Flip chip mounting apparatus

Abstract

The application provides a chip flip mounting device and relates to the field of chip mounting. The chip flip mounting device comprises a support, a first lifting module, a turnover structure, a rotating arm, a mounting plate, a suction assembly and a turnover motor. The first lifting module is installed on the support. The turnover structure comprises the rotating arm, the mounting plate, the suction assembly and the turnover motor. The turnover motor is connected with the output end of the first lifting module through the mounting plate. The rotating arm is sleeved and fixed on the rotating shaft of the output end of the turnover motor. Suction holes are arranged at both ends of the rotating arm. The chip flip mounting device provided by the application sucks the chip at one end of the rotating arm. After the posture of the chip is adjusted by driving the rotating arm to turn over by the turnover motor, the rotating arm does not need to be rotated again. The chip can be sucked again by the suction head below the rotating arm, so that the frequency of rotating the rotating arm by the turnover motor is reduced, the operation is simplified, and the efficiency of sucking and turning over the chip is improved.

Description

Technical Field

[0001] This invention relates to the field of chip mounting, and more particularly to a chip flip mounting apparatus. Background Technology

[0002] In the flip-chip packaging process for semiconductor chips, the following steps need to be completed: wafer chip picking, orientation flipping, alignment and transfer, and thermosetting bonding. Among them, the chip's initial bumps (external pins) are picked up by a flip-picking robotic arm, which then flips the chip 180 degrees so that the back of the chip is facing up and the bumps are facing down. The mounting head then picks up the back of the chip, moves the module, and drives the mounting head to move to the corresponding substrate or PCB board, aligning the chip's bumps with the solder points on the substrate or PCB board, and then performing mounting and soldering.

[0003] In existing technologies, most chip flipping robotic arms adopt a single-end adsorption structure, relying on a single-sided suction head to complete chip picking and 180° flipping operations. A single flipping action can only complete the transfer of a single chip, resulting in low chip picking efficiency. At the same time, the air circuits of existing flipping robotic arms mostly adopt an external hose layout scheme. During the reciprocating 180° flipping motion of the robotic arm, the external hose is prone to repeated twisting and pulling, which can easily lead to problems such as aging, air leakage, loosening, or even breakage of the hoses over long-term operation.

[0004] Furthermore, each set of adsorption structures requires a set of vacuum pump negative pressure pipelines, nitrogen vacuum breaking pipelines, etc., making the pipelines complex. When multiple sets of adsorption structures are set up, there is still room for optimization in how to simplify the pipelines and improve the stability of pipeline use.

[0005] Therefore, it is necessary to provide a chip flip-chip mounting apparatus to solve the above-mentioned technical problems. Summary of the Invention

[0006] This invention provides a chip flip mounting device, which solves the problem that existing chip flipping robotic arms mostly use a single-end adsorption structure, and can only complete the transfer of a single chip in a single flipping action, resulting in low efficiency in picking up flipped chips.

[0007] To solve the above-mentioned technical problems, the present invention provides a chip flip-chip mounting apparatus, comprising: a support;

[0008] A first lifting module is mounted on the bracket;

[0009] The flipping structure includes a rotating arm, a mounting plate, an adsorption assembly, and a flipping motor. The flipping motor is connected to the output end of the first lifting module through the mounting plate. The rotating arm is sleeved and fixed on the rotating shaft at the output end of the flipping motor. Both ends of the rotating arm are provided with suction holes.

[0010] The adsorption assembly includes a rotary joint, a gas supply pipe, two connecting pipes, two valves, and two suction heads. One end of each of the two connecting pipes is connected to both sides of the rotating shaft and communicates with the gas supply pipe. The other end of each of the two connecting pipes is connected to the two suction heads, and each of the two suction heads communicates with two suction holes. The two valves are correspondingly installed on the two connecting pipes. One end of the gas supply pipe is connected to the rotating shaft through the rotary joint, and the other end is connected to the output end of the air pressure control module.

[0011] A transverse movement module, which is suspended above the support platform;

[0012] A lifting device, wherein the lifting device is installed at the output end of the transverse module;

[0013] A placement head is installed at the output end of the lifting device.

[0014] Preferably, positioning rods are installed at both ends of the rotating arm, and a positioning tube is installed at the bottom of the mounting head; when the positioning rod is inserted into the positioning tube, the suction hole at the bottom of the mounting head is aligned with the corresponding suction hole on the rotating arm.

[0015] Preferably, the mounting plate is slidably mounted on the bracket, and the output end of the first lifting module is connected to the mounting plate via a connecting arm.

[0016] Preferably, the lifting device includes a second lifting module and a voice coil lifting module. The second lifting module is installed at the output end of the transverse module. A mounting base is installed at the output end of the second lifting module. The voice coil lifting module is installed on the mounting base, and the mounting head is installed at the output end of the voice coil lifting module.

[0017] Preferably, the second lifting module includes a lifting motor, a mounting box, a lead screw, a nut, and a connecting plate. The mounting box is installed at the output end of the transverse module. The lead screw is rotatably installed inside the mounting box and connected to the drive shaft of the lifting motor. The nut is threaded onto the lead screw and slidably connected to the mounting box. The connecting plate connects the nut and the mounting base.

