A multi-station synchronous visual positioning and quality detection method

Abstract

The application relates to the technical field of visual detection, and discloses a multi-station synchronous visual positioning and quality detection method, which comprises the following steps: acquiring a single collection image of a substrate to be processed on a work platform, generating a global reference coordinate covering all processing stations, and taking the global reference coordinate as the only reference parameter for visual operation of all stations in the current processing period; processing parameters of dispensing, chip mounting and copper sheet mounting stations are synchronously generated based on the global reference coordinate and are synchronously sent to corresponding execution units; real-time processing images of the stations are synchronously collected, standard features corresponding to the global reference coordinate are compared, chip mounting position review, copper sheet pickup state detection, finished product connection site final inspection are synchronously completed, and comparison results are obtained; the processing period is terminated according to the comparison results, and a waste treatment instruction is triggered, or a qualified substrate discharge instruction is output after the processing is completed. The application can solve the problem that the reference of IC packaging multi-station visual positioning is not unified, and the detection is not synchronous, thereby reducing the processing precision.

Description

Technical Field

[0001] This application relates to the technical field of visual inspection, and in particular to a multi-station synchronous visual positioning and quality inspection method. Background Technology

[0002] As semiconductor packaging technology rapidly develops towards higher density, miniaturization, and higher reliability, the wireless IC packaging process, which uses copper sheet conduction to replace traditional gold wire bonding, has been widely applied in the fields of power semiconductors and consumer electronics chip packaging due to its lower conduction impedance, better shock resistance, and higher batch processing adaptability.

[0003] In this packaging process, the visual positioning accuracy of multiple stations such as dispensing, chip mounting, and copper sheet mounting, as well as the quality inspection efficiency of the processing process, directly determine the yield rate and mass production efficiency of chip packaging. At present, the industry generally adopts a technical solution of independently configuring vision units at multiple stations and independently completing positioning and inspection at each station. Each station collects images of the corresponding processing area and generates the positioning reference for that station to complete the corresponding processing and inspection operations.

[0004] This multi-station independent positioning and step-by-step testing method is prone to cumulative positioning errors due to inconsistent benchmarks, which reduces packaging accuracy. At the same time, the processing and testing sequence is scattered and the response to abnormalities is delayed, which not only affects mass production efficiency but also causes unnecessary waste of raw materials.

[0005] As can be seen from the above, the problem of low processing accuracy caused by inconsistent visual positioning benchmarks and asynchronous detection in IC packaging multi-station still needs to be solved. Summary of the Invention

[0006] In order to solve the problem of low processing accuracy caused by inconsistent visual positioning benchmarks and asynchronous detection in multi-station IC packaging, this application provides a multi-station synchronous visual positioning and quality inspection method.

[0007] Firstly, this application provides a multi-station synchronous visual positioning and quality inspection method, which adopts the following technical solution:

[0008] A multi-station synchronous visual positioning and quality inspection method includes:

[0009] Acquire a single image of the substrate to be processed on the work platform, extract the feature information of the chip mounting position, electrode position and pin connection position of the substrate in the image, generate global reference coordinates covering all processing stations, and use the global reference coordinates as the unique reference parameter for visual operation of all stations in this processing cycle.

[0010] Based on the global reference coordinates, the dispensing path parameters of the dispensing station, the mounting correction parameters of the chip mounting station, and the punching and mounting correction parameters of the copper sheet mounting station are generated synchronously and sent to the execution unit of the corresponding station.

[0011] While performing processing actions at each workstation, real-time processing images of each workstation are simultaneously acquired. The real-time processing images are compared with the standard features corresponding to the global reference coordinates. Simultaneously, chip mounting position verification, copper sheet picking status detection, and final inspection of finished product connection points are completed to obtain the corresponding comparison results.

[0012] When the comparison result of any workstation exceeds the preset threshold, the current processing cycle is immediately terminated and a waste disposal instruction is triggered. When all comparison results meet the preset threshold, the entire process is completed and a qualified substrate unloading instruction is output.

[0013] Optionally, the step of generating global reference coordinates covering all machining stations includes:

[0014] Distortion correction and grayscale normalization are performed on the image of the substrate to be processed acquired in a single acquisition. The pixel coordinates of the preset global positioning markers on the substrate surface are extracted, and the conversion and calibration between pixel coordinates and device physical coordinates are performed.

[0015] Based on the calibrated reference coordinate values, and combined with the fixed physical position parameters of each processing station and the work platform, a unified mapping and binding is performed between the coordinate systems of all processing stations and the coordinate system of the work platform.

[0016] Based on the unified mapping and binding coordinate system, combined with the extracted feature information of substrate chip mounting position, electrode position, and pin connection position, a global reference coordinate covering all processing positions is generated, and the global reference coordinate is written into the storage unit of the current processing cycle.

[0017] Optionally, the step of comparing the real-time processed image with the standard features corresponding to the global reference coordinates, simultaneously completing chip mounting position verification, copper sheet picking status detection, and final inspection of finished product connection points, and obtaining the corresponding comparison results includes:

[0018] Using the synchronous trigger signal corresponding to the global reference coordinates locked in this processing cycle, the image acquisition units of each processing station are synchronously retrieved to acquire real-time processing images of the chip mounting station, copper sheet transfer station, and finished product final inspection station.

[0019] The target feature information is extracted from each real-time processing image. The target feature information includes the contour coordinate information of the chip mounting position, the quantity and position coordinate information of the copper sheet, and the path contour information of the finished product connection position. The extracted target feature information is compared and calculated in parallel with the standard feature parameters corresponding to the global reference coordinates.

[0020] The coordinate deviation values ​​of the chip mounting position, the quantity and position deviation values ​​of the copper sheets, and the path overlap values ​​of the finished product connection points are obtained respectively. The values ​​obtained from the above calculations are used as the comparison results of the corresponding workstations.

[0021] Optionally, the step of synchronously retrieving the image acquisition units of each processing station from the synchronization trigger signal corresponding to the global reference coordinates locked in the current processing cycle includes:

[0022] Based on the global reference coordinates generated in this processing cycle, a unique synchronous trigger clock signal is generated. The triggering sequence of the synchronous trigger clock signal is matched one by one with the processing action sequence of each station in this processing cycle.

