Camera module and electronic device

Abstract

Embodiments of the present application provide a camera module and an electronic device, which include a substrate, a lens piece, an image sensor and a filling glue layer. The substrate includes a first surface and a second surface arranged oppositely. The substrate is provided with a light transmission hole penetrating through the first surface and the second surface. The first surface is provided with a welding area and a glue blocking wall at least at an edge of the light transmission hole. The glue blocking wall is located between the welding area and the edge of the light transmission hole. The glue blocking wall extends in a direction away from the second surface compared with the welding area. The lens piece is mounted on the second surface. The image sensor is arranged on the first surface. Part of the image sensor corresponds to the lens piece through the light transmission hole, and part of the image sensor cover is mounted on the welding area. The filling glue layer is arranged at least between the non-photosensitive area and the welding area, and the filling glue layer is located on a side of the glue blocking wall away from the light transmission hole. By arranging the glue blocking wall, the filling glue can be effectively prevented from overflowing to the image sensor during the glue dispensing process, the influence on the light transmission hole is reduced, and the clarity of optical imaging is ensured.

Description

Technical Field

[0001] This application relates to the field of optical packaging technology, specifically to camera modules and electronic devices. Background Technology

[0002] With the development of camera module technology, image sensors are becoming increasingly smaller, leading to new challenges in their packaging and assembly processes. Particularly during image sensor assembly, the requirements for packaging precision have become extremely stringent. In image sensor assembly, a light-transmitting hole is typically created on the substrate, the image sensor is placed above the hole, and the pads at the edge of the image sensor are soldered to the pads on the substrate surface to achieve electrical connection. Filler adhesive is added between the image sensor pads and the substrate pads to strengthen the connection. However, excess filler adhesive may flow onto the photosensitive area of ​​the image sensor, affecting image quality. Summary of the Invention

[0003] To address the shortcomings of the existing technology, it is necessary to provide a camera module. Furthermore, embodiments of this application also require the provision of an electronic device incorporating such a camera module.

[0004] A camera module includes a substrate, a lens, an image sensor, and a filler layer. The substrate includes a first surface and a second surface disposed opposite to each other. The substrate has a light-transmitting hole penetrating the first and second surfaces. At least one edge of the light-transmitting hole on the first surface is further provided with a soldering area and a retaining wall, the retaining wall being located between the soldering area and the edge of the light-transmitting hole. The retaining wall extends relative to the soldering area in a direction away from the second surface. The lens is mounted on the second surface. The image sensor is disposed on the first surface. A portion of the image sensor corresponds to the lens through the light-transmitting hole, and a portion of the image sensor is mounted on the soldering area. The filler layer is at least disposed between the image sensor and the soldering area. The filler layer is located on the side of the retaining wall away from the light-transmitting hole.

[0005] This application effectively prevents filler adhesive from overflowing onto the image sensor during dispensing by setting a barrier, reducing its impact on the light-transmitting aperture and thus ensuring the clarity and quality of optical imaging. The pre-reserved soldering area and light-transmitting aperture on the PCB structure make the image sensor's mounting position clearer, providing higher alignment accuracy during assembly and reducing assembly errors. The filler adhesive layer, located between the soldering area and the non-photosensitive area, strengthens the connection between the image sensor and the substrate, improving the overall module's mechanical stability and reducing the risk of connection failure due to thermal expansion and contraction or vibration. By reducing the impact of filler adhesive leakage on the image sensor, this design helps improve the production line yield, reduces the generation of defective products, and thus lowers production costs in the long term.

[0006] In some embodiments of this application, the surface of the adhesive barrier facing the image sensor is flush with the first surface.

[0007] In some embodiments of this application, the image sensor includes a photosensitive area and a non-photosensitive area connected together. The photosensitive area corresponds to the lens element through a light-transmitting hole, and the non-photosensitive area is welded to the welding area.

[0008] In some embodiments of this application, the welding area includes a welding groove formed by a first surface depression and a first connecting portion disposed within the welding groove. At least a portion of the filler adhesive layer is disposed within the welding groove, and a second connecting portion is provided on the non-photosensitive area. The first connecting portion is welded to the second connecting portion.

[0009] In some embodiments of this application, a conductive material is provided on the first connecting part, and the second connecting part is electrically connected to the first connecting part through the conductive material.

[0010] In some embodiments of this application, at least a portion of the second connection portion is disposed within the welding groove.

