Integrated silicon wafer processing equipment

Abstract

The utility model relates to the technical field of processing equipment, in particular to integrated silicon wafer processing equipment, which comprises a mounting base, a controller is mounted on the outer wall of the mounting base, a first fixing block is mounted on the outer wall of the mounting base, a rotating rod is rotatably connected to the inner wall of the first fixing block, and a second fixing block is mounted on the inner wall of the rotating rod. The driving module is arranged to drive the rotating shaft to rotate, so that the rotating shaft drives the silicon wafer fixing frame to move through the first fixing plate and the second fixing plate, the physical polishing machine and the chemical polishing machine are located on the two sides of the moving assembly respectively, and after physical polishing is completed, the rotating shaft is driven to rotate to drive the silicon wafer fixing frame to move. When the silicon wafer fixing frame moves to the chemical polishing machine, the driving module drives the rotating shaft to rotate, and meanwhile, the electric control rotator rotates reversely by 180 degrees, so that when the silicon wafer fixing frame moves to the chemical polishing machine, the surface, needing to be polished, of the silicon wafer in the inner cavity of the silicon wafer fixing frame is kept upward, the silicon wafer fixing frame drives the silicon wafer to enter the inner cavity of the chemical polishing machine, and chemical polishing is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of processing equipment, in particular to an integrated silicon wafer processing equipment. Background Art

[0002] Integrated silicon wafer processing equipment refers to the integration of multiple silicon wafer processing processes into one device to achieve efficient and precise processing of silicon wafers. According to different processing processes, integrated silicon wafer processing equipment can be divided into the following categories: 1. Cleaning equipment: mainly used for decontamination, deoxidation, removal of organic pollutants, etc. on the surface of silicon wafers; 2. Polishing equipment: mechanically polishing the surface of silicon wafers to achieve the flatness and finish requirements of the surface of silicon wafers; 3. Etching equipment: chemical or physical methods are used to etch the surface of silicon wafers to form specific micro-nano structures; 4. Oxidation equipment: a layer of silicon oxide film is formed on the surface of silicon wafers through oxidation reaction to improve the anti-oxidation performance of silicon wafers; 5. Thin film deposition equipment: physical or chemical methods are used to deposit a layer of thin film on the surface of silicon wafers for functional materials such as dielectrics and conductors; 6. Heat treatment equipment: high temperature treatment is used to achieve lattice reconstruction, impurity diffusion, oxide film growth, etc. of silicon wafers.

[0003] Among them, the cut silicon wafer needs to be physically polished and chemically polished in sequence to make the silicon wafer meet the subsequent etching requirements. However, the existing high-power physical polishing machines and chemical polishing machines are different machines, and manual transfer is required, resulting in more polishing steps for the silicon wafer. The silicon wafer may also be bumped and damaged during the transfer, which is time-consuming, labor-intensive and impractical.

[0004] In this solution, an integrated silicon wafer processing device is therefore needed to improve the above problems. Utility Model Content

[0005] The purpose of the utility model is to provide an integrated silicon wafer processing device to solve the problems raised in the above background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] An integrated silicon wafer processing device comprises a mounting base, a controller is mounted on the outer wall of the mounting base, a first fixed block is mounted on the outer wall of the mounting base, a rotating rod is rotatably connected to the inner wall of the first fixed block, an electrically controlled telescopic rod is mounted on the outer wall of the rotating rod, a rotating rod is mounted on one end of the electrically controlled telescopic rod, a second fixed block is rotatably connected to the outer wall of the rotating rod, a physical polisher is mounted on the outer wall of the mounting base, a first rotating shaft is mounted on the side wall of the physical polisher, a first upper cover is rotatably connected to the outer wall of the first rotating shaft, a second fixed block is connected to the outer wall of the first upper cover, a moving component is mounted on one side of the physical polisher and located on the base surface of the mounting base, a chemical polisher is mounted on the base surface of the mounting base, a second rotating shaft is mounted on the side wall of the chemical polisher, a second upper cover is rotatably connected to the outer wall of the second rotating shaft, and a second fixed block is connected to the outer wall of the second upper cover;

[0008] The moving component includes a fixed frame, which is installed on the base surface of the mounting base, and a rotating shaft is rotatably connected on the opposite inner walls of the fixed frame, one end of the rotating shaft penetrates the fixed frame and extends to the outer wall of the fixed frame on which a driving module is installed, a first fixed plate is installed on the outer wall of the rotating shaft, an electric-controlled rotator is installed on the outer wall of the first fixed plate, a second fixed plate is installed on the outer wall of the electric-controlled rotator, and a silicon wafer fixing frame is installed on the outer wall of the second fixed plate.