[0023] The synchronous trigger clock signal is simultaneously sent to the image acquisition units corresponding to the chip mounting station, copper sheet transfer station, and finished product final inspection station, so as to control each image acquisition unit to perform image acquisition operation synchronously at the same time when the corresponding station's processing action is completed.

[0024] Optionally, the step of simultaneously acquiring real-time processing images of the chip mounting station, copper sheet transfer station, and finished product final inspection station includes:

[0025] The real-time processed images acquired synchronously by each image acquisition unit are all marked with a timestamp corresponding to the synchronous trigger clock signal;

[0026] Based on the timestamp, each real-time processed image is bound and matched with the global reference coordinates of the current processing cycle to ensure that all comparison operations are completed based on image data of the same time sequence and the same reference.

[0027] Optionally, the step of synchronously generating dispensing path parameters for the dispensing station, mounting correction parameters for the chip mounting station, and punching and mounting correction parameters for the copper sheet mounting station based on the global reference coordinates, and synchronously sending them to the execution units of the corresponding stations, includes:

[0028] Based on the global reference coordinates locked in this processing cycle, the standard processing feature parameters corresponding to the dispensing station, chip mounting station, and copper sheet mounting station are extracted respectively. Combined with the fixed physical position offset of each station and the work platform, the processing parameters corresponding to each station are generated synchronously.

[0029] The processing parameters of all generated workstations are simultaneously sent to the execution units of the corresponding workstations, controlling the processing actions of each workstation to start and execute synchronously based on the same reference parameters.

[0030] Optionally, the step of performing parallel comparison operations between the extracted target feature information and the standard feature parameters corresponding to the global reference coordinates includes:

[0031] Independent computing channels are allocated to the three inspection tasks: chip mounting position verification, copper sheet picking status detection, and final inspection of finished product connection points. Each computing channel performs feature comparison calculations synchronously based on the standard feature parameters corresponding to the global reference coordinates of the current processing cycle, and the comparison calculation results of each computing channel are output synchronously.

[0032] Optionally, the step of immediately terminating the current processing cycle and triggering a waste disposal command when the comparison result of any workstation exceeds a preset threshold includes:

[0033] When the comparison result of any workstation exceeds the preset threshold, a processing termination command is immediately sent to the execution units of all workstations to stop the subsequent processing actions of all workstations simultaneously.

[0034] Based on the workstation information corresponding to the comparison result exceeding the threshold, the corresponding waste processing instruction is triggered. If the detection result of the copper sheet picking status exceeds the threshold, the suction nozzle is controlled to transfer all the picked copper sheets to the waste collection workstation for centralized disposal. After the waste processing is completed, the reset operation of the entire workstation is performed.

[0035] Optionally, the step of outputting a blanking instruction for a qualified substrate after completing the entire processing flow when all comparison results meet the preset threshold includes:

[0036] When the comparison results of all workstations meet the preset threshold, the final full feature compliance review of the substrate that has completed the entire process is carried out based on the global reference coordinates locked in this processing cycle.

[0037] After the verification is passed, a qualified substrate unloading instruction is generated, and the control platform is used to move the substrate to the unloading station. At the same time, the global reference coordinates in the storage unit of this processing cycle are cleared.

[0038] Secondly, this application provides a multi-station synchronous visual positioning and quality inspection method, which adopts the following technical solution:

[0039] A multi-station synchronous visual positioning and quality inspection method includes:

[0040] The global reference generation module acquires a single image of the substrate to be processed on the work platform, extracts the feature information of the chip mounting position, electrode position and pin connection position of the substrate in the image, generates global reference coordinates covering all processing stations, and uses the global reference coordinates as the unique reference parameter for visual operation of all stations in this processing cycle.

[0041] The synchronous parameter distribution module, based on the global reference coordinates, synchronously generates dispensing path parameters for the dispensing station, placement correction parameters for the chip placement station, and punching and placement correction parameters for the copper sheet placement station, and synchronously distributes them to the execution units of the corresponding stations.

[0042] The synchronous visual inspection module simultaneously acquires real-time processing images of each workstation while performing processing actions. It compares the real-time processing images with the standard features corresponding to the global reference coordinates, and simultaneously completes chip mounting position verification, copper sheet picking status detection, and final inspection of finished product connection points, and obtains the corresponding comparison results.

[0043] The cycle control execution module immediately terminates the current processing cycle and triggers a waste disposal instruction when the comparison result of any station exceeds the preset threshold. When all comparison results meet the preset threshold, the module completes the entire processing process and outputs a qualified substrate unloading instruction.

[0044] In summary, this application includes at least one of the following beneficial technical effects:

[0045] By generating global reference coordinates covering all processing stations through a single image acquisition, and using these coordinates as the sole reference parameter for visual operations at all stations in this processing cycle, the problem of inconsistent references caused by independent positioning at multiple stations is fundamentally solved. By unifying the coordinate systems of each station and eliminating the cumulative errors caused by independent positioning, processes such as dispensing, chip mounting, and copper sheet mounting are all performed with the same reference for positioning and processing, significantly improving the overall visual positioning accuracy of IC packaging.

[0046] By employing multi-station synchronous image acquisition, parallel feature comparison, and synchronous detection and judgment, the timing difference and reference deviation of step-by-step detection are resolved. All detection steps are completed based on global reference coordinates, and the processing actions and detection timing are matched in real time. Once a deviation occurs, the process can be terminated immediately. This not only solves the problem of amplified processing errors caused by asynchronous detection, but also avoids the loss of precision caused by the continuous processing of defective products, thus comprehensively ensuring the stability and consistency of IC packaging processing precision. Attached Figure Description

[0047] Figure 1 This is a flowchart illustrating a multi-station synchronous visual positioning and quality inspection method according to an exemplary embodiment.

