Laser light source and laser radar

Abstract

The embodiment of the utility model provides a laser light source and a laser radar. The laser light source comprises a laser chip which comprises a plurality of lasers distributed in an array mode, each laser comprises a first electrode and a second electrode, and at least one of the first electrode and the second electrode is configured to be an independent electrode which is independently controlled; the driving chip is suitable for driving a laser of the laser chip, the driving chip comprises a first driving circuit and a second driving circuit, the first driving circuit and the second driving circuit are electrically connected with a first electrode and a second electrode of the laser respectively, at least one of the first driving circuit and the second driving circuit is configured to be an independently-controlled independent driving circuit, and the first driving circuit and the second driving circuit are electrically connected with the first electrode and the second electrode of the laser respectively. And the independent driving circuit is electrically connected with the independent electrode of each laser. By adopting the scheme, the probability of crosstalk among the plurality of lasers distributed in an array mode can be effectively reduced.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the field of semiconductor laser technology, and in particular to a laser light source and a laser radar. Background Art

[0002] In the development process of LiDAR, compared with discrete lasers, array lasers make the integration of the transmitter of LiDAR higher, reduce the cost of lasers, and make the control method of the transmitter simpler. Therefore, array lasers are widely used in LiDAR.

[0003] However, array lasers are electrically connected together through metal electrodes, which deteriorates the electrical isolation between lasers, leading to crosstalk problems between lasers, which in turn affects the performance of the lidar.

[0004] Therefore, how to reduce the crosstalk between lasers remains to be solved by those skilled in the art. Utility Model Content

[0005] In view of this, the embodiments of the present disclosure provide a laser light source and a laser radar, which can effectively reduce the probability of crosstalk between multiple lasers distributed in an array.

[0006] First, the present disclosure provides a laser light source, including:

[0007] A laser chip, comprising a plurality of lasers distributed in an array, wherein the laser comprises a first electrode and a second electrode, wherein at least one of the first electrode and the second electrode is configured as an independent electrode that is independently controlled;

[0008] A driving chip, suitable for driving the laser of the laser chip, the driving chip comprising: a first driving circuit and a second driving circuit, respectively electrically connected to the first electrode and the second electrode of the laser, wherein at least one of the first driving circuit and the second driving circuit is configured as an independently controlled independent driving circuit, and the independent driving circuits are respectively electrically connected to the independent electrodes of each laser.

[0009] Optionally, each independent electrode of the laser chip is electrically connected to each independent driving circuit of the driving chip through a solder ball.

[0010] Optionally, each independent electrode of the laser chip is led out to the first surface of the laser chip to form a first solder ball; a first solder pad is formed on the first surface of the driver chip to be electrically connected to each independent driving circuit of the driver chip; the first solder ball is connected to the corresponding first solder pad to electrically connect the independent electrode of the laser chip to the independent driving circuit of the driver chip.

[0011] Optionally, the laser chip is provided with a through silicon via, and the independent electrodes of each laser are respectively led out to the second surface of the laser chip through the through silicon via, forming a second solder ball; the first surface of the driver chip is formed with a second solder pad, which is electrically connected to each independent driving circuit of the driver chip; the second solder ball is connected to the corresponding second solder pad, so that the independent electrode of the laser chip is electrically connected to the independent driving circuit of the driver chip.

[0012] Optionally, the independent driving circuit includes a plurality of independently controlled first driving circuits and a plurality of independently controlled second driving circuits, wherein the first driving circuit includes a first switch electrically connected to the first electrodes of the laser respectively; and the second driving circuit includes a second switch electrically connected to the second electrodes of the laser respectively.

[0013] Optionally, the first end of the first switch is coupled to the first electrode of the laser, and the second end of the first switch is coupled to a voltage source; the first end of the second switch is coupled to the second electrode of the laser, and the second end of the second switch is coupled to ground.

[0014] Optionally, one of the first electrode and the second electrode is configured as an independent electrode independently controlled, and the other is configured as a common electrode commonly controlled by multiple lasers; one of the first driving circuit and the second driving circuit is configured as an independent driving circuit independently controlled and electrically connected to the independent electrodes of each laser, and the other is configured as a common driving circuit commonly controlled and electrically connected to the common electrode.

[0015] Optionally, each independent electrode of the laser chip is led out to the second surface of the laser chip to form a third solder ball; the common electrode of the laser chip is led out to the first surface of the laser chip to form a first solder pad; the first surface of the driver chip is formed with a third solder pad, which is electrically connected to each independent driving circuit of the driver chip, and a fourth solder pad is formed, which is electrically connected to the common driving circuit of the driver chip; the third solder ball is connected to the third solder pad, and the first solder pad is connected to the fourth solder pad, so that the independent electrodes of the laser chip are electrically connected to the independent driving circuits of the driver chip, and the common electrode is electrically connected to the common driving circuit.

[0016] Optionally, each independent electrode of the laser chip is led out to the second surface of the laser chip to form a fourth solder ball; the common electrode of the laser chip is led out to the second surface of the laser chip to form a fifth solder ball;

[0017] The first surface of the driver chip is formed with a fifth pad electrically connected to each independent driver circuit of the driver chip, and a sixth pad electrically connected to a common driver circuit of the driver chip;

[0018] The fourth solder ball is connected to the fifth solder pad, and the fifth solder ball is connected to the sixth solder pad, so that the independent electrode of the laser chip is electrically connected to the independent driving circuit of the driving chip, and the common electrode is electrically connected to the common driving circuit.

[0019] Optionally, the independent driving circuit includes a plurality of independently controlled first driving circuits, the first driving circuit includes a first switch electrically connected to first electrodes of a plurality of lasers respectively; the second electrode is configured as a common electrode controlled by a plurality of lasers; the common driving circuit includes a second driving circuit, the second driving circuit includes a second switch electrically connected to the second electrode.

