Display device and electronic device including the same

Abstract

This disclosure relates to display devices and electronic devices. A display device may include: a display panel; a window member on the display panel; an adhesive between the display panel and the window member; and a housing disposed on at least one side of the display panel and the window member and comprising metal, wherein the adhesive comprises an alkyl acrylate compound, an acrylate compound comprising polar functional groups, a hydrophobic monomer, and a hydrophilic monomer.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2025-0007072, filed on January 17, 2025, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments of this disclosure relate to display devices and electronic devices including display modules (e.g., display devices). Background Technology

[0004] With the development of an information-oriented society, the demand for or expectation of display devices capable of presenting images in one or more suitable formats is constantly increasing. Display devices are widely used in various electronic products, including but not limited to smartphones, digital cameras, laptops, navigation devices, and / or smart TVs.

[0005] In high-end display devices, metal frames can be used or applied to enhance structural integrity and aesthetic appeal. However, if subjected to external impacts (e.g., when subjected to external impacts), the shape of the metal frame may deform, potentially leading to the formation of air bubbles in the adhesives used within the display components. Summary of the Invention

[0006] One or more aspects of embodiments of this disclosure relate to adhesive members having (possessing) improved or enhanced impact (e.g., external impact) resistance by utilizing adhesives comprising hydrophobic and hydrophilic monomers.

[0007] However, the aspects and features of embodiments of this disclosure are not limited to those set forth herein. The above and other aspects and features of certain embodiments of this disclosure will become more apparent to those skilled in the art upon reference to the detailed description of this disclosure provided.

[0008] Other aspects of the implementation will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practicing the implementations presented in this disclosure.

[0009] According to one or more embodiments of the present disclosure, a display device includes: a display panel; a window member on the display panel; an adhesive between the display panel and the window member; and a housing located or disposed on at least one side of the display panel and the window member and comprising metal, wherein the adhesive comprises an alkyl acrylate compound, an acrylate compound comprising polar functional groups, a hydrophobic monomer, and a hydrophilic monomer.

[0010] In 100 parts by weight of the adhesive, an alkyl acrylate compound may be present in an amount of 60 to 80 parts by weight, an acrylate compound containing polar functional groups may be present in an amount of 10 to 30 parts by weight, a hydrophobic monomer may be present in an amount of 3 to 15 parts by weight, and a hydrophilic monomer may be present in an amount of 3 to 15 parts by weight.

[0011] Hydrophobic monomers and hydrophilic monomers can exist in a weight ratio of 5:5 to 2:8.

[0012] The adhesive may also include an emulsifier, and the emulsifier may be present in an amount of 1 to 5 parts by weight in 100 parts by weight of the adhesive.

[0013] The average value of the difference between the modulus of a first point on the surface of the display device and the modulus of a second point separated from and / or separated from the first point by a set or predetermined distance can be equal to or greater than 10 MPa.

[0014] The thickness of the adhesive is in the range of 75 μm to 100 μm.

[0015] The display device may also include a black mark on the edge of one surface of the window member, wherein the thickness of the black mark may be equal to or less than 30 μm.

[0016] Adhesive can be in 10 -4 Hz to 10 3 It has a modulus of 0.01 MPa to 10 MPa in the frequency range of Hz, and at 10 3 Hz to 10 5 It has a modulus of 10 MPa to 30 MPa in the frequency range of Hz.

[0017] If the modulus distribution is plotted according to frequency, with frequency on the x-axis (Hz) and modulus on the y-axis (MPa) (e.g., when the modulus distribution is plotted according to frequency, with frequency on the x-axis (Hz) and modulus on the y-axis (MPa), then at 10 3 Hz to 10 4 The average slope in the frequency range of Hz is between 0.01 and 0.35.

[0018] Adhesives can have two or more glass transition temperatures.

[0019] The first glass transition temperature of the adhesive is in the range of -30°C to 0°C, and the second glass transition temperature of the adhesive is in the range of 50°C to 80°C.

[0020] The hydrophobic monomer may include at least one of alkyl methacrylate compounds and isobornyl acrylate.

[0021] Hydrophilic monomers can include acrylamide-based compounds or ester-based compounds.

[0022] The adhesive strength can be equal to or greater than 1.5 kgf / inch.

[0023] According to one or more embodiments of the present disclosure, an electronic device includes: a display module for providing an image; and a processor for sending image data signals to the display module, wherein the display module includes: a display panel; a window member on the display panel; an adhesive between the display panel and the window member; and a housing located or disposed on at least one side of the display panel and the window member and comprising metal, wherein the adhesive includes an alkyl acrylate compound, an acrylate compound containing polar functional groups, a hydrophobic monomer, and a hydrophilic monomer.

[0024] In 100 parts by weight of the adhesive, an alkyl acrylate compound may be present in an amount of 60 to 80 parts by weight, an acrylate compound containing polar functional groups may be present in an amount of 10 to 30 parts by weight, a hydrophobic monomer may be present in an amount of 3 to 15 parts by weight, and a hydrophilic monomer may be present in an amount of 3 to 15 parts by weight.

[0025] The average value of the difference between the modulus of a first point on the surface of the display module and the modulus of a second point separated from and / or separated from the first point by a set or predetermined distance (e.g., spaced apart or separated) can be equal to or greater than 10 MPa.

[0026] The display module may also include a black mark on the edge of one surface of the window member, wherein the thickness of the black mark may be equal to or less than 30 μm.

[0027] Adhesive can be in 10 -4 Hz to 10 3 It has a modulus of 0.01 MPa to 10 MPa in the frequency range of Hz, and at 10 3 Hz to 10 5 It has a modulus of 10 MPa to 30 MPa in the frequency range of Hz.

[0028] If the modulus distribution is plotted according to frequency, with frequency on the x-axis (Hz) and modulus on the y-axis (MPa) (e.g., when the modulus distribution is plotted according to frequency, with frequency on the x-axis (Hz) and modulus on the y-axis (MPa), then at 10 3 Hz to 10 4 The average slope in the frequency range of Hz is between 0.01 and 0.35.

[0029] The adhesive according to one or more embodiments of the present disclosure may be a mixture of hydrophobic and hydrophilic monomers, and thus can effectively or appropriately disperse impact energy generated from the outside due to the difference in the rate of stress transmission at the interface between the hydrophobic and hydrophilic monomer regions.

[0030] Further details of one or more other embodiments are included in the detailed description and accompanying drawings.

[0031] In one or more embodiments, because the adhesive has excellent or suitable step-in embedding properties, it can completely (e.g., substantially completely) cover patterns, such as black markings, even when applied in a thin thickness (e.g., when the adhesive is applied in a thin thickness).

[0032] For example, adhesives can exhibit excellent or suitable step-fit ​​properties, allowing them to conform to and fill surface irregularities or height differences (e.g., steps) between adjacent layers or components. As a result, even when applied in thin layers (e.g., when applied in thin layers), the adhesive can substantially or completely cover surface patterns, such as black markings or printed circuitry on window components. This property can be advantageous or beneficial in display devices where maintaining optical uniformity (e.g., substantially uniformity) and reducing visual artifacts are important. The ability to achieve uniform (e.g., substantially uniform) coverage with thin adhesive layers can also help reduce overall device thickness and improve or enhance manufacturing efficiency. Furthermore, the step-fit ​​capability of the adhesive can enhance the mechanical and optical integration between the display panel and the window component. By effectively or appropriately smoothing surface discontinuities, the adhesive can reduce internal stress concentrations and potential delamination points, thereby improving or enhancing long-term reliability. This feature can also support the use of high-resolution display panels with intricate patterns, as the adhesive can adapt to and protect complex surface features without compromising adhesion or transparency.

[0033] It should be noted that the aspects and features of the embodiments of this disclosure are not limited to those described herein, and other aspects and features of certain embodiments of this disclosure will become more apparent to those skilled in the art from the following description. Attached Figure Description

[0034] The above and other aspects and features of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which: Figure 1 It is a plan view of a display device according to one or more embodiments; Figure 2 This is an exploded perspective view of a display device according to one or more embodiments; Figure 3This is a side view of a display device according to one or more embodiments; Figure 4 It is a schematic cross-sectional view of a display panel according to one or more embodiments; Figure 5 This is a diagram showing black markings on one side of a window component according to one or more embodiments of the present disclosure; Figure 6 This is a side view of a display device according to one or more embodiments; Figure 7 It is a side view of the display device under the condition that an external impact is applied to the display device (e.g., when an external impact is applied to the display device) according to one or more embodiments; Figure 8 It is a side view of the display device under the condition that an external impact is applied to the display device (e.g., when an external impact is applied to the display device) according to one or more embodiments; Figure 9 This is a diagram showing an adhesive member located at or arranged at any point in a window member according to one or more embodiments of the present disclosure; Figure 10 It is a graph showing the modulus (MPa) of the adhesive member according to frequency (Hz) in one or more embodiments; Figure 11 It is a modulus mapping image based on the adhesive component of the comparative example; Figure 12 It is a modulus mapping image of an adhesive member according to one or more embodiments; Figure 13 It is a graph showing the modulus of the bonded component in the comparative example at different temperatures based on the indentation depth; Figure 14 It is a graph showing the modulus of the adhesive component in one or more embodiments according to the indentation depth at different temperatures; Figure 15 This is a top view showing the indentation points during the evaluation of an adhesive member according to one or more embodiments; Figure 16 This is a side view showing indentation points during the evaluation of an adhesive member according to one or more embodiments; Figure 17 This is an image of the stress distribution simulation results when a force is applied to the adhesive component of the comparative example; Figure 18 It is an image showing the simulation results of stress distribution when a force is applied to an adhesive member of one or more embodiments; Figure 19 It is a block diagram of an electronic device according to one or more embodiments; and Figure 20 It is a schematic diagram of an electronic device according to one or more suitable embodiments. Detailed Implementation

[0035] The aspects and features of embodiments of this disclosure, as well as methods for implementing them, will become clearer with reference to one or more embodiments described herein in conjunction with the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed herein, but may be implemented in one or more suitable different forms, and these embodiments are provided only to fully inform those skilled in the art of the scope of this disclosure, and this disclosure is defined only by the appended claims and their equivalents.