[0048] Figure 2 This is a structural block diagram of a multi-station synchronous visual positioning and quality inspection system according to an exemplary embodiment. Detailed Implementation

[0049] The embodiments of this application are described in detail below, and examples of the embodiments are shown in the accompanying drawings.

[0050] In the description of this specification, the references to "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" refer to specific features, structures, materials, or characteristics described in connection with the described embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0051] This application discloses a multi-station synchronous visual positioning and quality inspection method, referring to... Figure 1 ,include:

[0052] S100: Acquire a single image of the substrate to be processed on the work platform, extract the feature information of the chip mounting position, electrode position and pin connection position of the substrate in the image, generate global reference coordinates covering all processing stations, and use the global reference coordinates as the only reference parameter for visual operation of all stations in this processing cycle.

[0053] Among them, reference Figure 2 In this embodiment of the invention, the specific execution process of S100 is as follows:

[0054] S101, perform a single image acquisition operation on the substrate to be processed. Send the material box carrying the substrate to be processed into the loading station. After the single substrate is transferred to the work platform by the pushing mechanism and clamped and fixed, start the global image acquisition unit above the work platform to complete the single image acquisition of the entire area of ​​the substrate to be processed, and obtain a complete high-definition image of the substrate to be processed. Ensure that the acquired image completely covers all areas to be processed on the substrate, without blind spots or distortion.

[0055] S102 performs preprocessing operations on the substrate image to be processed acquired in a single acquisition. Specifically, it performs distortion correction and grayscale normalization on the acquired image to eliminate image deviations caused by lens distortion and uneven lighting during image acquisition, thereby improving image clarity and feature recognition.

[0056] S103 After completing image preprocessing, extract the pixel coordinates of the preset global positioning markers on the substrate surface and perform a conversion and calibration operation between the pixel coordinates and the physical coordinates of the device. Based on the converted and calibrated reference coordinate values, combined with the fixed physical position parameters of each processing station and the work platform, complete the unified mapping and binding of the coordinate systems of all processing stations and the coordinate system of the work platform to ensure that all processing stations are in the same physical coordinate system and eliminate the positioning error caused by the physical position deviation between stations.

[0057] S104 After completing the mapping and binding of the coordinate system of all workstations, the feature information of the chip mounting position, electrode position and pin connection position of the substrate in the preprocessed image is extracted. Based on the coordinate system after unified mapping and binding, a global reference coordinate covering all processing workstations is generated. The global reference coordinate is written into the storage unit of this processing cycle as the only reference parameter for visual operations of all workstations in this processing cycle. The positioning, processing and detection operations of all workstations in this processing cycle directly call the global reference coordinate, and no longer generate a separate positioning reference for this workstation.

[0058] By acquiring a single whole-board image, the unified generation of reference coordinates for all workstations is achieved, replacing the existing operation mode of acquiring images and generating positioning references for each workstation separately. This fundamentally eliminates the problem of inconsistent references caused by independent positioning at multiple workstations and avoids the accumulation of positioning errors during multi-process processing. At the same time, through the unified mapping and binding of the coordinate system of all workstations, it ensures that all processing workstations perform operations based on the same physical coordinate system, which greatly improves the accuracy and consistency of multi-station visual positioning in IC packaging processes.

[0059] S200, based on global reference coordinates, synchronously generates dispensing path parameters for the dispensing station, mounting correction parameters for the chip mounting station, and punching and mounting correction parameters for the copper sheet mounting station, and synchronously sends them to the execution units of the corresponding stations.

[0060] In this embodiment of the invention, the specific execution process of S200 is as follows:

[0061] S201 After completing the generation and storage of the global reference coordinates, start the machining parameter generation operation. Confirm that the only reference parameter in this machining cycle is the global reference coordinate generated in step S100. The generation of all machining parameters is based on this global reference coordinate to ensure the consistency of the reference for parameter generation.

[0062] S202, based on the global reference coordinates locked in this processing cycle, extracts the standard processing feature parameters corresponding to the dispensing station, chip mounting station, and copper sheet mounting station respectively. Combined with the fixed physical position offset of each station and the work platform, the processing parameters corresponding to each station are generated synchronously. Specifically, these include the dispensing path parameters of the dispensing station, the mounting correction parameters of the chip mounting station, and the punching and mounting correction parameters of the copper sheet mounting station, ensuring that the processing parameters of each station are generated based on the same reference and that there is no reference deviation between the parameters.

[0063] S203 synchronously sends the processing parameters of all stations to the corresponding execution units at the same time, controls the processing actions of each station to start synchronously based on the same reference parameters, and ensures that the processing actions of each station are carried out synchronously under the same reference and the same timing, eliminating the problem of long cycle caused by parameter time-sharing and serial execution of processing actions in the prior art.

[0064] By synchronously generating and distributing processing parameters for all workstations using a global reference coordinate system, this technology achieves the same-source generation and synchronous execution of processing parameters across multiple workstations. This replaces the existing serial mode where each workstation generates its own process parameters based on its own positioning reference and then distributes and executes them in time slots. This ensures the consistency of the reference for processing parameters across all workstations, further improving processing accuracy, and significantly shortens the processing cycle of a single substrate, thereby increasing the mass production efficiency of IC packaging processes. Simultaneously, since all processing parameters are generated based on the same global reference, it avoids processing deviations caused by multiple reference parameters, ensuring the consistency and accuracy of processing actions across all processes.

[0065] The S300 simultaneously acquires real-time processing images of each workstation while performing processing actions. It compares the real-time processing images with the standard features corresponding to the global reference coordinates, and simultaneously completes chip mounting position verification, copper sheet picking status detection, and final inspection of finished product connection points, obtaining the corresponding comparison results.

[0066] In this embodiment of the invention, the specific execution process of S300 is as follows:

[0067] S301, while performing processing actions at each workstation, initiates a synchronous visual inspection operation. Using the synchronous trigger signal corresponding to the global reference coordinates locked in this processing cycle, it synchronously retrieves the image acquisition unit of each processing workstation and synchronously acquires real-time processing images of the chip mounting workstation, copper sheet transfer workstation, and finished product final inspection workstation. This ensures that the image acquisition is completely synchronized with the completion time of the corresponding workstation's processing action, with no acquisition timing difference.