[0009] As a preferred solution of the utility model, the controller is respectively connected to the electric-controlled telescopic rod, the physical polisher, the chemical polisher, the drive module and the electric-controlled rotator through wires, and the connection method is electrical connection.

[0010] As a preferred solution of the utility model, two groups of the first fixing blocks are provided and are respectively located on opposite inner walls of the mounting base, and the cross section of the mounting base is a concave structure.

[0011] As a preferred solution of the utility model, the connection mode of the rotating rod and the electric-controlled telescopic rod is a rotational connection, and the connection mode of the rotating rod and the electric-controlled telescopic rod is a rotational connection.

[0012] As a preferred solution of the utility model, the physical polisher and the chemical polisher are respectively located on both sides of the fixed frame, and the connection mode between the chemical polisher and the second rotating shaft is a rotating connection.

[0013] As a preferred solution of the utility model, two groups of second fixed blocks are provided and are respectively located on the outer walls of the first upper cover and the second upper cover, the silicon wafer fixing frame is located in the inner cavity of the chemical polishing machine, and grooves are provided on the side walls of the physical polishing machine and the chemical polishing machine, and the grooves are located on one side of the second fixed plate.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. In the utility model, a moving component in an integrated silicon wafer processing device is used, and a driving module in the moving component is used to drive the rotating shaft to rotate, so that the rotating shaft drives the silicon wafer holder to move through the first fixed plate and the second fixed plate, and the physical polisher and the chemical polisher are respectively located on both sides of the moving component. When the physical polishing is completed, only the driving module needs to drive the rotating shaft to rotate, and the electric control rotator is reversed 180 degrees at the same time, so that when the silicon wafer holder moves to the chemical polisher, the surface of the silicon wafer in the inner cavity of the silicon wafer holder that needs to be polished remains upward, so that the silicon wafer holder drives the silicon wafer into the inner cavity of the chemical polisher for chemical polishing, which is beneficial to solve the problem that the cut silicon wafer needs to be physically polished and chemically polished in sequence, so that the silicon wafer meets the subsequent etching requirements. However, the existing high-power physical polisher and chemical polisher are different machines, and manual transfer is required, resulting in more polishing steps for the silicon wafer. During the transfer, the silicon wafer may also be damaged by collision, which is time-consuming, labor-intensive and not practical. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the top view structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the mobile component of the utility model.

[0019] In the figure: 1. mounting base; 2. controller; 3. first fixed block; 4. rotating rod; 5. electrically controlled telescopic rod; 6. rotating rod; 7. second fixed block; 8. physical polisher; 9. first rotating shaft; 10. first upper cover; 11. moving assembly; 1101. fixed frame; 1102. rotating shaft; 1103. driving module; 1104. first fixed plate; 1105. electrically controlled rotator; 1106. second fixed plate; 1107. silicon wafer fixing frame; 12. chemical polisher; 13. second rotating shaft; 14. second upper cover. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0021] For examples, see Figure 1-3, the utility model provides a technical solution:

[0022] An integrated silicon wafer processing device comprises a mounting base 1, a controller 2 is mounted on the outer wall of the mounting base 1, a first fixed block 3 is mounted on the outer wall of the mounting base 1, a rotating rod 4 is rotatably connected to the inner wall of the first fixed block 3, an electric control telescopic rod 5 is mounted on the outer wall of the rotating rod 4, a rotating rod 6 is mounted on one end of the electric control telescopic rod 5, a second fixed block 7 is rotatably connected to the outer wall of the rotating rod 6, a physical polisher 8 is mounted on the outer wall of the mounting base 1, a first rotating shaft 9 is mounted on the side wall of the physical polisher 8, a first upper cover 10 is rotatably connected to the outer wall of the first rotating shaft 9, the second fixed block 7 is connected to the outer wall of the first upper cover 10, a moving component 11 is mounted on one side of the physical polisher 8 and located on the base surface of the mounting base 1, a chemical polisher 12 is mounted on the base surface of the mounting base 1, a second rotating shaft 13 is mounted on the side wall of the chemical polisher 12, a second upper cover 14 is rotatably connected to the outer wall of the second rotating shaft 13, and the second fixed block 7 is connected to the outer wall of the second upper cover 14;

[0023] In this embodiment, please refer to Figure 1 , Figure 2 and Figure 3 The moving component 11 includes a fixed frame 1101, which is installed on the base surface of the mounting base 1, and the physical polisher 8 and the chemical polisher 12 are respectively located on both sides of the fixed frame 1101. A rotating shaft 1102 is rotatably connected to the opposite inner walls of the fixed frame 1101, one end of the rotating shaft 1102 penetrates the fixed frame 1101 and extends to the outer wall of the fixed frame 1101, on which a driving module 1103 is installed, a first fixed plate 1104 is installed on the outer wall of the rotating shaft 1102, an electrically controlled rotator 1105 is installed on the outer wall of the first fixed plate 1104, a second fixed plate 1106 is installed on the outer wall of the electrically controlled rotator 1105, and a silicon wafer fixing frame 1107 is installed on the outer wall of the second fixed plate 1106.

