Vibration-damping assembly and network switching device

Abstract

The application provides a damping assembly and a network switching device, relates to the technical field of network devices, and aims to solve the technical problem of edge collapse of a switching chip. The network switching device comprises a connecting piece and a first elastic piece. The connecting piece is configured to at least penetrate a heat sink in a circuit board assembly. The first elastic piece is configured to be arranged between the side wall of the connecting piece and the heat sink, so as to limit the movement of the heat sink in a first direction, to relatively fix the heat sink and the switching chip located on one side of the heat sink, and to make the heat sink contact and connect with the switching chip in a second direction. The first direction and the second direction have an included angle. The application is used for avoiding the displacement of the heat sink relative to the switching chip during operation, so as to avoid the edge collapse of the switching chip, and to prolong the service life and performance of the switching chip.

Description

Technical Field

[0001] This application relates to the field of network equipment technology, and in particular to a vibration damping component and a network switching device. Background Technology

[0002] A network switching device (or simply switch) is a network hardware device that receives and forwards data to target devices through message exchange, enabling the connection of different devices on a computer network.

[0003] In related technologies, network switching equipment includes a backplane, a circuit board, a switching chip, and a heat sink. The circuit board is mounted on the backplane, the switching chip is mounted on the circuit board, and the heat sink is mounted on the switching chip. Both the heat sink and the circuit board have through holes for screws to pass through, allowing screws to connect to the backplane and secure the heat sink and circuit board. The heat sink dissipates heat from the switching chip. As the power consumption of switching chips increases, many manufacturers have begun to use bare chip packaging, i.e., bare chips without a metal casing, so that the switching chip can be directly exposed to the air to improve the heat dissipation efficiency of the switching chip.

[0004] However, in related technologies, the heat sink vibrates during heat dissipation, and the impact generated by the vibration of the heat sink will continuously rub against the switching chip, resulting in the problem of edge chipping of the switching chip. Summary of the Invention

[0005] In view of the above problems, this application provides a vibration damping component and a network switching device to prevent the heat sink from shifting relative to the switching chip during operation, thereby avoiding the problem of chip chip chip chipping and extending the service life and performance of the switching chip.

[0006] To achieve the above objectives, the embodiments of this application provide the following technical solutions:

[0007] A first aspect of this application provides a network switching device, including: a connector and a first elastic member, the connector being configured to penetrate at least a heat sink in a circuit board assembly; the first elastic member being configured to be disposed at least between a sidewall of the connector and the heat sink to restrict movement of the heat sink in a first direction, so that the heat sink is relatively fixed to a switching chip located on one side thereof, and the heat sink is in contact with the switching chip in a second direction; wherein, there is an angle between the first direction and the second direction.

[0008] In the vibration damping assembly provided in this application, a first elastic element is designed so that when the connector passes through at least the heat sink in the circuit board assembly, at least a portion of the first elastic element abuts against the sidewall between the heat sink and the connector to restrict the movement of the heat sink in a first direction. This fixes the heat sink relative to the switching chip located on one side, thereby preventing the heat sink from vibrating and displacing relative to the switching chip and causing friction on the switching chip. This also prevents the switching chip from chipping at the edges, thus extending the service life of the switching chip and improving its performance. In addition, due to the deformation of the first elastic element, when the connector passes through the heat sink and the first elastic element is located between the sidewall of the heat sink and the connector, the first elastic element can deform under the action of external force, so that the heat sink and the switching chip can make contact and connect. This avoids the problem that the heat sink is prone to tilting upwards and not making contact with the switching chip after the connector is connected to the backplate, thereby improving the heat dissipation effect.

[0009] In some alternative embodiments, the first elastic member includes one or more first elastic portions disposed between the sidewall of the connector and the heat sink; when the first elastic member includes multiple first elastic portions, the multiple first elastic portions are located on different sides of the connector.

[0010] In this way, the first elastic part abuts against the connector and the heat sink, which can further prevent the heat sink from vibrating and displacing.

[0011] In some alternative embodiments, each of the first elastic portions is connected to the sidewall of the connector, and the first elastic portion has a first arcuate protrusion protruding toward the heat sink side, the first arcuate protrusion being configured to abut against the heat sink.

[0012] In this way, the movement of the radiator can be restricted, while the contact area between the first elastic part and the radiator or the connector can be reduced, thus avoiding jamming between the first elastic part and the radiator and reducing the difficulty of disassembling and assembling the connector and the radiator.

[0013] In some alternative embodiments, the sidewall of the connector has a first mounting groove, and the first elastic part is movably mounted in the first mounting groove so that the first elastic part extends out of the first mounting groove or retracts into the first mounting groove under the action of force.

[0014] By providing a first mounting groove on the side wall of the connector, one end of the first elastic part is installed in the mounting groove. This makes the amount of expansion and contraction of the first elastic part between the connector and the heat sink adjustable. In addition, the reliability of the positioning and installation of the first elastic part can be improved.

[0015] In some alternative embodiments, a driving member is also included, which is disposed between the bottom of the first mounting groove and the first elastic portion, and the driving member is configured to drive the first elastic portion to extend toward a side away from the bottom of the first mounting groove.

