.

[0017] Various inventive features are described below, which can be used independently of each other or in combination with other features. However, no single inventive feature can solve any of the above-described problems, or can only solve one of the above-described problems. Furthermore, one or more of the above-described problems may not be completely solved by any of the features described below. The invention will now be described with reference to the accompanying drawings, which do not limit the scope and limits of the invention. In the following discussion of various embodiments and applications of the invention, reference is made to the accompanying drawings, which form part of the invention and are illustrated by way of specific embodiments in which the invention can be practiced. It should be understood that other embodiments may be utilized and modifications may be made without departing from the scope of the invention.

[0018] As used herein, the term "mechanism" refers to any device, process, service, or combination thereof. A mechanism can be implemented in hardware, software, or firmware using dedicated equipment or any combination thereof. A mechanism can be mechanical or electrical, or a combination thereof. A mechanism can be integrated into a single device or distributed across multiple devices. The various components of a mechanism can be located in the same location or dispersed. A mechanism can be formed from other mechanisms. Generally, as used herein, the term "mechanism" can therefore be considered an abbreviation for the terms device and / or process and / or service.

[0019] Now for reference Figures 1 to 1 5. The present invention according to exemplary embodiments will be described in further detail below.

[0020] Figure 1 The diagram shows a general perspective view and an exploded perspective view of a value-added smart card 100 according to an exemplary embodiment of the present invention. The value-added smart card 100 includes a card body 105, a plurality of plastic card layers 115, and an encapsulated electronic module 120 including and / or coupled to a contact plate 125. The card 100 may also include a card antenna 110 or an embedded battery (not shown).

[0021] According to an exemplary embodiment of the present invention, the packaged electronic module 120 may typically include a contact plate 142, one or more electronic readers 138, one or more integrated circuit (IC) chips 144, a plurality of electronic components 146, and any other components or elements required for the packaged electronic module 120 to perform its functions. This is in Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figures 7A-7C , Figures 9A-9C , Figures 11A-11C , Figures 13A-13C , Figure 14 and Figures 15A-15C As shown, the reference may correspond to Figure 1 The packaged electronic module 120 is a packaged electronic module. Thus, the packaged electronic module can be a self-contained unit, which can include all the basic components required to perform its functions. Therefore, the packaged electronic module 120 can also be referred to as an integrated component.

[0022] Contact plate 142 enables module 120 to make electrical contact with the card reader as needed. Electronic reader 138 can provide real-time information such as the current balance available on the card or in the associated bank account, the number of available trips (e.g., on a transit card), a dynamic security code for validally marking CVx2 data to prevent fraud, and other information.

[0023] The encapsulated electronic module 120 can be embedded in the card body 105. It should be noted that... Figure 1 The smart card 100 and the packaged electronic module 120 are for illustrative and conceptual purposes. Those skilled in the art will understand that the packaged electronic module 120 can be configured in any way that allows the smart card 100 to perform its functions. Furthermore, although... Figure 1 Module 120 is shown typically configured on the top surface of smart card 100, but module 120 or portions thereof may be configured on any one or more surfaces of the card, and / or in any one or more intermediate layers of the card, and / or in any combination of the card's surfaces and / or layers. This will be described in later sections.

[0024] The card body 105 may be flat and have different layers of plastic or other materials, one or more of which may include an antenna (e.g., for contactless card functionality, such as RFID communication) or an embedded battery (not shown). To support the card 100, which may include one or more antennas 110, the encapsulated electronics module 120 may be connected to the antenna 110 using a connector, a miniature antenna, or other connection mechanism. In all embodiments described herein, it is preferred that the embedding of the module 120 does not interfere with or obstruct any other components and elements of the card 100 (e.g., the internal antenna 110).

[0025] The encapsulated electronic module 120 can be used in the manufacturing and / or fabrication and / or assembly process of a value-added smart card 100 with embedded electronics. The value-added smart card 100 can be contactless only, contact only, or dual-interface (contact and contactless). According to an exemplary embodiment of the invention, components typically located on the flexible printed circuit (FPC) of the configurable smart card 100 can be combined to form an integral module 120. The card manufacturer can then embed the module 120 into a plastic card using conventional milling techniques or other manufacturing methods. Different components can be used depending on the relative dimensions of the electronic components and the contact plate. Because no hot or cold lamination is involved, the present invention has a lower risk of damaging the electronic components. The present invention enables all existing card manufacturers to manufacture these value-added smart cards with embedded electronics.

[0026] In some exemplary embodiments of the invention, the visible components of module 120 may be located and / or visible on the opposite side of smart card 100. For example, contact plate 142 may be located on the top surface of card 100, and electronic reader 138 may be located and / or visible on the bottom surface of card 100, or vice versa. Furthermore, in some exemplary embodiments of the invention, the visible components of module 120 may be located and / or visible on the same side of smart card 100. For example, contact plate 142 and electronic reader 138 may both be located and / or visible on the top surface of card 100.