[0018] Preferably, the support platform includes a longitudinal movement module, a support frame, and a carrier plate. The carrier plate is slidably mounted on the support frame, the longitudinal movement module is mounted on the support frame, and the carrier plate is connected to the output end of the longitudinal movement module.

[0019] Preferably, the longitudinal movement module includes a drive device, a second mounting box, a second lead screw, a second nut, and a connecting frame. The second mounting box is mounted on the support frame, the second lead screw is rotatably mounted inside the second mounting box, the drive device is used to drive the second lead screw to rotate, the second nut is threadedly connected to the second lead screw and slidably connected to the second mounting box, and the connecting frame connects the carrier plate and the second nut.

[0020] Preferably, the driving device is a driven bevel gear, which is mounted on one end of the lead screw and located outside the mounting box.

[0021] The second lifting module also includes a main bevel gear, a support arm, and a transmission rod. The lead screw is separate from the drive shaft. The top end of the transmission rod passes through the lead screw and is inserted into the drive shaft. The transmission rod has a square part one and a square part two spaced apart. The square part one forms an axial sliding and circumferential limiting fit with the drive shaft. The top of the lead screw one has a square cavity adapted to the square part two, and the bottom end has a cylindrical cavity. The square part two is located in the square cavity. The diameter of the cylindrical cavity is larger than the diameter of the square part two. The main bevel gear is installed at the bottom end of the lead screw one.

[0022] One end of the support arm is connected to the transmission rod via a bearing, and the other end of the support arm is connected to the mounting head via a drive arm;

[0023] When the mounting head is aligned with a substrate located on the outermost side of the carrier plate, the main bevel gear is aligned with the driven bevel gear.

[0024] Preferably, the other end of the support arm has an assembly hole, one end of the drive arm is fixed to the mounting head, and the other end passes through the assembly hole, with the assembly hole and the drive arm having a clearance fit.

[0025] Preferably, the chip flip mounting device further includes a positioning structure, which includes a U-shaped rod, an elastic element, and a pressure ring. The upper end of the U-shaped rod passes through the mounting box two and faces the mounting head. The lower end of the U-shaped rod passes through the side wall of the mounting box two and is inserted into the lead screw two. A connecting block is installed inside the mounting box two. The connecting block is sleeved on the upper end of the U-shaped rod. The pressure ring is fixed to the upper end of the U-shaped rod. The elastic element is sleeved on the upper end of the U-shaped rod and is located between the connecting block and the pressure ring.

[0026] Compared with related technologies, the chip flip-chip mounting apparatus provided by the present invention has the following advantages:

[0027] This invention provides a chip flip mounting device. The chip is adsorbed at one end of a rotating arm. After the rotating arm is flipped and the chip's orientation adjusted by a flip motor, it does not need to rotate back. The chip can then be re-adsorbed using the suction head below the rotating arm. This reduces the frequency of the rotating arm's rotation driven by the flip motor, simplifies operation, reduces wear on the rotating shaft, and improves the efficiency of chip adsorption and flipping. Furthermore, the air supply pipe is connected to the rotating shaft via a rotary joint, allowing two suction heads to share a single air pressure control module, reducing the need for other control modules and simplifying the equipment structure. The air supply pipe does not need to rotate with the rotating shaft; instead, the two connecting pipes rotate with the shaft while remaining relatively stationary. This prevents the tubing from twisting or being pulled during the rotation of the rotating arm, thus extending the tubing's lifespan. Attached Figure Description

[0028] Figure 1 A schematic diagram of the structure of a first embodiment of the chip flip-chip mounting apparatus provided by the present invention;

[0029] Figure 2 for Figure 1 The diagram shows the structure of the flip structure.

[0030] Figure 3 for Figure 1 A partial cross-sectional view of the flipped structure shown;

[0031] Figure 4 for Figure 1 The diagram shows the structure of the second lifting module.

[0032] Figure 5 for Figure 1 A partial sectional view of the support platform shown;

[0033] Figure 6 A schematic diagram of the second embodiment of the chip flip-chip mounting apparatus provided by the present invention;

[0034] Figure 7 for Figure 6 The diagram shows the structure of the second lifting module.

[0035] Figure 8 for Figure 6 A partial sectional view of the support platform shown;

[0036] Figure 9 This invention provides a schematic diagram of the assembly state of the main bevel gear and the driven bevel gear, wherein... Figure 9 (a) is a schematic diagram showing the main bevel gear suspended above the driven bevel gear. Figure 9 (b) is a schematic diagram of the meshing of the master bevel gear and the driven bevel gear;

[0037] Figure 10This is a schematic diagram showing the state of the substrate provided by the present invention assembled on the carrier plate.