[0016] In this way, the different gap sizes between the heat sink and the connector result in different extension amounts of the first elastic part driven by the drive component. Furthermore, during installation, the first elastic part can be positioned within the mounting groove under the push of an external force, thus avoiding the problem of jamming between the first elastic part and the heat sink, which would lead to difficulties in disassembly and assembly.

[0017] In some alternative embodiments, the drive element includes a spring disposed between the bottom of the first mounting groove and the first elastic portion.

[0018] By setting the driving component as an elastic component, the elastic component can drive the telescopic part to extend and retract through its own elastic force. The structure is simple, easy to implement, and low in cost.

[0019] In some alternative embodiments, at least one of the mounting groove and the telescopic portion is provided with a positioning structure, and the spring is connected to the positioning structure.

[0020] The positioning accuracy and reliability of the spring are improved by providing a positioning structure on at least one of the mounting groove and the first elastic part.

[0021] In some alternative implementations, the positioning structure is at least one of a positioning protrusion and a positioning groove.

[0022] By setting the positioning structure to at least one of positioning protrusions and positioning grooves, the structure is simple, easy to implement, and low in cost.

[0023] In some alternative implementations, the first elastic part is at least one of a ball and a telescopic spring.

[0024] By setting the first elastic part as at least one of a ball and a telescopic piece, the structure is simple, easy to implement, and low in cost.

[0025] In some alternative implementations, a second elastic element is also included; the connector is further configured to extend through the circuit board in the circuit board assembly, and the second elastic element is configured to be disposed at least between the sidewall of the connector and the circuit board to restrict movement of the circuit board in the first direction so that the circuit board is fixed relative to the switching chip.

[0026] This further restricts the movement between the connector and the circuit board in the circuit board assembly, fixing the circuit board relative to the connector. This, in turn, fixes the circuit board relative to the switching chip located on one side of it, preventing vibration of the switching chip relative to the heatsink and thus avoiding friction on the switching chip. This further prevents chip chip chipping, extending the lifespan of the switching chip and improving its performance.

[0027] In some alternative embodiments, the second elastic member includes one or more second elastic portions disposed between the sidewall of the connector and the circuit board; when the second elastic member includes multiple second elastic portions, the multiple second elastic portions are located on different sides of the connector.

[0028] In this way, the second elastic part abuts between the connector and the circuit board, which can further prevent the circuit board from vibrating and causing the switching chip to shift.

[0029] In some alternative embodiments, the sidewall of the connector has a second mounting groove, and the second elastic part is movably mounted in the second mounting groove so that the second elastic part extends out of the second mounting groove under force, or retracts into the second mounting groove.

[0030] In this way, the elastic extension of the second elastic part will vary depending on the size of the gap between the circuit board and the connector. When the connector is installed, the second elastic part can be positioned in the second mounting groove under the push of external force, so as to avoid the problem of the second elastic part getting stuck between the circuit board and the circuit board, which would lead to difficulties in disassembly and assembly.

[0031] A second aspect of this application provides a network switching device, a circuit board assembly, and a vibration damping component as described in the above embodiments; the circuit board assembly includes a heat sink and a switching chip, the switching chip being disposed on one side of the heat sink and connected to the heat sink, and the vibration damping component being configured to restrict the movement of the heat sink in a first direction, so that the heat sink is fixed relative to the switching chip, and the heat sink and the switching chip are in contact connection in a second direction.

[0032] In some alternative embodiments, the circuit board assembly further includes a circuit board, and the vibration damping component is configured to restrict movement of the circuit board in a first direction so that the circuit board is fixed relative to the switching chip.

[0033] The network switching device provided in this application embodiment has the same beneficial effects as the vibration damping component provided in the above embodiment, and will not be described again here.

[0034] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the vibration damping components and network switching equipment provided by the embodiments of this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further explained in detail in the specific implementation. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 A schematic diagram of a network switching device provided in an embodiment of this application;

[0037] Figure 2 This is another schematic diagram of the network switching device provided in the embodiments of this application;

[0038] Figure 3 Another schematic diagram of the network switching device provided in the embodiments of this application;

[0039] Figure 4 A schematic diagram of a network switching device provided in this application, in which an elastic element is disposed on a connector;

[0040] Figure 5 This is another schematic diagram of a network switching device provided in this application, in which the elastic element is disposed on the connector.

[0041] Figure label:

[0042] 100 - Network switching equipment;

[0043] 110 - Backplane; 120 - Circuit board; 130 - Switch chip;

[0044] 140 - Radiator; 141 - Heat dissipation fins;

[0045] 150 - Connector; 160 - First elastic element; 161 - First elastic part; 1611 - First arc-shaped protrusion;

[0046] 170 - Through hole; 170a - First through hole; 170b - Second through hole; 180 - Substrate; 190 - Thermally conductive layer; 200 - Second elastic element; 210 - Second elastic part;

[0047] 211 - Second arc-shaped protrusion. Detailed Implementation

[0048] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0049] A network switching device (or simply switch) is a network hardware device that receives and forwards data to target devices through message exchange, enabling the connection of different devices on a computer network.

[0050] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0051] This application provides a network switching device, which can be any type of switch, such as an access layer switch, an aggregation layer switch, or a core layer switch. Furthermore, the network switching device provided in this application can be applied to any scenario requiring a network system, such as a data center.

