Installation structure, antenna module, and communication device

Abstract

The mounting structure (1) includes: a dielectric body (10); a ground electrode (14) disposed on the dielectric body; a first line (11) disposed on the dielectric body opposite to the ground electrode; a second line (12) disposed on the dielectric body opposite to the ground electrode, between the first line and the ground electrode in the normal direction of the dielectric body; a connecting conductor (15) connecting the first line and the second line; and a stub (13) extending from the connection portion of the first line connected to the connecting conductor, disposed on the dielectric body opposite to the ground electrode and the second line. The thickness of the first line in the normal direction is greater than the thickness of the second line in the normal direction. The second line extends in the same direction as the first line. The stub extends in the same direction as the second line. When the dielectric body is viewed from the normal direction, at least a portion of the stub overlaps with the second line in the direction of extension.

Description

Technical Field

[0001] This disclosure relates to an installation structure for a transmission line that transmits signals, an antenna module including the installation structure, and a communication device equipped with the antenna module. Background Technology

[0002] Conventionally, it is known to use mounting structures for transmission lines that transmit signals between multiple lines of varying thicknesses. In such mounting structures, due to differences in capacitance caused by the difference in distance between the thicker transmission line and the ground electrode and the thinner transmission line and the ground electrode, the impedance differs between the thicker and thinner transmission lines, potentially increasing transmission loss between the transmission lines.

[0003] In this regard, Japanese Patent Application Publication No. 2006-128868 (Patent Document 1) discloses a connection circuit that uses a connecting conductor to connect a thicker transmission line disposed on a conductor base to a thinner transmission line, and connects a high-impedance line in parallel with the thinner transmission line.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2006-128868 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] According to the connection circuit disclosed in Japanese Patent Application Publication No. 2006-128868, the difference in capacitance caused by the difference between the distance between a thicker transmission line and the conductor base and the distance between a thinner transmission line and the conductor base can be adjusted by using a high-impedance line, and impedance matching can be achieved in both thicker and thinner transmission lines.

[0009] However, the impedance matching technology disclosed in Japanese Patent Application Publication No. 2006-128868 can only be applied to structures in which two transmission lines of different thicknesses are set on the main surface of the conductor base. Therefore, in structures in which the thinner transmission line is set in the inner layer of the dielectric and the thicker transmission line is connected between the layers of the dielectric, impedance matching cannot be achieved well.

[0010] This disclosure was made to solve such a problem, and its purpose is to provide a technique for achieving good impedance matching in a structure in which multiple transmission lines of different thicknesses are connected between layers of dielectric material.

[0011] Solution for solving the problem

[0012] The mounting structure for the transmission line of the signal transmission disclosed herein includes: a dielectric body; a ground electrode disposed on the dielectric body; a first line disposed on the dielectric body opposite to the ground electrode; a second line disposed on the dielectric body opposite to the ground electrode, between the first line and the ground electrode in the normal direction of the dielectric body; a connecting conductor connecting the first line and the second line; and a stub extending from a connection portion of the first line connected to the connecting conductor, disposed on the dielectric body opposite to the ground electrode and the second line. The thickness of the first line in the normal direction is greater than the thickness of the second line in the normal direction. The second line extends in the same direction as the first line. The stub extends in the same direction as the second line. When the dielectric body is viewed from the normal direction, at least a portion of the stub overlaps with the second line in the direction of extension.

[0013] The effects of the invention

[0014] In the mounting structure disclosed herein, a stripline is formed between the microstrip line consisting of a first line and a ground electrode and the microstrip line consisting of a second line and a ground electrode, wherein the second line is sandwiched between the ground electrode and a stub wire. By utilizing such a stripline to adjust the impedance, good impedance matching can be achieved even in a structure where the thicker first line and the thinner second line are connected between layers of dielectric material. Attached Figure Description

[0015] Figure 1 This is a perspective view of the installation structure of the transmission line according to Embodiment 1.

[0016] Figure 2 This is a cross-sectional view of the installation structure of Embodiment 1.

[0017] Figure 3 This is a diagram showing the structure of the antenna device including the mounting structure according to Embodiment 1.

[0018] Figure 4 This is a diagram showing the structure of an antenna module including an antenna device and a communication device according to Embodiment 1.

[0019] Figure 5 This is a diagram showing the structure of the antenna device in Embodiment 2.

[0020] Figure 6 This is a diagram showing the structure of the antenna device in Embodiment 3.

[0021] Figure 7 This is a diagram showing the structure of the antenna device in Embodiment 4.

[0022] Figure 8 This is a diagram showing the structure of the antenna device in Embodiment 5.

[0023] Figure 9 This is a perspective view of the installation structure of the transmission line in a modified example.

[0024] Figure 10 This is a cross-sectional view of the installation structure of a modified transmission line. Detailed Implementation

[0025] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Furthermore, the same or equivalent parts in the drawings will be labeled with the same reference numerals, and their descriptions will not be repeated.

[0026] <Implementation Method 1>

[0027] [Installation Construct]

[0028] Reference Figure 1 and Figure 2 The following describes the installation structure 1 of the transmission line in Embodiment 1. Figure 1 This is a perspective view of the installation structure 1 of the transmission line according to Embodiment 1. Figure 2 This is a cross-sectional view of the mounting structure 1 according to Embodiment 1. For example, the mounting structure 1 is a mounting substrate that constitutes a transmission line for transmitting high-frequency signals.

[0029] like Figure 1 and Figure 2 As shown, the mounting structure 1 includes a dielectric body 10, a grounding electrode 14, a first line 11, a second line 12, and a connecting conductor 15. Hereinafter, the structure of the mounting structure 1 will be described by designating the axis along the width direction of the dielectric body 10 as the X-axis, the axis along the length direction of the dielectric body 10 as the Y-axis, and the axis along the height direction (normal direction) of the dielectric body 10 as the Z-axis.