[0020] Optionally, the first end of the first switch is coupled to the first electrode of the laser, and the second end of the first switch is coupled to a voltage source; the first end of the second switch is coupled to the common electrode, and the second end of the second switch is coupled to ground.

[0021] Optionally, the independent driving circuit includes a plurality of independently controlled second driving circuits, the second driving circuits include a second switch electrically connected to the second electrodes of the plurality of lasers respectively; the first electrode is configured as a common electrode controlled by the plurality of lasers; the common driving circuit includes a first driving circuit, the first driving circuit includes a first switch electrically connected to the first electrode.

[0022] Optionally, the first end of the second switch is coupled to the second electrode of the laser, and the second end of the second switch is coupled to the ground; the first end of the first switch is coupled to the common electrode, and the second end of the first switch is coupled to a voltage source.

[0023] Optionally, the laser light source further comprises: a substrate or a printed circuit board; the substrate or the printed circuit board is connected to the driving chip, or,

[0024] They are respectively connected to the driving chip and the laser chip.

[0025] The present disclosure also provides a laser radar, including:

[0026] The laser light source according to any one of the aforementioned embodiments.

[0027] The laser light source provided by the embodiment of the present disclosure includes a laser chip and a driver chip, wherein the laser chip includes a plurality of lasers distributed in an array, the laser includes a first electrode and a second electrode, and the driver chip includes a first driver circuit and a second driver circuit, wherein the first driver circuit and the second driver circuit are electrically connected to the first electrode and the second electrode of the laser, respectively; by configuring at least one electrode of the laser as an independently controlled independent electrode, and configuring at least one driver circuit as an independently controlled independent driver circuit, the independent driver circuits are electrically connected to the independent electrodes of each laser, respectively, thereby effectively reducing the probability of crosstalk between the plurality of lasers distributed in an array.

[0028] Furthermore, since the independent electrodes of the laser chip are electrically connected to the independent driving circuits of the driving chip through solder balls, point-to-point connection can be achieved, thereby ensuring the consistency of electrical connection between different lasers, and further ensuring that the light-emitting performance of different lasers remains consistent.

[0029] Furthermore, by leading each independent electrode of the laser chip to the first surface of the laser chip to form a first solder ball, and forming a first solder pad on the first surface of the driver chip to be electrically connected to each independent driving circuit of the driver chip, and then connecting the first solder ball to the corresponding first solder pad, the independent electrode of the laser chip is electrically connected to the independent driving circuit of the driver chip, which can not only effectively reduce the probability of crosstalk between multiple lasers distributed in an array, but also ensure that the luminous performance of different lasers remains consistent. In addition, the electrical connection method between the independent electrode of the laser chip and the independent driving circuit of the driver chip can reduce the package size and improve the integration.

[0030] Furthermore, since lasers usually have different emission types, through silicon vias can be provided on the laser chip, and the independent electrodes of each laser can be led out to the second surface of the laser chip through the through silicon vias to form second solder balls, and second solder pads can be formed on the first surface of the driver chip to be electrically connected to the independent driving circuits of the driver chip, and then the second solder balls are connected to the corresponding second solder pads to electrically connect the independent electrodes of the laser chip to the independent driving circuits of the driver chip, which can not only effectively reduce the probability of crosstalk between multiple lasers distributed in an array, but also ensure that the light-emitting performance of different lasers remains consistent.

[0031] Furthermore, the independent driving circuit may include a plurality of independently controlled first driving circuits and a plurality of independently controlled second driving circuits, wherein the first driving circuit includes a first switch, which is electrically connected to the first electrode of the laser, respectively, and the second driving circuit includes a second switch, which is electrically connected to the second electrode of the laser, respectively. As can be seen from the above, since the first electrode and the second electrode of each laser are driven by the independently controlled first driving circuit and the second driving circuit, respectively, the probability of crosstalk between the multiple lasers distributed in an array can be further reduced. In addition, since the cost of the switching element is low and the service life is long, the first driving circuit includes the first switch and the second driving circuit includes the second switch, which is not only conducive to the stable operation of the laser light source, but also can reduce the cost of the laser light source and facilitate mass production.

[0032] Furthermore, by configuring one of the first electrode and the second electrode as an independently controlled independent electrode, and the other as a common electrode commonly controlled by multiple lasers; and configuring one of the first driving circuit and the second driving circuit as an independently controlled independent driving circuit electrically connected to the independent electrodes of each laser, and the other as a commonly controlled common driving circuit electrically connected to the common electrode, not only can the probability of crosstalk between multiple lasers distributed in an array be effectively reduced, but also the structure of the laser light source can be simplified, and the cost of the laser light source can be reduced.

[0033] Furthermore, by leading out each independent electrode of the laser chip to the second surface of the laser chip to form a third solder ball, and leading out the common electrode of the laser chip to the first surface of the laser chip to form a first solder pad; and by forming a third solder pad on the first surface of the driver chip to be electrically connected to each independent driving circuit of the driver chip, and forming a fourth solder pad to be electrically connected to the common driving circuit of the driver chip, and then connecting the third solder ball to the third solder pad, and connecting the first solder pad to the fourth solder pad, the independent electrodes of the laser chip are electrically connected to the independent driving circuit of the driver chip, and the common electrode is electrically connected to the common driving circuit, which can not only effectively reduce the probability of crosstalk between multiple lasers distributed in an array, but also simplify the packaging of the laser and reduce the production cost of the laser light source.

[0034] Furthermore, by leading out each independent electrode of the laser chip to the second surface of the laser chip to form a fourth solder ball, and by leading out the common electrode of the laser chip to the second surface of the laser chip to form a fifth solder ball; and by forming a fifth solder pad on the first surface of the driver chip to be electrically connected to each independent driving circuit of the driver chip, and forming a sixth solder pad to be electrically connected to the common driving circuit of the driver chip, and then connecting the fourth solder ball to the fifth solder pad, and the fifth solder ball to the sixth solder pad, the independent electrodes of the laser chip are electrically connected to the independent driving circuit of the driver chip, and the common electrode is electrically connected to the common driving circuit, which can not only effectively reduce the probability of crosstalk between multiple lasers distributed in an array, but also reduce the package size because the independent electrodes and the common electrode of the laser chip are led out to the same surface of the laser chip through solder balls for electrical connection.