[0027] Visible components on the opposite side of the card Figure 2 This illustrates a packaged electronic module 140 according to a preferred embodiment of the present invention (which may correspond to...) Figure 1The first component of the packaged electronic module 120 is an integral component, wherein the coverage area of ​​the electronic components (e.g., an electronic reader) is no greater than the coverage area of ​​the contact plate 142. The first component of the packaged electronic module 140 includes a contact plate 142 connected to an integrated circuit chip 144, a plurality of electronic components 146 connected to the contact plate 142 and the integrated circuit chip 144, an electronic display 138 connected to the plurality of electronic components 146, and a device for connecting the packaged electronic module 140 to a card antenna 110 (e.g., Figure 1 Multiple connectors (not shown) for an embedded battery (not shown). The thickness of the packaged electronic module 140 may be equal to or less than the thickness of the plastic card, but preferably not greater than the thickness of the plastic card. The packaged electronic module 140 may include a miniature antenna to be inductively coupled to an antenna in the card. It should also be noted that, in addition to or in place of the electronic display 138, value-added components such as a fingerprint sensor, LEDs, and / or electronic or mechanical buttons may be included.

[0028] Figures 2A to 2B This illustrates the invention according to the present invention. Figure 2 A schematic diagram of the embedding of the first component shown. A method for manufacturing a value-added smart card 100 (such as...) Figure 1 The method (shown) includes the step of embedding an integral component of the first component 140 by milling the card 150 from the front of the card to the back of the card and embedding the encapsulated electronic module 140 into the front of the card. The method for manufacturing the value-added smart card 100 (as shown) includes the step of embedding an integral component of the first component 140 by milling the card 150 from the front of the card to the back of the card and embedding the encapsulated electronic module 140 into the front of the card. Figure 1 The method (shown) also includes the steps of milling the card 150 from the front to the back protective layer 164 (while keeping the protective layer 164 intact) and embedding the packaged electronic module 140 from the front of the card. For example, if 138 is an electronic display, the protective layer 164 should be transparent. In this case, the thickness of the packaged electronic module 140 will be equal to the thickness of the card minus the thickness of the back protective layer. The milled area 154 should conform to the shape of the packaged electronic module 140.

[0029] Figure 3 This represents a second component of a packaged electronic module according to a preferred embodiment of the present invention. The second component 160 (which may correspond to...) Figure 1 The packaged electronic module 120 includes an integrated assembly in which the coverage area of ​​the electronic device 158 is larger than the coverage area of ​​the contact plate 142. The second assembly of the packaged electronic module 160 includes a contact plate 142 connected to the integrated circuit chip 144, a plurality of electronic components 146 connected to the contact plate 142 and the integrated circuit chip 144, an electronic display 138 connected to the plurality of electronic components 146, and a device for connecting the packaged electronic module 160 to a card antenna 110 (e.g., Figure 1Multiple connectors (not shown) for the packaged electronic module 160 or an embedded battery (not shown). The thickness of the packaged electronic module 160 is equal to or less than the thickness of the smart card. Depending on the size of the electronic component 146, the module may have an asymmetrical shape to avoid some electronic components being too close to the card's boundaries. The packaged electronic module 160 may have a miniature antenna to utilize inductive coupling to an antenna in the card. It should also be noted that, in addition to or in place of the electronic display 138, value-added components such as a fingerprint sensor, LEDs, and / or electronic or mechanical buttons may be included.

[0030] Figure 3A This illustrates the invention according to the present invention. Figure 3 The diagram shows the embedding of the second component. Because the back side of the second component 160 is larger than the front side, the value-added smart card 100 (as shown) is manufactured... Figure 1 The method (shown) includes the step of embedding an integral component of the second component 160 by milling the smart card 150 from the back of the card to the front of the card and embedding the module from the back of the card. The milled area 154 on the back of the card is larger than the front of the card to conform to the shape of the packaged electronic module 160.

[0031] Figure 4 This refers to a third component of the packaged electronic module according to a preferred embodiment of the present invention. The third component of the packaged electronic module 170 (which may correspond to...) Figure 1 The packaged electronic module 120 includes an integrated circuit chip 144, multiple electronic components 146, an electronic display 138 connected to the multiple electronic components 146, and a device for connecting the packaged electronic module 170 to a card antenna 110 (e.g., Figure 1 Multiple connectors (not shown) for an embedded battery (not shown). The thickness of the packaged electronic module 170 is no greater than the thickness of the plastic card. Depending on the size of the electronic component 146, the module may have an asymmetrical shape to avoid some electronic components being too close to the card's edge. The third component has no contact plate, so it can be used for contactless cards only, one-time password cards, or other value-added cards that do not require a contact plate. The packaged electronic module may have a miniature antenna to utilize an antenna connected inductively to the card. It should also be noted that, in addition to or in place of the electronic display 138, value-added components such as a fingerprint sensor, LEDs, and / or electronic or mechanical buttons may be included.