[0030] The dielectric 10 is a multilayer resin substrate formed by stacking multiple resin layers. The dielectric 10 is formed, for example, from resins such as low-temperature co-fired ceramics (LTCC), epoxy, or polyimide. Alternatively, the dielectric 10 may also be formed from other resins such as liquid crystal polymers (LCP), fluorine-based resins, or ceramics other than LTCC, which have a lower dielectric constant.

[0031] The ground electrode 14 is disposed in a layer inside the dielectric 10. The ground electrode 14 has a flat plate shape along the XY plane.

[0032] The first line 11 is disposed on the dielectric 10 opposite to the ground electrode 14. Figure 1 and Figure 2In the example shown, the first line 11 is disposed on the main surface 10A of the dielectric 10. The first line 11 has a cuboid shape and extends in the Y-axis direction on the main surface 10A of the dielectric 10. Figure 2 As shown, in the mounting structure 1, the microstrip line 71 is formed by the first line 11 and the ground electrode 14.

[0033] The second line 12 is disposed in a layer inside the dielectric 10 between the first line 11 and the ground electrode 14 in the Z-axis direction of the dielectric 10, opposite to the ground electrode 14 and the first line 11. Specifically, the second line 12 is disposed in a layer inside the dielectric 10 located between the main surface 10A of the dielectric 10 where the first line 11 is disposed and the layer inside the dielectric 10 where the ground electrode 14 is disposed. The second line 12 extends in the positive Y-axis direction, the same direction as the first line 11. Figure 2 As shown, in the mounting structure 1, the microstrip line 72 is formed by the second line 12 and the ground electrode 14.

[0034] like Figure 1 As shown, the end of the first line 11 is connected to the electrode plate 20. The electrode plate 20 receives high-frequency signals from power supply wiring provided on another substrate (not shown) and transmits them to the mounting structure 1. A connecting conductor 15 is connected to the side of the first line 11 that is not connected to the electrode plate 20. The first line 11 is connected to the second line 12 via the connecting conductor 15. Specifically, the connecting conductor 15 is provided inside the dielectric 10 in a manner that spans the main surface 10A of the dielectric 10 where the first line 11 is located and the interior of the dielectric 10 where the second line 12 is located, in the Z-axis direction. The end of the second line 12 that is not connected to the connecting conductor 15 is connected to a radiating electrode (not shown) that radiates high-frequency signals.

[0035] That is, the high-frequency signal transmitted via the electrode plate 20 is transmitted in the first line 11, the connecting conductor 15, and the second line 12, and is radiated by a radiation electrode not shown.

[0036] The thickness (dimension in the Z-axis direction) of the first line 11 in the Z-axis direction is greater than the thickness (dimension in the Z-axis direction) of the second line 12 in the Z-axis direction. In addition, when viewing the main surface 10A of the dielectric 10 from the Z-axis direction, the width (dimension in the X-axis direction) of the first line 11 is greater than the width (dimension in the X-axis direction) of the second line 12.

[0037] Thus, the first line 11 is a line with a certain cross-section (XZ cross-section), so it can be stably connected with the electrode plate 20 and receive the high-frequency signal transmitted from the electrode plate 20 well while suppressing transmission loss, and can transmit the received high-frequency signal to the second line 12 while suppressing transmission loss.

[0038] On the other hand, the second line 12 has a smaller cross-section (XZ cross-section) than the first line 11, so even if the second line 12 is located inside the dielectric 10, it is not necessary to increase the size of the dielectric 10 for the second line 12. As a result, the miniaturization of the dielectric 10 can be achieved.

[0039] When viewing the main surface 10A of the dielectric 10 from the Z-axis direction, the cross-sectional area (XY section) of the connecting conductor 15 is wider than the width (X-axis dimension) of the second line 12 and narrower than the width (X-axis dimension) of the first line 11. Figure 1 In the example shown, the connecting conductor 15 has a cylindrical shape, and the diameter of the cross-section (XY section) of the connecting conductor 15 is wider than the width (X-axis dimension) of the second line 12 and narrower than the width (X-axis dimension) of the first line 11.

[0040] Therefore, when the manufacturer uses the connecting conductor 15 to connect the first line 11 and the second line 12, the connecting conductor 15 can be easily connected to the first line 11 within the width (X-axis dimension) of the first line 11, and the second line 12 can be easily connected to the connecting conductor 15 within the cross-section (XY section) of the connecting conductor 15.

[0041] In the mounting structure 1 configured as described above, the distance between the first line 11 in microstrip line 71 and the ground electrode 14 is different from the distance between the second line 12 in microstrip line 72 and the ground electrode 14. Figure 1 and Figure 2 In the example shown, the distance between the second line 12 in microstrip line 72 and the ground electrode 14 is smaller than the distance between the first line 11 in microstrip line 71 and the ground electrode 14. As a result, the capacitance component increases in microstrip line 72 compared to microstrip line 71, which may lead to impedance mismatch between the transmission lines constituting microstrip line 71 and microstrip line 72.

[0042] Furthermore, due to the different thicknesses of the first line 11 and the second line 12, impedance mismatch may occur in the transmission lines constituting the microstrip line 71 and the transmission lines constituting the microstrip line 72.

[0043] Therefore, the mounting structure 1 of embodiment 1 is configured in such a way that a short stub 13 extending from the connection portion connected to the connecting conductor 15 in the first line 11 can be used to achieve good impedance matching in the transmission line constituting the microstrip line 71 and the transmission line constituting the microstrip line 72.

