A wearable device

Abstract

Embodiments of the present specification provide a wearable device, comprising an image signal sensor, a main chip, a storage chip, and an image signal processing chip. The image signal processing chip is configured to process an image signal output by the image signal sensor to generate image data. The main chip is configured to control a mounting state of the storage chip. The mounting state comprises a first mounting state when the storage chip is mounted to the main chip, and a second mounting state when the storage chip is mounted to the image signal processing chip. The second mounting state allows the image signal processing chip to transmit the image data to the storage chip. The first mounting state allows the main chip to read the image data in the storage chip.

Description

Technical Field

[0001] This application relates to the field of chips, and in particular to a chip solution for integrating image signal processing functions in wearable devices. Background Technology

[0002] With the continuous development of electronic devices, wearable devices with camera functions (such as smart glasses) are gradually becoming indispensable social and entertainment tools in people's daily lives, and people's requirements for wearable devices are also increasing. However, existing wearable devices still have many problems, such as excessive chip performance, high power consumption, and high price. Therefore, there is a need to provide a wearable device that can fully utilize the chip's capabilities and avoid performance waste. Summary of the Invention

[0003] This specification provides a wearable device including an image signal sensor, a main chip, a storage chip, and an image signal processing chip. The image signal processing chip is configured to process the image signal output by the image signal sensor to generate image data. The main chip is configured to control the mounting state of the storage chip. The mounting states include a first mounting state when the storage chip is mounted to the main chip, and a second mounting state when the storage chip is mounted to the image signal processing chip. The second mounting state allows the image signal processing chip to transmit the image data to the storage chip, and the first mounting state allows the main chip to read the image data from the storage chip. By switching the mounting state of the storage chip to control whether image data is stored in or read from the storage chip, the functionality of each chip can be fully utilized, avoiding performance waste. Simultaneously, it can also avoid the transmission of large amounts of data between the image signal processing chip and the main chip, thereby reducing problems such as high power consumption and unreliability caused by large data transmission.

[0004] In some embodiments, the main chip includes a first communication module, and when the storage chip is in the first mounted state, the main chip is configured to transmit the image data to an external device through the first communication module.

[0005] In some embodiments, when the storage chip is in the first mounted state, the image signal processing chip is in a power-off state or a low-power state to reduce chip power consumption.

[0006] In some embodiments, when the memory chip is in the second mounted state, the first communication module of the main chip is disabled to reduce chip power consumption.

[0007] In some embodiments, the main chip further includes a second communication module, wherein when the storage chip is in the second mounted state, the main chip is configured to communicate with the external device through the second communication module.

[0008] In some embodiments, the first communication module includes a Wi-Fi module, and the second communication module includes a Bluetooth module.

[0009] In some embodiments, when the storage chip is in the second mounted state, in response to the main chip receiving a preset signal through the second communication module, the image signal processing chip suspends operation to prevent users from missing important information and improve user experience.

[0010] In some embodiments, the main chip sends instructions to the image signal processing chip via dual-core communication, the instructions including instructing the image signal processing chip to control the image signal sensor to take pictures or record videos.

[0011] In some embodiments, the dual-core communication includes at least one of the following: Serial Peripheral Interface (SPI), Universal Asynchronous Receiver / Transmitter (UART) protocol, and Universal Input / Output Port (GPIO) protocol.

[0012] In some embodiments, the image signal processing chip includes a third communication module, and when the storage chip is in the second mounted state, the image signal processing chip is configured to transmit the image data to an external device through the third communication module.

[0013] In some embodiments, when the storage chip is in the second mounted state, the main chip transmits an instruction to the image processing chip to enable or disable the third communication module.

[0014] In some embodiments, the wearable device further includes a button configured to trigger a switching between the first mounting state and the second mounting state of the storage chip.

[0015] This specification provides a control method for a wearable device. The wearable device includes an image signal sensor, a main chip, a storage chip, and an image signal processing chip. The method includes: in response to a user's instruction to the image signal sensor to acquire image signals, obtaining the mounting state of the storage chip, the mounting state including a first mounting state when the storage chip is mounted to the main chip, and a second mounting state when the storage chip is mounted to the image signal processing chip, the second mounting state allowing the image signal processing chip to transmit image data to the storage chip, and the first mounting state allowing the main chip to read the image data from the storage chip; in response to the storage chip's mounting state being the first mounting state, switching the first mounting state to the second mounting state via the main chip.

[0016] In some embodiments, the main chip includes a first communication module, and when the storage chip is in the second mounted state, the first communication module of the main chip is disabled.

[0017] In some embodiments, the main chip further includes a second communication module, and when the storage chip is in the second mounted state, the method further includes: communicating with an external device through the second communication module.

[0018] In some embodiments, when the storage chip is in the second mounted state, the method further includes: pausing the operation of the image signal processing chip in response to the main chip receiving a preset signal through the second communication module.

[0019] In some embodiments, the image signal processing chip includes a third communication module. When the storage chip is in the second mounted state, the method further includes: in response to receiving an instruction to enable the third communication module, controlling the image signal processing chip to transmit the image data to an external device through the third communication module.

[0020] In some embodiments, in response to a user's instruction to stop the image signal sensor from acquiring the image signal, the power supply to the image signal processing chip is disconnected after a preset time.