[0024] Further, the controller 2 is respectively connected to the electric telescopic rod 5, the physical polisher 8, the chemical polisher 12, the drive module 1103 and the electric rotator 1105 through wires, and the connection method is electrical connection, so that the device is powered on, the first fixed block 3 is provided with two groups and is respectively located on the inner walls opposite to each other of the mounting base 1, the cross section of the mounting base 1 is a concave structure, the connection method of the rotating rod 4 and the electric telescopic rod 5 is a rotational connection, the connection method of the rotating rod 6 and the electric telescopic rod 5 is a rotational connection, the chemical polisher 12 and the second rotating The connection method of the moving shaft 13 is a rotating connection. The second fixed block 7 is provided with two groups and is respectively located on the outer walls of the first upper cover 10 and the second upper cover 14. The silicon wafer fixing frame 1107 is located in the inner cavity of the chemical polishing machine 12, and grooves are provided on the side walls of the physical polishing machine 8 and the chemical polishing machine 12. The groove is located on one side of the second fixed plate 1106, so that when the second fixed plate 1106 moves, when the second fixed plate 1106 moves to the inner cavity of the groove, its silicon wafer fixing frame 1107 is just located in the inner cavity of the polishing machine, which is more practical.

[0025] The working process of the utility model is as follows: when the integrated silicon wafer processing equipment designed by the present invention is working, the controller 2 is respectively connected to the electric control telescopic rod 5, the physical polisher 8, the chemical polisher 12, the drive module 1103 and the electric control rotator 1105 through wires and the connection mode is electrical connection, so that the device is powered on, and the switch of the controller 2 is turned on, and the silicon wafer fixing frame 1107 is installed on the outer wall of the second fixing plate 1106. The polished silicon wafer is placed on the inner wall of the silicon wafer fixing frame 1107 for fixing, and then the polishing switch of the controller 2 is turned on, so that the controller 2 controls the drive module 1103 to operate, and the silicon wafer fixing frame 1107 is fixed on the outer wall of the second fixing plate 1106. A rotating shaft 1102 is rotatably connected to the inner wall opposite to the frame 1101, and one end of the rotating shaft 1102 penetrates the fixed frame 1101 and extends to the outer wall of the fixed frame 1101. Under the action of a driving module 1103 installed, the driving end of the driving module 1103 drives the rotating shaft 1102 to rotate, and then the rotating shaft 1102 drives the first fixed plate 1104 to rotate, and the first fixed plate 1104 drives the second fixed plate 1106 to rotate through the electric control rotator 1105, so that the second fixed plate 1106 drives the silicon wafer fixing frame 1107 to rotate, and when the set numerical parameters are reached, the silicon wafer fixing frame 1107 moves to the inner cavity of the physical polishing machine 8;

[0026] A physical polisher 8 is installed on the outer wall of the mounting base 1, a first rotating shaft 9 is installed on the side wall of the physical polisher 8, a first upper cover 10 is rotatably connected to the outer wall of the first rotating shaft 9, and a second fixing block 7 is connected to the outer wall of the first upper cover 10. Under the action of the controller 2, the electric control telescopic rod 5 is rotated, so that one end of the electric control telescopic rod 5 pushes the first upper cover 10 to move through the second fixing plate 1106, thereby making the first upper cover 10 rotate on the outer wall of the rotating shaft 1102, and the first upper cover 10 is closed, and then the controller 2 controls the physical polisher 8 to operate for polishing;

