Thermal control device for spaceborne microwave antenna in extreme radiation environment
By using a combination of radiation-resistant temperature-equalizing layer, multi-layer thermal insulation components, and high thermal conductivity graphene layer in the spaceborne microwave antenna, the reliability and temperature consistency issues of large-area antennas under extreme radiation environments were solved, achieving improved heat dissipation and radiation resistance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHANGHAI SATELLITE ENG INST
- Filing Date
- 2026-05-11
- Publication Date
- 2026-07-17
AI Technical Summary
Existing technologies struggle to effectively protect spaceborne microwave antennas, especially large-array antennas, under extreme radiation environments, avoiding the coupling effects of single-event effects and high heat flux, which can lead to reliability and lifespan issues.
By employing a combination design of radiation-resistant temperature equalization layer, multi-layer thermal insulation components, and high thermal conductivity graphene layer, a dual heat transfer path is formed. Combined with high emissivity thermal control coating and thermally conductive filler, a lightweight thermal control device is constructed to improve radiation resistance and temperature consistency.
It achieves high heat dissipation performance and radiation resistance of spaceborne microwave antennas under extreme radiation environments, improves system reliability and temperature consistency, and is suitable for lightweight design of large array antennas.
Smart Images
Figure CN122418293A_ABST