[0021] In some embodiments, the method further includes: in response to receiving an instruction from the user to read the image data in the storage chip, switching the second mounting state to the first mounting state via the main chip.

[0022] In some embodiments, the method further includes: controlling the image signal processing chip to be in a power-off state or a low-power state when the storage chip is in the first mounted state.

[0023] In some embodiments, the main chip includes a first communication module, and the method further includes: transmitting the image data to an external device through the first communication module.

[0024] This specification also provides a control device for a wearable device, including a processor, characterized in that the processor is used to execute the control method for the wearable device as described above.

[0025] This specification also provides a computer-readable storage medium that stores computer instructions. When a computer reads the computer instructions from the storage medium, the computer executes the control method for the wearable device as described above. Attached Figure Description

[0026] This application will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0027] Figure 1 These are structural block diagrams of wearable devices illustrated in some embodiments of this specification;

[0028] Figure 2 This is a flowchart illustrating a control method for a wearable device according to some embodiments of this specification;

[0029] Figure 3 This is a flowchart illustrating a control method for a wearable device according to some embodiments of this specification;

[0030] Figure 4 This is a flowchart illustrating a control method for a wearable device according to some embodiments of this specification;

[0031] Figure 5 This is a flowchart illustrating a control method for a wearable device according to some embodiments of this specification. Detailed Implementation

[0032] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are merely some examples or embodiments of this application. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0033] It should be understood that the terms “system,” “device,” “unit,” and / or “module” used herein are one way to distinguish different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.

[0034] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0035] In the description of this specification, it should be understood that the terms "first," "second," "third," "fourth," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include at least one of that feature. In the description of this specification, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this specification, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, the term "connection" can refer to a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this specification according to the specific circumstances.

[0037] Flowcharts are used in this application to illustrate the operations performed by the system according to embodiments of this application. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, various steps can be processed in reverse order or simultaneously. Furthermore, other operations can be added to these processes, or one or more steps can be removed from them.

[0038] There are two main platform solutions for wearable devices with camera functionality. One is a single-chip solution, which integrates all the functions of the wearable device onto a single chip, such as image signal processing, WiFi, and Bluetooth. The other is a multi-chip discrete component solution, which integrates multiple functions of the wearable device onto different chips, such as WiFi, Bluetooth, and audio playback onto one chip, and image signal processing onto another. Current platform solutions still have many problems. For example, single-chip solutions generally face issues of performance overkill, high power consumption, and high price. Multi-chip discrete component solutions also face the problems of performance overkill and high power consumption. Therefore, this specification provides a discrete component solution that can fully utilize the chip's functionality, enabling wearable devices to simultaneously have audio playback and camera functions, avoiding performance waste.

[0039] The wearable devices described in the embodiments of this specification will be described in detail below with reference to the accompanying drawings. It should be noted that the following embodiments are only used to explain this specification and do not constitute a limitation thereof.

[0040] Figure 1 This is a structural block diagram of a wearable device with a camera function according to some embodiments of this specification. In some embodiments, the wearable device 100 may include one or more of smart glasses, smartphones, smartwatches, etc. The wearable device 100 can communicate with external devices via at least one communication module (e.g., WiFi, Bluetooth, etc.). In some embodiments, the external device may include one or more of mobile phones, computers, smartwatches, tablets, etc. For ease of description, this specification will use smart glasses with a camera function as an example of the wearable device 100 and a mobile phone as an example of the external device.

[0041] like Figure 1 As shown, the wearable device 100 includes a main chip 110, an image signal sensor 120, an image signal processing (ISP) chip 130, and a storage chip 140.

[0042] The main chip 110 can execute / send instructions to control one or more components in the wearable device 100.

[0043] Image signal sensor 120 is directly connected to ISP chip 130, and main chip 110 can control image signal sensor 120 to acquire image signals through ISP chip 130. For example, main chip 110 can send instructions to ISP chip 130 through dual-core communication, including instructing ISP chip 130 to control image signal sensor 120 to perform shooting or recording. In some embodiments, dual-core communication may include Serial Peripheral Interface (SPI), Universal Asynchronous Receiver / Transmitter (UART) protocol, General Purpose Input / Output Port (GPIO) protocol, or any combination thereof.

[0044] The image signal may include video and / or photographs. In some embodiments, the image signal sensor 120 may include a charge-coupled device (CCD) image sensor, a complementary metal-oxide-semiconductor (CMOS) image sensor, etc. Exemplary CMOS image sensors may include a global shutter image sensor, a rolling shutter image sensor, etc.

[0045] The ISP chip 130 can process the image signal output from the image signal sensor 120 to generate image data. The main chip 110 can control the ISP chip 130 to store the image data in the storage chip 140.

[0046] The storage chip 140 can store image data generated by the ISP chip 130 for subsequent reading by the main chip 110. In some embodiments, the storage chip 140 can also store instructions / program code related to controlling the wearable device 100. Exemplary storage chips 140 may include embedded multimedia cards (eMMC), secure digital memory (SD) cards, TF flash memory, etc.

