Mini LED chip backlight module capable of uniformly emitting light
By setting arc grooves under the diffusion film of the MiniLED chip backlight module and designing C-shaped grooves and glue grooves on the packaging board, the light uneven problem caused by the flat diffusion film is solved, and uniform refraction and color performance of light are achieved The accuracy of the installation process simplifies the installation process.
Patent Information
- Application Number
- CN202323566191.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-26
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2033-12-26
Smart Images
Figure CN222214209U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of Miniled display screens, and in particular to a MiniLED chip backlight module with uniform light output. Background Art
[0002] MiniLED display and microLED display are achieved by miniaturizing the size of light-emitting diodes to less than a millimeter, which greatly optimizes the resolution, power consumption, lifespan and other performance of the display. In order to solve the problems of actual uniformity and granularity, MiniLED needs to use smaller chips and smaller pitch values in design, and usually requires the use of special structured optical film materials.
[0003] However, in the process of implementing the above technical solutions, it was found that there are at least the following technical problems: in the use of the existing diffusion film, as shown in the attached figure, the diffusion film is flat, which will cause it to be less uniform when refracting the light source of the LED chip, resulting in local areas being too bright or too dark, affecting the viewing experience. In addition, the uneven light emission may also cause color distortion, affecting color performance and accuracy. Utility Model Content
[0004] 1. Technical issues to be solved
[0005] In view of the shortcomings of the prior art, the utility model provides a MiniLED chip backlight module with uniform light output, which solves the problem that in the use of the existing diffusion film, as shown in the attached figure, the diffusion film is flat, which causes it to be less uniform when refracting the light source of the LED chip, resulting in local areas being too bright or too dark, affecting the viewing experience. In addition, the uneven light emission may also cause color distortion, affecting the technical problem of color performance and accuracy.
[0006] (II) Technical solution
[0007] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:
[0008] A MiniLED chip backlight module with uniform light output comprises a Miniled light source board, the Miniled light source board is provided with a coating mechanism for facilitating uniform display, the coating mechanism comprises a diffusion film, a sealing layer and an LED chip, the LED chip is fixedly mounted on the inner side wall of the Miniled light source board, the diffusion film is located above the Miniled light source board, the sealing layer is coated on the inner side wall of the Miniled light source board, an arc groove is arranged below the diffusion film, two packaging boards are fixedly mounted on the upper end of the Miniled light source board, the diffusion film is attached to the upper ends of the two packaging boards, the upper ends of the two packaging boards are both provided with C-shaped grooves, the upper ends of the two packaging boards are also provided with at least two glue grooves, and the spacing between each of the glue grooves is the same,
[0009] Preferably, a connecting groove is formed through the side end of the inner side wall of each of the glue grooves.
[0010] Preferably, each of the connecting grooves has the same size.
[0011] (III) Beneficial effects
[0012] 1. This device sets an arc-shaped groove under the diffusion film to make the refraction surface of light larger than ordinary diffusion, so the light is refracted more evenly, ensuring uniform display and avoiding affecting color performance and accuracy.
[0013] 2. The device is provided with a packaging plate, and the glue is squeezed into the glue groove on the packaging plate, so that the glue is evenly applied, and the C-shaped groove is provided to avoid the overflow of glue, making the installation process more concise. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings.
[0015] Figure 1 It is a structural diagram of the cutaway surface of the utility model;
[0016] Figure 2 This is a structural reference diagram of the existing Miniled light source board of the utility model;
[0017] Figure 3 This is a structural diagram of the packaging board of the utility model;
[0018] Figure 4 It is the structural diagram of the glue groove of the utility model.
[0019] Legend: 1. Diffusion film; 2. Sealing layer; 3. LED chip; 4. Miniled light source board; 5. Packaging board; 51. C-shaped groove; 52. Glue groove; 53. Connection groove. DETAILED DESCRIPTION
[0020] The embodiment of the present application provides a MiniLED chip backlight module with uniform light output, which effectively solves the problem of using the existing diffusion film 1. Figure 2 As shown, the diffusion film 1 is flat, which will cause it to refract the light source of the LED chip 3 unevenly, resulting in local areas being too bright or too dark, affecting the viewing experience. In addition, uneven light emission may also cause color distortion, affecting technical problems such as color performance and accuracy. The device sets an arc-shaped groove under the diffusion film 1, so that the refraction surface of the light is larger than that of ordinary diffusion, so that the light is refracted more evenly, ensuring uniform display and avoiding affecting color performance and accuracy.
