Electronic package structure and method of manufacturing the same
By incorporating reinforcing structures and encapsulants into the semiconductor packaging structure, the problem of poor heat dissipation in fan-out stacked packaging structures is solved, improving the strength and yield of the packaging structure and ensuring the bonding of high-quality components.
CN122373867APending Publication Date: 2026-07-10ADVANCED SEMICON ENG INC
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ADVANCED SEMICON ENG INC
- Filing Date
- 2025-12-25
- Publication Date
- 2026-07-10
Smart Images
Figure CN122373867A_ABST
Abstract
An electronic package structure and a method of manufacturing the same are provided. The electronic package structure includes a metal-containing layer, an electronic component, an encapsulation, and a reinforcement structure. The electronic component is disposed over the metal-containing layer. The encapsulation encapsulates the electronic component and defines a designated cavity. The reinforcement structure contacts the metal-containing layer and overlaps a vertical projection of the designated cavity. A stiffness of the reinforcement structure is greater than a stiffness of the metal-containing layer.
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