[0036] When describing embodiments of this disclosure (e.g., when describing embodiments of this disclosure), the word "may" refers to "one or more embodiments of this disclosure".

[0037] In the context of this application and unless otherwise defined, the terms “use,” “using,” and “used” may be understood as synonymous with the terms “utilize,” “utilizing,” and “utilized,” respectively.

[0038] As used herein, “an,” “a,” “the,” and “at least one” do not indicate a limitation on quantity and are intended to include both the singular and the plural (e.g., both the singular and the plural), unless the context clearly indicates otherwise. For example, “element” has substantially the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” should not be construed as limiting “an” or “a.”

[0039] Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), the terms "about" or "approximately" as used herein include the stated value and mean within an acceptable deviation range of the particular value as determined by one of ordinary skill in the art. For example, "about" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0040] Furthermore, it should be understood that even when the terms “about,” “approximately,” or “substantially” are not explicitly stated in a given element (e.g., a claim element), the scope of such an element is intended to include non-substantial variations or variations understood by one of ordinary skill in the art. For example, the numerical values ​​and ranges provided herein are intended to include tolerances and measurement uncertainties that would be recognized by one of ordinary skill in the art, and elements (e.g., claim elements) should be interpreted accordingly to include such equivalences.

[0041] Any numerical range described herein is intended to include all subranges containing the same numerical precision within the described range. For example, the range “1.0 to 10.0” is intended to include all subranges between (and inclusive of) the described minimum value of 1.0 and the described maximum value of 10.0, that is, for example, having a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as 2.4 to 7.6. Any maximum numerical limit described herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit described herein is intended to include all higher numerical limits contained therein. Therefore, the applicant reserves the right to amend this specification, including the claims, to clearly describe any subranges contained within the range expressly described herein.

[0042] In the context of this disclosure and unless otherwise defined, a plan view is an orthographic projection of a three-dimensional object onto a horizontal plane intersecting the object. For example, it is a top-down view showing the layout and spatial relationships of one or more elements within an object or structure. A plan view based on the z-axis (thickness) direction refers to a top-down view of the object, as if looking directly down at a surface from above (e.g., as when looking directly down at a surface from above). In this context, the z-axis direction is perpendicular to or positively oriented towards the horizontal plane defined by the x-axis and y-axis directions.

[0043] If an element or layer is referred to as being "on" or "above" another element or layer (e.g., when an element or layer is referred to as being "on" or "above" another element or layer), this includes all cases where the layer or element is directly on, directly above, or in between of another layer or element. Conversely, if an element or layer is referred to as being "directly" on or "directly" above another element or layer (e.g., when an element or layer is referred to as being "directly" on or "directly" above another element or layer), then there is no intervening layer or element.

[0044] Throughout the specification, the same reference numerals denote substantially the same parts.

[0045] The shapes, dimensions, ratios, angles, quantities, etc. disclosed in the accompanying drawings for illustrating one or more embodiments of this disclosure are examples, and therefore the embodiments of this disclosure are not limited to those disclosed.

[0046] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe one or more elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the spirit and scope of this disclosure, a first element, first component, first region, first layer, or first portion as described herein may be referred to as a second element, second component, second region, second layer, or second portion.

[0047] Each of the features of one or more suitable embodiments of this disclosure may be combined in part or in whole, or combined with each other, and one or more suitable technical connections and operations may be feasible, and each embodiment may be implemented independently of each other or may be implemented together in a related relationship.

[0048] One or more embodiments of this disclosure will be described in more detail herein with reference to the accompanying drawings.

[0049] Figure 1 It is a plan view of a display device according to one or more embodiments. Figure 2 This is an exploded perspective view of a display device according to one or more embodiments. Figure 3 This is a side view of a display device according to one or more embodiments.

[0050] refer to Figures 1 to 3 The display device 1 according to one or more embodiments may include a window member 100, an adhesive member 200, an anti-fingerprint film 300, an anti-reflective film 400, a display panel 500, and a housing 600.

[0051] The display device 1, according to one or more embodiments, as a means of displaying moving and / or still images, can be used as a display screen for one or more suitable products such as televisions, laptops, monitors, billboards, and Internet of Things (IoT) devices, as well as portable electronic devices such as mobile phones, smartphones, tablet PCs, smartwatches, watch phones, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation systems, and ultra-mobile PCs (UMPCs).

[0052] The display device 1 according to one or more embodiments may be a light-emitting display device, such as an organic light-emitting display utilizing organic light-emitting diodes, a quantum dot light-emitting display including a quantum dot light-emitting layer, an inorganic light-emitting display including inorganic semiconductors, and a micro-light-emitting display or nano-light-emitting display utilizing micro-light-emitting diodes (LEDs) or nano-light-emitting diodes (LEDs). In the following description, it is assumed that the display device 1 according to one or more embodiments is an organic light-emitting display device, but the embodiments of this disclosure are not limited thereto.

[0053] The display device 1 may include a display panel 500, a display driving circuit 20, and a circuit board 30.

[0054] In a plan view, the display panel 500 may be a rectangular shape (e.g., substantially rectangular) having a short side in a first direction DR1 and a long side in a second direction DR2 intersecting the first direction DR1. Furthermore, the display panel 500 may have a thickness in a third direction DR3 intersecting (e.g., intersecting) the first direction DR1 and the second direction DR2. The corner where the short side of the first direction DR1 and the long side of the second direction DR2 meet may be rounded to have a selected (e.g., set or predetermined) curvature, or it may be a right angle. The planar shape of the display panel 500 is not limited to a rectangular shape and may be another polygonal shape (e.g., substantially polygonal), a circular shape (e.g., substantially circular), or an elliptical shape (e.g., substantially elliptical). The display panel 500 may be formed or arranged to be flat (e.g., substantially flat), but embodiments of this disclosure are not limited thereto. For example, the display panel 500 may include curved portions at the left and right ends and have a constant (e.g., substantially constant) curvature or a varying curvature. In one or more embodiments, the display panel 500 may be flexible, such that (e.g.) it can be bent, folded, and / or rolled up.

[0055] The display panel 500 may include a main area MA and a sub-area SBA.

[0056] The main region MA may include a display area DA for displaying an image and a non-display area NDA that serves as the peripheral region of the display area DA. The display area DA may occupy most (e.g., substantially all) of the main region MA. For example, the display area DA may occupy a large portion of the main region MA, and in one or more embodiments, the display area DA may extend across substantially the entire surface of the main region MA, leaving only a narrow peripheral portion for the non-display area NDA. The display area DA may be located or arranged at the center of the main region MA. The non-display area NDA may be located or arranged adjacent to the display area DA. The non-display area NDA may be a region outside the display area DA (e.g., a region surrounding or around the display area DA). The non-display area NDA may be located or arranged around (e.g., around) the display area DA. The non-display area NDA may be an edge region of the display panel 500.

[0057] The sub-region SBA can extend from one side of the main region MA along the second direction DR2. The length of the sub-region SBA along the second direction DR2 can be less than the length of the main region MA along the second direction DR2. The length of the sub-region SBA along the first direction DR1 can be substantially equal to or less than the length of the main region MA along the first direction DR1. The sub-region SBA can be foldable to be located or arranged below the display panel 500. In this case, the sub-region SBA can overlap with the main region MA along the third direction DR3.

[0058] The display driving circuit 20 can generate signals and voltages to drive the display panel 500. The display driving circuit 20 can be formed or arranged as an integrated circuit (IC) and attached to a sub-region SBA of the display panel 500 via a chip-on-glass (COG) method, a chip-on-plastic (COP) method, and / or ultrasonic bonding method. In one or more embodiments, the display driving circuit 20 can be attached to the circuit board 30 via a chip-on-film (COF) method.

[0059] Circuit board 30 can be attached to one end of a sub-region SBA of display panel 500. Therefore, circuit board 30 can be electrically connected to display panel 500 and display driving circuit 20. Display panel 500 and display driving circuit 20 can receive digital video data, timing signals, and driving voltages through circuit board 30. Circuit board 30 can be a flexible printed circuit board, a printed circuit board, or a flexible film such as a chip-on-film.