[0044] Specifically, in the mounting structure 1, a connecting conductor 15 is connected midway through the first line 11, so that a portion of the first line 11 extending from the connection portion connected to the connecting conductor 15 functions as a stub 13. That is, the conductor constituting the stub 13 is the same as the conductor constituting the first line 11. The stub 13, which is a portion of the first line 11, is provided on the main surface 10A of the dielectric body 10 opposite to the ground electrode 14 and the second line 12, extending in the same direction (positive Y-axis direction) as the second line 12. The end of the stub 13 opposite to the connection portion of the connecting conductor 15 (positive Y-axis direction) is an open end. That is, the stub 13 is composed of an open-circuit stub.

[0045] The length of the portion of the first line 11 that does not function as a stub 13 in the Y-axis direction is shorter than the length of the portion that functions as a stub 13 in the Y-axis direction and the length of the second line 12 in the Y-axis direction. In the Z-axis direction, the distance between the second line 12 and the stub 13 is the same as the distance between the second line 12 and the ground electrode 14.

[0046] The stub 13 is a portion of the first line 11; therefore, the thickness (dimension in the Z-axis direction) of the stub 13 in the Z-axis direction is the same as the thickness (dimension in the Z-axis direction) of the first line 11 in the Z-axis direction, and is thicker than the thickness (dimension in the Z-axis direction) of the second line 12 in the Z-axis direction. Furthermore, when viewing the main surface 10A of the dielectric 10 from the Z-axis direction, the width (dimension in the X-axis direction) of the stub 13 is wider than the width (dimension in the X-axis direction) of the second line 12.

[0047] When viewing the main surface 10A of the dielectric 10 from the Z-axis direction, at least partially, the stub 13 overlaps with the second line 12 in the extension direction (Y-axis direction) of the second line. For example, as Figure 1 As shown, when viewing the main surface 10A of the dielectric 10 from the Z-axis direction, the stub 13 completely covers the second line 12 in the width direction (X-axis direction).

[0048] In the mounting structure 1 configured as described above, a strip line 73 is provided between the microstrip line 71 and the microstrip line 72 in the Y-axis direction, which is formed by clamping the second line 12 with the ground electrode 14 and the stub wire 13.

[0049] In the mounting structure 1, by constructing a stripline 73 using a stub 13 in the transmission path from microstrip line 71 to microstrip line 72, impedance can be adjusted in a way that avoids impedance mismatch in the transmission lines constituting microstrip line 71 and microstrip line 72.

[0050] Specifically, the portion of the second line 12 that overlaps with the stub 13 in the Y-axis direction constitutes a stripline 73, and the impedance of the transmission line constituting this stripline 73 is lower than the impedance of the transmission line constituting the microstrip line 71 formed by the first line 11. On the other hand, the portion of the second line 12 that does not overlap with the stub 13 in the Y-axis direction constitutes a microstrip line 72, and the impedance of the transmission line constituting this microstrip line 72 is the same as the impedance of the transmission line constituting the microstrip line 71 formed by the first line 11.

[0051] For example, if the impedance of the transmission line constituting microstrip line 71 is designed to be 50Ω, without microstrip line 73, the impedance of the transmission line constituting microstrip line 72 would be smaller than 50Ω. However, in the mounting structure 1, by adjusting the impedance using microstrip line 73, the impedance of the transmission line constituting microstrip line 72 can be made to be the same as the impedance of the transmission line constituting microstrip line 71, which is 50Ω.

[0052] Based on the above, even if the mounting structure 1 of Embodiment 1 is configured such that the first line 11 and the second line 12 with different thicknesses are connected by using connecting conductors 15 between the layers of the dielectric 10, impedance matching can be well achieved and the increase in transmission loss can be suppressed.

[0053] The thickness (dimension in the Z-axis direction) of the stub 13 is the same as the thickness (dimension in the Z-axis direction) of the first line 11 in the Z-axis direction. Therefore, when the stub 13 is regarded as a transmission line, its impedance is equal to that of the first line 11. Thus, in the mounting structure 1, unnecessary radiation from the stub 13 can be suppressed between the first line 11 and the stub 13.

[0054] When viewing the main surface 10A of the dielectric 10 from the Z-axis direction, the width (dimension in the X-axis direction) of the stub 13 is wider than the width (dimension in the X-axis direction) of the second line 12. Therefore, in the mounting structure 1, the stub 13 can effectively function as a grounding electrode in the strip 73 for the second line 12.

[0055] In the Z-axis direction, the distance between the second line 12 and the stub 13 is the same as the distance between the second line 12 and the ground electrode 14. Therefore, in the mounting structure 1, the strip 73 can be used to effectively adjust the impedance.

[0056] [Antenna Device]

[0057] Reference Figure 3 This describes the antenna device 101 of Embodiment 1. Figure 3 This is a diagram showing the structure of the antenna device 101 including the mounting structure 1 in Embodiment 1.

[0058] like Figure 3As shown, the antenna device 101 is a microstrip antenna (patch antenna) including a mounting structure 1 and a radiating electrode 31. The radiating electrode 31 is a flat electrode that radiates the high-frequency signal transmitted from the mounting structure 1 as an electromagnetic wave.

[0059] A radiating electrode 31 is disposed on the dielectric 10 constituting the mounting structure 1 and connected to the second line 12 via a connecting conductor (not shown). The point in the radiating electrode 31 that connects to the second line 12 becomes a power supply point 311. Specifically, one end of the second line 12 in the Y-axis direction is connected to the first line 11 via a connecting conductor 15, and the other end of the second line 12 in the Y-axis direction is connected to the second line 12 via a connecting conductor (not shown). The other end of the second line 12 connected to the radiating electrode 31 constitutes a portion of the microstrip line 72 excluding the stub 13. Thus, the stub 13 is separated from the radiating electrode 31 by a predetermined distance, and therefore does not affect the radiation of high-frequency signals using the radiating electrode 31.