[0047] In this specification, the main chip 110 controls whether image data is stored in or read from the storage chip 140 by controlling (or switching) its mounting state. Specifically, the mounting states of the storage chip 140 include a first mounting state when the storage chip 140 is mounted to the main chip 110, and a second mounting state when the storage chip 140 is mounted to the ISP chip 130. The second mounting state allows the ISP chip 130 to transmit image data to the storage chip 140, while the first mounting state allows the main chip 110 to read image data from the storage chip 140. The main chip 110 can control the storage chip 140 to switch between the first and second mounting states.

[0048] It's important to understand that during the process of ISP chip 130 storing image data in storage chip 140, storage chip 140 is mounted on ISP chip 130. That is, ISP chip 130 can directly store image data in storage chip 140. At this time, storage chip 140 is disconnected from main chip 110, meaning main chip 110 cannot read the image data stored in storage chip 140. Conversely, during the process of main chip 110 reading image data from storage chip 140, storage chip 140 is mounted on main chip 110. That is, main chip 110 can directly read the image data stored in storage chip 140. At this time, storage chip 140 is disconnected from ISP chip 130, meaning ISP chip 130 cannot store image data in storage chip 140.

[0049] In some embodiments, the wearable device 100 may further include an auxiliary storage chip (not shown) that is always connected to the main chip. The auxiliary storage chip may store instructions / program code, etc., related to controlling the wearable device 100.

[0050] In some embodiments, the wearable device 100 also includes a button. The user can trigger the switching between a first mounting state and a second mounting state of the storage chip 140 by pressing the button.

[0051] For example, when a user wears wearable device 100 (e.g., smart glasses) and wants to take a photo or video, i.e., needs to store the captured photo or video in real time for later viewing, the user can press the shutter button on the wearable device 100 to trigger a first switching command to switch the storage chip 140 to a second mounting state (i.e., mount the storage chip 140 onto the ISP chip 130). After receiving the first switching command, the main chip 110 can first determine the current mounting state of the storage chip 140. If the storage chip 140 is currently mounted onto the ISP chip 130 (i.e., in the second mounting state), the main chip 110 can power on or wake up the ISP chip 130, and then control the image signal sensor 120 to directly acquire image signals through the ISP chip 130. If the storage chip 140 is not currently mounted on the ISP chip 130 (i.e., it is in the first mounting state, which is mounted on the main chip), the main chip 110 can first switch the mounting state of the storage chip 140 to the ISP chip 130, and then power on the ISP chip 130 or wake up the ISP chip 130, and control the image signal sensor 120 to acquire image signals through the ISP chip 130.

[0052] For example, when a user wears wearable device 100 (e.g., smart glasses) and wants to view photos or videos stored in storage chip 140—that is, when main chip 110 needs to read image data stored in storage chip 140—the user can trigger a second switching command to switch storage chip 140 to a first mounting state (i.e., mounting storage chip 140 onto main chip 110) via a touch button on an application (APP) connected to wearable device 100. Upon receiving the second switching command, main chip 110 can first determine the current mounting state of storage chip 140. If storage chip 140 is currently mounted on main chip 110 (i.e., in the first mounting state), main chip 110 can directly read the image data stored in storage chip 140. If the storage chip 140 is not currently mounted on the main chip 110 (i.e., it is in the second mounting state, which is mounted on the ISP chip), the main chip 110 can first switch the mounting state of the storage chip 140 to the main chip 110, and then exclusively retrieve the image data stored in the storage chip 140.

[0053] According to some embodiments of this specification, by switching the mounting state of the storage chip 140 to control whether image data is stored in or read from the storage chip 140, the functionality of each chip can be fully utilized, avoiding performance waste. Simultaneously, it can avoid the transmission of large amounts of data between the ISP chip and the main chip, thereby reducing problems such as high power consumption and unreliability caused by large data transmission. For example, in a scheme where both the main chip and the ISP chip are mounted with their respective corresponding storage chips, when the main chip and the ISP chip need to communicate, such as when the main chip needs to read image data from the storage chip corresponding to the ISP chip, the image / video data volume is relatively large, requiring the main chip and the ISP chip to transmit via large data protocols. However, large data transmission is energy-intensive, and due to the unreliability of large data transmission, data corruption may occur during the transmission process. Therefore, compared to a solution where both the main chip and the ISP chip have their own corresponding storage chips, switching the mounting state of the storage chip 140 can avoid large data transfers between the main chip and the ISP chip, thereby reducing the power consumption of the chip (wearable device 100), preventing data corruption, and saving physical space on the chip board since there is only one storage chip. For example, in a solution where the main chip is always mounted with a storage chip while the ISP chip is not, when the ISP chip needs to transmit acquired image data to the storage chip for storage, the ISP chip must first transmit the image data to the main chip, and then the main chip stores it in the storage chip. This transmission process is energy-intensive, and due to the unreliability of large data transmissions, it may also cause data corruption. Therefore, compared to a solution where the main chip is always mounted with a storage chip while the ISP chip is not, switching the mounting state of the storage chip 140 can avoid large data transfers between the main chip and the ISP chip, thereby reducing the power consumption of the chip (wearable device 100) and preventing data corruption.