[0035] Furthermore, the independent driving circuit may include a plurality of independently controlled first driving circuits, the first driving circuit including a first switch, respectively electrically connected to the first electrodes of the plurality of lasers; the second electrode may be configured as a common electrode controlled by the plurality of lasers; the common driving circuit may include a second driving circuit, the second driving circuit including a second switch, electrically connected to the second electrode. As can be seen from the above, since the first electrode of each laser is driven by an independently controlled first driving circuit, and the second electrode is configured as a common electrode controlled by the plurality of lasers and driven by the second driving circuit, it is possible to further reduce the probability of crosstalk between the plurality of lasers distributed in an array, and simplify the structure of the laser light source. In addition, since the cost of the switching element is low and the service life is long, the first driving circuit includes a first switch, and the second driving circuit includes a second switch, which is not only conducive to the stable operation of the laser light source, but also can reduce the cost of the laser light source and facilitate mass production.

[0036] Furthermore, the independent driving circuit may include a plurality of independently controlled second driving circuits, and the second driving circuit may include a second switch, which is electrically connected to the second electrodes of the plurality of lasers respectively; the first electrode may be configured as a common electrode controlled by the plurality of lasers; the common driving circuit may include a first driving circuit, and the first driving circuit may include a first switch, which is electrically connected to the first electrode. As can be seen from the above, since the second electrode of each laser is driven by an independently controlled second driving circuit, and the first electrode is configured as a common electrode controlled by the plurality of lasers and driven by the first driving circuit, it is possible to further reduce the probability of crosstalk between the plurality of lasers distributed in an array, and simplify the structure of the laser light source. In addition, since the cost of the switching element is low and the service life is long, the first driving circuit includes the first switch, and the second driving circuit includes the second switch, which is not only conducive to the stable operation of the laser light source, but also can reduce the cost of the laser light source and facilitate mass production.

[0037] Furthermore, the laser light source may also include a substrate or a printed circuit board, and the substrate or printed circuit board may be connected to a driver chip, and the driver chip is then connected to a laser chip to reduce the volume of the laser light source; the substrate or printed circuit board may also be connected to the driver chip and the laser chip respectively to ensure the stability of the electrical connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0039] Figure 1 A schematic diagram of the structure of a laser light source in an embodiment of the present disclosure is shown;

[0040] Figure 2 A schematic diagram of the specific structure of a laser light source in an embodiment of the present disclosure is shown;

[0041] Figure 3 A schematic diagram showing the specific structure of another laser light source in an embodiment of the present disclosure is shown;

[0042] Figure 4 A schematic diagram of the cross-sectional structure of a laser light source in an embodiment of the present disclosure is shown;

[0043] Figure 5 A schematic diagram of a circuit structure of a driver chip driving a laser in an embodiment of the present disclosure is shown;

[0044] Figure 6 A schematic diagram showing the specific structure of another laser light source in an embodiment of the present disclosure is shown;

[0045] Figure 7 A schematic diagram showing the specific structure of another laser light source in an embodiment of the present disclosure is shown;

[0046] Figure 8 A schematic diagram showing the specific structure of another laser light source in an embodiment of the present disclosure is shown;

[0047] Fig. 9 A schematic diagram of a circuit structure of another driving chip driving a laser in an embodiment of the present disclosure is shown;

[0048] Fig.10 A schematic diagram of the circuit structure of another driver chip driving a laser in an embodiment of the present disclosure is shown. DETAILED DESCRIPTION

[0049] As described in the background technology, array lasers are electrically connected together through metal electrodes, which deteriorates the electrical isolation between lasers, thereby causing crosstalk problems between lasers, and further affecting the performance of the lidar system.

[0050] In view of the above problems, an embodiment of the present disclosure provides a laser light source, including a laser chip and a driver chip, wherein the laser chip includes a plurality of lasers distributed in an array, the laser includes a first electrode and a second electrode, and the driver chip includes a first driver circuit and a second driver circuit, wherein the first driver circuit and the second driver circuit are electrically connected to the first electrode and the second electrode of the laser, respectively; by configuring at least one electrode of the laser as an independently controlled independent electrode, and configuring at least one driver circuit as an independently controlled independent driver circuit, the independent driver circuits are electrically connected to the independent electrodes of each laser, respectively, thereby effectively reducing the probability of crosstalk between the plurality of lasers distributed in an array.

[0051] In order to enable those skilled in the art to better understand and implement the embodiments of the present disclosure, the concepts, schemes, principles and advantages of the embodiments of the present disclosure are described in detail below with reference to the accompanying drawings and through specific application examples.

[0052] First, the present disclosure provides a laser light source, referring to Figure 1 The structure diagram of a laser light source is shown, and the laser light source L comprises:

[0053] The laser chip L1 includes a plurality of lasers L11-Lmn (m represents the number of rows of the array, and n represents the number of columns of the array) distributed in an array, wherein the laser includes a first electrode E1 and a second electrode E2, and at least one of the first electrode E1 and the second electrode E2 is configured as an independent electrode that is independently controlled.

[0054] It should be noted that the embodiment of the present disclosure does not impose any specific restrictions on the structure of the laser chip. Figure 1 The multiple lasers distributed in an array as shown are only exemplary. In a specific implementation, the number of rows m of the array and the number of columns n of the array can be any natural number greater than 1.

[0055] The driving chip L2 is suitable for driving the lasers L11~Lmn of the laser chip L1, and the driving chip L2 includes: a first driving circuit L21 and a second driving circuit L22, which are electrically connected to the first electrode E1 and the second electrode E2 of the laser, respectively (for example, the first driving circuit L21 is connected to the first electrode E1, and the second driving circuit L22 is electrically connected to the second electrode E2), wherein at least one of the first driving circuit L21 and the second driving circuit L22 is configured as an independent driving circuit with independent control, and the independent driving circuits are electrically connected to the independent electrodes of each laser, respectively.