[0060] When viewing the radiating electrode 31 from the Z-axis direction, the length A1 of the radiating electrode 31 in the direction connecting the power supply point 311 and the center point 312 (e.g., the Y-axis direction) is half the wavelength of the high-frequency signal transmitted within the substrate in the frequency band corresponding to the antenna device 101. That is, the length A1 of the radiating electrode 31 in the Y-axis direction is half the wavelength of the high-frequency signal transmitted by the first line 11 and the second line 12 in the frequency band corresponding to the antenna device 101.

[0061] The length L of the stub 13 is 1 / 4 of the wavelength of the high-frequency signal transmitted within the substrate in the frequency band corresponding to the antenna device 101. That is, the length L of the stub 13 is 1 / 4 of the wavelength of the high-frequency signal transmitted by the first line 11 and the second line 12 in the frequency band corresponding to the antenna device 101. In other views, the length L of the stub 13 is within ±30% of 1 / 2 of the length A1 of the radiating electrode 31 in the Y-axis direction. Furthermore, the frequency band corresponding to the antenna device 101 can be, for example, a millimeter-wave radio wave with a center frequency of 28 GHz, 39 GHz, or 60 GHz, or a radio wave in other frequency bands.

[0062] In the antenna device 101 configured as described above, the first line 11 and the second line 12 of the mounting structure 1, which are impedance matched, are used to transmit the high-frequency signal from the electrode plate 20 from the first line 11 to the second line 12 while suppressing transmission loss. The high-frequency signal transmitted to the second line 12 is then transmitted from the second line 12 to the radiating electrode 31, and radiated to the outside by the radiating electrode 31.

[0063] Thus, the antenna device 101 is able to receive high-frequency signals from the electrode plate 20 transmitted via the first line 11 and the second line 12 of the mounting structure 1 while suppressing transmission loss, and radiate them efficiently.

[0064] [Antenna module, communication device]

[0065] Reference Figure 4 This describes the antenna module 200 and communication device 300 of Embodiment 1. Figure 4 This is a diagram illustrating the structure of the antenna module 200, including the antenna device 101, and the communication device 300 according to Embodiment 1. The communication device 300 is, for example, a portable terminal such as a mobile phone, smartphone, or tablet computer, or another PC (Personal Computer) with communication capabilities.

[0066] like Figure 4 As shown, the antenna module 200 includes: an antenna device 101 comprising a mounting structure 1 and radiating electrodes 31 radiating high-frequency signals transmitted from the mounting structure 1; and an RFIC (Radio Frequency Integrated Circuit) 120 that supplies high-frequency signals to the antenna device 101. The communication device 300 carries the antenna module 200. Specifically, the communication device 300 includes the antenna module 200 and a baseband IC (Integrated Circuit) 130 constituting a baseband signal processing circuit.

[0067] The communication device 300 upconverts the signal transmitted from BBIC130 to antenna module 200 into a high-frequency signal and radiates it from antenna device 101. Additionally, the communication device 300 downconverts the high-frequency signal received from antenna device 101 and processes it using BBIC130.

[0068] As described above, the antenna device 101 of Embodiment 1, which includes the mounting structure 1 of the transmission line, can be used in the antenna module 200 mounted on a communication device 300 such as a portable terminal.

[0069] <Implementation Method 2>

[0070] Reference Figure 5 This section describes the antenna device 102 of Embodiment 2. Regarding the antenna device 102 of Embodiment 2, only the parts that differ from the antenna device 101 of Embodiment 1 will be described; descriptions of other parts will be omitted. Similar to the antenna device 101 of Embodiment 1, the antenna device 102 of Embodiment 2 includes the use of… Figure 1 and Figure 2 The installation structure 1 is explained below. Figure 5This is a diagram showing the structure of the antenna device 102 according to Embodiment 2.

[0071] like Figure 5 As shown, the antenna device 102 is a planar inverted F antenna (PIFA) including a mounting structure 1 and a radiating electrode 32. The radiating electrode 32 is a planar electrode that radiates the high-frequency signal transmitted from the mounting structure 1 as a radio wave.

[0072] The radiating electrode 32 is disposed on the dielectric 10 constituting the mounting structure 1, and includes a power supply point 321 connected to the second line 12 via a connecting conductor not shown, and a grounding point 322 connected to the grounding electrode 14 via a connecting conductor not shown. The stub 13 is separated from the radiating electrode 32 by a predetermined distance, so it does not affect the radiation of high-frequency signals using the radiating electrode 32.

[0073] When viewing the radiating electrode 32 from the Z-axis direction, the length (A2 + B2) obtained by adding the length A2 of the radiating electrode 32 in the Y-axis direction to the length B2 of the radiating electrode 32 in the X-axis direction is 1 / 4 of the wavelength of the high-frequency signal transmitted within the substrate in the frequency band corresponding to the antenna device 102. That is, the length (A2 + B2) obtained by adding the length A2 of the radiating electrode 32 in the Y-axis direction to the length B2 of the radiating electrode 32 in the X-axis direction is 1 / 4 of the wavelength of the high-frequency signal transmitted by the first line 11 and the second line 12 in the frequency band corresponding to the antenna device 102.

[0074] The length L of the stub 13 is 1 / 4 of the wavelength of the high-frequency signal transmitted within the substrate in the frequency band corresponding to the antenna device 102. That is, the length L of the stub 13 is 1 / 4 of the wavelength of the high-frequency signal transmitted by the first line 11 and the second line 12 in the frequency band corresponding to the antenna device 102. In other views, the length L of the stub 13 is within ±30% of the length (A2 + B2) obtained by adding the length A2 of the radiating electrode 32 in the Y-axis direction to the length B2 of the radiating electrode 32 in the X-axis direction.