[0052] Please refer to Figure 1 As shown in the embodiment of this application, the network switching device 100 includes: a circuit board 120 and a switching chip 130 disposed on the circuit board 120. The circuit board 120 can be a printed circuit board (PCB). The switching chip 130 is electrically connected to the circuit board 120 and is used to realize, for example, data reception and forwarding. As the integration of the switching chip 130 increases, the power consumption of the switching chip 130 increases. When the temperature of the switching chip 130 reaches a certain level, it will affect the working performance of the switching chip 130.

[0053] like Figure 1 As shown, a substrate 180 is also provided between the circuit board 120 and the switching chip 130. The switching chip 130 is packaged with the substrate 180, and the substrate 180 is electrically connected to the circuit board 120 by, for example, solder balls.

[0054] In order to improve the heat dissipation of the switching chip 130, in some embodiments, the switching chip 130 can be packaged as a bare chip, that is, no metal casing is provided on the outer periphery of the switching chip 130 for packaging. In this way, the switching chip 130 is directly exposed to the air, thereby reducing the thermal resistance of the switching chip 130 itself and improving the heat dissipation efficiency.

[0055] To further improve the heat dissipation efficiency of the switching chip 130, in some embodiments, please continue to refer to... Figure 1 As shown, a heat sink 140 can be provided on the side of the switching chip 130 away from the circuit board 120. The heat sink 140 can be in contact with the switching chip 130. In this way, in addition to dissipating heat by being exposed to the air, the switching chip 130 can also transfer heat to the heat sink 140 for heat dissipation, thereby achieving the purpose of further cooling the switching chip 130 and improving the cooling efficiency.

[0056] The radiator 140 can be a metal radiator 140 with good thermal conductivity. For example, the radiator 140 can be made of copper, aluminum, aluminum alloy, copper alloy, etc., as long as it can conduct heat quickly. There are no restrictions here.

[0057] It is understandable that by setting a heat sink 140 on the side of the switching chip 130 away from the circuit board 120, the heat of the switching chip 130 can be quickly transferred to the heat sink 140. The heat sink 140 can also increase the heat dissipation area of ​​the switching chip 130, thereby achieving the purpose of rapid cooling.

[0058] For example, such as Figure 1 As shown, multiple heat dissipation fins 141 can be provided on the side of the heat sink 140 away from the switching chip 130 to increase the heat dissipation area and thus improve the heat dissipation efficiency of the switching chip 130.

[0059] To avoid direct contact between the heat sink 140 and the switching chip 130, which could damage the structure of the switching chip 130, please refer to the embodiments of this application. Figure 1 As shown, a thermally conductive layer 190 is provided between the heat sink 140 and the switching chip 130. The thermally conductive layer 190 can be made of a thermally conductive material with a certain elasticity. For example, the thermally conductive layer 190 can be a heat dissipation gel coated on the switching chip 130. In this way, the heat dissipation gel can directly transfer the heat of the switching chip 130 to the heat sink 140 to improve the heat conduction and thus improve the heat dissipation efficiency.

[0060] Since the heatsink 140 will experience vibration and impact during operation, in order to improve the reliability of the relative position between the heatsink 140 and the switching chip 130, please continue to refer to... Figure 1As shown in this embodiment, a backplate 110 is provided on the side of the circuit board 120 away from the switching chip 130. For example, the backplate 110 can be a metal backplate 110 to provide a support base for components such as the circuit board 120, switching chip 130, and heat sink 140 located on the backplate 110. In addition, by connecting the heat sink 140 to the backplate 110, the purpose of fixing the heat sink 140 is achieved.

[0061] In some embodiments, such as Figure 1 As shown, the network switching device 100 also includes a connector 150. For example, the connector 150 includes, but is not limited to, a threaded connector 150, a riveting member, etc. The heat sink 140 and the circuit board 120 both have through holes 170 along the second direction through which the connector 150 can pass. In this way, the connector 150 passes through the through holes 170 on the heat sink 140 and the circuit board 120 in sequence and connects to the back plate 110, thereby achieving the purpose of fixing the heat sink 140. The second direction is, for example, the direction perpendicular to the circuit board 120.

[0062] For ease of description, the through hole 170 on the heat sink 140 is referred to as the first through hole 170a, and the through hole 170 on the circuit board 120 is referred to as the second through hole 170b.

[0063] To facilitate the connection 150 passing through the heat sink 140 and the circuit board 120, the diameter of the through hole 170 on the heat sink 140 and the circuit board 120 through which the connection 150 can pass is larger than the cross-sectional size of the connection 150. This allows the connection 150 to pass smoothly through the through hole 170 or be removed from the through hole 170. Therefore, there is a gap between the connection 150 and the hole wall of the through hole 170, that is, there is a gap between the connection 150 and the first through hole 170a and the second through hole 170b respectively.

[0064] However, the gap between the connector 150 and the hole wall of the through hole 170 causes the heat sink 140 to be displaced relative to the switching chip 130 in the axial direction (second direction) perpendicular to the through hole 170 during vibration and impact when it starts to dissipate heat from the switching chip 130. This causes the heat sink 140 to move relative to the switching chip 130 in the first direction, where the second direction is perpendicular to the first direction. As the heat sink 140 moves relative to the switching chip 130 in the first direction, it will continuously rub against the switching chip 130, resulting in chipping of the edge of the unencapsulated metal casing of the switching chip 130. This will shorten the service life of the switching chip 130 and reduce its performance.