[0011] In some embodiments of this application, the width of the welding groove is 0.01 mm to 0.05 mm along the arrangement direction of the adhesive barrier and the welding area on the same side of the edge of the light-transmitting hole.

[0012] In some embodiments of this application, the width of the adhesive barrier is 0.1 mm to 0.2 mm along the arrangement direction of the adhesive barrier and the welding area on the same side of the edge of the light-transmitting hole.

[0013] In some embodiments of this application, the first surface is provided with welding areas and adhesive barriers on two opposite edges of the light-transmitting hole in a first direction. The two adhesive barriers are located on both sides of the light-transmitting hole along the first direction, which is the length arrangement direction of the substrate. Along the first direction, the distance between the outer edges of the two adhesive barriers is greater than the width of the image sensor.

[0014] This application also provides an electronic device, including a housing, and the electronic device further includes the aforementioned camera module, which is installed inside the housing. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a camera module according to one embodiment of this application.

[0016] Figure 2 yes Figure 1 An exploded view of the camera module.

[0017] Figure 3 yes Figure 1 A cross-sectional view of the camera module along section line IV-IV.

[0018] Figure 4 yes Figure 2 An enlarged schematic diagram of the substrate of the camera module shown.

[0019] Figure 5 This is a schematic diagram of the structure of an electronic device according to one embodiment of this application.

[0020] Explanation of key component markings: Camera module 10, first surface 102, second surface 103, lens 30, substrate 100, welding area 200, image sensor 300, first connecting part 400, second connecting part 401, filling adhesive layer 500, adhesive barrier 600, light-transmitting hole 101, photosensitive area 301, non-photosensitive area 302, welding groove 202, electronic device 20, housing 21.

[0021] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0022] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0023] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also have a component that is centrally located. When a component is considered to be "located" on another component, it can be directly located on the other component or may also have a component that is centrally located.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] Please see Figures 1 to 3This application provides a camera module 10, including a substrate 100, a lens 30, an image sensor 300, and a filler adhesive layer 500. The substrate 100 includes a first surface 102 and a second surface 103 disposed opposite to each other. The substrate 100 has a light-transmitting hole 101 penetrating the first surface 102 and the second surface 103. At least one edge of the light-transmitting hole 101 on the first surface 102 is further provided with a welding area 200 and a retaining wall 600, the retaining wall 600 being located between the welding area 200 and the edge of the light-transmitting hole 101. In some embodiments, the first surface 102 is provided with welding areas 200 and retaining walls 600 opposite to both edges of the light-transmitting hole 101 in a first direction X, each retaining wall 600 being located between the corresponding welding area 200 and the corresponding edge. The first direction may be the length direction of the substrate 100. The retaining wall 600 extends relative to the welding area 200 in a direction away from the second surface 103.

[0026] A lens assembly 30 is mounted on the second surface 103. The lens assembly 30 may include a lens mount and at least one lens element mounted in the lens mount. An image sensor 300 is disposed on the first surface 102. Part of the image sensor 300 corresponds to the lens assembly 30 through a light-transmitting hole 101, and external light can pass through the lens element of the lens assembly 30, then through the light-transmitting hole 101, and be received by the image sensor 300. Another part of the image sensor 300 is mounted on the welding area 200. A filler layer 500 is at least disposed between the image sensor 300 and the welding area 200, and the filler layer 500 is located on the side of the adhesive barrier 600 facing away from the light-transmitting hole 101.

[0027] This application, by setting a sealant barrier 600, effectively prevents filler adhesive from overflowing onto the image sensor 300 during the dispensing process, reducing the obstruction of the light-transmitting hole 101 and the photosensitive area 301 of the image sensor 300 by the filler adhesive, and ensuring the clarity and quality of optical imaging. The pre-reserved soldering area 200 and light-transmitting hole 101 on the substrate 100 make the mounting position of the image sensor 300 more clearly defined, providing higher alignment accuracy during assembly and reducing assembly errors. The filler adhesive layer 500 strengthens the connection between the image sensor 300 and the substrate 100, improving the mechanical stability of the camera module 10 and reducing the risk of connection failure due to thermal expansion and contraction or vibration. By reducing the impact of filler adhesive leakage on the image sensor 300, this design helps improve the yield rate of the production line, reduces the generation of defective products, and thus reduces production costs in the long term. Optionally, the substrate 100 can be a circuit board.