[0075] In the antenna device 102 configured as described above, the first line 11 and the second line 12 of the mounting structure 1, which have undergone impedance matching, transmit the high-frequency signal from the electrode plate 20 from the first line 11 to the second line 12 while suppressing transmission loss. The high-frequency signal transmitted to the second line 12 is then transmitted from the second line 12 to the radiating electrode 32, and radiated to the outside by the radiating electrode 32.

[0076] Thus, the antenna device 102 is able to receive high-frequency signals from the electrode plate 20 transmitted via the first line 11 and the second line 12 of the mounting structure 1 while suppressing transmission loss, and radiate them efficiently.

[0077] Furthermore, similar to the antenna device 101 of Embodiment 1, the antenna device 102 of Embodiment 2 can be used in the antenna module 200 mounted on the communication device 300.

[0078] <Implementation Method 3>

[0079] Reference Figure 6 This section describes the antenna device 103 of Embodiment 3. Regarding the antenna device 103 of Embodiment 3, only the parts that differ from the antenna device 101 of Embodiment 1 will be described; descriptions of other parts will be omitted. Similar to the antenna device 101 of Embodiment 1, the antenna device 103 of Embodiment 3 includes a device using… Figure 1 and Figure 2 The installation structure 1 is explained below. Figure 6 This is a diagram showing the structure of the antenna device 103 in Embodiment 3.

[0080] like Figure 6 As shown, the antenna device 103 is a monopole antenna including a mounting structure 1 and a radiating electrode 33. The radiating electrode 33 is a linear electrode that radiates the high-frequency signal transmitted from the mounting structure 1 as an electromagnetic wave.

[0081] The radiating electrode 33 is a portion of the second line 12 and is provided on the dielectric 10 constituting the mounting structure 1. Specifically, the second line 12, together with the ground electrode 14, forms a microstrip line 72, but extends longer than the ground electrode 14 in the positive Y-axis direction. That is, when viewing the main surface 10A of the dielectric 10 from the Z-axis direction, the portion of the second line 12 that does not overlap with the ground electrode 14 functions as the radiating electrode 33 (monopole antenna). Furthermore, the radiating electrode 33 is not limited to a portion of the second line 12 and may also be composed of a conductor other than the second line 12.

[0082] The length A3 of the radiating electrode 33 in the Y-axis direction is 1 / 4 of the wavelength of the high-frequency signal transmitted within the substrate in the frequency band corresponding to the antenna device 103. That is, the length A3 of the radiating electrode 33 in the Y-axis direction is 1 / 4 of the wavelength of the high-frequency signal transmitted by the first line 11 and the second line 12 in the frequency band corresponding to the antenna device 103.

[0083] The length L of the stub 13 is 1 / 4 of the wavelength of the high-frequency signal transmitted within the substrate in the frequency band corresponding to the antenna device 103. That is, the length L of the stub 13 is 1 / 4 of the wavelength of the high-frequency signal transmitted by the first line 11 and the second line 12 in the frequency band corresponding to the antenna device 103. In other views, the length L of the stub 13 is within ±30% of the length A3 of the radiating electrode 33 in the Y-axis direction.

[0084] In the antenna device 103 configured as described above, the first line 11 and the second line 12 of the mounting structure 1 with impedance matching are used to transmit the high-frequency signal transmitted from the electrode plate 20 from the first line 11 to the second line 12 while suppressing transmission loss. The high-frequency signal transmitted to the second line 12 is radiated to the outside by the radiating electrode 33, which is a local part of the second line 12.

[0085] Thus, the antenna device 103 is able to receive high-frequency signals from the electrode plate 20 transmitted via the first line 11 and the second line 12 of the mounting structure 1 while suppressing transmission loss, and radiate them efficiently.

[0086] Furthermore, similar to the antenna device 101 of Embodiment 1, the antenna device 103 of Embodiment 3 can be used in the antenna module 200 mounted on the communication device 300.

[0087] <Implementation Method 4>

[0088] Reference Figure 7 This section describes the antenna device 104 according to Embodiment 4. Regarding the antenna device 104 of Embodiment 4, only the parts that differ from the antenna device 101 of Embodiment 1 will be described; descriptions of other parts will be omitted. Similar to the antenna device 101 of Embodiment 1, the antenna device 104 of Embodiment 4 includes a device using… Figure 1 and Figure 2 The installation structure 1 is explained below. Figure 7 This is a diagram showing the structure of the antenna device 104 in Embodiment 4.

[0089] like Figure 7 As shown, the antenna device 104 is a dipole antenna including a mounting structure 1 and a radiating electrode 34. The radiating electrode 34 is a flat electrode that radiates the high-frequency signal transmitted from the mounting structure 1 as a radio wave.

[0090] Radiation electrode 34 is disposed on dielectric 10 constituting mounting structure 1, and includes a first radiation electrode 341 connected to the second line 12 and a second radiation electrode 342 connected to the ground electrode 14.

[0091] The first radiating electrode 341 extends from the second line 12 in the positive direction of the Y-axis, and bends at the first bend 341A from the positive direction of the Y-axis to the negative direction of the X-axis, extending in the negative direction of the X-axis. The second radiating electrode 342 extends from the ground electrode 14 in the positive direction of the Y-axis, and bends at the second bend 342A from the positive direction of the Y-axis to the positive direction of the X-axis on the side opposite to the first radiating electrode 341, extending in the positive direction of the X-axis. When the main surface 10A of the dielectric 10 is viewed from the Z-axis direction, the first bend 341A and the second bend 342A at least partially overlap.