[0065] In some embodiments, an elastic pad may be provided around the connector 150. When the connector 150 is inserted into the through hole 170, the elastic pad fills the gap between the hole wall of the through hole 170 and the connector 150. However, to completely fill the gap between the connector 150 and the hole wall of the through hole 170, although the elastic pad has a certain elasticity, it is still difficult for the connector 150 to be inserted into the through hole 170. When the connector 150 is inserted into the through hole 170, the connector 150 and the hole wall of the through hole 170 may become stuck, which may cause the heat sink 140 to tilt upwards and fail to make contact with the switching chip 130. If the thickness of the elastic pad is less than the size of the gap between the hole wall of the through hole 170 and the connector 150, the heat sink 140 will still be displaced in the first direction, causing the chip edge to chip.

[0066] Therefore, this application needs to solve the problem of displacement between the switching chip 130 and the heat sink 140 along the first direction, avoiding the problem of edge chipping of the switching chip 130 due to continuous friction between the heat sink 140 and the switching chip 130. Simultaneously, it needs to reduce the difficulty of the connector 150 passing through the heat sink 140 and the circuit board 120 sequentially, avoiding the problem of jamming between the connector 150 and the hole wall of the through hole 170, and also avoiding the problem of the heat sink 140 tilting upwards due to jamming between the connector 150 and the hole wall of the through hole 170, thus preventing the heat sink 140 from contacting and connecting with the switching chip 130. In this application, the implementation... In the example, the contact connection between the heat sink 140 and the switching chip 130 refers to the direct contact connection between the heat sink 140 and the switching chip 130, or the contact connection between the heat sink 140 and the switching chip 130 through the thermal conductive layer 190. That is, when there is no thermal conductive layer 190 between the heat sink 140 and the switching chip 130, the heat sink 140 and the switching chip 130 are directly contacted. When there is a thermal conductive layer 190 between the heat sink 140 and the switching chip 130, it is necessary to ensure that the heat sink 140 and the thermal conductive layer 190 are in contact, and that the thermal conductive layer 190 and the switching chip 130 are in contact, in order to improve the heat dissipation effect and efficiency of the switching chip 130.

[0067] Based on the above-mentioned technical problems to be solved, please refer to Figure 2 and Figure 3As shown in the embodiment of this application, a vibration damping component is provided in the network switching device 100. The vibration damping component includes a first elastic member 160. For example, a first elastic member 160 can be provided on at least one of the connector 150 and the hole wall of the first through hole 170a. The first elastic member 160 is configured to elastically extend and retract at least along a first direction. For example, the first elastic member 160 can elastically extend and retract in the first direction, and it can also elastically extend and retract in a second direction, and it can also elastically extend and retract in any direction between the first direction and the second direction. When the connector 150 passes through the first through hole 170a, the first elastic member 160 can extend and retract according to the first through hole. The size of the gap between the hole wall of 170a and the connector 150 is adjusted by the amount of expansion and contraction, so that at least a portion of the first elastic member 160 abuts against the hole wall of the first through hole 170a and the side wall of the connector 150, thereby restricting the movement of the heat sink 140 in the first direction. In this way, while restricting the movement of the heat sink 140 in the first direction, the elastic deformation of the first elastic member 160 itself will not cause the connector 150 to jam with the hole wall of the first through hole 170a. Therefore, the position of the heat sink 140 can be adjusted at all times so that the heat sink 140 contacts and connects with the switching chip 130, ensuring the heat dissipation efficiency of the heat sink 140 for the switching chip 130.

[0068] In other words, when the heat sink 140 is directly mounted on the switching chip 130, the elastic deformation of the first elastic member 160 adjusts the position of the heat sink 140 and the switching chip 130 in the second direction, so that the heat sink 140 contacts and connects with the switching chip 130 in the second direction. When a heat-conducting layer 190 is provided between the heat sink 140 and the switching chip 130, the heat-conducting layer 190 contacts and connects with the switching chip 130, while the heat sink 140 directly contacts the heat-conducting layer 190. This can prevent the heat sink 140 from continuously rubbing against the switching chip 130 in the second direction, while reducing the difficulty of moving the connector 150 through the heat sink 140 and the circuit, and ensuring that the heat sink 140 and the switching chip 130 are in direct or indirect contact, thereby improving heat dissipation efficiency and effect.

[0069] In some embodiments, the first elastic element 160 is disposed on the side wall of the connector 150 to facilitate the assembly and disassembly of the first elastic element 160 and reduce the difficulty of the process.

