LED backlight module and display device

Abstract

The utility model relates to the technical field of LED display lighting, in particular to an LED backlight module and a display device, the LED backlight module comprises a substrate, an LED chip arranged on one surface of the substrate and a packaging colloid covering the LED chip; one side, far away from the substrate, of the packaging colloid is provided with a single-layer reflection optical structure, the reflection optical structure and the LED chips are in one-to-one correspondence, the center point of the reflection optical structure and the geometric center point of the LED chips are coaxial, and the reflection optical structure is provided with open holes arranged in an annular array. Each hole in the reflection optical structure in the LED backlight module is an independent small light-emitting unit, so that the front light emitting quantity of the reflection optical structure can be increased, the front transmittance of the reflection optical structure can be improved, and the overall brightness of the LED backlight module can be improved on the premise that the reflectivity and the dodging effect of the reflection optical structure are not reduced.

Description

[Technical field]

[0001] The utility model relates to the technical field of LED display lighting, in particular to an LED backlight module and a display device. [Background technology]

[0002] In order to meet the light density requirements within a certain thickness, the LED backlight module will make a reflective optical structure with a certain transmittance on the surface of the encapsulation colloid directly above the LED to perform light homogenization. To improve the light homogenization effect, the reflectivity of the reflective optical structure needs to be increased so that more light is reflected and propagated to the side of the LED.

[0003] However, due to the limitation of material mechanism, reflectivity and transmittance are usually a fixed ratio. In order to achieve the uniform light effect, a higher reflectivity is usually required, which will cause the transmittance of the reflective optical structure to be low, so that the brightness will be distributed in three areas: directly above the LED chip, the brightness is extremely high; at the outer edge of the reflective optical structure, the brightness is extremely low; only the brightness outside the reflective optical structure is normal. In order to solve this problem, it is usually chosen to change the size of the existing product, which not only increases the cost, but also does not conform to the development direction of miniaturization and ultra-thinness of display devices. [Contents of the utility model]

[0004] In order to solve the technical problem of poor light uniformity effect in the existing LED backlight module, the utility model provides an LED backlight module and a display device.

[0005] The solution to the technical problem of the utility model is to provide an LED backlight module, including a substrate, an LED chip arranged on one side of the substrate, and a packaging colloid covering the LED chip; a single-layer reflective optical structure is arranged on the side of the packaging colloid away from the substrate, the reflective optical structure corresponds to the LED chip one by one, the center point of the reflective optical structure is coaxial with the geometric center point of the LED chip, and the reflective optical structure is provided with openings arranged in a ring array.

[0006] Preferably, a copper wire layer is provided on a side of the substrate close to the LED chip, and a side of the copper wire layer away from the substrate is covered with a solder resist layer, the solder resist layer has a window, and the LED chip is arranged in the window.

[0007] Preferably, the depth of the opening is 0um-50um less than the thickness of the reflective optical structure, or the opening penetrates the reflective optical structure and extends toward the encapsulation colloid, and the depth of the opening is 0um-50um greater than the thickness of the reflective optical structure.

[0008] Preferably, the axial cross-section of the opening is rectangular, V-shaped or arc-shaped.

[0009] Preferably, the diameter of the opening is in the range of 50um-500um.

[0010] Preferably, the outer diameter of the reflective optical structure ranges from 1.0 mm to 6.0 mm.

[0011] Preferably, a projection area of ​​the reflective optical structure on the substrate is larger than a projection area of ​​the LED chip on the substrate.

[0012] Preferably, there is a gap between the solder resist layer and the LED chip.

[0013] Preferably, the thickness of the LED chip is greater than the thickness of the solder resist layer. To solve the above technical problem, the present invention provides another technical solution as follows: a display device comprises a carrier device and the above LED backlight module arranged on the carrier device.