[0060] The touch driving circuit 40 may be located or arranged on the circuit board 30. The touch driving circuit 40 may be formed or arranged as an integrated circuit (IC) and attached to the circuit board 30.

[0061] The touch driving circuit 40 can be electrically connected to multiple driving electrodes and multiple sensing electrodes of the touch sensing layer TDL. The touch driving circuit 40 can apply touch driving signals to the multiple driving electrodes and sense touch sensing signals of each of the multiple touch nodes through the multiple sensing electrodes, such as the amount of charge change in mutual capacitance. The touch driving circuit 40 can determine whether a user touch has occurred, whether a user is approaching, etc., based on the touch sensing signals of each of the multiple touch nodes. A user touch refers to an object such as a user's finger and / or pen directly contacting the front surface of the display device 1 on the touch sensing layer TDL. A user approach refers to an object such as a pen and / or a user's finger being positioned away from the front surface of the display device 1, such as hovering.

[0062] Window member 100 can be attached to the front surface of anti-fingerprint film 300 via adhesive member 200. Window member 100 may include a transparent (e.g., substantially transparent) material, and may be, for example, glass and / or plastic. For example, window member 100 may be ultra-thin glass (UTG) with a thickness of 0.1 mm or less and / or a transparent (e.g., substantially transparent) polyimide film.

[0063] The adhesive member 200 may be an optically transparent (e.g., substantially transparent) adhesive film and / or an optically transparent (e.g., substantially transparent) resin. For example, the adhesive member 200 may include a transparent (e.g., substantially transparent) adhesive such as pressure-sensitive adhesive (PSA) and / or an optically transparent (e.g., substantially transparent) adhesive (OCA). Because the adhesive member 200 is a key or primary feature of one or more embodiments of this disclosure, a more detailed description thereof will be given herein.

[0064] The anti-fingerprint film 300 can be placed or arranged on the rear surface of the window member 100. The anti-fingerprint film 300 can be used to prevent fingerprints of the user of the display device 1 from being left on it (or reduce the degree or occurrence of fingerprints left on it by the user of the display device 1).

[0065] An anti-reflective film 400 may be placed or arranged on the front surface of a display panel 500. The anti-reflective film 400 may include two or more refractive layers with different refractive indices. The anti-reflective film 400 can reduce reflected light (e.g., the degree or occurrence of reflected light) passing through the two or more refractive layers. The anti-reflective film 400 can be arranged as two or more layers by alternately stacking high-refractive-index and low-refractive-index layers utilizing the characteristics of a distributed Bragg reflector (DBR).

[0066] The refractive index of the low-refractive layer can be from 1.20 to 1.60, but embodiments of this disclosure are not limited thereto. The low-refractive layer may include silicone resin, silica, and silicon oxide (e.g., SiO2). x, where 0 < x ≤ 2; for example, at least one of SiO2), but the embodiments of the present disclosure are not limited thereto. The low refractive index layer is not limited to the materials described in one or more embodiments, but can be any suitable material that achieves a low refractive index.

[0067] The refractive index of the high refractive index layer can be 1.70 to ۲.۸۰, but the embodiments of the present disclosure are not limited thereto. The high refractive index layer can include silicon nitride (Si3N4), aluminum nitride (AlN), zirconium nitride (ZrN), chromium nitride (CrN), titanium nitride (TiN), manganese nitride (Mn4N), iron nitride (FeN x ), cobalt nitride (CoN x ), nickel nitride (Ni3N), copper nitride (Cu3N), zinc nitride (Zn2N3), vanadium nitride (VN), molybdenum nitride (Mo2N), hafnium nitride (HfN), germanium nitride (Ge3N4), lead azide (Pb(N3)2), titanium niobate (Ti4Nb3O 35 ), titanium dioxide (TiO2), zirconium dioxide (ZrO2), lithium niobate (LiNbO3), lithium tantalate (LiTaO3), and lanthanum titanium (LaTiO2). The high refractive index layer is not limited to the materials described in one or more embodiments, but can be any suitable material that achieves a high refractive index. <00,00225>The thickness of the low refractive index layer and the thickness of the high refractive index layer can be substantially the same or different. The thickness of the low refractive index layer and the thickness of the high refractive index layer can be determined in consideration of the characteristics of the antireflection film 400 (such as the target reflection wavelength, hardness, durability, and reflectance).

[0069] A light blocking layer for absorbing light incident from the outside, a buffer layer for absorbing impact from the outside, and a heat dissipation layer for effectively or appropriately dissipating heat from the display panel 500 can be further located or disposed under the display panel 500. [[ID=,17]]

[0070] The light blocking layer can block the transmission of light, thereby preventing the components disposed below the light blocking layer from being observed from above the display panel 500 (or reducing the degree or occurrence of the components disposed below the light blocking layer being observed from above the display panel 500). The light blocking layer can include light absorbing materials such as black pigments, black dyes, etc.

[0071] The buffer layer absorbs external impacts to prevent damage to the display panel 500 (or reduces the extent or occurrence of damage). The buffer layer can be formed or arranged as a single layer or two or more layers. For example, the buffer layer may include polymer resins such as polyurethane (PU), polycarbonate (PC), polypropylene (PP), and / or polyethylene (PE), or may include elastic materials such as sponges obtained by foaming rubber, urethane-based materials, and / or acrylic-based materials.

[0072] The heat dissipation layer may include a first heat dissipation layer containing graphite, carbon nanotubes, etc., and a second heat dissipation layer containing a metal thin film that can shield electromagnetic waves and has excellent or suitable thermal conductivity, the metal thin film including, for example, copper, nickel, ferrite and / or silver.

[0073] The housing 600 may house the anti-fingerprint film 300, the anti-reflective film 400, and the display panel 500, and may be combined with the window member 100. The housing 600 may protect the components housed within it. The housing 600 may be located or arranged on at least one side of the display panel 500 and the window member 100. For example, the housing 600 may be positioned to cover, surround, or frame at least one side or periphery of both the display panel 500 and the window member 100. In the figures, the housing 600 is shown as forming a frame-like structure around (e.g., around) the sides of the stacked components, providing mechanical protection and structural support. For example, the housing 600 may be positioned or arranged along at least one side of the display panel 500 and the window member 100, for example, in the form of a frame surrounding (e.g., around) or partially surrounding their edges. The housing 600 may be provided in the form of a frame surrounding (e.g., around) the sides of the display panel 500 and the window member 100. The housing 600 can protect the sides of the display panel 500 and the window component 100.

[0074] The housing 600 may include metal. If the housing 600 is made of metal (for example, when the housing 600 is made of metal), it can provide a more luxurious feel than if plastic materials are used (for example, when plastic materials are used).

[0075] Figure 4 It is a schematic cross-sectional view of a display panel according to one or more embodiments.

[0076] refer to Figure 4 The display panel 500 may include a substrate SUB, a display layer DISL on the substrate SUB, and a touch sensing layer TDL on the display layer DISL. The display layer DISL may include a thin film transistor layer TFTL, a light-emitting element layer EML, and a packaging layer TFEL.

[0077] The thin-film transistor layer (TFTL) can be located or disposed on the substrate (SUB). The TFTL may include a barrier film (BR), a thin-film transistor (TFT1), a first capacitor electrode (CAE1), a second capacitor electrode (CAE2), a first anode connection electrode (ANDE1), a second anode connection electrode (ANDE2), a gate insulating film (530), an interlayer insulating film (540), a first planarization film (560), and a second planarization film (580). The interlayer insulating film (540) may include a first interlayer insulating film (541) and a second interlayer insulating film (542).

[0078] The substrate SUB may include an insulating (e.g., electrically insulating) material, such as a polymer resin. For example, the substrate SUB may include polyimide. The substrate SUB may be a flexible substrate that can be bent, folded, or rolled up.

[0079] The barrier film BR can be located or disposed on the substrate SUB. The barrier film BR can be a film that protects the thin-film transistor layer TFTL (TFT1) and the light-emitting layer 572 of the light-emitting element layer EML from moisture penetration through the moisture-sensitive substrate SUB. The barrier film BR can be formed or disposed as multiple inorganic films stacked alternately. For example, the barrier film BR can be formed or disposed as two or more films in which one or more inorganic films, including silicon nitride layers, silicon oxide nitride layers, silicon oxide layers, titanium oxide layers, and aluminum oxide layers, are stacked alternately.

[0080] The thin-film transistor layer (TFTL) can be located on or disposed on the substrate (SUB). The TFTL can be disposed in the main region (MA) and the sub-region (SBA). The TFTL may include a thin-film transistor (TFT1).

[0081] The thin-film transistor TFT1 may be located on or disposed on the barrier film BR. The active layer ACT1 of the thin-film transistor TFT1 may be located on or disposed on the barrier film BR. The active layer ACT1 of the thin-film transistor TFT1 may include polycrystalline silicon, monocrystalline silicon, low-temperature polycrystalline silicon, amorphous (e.g., non-crystalline) silicon, and / or oxide semiconductor.

