Micro light emitting chip and manufacturing method thereof

By employing a grid-like cathode design and a post-cutting bonding method in the micro-LED chip, the problems of uneven current distribution in the micro-LED array and low wafer bonding yield were solved, achieving uniform current distribution and improved product yield.

CN122396136APending Publication Date: 2026-07-14
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Filing Date
2026-04-14
Publication Date
2026-07-14

AI Technical Summary

Technical Problem

In existing technologies, micro-LED arrays suffer from non-uniformity issues during current spread, leading to problems such as uneven light emission, brightness differences, and flickering. Furthermore, wafer-to-wafer hybrid bonding results in low yields, making it difficult to achieve efficient operation of large-area arrays.

Method used

A grid-like cathode design is adopted, which connects the driving module and the light-emitting module through the cathode and anode that penetrate the bonding layer, shortening the current transmission path and making the current distribution more uniform in the light-emitting module. The yield is improved by bonding the fully functional light-emitting module to the driving module after cutting.

Benefits of technology

This achieves uniform current distribution within the light-emitting module, avoiding uneven light emission and brightness differences, improving product yield, and reducing production costs.

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Abstract

The application provides a micro light emitting chip and a manufacturing method thereof. The micro light emitting chip comprises a driving module, a bonding layer, an electrode module and a light emitting module. The driving module is used for driving the light emitting module to work. The light emitting module is used for emitting light according to the action of the driving module. The driving module and the light emitting module are connected through the bonding layer. The electrode module comprises a cathode and an anode. The cathode and the anode penetrate through the bonding layer and are arranged in the interior of the driving module and the light emitting module. The cathode is in a grid shape, and the anode is located in the grid of the cathode. The micro light emitting chip in the application adopts the grid-shaped cathode design, which can effectively shorten the current transmission path of the anode and the cathode to each region in the interior of the light emitting module, so that the current is more uniformly distributed in the light emitting module, and problems such as uneven light emission, brightness difference and flicker of the light emitting module are prevented.
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