[0014] Compared with the prior art, the LED backlight module and display device provided by the present invention have the following advantages:

[0015] 1. An LED backlight module provided in the embodiment of the utility model is provided. By making openings on the reflective optical structure, when the LED chip emits light, most of the light is reflected to the side of the LED through the reflective optical structure, and part of the light can be emitted directly through the opening. This part of the light does not need to be reflected and evenly lighted by the reflective optical structure, so the light output is not attenuated. From the front, each opening in the LED backlight module is an independent small light-emitting unit, which can increase the front light output of the reflective optical structure without reducing the reflectivity and even light effect of the reflective optical structure, and improve the front transmittance of the reflective optical structure, so as to improve the overall brightness of the LED backlight module. The center point of the reflective optical structure is coaxial with the geometric center point of the LED chip. This setting is conducive to the reflective optical structure to better reflect or transmit the light emitted by the LED chip, and can control and improve the even light effect. In addition, the ring array arrangement of the openings can further improve the even light effect of the LED backlight module.

[0016] 2. An LED backlight module provided in an embodiment of the utility model has a copper wire layer on one side of a substrate close to an LED chip, and a solder resist layer is covered on one side of the copper wire layer away from the substrate. The solder resist layer has a window, and the LED chip is arranged in the window. The solder resist layer is made of a material with high reflectivity, which can enhance the reflection degree of light emitted by the LED chip, improve the light efficiency of the LED backlight module, and control the uniform light effect.

[0017] 3. In an LED backlight module provided in an embodiment of the present invention, the depth of the opening is 0um-50um less than the thickness of the reflective optical structure, or the opening penetrates the reflective optical structure and extends toward the encapsulation colloid, and the depth of the opening is 0um-50um greater than the thickness of the reflective optical structure. By adjusting the depth of the opening, the amount of light emitted directly above the LED chip can be changed, and the uniform light effect can be further controlled.

[0018] 4. In an LED backlight module provided in an embodiment of the utility model, the axial cross-section shape of the opening is rectangular, V-shaped or arc-shaped. Different opening shapes can also change the amount of light output directly above the LED chip. The cross-sectional shape of the opening is V-shaped or arc-shaped to increase the amount of light output directly above the LED chip, improve the lighting efficiency of the LED backlight module, and control the uniform light effect.

[0019] 5. In an LED backlight module provided in an embodiment of the utility model, the diameter of the opening is in the range of 50um-500um. The light output directly above the LED chip can be changed by adjusting the size of the opening, thereby further controlling the uniform light effect.

[0020] 6. In an LED backlight module provided in an embodiment of the utility model, the outer diameter range of the reflective optical structure is 1.0mm-6.0mm, and the projection area of ​​the reflective optical structure on the substrate is larger than the projection area of ​​the LED chip on the substrate, that is, the reflective optical structure can completely cover the light emitting surface of the LED chip, and can better adjust the concentrated light to the periphery through light reflection to control the uniform light effect of the LED backlight module.

[0021] 7. In an LED backlight module provided in an embodiment of the utility model, there is a gap between the solder resist layer and the LED chip, and sufficient space is reserved in the gap so that when the LED chip is placed in the window during the manufacturing process of the LED backlight module, the LED chip is prevented from directly contacting the solder resist layer and causing damage to the LED chip.

[0022] 8. In an LED backlight module provided in an embodiment of the utility model, the thickness of the LED chip is greater than the thickness of the solder resist layer, so as to avoid the thickness of the LED chip being lower than the thickness of the solder resist layer and affecting the lateral light emission of the LED chip, thereby making the light emission effect of the LED chip better.

[0023] 9. A display device provided in an embodiment of the utility model includes a carrying device and an LED backlight module as described above, which is arranged on the carrying device. The display device has all the beneficial effects of the LED backlight module, which will not be described in detail here.

Brief Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0025] Figure 1 This is a side view of the LED backlight module provided by the first embodiment of the utility model. Figure 1 .

[0026] Figure 2 It is a front schematic diagram of the LED backlight module provided by the first embodiment of the utility model.