[0032] Figure 4A This illustrates the invention according to the present invention. Figure 4 The diagram shows the embedding of the third component. Creating a value-added smart card 100 (such as...) Figure 1The method (shown) includes the step of embedding a third component of the encapsulated electronics module 170 by milling the card 176 from the back or front of the card and embedding the encapsulated electronics module 170. Since the encapsulated electronics module 170 does not have a contact plate 142, it can be embedded virtually anywhere on the card. The milled area 154 should conform to the shape of the encapsulated electronics module 170. It should be noted that although... Figure 4A Card 176 may be depicted as being milled from the top to embed module 170 from the top and from the bottom to embed module 170 from the bottom, but this is shown for illustrative and conceptual purposes, and card 176 may include module 170 embedded only from the top, module 170 embedded only from the bottom, or any combination thereof.

[0033] Figure 5 This represents a fourth component of the packaged electronic module according to a preferred embodiment of the present invention. The fourth component 180 (which may correspond to...) Figure 1 The packaged electronic module 120 includes two components, wherein the coverage area of ​​all electronic devices is no greater than the coverage area of ​​the contact plate 142. The fourth component of the packaged electronic module 180 includes multiple electronic components 146 connected to the contact plate 142 and the integrated circuit chip 144, an electronic display 138 connected to the multiple electronic components 146, and a device for connecting the packaged electronic module 180 to a card antenna 110 (e.g.,...). Figure 1 Multiple connectors (not shown) for an embedded battery (not shown). The thickness of the packaged electronic module 180 may be less than, equal to, but preferably not greater than, the thickness of the plastic card. The fourth component 180 may be further defined as an assembly of the upper and lower halves of the packaged electronic module. The upper and lower halves of the fourth component 180 are assembled into an asymmetrical packaged electronic module. The packaged electronic module 180 may have a miniature antenna to be connected to an antenna in the card via inductive coupling. It should also be noted that, in addition to or in place of the electronic display 138, value-added components such as a fingerprint sensor, LEDs, and / or electronic or mechanical buttons may be included.

[0034] Figure 5A This illustrates the invention according to the present invention. Figure 5 The diagram shows the embedding of the fourth component. Creating a value-added smart card 100 (such as...) Figure 1 The method (shown) includes the steps of embedding the fourth component 180 by milling the card from the front and embedding the upper half of the module from the front of the card, embedding the lower half from the back of the card, and connecting the two halves to assemble a complete module. The milled area 154 should conform to the shape of the packaged electronic module 180.

[0035] Figure 6 This refers to a fifth component of the packaged electronic module according to a preferred embodiment of the present invention. The fifth component 190 (which may correspond to...) Figure 1The packaged electronic module 120 includes two components, wherein the coverage area of ​​all electronic components is greater than the coverage area of ​​the contact plate 142. The fifth component of the packaged electronic module 190 includes multiple electronic components 146 connected to the contact plate 142 and the integrated circuit chip 144, an electronic display 138 connected to the multiple electronic components 146, and a device for connecting the packaged electronic module 190 to a card antenna 110 (e.g., Figure 1 Multiple connectors (not shown) for an embedded battery (not shown). The thickness of the packaged electronic module 190 may be less than, equal to, but preferably not greater than, the thickness of the plastic card. The fifth component 190 may be further defined as an assembly of the upper and lower halves of the packaged electronic module. The lower half of the fifth component 190 is larger than the upper half of the packaged electronic module, wherein the upper and lower halves are assembled into an asymmetrical packaged electronic module to avoid some electronic components 146 being too close to the card's boundary. The packaged electronic module 190 may have a miniature antenna to utilize inductive coupling to an antenna in the card. It should also be noted that, in addition to or in place of the electronic display 138, value-added components such as a fingerprint sensor, LEDs, and / or electronic or mechanical buttons may be included.

[0036] Figure 6A This illustrates the invention according to the present invention. Figure 6 The diagram shows the embedding of the fifth component. Creating a value-added smart card 100 (such as...) Figure 1 The method (shown) includes embedding the fifth component 190 by milling the card from the back to the front and inserting the upper half of the module from the front, inserting the lower half from the back, and connecting the two halves to assemble the complete module. The milled area 154 should conform to the shape of the packaged electronic module 190.

[0037] Visible components on the same side of the card In some exemplary embodiments of the invention, visible components of the packaged electronic module 120 may be located and / or visible on the same side of the smart card 100. For example, portions of the contact plate 142 and / or the electronic reader 138 may be located and / or visible on the top surface of the card 100, the bottom surface of the card 100, any other surface of the card 100, and any combination thereof.