[0082] The active layer ACT1 may include a channel region CHA1, a source region TS1, and a drain region TD1. The channel region CHA1 may be a region on the third direction DR3, which is the thickness direction of the substrate SUB, that overlaps with the gate electrode TG1. The source region TS1 may be located on or disposed on one side of the channel region CHA1, and the drain region TD1 may be located on or disposed on the other side of the channel region CHA1. The source region TS1 and the drain region TD1 may be regions on the third direction DR3 that do not overlap with the gate electrode TG1. The source region TS1 and the drain region TD1 may be regions that have conductivity (e.g., electrical conductivity) by doping silicon semiconductors or oxide semiconductors with ions or impurities.

[0083] The gate insulating film 530 may be located or disposed on the active layer ACT1 of the thin-film transistor TFT1. The gate insulating film 530 may be formed or disposed as an inorganic film, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0084] The gate electrode TG1 and the first capacitor electrode CAE1 of the thin-film transistor TFT1 can be located or arranged on the gate insulating film 530. The gate electrode TG1 can overlap with the channel region CHA1 on the third-direction DR3. Figure 4 The gate electrode TG1 and the first capacitor electrode CAE1 are shown to be spaced apart and / or separated (e.g., spaced apart or separated), but the gate electrode TG1 and the first capacitor electrode CAE1 may be connected to each other and integrally formed or arranged. The gate electrode TG1 and the first capacitor electrode CAE1 may be formed or arranged as a single layer or two or more layers, comprising any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof.

[0085] The first interlayer insulating film 541 may be located on or disposed on the first capacitor electrode CAE1 and the gate electrode TG1 of the thin-film transistor TFT1. The first interlayer insulating film 541 may be formed or disposed as an inorganic film, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The first interlayer insulating film 541 may be formed or disposed as multiple inorganic films.

[0086] The second capacitor electrode CAE2 may be located on or disposed on the first interlayer insulating film 541. The second capacitor electrode CAE2 may overlap with the first capacitor electrode CAE1 on the third-direction DR3. Furthermore, if the gate electrode TG1 and the first capacitor electrode CAE1 are integrally formed or disposed (e.g., when the gate electrode TG1 and the first capacitor electrode CAE1 are integrally formed or disposed), the second capacitor electrode CAE2 may overlap with the gate electrode TG1 on the third-direction DR3. Because the first interlayer insulating film 541 has a selected (e.g., set or predetermined) dielectric constant, a capacitor may be formed or disposed from the first capacitor electrode CAE1, the second capacitor electrode CAE2, and the first interlayer insulating film 541 between the first capacitor electrode CAE1 and the second capacitor electrode CAE2. The second capacitor electrode CAE2 may be formed or disposed as a single layer or two or more layers, comprising any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0087] The second interlayer insulating film 542 may be located or disposed on the second capacitor electrode CAE2. The second interlayer insulating film 542 may be formed or disposed as an inorganic film, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The second interlayer insulating film 542 may be formed or disposed as multiple inorganic films.

[0088] The first anode connection electrode ANDE1 may be located or disposed on the second interlayer insulating film 542. The first anode connection electrode ANDE1 may be connected to the drain region TD1 of the thin-film transistor TFT1 through a first connection contact hole ANCT1 passing through the gate insulating film 530, the first interlayer insulating film 541, and the second interlayer insulating film 542. The first anode connection electrode ANDE1 may be formed or disposed as a single layer or two or more layers, comprising any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0089] A first planarization film 560 for planarizing the stepped portion formed or arranged by the thin-film transistor TFT1 may be located or arranged on the first anode connection electrode ANDE1. The first planarization film 560 may be formed or arranged as an organic film made of a resin such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0090] The second anode connection electrode ANDE2 can be located or disposed on the first planarization film 560. The second anode connection electrode ANDE2 can be connected to the first anode connection electrode ANDE1 through the second connection contact hole ANCT2 passing through the first planarization film 560. The second anode connection electrode ANDE2 can be formed or disposed as a single layer or two or more layers, comprising any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or an alloy thereof.

[0091] The second planarization film 580 may be located or disposed on the second anode connection electrode ANDE2. The second planarization film 580 may be formed or disposed as an organic film made of resins such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0092] The light-emitting element layer (EML) can be located on or disposed on the thin-film transistor layer (TFTL). The EML can be disposed in the display area (DA) of the main area (MA). The EML may include light-emitting elements (LELs) disposed in the emitting portion.

[0093] The light-emitting element layer EML, including the light-emitting element LEL and the dam 590, can be located or arranged on the second planarization film 580. Each of the light-emitting elements LEL may include a pixel electrode 571, a light-emitting layer 572, and a common electrode 573.

[0094] The pixel electrode 571 may be located on or arranged on the second planarization film 580. The pixel electrode 571 may be connected to the second anode connection electrode ANDE2 through the third connection contact hole ANCT3 passing through the second planarization film 580.

[0095] In the top-emitting structure that emits light toward the common electrode 573 relative to the light-emitting layer 572, the pixel electrode 571 may include a metallic material with high reflectivity, such as a stacked structure of aluminum (Al) and titanium (Ti) (Ti / Al / Ti), a stacked structure of aluminum (Al) and indium tin oxide (ITO) (ITO / Al / ITO), a stacked structure of silver (Ag) and ITO (ITO / Ag / ITO), an APC alloy, and a stacked structure of APC alloy and ITO (ITO / APC / ITO). The APC alloy may be an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0096] The dam 590 can be formed or arranged to separate the pixel electrodes 571 on the second planarization film 580 to define the emission portions EA1 and EA2. The dam 590 can be positioned or arranged to cover the edges of the pixel electrodes 571. The dam 590 can be formed or arranged as an organic film made of a resin such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0097] Each of the first emitting portion EA1 and the second emitting portion EA2 can be a region in which the pixel electrode 571, the light-emitting layer 572 and the common electrode 573 are stacked in sequence, and holes from the pixel electrode 571 and electrons from the common electrode 573 recombine in the light-emitting layer 572 to emit light.

[0098] The light-emitting layer 572 may be located on or disposed on the pixel electrode 571. In one or more embodiments, the light-emitting layer 572 may be located on or disposed on the pixel electrode 571 and the embankment 590. The light-emitting layer 572 may include an organic material to emit light of a selected (e.g., set or predetermined) color. For example, the light-emitting layer 572 may include a hole transport layer, an organic material layer, and an electron transport layer.

[0099] The common electrode 573 may be located on or arranged on the light-emitting layer 572. The common electrode 573 may be positioned or arranged to cover the light-emitting layer 572. The common electrode 573 may be a common layer that is formed together or arranged in the first emitting portion EA1 and the second emitting portion EA2.

[0100] In the top-emitting structure, the common electrode 573 may include a transparent (e.g., substantially transparent) conductive (e.g., electrically conductive) oxide (TCO) material capable of transmitting light, such as ITO and / or IZO, or a semi-transmissive conductive (e.g., electrically conductive) material, such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). If the common electrode 573 includes a semi-transmissive conductive (e.g., electrically conductive) material (e.g., when the common electrode 573 includes a semi-transmissive conductive (e.g., electrically conductive) material), the luminous efficiency can be improved or enhanced due to the microcavity effect.

[0101] Spacer 591 may be located or arranged on embankment 590. Spacer 591 may be used to support the mask during the manufacturing process of manufacturing the light-emitting layer 572. Spacer 591 may be formed or arranged as an organic film made of resin such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0102] In one or more embodiments, the display panel 500 may further include a capping layer CPL on the common electrode 573. The capping layer CPL may include an inorganic material. For example, the capping layer CPL may include at least one of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, tin oxide, cerium oxide, and silicon oxynitride.

[0103] The encapsulation layer TFEL can be located on or disposed on the light-emitting element layer EML. The encapsulation layer TFEL can be disposed in the display area DA and the non-display area NDA of the main area MA. The encapsulation layer TFEL may include at least one inorganic layer and at least one organic layer to encapsulate the light-emitting element layer EML.

[0104] The encapsulation layer TFEL may be located or disposed on the common electrode 573. The encapsulation layer TFEL may include at least one inorganic film to prevent (or reduce) the extent or occurrence of oxygen and / or moisture penetration into the light-emitting element layer EML. In one or more embodiments, the encapsulation layer TFEL may include at least one organic film to protect the light-emitting element layer EML from foreign matter such as dust. For example, the encapsulation layer TFEL may include a first encapsulation inorganic film TFE1, an encapsulation organic film TFE2, and a second encapsulation inorganic film TFE3.

[0105] The first encapsulating inorganic film TFE1 may be located or arranged on the common electrode 573, the encapsulating organic film TFE2 may be located or arranged on the first encapsulating inorganic film TFE1, and the second encapsulating inorganic film TFE3 may be located or arranged on the encapsulating organic film TFE2. The first encapsulating inorganic film TFE1 and the second encapsulating inorganic film TFE3 may be formed or arranged as two or more films in which one or more inorganic films of silicon nitride layer, silicon oxynitride layer, silicon oxide layer, titanium oxide layer and aluminum oxide layer are alternately stacked. The encapsulating organic film TFE2 may be an organic film made of resin such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0106] The touch sensing layer (TDL) can be located on or disposed on the encapsulation layer (TFEL). The touch sensing layer (TDL) may include a first touch insulating film (TINS1), a connection electrode (BE), a second touch insulating film (TINS2), a driving electrode (TE), a sensing electrode (RE), and a third touch insulating film (TINS3). The touch sensing layer (TDL) can sense the touch of a person or object using the touch electrodes.