[0068] S302, preprocess the real-time processing images of each station that are acquired synchronously, and extract the target feature information from each real-time processing image. The target feature information includes the contour coordinate information of the chip mounting position in the chip mounting station image, the quantity and position coordinate information of the copper sheet in the copper sheet transfer station image, and the path contour information of the finished product connection position in the finished product final inspection station image.

[0069] The S303 assigns independent computing channels to three inspection tasks: chip mounting position verification, copper sheet pickup status detection, and final inspection of finished product connection points. Each computing channel performs feature comparison calculations synchronously based on the standard feature parameters corresponding to the global reference coordinates of the current processing cycle. The extracted target feature information is compared with the standard feature parameters corresponding to the global reference coordinates in parallel. The comparison calculation results of each computing channel are output synchronously without any time difference.

[0070] S304 obtains the coordinate deviation value of the chip mounting position, the quantity and position deviation value of the copper sheet, and the path overlap value of the finished product connection position through each independent calculation channel. The values ​​obtained by the above calculation are used as the comparison results of the corresponding workstation to ensure that each detection result is calculated based on the same global reference coordinates and there is no reference deviation.

[0071] S305. Perform preliminary verification on the comparison results of all workstations to confirm that all comparison results carry the identification information of the corresponding workstation and the binding identifier of the global reference coordinate of the current processing cycle, ensuring that the comparison results are accurately matched with the current processing cycle and the corresponding workstation, and that there are no data mismatch issues.

[0072] Synchronous acquisition of multi-station processing images is achieved through a synchronous trigger signal based on global reference coordinates, replacing the serial mode of independent trigger acquisition and time-division detection at each station in the existing technology. This ensures the synchronization of all detection steps with processing actions from a timing perspective, avoiding detection deviations caused by differences in acquisition timing. Simultaneously, through multi-channel parallel comparison operations, chip mounting verification, copper sheet picking and detection, and final product inspection are completed synchronously, significantly improving detection efficiency. Furthermore, all detection comparisons are based on the same global reference coordinates, completely solving the problems of insufficient processing accuracy and frequent misjudgments and omissions caused by asynchronous multi-station detection and inconsistent references in the existing technology. In addition, the synchronous detection mode enables real-time quality control throughout the entire processing process, allowing for real-time acquisition of the processing quality status of each process step.

[0073] S400: When the comparison result of any station exceeds the preset threshold, the current processing cycle is immediately terminated and a waste disposal instruction is triggered. When all comparison results meet the preset threshold, the qualified substrate is output as a unloading instruction after the entire process is completed.

[0074] In this embodiment of the invention, the specific execution process of S400 is as follows:

[0075] S401: Obtain the comparison results of all workstations output in step S300, retrieve the preset deviation thresholds for each workstation, and compare the comparison results of each workstation with the corresponding preset thresholds one by one to confirm the compliance of the processing quality of each workstation.

[0076] S402, when the comparison result of any station exceeds the preset threshold, immediately send a processing termination command to the execution unit of all stations simultaneously to stop the subsequent processing actions of all stations, so as to avoid the waste of raw materials caused by the continuous processing of defective products; at the same time, based on the station information corresponding to the comparison result that exceeds the threshold, trigger the corresponding waste disposal command. If the copper sheet picking status detection result exceeds the threshold, control the nozzle to transfer all picked copper sheets to the waste collection station for centralized disposal. After the waste disposal is completed, execute the reset operation of all stations to prepare for the next processing cycle.

[0077] S403, when the comparison results of all workstations meet the preset threshold, it is confirmed that the processing quality of all processes in this processing cycle is compliant. Based on the global reference coordinates locked in this processing cycle, the final full feature compliance review of the substrate that has completed the entire process is carried out to ensure that all processing positions of the substrate meet the packaging accuracy requirements and that no inspection items are missed.

[0078] S404 After the final full feature compliance review is passed, a qualified substrate unloading instruction is generated, and the control platform is used to move the substrate to the unloading station. At the same time, the global reference coordinates in the storage unit of this processing cycle are cleared, completing the full closed-loop operation of this processing cycle and preparing for the processing flow of the next substrate to be processed.

[0079] By achieving synchronous control of the process through comparison results based on synchronous detection, the processing actions of all workstations can be immediately and synchronously terminated when processing deviations occur at any workstation. This enables rapid response to processing anomalies, avoids the waste of raw materials such as substrates, chips, and copper strips caused by the continuous processing of defective products, and reduces the production cost of the packaging process. At the same time, compliance verification based on the same global reference coordinate throughout the entire process ensures the accuracy of finished product inspection, avoids misjudgment problems caused by multiple reference detections, and significantly improves the yield of packaged products. In addition, by clearing the global reference coordinate after the processing cycle, it is ensured that the reference parameters of each processing cycle are independent and free from data crosstalk, guaranteeing the uniqueness and accuracy of the processing reference of each substrate during mass production.

[0080] Based on the solutions in the embodiments of this application, and combined with the mass production scenario of wire bondless packaging for power semiconductor devices, the wire bondless packaging process for power semiconductor devices involves multiple processing stations such as material loading, dispensing, chip mounting, copper strip punching and mounting, and quality inspection, which places extremely high demands on positioning accuracy, processing efficiency, and yield. Traditional solutions adopt a mode of independently configuring vision units at each station, independent positioning, step-by-step processing, and serial inspection. The entire process cycle of a single substrate is relatively long, and cumulative positioning errors are easily generated due to inconsistent benchmarks at multiple stations. The positional accuracy of chip mounting and copper strip mounting is difficult to guarantee, limiting the product yield. At the same time, the response to anomalies is lagging, which can easily lead to the waste of valuable raw materials such as substrates, chips, and copper strips, making it difficult to meet the mass production requirements of high-density, high-precision power semiconductor packaging.