[0027] When polishing is completed, the above is reversed in the same manner, so that the first upper cover 10 is opened, and then the driving module 1103 is reversed, so that the rotating shaft 1102 drives the first fixed plate 1104 to rotate in the opposite direction, and the first fixed plate 1104 drives the second fixed plate 1106 to rotate through the electric-controlled rotator 1105, so that the second fixed plate 1106 drives the silicon wafer fixing frame 1107 to move in the opposite direction, and at the same time, the controller 2 controls the electric-controlled rotator 1105 to reverse 180 degrees, so that when the silicon wafer fixing frame 1107 moves to the chemical polishing machine 12, the surface of the silicon wafer in the inner cavity of the silicon wafer fixing frame 1107 that needs to be polished is kept upward, so that the silicon wafer fixing frame 1107 is 07 drives the silicon wafer into the inner cavity of the chemical polisher 12. Similarly, one end of the electric telescopic rod 5 pushes the second upper cover 14 to move, so that the chemical polisher 12 is closed. Then the controller 2 controls the chemical polisher 12 to perform chemical polishing. The practicality of the device is better, which is beneficial to solving the problem that the cut silicon wafer needs to be physically polished and chemically polished in sequence so that the silicon wafer can meet the subsequent etching requirements. However, the existing high-power physical polisher and chemical polisher are different machines, and manual transfer is required, resulting in more polishing steps for the silicon wafer. The silicon wafer may also be damaged by collision during transfer, which is time-consuming, labor-intensive and not practical.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated silicon wafer processing device, comprising a mounting base (1), characterized in that: A controller (2) is mounted on the outer wall of the mounting base (1); a first fixed block (3) is mounted on the outer wall of the mounting base (1); a rotating rod (4) is rotatably connected to the inner wall of the first fixed block (3); an electric-controlled telescopic rod (5) is mounted on the outer wall of the rotating rod (4); a rotating rod (6) is mounted at one end of the electric-controlled telescopic rod (5); a second fixed block (7) is rotatably connected to the outer wall of the rotating rod (6); a physical polisher (8) is mounted on the outer wall of the mounting base (1); a first rotating shaft (9) is mounted on the side wall of the physical polisher (8); and the second rotating shaft (9) is mounted on the outer wall of the first fixed block (3). A first upper cover (10) is rotatably connected to the outer wall of a rotating shaft (9), a second fixed block (7) is connected to the outer wall of the first upper cover (10), a moving component (11) is installed on one side of the physical polisher (8) and located on the base surface of the mounting base (1), a chemical polisher (12) is installed on the base surface of the mounting base (1), a second rotating shaft (13) is installed on the side wall of the chemical polisher (12), a second upper cover (14) is rotatably connected to the outer wall of the second rotating shaft (13), and a second fixed block (7) is connected to the outer wall of the second upper cover (14); The moving component (11) comprises a fixed frame (1101), wherein the fixed frame (1101) is mounted on a base surface of a mounting base (1), and a rotating shaft (1102) is rotatably connected to opposite inner walls of the fixed frame (1101), one end of the rotating shaft (1102) passes through the fixed frame (1101) and extends to an outer wall of the fixed frame (1101) on which a driving module (1103) is mounted, a first fixed plate (1104) is mounted on the outer wall of the rotating shaft (1102), an electrically controlled rotator (1105) is mounted on the outer wall of the first fixed plate (1104), a second fixed plate (1106) is mounted on the outer wall of the electrically controlled rotator (1105), and a silicon wafer fixing frame (1107) is mounted on the outer wall of the second fixed plate (1106).

2. The integrated silicon wafer processing device according to claim 1, characterized in that: The controller (2) is respectively connected to the electrically controlled telescopic rod (5), the physical polisher (8), the chemical polisher (12), the drive module (1103) and the electrically controlled rotator (1105) via wires, and the connection method is electrical connection.

3. The integrated silicon wafer processing device according to claim 1, characterized in that: The first fixing blocks (3) are provided in two groups and are respectively located on opposite inner walls of the mounting base (1); the cross section of the mounting base (1) is a concave structure.

4. The integrated silicon wafer processing device according to claim 1, characterized in that: The rotating rod (4) and the electrically controlled telescopic rod (5) are connected in a rotating manner, and the rotating rod (6) and the electrically controlled telescopic rod (5) are connected in a rotating manner.

5. The integrated silicon wafer processing device according to claim 1, characterized in that: The physical polisher (8) and the chemical polisher (12) are respectively located on two sides of the fixed frame (1101), and the chemical polisher (12) and the second rotating shaft (13) are connected in a rotating manner.

6. The integrated silicon wafer processing equipment according to claim 1, characterized in that: The second fixing blocks (7) are provided in two groups and are respectively located on the outer walls of the first upper cover (10) and the second upper cover (14); the silicon wafer fixing frame (1107) is located in the inner cavity of the chemical polishing machine (12); and grooves are provided on the side walls of the physical polishing machine (8) and the chemical polishing machine (12); the grooves are located on one side of the second fixing plate (1106).

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