[0038] Numbering on the map:

[0039] 1. Bracket;

[0040] 2. First lifting module; 21. Connecting arm;

[0041] 3. Flipping structure; 31. Rotating arm; 32. Mounting plate; 33. Adsorption assembly; 34. Flipping motor; 301. Suction hole; 311. Positioning rod; 341. Rotating shaft;

[0042] 331. Rotary joint; 332. Gas delivery pipe; 333. Connecting pipe; 334. Valve; 335. Suction head;

[0043] 4. Lateral movement module;

[0044] 5. Second lifting module; 51. Lifting motor; 52. Mounting box one; 53. Lead screw one; 54. Nut one; 55. Connecting plate; 511. Drive shaft;

[0045] 6. Voice coil lifting module; 601. Mounting bracket;

[0046] 7. Placement head; 71. Vacuum adsorption equipment; 72. Positioning tube; 73. Moving arm;

[0047] 8. Support platform; 81. Longitudinal movement module; 82. Support frame; 83. Carrier plate;

[0048] 811. Drive unit; 812. Mounting box II; 813. Lead screw II; 814. Nut II; 815. Connecting bracket; 816. Connecting block;

[0049] 9. Positioning structure; 91. U-shaped rod; 92. Elastic element; 93. Pressure ring;

[0050] 10. Substrate;

[0051] 56. Main bevel gear; 57. Support arm; 58. Transmission rod; 531. Cylindrical cavity; 581. Square part one; 582. Square part two; 571. Bearing; 572. Assembly hole. Detailed Implementation

[0052] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0053] This invention provides a chip flip-chip mounting apparatus.

[0054] First embodiment;

[0055] Please refer to the following: Figures 1 to 3 In one embodiment of the present invention, the chip flip mounting device includes: a support 1;

[0056] The first lifting module 2 is mounted on the bracket 1;

[0057] The flipping structure 3 includes a rotating arm 31, a mounting plate 32, an adsorption component 33, and a flipping motor 34. The flipping motor 34 is connected to the output end of the first lifting module 2 through the mounting plate 32. The rotating arm 31 is sleeved and fixed on the rotating shaft 341 at the output end of the flipping motor 34. Both ends of the rotating arm 31 are provided with suction holes 301.

[0058] The adsorption assembly 33 includes a rotary joint 331, an air supply pipe 332, two connecting pipes 333, two valves 334, and two suction heads 335. One end of each of the two connecting pipes 333 is connected to both sides of the rotating shaft 341 and communicates with the air supply pipe 332. The other end of each of the two connecting pipes 333 is connected to the two suction heads 335. Each of the two suction heads 335 communicates with two suction holes 301. The two valves 334 are correspondingly installed on the two connecting pipes 333. One end of the air supply pipe 332 is connected to the rotating shaft 341 through the rotary joint 331, and the other end is connected to the output end of the air pressure control module.

[0059] The transverse shift module 4 is suspended above the support platform 8;

[0060] A lifting device is installed at the output end of the transverse module 4;

[0061] Placement head 7 is installed at the output end of the lifting device.

[0062] In this invention, the gas pressure control module includes a vacuum pump negative pressure pipeline, a nitrogen vacuum breaking pipeline, and a three-way connector. The other end of the gas delivery pipe 332 is connected to the vacuum pump negative pressure pipeline and the nitrogen vacuum breaking pipeline via the three-way connector. When adsorbing the chip, the valve on the vacuum pump negative pressure pipeline is opened, and the vacuum pump sequentially extracts the gas from the gas delivery pipe 332, connecting pipe 333, and suction head 335, thereby generating negative pressure to adsorb the chip. However, when it is necessary to release the chip, the solenoid valve and throttle valve on the nitrogen vacuum breaking pipeline are opened, and a certain amount of nitrogen is introduced into the gas delivery pipe 332 to balance the negative pressure and release the chip. For example, Figure 3 One end of the rotating shaft 341 has a hollow structure at its center, which is connected to two connecting pipes 333 and communicates with the hollow structure.

[0063] The flip structure 3 is suspended on the chip placement stage. The placement surface of the stage is movable along the X-axis and Y-axis, so that the position of the chip can be adjusted so that the chip to be mounted can be aligned with the pick-up head 335 of the flip structure 3 in sequence.

[0064] During operation, when a chip is placed under the suction head 335 of the flip structure 3, the lower valve 334 opens, and the first lifting module 2 lowers the flip structure 3, causing the suction hole 301 at the bottom of the rotating arm 31 to align with the corresponding chip. At this time, the air pressure control module creates a negative pressure inside the suction head 335 to adsorb the chip. Then, the first lifting module 2 raises the flip structure 3, which lifts the chip. The flip motor 34 flips the rotating arm 31, moving the chip to the top. At this time, the chip bump (external pin) is located at the bottom. Then, the horizontal movement module 4 moves the lifting device to move the mounting head 7 above the rotating arm 31, aligning the suction hole of the mounting head 7 with the suction hole 301. The lifting device lowers the mounting head 7, and the suction hole of the mounting head 7 aligns with the back of the chip (the side away from the bump). Then, the upper valve 334 is opened, and the lower valve 334 is closed. The air pressure control module sends in nitrogen to balance the negative pressure and release the chip. Then, the mounting head 7 adsorbs the chip.

[0065] Subsequently, the horizontal moving module 4, in conjunction with the lifting device, drives the mounting head 7 to move to the corresponding position of the substrate 10 on the support platform 8, and completes the mounting work with the substrate 10. After the mounting head 7 adsorbs the chip, the upper valve 334 is closed, and the lower valve 334 is opened at the same time. The first lifting module 2 lowers the rotating arm 31, and the suction hole 301 at the bottom of the rotating arm 31 adheres to the chip on the chip support platform and then adsorbs it. The subsequent operation is the same.