[0081] After using the solution in the embodiments of the present invention, step S100 is executed first. After the substrate is transferred to the work platform and clamped and fixed, the global image acquisition unit completes the single image acquisition of the entire substrate. After image preprocessing and full-station coordinate system mapping and binding are completed, a global reference coordinate covering all processing stations is generated as the unique reference parameter for all stations in this processing cycle. There is no need for each station to perform positioning operations separately, which significantly shortens the positioning time of the entire process.

[0082] After step S100 is completed, step S200 is automatically initiated. Based on the generated global reference coordinates, processing parameters for dispensing, chip mounting, and copper sheet mounting stations are generated synchronously and simultaneously sent to the execution units of each station. This controls each station to start processing actions synchronously based on the same reference, replacing the traditional method of generating parameters serially and executing processing step by step. This significantly reduces processing time, and all processing actions are executed based on the same reference, eliminating the cumulative positioning error of multiple processes from the root.

[0083] While performing processing actions at each workstation, the S300 step is automatically executed. Based on the synchronous trigger signal corresponding to the global reference coordinates, the image acquisition units of each workstation are synchronously retrieved to complete the synchronous acquisition of real-time processing images. Parallel comparison calculations are completed through multiple independent computing channels, and chip mounting position verification, copper sheet picking status detection, and final inspection of finished product connection positions are completed synchronously. The comparison results are obtained synchronously. The entire inspection process is carried out synchronously with the processing actions, without the need to add an extra inspection cycle. Moreover, all inspections are completed based on the same global reference, which significantly improves the inspection accuracy and reliability of the inspection results.

[0084] Finally, step S400 is executed, and compliance is determined based on the synchronously acquired comparison results. When any processing deviation occurs at any workstation, the processing action of all workstations is immediately terminated synchronously, and the corresponding waste disposal instruction is triggered to avoid continuous waste of raw materials. When all comparison results are compliant, the final full feature review is completed and a material unloading instruction is generated to complete the entire process of this processing cycle.

[0085] This solution can significantly shorten the entire processing cycle of a single substrate, greatly improve mass production efficiency, and effectively improve the placement accuracy of chips and copper sheets, significantly improve packaging processing accuracy, and greatly improve and stabilize product yield. At the same time, it enables rapid response and timely handling of processing anomalies, greatly reducing raw material loss during the production process. It perfectly solves the technical problems of low processing accuracy, poor mass production efficiency, and high raw material loss caused by inconsistent visual positioning benchmarks and asynchronous detection in multi-station IC packaging in traditional solutions, and fully meets the mass production requirements of high-density, high-precision power semiconductor wire bonding packaging.

[0086] In this embodiment of the application, the method further includes the following steps in generating global reference coordinates covering all machining stations:

[0087] First, distortion correction and grayscale normalization preprocessing are performed on the single-acquired image of the substrate to be processed to eliminate image deviations caused by lens distortion and uneven illumination. The pixel coordinates of at least two sets of globally positioned marker points distributed diagonally on the substrate surface are extracted. Based on the coordinates of multiple sets of marker points, the conversion and calibration between pixel coordinates and device physical coordinates are completed to ensure the accuracy and reliability of coordinate conversion.

[0088] In addition, based on the calibrated reference coordinate values ​​and the fixed physical position parameters of each processing station and the work platform, a unified mapping and binding of the coordinate systems of all processing stations and the work platform is completed to ensure that all stations are in the same physical coordinate system and to eliminate positioning errors caused by physical position deviations between stations.

[0089] Furthermore, after the coordinate system mapping and binding is completed, the mapping and binding accuracy of each processing station is checked one by one. When the verification deviation exceeds the preset calibration threshold, the mapping and binding operation is re-executed. After the verification is passed, global reference coordinates are generated by combining the substrate processing station feature information and written into the storage unit of this processing cycle.

[0090] Finally, the global reference coordinates written to the storage unit are verified for reference uniqueness to confirm that they serve as the unique reference parameter for all workstation vision operations within this processing cycle, with no other parallel reference parameters involved.

[0091] By using high-precision calibration with multiple marker points, mapping of the entire workstation coordinate system, and binding accuracy closed-loop verification, the generation accuracy of global reference coordinates has been further improved, providing stable and reliable reference support for the entire process of processing and inspection, and fundamentally avoiding the cumulative error problem caused by multi-reference positioning.

[0092] In this embodiment of the application, the method further includes, during the process of comparing the real-time processed image with the standard features corresponding to the global reference coordinates and synchronously completing multi-station quality inspection:

[0093] Using the synchronous trigger signal corresponding to the global reference coordinates locked in this processing cycle, the image acquisition units of each processing station are synchronously retrieved. At the same moment when the processing action of the corresponding station is completed, real-time processing images of the chip mounting station, copper sheet transfer station, and finished product final inspection station are synchronously acquired to ensure that there is no time difference between image acquisition and processing action.

[0094] After preprocessing the real-time processing images of each workstation acquired synchronously, target feature information is extracted from each image, including the contour coordinates of the chip mounting position, the quantity and position coordinates of the copper sheet, and the path contour information of the finished product connection position, providing accurate feature data for subsequent comparison and calculation.

[0095] Independent computing channels are allocated to the three testing tasks. Each computing channel performs feature comparison calculations synchronously based on the standard feature parameters corresponding to the global reference coordinates, and obtains the chip mounting position coordinate deviation value, the copper sheet quantity and position deviation value, and the finished product connection path overlap value, which are used as the comparison results of the corresponding workstation.

[0096] Finally, all comparison results are bound and verified to workstations and processing cycles to ensure that the comparison results are accurately matched with the current cycle and corresponding workstations, and that there are no data mismatch issues.

[0097] By employing synchronous image acquisition, multi-dimensional feature extraction, and multi-channel parallel comparison operations, simultaneous inspection of processing quality at multiple workstations was achieved, significantly improving inspection efficiency and accuracy, and avoiding timing deviations and benchmark mismatches caused by serial inspection.