[0107] The first touch insulating film TINS1 may be located on or disposed on the encapsulation layer TFEL. The first touch insulating film TINS1 may be formed or disposed as an inorganic film, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0108] The connecting electrode BE can be located on or arranged on the first touch insulating film TINS1. The connecting electrode BE can be formed or arranged as a single layer or two or more layers, which contains any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or an alloy thereof.

[0109] The second touch insulating film TINS2 may be located or disposed on the connecting electrode BE. The second touch insulating film TINS2 may be formed or disposed as an inorganic film, such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. In one or more embodiments, the second touch insulating film TINS2 may be formed or disposed as an organic film made of a resin such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0110] The driving electrode TE and the sensing electrode RE can be located on or arranged on the second touch insulating film TINS2. The driving electrode TE and the sensing electrode RE can be formed or arranged as a single layer or two or more layers, which contain any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof.

[0111] The driving electrode TE and the sensing electrode RE can overlap with the connecting electrode BE on the third-direction DR3. The driving electrode TE can be connected to the connecting electrode BE through the touch contact hole TCNT1 passing through the second touch insulating film TINS2.

[0112] The third touch insulating film TINS3 can be formed or disposed on the driving electrode TE and the sensing electrode RE. The third touch insulating film TINS3 can be used to flatten the stepped portion formed or disposed by the driving electrode TE, the sensing electrode RE and the connecting electrode BE. The third touch insulating film TINS3 can be formed or disposed as an organic film made of resin such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, etc.

[0113] In the following, one or more suitable embodiments of the adhesive member 200, which is a major or primary feature of the display device 1 according to one or more embodiments of the present disclosure, will be described in more detail with reference to the accompanying drawings.

[0114] Figure 5 This is a diagram showing black markings placed or arranged on one side of a window member according to one or more embodiments of the present disclosure.

[0115] refer to Figure 5 The black mark BM can be positioned or arranged along the edge of the window component 100.

[0116] The black marker BM can be formed or arranged in the non-display area NDA of the window component 100. The black marker BM can be provided with a receiver so that the user can hear the other party's voice during a telephone call. The receiver can be covered by a receiver grille to protect the inside of the receiver from external influences.

[0117] The thickness of the black-marked BM can be equal to or less than 30 μm.

[0118] Figure 6 This is a side view of a display device according to one or more embodiments.

[0119] refer to Figure 6 The display panel 500 can be placed or arranged in the opposite direction to the black mark BM located or arranged in the window member 100. The display panel 500 and the window member 100 can be joined by the adhesive member 200. The housing 600 can be placed or arranged on the side of the window member 100, the display panel 500 and the adhesive member 200.

[0120] Figure 7 This is a side view of the display device under the condition that an external impact is applied to the display device (e.g., when an external impact is applied to the display device) according to one or more embodiments.

[0121] refer to Figure 7 If the display device 1 is subjected to an external impact such as a drop (e.g., when the display device 1 is subjected to an external impact such as a drop), the housing 600 may deform. Deformation of the housing 600 may cause the window member 100 in contact with the housing 600 to lift. As the window member 100 lifts, stress may be generated in the adhesive member 200. If stress exceeding the yield point is applied to the adhesive member 200 (e.g., when stress exceeding the yield point is applied to the adhesive member 200), cohesive failure may occur, and bubbles may form (or may be generated) within the adhesive member 200.

[0122] If the display device 1 is subjected to an external impact (e.g., when the display device 1 is subjected to an external impact), the modulus of the adhesive member 200 may increase. With this increase in modulus, the stress applied to the adhesive member 200 may increase, and bubbles formed or generated in the adhesive member 200 may extend all the way to the display area DA. For example, the larger the modulus, the wider the area in the adhesive member 200 where bubbles are formed or generated.

[0123] Figure 8 This is a side view of the display device under the condition that an external impact is applied to the display device (e.g., when an external impact is applied to the display device) according to one or more embodiments.

[0124] Figure 8 This diagram illustrates an adhesive member 200 utilizing the adhesive of this disclosure. The adhesive according to one or more embodiments of this disclosure can be a mixture of hydrophobic and hydrophilic monomers, and therefore can effectively or appropriately disperse impact energy generated from the outside due to the difference in stress transmission rates at the interface between the hydrophobic and hydrophilic monomer regions. Therefore, the area where bubbles form or are generated in the adhesive member 200 can be reduced. [Diagram showing...] Figure 8 The area where bubbles are formed or generated is smaller than Figure 7 The area where bubbles are formed or generated.

[0125] For example, adhesives comprising both hydrophobic and hydrophilic monomers can cause phase separation between the two monomers because they are immiscible. The modulus and glass transition temperature can differ between regions where the hydrophobic monomers are distributed and regions where the hydrophilic monomers are distributed.

[0126] The glass transition temperature of the region where hydrophobic monomers are distributed can be in the range of 50℃ to 80℃, while the glass transition temperature of the region where hydrophilic monomers are distributed can be in the range of -30℃ to 0℃.

[0127] Because the moduli differ between the regions where hydrophobic and hydrophilic monomers are distributed, externally applied stress and impact energy can be effectively or appropriately dispersed. For example, if stress transfers from hydrophobic to hydrophilic monomers (e.g., when stress transfers from hydrophobic to hydrophilic monomers), the rate of stress transfer can be reduced or decreased. Due to the difference in stress transmission rates at the interface between the hydrophilic and hydrophobic monomer regions, externally generated impact energy can be reduced or dispersed.

[0128] The adhesive component 200 disclosed herein may include an adhesive, and the adhesive may include alkyl acrylate compounds, acrylate compounds containing polar functional groups, hydrophobic monomers, and hydrophilic monomers.

[0129] Alkyl acrylate compounds can be alkyl acrylates containing alkyl groups having 1 to 20 carbon atoms. For example, an alkyl acrylate compound can be at least one of alkyl acrylates containing straight-chain alkyl groups having 1 to 12 carbon atoms and alkyl acrylates containing branched-chain alkyl groups having 3 to 12 carbon atoms. For example, an alkyl acrylate containing straight-chain alkyl groups having 1 to 12 carbon atoms can be selected from n-hexyl acrylate, n-octyl acrylate, n-nonyl acrylate, butyl acrylate, etc., but the embodiments of this disclosure are not limited thereto. For example, an alkyl acrylate containing branched-chain alkyl groups having 3 to 12 carbon atoms can be selected from 2-ethylhexyl acrylate, isononyl acrylate, isooctyl acrylate, etc., but the embodiments of this disclosure are not limited thereto.

[0130] Alkyl acrylate compounds can form the backbone of an adhesive. 60 to 80 parts by weight of the alkyl acrylate compound may be included in 100 parts by weight of the adhesive.

[0131] Acrylic compounds containing polar functional groups can improve or enhance interfacial adhesion and have excellent or suitable reactivity with crosslinking agents, which facilitates the introduction of crosslinked structures.

[0132] Polar functional groups may include at least one of hydroxyl groups, epoxy groups, and urethane groups.

[0133] Acrylate compounds containing polar functional groups may include at least one of (meth)acrylate 2-hydroxyethyl ester, (meth)acrylate 2-hydroxypropyl ester, (meth)acrylate 4-hydroxybutyl ester, (meth)acrylate 6-hydroxyhexyl ester, (meth)acrylate 8-hydroxyoctyl ester, (meth)acrylate 10-hydroxydecyl ester and (meth)acrylate 12-hydroxylaurate.

[0134] The 100 parts by weight of the adhesive may include 10 to 30 parts by weight of an acrylate compound containing polar functional groups.

[0135] The hydrophobic monomer may include at least one of alkyl methacrylate compounds and isobornyl acrylate. In 100 parts by weight of the adhesive, there may be 3 to 15 parts by weight of the hydrophobic monomer.

[0136] The hydrophilic monomer may include acrylamide-based compounds or ester-based compounds. In 100 parts by weight of the adhesive, there may be 3 to 15 parts by weight of the hydrophilic monomer.

[0137] Compounds based on acrylamide may also include (meth)acrylamides having an amino group, such as N-ethyl(meth)acrylamide, N-isopropyl(meth)acrylamide, N-n-butyl(meth)acrylamide, N-octyl(meth)acrylamide, dimethylaminoethyl(meth)acrylamide, diethylaminoethyl(meth)acrylamide, and dimethylaminopropyl(meth)acrylamide. As a non-limiting example, N,N-dialkyl(meth)acrylamides as described herein may include N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, N,N-dipropyl(meth)acrylamide, N,N-diisopropyl(meth)acrylamide, N,N-di(n-butyl)(meth)acrylamide, N,N-di(tert-butyl)(meth)acrylamide, N-hydroxymethyl(meth)acrylamide, and N-(2-hydroxyethyl)(meth)acrylamide. At least one of the following: amine, N-(2-hydroxypropyl)(methyl)acrylamide, N-(1-hydroxypropyl)(methyl)acrylamide, N-(3-hydroxypropyl)(methyl)acrylamide, N-(2-hydroxybutyl)(methyl)acrylamide, N-(3-hydroxybutyl)(methyl)acrylamide, N-(4-hydroxybutyl)(methyl)acrylamide, N-methyl-N-2-hydroxyethyl(methyl)acrylamide, N-methoxymethyl(methyl)acrylamide, and N-butoxymethyl(methyl)acrylamide.