[0027] Figure 3 This is a schematic diagram of the uniform light effect of a conventional LED backlight module.

[0028] Figure 4 This is a schematic diagram of the light path of a conventional LED backlight module.

[0029] Figure 5 It is a schematic diagram of the light path of the LED backlight module provided by the first embodiment of the utility model.

[0030] Figure 6 This is a side view of the LED backlight module provided by the first embodiment of the utility model. Figure 2 .

[0031] Figure 7 It is a schematic diagram of the uniform light effect of the LED backlight module provided by the first embodiment of the utility model.

[0032] Figure 8 It is a schematic block diagram of the structure of a display device provided in the second embodiment of the utility model.

[0033] Description of the accompanying drawings:

[0034] 1. LED backlight module; 2. LED backlight module; 3. Display device;

[0035] 10. Substrate; 11. Wire copper layer; 12. Solder resist layer; 13. LED chip; 14. Packaging colloid; 15. Reflective optical structure; 20. Reflective optical structure; 21. LED chip; 30. Carrying device;

[0036] 121. Window; 122. Gap; 151. Opening. [Specific implementation method]

[0037] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0038] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0039] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0040] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0041] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0042] Please combine Figure 1 to Figure 2 The first embodiment of the utility model provides an LED backlight module 1, comprising a substrate 10, an LED chip 13 arranged on one side of the substrate 10, and a packaging colloid 14 covering the LED chip 13; a single-layer reflective optical structure 15 is arranged on the side of the packaging colloid 14 away from the substrate 10, the reflective optical structure 15 corresponds to the LED chip 13 one by one, the center point of the reflective optical structure 15 is coaxial with the geometric center point of the LED chip 13, and the reflective optical structure 15 is provided with openings 151 arranged in a ring array.

[0043] Please further combine Figure 3 and Figure 4 In order to achieve a better uniform light effect, the existing LED backlight module 2 and the reflective optical structure 20 usually increase the reflectivity of the reflective optical structure 20, but the reflectivity and transmittance are usually a fixed ratio, so the transmittance of the reflective optical structure 20 will be low, and the brightness of the LED backlight module 2 will be distributed in three areas: the first area is directly above the LED chip 21, with extremely high brightness. Most of the light emitted by the LED chip 21 is propagated to the side through reflection. Although the transmittance is low, since the brightness of the LED chip 21 is concentrated on the front, there is still a considerable degree of light transmission, forming a bright spot; the second area is the outer edge of the reflective optical structure 20, with extremely low brightness. Since the brightness of the LED chip is concentrated on the front, the side is less exposed to direct light, and most of it is reflected light. The light transmission is low, forming a circular dark area; the third area is the part outside the reflective optical structure 20, with normal brightness. The light here is mainly reflected light from the reflective optical structure 20, which is the most important part for the uniform light effect.

[0044] Please further combine Figure 5 It can be understood that by making the opening 151 on the reflective optical structure 15, when the LED chip 13 emits light, most of the light is reflected to the side of the LED through the reflective optical structure 15, and part of the light can be directly emitted through the opening 151. This part of the light does not need to be reflected and evenly lighted by the reflective optical structure 15, so the light output is not attenuated. Viewed from the front, each opening 151 in the LED backlight module 1 is an independent small light-emitting unit, which can increase the front light output of the reflective optical structure 15 without reducing the reflectivity and evenly light effect of the reflective optical structure 15, improve the front transmittance of the reflective optical structure 15, and improve the overall brightness of the LED backlight module 1.

[0045] It can be understood that the center point of the reflective optical structure 15 is coaxial with the geometric center point of the LED chip 13. This setting helps the reflective optical structure 15 to better reflect or transmit the light emitted by the LED chip 13, thereby controlling and improving the uniform light effect.

[0046] It can be understood that arranging the openings 151 in a circular array can further improve the light uniformity effect of the LED backlight module 1 .

[0047] It can be understood that in this embodiment, the array arrangement of the openings 151 can be changed according to the specific light uniformity effect, and the light uniformity effect can be controlled by increasing or decreasing the number of the openings 151.