[0038] Reference Figures 7A to 7C According to an exemplary embodiment of the present invention, the packaged electronic module 200 (which may correspond to) Figure 1 The packaged electronic module 120 in the specification may be an integrated component, which may typically include a contact plate 142, an electronic reader 138, an integrated circuit (IC) chip 144, multiple electronic components 146, and other elements and / or components required by the module 200 to perform the desired functions described herein or otherwise. Figure 7A , Figure 7B and Figure 7C The top view, bottom view, and side view of module 200 can be displayed in general.

[0039] Components 142, 138, 144, 146 (and any other components) may be connected together (electrically and / or physically) as required for the proper functioning of module 200. For example, contact plate 142 may be connected to IC chip 144, and IC chip 144 may be connected to multiple electronic components 146 and electronic reader 138. It should be understood that any of components 138, 142, 144, 146 may be connected to any other component 138, 142, 144, 146 in any combination. Any type of connection may be used between any components.

[0040] In one exemplary embodiment of the invention, the packaged electronic module 200 and / or components 138, 142, 144, 146 may include additional connectors or connection mechanisms for connecting module 200 to other components. For example, module 200 may include a miniature antenna for inductive coupling to an internal antenna 110 within the card. Figure 1 (Clearly visible in the image), and / or communicate with the internal antenna 110 within the card. Other types of connectors or connection mechanisms may also be used as needed. For example, module 200 and / or components 138, 142, 144, 146 may include electrical and / or physical contacts (connectors) that are positioned and configured to connect (electrically and / or physically) to other components of the configurable card 100 (e.g., other components configured within and / or outside the card 100). For example, module 200 may include other connectors that can be used to connect module 200 to other components (e.g., an embedded battery). In another example, module 200 may include connectors that can be connected to value-added components (e.g., a fingerprint sensor, one or more antennas, LEDs, and / or electronic or mechanical buttons, which may be included in addition to or in place of electronic display 138). In this case, the value-added component may include a portion located on the same side of the smart card 100 and / or visible on the same side as contact plate 142 and / or electronic reader 138.

[0041] Module 200 may also include a sealing material 148 (e.g., resin) to help hold the components together and protect them from moisture, corrosion and other unwanted elements.

[0042] In one example, contact plate 142 and electronic reader 138 may be included in a portion visible on the same side of card 100. Figures 7A to 7C As shown, these visible components 142, 138 can be configured with their visible sides all facing the same direction (e.g., upwards) (e.g., as shown in the diagram). Figure 7A The portion of the top surface shown. Thus, when the encapsulated electronic module 200 is disposed on the surface of the smart card 100 (e.g., the top surface of the card 100), these portions of the contact plate 142 and the electronic reader 138 can all be visible on the same surface of the smart card 100. In a preferred embodiment, these portions of the top surfaces of the contact plate 142 and the electronic reader 138 can be visible on the top surface of the smart card 100.

[0043] The thickness D1 of the packaged electronic module 200 (e.g.) Figure 7C (As shown) can preferably be less than the thickness D of the smart card 100 (e.g. Figure 8 (As shown). In this way, module 200 can be embedded in the top or bottom surface of the smart card without module 200 completely penetrating card 100. However, it should be noted that the thickness D1 can be equal to, but preferably not greater than, the thickness D.

[0044] According to an exemplary embodiment of the present invention, Figure 8 The process and method for manufacturing a value-added smart card 100 by embedding an integrated packaged electronic module 200 into a smart card 100 are illustrated. As shown in step 1, a smart card 100 with a thickness of D can be provided. In step 2, the surface of the smart card 100 (e.g., the top surface 102 or "front" of the card 100) can be milled using a milling drill bit 152 or any other mechanism that can remove a portion of the card 100 sufficient for insertion into the module 200. Other techniques, such as laser etching or other techniques, can also be utilized. The card can also be formed during its overall manufacturing process to include an open area sufficient for embedding the module 200.

[0045] It should be noted that the milled area 154 can extend from the surface of the card 100 (e.g., the top surface 102 or "front" of the card 100) to an intermediate depth within the card 100, but preferably does not completely penetrate the card 100. An integral component 200 with a thickness D1 less than the total thickness D of the card 100 can be accommodated through the milled area 154 and thus embedded in the card 100. Thus, when components 138, 142 are embedded in the card 100, visible portions of the module 200 (e.g., at least a portion of the top surface of the contact plate 142 and at least a portion of the top surface of the electronic reader 138) are visible on the top surface 102 of the card 100. This is in Figure 8 The steps are described in step 3.

[0046] However, it should be noted that if the thickness D1 of module 200 is equal to the thickness D of card 100, the milled area 154 can extend from the top surface 102 (front) of card 100 to the bottom surface 104 (back) of card 100, and a portion of module 200 can be visible on the bottom surface 104 of card 100. However, portions of module 200 visible on the top of card 100 (e.g., at least a portion of the top of contact plate 142 and at least a portion of the top of electronic reader 138) may still be so in this scenario. It should be noted that if card 100 includes a protective layer on its bottom surface 104, the protective layer can be left intact or milled depending on the thickness D1 of module 200 relative to the thickness D of card 100.