[0138] Ester-based compounds may include at least one of 2-acrylic acid, (5-ethyl-1,3-dioxane-5-yl)methyl ester, and 2-phenoxyethyl ester.

[0139] Adhesives may also include additives that are generally available or commonly used in the art to control bond strength, cohesion, viscosity, elastic modulus, glass transition temperature, etc. For example, as additives, adhesives may include tackifiers, antioxidants, corrosion inhibitors, leveling agents, surface lubricants, dyes, pigments, defoamers, fillers, photoinitiators, light stabilizers, plasticizers, etc.

[0140] Hydrophobic monomers and hydrophilic monomers may be included in a content ratio (e.g., amount) of 5:5 to 2:8 by weight.

[0141] If the content (e.g., amount) of hydrophobic monomers is too low compared to the content (e.g., amount) of hydrophilic monomers (e.g., when the content (e.g., amount) of hydrophobic monomers is too low compared to the content (e.g., amount) of hydrophilic monomers), stamping performance may be reduced. Stamping performance refers to the degree of indentation and / or scratching that occurs when the cutting blade is applied from one side to the other during a cutting process (e.g., when the cutting blade is applied from one side to the other during a cutting process). The less indentation and / or scratching occurs during the cutting process, the better the punching performance is assessed. Additionally, haze may increase.

[0142] If the content (e.g., amount) of hydrophilic monomers is too low compared to the content (e.g., amount) of hydrophobic monomers (e.g., when the content (e.g., amount) of hydrophilic monomers is lower than that of hydrophobic monomers (e.g., amount), then impact resistance may be reduced. Impact energy can be reduced in the hydrophilic monomer region, but if the content (e.g., amount) of hydrophilic monomers is low (e.g., when the content (e.g., amount) of hydrophilic monomers is low), there may be limitations in adequately reducing impact energy.

[0143] The adhesive may also contain an emulsifier, and may include an amount of 1 to 5 parts by weight of emulsifier per 100 parts by weight of the adhesive. If the amount of emulsifier is greater than 5 parts by weight relative to 100 parts by weight of the adhesive (e.g., when the amount of emulsifier is greater than 5 parts by weight relative to 100 parts by weight of the adhesive), the adhesion properties and modulus may be increased or enhanced, which may result in a decrease or reduction in impact resistance and the ability to cover the steps of the black mark BM.

[0144] The emulsifier may include at least one of polyoxyethylene (20) sorbitan monolaurate, 2-[4-(2,4,4-trimethylpentyl-2-yl)phenoxy]ethanol, polyoxyethylene alkyl aryl ether, polyoxyethylene alkylamine and polyoxyethylene alkyl ester.

[0145] Adhesive can be in 10 -4 Hz to 10 3 It has a modulus of 0.01 MPa to 10 MPa in the frequency range of Hz, and at 10 3 Hz to 10 5 It has a modulus of 10 MPa to 30 MPa in the frequency range of Hz.

[0146] The frequency of display device 1 can typically be 10. -4 Hz to 10 3Hz, and if the display device 1 is subjected to an external impact such as a drop (e.g., when the display device 1 is subjected to an external impact such as a drop), the frequency range can be 10 Hz. 3 Hz to 10 5 Hz. Therefore, if the display device 1 is in a normal state (e.g., when the display device 1 is in a normal state), the modulus of the display device 1 can be from 0.01 MPa to 10 MPa, and if the display device 1 is subjected to an impact (e.g., when the display device 1 is subjected to an impact), the modulus of the display device 1 can be from 10 MPa to 30 MPa.

[0147] Commercially available adhesives can be used in 10 3 Hz to 10 5 It has a modulus of 50 MPa or higher in the Hz frequency range. This indicates low impact resistance.

[0148] Conversely, if the display device 1 is subjected to an external impact (e.g., when the display device 1 is subjected to an external impact), the adhesive member 200 to which the adhesive of this disclosure is applied can be 10 3 Hz to 10 5 It has a modulus of 10 MPa to 30 MPa in the frequency range of Hz. The adhesive disclosed herein can be considered to have high impact resistance.

[0149] If the modulus distribution is plotted based on frequency, with frequency on the x-axis (Hz) and modulus on the y-axis (MPa) (e.g., when the modulus distribution is plotted based on frequency, with frequency on the x-axis (Hz) and modulus on the y-axis (MPa), then at 10 3 Hz to 10 4 The average slope in the Hz frequency range can be between 0.01 and 0.35.

[0150] If the display device 1 is subjected to an external shock under normal conditions (for example, when the display device 1 is subjected to an external shock under normal conditions), then at a frequency that increases rapidly by 10... 3 Hz to 10 4 Within the Hz range, the slope of the modulus relative to the frequency can remain low (in the range of approximately 0.01 to 0.35). This can mean that if an external impact is applied to the display device 1 (e.g., when an external impact is applied to the display device 1), the modulus gradually increases.

[0151] The adhesive disclosed herein can have high impact resistance, so the minimum load at which defects such as bubbles occur can be 25 N or greater.

[0152] Figure 9 This is a diagram showing an adhesive member located at or arranged at any point in a window member according to one or more embodiments of the present disclosure.

[0153] For example, Figure 9 The first point 1P, the second point 2P, the third point 3P, and the fourth point 4P can be randomly marked points on the window member 100 where the adhesive member 200 is located or arranged. If the modulus of the first point 1P to the fourth point 4P is measured (e.g., when measuring the modulus of the first point 1P to the fourth point 4P), the average value of the modulus difference between the first point 1P and the second point 2P, the modulus difference between the first point 1P and the third point 3P, the modulus difference between the first point 1P and the fourth point 4P, the modulus difference between the second point 2P and the third point 3P, the modulus difference between the second point 2P and the fourth point 4P, and the modulus difference between the third point 3P and the fourth point 4P can be 10 MPa or higher. For example, if the modulus measured at the first point 1P is 5 MPa (e.g., when the modulus measured at the first point 1P is 5 MPa), then the modulus measured at the third point 3P can be 20 MPa.

[0154] The second point 2P can be separated from and / or isolated from the first point 1P by a selected (e.g., spaced apart or separated) distance. The selected distance can be approximately 0.5 cm.

[0155] The adhesive component 200 may include an adhesive comprising hydrophobic and hydrophilic monomers, and the modulus may differ between the regions where the hydrophobic monomers are distributed and the regions where the hydrophilic monomers are distributed. The modulus of the regions where the hydrophilic monomers are distributed may be less than the modulus of the regions where the hydrophobic monomers are distributed.

[0156] In the window member 100 where the adhesive member 200 is located or arranged, the difference in modulus can occur across different regions, allowing stress and impact energy to be dispersed or shock wave transmission to be reduced at the interface between regions with different moduli.

[0157] The thickness of the adhesive can be from 75 μm to 100 μm.

[0158] Generally available or commonly used adhesives can be applied at a thickness of 150 μm or greater. For example, if the black marker BM is formed or arranged at a thickness of 30 μm (e.g., when the black marker BM is formed or arranged at a thickness of 30 μm), the adhesive may need to be or may be expected to be formed or arranged at a thickness of at least 150 μm to completely (e.g., substantially completely) cover the black marker BM.

[0159] Conversely, even if the black marker BM is formed or arranged with a thickness of 30 μm (e.g., when the black marker BM is formed or arranged with a thickness of 30 μm), the adhesive disclosed herein can be formed or arranged with a thickness of 100 μm to completely (e.g., substantially completely) cover the black marker BM.

[0160] The adhesive strength can be equal to or greater than 1.5 kgf / inch.

[0161] The adhesive disclosed herein achieves both high flowability and high adhesive strength (e.g., simultaneously achieving both high flowability and high adhesive strength). When placed between the window member 100 and the display panel 500 (e.g., when placed between the window member 100 and the display panel 500), the adhesive of this disclosure exhibits excellent or suitable stepped embedding properties even in small quantities, ensuring excellent lamination performance. Excellent lamination performance can refer to the minimization or reduction of gaps between the patterned surface of the element and the adhesive member 200, and the patterned surface being completely (e.g., substantially completely) filled without air bubbles, such that (e.g., to make) the surfaces in contact with the adhesive member 200 are firmly attached.

[0162] One or more embodiments of this disclosure will be described in more detail by way of the following examples, but the following examples are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0163] 1. Preparation of adhesives

[0164] 1) Preparation Example 1

[0165] 70 parts by weight of 2-ethylhexyl acrylate, 20 parts by weight of 2-hydroxyethyl acrylate, 5 parts by weight of isobornyl acrylate, and 5 parts by weight of dimethylacrylamide were added to a reaction vessel. The adhesive was prepared by mixing the solution in the reaction vessel.

[0166] 2) Example 1

[0167] The adhesive prepared in Preparation Example 1 is applied to a glass substrate having a selected (e.g., set or predetermined) thickness, dried and cured to prepare an adhesive component.

