High-thermal-conductivity modified polyurethane pouring sealant and preparation method thereof

By using modified nitrogen-doped graphene, boric acid-modified composite filler, and graded silicon carbide, a continuous thermally conductive network and strong interfacial interactions are constructed, which solves the problems of insufficient thermal conductivity, mechanical properties, resistance to humid heat aging, and high temperature resistance of high thermal conductivity polyurethane potting compounds, and achieves the stability and efficient thermal conductivity of the material in high temperature and high humidity environments.

CN122445314APending Publication Date: 2026-07-24HUNAN SHENGSHI ADHESIVE TECH CO LTD
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Patent Information

Application Number
CN202610606919.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-05-06
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

Existing high thermal conductivity polyurethane potting compounds have shortcomings in terms of thermal conductivity, mechanical properties, resistance to damp heat aging, and high temperature resistance, making it difficult to balance thermal conductivity efficiency and material stability.

Method used

By employing modified nitrogen-doped graphene, boric acid-modified composite filler, and graded silicon carbide, the thermal conductivity, mechanical properties, and resistance to damp heat aging of the material are improved through the construction of a continuous thermally conductive network, strong interfacial interactions, and cross-linking network.

Benefits of technology

Significant improvements have been achieved in the thermal conductivity, mechanical properties, resistance to humid heat aging, and high temperature resistance of high thermal conductivity polyurethane potting compounds, ensuring the maintenance of structural stability and thermal conductivity efficiency of the material in high temperature and high humidity environments.

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Abstract

The invention discloses a high-thermal-conductivity modified polyurethane pouring sealant and a preparation method thereof, and relates to the technical field of adhesives. The high-temperature-resistant polyurethane adhesive is prepared from the following raw materials in parts by mass: 265 to 318 parts of modified polyurethane prepolymer, 5 to 6 parts of silane coupling agent KH-550, 80 to 96 parts of modified composite filler, 3.2 to 3.7 parts of ethylene glycol amine and 0.3 to 0.36 part of dibutyltin dilaurate, the modified composite filler is prepared from a silane coupling agent KH-550, graphene, silicon carbide, boron nitride nanosheets, cellulose nanofibers and modified nitrogen-doped graphene; the modified nitrogen-doped graphene is prepared from nitrogen-doped graphene powder, calcium nitrate tetrahydrate and diammonium hydrogen phosphate. By introducing the modified polyurethane prepolymer, the modified nitrogen-doped graphene and the like, the heat conductivity, the mechanical property, the damp-heat aging resistance and the high temperature resistance of the high-heat-conductivity polyurethane pouring sealant are effectively improved.
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