[0056] By adopting the above embodiment, at least one electrode of the laser is configured as an independently controlled independent electrode, and at least one driving circuit of the driving chip is configured as an independently controlled independent driving circuit, so that the independent driving circuits are electrically connected to the independent electrodes of each laser respectively, the probability of crosstalk between multiple lasers distributed in an array can be effectively reduced.

[0057] As an optional example, each independent electrode of the laser chip may be electrically connected to each independent driving circuit of the driving chip through a solder ball.

[0058] By adopting the above embodiment, since the independent electrodes of the laser chip are electrically connected to the independent driving circuits of the driving chip through solder balls, point-to-point connection can be achieved, thereby ensuring the consistency of electrical connection between different lasers, and further ensuring that the light-emitting performance of different lasers remains consistent.

[0059] As an optional example, each independent electrode of the laser chip can be led out to the first surface of the laser chip to form a first solder ball; a first solder pad is formed on the first surface of the driver chip to be electrically connected to each independent driving circuit of the driver chip; the first solder ball is connected to the corresponding first solder pad to electrically connect the independent electrode of the laser chip to the independent driving circuit of the driver chip.

[0060] For example, the side of the laser facing away from the substrate is used as the first side of the laser chip, and the substrate side of the laser is used as the second side. When the laser is a back-emitting laser, the laser is emitted from the second side, and the electrodes of the laser chip are arranged on the first side. Each independent electrode of the laser can be led out to the first side in the form of a solder ball, and the first side of the laser chip faces the first side of the driver chip, and then is electrically connected to each independent driving circuit of the driver chip through the solder ball.

[0061] The above embodiment can not only effectively reduce the probability of crosstalk between multiple lasers distributed in an array, but also ensure that the light-emitting performance of different lasers remains consistent. In addition, the electrical connection method between the independent electrodes of the above laser chip and the independent driving circuit of the driving chip can reduce the package size and improve the integration.

[0062] As another optional example, the side of the laser facing away from the substrate serves as the first side of the laser chip, and the substrate side of the laser serves as the second side. When the laser is a surface-emitting laser, the laser is emitted from the first side, and the electrode of the laser is arranged on the surface of the laser facing the first side. Through silicon vias can be provided on the laser chip, and the independent electrodes of each laser can be led out to the second side of the laser chip through the through silicon vias, respectively, to form a second solder ball. The side of the driver chip used for connecting to the laser chip is the first side, and a second solder pad is formed on the first side of the driver chip. The second solder ball is connected to the corresponding second solder pad, so that the independent electrode of the laser chip is electrically connected to the independent driving circuit of the driver chip.

[0063] By adopting the above embodiment, not only the probability of crosstalk between multiple lasers distributed in an array can be effectively reduced, but also the light-emitting performance of different lasers can be ensured to remain consistent.

[0064] In some embodiments of the present disclosure, the independent driving circuit may include a plurality of independently controlled first driving circuits and a plurality of independently controlled second driving circuits, wherein the first driving circuit may include a first switch electrically connected to the first electrodes of the laser, respectively, and the second driving circuit may include a second switch electrically connected to the second electrodes of the laser, respectively.

[0065] With the above embodiment, since the first electrode and the second electrode of each laser are driven by the independently controlled first drive circuit and the second drive circuit, respectively, the probability of crosstalk between the plurality of lasers distributed in an array can be further reduced. In addition, since the cost of the switch element is low and the service life is long, the first drive circuit includes the first switch and the second drive circuit includes the second switch, which is not only conducive to the stable operation of the laser light source, but also can reduce the cost of the laser light source and facilitate mass production.

[0066] As an optional example, the first end of the first switch can be coupled to the first electrode of the laser, and the second end of the first switch can be coupled to the voltage source; the first end of the second switch can be coupled to the second electrode of the laser, and the second end of the second switch can be coupled to the ground.

[0067] In some other embodiments of the present disclosure, one of the first electrode and the second electrode can be configured as an independent electrode that is independently controlled, and the other can be configured as a common electrode that is commonly controlled by multiple lasers; one of the first drive circuit and the second drive circuit can be configured as an independent drive circuit that is independently controlled and electrically connected to the independent electrodes of each laser, and the other can be configured as a common drive circuit that is commonly controlled and electrically connected to the common electrode.

[0068] By adopting the above embodiment, not only the probability of crosstalk between multiple lasers distributed in an array can be effectively reduced, but also the structure of the laser light source can be simplified and the cost of the laser light source can be reduced.

[0069] As an optional example, each independent electrode of the laser chip can be led out to the second surface of the laser chip to form a third solder ball, and the common electrode of the laser chip can be led out to the first surface of the laser chip to form a first solder pad; and a third solder pad is formed on the first surface of the driver chip to be electrically connected to each independent driving circuit of the driver chip, and a fourth solder pad is formed to be electrically connected to the common driving circuit of the driver chip; the third solder ball is connected to the third solder pad, and the first solder pad is connected to the fourth solder pad, so that the independent electrodes of the laser chip are electrically connected to the independent driving circuits of the driver chip, and the common electrode is electrically connected to the common driving circuit.

[0070] The above embodiment can not only effectively reduce the probability of crosstalk between multiple lasers distributed in an array, but also simplify the packaging of the lasers and reduce the production cost of the laser light source.

[0071] As another optional example, each independent electrode of the laser chip can be led out to the second surface of the laser chip to form a fourth solder ball, and the common electrode of the laser chip can be led out to the second surface of the laser chip to form a fifth solder ball; and a fifth solder pad is formed on the first surface of the driver chip to be electrically connected to each independent driving circuit of the driver chip, and a sixth solder pad is formed to be electrically connected to the common driving circuit of the driver chip; the fourth solder ball is connected to the fifth solder pad, and the fifth solder ball is connected to the sixth solder pad, so that the independent electrodes of the laser chip are electrically connected to the independent driving circuits of the driver chip, and the common electrode is electrically connected to the common driving circuit.