[0066] Thus, after the chip is adsorbed at one end of the rotating arm 31 and the rotating arm 31 is flipped by the flipping motor 34 to adjust the chip's posture, it does not need to be rotated back. The chip can then be adsorbed again using the suction head 335 below the rotating arm 31. This reduces the frequency of the rotating arm 31 being rotated by the flipping motor 34, simplifies operation, reduces wear on the rotating shaft 341, and improves the efficiency of chip adsorption and flipping. Furthermore, the air supply pipe 332 is connected to the rotating shaft 341 through the rotary joint 331, allowing the two suction heads 335 to share a single air pressure control module, reducing the use of other control modules and simplifying the equipment structure. Also, the air supply pipe 332 does not need to rotate with the rotating shaft 341, while the two connecting pipes 333 rotate with the rotating shaft 341, remaining relatively stationary. This means that the pipeline will not be twisted or pulled when the rotating arm 31 rotates, thus improving the service life of the pipeline.

[0067] The rotating arm 31 is driven by the flip motor 34 to reciprocate 180 degrees. The flip motor 34 includes a servo motor and a reducer. The output shaft of the servo motor is connected to the input end of the reducer, and the rotating shaft 341 is connected to the output end of the reducer.

[0068] The first lifting module 2 preferably adopts a servo motor and ball screw structure, or a cylinder, hydraulic cylinder or electric push cylinder.

[0069] Among them, conduits are connected to both the upper and lower sides of the rotating arm 31 and the rotating shaft 341. The power lines of the two valves 334 extend through the conduits, and the length of the power lines is redundantly designed to meet the distance requirements of the reciprocating rotation of the rotating arm 31.

[0070] Preferably, rectangular grooves are provided at both ends of the rotating arm 31 corresponding to the suction holes 301. The size of the rectangular grooves is adapted to the size of the chip. During adsorption, the chip enters the rectangular grooves, thereby allowing for better adsorption of the chip.

[0071] In this invention, the chip flip-chip mounting apparatus further includes multiple positioning cameras and an image computing module. The positioning cameras are mounted on the support 1 via an assembly rack, located above the chip carrier stage 8 and the rotating arm 31, and also mounted on the housing of the transverse module 4 and / or the housing of the lifting device. The positioning cameras can capture the position of the chip on the chip carrier stage, and the image computing module calculates the alignment of the actual chip position with the suction head 335 at the bottom of the rotating arm 31. When there is an error, the chip carrier stage is used to precisely adjust the chip position. Subsequently, when the mounting head 7 moves the chip to the substrate 10, the positioning cameras and image computing module capture the positions of the chip and the substrate 10 to determine if they correspond, and then make corresponding adjustments. A supplementary light is also provided at the position corresponding to the positioning camera.

[0072] The mounting head 7 is equipped with a vacuum adsorption device 71 and a heating device. The vacuum adsorption device includes a pressure control module, a negative pressure pipeline, and a suction nozzle. The suction nozzle is installed inside the mounting head 7 and is aligned and connected with the adsorption hole at the bottom of the mounting head 7. The negative pressure pipeline connects the suction nozzle and the pressure control module. The specific composition of the pressure control module is the same as described above.

[0073] The placement head 7 integrates a ceramic heating rod / thin-film PI heating element, with an outer insulation layer to prevent heat leakage. The nozzle is made of high thermal conductivity ceramic material, which vacuum-adsorbs the back of the chip during use, directly transferring heat to the chip body and bottom bumps. A built-in thermocouple provides real-time temperature measurement, employing pulse heating: rapid heating during bonding and rapid cooling after holding, with a heating rate reaching tens of degrees Celsius per second.

[0074] After the working logic chip is flipped and aligned, the lifting device presses down the mounting head 7 to bring the chip into contact with the substrate 10. The heating head instantly heats up to the process temperature (200~400℃), and the heat is transferred downwards to melt the bumps, completing the soldering and mounting with the substrate 10. In this process, only a single chip is heated, resulting in localized heating and a very small heat-affected zone, which will not cause the entire substrate 10 to warp. The temperature control accuracy is ±1~2℃.

[0075] Please see Figure 1 and Figure 2 In this example, positioning rods 311 are installed at both ends of the rotating arm 31, and positioning tubes 72 are installed at the bottom of the mounting head 7. When the positioning rods 311 are inserted into the positioning tubes 72, the suction holes at the bottom of the mounting head 7 are aligned with the corresponding suction holes 301 on the rotating arm 31.

[0076] By setting up the positioning rod 311 and the positioning tube 72, when the mounting head 7 is attached to the back of the chip adsorbed by the rotating arm 31, the positioning tube 72 is sleeved on the positioning rod 311. With the guidance and positioning of the positioning tube 72 and the positioning rod 311, the mounting head 7 can be stably aligned and attached to the rotating arm 31, so that the chip can be more stably adsorbed by the mounting head 7.

[0077] Please see Figure 2 In a preferred embodiment, multiple positioning rods 311 and positioning tubes 72 are provided. Multiple positioning rods 311 are arranged around the suction hole 301, and multiple positioning tubes 72 are arranged around the suction hole at the bottom of the mounting head 7.

[0078] By setting multiple positioning rods 311 and positioning tubes 72, the stability of the guiding and positioning is further improved.

[0079] Please see Figure 2 In this embodiment, the mounting plate 32 is slidably mounted on the bracket 1, and the output end of the first lifting module 2 is connected to the mounting plate 32 through the connecting arm 21.