[0070] Understandably, when the connector 150 needs to pass through the through hole 170, if the dimension of the connector 150 in the first direction is smaller than the diameter of the first through hole 170a, and the total dimension of the connector 150 and the first elastic member 160 in the first direction is larger than the diameter of the first through hole 170a, the first elastic member 160 will elastically contract under the compressive force, allowing the connector 150 to pass through the first through hole 170a. At least part of the first elastic member 160 will abut against the wall of the first through hole 170a and the side wall of the connector 150. This reduces the difficulty of assembling and disassembling the connector 150, and also prevents the connector 150 from getting stuck between itself and the wall of the first through hole 170a, which could cause the heat sink 140 to tilt upwards, preventing the heat sink 140 from connecting to the switching chip. The problem of heat dissipation being affected by the inability of the 130 to make contact is addressed in this embodiment. A retractable first elastic element 160 is provided on at least one of the connector 150 and the hole wall of the first through hole 170a. When the heat sink 140 is in operation, the first elastic element 160 can restrict the displacement of the heat sink 140 relative to the switching chip 130 in the first direction, while ensuring contact between the heat sink 140 and the switching chip 130. This ensures the heat dissipation effect of the heat sink 140 on the switching chip 130 while preventing friction caused by the movement of the heat sink 140 relative to the switching chip 130. This avoids chipping of the switching chip 130, thereby extending its service life and improving its performance.

[0071] Additionally, it should be noted that since the first elastic member 160 can elastically extend and retract along the first direction, in this embodiment, the elastic extension and retraction amount of the first elastic member 160 can be adjusted according to the size between the side wall of the connector 150 and the hole wall of the first through hole 170a, so as to adapt to the connector 150 passing through the first through hole 170a with different diameters. This can meet the needs of different occasions and avoid the problem of the connector 150 getting stuck between the hole wall of the first through hole 170a, causing the heat sink 140 to tilt upwards and fail to contact and connect with the switching chip 130.

[0072] The first elastic element 160 can be made of elastic materials such as rubber or silicone to form an elastic element. In this way, the first elastic element 160 can extend and retract along the first direction under the action of external force or its own elastic force. Of course, a driving element can also be provided to apply a stretching driving force to the first elastic element 160 to drive the first elastic element 160 to extend and retract along the first direction. The specific design can be based on actual needs, as long as it can extend and retract along the first direction, there are no restrictions here.

[0073] It should be noted that, in the embodiments of this application, the first elastic member 160 includes, but is not limited to, elastic extension and contraction along the first direction, and can also elastically extend and contract along any other direction, so that the heat sink 140 and the switching chip 130 are relatively fixed, while the heat sink 140 and the switching chip 130 are in direct contact, increasing the contact area, so as to improve the heat dissipation effect of the heat sink 140 on the switching chip 130.

[0074] In some embodiments, such as Figures 2 to 5 As shown, each first elastic member 160 includes two first elastic portions 161. With the axis of the first through hole 170a as the center of symmetry, when the connector 150 passes through the first through hole 170a, the two first elastic portions 161 can be symmetrically arranged on opposite sides of the connector 150. In this way, the extension and retraction of the two first elastic portions 161 can be determined according to the gap between the opposite sides of the connector 150 and the corresponding hole wall of the first through hole 170a, so as to limit the heat sink 140 in the first direction. It is not necessary to fill the entire gap between the connector 150 and the hole wall of the first through hole 170a with elastic portions, which reduces material costs. In addition, it reduces the smoothness of the connector 150 passing through the through hole 170.

[0075] In some embodiments, the two first elastic portions 161 of each first elastic member 160 are located on opposite sides of the connector 150 and connected to the wall of the first through hole 170a, so that the first elastic portion 161 can extend or retract toward the connector 150 or away from the connector 150. When the connector 150 passes through the first through hole 170a, the first elastic portion 161 can elastically deform under the pushing action of the connector 150, avoiding jamming between the connector 150 and the first elastic portion 161, so that the connector 150 can pass smoothly through the first through hole 170a. When the connector 150 is connected to the back plate 110, the first elastic portion 161 can abut against the wall of the first through hole 170a and the connector 150 to limit the movement of the heat sink 140 in the first direction, preventing the heat sink 140 from displacing relative to the switching chip 130 in the first direction, and allowing the heat sink 140 and the switching chip 130 to contact and connect without affecting the heat dissipation effect of the heat sink 140 on the switching chip 130.

[0076] In other embodiments, such as Figure 4 and Figure 5As shown, the two first elastic portions 161 of each first elastic member 160 are respectively disposed on opposite sides of the connector 150 and connected to its sidewall. The first elastic portions 161 can extend or retract toward or away from the hole wall of the through hole 170, so that when the connector 150 carries the first elastic portions 161 through the first through hole 170a, the first elastic portions 161 are elastically deformed along the first direction under the squeezing action of the hole wall of the first through hole 170a, so that the connector 150 can pass smoothly through the first through hole 170a, avoiding the problem of the connector 150 getting stuck or even jammed and unable to pass through the hole wall of the first through hole 170a.

[0077] In some embodiments, each first elastic portion 161 is disposed on one of the hole wall of the first through hole 170a and the connector 150, and has a first arc-shaped protrusion 1611 protruding toward the other. The first arc-shaped protrusion 1611 abuts against the other of the hole wall of the first through hole 170a and the connector 150. It can be understood that by setting part of the structure of each first elastic portion 161 as a first arc-shaped protrusion 1611, the contact area when the first elastic portion 161 abuts against the hole wall of the first through hole 170a or the connector 150 can be reduced. In this way, the movement of the heat sink 140 in the second direction can be restricted, and the first elastic portion 161 can be prevented from getting stuck with the hole wall of the first through hole 170a or the connector 150, thereby reducing the difficulty of disassembling and assembling the connector 150.