[0072] The above embodiment can not only effectively reduce the probability of crosstalk between multiple lasers distributed in an array, but also reduce the package size because the independent electrodes and the common electrodes of the laser chip are led out to the same surface of the laser chip through solder balls for electrical connection.

[0073] As an optional example, the independent driving circuit may include a plurality of independently controlled first driving circuits, wherein the first driving circuit may include a first switch electrically connected to first electrodes of a plurality of lasers respectively; the second electrode may be configured as a common electrode controlled by a plurality of lasers; the common driving circuit may include a second driving circuit, wherein the second driving circuit may include a second switch electrically connected to the second electrode.

[0074] With the above embodiment, since the first electrode of each laser is driven by an independently controlled first driving circuit, and the second electrode is configured as a common electrode controlled by multiple lasers and driven by a second driving circuit, it is not only possible to further reduce the probability of crosstalk between multiple lasers distributed in an array, but also to simplify the structure of the laser light source. In addition, since the cost of the switch element is low and the service life is long, the first driving circuit includes a first switch, and the second driving circuit includes a second switch, which is not only conducive to the stable operation of the laser light source, but also can reduce the cost of the laser light source and facilitate mass production.

[0075] In some embodiments of the present disclosure, the first end of the first switch is coupled to the first electrode of the laser, and the second end of the first switch is coupled to the voltage source; the first end of the second switch is coupled to the common electrode, and the second end of the second switch is coupled to the ground.

[0076] As another optional example, the independent driving circuit may include a plurality of independently controlled second driving circuits, each of which may include a second switch electrically connected to the second electrodes of the plurality of lasers respectively; the first electrode may be configured as a common electrode controlled by the plurality of lasers; the common driving circuit may include a first driving circuit, each of which may include a first switch electrically connected to the first electrode.

[0077] With the above embodiment, since the second electrode of each laser is driven by an independently controlled second driving circuit, and the first electrode is configured as a common electrode controlled by multiple lasers and driven by the first driving circuit, it is not only possible to further reduce the probability of crosstalk between multiple lasers distributed in an array, but also to simplify the structure of the laser light source. In addition, since the cost of the switch element is low and the service life is long, the first driving circuit includes the first switch, and the second driving circuit includes the second switch, which is not only conducive to the stable operation of the laser light source, but also can reduce the cost of the laser light source and facilitate mass production.

[0078] In some embodiments of the present disclosure, the first end of the second switch is coupled to the second electrode of the laser, and the second end of the second switch is coupled to the ground; the first end of the first switch is coupled to the common electrode, and the second end of the first switch is coupled to the voltage source.

[0079] In some other embodiments of the present disclosure, the laser light source may further include a substrate or a printed circuit board. As an optional example, the substrate or printed circuit board may be connected to the driver chip, and the driver chip is then connected to the laser chip to reduce the volume of the laser light source. As another optional example, the substrate or printed circuit board may be connected to the driver chip and the laser chip respectively to ensure the stability of the electrical connection.

[0080] In order to enable those skilled in the art to better understand and implement the embodiments of the present disclosure, the laser light source described in the above embodiments is described below by means of specific examples.

[0081] Reference Figure 2 A specific structural schematic diagram of a laser light source is shown, wherein the laser light source L includes a laser chip L1 and a driving chip L2, the laser chip L1 includes a plurality of lasers distributed in an array, and the laser includes a first electrode and a second electrode (not shown).

[0082] As an alternative example, continue to refer to Figure 2 The laser chip L1 is a back-emitting laser chip, and the first electrode and the second electrode of the laser are configured as independent electrodes that are independently controlled. Each independent electrode of the laser chip L1 is led out to the second surface of the laser chip L1, and a first solder ball Q1 is formed. A first solder pad P1 is formed on the first surface of the driver chip L2, and is electrically connected to each independent driving circuit of the driver chip.

[0083] As an alternative example, continue to refer to Figure 2 The laser light source L also includes a substrate L3, the first solder ball Q1 and the first solder pad P1 can be connected to the substrate L3 respectively, and the substrate L3 is provided with wiring for connecting the first solder ball Q1 and the first solder pad P1, thereby realizing the connection between the first solder ball Q1 and the corresponding first solder pad P1.

[0084] In a specific implementation, the laser may include a vertical-cavity surface-emitting laser (VCSEL). The substrate may include a printed circuit board (PCB). The first solder ball Q1 may be electrically connected to the corresponding first solder pad P1 through wiring on the PCB.

[0085] As another alternative example, refer to Figure 3 As shown in the specific structural diagram of another laser light source, the first solder ball Q1 and the first solder pad P1 can also be directly connected point-to-point.

[0086] In some embodiments of the present disclosure, the substrate further includes a packaging substrate, a heat sink, etc.

[0087] As an alternative example, refer to Figure 4 A schematic diagram of the cross-sectional structure of a laser light source is shown, the laser chip L1 can be a surface-emitting laser chip, and the first electrode and the second electrode of the laser are configured as independently controlled independent electrodes (not shown). The electrodes of the laser are arranged on the first side of the laser chip. A through silicon via LT is provided on the laser chip L1, and the independent electrodes of each laser are respectively led out to the second side of the laser core L1 through the through silicon via LT, forming a second solder ball Q2, and a second solder pad P2 is formed on the first side of the driver chip L2, which is electrically connected to each independent driving circuit of the driver chip L2.

[0088] In some specific implementations, the second surface of the laser chip L1 is opposite to the first surface of the driver chip L2, and the second solder ball Q2 is connected to the corresponding second solder pad P2, so that the independent electrode of the laser chip L1 is electrically connected to the independent driving circuit of the driver chip L2.