[0054] In some embodiments, to facilitate the main chip 110's control over the switching of the memory chip 140, the memory chip 140 can be connected to the main chip 110 and the ISP chip 130 via multiple leads. For example, the memory chip 140 can be connected to the main chip 110 and the ISP chip 130 respectively via multiple leads. The main chip 110 controls the connection logic to select which link to activate. For example, the main chip 110 can send a switch signal to the memory chip 140 via one lead. This switch signal can select to activate either the link between the main chip 110 and the memory chip 140, or the link between the ISP chip 130 and the memory chip 140. In response to receiving the switch signal, the main chip 110 can pull the switching pin high or low to switch the communication pin of the memory chip 140 to the ISP chip 130 or the main chip 110. For example, when the main chip 110 needs to read image data from the memory chip 140, the main chip 110 can control the connection between itself and the memory chip 140. At this time, the link between the ISP chip 130 and the storage chip 140 will be closed. For example, when taking photos or videos is needed, the captured image data needs to be stored in the storage chip 140 in real time. At this time, the main chip 110 can connect the link between the ISP chip 130 and the storage chip 140. Then, the link between the main chip 110 and the storage chip 140 will be closed. That is, at any given time, the storage chip 140 can only be connected to one chip, either the main chip 110 or the ISP chip 130. By switching whether the storage chip 140 is mounted on the main chip or the ISP chip, resource sharing of the storage on the storage chip 140 is achieved.

[0055] In some embodiments, the main chip 110 may include a first communication module 112. The first communication module 112 can establish a connection between the wearable device 100 and an external device. This connection can be a wired connection, a wireless connection, any other communication connection capable of data transmission and / or reception, and / or any combination of these connections. Wired connections may include, for example, cables, optical fibers, telephone lines, etc., or any combination thereof. Wireless connections may include, for example, Bluetooth links, Wi-Fi links, WiMax links, WLAN links, ZigBee links, mobile network links (e.g., 3G, 4G, 5G, etc.), etc., or combinations thereof.

[0056] When the storage chip 140 is in its first mounted state, i.e., mounted on the main chip 110, the main chip 110 can transmit image data to external devices via the first communication module 112. Users can view the image data stored in the storage chip 140 through external devices. For example, after a user wears a wearable device 100 (e.g., smart glasses), the user can communicate with the wearable device 100 through an application (APP) installed on an external device (e.g., a mobile phone). The user can send instructions to the main chip 110 through the APP to transfer the image data stored in the storage chip 140 to the APP (e.g., to a cloud connected to the APP) for viewing at any time. Optionally, after the transmission is complete, the main chip 110 can automatically disable the first communication module 112 to reduce chip power consumption.

[0057] In some embodiments, when the storage chip 140 is in the first mounted state, the ISP chip 130 can be in a power-off state or a low-power state to reduce the power consumption of the wearable device 100. For example, when a user wants to view a photo after taking it, the main chip 110 can switch the storage chip 140 from the ISP chip 130 to the main chip 110. At the same time, the main chip 110 can disconnect the power supply to the ISP chip 130 to terminate the operation of the ISP chip 130, thereby reducing the power consumption of the ISP chip 130.

[0058] In some embodiments, when the storage chip 140 is in the second mounting state, i.e., the storage chip 140 is mounted on the ISP chip 130, the image signal sensor 120 can be directly used for shooting. When the user is taking a picture, the image signal sensor 120 is working. To reduce the power consumption of the wearable device 100, the first communication module 112 of the main chip 110 is disabled, i.e., the main chip 110 is disconnected from the external device. In some embodiments, when the user is taking a picture, the first communication module 112 may not be disabled, i.e., the wearable device 100 can connect to the external device, but the main chip 110 cannot send image data to the external device at this time.

[0059] In some embodiments, the main chip 110 further includes a second communication module 114. The second communication module 114 can also establish a connection between the wearable device 100 and an external device. This connection can be a wired connection, a wireless connection, any other communication connection capable of data transmission and / or reception, and / or any combination of these connections. Wired connections can include, for example, cables, optical fibers, telephone lines, etc., or any combination thereof. Wireless connections can include, for example, Bluetooth links, Wi-Fi links, WiMax links, WLAN links, ZigBee links, mobile network links (e.g., 3G, 4G, 5G, etc.), etc., or combinations thereof.

[0060] When the storage chip 140 is in its second mounting state, that is, when the storage chip 140 is mounted on the ISP chip 130, the main chip 110 can be used to communicate with external devices through the second communication module 114. In other words, when the wearable device 100 is taking pictures, the wearable device 100 can also communicate with the outside world.

[0061] In some embodiments, in practical applications, to save transmission resources, the first communication module 112 can be a WiFi module, and the second communication module 114 can be a Bluetooth module. In other words, the main chip 110 transmits image data to external devices through the WiFi module and communicates with external devices through the Bluetooth module, for example, to listen to music or make calls.

[0062] In some embodiments, the WiFi module and Bluetooth module of the main chip 110 can operate simultaneously. In some embodiments, one of the WiFi module and Bluetooth module of the main chip 110 can be in an active state while the other is disabled or disconnected.

[0063] In some embodiments, when the Bluetooth module of the main chip 110 is active, the mounting state of the storage chip 140 is unrestricted; it can be mounted on either the main chip 110 or the ISP chip 130. When the storage chip 140 is mounted on the main chip 110, the WiFi module of the main chip 110 can also be active simultaneously. In this case, the main chip 110 can read image data stored in the storage chip 140. When the storage chip 140 is mounted on the main chip 110 and its WiFi module is disabled, or when the storage chip 140 is mounted on the ISP chip 130, the main chip 110 can communicate with external devices via the Bluetooth module, for example, to listen to music or make calls. In this case, the wearable device 100 functions as a Bluetooth headset.