[0092] When viewing the main surface 10A of the dielectric 10 from the Z-axis direction, the portion of the first radiating electrode 341 extending in the negative X-axis direction does not overlap with the ground electrode. The stub 13 is separated from the radiating electrode 34 by a predetermined distance, so it does not affect the radiation of high-frequency signals using the radiating electrode 34.

[0093] The length A41 of the first radiating electrode 341 in the X-axis direction, which bends and extends in the negative X-axis direction at the first bend 341A, is 1 / 4 of the wavelength of the high-frequency signal transmitted within the substrate in the frequency band corresponding to the antenna device 104. That is, the length A41 of the first radiating electrode 341 in the X-axis direction is 1 / 4 of the wavelength of the high-frequency signal transmitted by the first line 11 and the second line 12 in the frequency band corresponding to the antenna device 104.

[0094] The length A42 of the second radiating electrode 342 in the X-axis direction, which bends and extends in the positive X-axis direction at the second bend 342A, is 1 / 4 of the wavelength of the high-frequency signal transmitted within the substrate in the frequency band corresponding to the antenna device 104. That is, the length A42 of the second radiating electrode 342 in the X-axis direction is 1 / 4 of the wavelength of the high-frequency signal transmitted by the first line 11 and the second line 12 in the frequency band corresponding to the antenna device 104.

[0095] That is, the length (A41 + A42) obtained by adding the length A41 of the first radiating electrode 341 in the X-axis direction and the length A42 of the second radiating electrode 342 in the X-axis direction is half the wavelength of the high-frequency signal transmitted by the first line 11 and the second line 12 in the frequency band corresponding to the antenna device 104.

[0096] The length L of the stub 13 is 1 / 4 of the wavelength of the high-frequency signal transmitted within the substrate in the frequency band corresponding to the antenna device 104. That is, the length L of the stub 13 is 1 / 4 of the wavelength of the high-frequency signal transmitted by the first line 11 and the second line 12 in the frequency band corresponding to the antenna device 104. In other views, the length L of the stub 13 is within ±30% of half of the length (A41 + A42) obtained by adding the length A41 of the first radiating electrode 341 in the X-axis direction and the length A42 of the second radiating electrode 342 in the X-axis direction.

[0097] In the antenna device 104 configured as described above, the first line 11 and the second line 12 of the mounting structure 1, which have undergone impedance matching, transmit the high-frequency signal from the electrode plate 20 from the first line 11 to the second line 12 while suppressing transmission loss. The high-frequency signal transmitted to the second line 12 is then transmitted from the second line 12 to the radiating electrode 34, and radiated to the outside by the radiating electrode 34.

[0098] Thus, the antenna device 104 is able to receive high-frequency signals from the electrode plate 20 transmitted via the first line 11 and the second line 12 of the mounting structure 1 while suppressing transmission loss, and radiate them efficiently.

[0099] Furthermore, similar to the antenna device 101 of Embodiment 1, the antenna device 104 of Embodiment 4 can be used in the antenna module 200 mounted on the communication device 300.

[0100] <Implementation Method 5>

[0101] Reference Figure 8 This section describes the antenna device 105 of Embodiment 5. Regarding the antenna device 105 of Embodiment 5, only the parts that differ from the antenna device 101 of Embodiment 1 will be described; descriptions of other parts will be omitted. Similar to the antenna device 101 of Embodiment 1, the antenna device 105 of Embodiment 5 includes a device using… Figure 1 and Figure 2 The installation structure 1 is explained below. Figure 8 This is a diagram showing the structure of the antenna device 105 according to Embodiment 5. Furthermore, in Figure 8 The image shows a cross-section of the antenna device 105, which has an L-shaped shape, as viewed from the Z-axis direction.

[0102] like Figure 8 As shown, the antenna device 105 includes a dielectric 10 extending in the Y-axis direction and a dielectric 50 extending orthogonally to the dielectric 10 in the Z-axis direction. The cross-section of the antenna device 105 has a generally L-shaped cross-section formed by the dielectric 10 and the dielectric 50. A SiP (System in Package) module 60, which integrates an RFIC 120 and a power module IC (not shown), is connected to the main surface 50A of the dielectric 50 of the antenna device 105.

[0103] The antenna device 105 includes a ground electrode 51, a ground electrode 52, a radiating electrode 36, a power supply wiring 61, a power supply wiring 62, and an electrode plate 20 within a dielectric 50. The ground electrode 51 and ground electrode 52 are arranged within the dielectric 50 in an XZ-plane configuration. The radiating electrode 36 is connected to the SiP module 60 via the power supply wiring 61 extending in the Y-axis direction. The radiating electrode 36 is a flat electrode that radiates high-frequency signals transmitted from the SiP module 60 via the power supply wiring 61 as radio waves, and is arranged within the dielectric 50 in an XZ-plane configuration. The electrode plate 20 is positioned facing the dielectric 10 and is connected to the SiP module 60 via the power supply wiring 62.

[0104] The antenna device 105 includes a mounting structure 1 and a radiating electrode 35 within the dielectric 10. The main surface 10A of the mounting structure 1 faces the side of the SiP module 60. That is, the first line 11 and the second line 12 of the mounting structure 1 are arranged orthogonally to the main surface 50A of the dielectric 50.

[0105] The first line 11 is connected to the electrode plate 20. The radiating electrode 35 is a flat electrode that radiates the high-frequency signal transmitted from the mounting structure 1 as an electromagnetic wave, and is arranged inside the dielectric body 10 in a manner extending in the YY plane. The radiating electrode 35 is connected to the second line 12 via a power supply wiring 63 extending in the Z-axis direction.