[0047] Preferably, the milled area 154 generally corresponds to the size, shape, and dimensions of the module 200 so that the milled area 154 can accommodate the module 200, and the joint between the milled area 154 and the module 200 can be free of gaps, protrusions, or disengagements. It is also preferable that, once inserted, the top surface of the module 200 can be generally flush with the top surface of the card 100. The module 200 can be held within the open area 154 using adhesives, press-fitting, or other attachment mechanisms, methods, or means.

[0048] As described with respect to other exemplary embodiments herein, the coverage area of ​​the electronic reader 138 (including or excluding the integrated circuit (IC) chip 144 and / or multiple electronic components 146) may be substantially equal to, smaller than, or larger than the coverage area size of the contact plate 142. In previous embodiments, because the visible portions of the contact plate 142 and the electronic reader 138 may be configured on opposite sides (front and back) of the card 100, the coverage area size of the electronic display 138 relative to the coverage area size of the contact plate 142 may affect the method by which the module 200 can be embedded in the card 100.

[0049] However, when the visible portion of the contact plate 138 and the visible portion of the electronic display 138 are configured on the same side of the card 100, the coverage size of the electronic reader 138 relative to the coverage size of the contact plate 142 may not necessarily have the same or similar effect on the method by which the module 200 can be embedded in the card as in other embodiments.

[0050] For example, according to the exemplary implementation described herein, Figures 7A to 7C An encapsulated electronic module 200 is depicted, which may include an electronic reader 138, the coverage area of ​​which is substantially smaller than or equal to the coverage area of ​​the associated contact plate 142. On the other hand, Figure 9A , Figure 9B and Figure 9CTop, bottom, and side views of an integrated packaged electronic module 202 are shown, which may include a reader 138, the coverage area of ​​which may be larger than the coverage area of ​​an associated contact plate 142. However, in Figure 10 As can be seen, the process of embedding module 202 into card 100 can be similar to that regarding Figure 8 The process shown and described, but with a slightly larger milling area 154 that can accommodate a larger electronic reader 138 coverage area. All other aspects of this exemplary embodiment of module 202 are related to... Figures 7A to 7C and Figure 8 The exemplary embodiments of the module 200 are identical or similar in aspects.

[0051] In another exemplary embodiment of the invention, the integrated electronic packaging assembly 204 may include two or more sub-components that can be assembled to form the packaging assembly 204. In such... Figures 11A to 11C (Depicting the top, bottom, and side views of the components respectively) In one example, module 204 may include a first sub-component 204-1 and a second sub-component 204-2 (in... Figure 11C (Clearly seen in the image). In this example, the first sub-component 204-1 typically includes a contact plate 142 and electronic components 146, and the second sub-component 204-2 typically includes an electronic reader 138 and an IC 144. However, it should be noted that each and / or any of the first sub-component 204-1 and the second sub-component 204-2 may include any of the elements 138, 142, 144, 146, or any other elements required by module 200. As shown, the coverage size of the electronic reader 138 of module 204 may be equal to or smaller than the coverage size of the associated contact plate 142, so that when the sub-components are combined, the resulting module 204 can resemble... Figures 7A to 7C and Figure 8 Module 200. As mentioned above regarding... Figures 7A to 7C and Figure 8 All aspects of module 200 can also be applied to the combined module 204.

[0052] Encapsulation module 204 can be used in conjunction with the above-mentioned... Figure 8 The card 100 is configured in a similar manner to that described in module 200, but with the addition of a step of combining sub-components 204-1 and 204-2 together to form component 204.

[0053] Sub-components 204-1 and 204-2 can be combined before or during the configuration of module 204 and card 100. In one example, sub-module 204-1 can first be placed in its... Figure 12The submodule 204-2 can then be placed at its corresponding position within the milling area 154 (as shown in step 3). It should be noted that the insertion order can be reversed or performed in any order. For example, submodule 204-2 can be embedded into card 100 first, followed by submodule 204-1.

[0054] In one exemplary embodiment of the invention, sub-components 204-1 and 204-2 may each include corresponding electrical and / or physical contacts or other connection mechanisms configured to cooperate with each other. That is, sub-component 204-1 may include a connection mechanism, sub-component 204-2 may include a connection mechanism, and the connection mechanisms of 204-1 and 204-2 may be configured to connect to each other. Thus, when sub-components 204-1 and 204-2 are embedded in the open area 154 of card 100 (together, individually, one after another, or in any combination), their corresponding electrical and / or physical contacts can contact each other to properly (electrically and physically) connect sub-components 204-1 and 204-2 together. This may result in a combined component 204 that can therefore function normally. It should be understood that the electrical and / or physical connections between sub-components 204-1 and 204-2 can be configured and can be made in contact within card 100 (e.g., within open area 154), outside card 100 (e.g., on the top or bottom surface of card 100), and in any combination thereof.