[0064] In some embodiments, when the storage chip 140 is in a second mounted state, i.e., mounted on the ISP chip 130, if the main chip 110 receives a preset signal through the second communication module 114 (e.g., a Bluetooth module), the ISP chip 130 will pause operation. For example, after a user wears smart glasses, they connect them to a mobile phone via Bluetooth. During the shooting process, if the mobile phone receives a call signal, the main chip 110 can automatically disconnect its connection with the ISP chip 130 or put the ISP chip 130 into standby mode, i.e., interrupt the shooting. When the user chooses not to answer the call or the call ends, the main chip 110 can power on or wake up the ISP chip 130 again to continue shooting.

[0065] In some embodiments, the ISP chip 130 includes a third communication module (not shown). The third communication module may be the same as or different from the first or second communication module. For example, the third communication module may be a WiFi module.

[0066] When the storage chip 140 is in its second mounted state, i.e., mounted on the ISP chip 130, the ISP chip 130 can be used to transmit image data to external devices via the third communication module. Specifically, when a user wears the wearable device 100 and wants to transmit the image signals collected by the image information sensor 110 to an external device in real time, the user can trigger the main chip 110 to send a command to the ISP chip 130 to enable the third communication module via a button on the wearable device 100 (or a touch button on the APP communicating with the wearable device 100). In response to receiving the command to enable the third communication module, the ISP chip 130 can collect image signals and convert them into image data, which is then transmitted to the external device in real time via the third communication module. When the user wants to stop transmitting the image signals collected by the image information sensor 110 to an external device in real time, the user can trigger the main chip 110 to send a command to the ISP chip 130 to disable the third communication module via a button on the wearable device 100. In response to receiving an instruction to disable the third communication module, the main chip 110 can control the ISP chip 130 to stop acquiring image signals (e.g., disconnect the power supply to the ISP chip 130) and disable the third communication module. For example, the wearable device 100 is equipped with a live streaming button. When a user wants to live stream the footage captured by the smart glasses to a friend's mobile phone for real-time viewing, the user can trigger the live streaming button. The main chip 110 can first transmit the image data to a server associated with the smart glasses via the third communication module. The server associated with the smart glasses can transcode the received image data. The user's friend can receive the transcoded data from the server through an app installed on their mobile phone and watch the live stream. When the user wants to stop the live stream, they can trigger the stop live stream button. The main chip 110 can disable the third communication module. Furthermore, the main chip 110 can disconnect the power supply to the ISP chip or put it into standby mode. In some embodiments, to reduce the number of buttons on the wearable device 100, when the user is live streaming via the live streaming button, the user can trigger the live streaming button again to stop the live stream.

[0067] In some embodiments, the power consumption of the third communication module is too high when transmitting image data in real time, resulting in a short working time for the wearable device 100. In this case, an external power supply can be used to maintain real-time transmission.

[0068] It should be noted that the above description is for convenience only and should not limit this application to the scope of the embodiments described. It is understood that those skilled in the art, after understanding the principle of the system, can make various modifications and changes in form and detail to the application fields of the above methods and systems without departing from this principle.

[0069] Figure 2 This is a flowchart illustrating a control method for a wearable device according to some embodiments of this specification. In some embodiments, process 200 can be executed by processing logic, which may include hardware (e.g., circuitry, dedicated logic, programmable logic, microcode, etc.), software (instructions running on a processing device to execute hardware simulations), and any combination thereof. For example, process 200 may be stored in memory chip 140 as instructions and invoked and / or executed by main chip 110.

[0070] In step 210, the main chip 110 can obtain a shooting command instructing the image signal sensor 120 to acquire image signals.

[0071] In some embodiments, the wearable device 100 may have a button for turning the image signal sensor 120 on / off. The user can use this button to issue commands to control the image signal sensor 120 to acquire image signals. For example, when a user wears smart glasses and wants to take a picture, the user can directly press the shooting start button on the smart glasses. The shooting start button can trigger a first switching command to switch the storage chip 140 to a second mounting state (i.e., mount the storage chip 140 onto the ISP chip 130).

[0072] In some embodiments, the wearable device 100 can connect to an external device via a communication module (e.g., a first communication module 112 or a second communication module 114). The user can control the image signal sensor 120 to acquire image signals via an app installed on the external device that can communicate with the wearable device. For example, when the user wears smart glasses, the user can connect the smart glasses to the user's mobile phone via WiFi. When the user wants to take a picture, the user can trigger a first switching command to switch the storage chip 140 to a second mounting state (i.e., mounting the storage chip 140 onto the ISP chip 130) via a shooting button (e.g., a touch button) in the app on the user's mobile phone.

[0073] In step 220, the main chip 110 can obtain the mounting status of the storage chip 140.

[0074] In response to receiving the first switching command, the main chip 110 can determine the current mounting state of the memory chip 140. For example, the main chip 110 can determine the current mounting state of the memory chip 140 by the current position of the switching pin of the memory chip 140. If the current position of the switching pin of the memory chip 140 is located at the position of the pin connected to the main chip 110, then its current mounting state is determined to be the first mounting state; if the current position of the switching pin of the memory chip 140 is located at the position of the pin connected to the ISP chip 130, then its current mounting state is determined to be the second mounting state.