[0098] In this embodiment of the application, during the process of synchronously retrieving the image acquisition units of each processing station using the synchronous trigger signal corresponding to the global reference coordinates, the method further includes:

[0099] Based on the global reference coordinates generated in this processing cycle, a unique synchronous trigger clock signal is generated. The trigger timing of this clock signal is calibrated to match the processing action timing of each station in this processing cycle, ensuring that the trigger timing is completely consistent with the completion time of the corresponding station's processing action.

[0100] The generated synchronous trigger clock signal is simultaneously sent to the image acquisition units corresponding to the chip mounting station, copper sheet transfer station, and finished product final inspection station, establishing a one-to-one trigger association between the clock signal and each acquisition unit, ensuring that the signal is sent to all target units without delay or out of order.

[0101] Furthermore, by synchronously triggering the clock signal, each image acquisition unit is controlled to execute the image acquisition operation synchronously at the same moment when the corresponding workstation processing action is completed. The timing of the action execution of each acquisition unit is monitored in real time to ensure that all acquisition actions are completed at the same timing node.

[0102] Finally, the image acquisition completion status of each acquisition unit is synchronously confirmed to ensure that the real-time processing images of all workstations are acquired synchronously without any omissions or delays.

[0103] By using a unique synchronous trigger clock signal that matches the processing timing, precise synchronization of multi-station image acquisition is achieved, completely eliminating timing differences in image acquisition, avoiding detection deviations caused by asynchronous processing and acquisition, and improving the reliability of synchronous detection.

[0104] In this embodiment of the application, the method further includes the following steps during the process of synchronously acquiring real-time processing images of each workstation:

[0105] While each image acquisition unit completes real-time processing image acquisition based on the synchronous trigger clock signal, it adds a unique timestamp mark corresponding to the synchronous trigger clock signal to each acquired real-time processing image, ensuring that the timestamp corresponds one-to-one with the global reference coordinates of this processing cycle.

[0106] All real-time processed images with timestamps are subjected to integrity verification to confirm that the image content is complete and the timestamps are clear and traceable. Invalid images without timestamps or with mismatched timestamps are removed to ensure the validity of the images used in subsequent comparison operations.

[0107] Based on the timestamp carried by the image, the real-time processing images synchronously collected by each workstation are rigidly bound and matched one by one with the global reference coordinates of the current processing cycle, establishing a unique association between the image, timestamp, and global reference coordinates.

[0108] Finally, compliance verification is performed on the image data that has been bound and matched to ensure that all image data used for comparison calculations are generated based on the same time series and the same benchmark, without cross-period or cross-benchmark data crosstalk.

[0109] By rigidly binding and matching timestamp markers with global reference coordinates, the temporal consistency and reference homology of the image data used for detection are ensured, avoiding misjudgment and missed judgment caused by data crosstalk in mass production, and further ensuring the accuracy of the comparison calculation results.

[0110] In this embodiment of the application, the method further includes, during the process of synchronously generating and distributing machining parameters for each workstation based on global reference coordinates:

[0111] Based on the global reference coordinates locked in this processing cycle, the standard processing feature parameters corresponding to the dispensing station, chip mounting station, and copper sheet mounting station are extracted respectively. Combined with the fixed physical position offset of each station and the work platform, the processing parameters corresponding to each station are generated synchronously.

[0112] While synchronously generating the processing parameters for each workstation, the consistency of the reference of all processing parameters is checked one by one to confirm that all parameters are generated based on the global reference coordinates of this processing cycle. When a mismatch occurs in the parameter reference, the processing parameters for the corresponding workstation are immediately regenerated.

[0113] All processing parameters that have passed verification are simultaneously sent to the corresponding execution units at the same time. At the same time, the parameter receiving status of each execution unit is synchronously verified to confirm that all execution units have received the corresponding processing parameters at the same time.

[0114] Based on the synchronously issued processing parameters, processing start commands are synchronously issued to each execution unit to control the processing actions of each station to start and execute synchronously based on the same reference parameters, ensuring that there is no time difference in the start of processing actions.

[0115] By generating processing parameters synchronously from the same source, verifying the consistency of the benchmark, and confirming the synchronous transmission and reception, the benchmark uniformity of processing parameters at each workstation and the synchronicity of action execution are ensured. This avoids processing deviations caused by parameter benchmark mismatch and transmission timing differences, thereby improving process stability.

[0116] In this embodiment of the application, during the parallel comparison operation of the extracted target feature information with the standard feature parameters corresponding to the global reference coordinates, the method further includes:

[0117] For the three inspection tasks of chip mounting position verification, copper strip picking status detection, and final inspection of finished product connection points, independent computing channels are allocated to each other. Each computing channel is only responsible for the comparison calculation of the corresponding inspection task, and the data between channels are isolated from each other and do not interfere with each other.

[0118] The standard feature parameters corresponding to the global reference coordinates of the current processing cycle, as well as the target feature information extracted from the corresponding workstation, are synchronously sent to each independent computing channel to ensure that all computing channels receive the complete data required for computing at the same time, without any data transmission timing difference.

[0119] Each independent computing channel is controlled to synchronously perform feature comparison operations based on the received standard feature parameters and target feature information. The computing process of each channel is synchronized and calibrated in real time to ensure that the computing processes of all channels remain completely consistent without any timing difference.

[0120] The comparison results of each computing channel are output synchronously to ensure that the judgment results of the three detection tasks are generated at the same time node, providing a synchronous judgment basis for subsequent process control.

[0121] By allocating independent computing channels to multiple detection tasks and performing full-process synchronous comparison operations, the efficiency of detection operations is greatly improved, and the timing deviation caused by serial operations is avoided. This ensures that all detection results are generated based on the same processing state and benchmark, thereby improving the accuracy of the detection results.

[0122] In this embodiment of the application, the method further includes, during the process of terminating the processing cycle and triggering a waste disposal instruction based on the comparison result:

[0123] When the comparison result of any workstation exceeds the preset threshold, a processing termination command is immediately sent to the execution units of all workstations to stop the subsequent processing actions of all workstations. At the same time, the stopping status of the processing actions of all workstations is confirmed in real time to ensure that no workstation continues to perform processing operations.