[0028] Please see Figure 3In some embodiments of this application, the surface of the adhesive barrier 600 facing the image sensor 300 is flush with the first surface 102. The image sensor 300 typically consists of multiple photosensitive units responsible for capturing light signals and converting them into electrical signals. In some embodiments, the image sensor 300 can be a CCD sensor or a CMOS sensor. The flushness of the adhesive barrier 600 with the substrate 100 surface prevents the filler adhesive from overflowing during the dispensing process, reducing the risk of adhesive overflow contacting the photosensitive area 301 of the image sensor 300 located at the light-transmitting aperture 101. It also reduces the risk of increased overall thickness of the substrate 100 due to the adhesive barrier 600. By making the adhesive barrier 600 flush with the substrate 100, a more uniform contact surface can be ensured during assembly, contributing to improved connection strength and overall structural stability. If the surface of the adhesive barrier 600 is lower than the first surface 102 of the substrate 100, the adhesive barrier effect will not be good. If the surface of the adhesive barrier 600 is higher than the first surface 102 of the substrate 100, the overall thickness of the substrate 100 may increase, which is not conducive to the miniaturization of the substrate 100.

[0029] In some embodiments of this application, the image sensor 300 includes a photosensitive area 301 and a non-photosensitive area 302 connected together, wherein the non-photosensitive area 302 may be arranged around the photosensitive area 301. The photosensitive area 301 corresponds to the lens component 30 through the light-transmitting hole 101, and the non-photosensitive area 302 is welded to the welding area 200. The photosensitive area 301 is located on the light-transmitting hole 101, effectively ensuring that the image sensor 300 can minimize light loss when receiving light signals, thereby improving image quality. The design of welding the non-photosensitive area 302 to the welding area 200 improves the mechanical strength between the two and enhances the reliability of the electrical connection. Through a clear structural design, the alignment and fixing steps of each part during manufacturing and assembly are simplified, improving production efficiency and also contributing to quality control. The non-photosensitive area 302 is typically constructed using highly conductive materials and may employ processes such as surface gold plating to improve corrosion resistance and durability. The electrical signal captured by the photosensitive area 301 through the non-photosensitive area 302 can be stably and efficiently transmitted to the welding area 200 for subsequent signal processing.

[0030] In some embodiments of this application, the welding area 200 includes a welding groove 202 recessed from the first surface 102 and a first connecting portion 400 disposed within the welding groove 202. At least a portion of the filler adhesive layer 500 is disposed within the welding groove 202, and a second connecting portion 401 is disposed on the non-photosensitive area 302. The first connecting portion 400 and the second connecting portion 401 are welded together. The first connecting portion 400 is disposed within the welding groove 202, and the second connecting portion 401 is disposed on the image sensor 300, providing a stable electrical connection interface for the image sensor 300. The welding groove 202 is located within the welding area 200, allowing the image sensor 300 to be electrically connected to the first connecting portion 400 via the second connecting portion 401, while also reducing the overall thickness of the substrate 100. The welding groove 202 also provides a stable welding environment for the first connecting portion 400 and the second connecting portion 401, enhancing the reliability and consistency of the welding process. This design ensures the strength of the weld and effectively reduces electrical faults caused by poor welding quality. Furthermore, the design of the adhesive barrier 600 effectively guides the filler adhesive into the welding groove 202, preventing overflow and thus affecting the performance of the image sensor 300. Additionally, the welding groove 202 provides a clear positioning for the image sensor 300, facilitating alignment and fixation during assembly, improving assembly accuracy and efficiency. The first connecting part 400 and the second connecting part 401 are welded together, contributing to better electrical signal conduction. Through improved electrical connection and physical support, the performance of the image sensor 300 is guaranteed, thereby improving the imaging quality and working efficiency of the entire camera module 10. The first connecting part 400 can be a solder pad. The second connecting part 401 can be either a solder pad or an electrode.

[0031] Please see Figure 4In some embodiments of this application, a conductive material is provided on the first connecting portion 400, and the second connecting portion 401 is electrically connected to the first connecting portion 400 through the conductive material. The addition of the conductive material can improve the electrical connection strength between the second connecting portion 401 and the first connecting portion 400, ensuring stable signal transmission, reducing contact resistance, and thus improving the sensor's response speed and performance. The type of conductive material can be selected according to different application requirements; for example, it can be solder paste, silver paste, or copper paste, providing flexible design options to adapt to different environmental and operating conditions. With the help of the conductive material, a more robust and reliable electrical connection can be achieved between the first connecting portion 400 and the second connecting portion 401. Through a reliable conductive connection, the image sensor 300 can achieve more accurate signal processing, thereby improving the imaging quality and response speed of the entire camera module 10. A reliable conductive connection enhances the signal processing capability of the image sensor 300. By constructing a robust electrical connection, the image sensor 300 can obtain more accurate signal feedback, ensuring that image quality remains at a high level under various dynamic environments. This is particularly important for devices requiring real-time imaging and fast response. For example, in surveillance cameras, smartphones, and autonomous driving systems, fast and accurate image processing capabilities directly impact their performance. By optimizing the application of conductive materials, these devices can perform even better in real-world scenarios.