[0168] 3) Example 2

[0169] The adhesive prepared in Preparation Example 1 was applied to a glass substrate with 20 μm thick black markings printed on the edges at a thickness of 75 μm, and dried at 120 °C for 4 minutes to perform primary curing. Subsequently, glass substrates were stacked on the applied adhesive to prepare an adhesive component.

[0170] 4) Example 3

[0171] Except that the adhesive prepared in Preparation Example 1 is applied to a thickness of 100 μm, the adhesive component is prepared in essentially the same manner as in Preparation Example 2.

[0172] 5) Example 4

[0173] The adhesive prepared in Preparation Example 1 was applied to a glass substrate at a thickness of 75 μm and dried for 4 minutes to perform primary curing. Subsequently, a PET film was stacked on the applied adhesive and irradiated with UV light to perform secondary curing. The PET film and glass substrate were then removed, leaving only the adhesive components.

[0174] 6) Example 5

[0175] Except that the adhesive prepared in Preparation Example 1 is applied to a thickness of 100 μm, the adhesive component is prepared in essentially the same manner as in Example 4.

[0176] 7) Comparative Example 1

[0177] As a comparative example, the CEF30 series from 3M was used as the adhesive, and the bonded component was prepared on the glass substrate in essentially the same manner as in Example 1.

[0178] 8) Comparative Example 2

[0179] Except that the CEF30 series from 3M is used as the adhesive, the bonded components are prepared in essentially the same manner as in Example 2.

[0180] 9) Comparative Example 3

[0181] Except for applying the adhesive to a thickness of 100 μm, the adhesive component was prepared in essentially the same manner as in Comparative Example 2.

[0182] 10) Comparative Example 4

[0183] Except for applying the adhesive to a thickness of 150 μm, the adhesive component was prepared in essentially the same manner as in Comparative Example 2.

[0184] 11) Comparative Example 5

[0185] Except that the CEF30 series from 3M is used as the adhesive, the bonded components are prepared in essentially the same manner as in Example 4.

[0186] 12) Comparative Example 6

[0187] Except for applying the adhesive to a thickness of 100 μm, the adhesive component was prepared in essentially the same manner as in Comparative Example 5.

[0188] 13) Comparison Example 7

[0189] Except for applying the adhesive to a thickness of 150 μm, the adhesive component was prepared in essentially the same manner as in Comparative Example 5.

[0190] Evaluate

[0191] 1. Modulus Assessment

[0192] The modulus of the bonded components of Example 1 and Comparative Example 1 was measured using an indenter, and the results are shown below. Figures 10 to 14 middle.

[0193] Figure 10 It is a graph showing the modulus (MPa) of the adhesive member according to frequency (Hz) in one or more embodiments.

[0194] from Figure 10 The results shown indicate that the modulus of the adhesive component in Comparative Example 1 is within the impact range of 10. 3 Hz to 10 4 It increases rapidly in the frequency range of Hz. Additionally, the modulus was observed to increase rapidly at approximately 10. 3 At Hz, the pressure is equal to or greater than 50 MPa. Conversely, the bonded component of Example 1 was observed to have a pressure of 10 MPa, which is the impact range. 3 Hz to 10 4 It has a gradually increasing modulus in the frequency range of Hz, and around 10 6 It has a very low modulus of about 10 MPa at a frequency of Hz. This indicates that the adhesive disclosed herein has high impact resistance.

[0195] Figure 11 It is a modulus mapping image of the adhesive component based on the comparative example. Figure 12 It is a modulus mapping image of an adhesive component according to one or more embodiments.

[0196] from Figure 11 The results shown indicate that the first point (brightest spot) and the second point (darkest spot) of the bonded component have pressures of 2.7 MPa and 2.4 MPa, respectively. Furthermore, the mapping range is shown to be from 2.3 MPa to 2.7 MPa.

[0197] On the contrary, according to Figure 12 The results shown indicate that the first point (brightest spot) and the second point (darkest spot) of the bonded component have pressures of 14 MPa and 27 MPa, respectively. Furthermore, it can be confirmed that the mapping range shows a range of 10 MPa or higher from 14 MPa to 27 MPa.

[0198] according to Figure 11 and Figure 12 The results shown indicate that the adhesive component of Comparative Example 1 exhibits a substantially uniform modulus across its entire plane, while the adhesive component of Example 1 exhibits a modulus variation across its entire plane. If a difference in modulus exists across the entire plane (e.g., when a difference in modulus exists across the entire plane), as in Example 1, shock wave dissipation can occur at the interface of the modulus variation. Therefore, the adhesive component can be considered to have excellent or suitable shock resistance.

[0199] The modulus was evaluated under temperature scanning conditions, and the results are shown in... Figure 13 and Figure 14 middle.

[0200] Figure 13 This is a graph showing the modulus of the bonded component in a comparative example at different temperatures based on the indentation depth. Figure 14 It is a graph showing the modulus of the adhesive component in one or more embodiments according to the indentation depth at different temperatures.

[0201] according to Figure 13 The results shown indicate that the bonded component of Comparative Example 1 exhibits only small modulus differences at different temperatures. Conversely, according to... Figure 14 As shown in the results, the bonded component of Example 1 exhibits significant modulus differences at different temperatures. In the case of Example 1, phase separation can occur due to incomplete mixing between the hydrophobic and hydrophilic monomers, which can result in the presence of two or more glass transition temperatures. Shock wave dissipation can occur at the interface between the hydrophobic and hydrophilic monomer regions, thereby improving or enhancing the impact resistance of the bonded component.

[0202] To assess crack formation and bubble generation in the adhesive, indentation testing was performed using a universal testing machine (UTM). Figure 15 and Figure 16 The physical properties of the adhesive components of Examples 2, 3, Comparative Examples 2, 3, and 4 when slowly pressed at the indentation points are shown in Table 1.

[0203] Figure 15 This is a top view showing the indentation points during the evaluation of an adhesive member according to one or more embodiments. Figure 16 This is a side view showing indentation points during the evaluation of an adhesive member according to one or more embodiments.

[0204] Table 1

[0205] Based on the results shown in Table 1, it was found that each of Examples 2 and 3 has two glass transition temperatures (T0 and T1) of -30°C and 60°C. g Comparative Examples 2, 3, and 4 each have a single glass transition temperature (T). g (and their temperatures are -13℃, 5℃ and 5℃ respectively).

[0206] At room temperature, the moduli of Examples 2 and 3, and Comparative Examples 2 to 4, did not show significant differences (although the room temperature moduli of Examples 2 and 3 were slightly higher). However, the moduli at low temperatures were different. For example, the moduli at low temperatures in Examples 2 and 3 were 5.17 MPa and 5.25 MPa, respectively, while the moduli at low temperatures in Comparative Examples 3 and 4 were very high, at 240.97 MPa and 241.00 MPa, respectively. The load at which bubble formation began in Comparative Example 3 was approximately 15.0 N. Comparative Example 2, with a modulus of approximately 6.38 at low temperature, exhibited a bubble formation load of approximately 21.7 N. The bubble formation load of Comparative Example 4 was approximately 23.9 N. The bubble formation load of Comparative Example 4 was higher than that of Comparative Examples 2 and 3, which had adhesive thicknesses smaller than that of Comparative Example 4. However, the bubble formation load of Comparative Example 4 was found to be lower than that of the examples. Since Comparative Examples 2, 3, and 4 all have low bubble-forming loads, they can be considered to have low impact resistance. In contrast, Examples 2 and 3 have high bubble-forming loads of 28.1 N and 30.4 N, respectively.

[0207] Example 2 and Example 3 each have two glass transition temperatures (T). g It also exhibits low modulus and high impact resistance even at low temperatures.

[0208] Figure 17 This is an image showing the stress distribution simulation results when a force is applied to the adhesive component of the comparative example. Figure 18 It is an image showing the simulation results of stress distribution when a force is applied to an adhesive member of one or more embodiments.

[0209] from Figure 17 The results shown indicate that when force is applied to the bonded component of the comparative example, the stress transfer distance is relatively large. Conversely, Figure 18 The adhesive member in the embodiment of the present invention exhibits a reduced stress transmission distance when force is applied.

[0210] The adhesive component prepared in the embodiment has randomly distributed hydrophobic monomer regions and hydrophilic monomer regions, which reduces the transmission speed of shock waves and thus reduces the stress transmission distance.

[0211] 2. Stepped embedding performance

[0212] To evaluate the step-embedding performance of the adhesive, the adhesive components of Examples 4 and 5, and Comparative Examples 5, 6, and 7 were placed on the top surface of glass substrates with patterns having thicknesses of 10 μm, 20 μm, and 30 μm, respectively, and then laminated by autoclaving at 40 °C and 5 bar for 10 minutes. The laminated surfaces were examined under a microscope to check for the presence of air bubbles. If no air bubbles were found, the results of the microscopic evaluation were classified as OK, and if any air bubbles were detected, they were classified as NG. These results are shown in Table 2.