[0048] It can be understood that the projection shape of the opening 151 and the reflective optical structure 15 on the substrate 10 can also be changed according to the specific uniform light effect to further improve the uniform light effect of the LED backlight module 1. Specifically, the projection shape of the opening 151 and the reflective optical structure 15 on the substrate 10 can be a geometric shape such as a circle, a rectangle, a polygon, or an irregular shape.

[0049] It can be understood that in this embodiment, the opening 151 can be integrally formed with the reflective optical structure 15, or can be processed after the reflective optical structure 15 is manufactured. Optionally, the processing method includes but is not limited to laser processing, grinding processing, and stamping processing.

[0050] It can be understood that in this embodiment, the material of the reflective optical structure 15 is not specifically limited, and any material that has a reflective effect can be used, such as white oil, metal, etc. The manufacturing process of the reflective optical structure 15 is also not specifically limited, and any process that can form a protruding structure can be used, such as a printing process, a spraying process, a deposition process, a photolithography development process, etc.

[0051] It can be understood that in this embodiment, the reflectivity of the reflective optical structure 15 is not specifically limited and can be arbitrarily changed according to specific usage requirements.

[0052] For further information, please refer to Figure 1 A copper layer 11 is disposed on one side of the substrate 10 close to the LED chip 13 , and a solder resist layer 12 is covered on one side of the copper layer 11 away from the substrate 10 . The solder resist layer 12 has a window 121 , and the LED chip 13 is disposed in the window 121 .

[0053] It can be understood that the solder resist layer 12 is made of a material with high reflectivity, which can enhance the reflection degree of the light emitted by the LED chip 13, improve the light efficiency of the LED backlight module 1, and control the uniform light effect. Specifically, in this embodiment, the material of the solder resist layer 12 is not specifically limited, and a material that can provide light reflection can be used, such as white film, white oil, metal, etc.

[0054] For further information, please refer to Figure 6 , the depth value h of the opening 151 (such as Figure 6 h) is greater than the thickness H of the reflective optical structure 15 (e.g. Figure 6 The H) in the figure is smaller than 0um-50um, or the opening 151 penetrates the reflective optical structure 15 and extends toward the encapsulation colloid 14, and the depth value h of the opening 151 is greater than the thickness value H of the reflective optical structure 15 by 0um-50um.

[0055] It can be understood that, under normal circumstances, the depth of the opening 151 and the thickness of the reflective optical structure 15 are kept consistent, and can also be adjusted according to the actual optical effect to change the amount of light output directly above the LED chip 13. The greater the depth of the opening, the greater the amount of light output directly above the LED chip 13.

[0056] Furthermore, please combine Figure 1 , Figure 5 and Figure 6 The axial cross-section shape of the opening 151 is rectangular, V-shaped or arc-shaped. It can be understood that different shapes of the opening 151 can also change the amount of light emitted directly above the LED chip 13. The axial cross-section shape of the opening 151 is V-shaped or arc-shaped, which can increase the amount of light emitted directly above the LED chip 13, improve the light effect of the LED backlight module 1, and control the uniform light effect.

[0057] Furthermore, the diameter of the opening 151 ranges from 50um to 500um. It is understandable that the light output directly above the LED chip 13 can be changed by adjusting the size of the opening 151, thereby further controlling the uniform light effect.

[0058] Furthermore, the outer diameter of the reflective optical structure 15 ranges from 1.0 mm to 6.0 mm. It is understandable that the size of the reflective optical structure 15 can be adjusted to change the amount of light emitted from the top and sides.

[0059] Furthermore, the projection area of ​​the reflective optical structure 15 on the substrate 10 is larger than the projection area of ​​the LED chip 13 on the substrate 10. It can be understood that the projection area of ​​the reflective optical structure 15 on the substrate 10 is larger than the projection area of ​​the LED chip 13 on the substrate 10, that is, the reflective optical structure 15 can completely cover the light emitting surface of the LED chip 13, and can better adjust the concentrated light to the periphery through light reflection to control the uniform light effect of the LED backlight module 1.