[0078] For example, the arc-shaped profile of the first arc protrusion 1611 can be a circular arc, an elliptical arc, or other structures, without any specific limitations.

[0079] In some embodiments, a first mounting groove (not shown in the figure) is provided on one of the hole wall of the first through hole 170 and the connector 150, and one end of the first elastic part 161 is installed in the first mounting groove, thereby improving the installation reliability of the first elastic part 161.

[0080] In some embodiments, the first elastic part 161 can retract at least partially into the first mounting groove along the second direction under the action of a force, or extend out of the first mounting groove under the action of a force. The length of the first elastic part 160 extending out of the first mounting groove can be adjusted according to the size of the gap between the outer wall of the connector 150 and the hole wall of the first through hole 170a. That is, the elastic deformation of the first elastic part 161 is different depending on the size of the gap between the hole wall of the first through hole 170a and the connector 150. For example, when the connector 150 is installed, the first elastic part 161 can be located in the mounting groove under the push of an external force to avoid the problem of difficulty in disassembly and assembly caused by jamming between the first elastic part 161 and the hole wall of the first through hole 170a or the connector 150.

[0081] For example, the side wall of the connector 150 has a first mounting groove, and the first elastic part 161 is movably installed in the first mounting groove so that the first elastic part 161 extends out of the first mounting groove under the action of force, or retracts into the first mounting groove. It can be understood that by providing a first mounting groove on the side wall of the connector 150 and installing the first elastic part 161 in the first mounting groove, the installation difficulty of the first elastic part 161 is reduced.

[0082] In some embodiments, a driving member (not shown) is also included. The driving member is disposed between the bottom of the first mounting groove and the first elastic portion 161. The driving member is configured to at least drive the first elastic portion 161 to extend away from the bottom of the first mounting groove. In this way, by disposing the driving member between the bottom of the first mounting groove and the first elastic portion 161, the extension amount of the first elastic portion 161 can be determined according to the size of the gap between the connector 150 and the wall of the first through hole 170a. At the same time, the problem of jamming between the first elastic portion 161 and the wall of the first through hole 170a and the connector 150 can be avoided when the connector 150 is disassembled or assembled.

[0083] For example, the driving component is a structure such as a spring or a hydraulic rod. Taking the driving component as a spring, the spring is disposed between the bottom of the first mounting groove and the first elastic part. When the first elastic part 160 retracts into the first mounting groove under the pushing action of an external force, the spring is in a compressed state. When the first elastic part 161 is not subject to the external pushing force, the first elastic part 161 extends out of the first mounting groove under the elastic force of the spring itself, so that at least a part of the structure of the first elastic part 160 is located between the hole wall of the first through hole 170a and the connector 150, so as to restrict the radiator 140 in the first direction to avoid the radiator 140 from being displaced in the first direction. Moreover, the extension and retraction method of driving the first elastic part 160 is simple, easy to implement, and low in cost.

[0084] In addition, in order to improve the installation reliability of the elastic element, in some embodiments, at least one of the first mounting groove and the first elastic part 161 is provided with a positioning structure (not shown in the figure), and the elastic element is connected to the positioning structure. It can be understood that by providing a positioning structure on at least one of the first mounting groove and the first elastic part 161, the positioning accuracy and reliability of the elastic element are improved, thereby improving the extension and retraction reliability of the first elastic part 161.

[0085] The positioning structure can be at least one of a positioning protrusion or a positioning groove. When the positioning structure is a positioning protrusion, the end of the spring near the positioning protrusion is sleeved on the positioning protrusion to limit the circumferential movement of the spring. When the positioning structure is a positioning groove, one end of the spring is located in the positioning groove to limit the circumferential movement of the spring through the groove wall of the positioning groove, thereby improving the reliability of the spring's installation position. The positioning method is simple, easy to implement, and low in cost.

[0086] Of course, a driving component may not be provided. Instead, the first elastic part 161 can abut against the hole wall of the first through hole 170a and the connector 150 through its own elasticity, so as to restrict the movement of the heat sink 140 in the first direction and make the heat sink 140 contact and connect with the switching chip 130.

[0087] For example, the first elastic portion 161 can be at least one of a ball and a telescopic spring; for example, in Figure 2 and Figure 4 In the middle, the first elastic part 161 is a marble with an arc-shaped outline, while... Figure 3 and Figure 5 In the first elastic part 161, a telescopic spring is formed. When the first elastic element 160 is a telescopic spring, both ends of the telescopic spring are connected to one of the connecting member 150 and the hole wall of the first through hole 170a, respectively. The area between the two ends of the telescopic spring is formed into a first arc-shaped protrusion 1611 that bends toward the other of the hole wall of the connecting member 150 and the first through hole 170a. The first arc-shaped protrusion 1611 is configured to elastically deform along a first direction under the action of force.

[0088] For example, in Figure 2 and Figure 4 In the process, the connector 150 is provided with four balls. The side of the ball facing the hole wall of the first through hole 170a is arc-shaped to form a first arc-shaped protrusion 1611. Two of the four balls form a first elastic element 160. Two balls in the first elastic element 160 are symmetrically arranged on opposite sides of the connector 150, located between the hole wall of the first through hole 170a in the radiator 140 and the connector 150, and abut against the hole wall of the first through hole 170a to limit the radiator 140 in the first direction.