[0075] In step 230, the main chip 110 can determine whether the mounting state of the storage chip 140 is the second mounting state. That is, the main chip 110 can determine whether the storage chip 140 is currently mounted on the ISP chip.

[0076] When the mounting state of the storage chip 140 is determined to be the second mounting state, that is, the storage chip 140 is mounted on the ISP chip 130, the main chip 110 can directly execute step 250.

[0077] When it is determined that the mounting state of the storage chip 140 is not the second mounting state, that is, the storage chip 140 is mounted on the main chip 110, the main chip 110 can execute step 240.

[0078] In step 240, the main chip 110 can switch the first mounting state of the memory chip 140 to the second mounting state. In some embodiments, the main chip 110 can switch the switching pin of the memory chip 140 to the position of the pin connected to the ISP chip 130, so as to switch the memory chip 140 to be mounted to the ISP chip 130.

[0079] In step 250, the main chip 110 can control the image signal sensor 120 to acquire image signals and store the image signals in the storage chip 140.

[0080] When it is determined that the storage chip 140 is mounted on the ISP chip 130, the main chip 110 can power on or wake up the ISP chip 130, and control the image signal sensor 120 to acquire image signals through the ISP chip 130. The ISP chip 130 can process the image signals acquired by the image signal sensor 120 to generate image data. The main chip 110 can control the ISP chip 130 to store the generated image data in the storage chip 140.

[0081] When a user wants to stop recording, they can trigger a stop recording command (i.e., an instruction to the image signal sensor 120 to stop acquiring image signals) by using a stop recording button on the wearable device 100 or a stop recording button (e.g., a touch button) in an app installed on an external device. In response to receiving the stop recording command, after a preset time (e.g., 3s, 5s, 7s, etc.), the main chip 110 can disconnect the power supply to the ISP chip 130 to save power for the wearable device 100.

[0082] In some embodiments, the main chip 110 includes a first communication module 112 (e.g., a WiFi module). During the shooting process, in order to save power of the wearable device 100, the first communication module 112 of the main chip 110 can be disabled.

[0083] In some embodiments, the main chip 110 further includes a second communication module 114 (e.g., a Bluetooth module). During shooting, the main chip 110 can simultaneously communicate with external devices through the second communication module 114. In response to the main chip 110 receiving a preset signal (e.g., an incoming call) through the second communication module 114, the main chip 110 can pause the operation of the ISP chip 130. For example, the main chip 110 can disconnect its connection with the ISP chip 130 or put the ISP chip 130 into standby mode, i.e., interrupt shooting. When the user chooses not to answer the call or the call ends, the main chip 110 can power on or wake up the ISP chip 130 again to continue shooting.

[0084] In some embodiments, the ISP chip 130 includes a third communication module. During shooting, in response to receiving an instruction to activate the third communication module, the main chip 110 can control the ISP chip 130 to transmit image data to an external device through the third communication module. More information about the wearable device 100 can be found at [link to relevant documentation]. Figure 1 And its description.

[0085] Figure 3 This is a flowchart illustrating a control method for a wearable device according to some embodiments of this specification. In some embodiments, process 300 can be executed by processing logic, which may include hardware (e.g., circuitry, dedicated logic, programmable logic, microcode, etc.), software (instructions running on a processing device to execute hardware simulations), and any combination thereof. For example, process 300 may be stored in memory chip 140 as instructions and invoked and / or executed by main chip 110.

[0086] In step 310, the main chip 110 can obtain an instruction to read image data from the storage chip 140.

[0087] In some embodiments, the wearable device 100 can connect to an external device via a communication module (e.g., a first communication module 112 or a second communication module 114). A user can control the main chip 110 to read image data from the storage chip 140 via an app installed on the external device that can communicate with the wearable device. For example, when a user wears smart glasses, the user can connect the smart glasses to their mobile phone via WiFi. When the user wants to view videos or photos (i.e., image data) in the storage chip 140, the user can trigger a second switching command to switch the storage chip 140 to a first mounting state (i.e., mounting the storage chip 140 onto the main chip 110) via a view button (e.g., a touch button) in the app installed on their mobile phone.

[0088] In step 320, the main chip 110 can obtain the mounting status of the storage chip 140.

[0089] In response to receiving the second switching command, the main chip 110 can determine the current mounting state of the memory chip 140. For example, the main chip 110 can determine the current mounting state of the memory chip 140 by the current position of the switching pin of the memory chip 140. If the current position of the switching pin of the memory chip 140 is located at the pin connected to the main chip 110, then its current mounting state is determined to be the first mounting state; if the current position of the switching pin of the memory chip 140 is located at the pin connected to the ISP chip 130, then its current mounting state is determined to be the second mounting state.

[0090] In step 330, the main chip 110 can determine whether the mounting state of the storage chip 140 is the first mounting state. That is, the main chip 110 can determine whether the storage chip 140 is currently mounted on the main chip 110.

[0091] When the mounting state of the storage chip 140 is determined to be the first mounting state, that is, the storage chip 140 is mounted on the main chip 110, the main chip 110 can directly execute step 350.