[0080] Slide rails are symmetrically installed on the bracket 1, and sliding sleeves are symmetrically arranged on the mounting plate 32. The sliding sleeves slide into the slide rails to form a sliding connection. Through the sliding connection, the stability of the first lifting module 2 driving the mounting plate 32 to lift is improved.

[0081] The flip motor 34 is mounted on the mounting plate 32.

[0082] Please see Figure 1As an optional solution in this example, the lifting device includes a second lifting module 5 and a voice coil lifting module 6. The second lifting module 5 is installed at the output end of the transverse module 4. A mounting base 601 is installed at the output end of the second lifting module 5. The voice coil lifting module 6 is installed on the mounting base 601. The mounting head 7 is installed at the output end of the voice coil lifting module 6.

[0083] In this embodiment, the voice coil lifting module 6 uses a voice coil motor as the lifting drive.

[0084] By configuring the lifting device as a second lifting module 5 and a voice coil lifting module 6, two-stage lifting is used. The second lifting module 5 quickly descends a certain height, bringing the chip adsorbed at the bottom of the placement head 7 close to the substrate 10. Then, the voice coil lifting module 6 lowers the placement head 7 to place the chip onto the substrate 10. This separates the long-distance coarse transfer and micro-stroke precision pressing functions. The second lifting module 5 undertakes the large-stroke transfer, while the voice coil lifting module 6 uses direct drive, backlash-free, high-speed response, and closed-loop flexible pressure control characteristics to complete the thermo-pressing bonding. The combination of the two not only improves the overall production cycle of the equipment but also achieves high-precision uniform pressing of micro-bumps, reducing chip breakage and solder joint misalignment defects. At the same time, it reduces the load heat of the voice coil motor and extends the service life of core components, making it suitable for automated continuous packaging production of multi-specification chips.

[0085] As an alternative solution in this example, the lifting device can also achieve the lifting and mounting function using only a servo motor and a lead screw structure.

[0086] Please see Figure 4 As an optional embodiment, the second lifting module 5 includes a lifting motor 51, a mounting box 52, a lead screw 53, a nut 54, and a connecting plate 55. The mounting box 52 is installed at the output end of the transverse module 4. The lead screw 53 is rotatably installed in the mounting box 52 and connected to the drive shaft 511 of the lifting motor 51. The nut 54 is threaded onto the lead screw 53 and slidably connected to the mounting box 52. The connecting plate 55 connects the nut 54 and the mounting base 601.

[0087] During lifting, the lifting motor 51 drives the lead screw 53 to rotate clockwise or counterclockwise, thereby driving the nut 54 to slide up or down along the mounting box 52. The nut 54 drives the mounting base 601 to move through the connecting plate 55. The mounting base 601 drives the mounting head 7 to lift and lower through the voice coil lifting module 6, realizing the lifting function of the mounting head 7.

[0088] The lead screw 53 and nut 54 are preferably ball screw structures, and the lifting motor 51 is a servo motor.

[0089] Among them, the mounting box 52 has a strip hole, one end of the connecting plate 55 is installed on the nut 54, and the other end passes through the strip hole and is connected to the mounting base 601;

[0090] The mounting box 52 has multiple sliding grooves inside, and the nut 54 has multiple sliders installed on its peripheral side. The sliders slide into the sliding grooves to achieve sliding assembly, and the sliders are equipped with multiple balls to make the movement smoother.

[0091] The mounting box 52 has two slide rails symmetrically mounted on its exterior, and a corresponding sliding sleeve is mounted on the mounting base 601. The sliding sleeve slides into the slide rail to form a sliding assembly.

[0092] As another optional approach in this embodiment, the second lifting module 5 can also be a pneumatic cylinder, a hydraulic cylinder, or an electric push cylinder, etc.

[0093] Please see Figure 1 and Figure 5 In this embodiment, the support platform 8 includes a longitudinal movement module 81, a support frame 82, and a carrier plate 83. The carrier plate 83 is slidably mounted on the support frame 82, the longitudinal movement module 81 is mounted on the support frame 82, and the carrier plate 83 is connected to the output end of the longitudinal movement module 81.

[0094] In use, the frame holding the substrate 10 is assembled onto the carrier plate 83, such as... Figure 10 The longitudinal translation module 81 drives the carrier plate 83 to move along the direction set by the support frame 82, thereby adjusting the position of the substrate 10.

[0095] In this configuration, the longitudinal movement module 81 drives the carrier plate 83 to move in the direction of the support frame 82, which is perpendicular to the opposite direction of the movement of the transverse movement module 4 driving the lifting device; and as... Figure 10 The substrates 10 are arranged in a row. The vertical moving module 81 is used to adjust the position of a row of substrates 10 to align with the mounting head 7, and the horizontal moving module 4 adjusts the mounting head 7 to align with each chip in sequence.

[0096] In this embodiment, the horizontal axis is defined as the X-axis and the vertical axis as the Y-axis. Alternatively, X-axis and Z-axis movement modules can also be provided. These can be used to further adjust the substrate 10 on the carrier board 83, allowing for more precise alignment between the substrate 10 and the chip. Correspondingly, a Y-axis movement module can also be provided to further adjust the position of the mounting head 7. This Y-axis movement module can be located between the horizontal movement module 4 and the second lifting module 5, or between the second lifting module 5 and the voice coil lifting module 6.