[0124] Based on the workstation information corresponding to the comparison results that exceed the threshold, the corresponding waste disposal instruction is triggered. If the detection result of copper sheet picking status exceeds the threshold, the suction nozzle is immediately controlled to transfer all picked copper sheets to the waste collection station for centralized disposal, so as to avoid abnormal copper sheets causing equipment failure.

[0125] After the waste disposal operation is completed, all relevant data of the processing anomaly are stored and recorded, including information on the abnormal workstation, the deviation value of the comparison result, the time of the anomaly, and the handling process of the anomaly, forming a complete anomaly event file.

[0126] After the abnormal data storage is completed, a full-station reset operation is performed to clear the invalid data and processing instructions of this processing cycle and prepare for the execution process of the next processing cycle.

[0127] By synchronously terminating all workstations when an anomaly occurs, handling targeted waste materials, and recording anomaly data throughout the entire process, the system ensures rapid and reliable handling of processing anomalies, avoids waste of raw materials and equipment failure, and provides data support for subsequent equipment debugging and process optimization, thereby improving the practicality of the solution.

[0128] In this embodiment of the application, the method further includes, during the process of outputting a qualified substrate unloading instruction based on the compliance comparison result:

[0129] First, when the comparison results of all workstations meet the preset threshold, based on the global reference coordinates locked in this processing cycle, a final full feature compliance review is performed on the substrate that has completed the entire process, covering all processing positions of the substrate to ensure that no inspection items are missed and to ensure that the quality of the finished product meets the packaging accuracy requirements.

[0130] After the final full feature compliance review is passed, a qualified substrate unloading instruction is generated. The control platform moves the processed substrate to the unloading station and clears the global reference coordinates in the storage unit of this processing cycle to ensure that the reference parameters of each processing cycle are independent and there is no data crosstalk.

[0131] While generating the material feeding instruction, the entire process data, including global reference coordinates, processing parameters, comparison results, and verification data, is stored together to form a complete process traceability file for a single substrate, ensuring that the file data is complete and traceable.

[0132] Finally, after the substrate unloading operation is completed, the processing traceability file is uploaded to the production management system to achieve traceability management of the entire product processing process and meet the production control and compliance requirements of the semiconductor packaging industry.

[0133] By conducting a final full feature verification of finished products, clearing the processing cycle benchmark in a closed loop, and managing the entire process traceability archives, we not only ensure the quality of finished product shipments but also avoid data crosstalk in mass production, while meeting the industry's production control and compliance requirements.

[0134] This application discloses a multi-station synchronous visual positioning and quality inspection system, referring to... Figure 2 ,include:

[0135] The global reference generation module 001 acquires a single image of the substrate to be processed on the work platform, extracts the feature information of the chip mounting position, electrode position and pin connection position of the substrate in the image, generates global reference coordinates covering all processing stations, and uses the global reference coordinates as the only reference parameter for visual operation of all stations in this processing cycle.

[0136] The synchronous parameter distribution module 002, based on global reference coordinates, synchronously generates dispensing path parameters for the dispensing station, placement correction parameters for the chip placement station, and punching and placement correction parameters for the copper sheet placement station, and synchronously distributes them to the execution units of the corresponding stations.

[0137] The synchronous visual inspection module 003 simultaneously acquires real-time processing images of each workstation while performing processing actions at each workstation. It compares the real-time processing images with the standard features corresponding to the global reference coordinates, and simultaneously completes chip mounting position verification, copper sheet picking status detection, and final inspection of finished product connection positions, and obtains the corresponding comparison results.

[0138] The cycle control execution module 004 immediately terminates the current processing cycle and triggers a waste disposal command when the comparison result of any station exceeds the preset threshold. When all comparison results meet the preset threshold, it outputs a qualified substrate unloading command after completing the entire process.

[0139] This application also discloses a multi-station synchronous visual positioning and quality inspection method, including a processor, wherein the processor runs a program of the multi-station synchronous visual positioning and quality inspection method described in any one of the above embodiments.

[0140] This application also discloses a storage medium storing the program of the multi-station synchronous visual positioning and quality inspection method described in any one of the above embodiments.

[0141] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A multi-station synchronous visual positioning and quality inspection method, characterized in that, include: Acquire a single image of the substrate to be processed on the work platform, extract the feature information of the chip mounting position, electrode position and pin connection position of the substrate in the image, generate global reference coordinates covering all processing stations, and use the global reference coordinates as the unique reference parameter for visual operation of all stations in this processing cycle. Based on the global reference coordinates, the dispensing path parameters of the dispensing station, the mounting correction parameters of the chip mounting station, and the punching and mounting correction parameters of the copper sheet mounting station are generated synchronously and sent to the execution unit of the corresponding station. While performing processing actions at each workstation, real-time processing images of each workstation are simultaneously acquired. The real-time processing images are compared with the standard features corresponding to the global reference coordinates. Simultaneously, chip mounting position verification, copper sheet picking status detection, and final inspection of finished product connection points are completed to obtain the corresponding comparison results. When the comparison result of any workstation exceeds the preset threshold, the current processing cycle is immediately terminated and a waste disposal instruction is triggered. When all comparison results meet the preset threshold, the entire process is completed and a qualified substrate unloading instruction is output.

2. The multi-station synchronous visual positioning and quality inspection method according to claim 1, characterized in that, The step of generating global reference coordinates covering all machining stations includes: Distortion correction and grayscale normalization are performed on the image of the substrate to be processed acquired in a single acquisition. The pixel coordinates of the preset global positioning markers on the substrate surface are extracted, and the conversion and calibration between pixel coordinates and device physical coordinates are performed. Based on the calibrated reference coordinate values, and combined with the fixed physical position parameters of each processing station and the work platform, a unified mapping and binding is performed between the coordinate systems of all processing stations and the coordinate system of the work platform. Based on the unified mapping and binding coordinate system, combined with the extracted feature information of substrate chip mounting position, electrode position, and pin connection position, a global reference coordinate covering all processing positions is generated, and the global reference coordinate is written into the storage unit of the current processing cycle.