[0092] When it is determined that the mounting state of the storage chip 140 is not the first mounting state, that is, the storage chip 140 is mounted on the ISP chip 130, the main chip 110 can execute step 340.

[0093] In step 340, the main chip 110 can switch the second mounting state of the memory chip 140 to the first mounting state. In some embodiments, the main chip 110 can switch the switching pin of the memory chip 140 to the position of the pin connected to the main chip 110, so as to switch the memory chip 140 to be mounted to the main chip 110.

[0094] In step 350, the main chip 110 can read the image data stored in the storage chip 140.

[0095] When it is determined that the storage chip 140 is mounted on the main chip 110, the main chip 110 can directly read the image data stored in the storage chip 140.

[0096] In some embodiments, the main chip 110 includes a first communication module 112 (e.g., a WiFi module). The main chip 110 can transmit image data to external devices via the first communication module 112 for users to view the image data.

[0097] In some embodiments, during the process of the main chip 110 reading image data stored in the storage chip 140, in order to save power of the wearable device 100, the main chip 110 can control the ISP chip 130 to be in a power-off state or a low-power state. More information about the wearable device 100 can be found at [link to relevant documentation]. Figure 1 And its description.

[0098] Figure 4 This is a flowchart illustrating a control method for a wearable device according to some embodiments of this specification. In some embodiments, process 400 can be executed by processing logic, which may include hardware (e.g., circuitry, dedicated logic, programmable logic, microcode, etc.), software (instructions running on a processing device to execute hardware simulations), and any combination thereof. For example, process 400 may be stored in memory chip 140 as instructions and invoked and / or executed by main chip 110.

[0099] In step 401, the main chip 110 can determine the current mounting status of the storage chip 140 in response to receiving a first switching instruction to switch the storage chip 140 to the ISP chip 130. For example, when a user wears the wearable device 100 and wants to take a picture or record a video, that is, when the user needs to mount the storage chip 140 to the ISP chip 130, the user can trigger the first switching instruction to switch the storage chip 140 to the ISP chip 130 through a button set on the wearable device 100. Upon receiving the first switching instruction, the main chip 110 can determine whether the storage chip 140 is currently mounted on the ISP chip 130. When the storage chip 140 is mounted on the ISP chip 130, the main chip 110 can directly instruct the ISP chip 130 to control the image signal sensor 120 to take a picture or record a video. When the storage chip 140 is not mounted on the ISP chip 130, that is, when the storage chip 140 is mounted on the main chip 110, the storage chip 140 needs to be switched to the ISP chip 130. At this time, the main chip 110 can execute step 402.

[0100] In step 402, the main chip 110 can unload the file system of the storage chip 140.

[0101] In step 403, the main chip 110 can unload the driver module of the storage chip 140.

[0102] In step 404, the ISP chip 130 can reset the memory chip 140.

[0103] In step 405, the main chip 110 can pull the switching pin high to switch the communication pin of the memory chip 140 to the ISP chip 130.

[0104] In step 406, the main chip 110 can power on the ISP chip 130 or pull down the reset pin of the ISP chip 130 to power on or wake up the ISP chip 130. After the ISP chip 130 is powered on or woken up, it can boot up and load the driver module of the storage chip 140. Then, the ISP chip 130 can mount the file system of the storage chip 140 and return the mounting result via dual-core communication.

[0105] In step 407, in response to successful mounting, the main chip 110 can return a successful mounting result.

[0106] In step 408, in response to mounting failure, the main chip 110 can perform mounting exception handling.

[0107] Figure 5 This is a flowchart illustrating a control method for a wearable device according to some embodiments of this specification. In some embodiments, process 500 can be executed by processing logic, which may include hardware (e.g., circuitry, dedicated logic, programmable logic, microcode, etc.), software (instructions running on a processing device to execute hardware simulations), and any combination thereof. For example, process 500 may be stored in memory chip 140 as instructions and invoked and / or executed by main chip 110.

[0108] In step 501, the main chip 110 can determine the current mounting status of the storage chip 140 in response to receiving a second switching instruction to switch the storage chip 140 to the main chip 110. For example, when a user is wearing the wearable device 100 and wants to view videos or photos stored in the storage chip 140, i.e., needs to mount the storage chip 140 to the main chip 110, the user can trigger the second switching instruction to switch the storage chip 140 to the main chip 110 through a button in an app installed on the external device. In response to receiving the second switching instruction, the main chip 110 can determine whether the storage chip 140 is currently mounted to the main chip 110. When the storage chip 140 is mounted to the main chip 110, the main chip 110 can directly read the image data stored in the storage chip 140. When the storage chip 140 is not mounted on the main chip 110, that is, when the storage chip 140 is mounted on the ISP chip 130, the storage chip 140 needs to be switched to the main chip 110. At this time, the main chip 110 can execute step 502.

[0109] In step 502, the main chip 110 can send a second switching command to the ISP chip 130 via dual-core communication to notify the ISP chip 130 to switch storage chips. In response to receiving the second switching command, the ISP chip 130 can unload the file system of the storage chip 140 and return an unloading completion command to the main chip 110.

[0110] In step 503, in response to receiving the unloading completion instruction, the main chip 110 can reset the storage chip 140.