[0021] Example
[0022] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As described above, the technical solution in the embodiment of the present application is to effectively solve the problem of the existing diffusion membrane 1 in use. Figure 2 As shown, the diffusion film 1 is flat, which will cause it to be uneven when refracting the light source of the LED chip 3, resulting in local areas being too bright or too dark, affecting the viewing experience. In addition, uneven light emission may also cause color distortion, affecting the technical problems of color performance and accuracy. The overall idea is as follows: A MiniLED chip backlight module with uniform light output includes a Miniled light source board 4, and the Miniled light source board 4 is provided with a coating mechanism that facilitates its uniform display. The coating mechanism includes a diffusion film 1, a sealing layer 2 and an LED chip 3. The LED chip 3 is fixedly installed on the inner wall of the Miniled light source board 4, the diffusion film 1 is located above the Miniled light source board 4, and the sealing layer 2 is coated on the inner wall of the Miniled light source board 4. An arc groove is provided below the diffusion film 1. The present application starts the groove below the diffusion film 1, as shown in the attached Figure 1 As shown, the diffuser has an arc-shaped concave structure, and the light refraction surface is larger than that of the ordinary diffuser, so the light is refracted more evenly;
[0023] Two packaging boards 5 are fixedly installed on the upper end of the Miniled light source board 4, and the diffusion film 1 is attached to the upper ends of the two packaging boards 5. The upper ends of the two packaging boards 5 are both provided with C-shaped grooves 51. The upper ends of the two packaging boards 5 are also provided with at least two glue grooves 52. The spacing between each glue groove 52 is the same. After the glue is squeezed, the user can stick the diffusion film 1 on the two packaging boards 5. The glue may overflow after being pressed. The C-shaped groove 51 is also provided on the packaging board 5. The glue will overflow into the C-shaped groove 51 to avoid glue overflow and inconvenience in cleaning;
[0024] A connecting groove 53 is formed through the side end of the inner wall of each glue groove 52. Each connecting groove 53 has the same size. When attaching the diffusion membrane 1, glue can be squeezed into each glue groove 52. A connecting groove 53 is formed between each of the glue grooves 52 so that each glue groove 52 is connected.
[0025] In view of the problems existing in the prior art, the utility model provides a MiniLED chip backlight module with uniform light output. The device sets an arc-shaped groove under the diffusion film 1 so that the refraction surface of the light is larger than the ordinary diffusion, so the light is refracted more evenly, ensuring uniform display and avoiding affecting color performance and accuracy.
[0026] Working principle:
[0027] The present application starts with a groove below the diffusion film 1, as shown in the attached Figure 1 As shown, the diffusion band has an arc-shaped concave structure, and the refraction surface of light is larger than that of ordinary diffusion, so the light is refracted more evenly. When attaching the diffusion film 1, glue can be squeezed into each glue groove 52, and a connecting groove 53 is opened between each, so that each glue groove 52 is connected. The principle of forming a communicating vessel can make the glue contained in each glue groove 52 equal, avoiding the situation of excessive glue coating locally. After the glue is squeezed, the user can attach the diffusion film 1 to the two packaging plates 5. The glue may overflow after being pressed. A C-shaped groove 51 is also provided on the packaging plate 5, and the glue will overflow into the C-shaped groove 51 to avoid glue overflow and inconvenience in cleaning. In the use of the existing diffusion film 1, as shown in the attached Figure 2 As shown, the diffusion film 1 is flat, which will cause it to refract the light source of the LED chip 3 unevenly, resulting in local areas being too bright or too dark, affecting the viewing experience. In addition, uneven light emission may also cause color distortion, affecting color performance and accuracy. The device sets an arc-shaped groove under the diffusion film 1, so that the refraction surface of light is larger than ordinary diffusion, so that the light is refracted more evenly, ensuring uniform display and avoiding affecting color performance and accuracy. In addition, the device sets a packaging plate 5, and the glue is squeezed into the glue groove 52 on the packaging plate 5, so that the glue is evenly applied, and the C-shaped groove 51 is set to avoid glue overflow, making the installation process simpler.
[0028] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.
Claims
1. A MiniLED chip backlight module with uniform light output, comprising a MiniLED light source board (4), characterized in that: The Miniled light source panel (4) is provided with a coating mechanism to facilitate uniform display; The coating mechanism comprises a diffusion film (1), a sealing layer (2) and an LED chip (3); the LED chip (3) is fixedly mounted on the inner wall of a Miniled light source board (4); the diffusion film (1) is located above the Miniled light source board (4); the sealing layer (2) is coated on the inner wall of the Miniled light source board (4); and an arc groove is provided below the diffusion film (1).
2. The MiniLED chip backlight module with uniform light output according to claim 1, characterized in that: Two packaging plates (5) are fixedly mounted on the upper end of the Miniled light source plate (4); Wherein, the diffusion film (1) is attached to the upper ends of the two packaging plates (5).
3. A MiniLED chip backlight module with uniform light output as claimed in claim 2, characterized in that: The upper ends of the two packaging plates (5) are each provided with a C-shaped groove (51).
4. The MiniLED chip backlight module with uniform light output as claimed in claim 3, characterized in that: At least two glue grooves (52) are also formed at the upper ends of the two packaging plates (5); Wherein, the spacing between each of the glue grooves (52) is the same.
5. The MiniLED chip backlight module with uniform light output as claimed in claim 4, characterized in that: A connecting groove (53) is formed through the side end of the inner wall of each of the glue grooves (52).
6. The MiniLED chip backlight module with uniform light output according to claim 5, characterized in that: The size of each of the connecting grooves (53) is the same.
Citation Information
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