[0213] Table 2

[0214] According to the results shown in Table 2, the step-embedding performance of the adhesive member in Example 4, with a thickness of 75 μm, is 20 μm, while that of Comparative Example 5 is 10 μm. The step-embedding performance of the adhesive member in Example 5, with a thickness of 100 μm, is 30 μm, while that of Comparative Example 6 is 20 μm. If the adhesive of the comparative examples is used (e.g., when the adhesive of the comparative examples is used), the adhesive member requires and is expected to have a minimum thickness of 150 μm to achieve the step-embedding performance. Conversely, if the adhesive of the embodiments is used (e.g., when the adhesive of the embodiments is used), it is confirmed that even with a thickness of 100 μm, the adhesive member exhibits good or suitable step-embedding performance for a 30 μm thick pattern. Therefore, even with a smaller thickness compared to the adhesive member of the comparative examples, the adhesive member of the embodiments can effectively or appropriately cover the steps of thick patterns. This demonstrates that the adhesive member of the embodiments has excellent step-embedding performance.

[0215] 3. Adhesion strength

[0216] The bond strength between the bonded component and the glass plate (alkali-free glass plate) was measured as the 180° bond strength according to JIS 2107 standard. The bonded components of Examples 4 and 5, and Comparative Example 7, were each laminated onto the glass plate. Using a 30 kgf pressure gauge, each of the glass plate and the bonded component was connected to the upper and lower clamps of a tensile testing machine (TextureAnalyzer, TA Instrument). The load (bond strength) was measured while the bonded component was being separated from the glass plate at a tensile speed of 300 mm / min, a tensile angle of 180°, and a tensile temperature of 25°C, and the results are shown in Table 3.

[0217] Table 3

[0218] Based on the results shown in Table 3, it can be confirmed that the adhesive strength of the example bonded component is excellent or suitable, with an adhesive strength of 1.5 kgf / inch or greater.

[0219] Figure 19 This is a block diagram of an electronic device according to one or more embodiments. (Reference) Figure 19 The electronic device 2 according to one or more embodiments may include a display module 21, a processor 22, a memory 23, and a power module 24. The display device according to one or more embodiments may be applied to the display module 21.

[0220] The processor 22 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0221] The memory 23 can store data information expected or required by the operation of the processor 22 or the display module 21. If the processor 22 executes an application stored in the memory 23 (e.g., when the processor 22 executes an application stored in the memory 23), image data signals and / or input control signals can be sent to the display module 21, and the display module 21 can process the received signals and output image information through the display screen.

[0222] The power module 24 may include a power supply module such as a power adapter and / or battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power desired or required for the operation of the electronic device 2.

[0223] At least one component selected from the components of the electronic device 2 as described in one or more embodiments may be included in the display device 1 as described in one or more embodiments. Furthermore, one or more separate modules functionally included in a single module may be included in the display device 1, and one or more other modules may be provided separately from the display device 1. For example, the display device 1 may include a display module 21, and a processor 22, a memory 23, and a power module 24 may be provided in the electronic device 2 as other devices besides the display device 1.

[0224] Figure 20 It is a schematic diagram of an electronic device according to one or more suitable embodiments.

[0225] refer to Figure 20The application of a display device according to one or more embodiments may include not only image display electronic devices such as smartphones 2_1a, tablet PCs 2_1b, laptop computers 2_1c, TVs 2_1d and desktop monitors 2_1e, but also wearable electronic devices including display modules such as smart glasses 2_2a, head-mounted displays 2_2b, smartwatches 2_2c, and vehicle electronic devices including display modules such as dashboards, central instrument panels and dashboards of automobiles, interior mirror displays, etc.

[0226] The light-emitting device, display device, display apparatus, electronic device, electronic device, and apparatus for manufacturing substantially the same and / or any other related devices or components according to one or more embodiments of this disclosure can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuits), software, or a combination of software, firmware, and hardware (e.g., any suitable). For example, one or more components of the device may be provided on an integrated circuit (IC) chip or on a separate IC chip. Furthermore, one or more components of the device may be implemented on a flexible printed circuit film, a tape-on-a-carrier (TCP) package, and / or a printed circuit board (PCB), or provided on a substrate. Additionally, one or more components of the device may be a process or thread that runs on one or more processors in one or more computing devices, executes computer program instructions, and interacts with other system components for performing one or more functions described herein. The computer program instructions may be stored in memory that can be implemented in the computing device using, for example, standard storage devices, such as random access memory (RAM). The computer program instructions may also be stored, for example, on other non-transitory computer-readable media, such as CD-ROMs, flash drives, etc. Furthermore, those skilled in the art will recognize that, without departing from the scope of this disclosure, the functions of one or more computing devices may be combined or integrated into a single computing device, or the functions of a particular computing device may be distributed to one or more other computing devices.

[0227] Although one or more embodiments of this disclosure have been described with reference to the accompanying drawings, those skilled in the art will understand that this disclosure may be implemented in one or more suitable forms without departing from its spirit and scope. Therefore, it should be understood that the embodiments described herein should be considered illustrative rather than restrictive in all respects.

Claims

1. A display device, comprising: Display panel; Window components are located on the display panel. An adhesive is used between the display panel and the window component; as well as The housing, located on at least one side of the display panel and the window member, comprises metal. The adhesive includes alkyl acrylate compounds, acrylate compounds containing polar functional groups, hydrophobic monomers, and hydrophilic monomers.

2. The display device according to claim 1, wherein, In 100 parts by weight of the adhesive, The amount of the alkyl acrylate compound is 60 to 80 parts by weight. The amount of the acrylate compound containing the polar functional group is from 10 parts by weight to 30 parts by weight. The amount of the hydrophobic monomer is from 3 parts by weight to 15 parts by weight, and The amount of the hydrophilic monomer is from 3 to 15 parts by weight.

3. The display device according to claim 1, wherein, The weight ratio of the hydrophobic monomer to the hydrophilic monomer is 5:5 to 2:

8.

4. The display device according to claim 1, wherein, The adhesive also includes an emulsifier, and In 100 parts by weight of the adhesive, the amount of the emulsifier is from 1 part by weight to 5 parts by weight.

5. The display device according to claim 1, wherein, The average value of the difference between the modulus of a first point on the surface of the display device and the modulus of a second point separated from the first point by a set distance is equal to or greater than 10 MPa.

6. The display device according to claim 1, wherein, The thickness of the adhesive is in the range of 75 μm to 100 μm.

7. The display device according to claim 1, further comprising a black mark on the edge of one surface of the window member. in, The thickness of the black mark is equal to or less than 30 μm.

8. The display device according to claim 1, wherein, The adhesive is in 10 -4 Hz to 10 3 It has a modulus of 0.01 MPa to 10 MPa in the frequency range of Hz, and at 10 3 Hz to 10 5 It has a modulus of 10 MPa to 30 MPa in the frequency range of Hz.

9. The display device according to claim 1, wherein, When plotting the modulus distribution based on frequency, with frequency on the x-axis and modulus on the y-axis, at 10 3 Hz to 10 4 The average slope in the frequency range of Hz is between 0.01 and 0.

35.

10. The display device according to claim 1, wherein, The adhesive has two or more glass transition temperatures.

11. The display device according to claim 10, wherein, The first glass transition temperature of the adhesive is in the range of -30°C to 0°C, and The second glass transition temperature of the adhesive is in the range of 50°C to 80°C.

12. The display device according to claim 1, wherein, The hydrophobic monomer includes at least one of alkyl methacrylate compounds and isobornyl acrylate.

13. The display device according to claim 1, wherein, The hydrophilic monomers include acrylamide-based compounds or ester-based compounds.

14. The display device according to claim 1, wherein, The adhesive has a bonding strength equal to or greater than 1.5 kgf / inch.

15. An electronic device comprising: The display module provides the image. as well as The processor sends image data signals to the display module. The display module includes: Display panel; Window components are located on the display panel. Adhesive, between the display panel and the window member; and The housing, located on at least one side of the display panel and the window member, comprises metal, and The adhesive includes alkyl acrylate compounds, acrylate compounds containing polar functional groups, hydrophobic monomers, and hydrophilic monomers.

16. The electronic device according to claim 15, wherein, In 100 parts by weight of the adhesive, The amount of the alkyl acrylate compound is 60 to 80 parts by weight. The amount of the acrylate compound containing the polar functional group is from 10 parts by weight to 30 parts by weight. The amount of the hydrophobic monomer is from 3 parts by weight to 15 parts by weight, and The amount of the hydrophilic monomer is from 3 to 15 parts by weight.

17. The electronic device according to claim 15, wherein, The average value of the difference between the modulus of a first point on the surface of the display module and the modulus of a second point separated from the first point by a set distance is equal to or greater than 10 MPa.

18. The electronic device according to claim 15, wherein, The display module also includes a black mark on the edge of one surface of the window member, and The thickness of the black mark is equal to or less than 30 μm.

19. The electronic device according to claim 15, wherein, The adhesive is in 10 -4 Hz to 10 3 It has a modulus of 0.01 MPa to 10 MPa in the frequency range of Hz, and at 10 3 Hz to 10 5 It has a modulus of 10 MPa to 30 MPa in the frequency range of Hz.

20. The electronic device according to claim 15, wherein, When plotting the modulus distribution based on frequency, with frequency on the x-axis and modulus on the y-axis, at 10 3 Hz to 10 4 The average slope in the frequency range of Hz is between 0.01 and 0.35.

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