[0060] For further information, please refer to Figure 2 , there is a gap 122 between the solder resist layer 12 and the LED chip 13. It can be understood that the gap 122 reserves enough space so that when the LED chip 13 is placed in the window 121 during the manufacturing process of the LED backlight module 1, the LED chip 13 is prevented from directly contacting the solder resist layer 12 to cause damage to the LED chip 13.

[0061] For further information, please refer to Figure 1 , the thickness of the LED chip 13 is greater than the thickness of the solder resist layer 12. It can be understood that this design can avoid the thickness of the LED chip 13 being lower than the thickness of the solder resist layer 12 affecting the lateral light emission of the LED chip 13, so that the light emission effect of the LED chip 13 is better.

[0062] For example, please further combine Figure 6 and Figure 7 The front projection of the reflective optical structure 15 is circular, and the outer diameter D (eg Figure 6 D) is 4.2 mm, and the thickness value H (such as Figure 6 The H in the figure is 0.06 mm, and the center of the reflective optical structure 15 coincides with the geometric center of the LED chip 13; the front projection of the opening 151 is a circle with a diameter d (such as Figure 6 The d in is 0.3 mm, and the depth of the opening h (such as Figure 6 h) and the thickness H of the reflective optical structure are consistent with 0.06 mm, and the plurality of openings 151 are arranged in a circular array according to the center of the reflective optical structure 15, with a total of two rows. Figure 6 The light uniformity effect of the LED backlight module is demonstrated. Since the opening 151 is provided at the outer edge of the reflective optical structure 15, the light emitted by the LED chip 13 is emitted through the opening 151 without attenuation, so no annular dark area is formed, and the overall light uniformity effect of the LED backlight module is good.

[0063] Please continue reading Figure 8 The second embodiment of the utility model provides a display device 3, including a carrying device 30 and the above-mentioned LED backlight module 1 arranged on the carrying device 30. The backlight module has all the beneficial effects of the above-mentioned LED backlight module 1, which will not be described in detail here.

[0064] Compared with the prior art, the LED backlight module and display device provided by the present invention have the following advantages:

[0065] 1. An LED backlight module provided in the embodiment of the utility model is provided. By making openings on the reflective optical structure, when the LED chip emits light, most of the light is reflected to the side of the LED through the reflective optical structure, and part of the light can be emitted directly through the opening. This part of the light does not need to be reflected and evenly lighted by the reflective optical structure, so the light output is not attenuated. From the front, each opening in the LED backlight module is an independent small light-emitting unit, which can increase the front light output of the reflective optical structure without reducing the reflectivity and even light effect of the reflective optical structure, and improve the front transmittance of the reflective optical structure, so as to improve the overall brightness of the LED backlight module. The center point of the reflective optical structure is coaxial with the geometric center point of the LED chip. This setting is conducive to the reflective optical structure to better reflect or transmit the light emitted by the LED chip, and can control and improve the even light effect. In addition, the ring array arrangement of the openings can further improve the even light effect of the LED backlight module.

[0066] 2. An LED backlight module provided in an embodiment of the utility model has a copper wire layer on one side of a substrate close to an LED chip, and a solder resist layer is covered on one side of the copper wire layer away from the substrate. The solder resist layer has a window, and the LED chip is arranged in the window. The solder resist layer is made of a material with high reflectivity, which can enhance the reflection degree of light emitted by the LED chip, improve the light efficiency of the LED backlight module, and control the uniform light effect.

[0067] 3. In an LED backlight module provided in an embodiment of the present invention, the depth of the opening is 0um-50um less than the thickness of the reflective optical structure, or the opening penetrates the reflective optical structure and extends toward the encapsulation colloid, and the depth of the opening is 0um-50um greater than the thickness of the reflective optical structure. By adjusting the depth of the opening, the amount of light emitted directly above the LED chip can be changed, and the uniform light effect can be further controlled.