[0032] Please see Figure 4 In some embodiments of this application, at least a portion of the second connecting portion 401 is also disposed within the welding groove 202, and the filler adhesive layer 500 at least covers the welding joint of the first connecting portion 400 and the second connecting portion 401. Furthermore, the surface of the filler adhesive layer 500 facing the image sensor 300 is flush with the surface of the adhesive barrier 600 facing the image sensor 300. This flush design of the filler adhesive layer 500 and the adhesive barrier 600 effectively ensures that the filler adhesive does not overflow from the welding groove 202, reducing the impact of the filler adhesive on the image sensor 300 and the light-transmitting aperture 101, and helping to maintain the performance and clarity of the image sensor 300. The filler adhesive layer 500 not only provides support but also strengthens the strength and stability of the welded connection, improves the mechanical durability of the weld joint, and reduces the risk of breakage due to external impact. The filler adhesive typically has a certain thermal conductivity, which helps to achieve more uniform heat distribution in the welding area 200, avoids localized overheating, and helps to extend the service life of the image sensor 300. The filler layer 500 can also improve the sealing of the welding area 200, preventing potential external contaminants such as moisture and dust from entering, thereby ensuring the long-term stable operation of the image sensor 300.

[0033] Please see Figure 3In some embodiments of this application, the first surface 102 is provided with welding areas 200 and adhesive-resistant walls 600 on both opposite edges of the light-transmitting hole 101 along the first direction X. The two adhesive-resistant walls 600 are located on both sides of the light-transmitting hole 101 along the first direction X, which is the lengthwise arrangement direction of the substrate 100. The distance between the outer edges of the two adhesive-resistant walls 600 along the first direction X is greater than the width of the image sensor 300. The width A1 of the welding area 200 is greater than the width A2 of the image sensor 300. This allows the image sensor 300 to be mounted on the welding area 200, which provides a simpler support structure for the image sensor 300. The wider welding area 200 improves heat dissipation performance, reduces heat accumulation at the welding points and the image sensor 300, helps maintain the operating temperature within a safe range, and improves the stability and lifespan of the camera module 10. The increased width of the welding area 200 helps reduce heat accumulation between the welding points and the image sensor 300. When the solder joint is directly adjacent to the image sensor 300 and the solder area 200 is narrow, the sensor may heat up rapidly due to direct contact, even without rust. A wide solder area 200 effectively blocks heat flow, reducing the direct heat absorbed by the image sensor 300 and keeping it within a more ideal temperature range during operation. This is especially important under prolonged high-load operation. By reducing heat accumulation, performance degradation due to overheating can be prevented, ensuring the stability of image output.

[0034] Please see Figure 3 and Figure 4 In some embodiments of this application, the width B of the adhesive barrier 600 is 0.1 mm to 0.2 mm. This ensures that during the bonding process, the adhesive is applied only within a predetermined area and does not spread to unnecessary areas. This process is particularly critical for the assembly of electronic components. With the miniaturization and increased functional integration of electronic devices, the gaps between components are becoming increasingly narrow, thus requiring more precise control. If the width of the adhesive barrier 600 is too large, the adhesive may not be accurately positioned, affecting production efficiency and product quality; if it is too small, it may not effectively block the spread of the adhesive, causing unnecessary waste and potential component damage. Therefore, choosing a width range of 0.1 mm to 0.2 mm provides sufficient blocking effect while also taking into account the space constraints of micro-components. While an excessively wide adhesive barrier 600 can improve its physical strength, it may also increase the cost and weight of the material itself, affecting the lightweight design of the overall structure; while an excessively narrow adhesive barrier 600 may lead to structural instability under pressure and temperature changes. Therefore, meticulous calculations and experiments are required in material selection and width design to ensure that it meets various mechanical properties and environmental adaptability requirements in practical applications.