[0106] When the radiating electrode 35 is viewed from the Z-axis direction, the length A5 of the radiating electrode 35 in the Y-axis direction is half the wavelength of the high-frequency signal transmitted within the substrate in the frequency band corresponding to the antenna device 105. That is, the length A5 of the radiating electrode 35 in the Y-axis direction is half the wavelength of the high-frequency signal transmitted by the first line 11 and the second line 12 in the frequency band corresponding to the antenna device 105.

[0107] The length L of the stub 13 is 1 / 4 of the wavelength of the high-frequency signal transmitted within the substrate in the frequency band corresponding to the antenna device 105. That is, the length L of the stub 13 is 1 / 4 of the wavelength of the high-frequency signal transmitted by the first line 11 and the second line 12 in the frequency band corresponding to the antenna device 105. In other views, the length L of the stub 13 is within ±30% of 1 / 2 of the length A5 of the radiating electrode 35 in the Y-axis direction.

[0108] In the antenna device 105 configured as described above, the first line 11 and the second line 12 of the mounting structure 1, which have undergone impedance matching, transmit the high-frequency signal from the electrode plate 20 from the first line 11 to the second line 12 while suppressing transmission loss. The high-frequency signal transmitted to the second line 12 is then transmitted from the second line 12 to the radiating electrode 35, and radiated to the outside by the radiating electrode 35.

[0109] Thus, the antenna device 105 is able to receive high-frequency signals from the electrode plate 20 transmitted via the first line 11 and the second line 12 of the mounting structure 1 while suppressing transmission loss, and radiate them efficiently.

[0110] <Variation Example>

[0111] This disclosure is not limited to the embodiments described above, and various modifications and applications are possible. Hereinafter, modifications applicable to this disclosure will be described.

[0112] Figure 9 This is a perspective view of the installation structure 1A of the modified transmission line. Figure 10This is a cross-sectional view of the mounting structure 1A of the modified embodiment. The mounting structure 1 of the embodiment includes a short line 13 as an open-circuit short line with an open end. However, the mounting structure 1A of the modified embodiment may also include a short line 13A as a short-circuit short line with a short end.

[0113] Specifically, such as Figure 9 and Figure 10 As shown, a portion of the first line 11 extends from the connection portion of the connecting conductor 15 in the positive direction of the Y-axis and then bends in the positive direction of the X-axis. The end of the first line 11 is connected to the ground electrode 14 via the connecting conductor 16.

[0114] The length of the stub 13A, which serves as a short-circuit stub, is half the wavelength of the high-frequency signal transmitted within the substrate in the frequency band corresponding to the antenna device of the mounting structure 1A. That is, the length of the stub 13A is half the wavelength of the high-frequency signal transmitted by the first line 11 and the second line 12 in the frequency band corresponding to the antenna device.

[0115] Thus, the mounting structure of this disclosure can also include a short-circuit stub 13A instead of an open-circuit stub 13. However, the length of the short-circuit stub 13A needs to be designed to be longer than the length of the open-circuit stub 13. Furthermore, in order to connect the stub 13A to the ground electrode 14, it needs to be bent from the Y-axis direction to the X-axis direction. Therefore, when using the short-circuit stub 13A, the size of the dielectric 10 needs to be increased compared to using the open-circuit stub 13. Therefore, it is preferable that the mounting structure of this disclosure includes the open-circuit stub 13, but does not include the short-circuit stub 13A.

[0116] In the mounting structure 1 of the embodiment, the first line 11 is provided on the main surface 10A of the dielectric 10, but the first line 11 may also be provided in a layer inside the dielectric 10.

[0117] In the mounting structure 1 of the embodiment, the first line 11 and the second line 12 have a cuboid shape, but the first line 11 and the second line 12 may also have other shapes such as cylinders. In this case, the cross-sectional dimension (e.g., diameter) of the first line 11 in the Z-axis direction can be designed to be larger than the cross-sectional dimension (e.g., diameter) of the second line 12 in the Z-axis direction.

[0118] In the mounting structure 1 of the embodiment, the connecting conductor 15 has a cylindrical shape, but the connecting conductor 15 may also have other shapes such as cuboids.

[0119] In the mounting structure 1 of the embodiment, the stub 13 is part of the first line 11, but the stub 13 may also be made of a conductor other than the first line 11. However, when the conductor constituting the stub 13 is the same as the conductor constituting the first line 11, impedance matching can be easily achieved compared to the case where the conductor constituting the stub 13 is different from the conductor constituting the first line 11.

[0120] In the mounting structure 1 of the embodiment, when the main surface 10A of the dielectric 10 is viewed from the Z-axis direction, the stub 13 completely covers the second line 12 in the width direction (X-axis direction), but it is also possible that the stub 13 covers at least a portion of the second line 12 in the width direction (X-axis direction).

[0121] <Method>

[0122] (Item 1) An installation structure for a transmission line includes: a dielectric body; a ground electrode disposed on the dielectric body; a first line disposed on the dielectric body opposite to the ground electrode; a second line disposed on the dielectric body opposite to the ground electrode, between the first line and the ground electrode in the normal direction of the dielectric body; a connecting conductor connecting the first line and the second line; and a stub extending from a connection portion of the first line connected to the connecting conductor, disposed on the dielectric body opposite to the ground electrode and the second line. The thickness of the first line in the normal direction is greater than the thickness of the second line in the normal direction. The second line extends in the same direction as the first line. The stub extends in the same direction as the second line. When the dielectric body is viewed from the normal direction, at least a portion of the stub overlaps with the second line in the direction of extension.

[0123] (Item 2) In the mounting structure described in Item 1, the first line is located on the main surface of the dielectric.

[0124] (Item 3) In the mounting structure described in Item 1 or Item 2, the thickness of the stub in the normal direction is the same as the thickness of the first line in the normal direction.