3. The multi-station synchronous visual positioning and quality inspection method according to claim 1, characterized in that, The steps of comparing the real-time processed image with the standard features corresponding to the global reference coordinates, simultaneously completing chip mounting position verification, copper sheet pickup status detection, and final inspection of finished product connection points, and obtaining the corresponding comparison results include: Using the synchronous trigger signal corresponding to the global reference coordinates locked in this processing cycle, the image acquisition units of each processing station are synchronously retrieved to acquire real-time processing images of the chip mounting station, copper sheet transfer station, and finished product final inspection station. The target feature information is extracted from each real-time processing image. The target feature information includes the contour coordinate information of the chip mounting position, the quantity and position coordinate information of the copper sheet, and the path contour information of the finished product connection position. The extracted target feature information is compared and calculated in parallel with the standard feature parameters corresponding to the global reference coordinates. The coordinate deviation values ​​of the chip mounting position, the quantity and position deviation values ​​of the copper sheets, and the path overlap values ​​of the finished product connection points are obtained respectively. The values ​​obtained from the above calculations are used as the comparison results of the corresponding workstations.

4. The multi-station synchronous visual positioning and quality inspection method according to claim 3, characterized in that, The step of synchronously retrieving the image acquisition units of each processing station from the synchronization trigger signal corresponding to the global reference coordinates locked in this processing cycle includes: Based on the global reference coordinates generated in this processing cycle, a unique synchronous trigger clock signal is generated. The triggering sequence of the synchronous trigger clock signal is matched one by one with the processing action sequence of each station in this processing cycle. The synchronous trigger clock signal is simultaneously sent to the image acquisition units corresponding to the chip mounting station, copper sheet transfer station, and finished product final inspection station, so as to control each image acquisition unit to perform image acquisition operation synchronously at the same time when the corresponding station's processing action is completed.

5. The multi-station synchronous visual positioning and quality inspection method according to claim 4, characterized in that, The step of simultaneously acquiring real-time processing images of the chip mounting station, copper sheet transfer station, and finished product final inspection station includes: The real-time processed images acquired synchronously by each image acquisition unit are all marked with a timestamp corresponding to the synchronous trigger clock signal; Based on the timestamp, each real-time processed image is bound and matched with the global reference coordinates of the current processing cycle to ensure that all comparison operations are completed based on image data of the same time sequence and the same reference.

6. The multi-station synchronous visual positioning and quality inspection method according to claim 1, characterized in that, Based on the global reference coordinates, the dispensing path parameters for the dispensing station, the placement correction parameters for the chip placement station, and the punching and placement correction parameters for the copper sheet placement station are generated synchronously and sent to the execution units of the corresponding stations, including: Based on the global reference coordinates locked in this processing cycle, the standard processing feature parameters corresponding to the dispensing station, chip mounting station, and copper sheet mounting station are extracted respectively. Combined with the fixed physical position offset of each station and the work platform, the processing parameters corresponding to each station are generated synchronously. The processing parameters of all generated workstations are simultaneously sent to the execution units of the corresponding workstations, controlling the processing actions of each workstation to start and execute synchronously based on the same reference parameters.

7. The multi-station synchronous visual positioning and quality inspection method according to claim 3, characterized in that, The step of performing parallel comparison operations between the extracted target feature information and the standard feature parameters corresponding to the global reference coordinates includes: Independent computing channels are allocated to the three inspection tasks: chip mounting position verification, copper sheet picking status detection, and final inspection of finished product connection points. Each computing channel performs feature comparison calculations synchronously based on the standard feature parameters corresponding to the global reference coordinates of the current processing cycle, and the comparison calculation results of each computing channel are output synchronously.

8. The multi-station synchronous visual positioning and quality inspection method according to claim 1, characterized in that, In the step where the comparison result of any workstation exceeds a preset threshold, the step of immediately terminating the current processing cycle and triggering a waste disposal command includes: When the comparison result of any workstation exceeds the preset threshold, a processing termination command is immediately sent to the execution units of all workstations to stop the subsequent processing actions of all workstations simultaneously. Based on the workstation information corresponding to the comparison result exceeding the threshold, the corresponding waste processing instruction is triggered. If the detection result of the copper sheet picking status exceeds the threshold, the suction nozzle is controlled to transfer all the picked copper sheets to the waste collection workstation for centralized disposal. After the waste processing is completed, the reset operation of the entire workstation is performed.

9. The multi-station synchronous visual positioning and quality inspection method according to claim 1, characterized in that, The step of outputting a blanking instruction for a qualified substrate after completing the entire processing flow when all comparison results meet the preset threshold includes: When the comparison results of all workstations meet the preset threshold, the final full feature compliance review of the substrate that has completed the entire process is carried out based on the global reference coordinates locked in this processing cycle. After the verification is passed, a qualified substrate unloading instruction is generated, and the control platform is used to move the substrate to the unloading station. At the same time, the global reference coordinates in the storage unit of this processing cycle are cleared.

10. A multi-station synchronous visual positioning and quality inspection system, characterized in that, include: The global reference generation module acquires a single image of the substrate to be processed on the work platform, extracts the feature information of the chip mounting position, electrode position and pin connection position of the substrate in the image, generates global reference coordinates covering all processing stations, and uses the global reference coordinates as the unique reference parameter for visual operation of all stations in this processing cycle. The synchronous parameter distribution module, based on the global reference coordinates, synchronously generates dispensing path parameters for the dispensing station, placement correction parameters for the chip placement station, and punching and placement correction parameters for the copper sheet placement station, and synchronously distributes them to the execution units of the corresponding stations. The synchronous visual inspection module simultaneously acquires real-time processing images of each workstation while performing processing actions. It compares the real-time processing images with the standard features corresponding to the global reference coordinates, and simultaneously completes chip mounting position verification, copper sheet picking status detection, and final inspection of finished product connection points, and obtains the corresponding comparison results. The cycle control execution module immediately terminates the current processing cycle and triggers a waste disposal instruction when the comparison result of any station exceeds the preset threshold. When all comparison results meet the preset threshold, the module completes the entire processing process and outputs a qualified substrate unloading instruction.

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