[0055] The above examples are for illustrative purposes. Those skilled in the art will understand upon reading this specification that the integrated component 204 may include any number of sub-components 204-n, where n is any number, and that sub-components 204-1, 204-2, and 204-n may be configured in any order and / or in any position relative to each other within the open area 154 of the card 100. Furthermore, not all sub-components 204-n may be visible from the surface of the card 100, and some sub-components 204-n may be located in the inner layers of the card 100. However, it is preferable that sub-components 204-n, which may include a contact plate 142 and an electronic reader 138, may be located in the area of ​​the open area 154 such that the desired visible portions of the contact plate 142 and the desired visible portions of the electronic display 138 may be visible from the same surface of the card 100.

[0056] Sub-components 204-1, 204-2, and 204-n may also be combined prior to embedding the combined module 204 into the card 100. Furthermore, some sub-components 204-n may be combined prior to embedding into the card 100, while others may be combined during embedding. Clearly, any combination of sub-components 204-n may be combined before or during embedding into the card 100, and may be combined in any combination thereof. It should also be understood that any and / or all sub-components 204-n may include corresponding electrical and / or physical contacts that can be configured to contact corresponding contacts on any other sub-component 204-n as needed by the smart card 100 and / or module 200 during embedding into the card 100.

[0057] Although Figures 11A to 11C and Figure 12 The illustration depicts an integrated assembly 204 formed by combining sub-assemblies 204-1 and 204-2. Sub-assemblies 204-1 and 204-2 may have an electronic reader 138 whose coverage area size may be the same as or smaller than the coverage area size of the associated contact plate 142. Figure 13A , Figure 13B and Figure 13C The top, bottom, and side views of the packaged electronic module 206 formed by combining sub-components 206-1 and 206-2 are shown respectively. Sub-components 206-1 and 206-2 may have an electronic reader 138 whose coverage area may be larger than the coverage area of ​​its associated contact plate 142.

[0058] It should be understood that all aspects of module 204 described above also apply to module 206, but the process of embedding module 206 into card 100 may require a larger open area 154 to accommodate a larger coverage area size for the electronic reader. This is in Figure 14 As shown in the image.

[0059] Those skilled in the art will understand upon reading this specification that, as stated above regarding Figures 7A to 7C , Figure 8 , Figures 9A to 9C , Figure 10 , Figures 11A to 11C , Figure 12 , Figures 13A to 13C and Figure 14 In any of the embodiments described, at least a portion of the electronic reader 138 may be positioned and / or visible at any location relative to at least a portion of the contact plate 142 on the same surface of the card. That is, although Figures 7A to 7C , Figure 8 , Figures 9A to 9C , Figure 10 , Figures 11A to 11C , Figure 12 , Figures 13A to 13C and Figure 14 Electronic reader 138 can typically be depicted as located next to or near contact plate 142, but electronic reader 138 can be located anywhere relative to contact plate 142, such as to the right of contact plate 142, to the left of contact plate 142, above contact plate 142, below contact plate 142, diagonally in any direction, offset by any distance in any direction, or at any position on the same side of card 100 as contact plate 142, such that electronic reader 138 and modules 200, 202, 204, 206 and all associated components can each perform their desired functions.

[0060] It should also be understood that, for all embodiments herein, the contact plate 142 and the electronic reader 138 may also be typically configured on and visible on the opposite side of the card 100. For example, the contact plate 142 may typically be configured on and visible on the top surface (front) of the card 100, while the electronic display 138 may typically be configured on and visible on the bottom surface (back) of the card 100, and vice versa. It should also be understood that when the contact plate 142 and the electronic reader are typically configured on and visible on the opposite side of the card 100, they may be in any orientation and / or position relative to each other. For example, a portion or all of the electronic reader 138 may typically be located below the contact plate 142 (but on the opposite side of the card 100), or a portion or all of the electronic display 138 may be laterally offset from the contact plate 142 at any lateral position relative to the contact plate 142 (but on the opposite side of the card 100). IC chip 144 and / or electronic component 146 can be located at any position that allows components 144, 146 to be fully electrically connected to contact plate 142 and / or electronic display 138 and / or to each other as needed to achieve their respective functions. It is also preferable that electrical connections can be made between contact plate 142 and / or electronic display 138 and / or IC chip 144 and / or electronic component 146, and between any combinations thereof, as needed for various individual and combined components to achieve their respective and combined functions. It should also be understood that these electrical connections can be configured before or during embedding any of components 138, 142, 144, 146 into card 100. As can be seen in this embodiment, contact plate 142 can be embedded in card 100 on one surface of card 100 (e.g., on the front or top of card 100) and electronic reader 138 can be embedded in card 100 on a surface of card 100 opposite to the surface that may include contact plate 142.