[0111] In step 504, the main chip 110 can pull the switching pin low to switch the communication pin of the memory chip 140 to the main chip 110.

[0112] In step 505, the main chip 110 can load the driver module of the storage chip 140.

[0113] In step 506, the main chip 110 can load the file system of the storage chip 140.

[0114] In step 507, in response to successful mounting, the main chip 110 can return a successful mounting result.

[0115] In step 508, in response to mounting failure, the main chip 110 can perform mounting exception handling.

[0116] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

Claims

1. A wearable device, comprising: Image signal sensor; Main chip; Memory chips; as well as An image signal processing chip is configured to process the image signal output by the image signal sensor to generate image data. The main chip is configured to control the mounting state of the memory chip, including a first mounting state when the memory chip is mounted to the main chip, and a second mounting state when the memory chip is mounted to the image signal processing chip. The second mounting state allows the image signal processing chip to transmit the image data to the memory chip, and the first mounting state allows the main chip to read the image data from the memory chip.

2. The wearable device according to claim 1, wherein, The main chip includes a first communication module. When the storage chip is in the first mounted state, the main chip is configured to transmit the image data to an external device through the first communication module.

3. The wearable device according to claim 2, wherein, When the storage chip is in the first mounted state, the image signal processing chip is in a power-off state or a low-power state.

4. The wearable device according to claim 2, wherein, When the storage chip is in the second mounted state, the first communication module of the main chip is disabled.

5. The wearable device according to claim 4, wherein, The main chip also includes a second communication module. When the storage chip is in the second mounted state, the main chip is configured to communicate with the external device through the second communication module.

6. The wearable device according to claim 5, wherein, The first communication module includes a Wi-Fi module, and the second communication module includes a Bluetooth module.

7. The wearable device according to claim 5, wherein, When the storage chip is in the second mounted state, in response to the main chip receiving a preset signal through the second communication module, the image signal processing chip suspends operation.

8. The wearable device according to any one of claims 1-7, wherein, The main chip sends instructions to the image signal processing chip via dual-core communication. The instructions include instructing the image signal processing chip to control the image signal sensor to take pictures or record videos.

9. The wearable device according to claim 8, wherein, The dual-core communication includes at least one of the following: Serial Peripheral Interface (SPI), Universal Asynchronous Receiver / Transmitter (UART) protocol, and Universal Input / Output Port (GPIO) protocol.

10. The wearable device according to any one of claims 1-9, wherein, The image signal processing chip includes a third communication module. When the storage chip is in the second mounted state, the image signal processing chip is configured to transmit the image data to an external device through the third communication module.

11. The wearable device according to claim 10, wherein, When the storage chip is in the second mounted state, the main chip transmits an instruction to the image processing chip to enable or disable the third communication module.

12. The wearable device according to any one of claims 1-11 further includes a button, the button being configured to trigger switching between the first mounting state and the second mounting state of the storage chip.

13. A control method for a wearable device, wherein, The wearable device includes an image signal sensor, a main chip, a memory chip, and an image signal processing chip, and the method includes: In response to a user-issued instruction for the image signal sensor to acquire image signals, the mounting state of the storage chip is obtained. The mounting state includes a first mounting state when the storage chip is mounted to the main chip, and a second mounting state when the storage chip is mounted to the image signal processing chip. The second mounting state allows the image signal processing chip to transmit the image data to the storage chip, while the first mounting state allows the main chip to read the image data from the storage chip. In response to the storage chip being in a first mounting state, the main chip switches the first mounting state to a second mounting state.

14. The method according to claim 13, wherein, The main chip includes a first communication module. When the storage chip is in the second mounted state, the first communication module of the main chip is disabled.

15. The method according to claim 14, wherein, The main chip further includes a second communication module. When the storage chip is in the second mounted state, the method further includes: The second communication module communicates with external devices.

16. The method according to claim 15, wherein, When the memory chip is in the second mounted state, the method further includes: In response to the main chip receiving a preset signal through the second communication module, the operation of the image signal processing chip is suspended.

17. The method according to any one of claims 13-16, wherein, The image signal processing chip includes a third communication module. When the storage chip is in the second mounted state, the method further includes: In response to receiving an instruction to activate the third communication module, the image signal processing chip is controlled to transmit the image data to an external device through the third communication module.

18. The method according to any one of claims 13-17, wherein, In response to a user's instruction to stop the image signal sensor from acquiring the image signal, the power supply to the image signal processing chip is disconnected after a preset time.

19. The method of claim 18, further comprising: In response to receiving an instruction from the user to read the image data in the storage chip, the main chip switches the second mounting state to the first mounting state.

20. The method according to claim 19, wherein, The method further includes: When the storage chip is in the first mounted state, the image signal processing chip is controlled to be in a power-off state or a low-power state.

21. The method according to claim 19 or 20, wherein, The main chip includes a first communication module, and the method further includes: The image data is transmitted to an external device through the first communication module.

22. A control device for a wearable device, comprising a processor, characterized in that, The processor is used to execute the control method for the wearable device according to any one of claims 13-21.

23. A computer-readable storage medium storing computer instructions, wherein when a computer reads the computer instructions in the storage medium, the computer executes a control method for a wearable device as described in any one of claims 13-21.

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