[0089] exist Figure 3 and Figure 5In the connector 150, four telescopic springs are provided. Two of the four telescopic springs form a first elastic element 160. Two telescopic springs in the first elastic element 160 are symmetrically arranged on opposite sides of the connector 150, and the two ends of the telescopic springs are fixedly connected to the connector 150, so that the area between the two ends of the telescopic springs bends toward the wall of the first through hole 170a to form a first arc-shaped protrusion 1611. The first arc-shaped protrusion 1611 abuts against the wall of the first through hole 170a to limit the radiator 140 in the first direction.

[0090] The number of the first elastic part 161 can be 4, 2 or any other number, as long as it can restrict the movement of the heat sink 140 in the first direction, without affecting the heat dissipation effect of the heat sink 140, and reduce the difficulty of disassembling and assembling the connector 150 with the heat sink 140 respectively. There are no restrictions here.

[0091] In addition, the vibration damping assembly also includes a second elastic element 200. For example, the second elastic element 200 is disposed on at least one of the wall of the connector 150 and the second through hole 170b. The second elastic element 200 is configured to elastically extend and retract at least along a first direction. For example, the second elastic element 200 can elastically extend and retract in the first direction, or in the second direction, or in any direction between the first and second directions. When the connector 150 passes through the second through hole 170b, the second elastic element 200 can adjust the amount of extension and retraction according to the size of the gap between the wall of the second through hole 170b and the connector 150, so that at least a portion of the second elastic element 200 abuts against the wall of the second through hole 170b and the side wall of the connector 150, thereby restricting the movement of the circuit board 120 in the first direction, so that there is no relative movement between the circuit board 120 and the switching chip 130, thereby avoiding the problem of the switching chip 130 chipping due to the movement of the circuit board 120 relative to the switching chip 130.

[0092] In some embodiments, the second elastic member 200 includes one or more second elastic portions 210, which are disposed between the sidewall of the connector 150 and the circuit board 120. When the second elastic member 200 includes multiple second elastic portions 210, the multiple second elastic portions 210 are located on different sides of the connector 150 to adjust the gap between the connector 150 and the hole wall of the second through hole 170b through the multiple second elastic portions 210, so that there is no relative movement between the circuit board 120 and the switching chip 130.

[0093] In some embodiments, the second elastic member 200 is mounted on the side wall of the connector 150. For example, the side wall of the connector 150 has a second mounting groove, and the second elastic part 210 is movably mounted in the second mounting groove so that the second elastic part 210 extends out of the second mounting groove under the action of force, or retracts into the second mounting groove. In this way, the connection reliability between the second elastic member 200 and the connector 150 is improved, and the elastic extension amount of the second elastic part 210 is different depending on the size of the gap between the circuit board 120 and the connector 150. When the connector is installed, the second elastic part 210 can be located in the second mounting groove under the push of the external force, so as to avoid the problem of the second elastic part 210 getting stuck between the second elastic part 210 and the hole wall of the second through hole 170b, which would lead to difficulties in disassembly and assembly.

[0094] In addition, a spring can be provided between the bottom of each second mounting groove and the corresponding second elastic part 210. The spring can drive the extension of the second elastic part 210 through its own elastic force, so that the elastic extension and contraction of the second elastic part 210 can be further adjusted to meet the needs of the gap change between the connector 150 and the circuit board 120.

[0095] For example, the second elastic portion 210 can be at least one of a ball and a telescopic spring; for example, in Figure 2 and Figure 4 In the middle, the second elastic part 210 is a marble with an arc-shaped outline, while... Figure 3 and Figure 5 In this design, the second elastic portion 210 is a telescopic spring. When the second elastic portion 210 is a telescopic spring, both ends of the telescopic spring are connected to one of the walls of the connector 150 and the second through hole 170b, respectively. The area between the two ends of the telescopic spring is formed into a second arc-shaped protrusion 211 that bends toward the other of the walls of the connector 150 and the second through hole 170b. The second arc-shaped protrusion 211 is configured to elastically deform along a first direction under the action of force, so as to further reduce the contact area between the second elastic portion 210 and the second through hole 170b, thereby avoiding the problem of jamming between the second elastic portion 210 and the second through hole 170b.

[0096] For example, in Figure 2 and Figure 4In the connector 150, four second elastic parts 210 are provided. Each of the four second elastic parts 210 is a ball. The side of the ball facing the hole wall of the second through hole 170b is arc-shaped to form a second arc-shaped protrusion 211. Two of the four balls form a second elastic element 200. Two balls in a second elastic element 200 are symmetrically arranged on opposite sides of the connector 150 to be located between the hole wall of the second through hole 170b in the circuit board 120 and the connector 150, and to abut against the hole wall of the second through hole 170b to limit the circuit board 120 in the first direction.

[0097] exist Figure 3 and Figure 5 In the connector 150, four second elastic parts 210 are provided. Each of the four second elastic parts 210 is a telescopic spring. Two of the four telescopic springs form a second elastic element 200. Two telescopic springs in a second elastic element 200 are symmetrically arranged on opposite sides of the connector 150, and the two ends of the telescopic springs are fixedly connected to the connector 150, so that the area between the two ends of the telescopic springs bends toward the wall of the second through hole 170b to form a second arc-shaped protrusion 211. The second arc-shaped protrusion 211 abuts against the wall of the second through hole 170b to limit the circuit board 120 in the first direction.