[0097] Preferably, a heating module is provided in the carrier board 83 to preheat the substrate 10, thereby facilitating the subsequent soldering and mounting of the substrate 10 and the chip.

[0098] In this embodiment, positioning shafts are symmetrically arranged at both ends of the carrier plate 83. Positioning holes are correspondingly provided at the bottom of the frame supporting the substrate 10, allowing for rapid assembly by inserting the positioning shafts into the positioning holes. The assembly of the frame carrying the substrate 10 and the carrier plate 83 can be performed using a robotic arm.

[0099] In this embodiment, the transverse module 4 preferably adopts a servo motor and ball screw structure; one end of the outer shell of the transverse module 4 is installed on the top of the bracket 1, and the other end is installed on the support frame 82 through the support plate.

[0100] The transverse module 4 can also be a belt conveyor, chain conveyor, etc.

[0101] Please see Figure 1 and Figure 5 As an optional solution in this embodiment, the longitudinal movement module 81 includes a drive device 811, a second mounting box 812, a second lead screw 813, a second nut 814, and a connecting frame 815. The second mounting box 812 is mounted on the support frame 82, the second lead screw 813 is rotatably mounted inside the second mounting box 812, the drive device 811 is used to drive the second lead screw 813 to rotate, the second nut 814 is threadedly connected to the second lead screw 813 and slidably connected to the second mounting box 812, and the connecting frame 815 connects the carrier plate 83 and the second nut 814.

[0102] The drive device 811 drives the lead screw 813 to rotate, the lead screw 813 drives the nut 814 to slide along the mounting box 812, and the nut 814 drives the carrier plate 83 to move through the connecting frame 815, thereby realizing the function of switching the position of the substrate 10.

[0103] The mounting box 2 812 has symmetrically installed sliding rods inside, and the nuts 2 814 have symmetrically arranged sliders on both sides. The sliders are fitted onto the sliding rods to form a sliding assembly.

[0104] The support frame 82 includes two main beams and support legs. The support legs support and connect the two main beams. Slide rails are installed on opposite sides of the two main beams. The bottom of the carrier plate 83 is provided with pulleys that slide into the slide rails to form a sliding connection. In this embodiment, the mounting box 812 is installed on one of the main beams of the support frame 82. The main beam has a hollow structure inside. The inner side and top of the main beam are provided with strip openings. The two ends of the connecting frame 815 pass through the corresponding strip openings and are fixedly connected to the nut 814 and the carrier plate 83 respectively.

[0105] A groove is provided on the side of the main beam near the rotating arm 31, and the air supply pipe 332 is arranged along the groove.

[0106] In this example, the drive device 811 is a servo motor, which is installed at the end of the mounting box 812. The output end of the drive device 811 is fixedly connected to the lead screw 813. The lead screw 53 is fixedly installed to the drive shaft 511.

[0107] Second embodiment;

[0108] Please see Figure 6 and Figure 7 The chip flip mounting device is proposed in a second embodiment based on the first embodiment. The second embodiment of the chip flip mounting device differs from the first embodiment in that the driving device 811 is a driven bevel gear, which is installed at one end of the lead screw 813 and located outside the mounting box 812.

[0109] The second lifting module 5 also includes a main bevel gear 56, a support arm 57, and a transmission rod 58. The lead screw 53 is separately disposed from the drive shaft 511. The top end of the transmission rod 58 passes through the lead screw 53 and is inserted into the interior of the drive shaft 511. The transmission rod 58 is provided with a square part 581 and a square part 582 spaced apart. The square part 581 forms an axial sliding and circumferential limiting fit with the drive shaft 511. The top of the lead screw 53 has a square cavity adapted to the square part 582, and the bottom end has a cylindrical cavity 531. The square part 582 is located in the square cavity. The diameter of the cylindrical cavity 531 is larger than the diameter of the square part 582. The main bevel gear 56 is installed at the bottom end of the lead screw 53.

[0110] One end of the support arm 57 is connected to the transmission rod 58 via a bearing 571, and the other end of the support arm 57 is connected to the mounting head 7 via a drive arm 73;

[0111] When the mounting head 7 is aligned with the outermost substrate 10 on the carrier plate 83, the main bevel gear 56 is aligned with the slave bevel gear.

[0112] Here, the diameter of square part 2 582 refers to the length of the diagonal of the cross section of square part 2 582.

[0113] Please refer to the following: Figure 9 and Figure 10 When mounting the outermost substrate 10 in a row of substrates 10, the traverse module 4 drives the lifting device to move the mounting head 7 to align with the outermost substrate 10, such as... Figure 9In (a), the main bevel gear 56 is suspended above the driven bevel gear (drive device 811). After the second lifting module 5 lowers the mounting head 7 in the first stage, the main bevel gear 56 approaches the driven bevel gear but is not engaged. The mounting head 7 drives the transmission rod 58 to follow the downward movement via the drive arm 73 and support arm 57. When the voice coil lifting module 6 lowers the mounting head 7 to solder the chip onto the substrate 10, as... Figure 9 In section (b), at this time, the main bevel gear 56 meshes with the driven bevel gear (drive device 811), and the square part 1 581 is still located inside the drive shaft 511, while the square part 2 582 enters the cylindrical cavity 531. Thus, when the lifting motor 51 drives the transmission rod 58 to rotate, it will not drive the lead screw 1 53 to rotate, that is, it will not lift the mounting head 7. At the same time, when the lifting motor 51 drives the transmission rod 58 to rotate through the square part 1 581, it can drive the main bevel gear 56 to rotate, thereby driving the driven bevel gear (drive device 811) to rotate, that is, driving the lead screw 2 813 to rotate, thereby realizing the function of driving the carrier plate 83 to move and adjusting the position of the substrate 10.