[0125] (Item 4) In any of the installation structures in items 1 to 3, the stub is a portion of the first line.

[0126] (Item 5) In any of the mounting structures described in Items 1 to 4, when the dielectric is viewed from the normal direction, the width of the stub is wider than the width of the second line.

[0127] (Item 6) In any of the mounting structures in items 1 to 5, when the dielectric is viewed from the normal direction, the stub covers the second line in the width direction.

[0128] (Item 7) In any of the mounting structures in items 1 to 6, the impedance of the portion of the second line that does not overlap with the stub in the extension direction is the same as the impedance of the first line.

[0129] (Item 8) In any of the mounting structures in items 1 to 7, the distance between the second line and the stub and the distance between the second line and the grounding electrode are the same in the normal direction.

[0130] (Item 9) In any of the mounting structures in items 1 to 8, the impedance of the portion of the second line that overlaps with the stub in the extension direction is smaller than the impedance of the first line.

[0131] (Item 10) In any of the mounting structures described in items 1 to 9, when the dielectric is viewed from the normal direction, the width of the first line is wider than the width of the second line.

[0132] (Item 11) In any of the mounting structures in items 1 to 10, when the dielectric is viewed from the normal direction, the cross-sectional dimension of the connecting conductor is wider than the width of the second line and narrower than the width of the first line.

[0133] (Item 12) In any of the mounting structures described in items 1 to 11, the end of the stub on the side opposite to the connecting portion is open.

[0134] (Item 13) In any of the mounting structures described in items 1 to 12, the length of the stub in the extension direction is 1 / 4 of the wavelength of the high-frequency signal transmitted by the first line and the second line.

[0135] (Item 14) Another antenna module includes: a mounting structure as described in any one of items 1 to 13; and a radiating electrode that radiates a high-frequency signal transmitted from the mounting structure.

[0136] (Item 15) Another communication device is equipped with the antenna module described in Item 14.

[0137] The embodiments disclosed herein should be considered illustrative rather than limiting in all respects. The scope of this disclosure is defined by the claims rather than by the foregoing description of the embodiments, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0138] Explanation of reference numerals in the attached figures

[0139] 1, 1A, Mounting structure; 10, 50, Dielectric; 10A, 50A, Main surface; 11, First line; 12, Second line; 13, 13A, Short stub; 14, 51, 52, Grounding electrode; 15, 16, Connecting conductor; 20, Electrode plate; 31, 32, 33, 34, 35, 36, Radiation electrode; 60, Module; 61, 62, 63, Power supply wiring; 71, 72, Microstrip line; 73, Stripline; 101, 102, 103, 104, 105, Antenna device; 200, Antenna module; 300, Communication device; 311, 321, Power supply point; 312, Center point; 322, Grounding point; 341, First radiation electrode; 341A, First bend; 342, Second radiation electrode; 342A, Second bend.

Claims

1. An installation structure, which is an installation structure for a transmission line for transmitting signals, wherein, The mounting structure includes: Dielectric; A grounding electrode is disposed on the dielectric; The first line is disposed on the dielectric opposite to the grounding electrode; The second line is disposed in the dielectric material between the first line and the ground electrode in the normal direction of the dielectric material, opposite to the ground electrode. A connecting conductor that connects the first line and the second line; and A short stub, extending from the connection portion of the first line connected to the connecting conductor, is disposed on the dielectric opposite to the ground electrode and the second line. The thickness of the first line in the normal direction is greater than the thickness of the second line in the normal direction. The second line extends in the same direction as the first line. The stub extends in the direction of the extension of the second line. When the dielectric is viewed from the normal direction, at least a portion of the stub overlaps with the second line in the direction of extension.

2. The mounting structure according to claim 1, wherein, The first line is located on the main surface of the dielectric.

3. The mounting structure according to claim 1 or 2, wherein, The thickness of the stub in the normal direction is the same as the thickness of the first line in the normal direction.

4. The mounting structure according to any one of claims 1 to 3, wherein, The stub is a portion of the first line.

5. The mounting structure according to any one of claims 1 to 4, wherein, When the dielectric is viewed from the normal direction, the width of the stub is wider than the width of the second line.

6. The mounting structure according to any one of claims 1 to 5, wherein, When the dielectric is viewed from the normal direction, the stub covers the second line in the width direction.

7. The mounting structure according to any one of claims 1 to 6, wherein, The impedance of the portion of the second line that does not overlap with the stub in the direction of extension is the same as the impedance of the first line.

8. The mounting structure according to any one of claims 1 to 7, wherein, In the normal direction, the distance between the second line and the stub is the same as the distance between the second line and the ground electrode.

9. The mounting structure according to any one of claims 1 to 8, wherein, The impedance of the portion of the second line that overlaps with the stub in the direction of extension is smaller than the impedance of the first line.

10. The mounting structure according to any one of claims 1 to 9, wherein, When the dielectric is viewed from the normal direction, the width of the first line is wider than the width of the second line.

11. The mounting structure according to any one of claims 1 to 10, wherein, When the dielectric is viewed from the normal direction, the cross-sectional dimension of the connecting conductor is wider than the width of the second line and narrower than the width of the first line.

12. The mounting structure according to any one of claims 1 to 11, wherein, The end of the stub opposite to the connecting portion is open.

13. The mounting structure according to any one of claims 1 to 12, wherein, The length of the stub in the extension direction is 1 / 4 of the wavelength of the high-frequency signal transmitted by the first line and the second line.

14. An antenna module, wherein, The antenna module includes: The mounting structure according to any one of claims 1 to 13; and Radiation electrodes that radiate high-frequency signals transmitted from the mounting structure.

15. A communication device, wherein, The communication device is equipped with the antenna module as described in claim 14.

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