[0098] The number of the second elastic part 210 can be 4, 2 or any other number, as long as it can restrict the movement of the circuit board 120 in the first direction and reduce the difficulty of assembling and disassembling the connector 150 from the circuit board 120. No restrictions are imposed here.

[0099] In summary, the network switching device provided in this application, by providing a first elastic member on at least one of the through-hole wall and the connector, allows for elastic extension and retraction. When the connector passes through the through-hole in the circuit board assembly and connects to the backplane, the first elastic member at least partially abuts against the heat sink and the connector in the circuit board assembly. Because the first elastic member is elastic, the difficulty of assembling and disassembling the connector is reduced, and the problem of the heat sink tilting upwards and failing to contact the switching chip after the connector is connected to the backplane is avoided, thus improving heat dissipation. Furthermore, when the heat sink is in operation, its movement in the direction perpendicular to the through-hole is restricted, while ensuring that the heat sink contacts the switching chip along the axial direction of the through-hole. This ensures the heat dissipation effect of the heat sink on the switching chip while preventing friction caused by the heat sink moving relative to the switching chip, thereby preventing chipping of the switching chip, extending its service life, and improving its performance.

[0100] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0101] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0102] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A vibration damping component, characterized in that, include: A connector (150) configured to penetrate at least through a heat sink (140) in a circuit board assembly; A first elastic member (160) is configured to be disposed at least between the sidewall of the connector (150) and the heat sink (140) to restrict the movement of the heat sink (140) in a first direction, so that the heat sink (140) is fixed relative to the switching chip (130) located on one side thereon, and the heat sink (140) is in contact with the switching chip (130) in a second direction. There is an angle between the first direction and the second direction.

2. The vibration damping component according to claim 1, characterized in that, The first elastic member (160) includes one or more first elastic portions (161), which are disposed between the side wall of the connector (150) and the heat sink (140); When the first elastic member (160) includes a plurality of first elastic portions (161), the plurality of first elastic portions (161) are located on different sides of the connector (150).

3. The vibration damping component according to claim 2, characterized in that, Each of the first elastic portions (161) is connected to the sidewall of the connector (150), and the first elastic portion (161) has a first arcuate protrusion (1611) protruding toward the side of the heat sink (140), the first arcuate protrusion (1611) being configured to abut against the heat sink (140).

4. The vibration damping component according to claim 3, characterized in that, The connector (150) has a first mounting groove on its side wall, and the first elastic part (161) is movably mounted in the first mounting groove so that the first elastic part (161) extends out of the first mounting groove or retracts into the first mounting groove under the action of force.

5. The vibration damping component according to claim 4, characterized in that, It also includes a driving member disposed between the bottom of the first mounting groove and the first elastic part (161), the driving member being configured to drive the first elastic part (161) to extend toward the side away from the bottom of the first mounting groove.

6. The vibration damping component according to claim 5, characterized in that, The driving component includes a spring disposed between the bottom of the first mounting groove and the first elastic part (161).

7. The vibration damping component according to claim 6, characterized in that, A positioning structure is provided on at least one of the first mounting groove and the first elastic part (161), and the spring is connected to the positioning structure.

8. The vibration damping component according to claim 7, characterized in that, The positioning structure includes at least one of a positioning protrusion and a positioning groove.

9. The vibration damping component according to any one of claims 2-8, characterized in that, The first elastic part (161) includes at least one of a ball and a telescopic spring.

10. The vibration damping component according to any one of claims 1-8, characterized in that, It also includes a second elastic element (200); The connector (150) is also configured to pass through the circuit board (120) in the circuit board assembly, and the second elastic member (200) is configured to be disposed at least between the sidewall of the connector (150) and the circuit board (120) to restrict the movement of the circuit board (120) in the first direction so that the circuit board (120) is relatively fixed to the switching chip (130).

11. The vibration damping component according to claim 10, characterized in that, The second elastic member includes one or more second elastic portions (210), which are disposed between the sidewall of the connector (150) and the circuit board (120); When the second elastic member (200) includes a plurality of second elastic portions (210), the plurality of second elastic portions (210) are located on different sides of the connector (150).

12. The vibration damping component according to claim 11, characterized in that, The connector (150) has a second mounting groove on its side wall, and the second elastic part (210) is movably mounted in the second mounting groove so that the second elastic part (210) extends out of the second mounting groove or retracts into the second mounting groove under the action of force.

13. A network switching device, characterized in that, include: Circuit board assembly and vibration damping assembly as described in any one of claims 1-12; The circuit board assembly includes a heat sink (140) and a switching chip (130), the switching chip (130) being disposed on one side of the heat sink (140) and connected to the heat sink (140), and the vibration damping assembly being configured to restrict the movement of the heat sink (140) in a first direction, so that the heat sink (140) is fixed relative to the switching chip (130), and the heat sink (140) and the switching chip (130) are in contact connection in a second direction.

14. The network switching device according to claim 13, characterized in that, The circuit board assembly further includes a circuit board (120), and the vibration damping component is configured to restrict the movement of the circuit board (120) in a first direction so that the circuit board (120) is fixed relative to the switching chip (130).

Images