[0068] 4. In an LED backlight module provided in an embodiment of the utility model, the axial cross-section shape of the opening is rectangular, V-shaped or arc-shaped. Different opening shapes can also change the amount of light output directly above the LED chip. The axial cross-section shape of the opening is V-shaped or arc-shaped, which can increase the amount of light output directly above the LED chip, improve the lighting efficiency of the LED backlight module, and control the uniform light effect.

[0069] 5. In an LED backlight module provided in an embodiment of the utility model, the diameter of the opening is in the range of 50um-500um. The light output directly above the LED chip can be changed by adjusting the size of the opening, thereby further controlling the uniform light effect.

[0070] 6. In an LED backlight module provided in an embodiment of the utility model, the outer diameter range of the reflective optical structure is 1.0mm-6.0mm, and the projection area of ​​the reflective optical structure on the substrate is larger than the projection area of ​​the LED chip on the substrate, that is, the reflective optical structure can completely cover the light emitting surface of the LED chip, and can better adjust the concentrated light to the periphery through light reflection to control the uniform light effect of the LED backlight module.

[0071] 7. In an LED backlight module provided in an embodiment of the utility model, there is a gap between the solder resist layer and the LED chip, and sufficient space is reserved in the gap so that when the LED chip is placed in the window during the manufacturing process of the LED backlight module, the LED chip is prevented from directly contacting the solder resist layer and causing damage to the LED chip.

[0072] 8. In an LED backlight module provided in an embodiment of the utility model, the thickness of the LED chip is greater than the thickness of the solder resist layer, so as to avoid the thickness of the LED chip being lower than the thickness of the solder resist layer and affecting the lateral light emission of the LED chip, thereby making the light emission effect of the LED chip better.

[0073] 9. A display device provided in an embodiment of the utility model includes a carrying device and an LED backlight module as described above, which is arranged on the carrying device. The display device has all the beneficial effects of the LED backlight module, which will not be described in detail here.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An LED backlight module, characterized in that: The invention comprises a substrate, an LED chip arranged on one side of the substrate, and an encapsulation body covering the LED chip; a reflective optical structure is provided on the side of the encapsulation body away from the substrate, the reflective optical structure corresponds one-to-one with the LED chip, the center point of the reflective optical structure is coaxial with the geometric center point of the LED chip, and the reflective optical structure is provided with openings arranged in a ring array.

2. The LED backlight module according to claim 1, wherein: A copper wire layer is provided on a side of the substrate close to the LED chip, and a solder resist layer is covered on a side of the copper wire layer away from the substrate. A window is provided in the solder resist layer, and the LED chip is arranged in the window.

3. The LED backlight module according to claim 1, wherein: The depth of the opening is 0um-50um smaller than the thickness of the reflective optical structure, or the opening penetrates the reflective optical structure and extends toward the encapsulation colloid, and the depth of the opening is 0um-50um larger than the thickness of the reflective optical structure.

4. The LED backlight module according to claim 1, wherein: The axial cross-section of the opening is rectangular, V-shaped or arc-shaped.

5. The LED backlight module according to claim 1, wherein: The diameter of the opening ranges from 50um to 500um.

6. The LED backlight module according to claim 1, wherein: The outer diameter of the reflective optical structure ranges from 1.0 mm to 6.0 mm.

7. The LED backlight module according to claim 1, wherein: The projection area of ​​the reflective optical structure on the substrate is larger than the projection area of ​​the LED chip on the substrate.

8. The LED backlight module according to claim 2, wherein: There is a gap between the solder resist layer and the LED chip.

9. The LED backlight module according to claim 2, wherein: The thickness of the LED chip is greater than the thickness of the solder resist layer.

10. A display device, characterized in that: The invention comprises a carrying device and an LED backlight module according to any one of claims 1 to 9, which is arranged on the carrying device.

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