[0061] In all embodiments described herein or in other embodiments, integrated circuit chip 144 may include a microprocessor, microcontroller, CPU, memory, and any other components and elements for performing its functions. In all embodiments described herein, multiple electronic components may include resistors, capacitors, inductors, matching networks, and any other components and elements required for modules 120, 140, 160, 170, 180, 190, 200, 202, 204, 206 to perform their desired functions.

[0062] In all embodiments described herein or other embodiments, modules 120, 140, 160, 170, 180, 190, 200, 202, 204, 206 and / or any of their sub-components (e.g., sub-components 204-1, 204-2, 204-n) may include elements replacing the stated elements or elements other than the stated elements. For example, in situations such as Figure 15A , Figure 15B and Figure 15C In one exemplary embodiment shown, in addition to contact plate 142, electronic reader 138, electronic component 146 and / or IC 144, module 208 and / or any sub-component (e.g., sub-components 208-1, 208-2, 208-n) may also include one or more antennas 166. In one exemplary embodiment of the invention, one or more antennas 166 may be configured for sub-component 208-1 (as shown), and / or for sub-component 208-2, configuring two sub-components 208-1, 208-2 and any combination thereof. In one exemplary embodiment of the invention, sub-components 208-1, 208-2 may utilize... Figure 12 The method described in the implementation scheme or any other implementation scheme as described herein is configured within card 100. Although Figure 15C An antenna 166 is shown configured for sub-component 208-1, but any number of antennas 166 can be configured for any sub-component 208-n or any combination of sub-components 208-n. It should also be understood that if module 208 may not include sub-components 204-n (e.g., similar to module 200), then one or more antennas 166 can be configured for module 208 in any manner. In this case, it can be as follows regarding... Figure 8 As described in the implementation scheme or any other implementation scheme described herein, module 208 is configured within card 100. It should also be understood that one or more antennas 166 may be configured with any module 200, 202, 204, 206, 208 in any manner as needed.

[0063] Furthermore, those skilled in the art will understand upon reading this specification that the various aspects of the embodiments described herein can be combined in any manner and in any combination. For example, one exemplary embodiment may include an integrated module that may include a visible portion of a contact plate 142 and a visible portion of an electronic reader 138 on the top surface of the smart card 100, and additionally, a visible portion of an additional electronic reader 138 on the bottom surface of the smart card 100. Another exemplary embodiment may include an integrated module that may include a visible portion of a contact plate 142 on the top of the smart card 100, and visible portions of one or more electronic readers on the same surface as the contact plate 142, on a different surface from the contact plate 142, or in any combination of surfaces of the contact plate 142. In this embodiment, the electronic reader may be located on a surface at any location and place relative to the contact plate 142. In another example, another exemplary embodiment may include an IC chip 146 typically located under, below, or behind the contact plate 142, and electronic components 146 typically located under, below, or behind the electronic display 138. In another exemplary embodiment, the IC chip 146 and electronic component 146 may typically be located under, below, or behind the electronic display 138. In another exemplary embodiment, the IC chip 146 may typically be located under, below, or behind the electronic display 138, and the electronic component 146 may typically be located under, below, or behind the contact plate 142. Furthermore, any portion of the IC chip 146 and / or any portion of the electronic component 146 may be located below the contact plate 142 and / or the electronic reader 138, or any combination thereof. Any and all combinations of any and all aspects of any or all exemplary embodiments described herein are covered by this specification.

[0064] As those skilled in the art will understand, software implementations may include firmware, resident software, microcode, etc. Certain components, including software or hardware or a combination of software and hardware, may generally be referred to herein as “circuit,” “module,” or “system.” Furthermore, the disclosed subject matter can be implemented as a computer program product embodied in one or more computer-readable storage media, on which implemented computer-readable program code is contained. Any combination of one or more computer-readable storage media may be utilized. The computer-readable storage medium may be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium may be, for example, but not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatuses, or devices, or any suitable combination thereof.

[0065] In the context of this document, a computer-readable storage medium can be any tangible medium that may contain or store a program for use by or associated with an instruction execution system, apparatus, or device. A computer-readable signal medium may include a propagated data signal carrying, for example, implemented computer-readable program code in baseband or as part of a carrier wave. Such a propagated signal may take any of a variety of forms, including, but not limited to, electromagnetic, optical, or any suitable combination thereof. A computer-readable signal medium may be any computer-readable medium that is not a computer-readable storage medium and can communicate, propagate, or transmit a program used by or associated with an instruction execution system, apparatus, or device.

[0066] The program code implemented on a computer-readable storage medium can be transmitted using any suitable medium, including but not limited to wireless, wired, fiber optic cable, RF, or any suitable combination thereof. The computer program code for performing the disclosed operations can be written in any combination of one or more programming languages, including object-oriented programming languages ​​(e.g., Java, Simaltalk, C++, etc.) and conventional procedural programming languages ​​(e.g., the "C" programming language or similar programming languages).