[0089] In some other specific implementations, the second solder ball Q2 of the laser chip L1 and the second solder pad P2 of the driver chip L2 are respectively connected to the PCB, and the second solder ball Q2 and the second solder pad P2 are electrically connected through PCB wiring, so that the independent electrode of the laser chip L1 is electrically connected to the independent driving circuit of the driver chip L2.

[0090] As an optional example, the driving chip L2 may include: a first driving circuit and a second driving circuit, which are electrically connected to the first electrode and the second electrode of the laser, respectively, wherein the first driving circuit and the second driving circuit are configured as independent driving circuits with independent control, and the independent driving circuits are electrically connected to the independent electrodes of each laser, respectively.

[0091] Reference Figure 5 The circuit structure diagram of a driver chip driving a laser is shown in FIG. 1 . For ease of description, Figure 5 Taking driving a 3*3 laser array as an example, the independent driving circuit may include a plurality of independently controlled first driving circuits L21 ( Figure 5 and a plurality of independently controlled second drive circuits L22 ( Figure 5As shown in the solid line box, in the 3*3 laser array, each laser includes a first electrode E1 and a second electrode E2, the first electrode E1 of each laser is electrically connected to a first driving circuit L21, and the second electrode E2 of each laser is electrically connected to a second driving circuit L22.

[0092] As an alternative example, continue to refer to Figure 5 The first driving circuit L21 may include a first switch K1, a first end of the first switch K1 is coupled to the first electrode E1 of the laser, and a second end of the first switch K1 is coupled to the voltage source HVDD. The second driving circuit L22 may include a second switch K2, a first end of the second switch K2 is coupled to the second electrode E2 of the laser, and a second end of the second switch K2 is coupled to the ground GND.

[0093] In some embodiments of the present disclosure, one of the first electrode and the second electrode of the laser can be configured as an independently controlled independent electrode, and the other can be configured as a common electrode controlled by multiple lasers. One of the first drive circuit and the second drive circuit can be configured as an independently controlled independent drive circuit electrically connected to the independent electrodes of each laser, and the other can be configured as a commonly controlled common drive circuit electrically connected to the common electrode.

[0094] Reference Figure 6 A specific structural schematic diagram of another laser light source is shown, wherein the laser light source L includes a laser chip L1 and a driver chip L2, the laser chip L1 includes a plurality of lasers distributed in an array, and the laser includes a first electrode and a second electrode (not shown).

[0095] As an alternative example, continue to refer to Figure 6 , one of the first electrode and the second electrode of the laser is configured as an independent electrode that is independently controlled, and the other can be configured as a common electrode that is commonly controlled by multiple lasers. Each independent electrode of the laser chip L1 can be led out to the second surface of the laser chip L1 to form a third solder ball Q3, and the common electrode of the laser chip L1 can be led out to the first surface of the laser chip L1 to form a first solder pad D1. And a third solder pad P3 is formed on the first surface of the driver chip L2, which is electrically connected to each independent driving circuit of the driver chip L2, and a fourth solder pad P4 is formed, which is electrically connected to the common driving circuit of the driver chip L2. The third solder ball Q3 is connected to the third solder pad P3, and the first solder pad D1 is connected to the fourth solder pad P4, so that the independent electrodes of the laser chip L1 are electrically connected to the independent driving circuits of the driver chip L1, and the common electrode is electrically connected to the common driving circuit.

[0096] As an alternative example, continue to refer to Figure 6 The laser light source L further includes a substrate L3, and the third solder ball Q3 and the third solder pad P3 can be connected to the substrate L3 respectively. A second solder pad D2 is provided on the substrate L3, and the first solder pad D1 of the laser chip is connected to the second solder pad D2 of the substrate L3. For example, the first solder pad D1 and the second solder pad D2 are connected by wire bonding.

[0097] The substrate L3 is also provided with wiring for connecting the third solder ball Q3 and the third pad P3, thereby realizing the connection between the third solder ball Q3 and the third pad P3. The fourth pad P4 can be connected to the substrate L3, and the substrate L3 is provided with wiring for connecting the second pad D2 and the fourth pad P4, thereby realizing the connection between the first pad D1 and the fourth pad P4.

[0098] As another alternative example, refer to Figure 7 In the schematic diagram of the specific structure of another laser light source shown in the figure, the third solder ball Q3 and the third solder pad P3 can also be directly connected point-to-point. A second solder pad D2 is provided on the substrate L3, and the first solder pad D1 of the laser chip is connected to the second solder pad D2 of the substrate L3. For example, the first solder pad D1 and the second solder pad D2 are connected by wire bonding. The fourth solder pad P4 (not shown in the figure) of the driver chip is connected to the substrate L3, and the fourth solder pad P4 is electrically connected to the second solder pad D2 through the wiring of the substrate L3, so that the first solder pad D1 is electrically connected to the fourth solder pad P4.

[0099] In some embodiments of the present disclosure, reference Figure 2 As shown, each independent electrode of the laser chip L1 is led out to the second surface of the laser chip L1, forming a plurality of solder balls Q1. The common electrode of the laser chip L1 is also led out to the second surface of the laser chip L1, forming a common electrode solder ball (not shown in the figure). A first solder pad P1 is formed on the first surface of the driver chip L2 for electrically connecting to the solder ball Q1. A common electrode solder pad (not shown in the figure) is also formed on the first surface of the driver chip L2 for electrically connecting to the common electrode solder ball of the laser chip. The first solder ball Q1, the common electrode solder ball, and the first solder pad P1 and the common electrode solder pad are respectively connected to the substrate L3. Wiring for connecting the corresponding solder balls and solder pads is provided on the substrate L3 to realize the electrical connection between the first solder ball Q1 and the corresponding first solder pad P1, and the electrical connection between the common electrode solder ball and the common electrode solder pad.