[0114] After the voice coil lifting module 6 drives the mounting head 7 to move up to the preset height, the square part 582 re-enters the lead screw 53. Thus, when the lifting motor 51 is working, the transmission rod 58 can drive the lead screw 53 to rotate, thereby realizing the lifting function.

[0115] Therefore, the lifting motor 51 has the function of driving the lead screw 53 to rotate and drive the mounting head 7 to lift and lower, and also has the function of driving the longitudinal translation module 81 to move the carrier plate 83 to adjust the substrate 10. Furthermore, it can switch between the two functions during the process of the voice coil lifting module 6 pressing down the mounting head 7 and the substrate 10 for welding and mounting.

[0116] Among them, the lifting motor 51 has a drive screw 53 to rotate and drive the mounting head 7 to lift and lower. Each time the drive screw 53 rotates an integer number of revolutions or an integer number of revolutions plus a quarter revolution, it ensures that the teeth of the main bevel gear 56 are aligned with the tooth grooves of the driven bevel gear each time.

[0117] The drive shaft 511 has a square cavity opening from the bottom upwards. It is fitted onto the square part 581 through the square cavity to form an axial sliding and circumferential limiting fit.

[0118] Similarly, the lead screw 53 has a square cavity with its top facing downwards, and is fitted onto the square part 582.

[0119] Please see Figure 7 In a preferred embodiment, the other end of the support arm 57 is provided with an assembly hole 572, one end of the drive arm 73 is fixed on the mounting head 7, and the other end passes through the assembly hole 572, with the assembly hole 572 and the drive arm 73 in clearance fit.

[0120] By engaging the mounting hole 572 with the drive arm 73, when the main bevel gear 56 meshes with the driven bevel gear (drive device 811), and after the voice coil lifting module 6 lowers the mounting head 7 to complete the soldering and mounting of the chip to the last substrate 10 in the row, the voice coil lifting module 6 can slightly move the mounting head 7 upward to separate it from the chip. At this time, the drive arm 73 is just in contact with the top of the inner wall of the mounting hole 572, and the support arm 57 is not raised. That is, the main bevel gear 56 is still meshing with the driven bevel gear (drive device 811), which enables subsequent adjustment of the position of the substrate 10. When the carrier plate 83 moves the substrate 10, there will be no friction with the mounting head 7, which facilitates the adjustment of the substrate 10.

[0121] Please see Figure 8 and Figure 9 In a preferred embodiment, the flip-chip mounting device further includes a positioning structure 9, which includes a U-shaped rod 91, an elastic element 92, and a pressure ring 93. The upper end of the U-shaped rod 91 passes through the mounting box 812 and faces the mounting head 7. The lower end of the U-shaped rod 91 passes through the side wall of the mounting box 812 and is inserted into the lead screw 813. A connecting block 816 is installed inside the mounting box 812. The connecting block 816 is sleeved on the upper end of the U-shaped rod 91. The pressure ring 93 is fixed to the upper end of the U-shaped rod 91. The elastic element 92 is sleeved on the upper end of the U-shaped rod 91 and is located between the connecting block 816 and the pressure ring 93.

[0122] By setting the positioning structure 9, after the main bevel gear 56 separates from the driven bevel gear (drive device 811), one end of the U-shaped rod 91 is inserted into the lead screw 813, thereby limiting the lead screw 813 in the rotation direction and preventing rotational deviation.

[0123] When mounting a chip on the last substrate 10 in a row, the second lifting module 5 can lower the mounting head 7 a certain distance in advance, so that one side of the mounting head 7 overlaps with one end of the U-shaped rod 91. Subsequently, the horizontal moving module 4 moves the lifting device to align the mounting head 7 with the last chip in the row. At this time, the mounting head 7 pushes one end of the U-shaped rod 91, causing the other end of the U-shaped rod 91 to move out of the lead screw 813 and release the limit. At the same time, the pressure ring 93 compresses the elastic element 92. After the mounting is completed and the substrate 10 is adjusted, the mounting head 7 separates from the U-shaped rod 91. The elastic element 92 pushes the pressure ring 93 to drive the other end of the U-shaped rod 91 to re-insert into the lead screw 813 to achieve the limit.

[0124] One or more limiting holes are made around the lead screw 813, the lower end of the U-shaped rod 91 is inserted into the limiting hole, and the upper end of the U-shaped rod 91 is longer than the lower end, so that the upper end of the U-shaped rod 91 can pass through the mounting box 812.

[0125] The spacing between each row of substrates 10 is set so that the lead screw 813 rotates an integer number of turns or an integer number of turns plus half a turn each time, thereby adjusting the position of the substrate 10. This allows the U-shaped rod 91 to be aligned with the limiting hole again after each adjustment of the position of the substrate 10.