[0067] The program code can execute entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer can be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computer (e.g., via the Internet provided by an Internet service provider).

[0068] As used herein, the phrase "at least some" in the claims means "one or more," and includes the case of only one. Thus, for example, the phrase "at least some ABCs" means "one or more ABCs," and includes the case of only one ABC.

[0069] As used herein, the term "part" refers to some or all of "X". Therefore, for example, "part of X" can include some or all of "X". In the context of a session, the term "part" refers to some or all of the session.

[0070] As used herein, including in the claims, the phrase “based on” means “partially based on” or “at least partially based on” and is not exclusive. Thus, for example, the phrase “based on factor X” means “partially based on factor X” or “at least partially based on factor X.” Unless explicitly stated using the word “only,” the phrase “based on X” does not mean “based solely on X.”

[0071] As used herein, the phrase “use” in the claims means “at least use” and is not exclusive. Thus, for example, the phrase “use X” means “at least use X”. Unless explicitly stated by the use of the word “only”, the phrase “use X” does not mean “use only X”.

[0072] Generally, as used herein, "included" in the claims should not be interpreted as such unless the word "only" is explicitly used in the phrase.

[0073] As used herein, including in the claims, the phrase “different” means “at least partially different”. Unless explicitly stated otherwise, “different” does not mean “completely different”. Thus, for example, the phrase “X is different from Y” means “X is at least partially different from Y”, not “X is completely different from Y”. Therefore, as used herein, including in the claims, the phrase “X is different from Y” means that X is different from Y at least in some respects.

[0074] It should be understood that the words “first” and “second” in the specification and claims are used for distinction or identification, not to indicate a sequence or numerical limitation. Similarly, the use of alphanumeric labels (e.g., “(a)”, “(b)”, etc.) is used to aid in distinction and / or identification, not to indicate any sequence or numerical limitation or order.

[0075] Although the invention has been described in conjunction with embodiments currently considered to be the most practical and preferred, it should be understood that the invention is not limited to the disclosed embodiments, but rather is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

[0076] Although certain currently preferred embodiments of the invention have been described herein, it will be apparent to those skilled in the art that variations and modifications can be made to the described embodiments without departing from the spirit and scope of the invention.

[0077] For purposes of illustration and description, the foregoing description of preferred embodiments of the invention has been provided. It is not intended to be exhaustive or to limit the invention to the precise forms disclosed. Many modifications and variations are possible in accordance with the foregoing teachings. The scope of the invention is not limited by this detailed description, but rather by the appended claims and their equivalents.

Claims

1. An electronic module for a card, comprising: At least one integrated circuit chip; A contact plate having at least one integrated circuit chip; Multiple electronic components connected to the at least one integrated circuit chip; as well as At least one electronic display connected to the plurality of electronic components and / or the at least one integrated circuit chip; The electronic module configures the card, and at least a portion of the contact plate and at least a portion of the at least one electronic display are visible on a first surface of the card. The electronic module has a first sub-component embedded in the first surface of the card from the front, and a second sub-component embedded in the first surface of the card from the front and separately from the first sub-component. The sub-components are directly connected to each other to form a value-added smart card. Each of the first sub-component and the second sub-component includes any one of a contact plate, an electronic component, an electronic display, and an integrated circuit chip. The first sub-component and / or the second sub-component includes one or more antennas. The card includes one or more card antennas located within the card. The one or more antennas are connected to the one or more card antennas via inductive coupling.

2. The electronic module of claim 1, wherein, The first surface of the card is either the front or the back of the card.

3. The electronic module of claim 1 further includes an electrical connector configured to connect to other electronic components within the card.

4. The electronic module of claim 1, wherein, The packaged electronic module is connected to the embedded battery inside the card.

5. The electronic module of claim 1, wherein, The electronic display or contact plate of the packaged electronic module is replaced by at least one value-added component selected from the group consisting of: fingerprint sensor, LED, electronic button and mechanical button.

6. A method for assembling an electronic module within a card, the method comprising: (A) Provide a card; (B) Create an open area on the first surface of the card; (C) Embed the first sub-component of the electronic module into the first part of the open area; as well as (D) Embed the second sub-component of the electronic module into the second part of the open area; The first sub-component and the second sub-component of the electronic module are directly connected to each other by embedding them into an open area. Each of the first sub-component and the second sub-component includes any one of a contact plate, an electronic component, an electronic display, and an integrated circuit chip. The first sub-component and / or the second sub-component includes one or more antennas. The card includes one or more card antennas located within the card. The one or more antennas are connected to the one or more card antennas via inductive coupling.

7. The method of claim 6, wherein, The first surface is either the front or the back of the card.

Images