[0100] In a specific implementation, the laser included in the laser chip L1 can be a back-emitting laser. The laser is emitted from the second surface of the laser chip. The independent electrodes and common electrodes of the laser are led to the first surface of the laser chip to form corresponding solder balls for electrical connection between the laser and the driving circuit.

[0101] In some other specific implementations, the laser chip L1 includes a surface-emitting laser, the laser is emitted from the first surface of the laser chip, and the electrode of the laser is arranged on the surface of the laser facing the first surface. Through silicon vias can be arranged on the laser chip, and each independent electrode and the common electrode of the laser can be led out to the second surface of the laser chip through the through silicon vias, respectively, to form corresponding solder balls for electrical connection between the laser and the driving circuit.

[0102] In some other embodiments of the present disclosure, Figure 8 A specific structural schematic diagram of another laser light source is shown, wherein the laser light source L includes a laser chip L1 and a driver chip L2, the laser chip L1 includes a plurality of lasers distributed in an array, and the laser includes a first electrode and a second electrode (not shown).

[0103] As an alternative example, continue to refer to Figure 8 In the laser chip L1, one of the first electrode and the second electrode of the laser is configured as an independent electrode that is independently controlled, and the other can be configured as a common electrode that is commonly controlled by multiple lasers. Each independent electrode of the laser chip L1 can be led out to the second surface of the laser chip to form a fourth solder ball Q4, and the common electrode of the laser chip can be led out to the second surface of the laser chip L1 to form a fifth solder ball Q5. A fifth solder pad P5 is formed on the first surface of the driver chip L2, which is electrically connected to each independent driving circuit of the driver chip L2, and a sixth solder pad P6 is formed, which is electrically connected to the common driving circuit of the driver chip L2. The fourth solder ball Q4 is connected to the fifth solder pad P5, and the fifth solder ball Q5 is connected to the sixth solder pad P6, so that the independent electrodes of the laser chip are electrically connected to the independent driving circuits of the driver chip, and the common electrode is electrically connected to the common driving circuit.

[0104] In a specific implementation, the second surface of the laser chip L1 is opposite to the first surface of the driver chip L2, the fourth solder ball Q4 is connected point-to-point with the corresponding fifth solder pad P5, and the fifth solder ball Q5 is connected point-to-point with the corresponding sixth solder pad P6, so that the independent electrode of the laser chip is electrically connected to the independent driving circuit of the driver chip, and the common electrode is electrically connected to the common driving circuit.

[0105] As an optional example, the driving chip L2 may include: a first driving circuit and a second driving circuit, wherein one of the first driving circuit and the second driving circuit is configured as an independent driving circuit for independent control and electrically connected to the independent electrodes of each laser, and the other is configured as a common driving circuit for common control and electrically connected to the common electrode.

[0106] Reference Fig. 9 Another circuit structure diagram of a driver chip driving a laser is shown in FIG. 1 . For ease of description, Fig. 9 The following description is made by taking driving a 3*3 laser array as an example. The independent driving circuit may include a plurality of independently controlled first driving circuits L21 ( Fig. 9 The common driving circuit may include a second driving circuit L22 ( Fig. 9 In the 3*3 laser array, each laser includes a first electrode E1 and a second electrode E2, the first electrode E1 of each laser is electrically connected to a first driving circuit L21, the second electrode E2 of each laser is configured as a common electrode EC controlled by multiple lasers, and the common electrode EC is electrically connected to the second driving circuit L22.

[0107] As an alternative example, continue to refer to Fig. 9 The first driving circuit L21 may include a first switch K1, a first end of the first switch K1 is coupled to the first electrode E1 of the laser, and a second end of the first switch K1 is coupled to the voltage source HVDD; the second driving circuit L22 may include a second switch K2, a first end of the second switch K2 is coupled to the common electrode EC, and a second end of the second switch K2 is coupled to the ground GND.

[0108] In other embodiments of the present disclosure, the first drive circuit is configured as an independent drive circuit, electrically connected to the independent electrodes of each laser, and the second drive circuit is configured as a common drive circuit. The first drive circuit includes a plurality of first switches, which are respectively coupled to the independent electrodes of the lasers. The second drive circuit includes a second switch, which is coupled to the common electrode of the lasers. In a specific implementation, the first switches can be independently controlled to achieve independent addressing of each laser.

[0109] As another alternative example, refer to Fig.10 The circuit structure diagram of another driving chip driving the laser is shown in FIG. 1 . For ease of description, Fig.10 The following description is made by taking driving a 3*3 laser array as an example. The independent driving circuit may include a plurality of independently controlled second driving circuits L22 ( Fig.10 The common driving circuit may include a first driving circuit L21 ( Fig.10 As shown in the dotted box, in the 3*3 laser array, each laser includes a first electrode E1 and a second electrode E2, the second electrode E2 of each laser is electrically connected to a second drive circuit L22, the first electrode E1 of each laser is configured as a common electrode EC controlled by multiple lasers, and the common electrode EC is electrically connected to the first drive circuit L21.

[0110] As an alternative example, continue to refer to Fig.10The first driving circuit L21 may include a first switch K1, a first end of the first switch K1 is coupled to the common electrode EC, and a second end of the first switch K1 is coupled to a voltage source; a first end of the second switch K2 is coupled to the second electrode E2 of the laser, and a second end of the second switch K2 is coupled to the ground GND.

[0111] In other embodiments of the present disclosure, the second drive circuit is configured as an independent drive circuit, electrically connected to the independent electrodes of each laser, and the first drive circuit is configured as a common drive circuit. The second drive circuit includes a plurality of second switches, which are respectively coupled to the independent electrodes of the lasers. The first drive circuit includes a first switch, which is coupled to the common electrode of the lasers. In a specific implementation, the second switches can be independently controlled to achieve independent addressing of each laser.

[0112] The present disclosure also provides a laser radar, including:

[0113] Any laser light source in the aforementioned embodiments.

[0114] By adopting the above embodiment, since the laser light source used by the laser radar can effectively reduce the probability of crosstalk between multiple lasers distributed in an array, the performance of the laser radar system can be improved.