[0126] Among them, the elastic element 92 is an elastic element such as a compression spring or a leaf spring.

[0127] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A chip flip-chip mounting apparatus, characterized in that, include: support; A first lifting module is mounted on the bracket; The flipping structure includes a rotating arm, a mounting plate, an adsorption assembly, and a flipping motor. The flipping motor is connected to the output end of the first lifting module through the mounting plate. The rotating arm is sleeved and fixed on the rotating shaft at the output end of the flipping motor. Both ends of the rotating arm are provided with suction holes. The adsorption assembly includes a rotary joint, a gas supply pipe, two connecting pipes, two valves, and two suction heads. One end of each of the two connecting pipes is connected to both sides of the rotating shaft and communicates with the gas supply pipe. The other end of each of the two connecting pipes is connected to the two suction heads, and each of the two suction heads communicates with two suction holes. The two valves are correspondingly installed on the two connecting pipes. One end of the gas supply pipe is connected to the rotating shaft through the rotary joint, and the other end is connected to the output end of the air pressure control module. A transverse movement module, which is suspended above the support platform; A lifting device, wherein the lifting device is installed at the output end of the transverse module; A placement head is installed at the output end of the lifting device.

2. The chip flip-chip mounting apparatus according to claim 1, characterized in that, Positioning rods are installed at both ends of the rotating arm, and a positioning tube is installed at the bottom of the mounting head; when the positioning rod is inserted into the positioning tube, the suction hole at the bottom of the mounting head is aligned with the corresponding suction hole on the rotating arm.

3. The chip flip-chip mounting apparatus according to claim 1, characterized in that, The mounting plate is slidably mounted on the bracket, and the output end of the first lifting module is connected to the mounting plate via a connecting arm.

4. The chip flip-chip mounting apparatus according to claim 1, characterized in that, The lifting device includes a second lifting module and a voice coil lifting module. The second lifting module is installed at the output end of the transverse module. A mounting base is installed at the output end of the second lifting module. The voice coil lifting module is installed on the mounting base. The mounting head is installed at the output end of the voice coil lifting module.

5. The chip flip-chip mounting apparatus according to claim 4, characterized in that, The second lifting module includes a lifting motor, a mounting box, a lead screw, a nut, and a connecting plate. The mounting box is installed at the output end of the transverse module. The lead screw is rotatably installed inside the mounting box and connected to the drive shaft of the lifting motor. The nut is threaded onto the lead screw and slidably connected to the mounting box. The connecting plate connects the nut and the mounting base.

6. The chip flip-chip mounting apparatus according to claim 5, characterized in that, The support platform includes a longitudinal movement module, a support frame, and a carrier plate. The carrier plate is slidably mounted on the support frame, the longitudinal movement module is mounted on the support frame, and the carrier plate is connected to the output end of the longitudinal movement module.

7. The chip flip-chip mounting apparatus according to claim 6, characterized in that, The longitudinal movement module includes a drive device, a second mounting box, a second lead screw, a second nut, and a connecting frame. The second mounting box is mounted on the support frame. The second lead screw is rotatably mounted inside the second mounting box. The drive device is used to drive the second lead screw to rotate. The second nut is threadedly connected to the second lead screw and slidably connected to the second mounting box. The connecting frame connects the carrier plate and the second nut.

8. The chip flip-chip mounting apparatus according to claim 7, characterized in that, The driving device is a driven bevel gear, which is installed at one end of the lead screw and located outside the mounting box. The second lifting module also includes a main bevel gear, a support arm, and a transmission rod. The lead screw is separate from the drive shaft. The top end of the transmission rod passes through the lead screw and is inserted into the drive shaft. The transmission rod has a square part one and a square part two spaced apart. The square part one forms an axial sliding and circumferential limiting fit with the drive shaft. The top of the lead screw one has a square cavity adapted to the square part two, and the bottom end has a cylindrical cavity. The square part two is located in the square cavity. The diameter of the cylindrical cavity is larger than the diameter of the square part two. The main bevel gear is installed at the bottom end of the lead screw one. One end of the support arm is connected to the transmission rod via a bearing, and the other end of the support arm is connected to the mounting head via a drive arm; When the mounting head is aligned with a substrate located on the outermost side of the carrier plate, the main bevel gear is aligned with the driven bevel gear.

9. The chip flip-chip mounting apparatus according to claim 8, characterized in that, The other end of the support arm is provided with an assembly hole. One end of the drive arm is fixed to the mounting head, and the other end passes through the assembly hole. The assembly hole and the drive arm are in clearance fit.

10. The chip flip-chip mounting apparatus according to claim 8, characterized in that, The chip flip mounting device further includes a positioning structure, which includes a U-shaped rod, an elastic element, and a pressure ring. The upper end of the U-shaped rod passes through the mounting box and faces the mounting head. The lower end of the U-shaped rod passes through the side wall of the mounting box and is inserted into the lead screw. A connecting block is installed inside the mounting box. The connecting block is sleeved on the upper end of the U-shaped rod. The pressure ring is fixed to the upper end of the U-shaped rod. The elastic element is sleeved on the upper end of the U-shaped rod and is located between the connecting block and the pressure ring.

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