[0035] Please see Figure 3In some embodiments of this application, the width C of the solder groove 202 is 0.01 mm to 0.05 mm. Many modern electronic devices use adhesives that are high-viscosity fluids during manufacturing. Improper spacing between the adhesive and the substrate can not only affect coating efficiency but also lead to air bubble retention, which may cause a decrease in thermal conductivity or abnormal electrical performance in microelectronic devices. Therefore, precisely controlling the width of the solder groove 202 can effectively reduce the surface tension changes of the adhesive during the coating process, thereby ensuring uniform coating of the adhesive on the substrate 100.

[0036] Please see Figure 5 This application provides an electronic device 20, including a housing 21. The electronic device 20 also includes the aforementioned camera module 10, which is installed within the housing 21. The camera module 10 has various applications, ranging from mobile phones and tablets to portable devices such as digital cameras. Through reasonable spatial layout and circuit design, the camera module 10 can be compactly placed within the housing 21, reducing space occupation while ensuring heat dissipation and signal transmission stability, thereby achieving high performance and a user-friendly experience. By setting a baffle wall 600, the camera module 10 effectively improves the situation where bottom filler glue overflows into the photosensitive area 301 of the image sensor 300 located on the light-transmitting hole 101 during the dispensing process, ensuring that the development effect is not affected. By setting a baffle wall 600 in the soldering area 200, the position and amount of filler glue can be better controlled, thereby improving the packaging accuracy of the entire camera module 10 and ensuring reliable connection between components. As the image sensor 300 gradually becomes smaller, this design can adapt to more complex assembly conditions and meet the needs of modern electronic products for miniaturization and high performance. It can also effectively reduce the failure rate caused by filler glue overflow, thereby reducing the time and cost of reprocessing and testing, and improving production efficiency.

[0037] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and substance of the technical solutions of this application.

Claims

1. A camera module, characterized in that, include: A substrate includes a first surface and a second surface disposed opposite to each other. The substrate has a light-transmitting hole penetrating the first surface and the second surface. The first surface is further provided with a soldering area and a retaining wall at at least one edge of the light-transmitting hole. The retaining wall is located between the edge of the soldering area and the edge of the light-transmitting hole. The retaining wall extends in a direction away from the second surface relative to the soldering area. A lens assembly, said lens assembly being mounted on the second surface; An image sensor is disposed on the first surface, a portion of the image sensor corresponds to the lens component through the light-transmitting hole, and a portion of the image sensor is mounted in the welding area; as well as A filler adhesive layer is disposed at least between the image sensor and the welding area, and the filler adhesive layer is located on the side of the adhesive barrier away from the light-transmitting hole.

2. The camera module according to claim 1, characterized in that, The surface of the adhesive barrier facing the image sensor is flush with the first surface.

3. The camera module according to claim 1, characterized in that, The image sensor includes a photosensitive area and a non-photosensitive area connected together. The photosensitive area corresponds to the lens component through the light-transmitting hole, and the non-photosensitive area is welded to the welding area.

4. The camera module according to claim 3, characterized in that, The welding area includes a welding groove formed by the first surface depression and a first connecting part disposed in the welding groove. At least a portion of the filler adhesive layer is disposed in the welding groove. A second connecting part is provided on the non-photosensitive area. The first connecting part is welded to the second connecting part.

5. The camera module according to claim 4, characterized in that, The first connecting part is provided with a conductive material, and the second connecting part is electrically connected to the first connecting part through the conductive material.

6. The camera module according to claim 4, characterized in that, At least a portion of the second connection portion is disposed within the welding groove.

7. The camera module according to claim 4, characterized in that, Along the arrangement direction of the adhesive barrier and the welding area on the same side of the edge of the light-transmitting hole, the width of the welding groove is 0.01 mm to 0.05 mm.

8. The camera module according to claim 1, characterized in that, Along the arrangement direction of the adhesive barrier and the welding area on the same side of the edge of the light-transmitting hole, the width of the adhesive barrier is 0.1 mm to 0.2 mm.

9. The camera module according to claim 1, characterized in that, The first surface has the welding area and the adhesive barrier on both opposite edges of the light-transmitting hole in the first direction. The two adhesive barriers are located on both sides of the light-transmitting hole along the first direction, which is the length arrangement direction of the substrate. Along the first direction, the distance between the outer edges of the two adhesive barriers is greater than the width of the image sensor.

10. An electronic device, comprising a housing, characterized in that, The electronic device further includes a camera module as described in any one of claims 1-9, the camera module being installed within the housing.

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