[0115] It should be noted that the terms "first", "second", etc. in the embodiments of the present disclosure are only used to distinguish the descriptions of different electrodes, drive circuits, solder balls, solder pads, solder pads, switches or surfaces, and are not used to make any limitations on their specific structures, positions, or functions.

[0116] Although the embodiments of the present disclosure are disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A laser light source, characterized in that: include: A laser chip, comprising a plurality of lasers distributed in an array, wherein the laser comprises a first electrode and a second electrode, wherein at least one of the first electrode and the second electrode is configured as an independent electrode that is independently controlled; A driving chip, suitable for driving the laser of the laser chip, the driving chip comprising: a first driving circuit and a second driving circuit, respectively electrically connected to the first electrode and the second electrode of the laser, wherein at least one of the first driving circuit and the second driving circuit is configured as an independently controlled independent driving circuit, and the independent driving circuits are respectively electrically connected to the independent electrodes of each laser.

2. The laser light source according to claim 1, characterized in that: Each independent electrode of the laser chip is electrically connected to each independent driving circuit of the driving chip through a solder ball.

3. The laser light source according to claim 2, characterized in that: Each independent electrode of the laser chip is led out to the first surface of the laser chip to form a first solder ball; A first pad is formed on the first surface of the driver chip and is electrically connected to each independent driver circuit of the driver chip; The first solder balls are connected to the corresponding first solder pads, so that the independent electrodes of the laser chip are electrically connected to the independent driving circuits of the driving chip.

4. The laser light source according to claim 2, characterized in that: The laser chip is provided with a through silicon via, and the independent electrodes of each laser are respectively led out to the second surface of the laser chip through the through silicon via, forming a second solder ball; A second pad is formed on the first surface of the driver chip and is electrically connected to each independent driver circuit of the driver chip; The second solder balls are connected to the corresponding second solder pads, so that the independent electrodes of the laser chip are electrically connected to the independent driving circuits of the driving chip.

5. The laser light source according to claim 1, characterized in that: The independent driving circuit includes a plurality of independently controlled first driving circuits and a plurality of independently controlled second driving circuits, wherein the first driving circuit includes a first switch electrically connected to the first electrodes of the laser respectively; The second driving circuit includes second switches electrically connected to the second electrodes of the lasers respectively.

6. The laser light source according to claim 5, characterized in that: The first end of the first switch is coupled to the first electrode of the laser, and the second end of the first switch is coupled to the voltage source; the first end of the second switch is coupled to the second electrode of the laser, and the second end of the second switch is coupled to the ground.

7. The laser light source according to claim 2, characterized in that: One of the first electrode and the second electrode is configured as an independent electrode that is independently controlled, and the other is configured as a common electrode that is commonly controlled by a plurality of lasers; One of the first driving circuit and the second driving circuit is configured as an independently controlled independent driving circuit electrically connected to the independent electrodes of each laser, and the other is configured as a commonly controlled common driving circuit electrically connected to the common electrode.

8. The laser light source according to claim 7, characterized in that: Each independent electrode of the laser chip is led out to the second surface of the laser chip to form a third solder ball; the common electrode of the laser chip is led out to the first surface of the laser chip to form a first solder pad; The first surface of the driver chip is formed with a third pad electrically connected to each independent driver circuit of the driver chip, and a fourth pad electrically connected to a common driver circuit of the driver chip; The third solder ball is connected to the third solder pad, and the first solder pad is connected to the fourth solder pad, so that the independent electrode of the laser chip is electrically connected to the independent driving circuit of the driving chip, and the common electrode is electrically connected to the common driving circuit.

9. The laser light source according to claim 7, characterized in that: Each independent electrode of the laser chip is led out to the second surface of the laser chip to form a fourth solder ball; the common electrode of the laser chip is led out to the second surface of the laser chip to form a fifth solder ball; The first surface of the driver chip is formed with a fifth pad electrically connected to each independent driver circuit of the driver chip, and a sixth pad electrically connected to a common driver circuit of the driver chip; The fourth solder ball is connected to the fifth solder pad, and the fifth solder ball is connected to the sixth solder pad, so that the independent electrode of the laser chip is electrically connected to the independent driving circuit of the driving chip, and the common electrode is electrically connected to the common driving circuit.

10. The laser light source according to claim 8 or 9, characterized in that: The independent driving circuit includes a plurality of independently controlled first driving circuits, wherein the first driving circuit includes a first switch electrically connected to the first electrodes of the plurality of lasers respectively; the second electrode is configured as a common electrode controlled by the plurality of lasers; the common driving circuit includes a second driving circuit, and the second driving circuit includes a second switch electrically connected to the second electrode.

11. The laser light source according to claim 10, characterized in that: The first end of the first switch is coupled to the first electrode of the laser, and the second end of the first switch is coupled to the voltage source; the first end of the second switch is coupled to the common electrode, and the second end of the second switch is coupled to the ground.

12. The laser light source according to claim 8 or 9, characterized in that: The independent driving circuit includes a plurality of independently controlled second driving circuits, wherein the second driving circuit includes a second switch electrically connected to the second electrodes of the plurality of lasers respectively; the first electrode is configured as a common electrode controlled by the plurality of lasers; the common driving circuit includes a first driving circuit, wherein the first driving circuit includes a first switch electrically connected to the first electrode.

13. The laser light source according to claim 12, characterized in that: The first end of the second switch is coupled to the second electrode of the laser, and the second end of the second switch is coupled to the ground; the first end of the first switch is coupled to the common electrode, and the second end of the first switch is coupled to a voltage source.

14. The laser light source according to claim 1, characterized in that: Also includes: A substrate or a printed circuit board; the substrate or the printed circuit board is connected to the driving chip, or, They are respectively connected to the driving chip and the laser chip.

15. A laser radar, characterized in that: include: The laser light source according to any one of claims 1 to 14.

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