Sintering device for wafer backing ring

Abstract

The utility model discloses a wafer backing ring sintering device which comprises a sintering box body, a first box door is hinged to the left end of the sintering box body, a second box door is hinged to the right end of the sintering box body, the first box door and the second box door are symmetrically arranged, a first guide rail frame is arranged at the bottom of the sintering box body, and a second guide rail frame is arranged at the right end of the sintering box body. A first guide rail frame is arranged in the sintering box body, a first receding opening is formed in the lower end of the sintering box body, the first receding opening is matched with the first guide rail frame, a first sintering frame is arranged in the sintering box body, first limiting wheels are arranged at the two ends of the first sintering frame, the first limiting wheels are matched with the first guide rail frame, and heating devices are arranged on the two sides of the sintering box body. According to the sintering device of the wafer backing ring, the first heating cover is used for absorbing heat and conducting heat, the temperature around the first sintering frame can be more uniform, the sintering speed is increased through blowing of the first fan blades, and better sintering quality can be guaranteed.

Description

Technical Field

[0001] The utility model belongs to the field of sintering devices, and in particular relates to a sintering device for a wafer gasket ring. Background Art

[0002] Wafers are required to use gaskets when grinding or dicing. Gaskets are usually made of semiconductor materials or sintered ceramics. One way to sinter ceramics is to burn natural gas. However, most of the equipment currently using natural gas to sinter ceramics cannot control the uniformity of heating at various locations on the gasket surface, resulting in some locations of the gasket being heated more and some locations being heated less, which is not conducive to controlling the quality of the gasket after sintering. Summary of the invention

[0003] In order to solve the deficiencies in the prior art, the utility model provides a sintering device for a wafer gasket ring.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A sintering device for wafer gaskets comprises a sintering box, wherein a first box door is hingedly provided at the left end of the sintering box, and a second box door is hingedly provided at the right end of the sintering box, the first box door and the second box door are symmetrically arranged, a first guide rail frame is provided at the bottom of the sintering box, a first clearance opening is provided at the lower end of the sintering box, and the first clearance opening matches with the first guide rail frame, a first sintering frame is provided in the sintering box, first limiting wheels are provided at both ends of the first sintering frame, and the first limiting wheels match with the first guide rail frame, and heating devices are provided on both sides of the sintering box.

[0006] Furthermore, the heating device includes a first heating hood, which is arranged in the sintering box, and has a plurality of first air inlet holes at both ends of the first heating hood. First heating tubes are arranged on both sides of the first heating hood, and the first heating tubes are U-shaped. First connecting parts are arranged at both ends of the first heating tubes, and the first connecting parts are fixed to the upper end of the sintering box.

[0007] Furthermore, the heating device includes a first drive motor and a first fan blade, the first drive motor is installed at the upper end of the sintering box, the first fan blade is arranged between the sintering box and the first heating cover, and the first drive motor is connected to the first fan blade.

[0008] Furthermore, the heating device comprises a first protective shell, the first protective shell is arranged at two ends of the sintering box, and the first connecting portion corresponds to the inside of the first protective shell.

[0009] Furthermore, a first limiting frame is provided at the rear end of the sintering box body, a first limiting column is provided at the right end of the first box door, and a second limiting column is provided at the left end of the second box door, and both the first limiting column and the second limiting column match the first limiting frame.

[0010] The utility model discloses a sintering device for a wafer gasket ring, which has the beneficial effect compared with the prior art in that it utilizes the first heating hood to absorb and conduct heat, so that the temperature around the first sintering rack can be more uniform, and the first fan blades can be blown to accelerate the sintering speed and ensure better sintering quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural schematic diagram of the first viewing angle of the preferred embodiment provided by the utility model.

[0012] Figure 2 It is a structural schematic diagram of a second viewing angle of a preferred embodiment provided by the utility model.

[0013] Figure 3 It is a structural schematic diagram of a third viewing angle of a preferred embodiment provided by the utility model.

[0014] The reference numerals include: 100, sintering box body; 110, first clearance opening; 120, first guide rail frame; 130, first box door; 140, second box door; 141, second limiting column; 150, first limiting frame; 160, first sintering rack; 170, first limiting wheel; 200, first heating cover; 210, first air inlet hole; 220, first heating tube; 221, first connecting part; 230, first driving motor; 240, first fan blade; 250, first protective shell. DETAILED DESCRIPTION

[0015] The utility model discloses a sintering device for a wafer gasket ring. The specific implementation manner of the utility model is further described below in conjunction with a preferred embodiment.

[0016] See attached figure Figure 1-3 , Figure 1 It is a structural schematic diagram of a first viewing angle of a preferred embodiment provided by the utility model, Figure 2 is a structural schematic diagram of a second viewing angle of a preferred embodiment provided by the utility model, Figure 3 It is a structural schematic diagram of a third viewing angle of a preferred embodiment provided by the utility model.

[0017] Preferred embodiments.

[0018] The present embodiment provides a sintering device for a wafer gasket, comprising a sintering box 100, wherein a first box door 130 is hingedly provided at the left end of the sintering box 100, and a second box door 140 is hingedly provided at the right end of the sintering box 100, wherein the first box door 130 and the second box door 140 are symmetrically arranged, a first guide rail frame 120 is arranged at the bottom of the sintering box 100, a first clearance opening 110 is arranged at the lower end of the sintering box 100, and the first clearance opening 110 matches the first guide rail frame 120, a first sintering frame 160 is arranged inside the sintering box 100, and first limiting wheels 170 are arranged at both ends of the first sintering frame 160, and the first limiting wheels 170 match the first guide rail frame 120, and heating devices are arranged on both sides of the sintering box 100. The first sintering rack 160 is moved to the rear end through the first limiting wheel 170 and the first guide rack 120, and the wafer gasket to be sintered is placed on the first sintering rack 160, and then the first sintering rack 160 is moved into the sintering box 100, and the wafer gasket is sintered by the heating device.

[0019] Furthermore, the heating device includes a first heating hood 200, which is disposed in the sintering box 100, and a plurality of first air inlet holes 210 are disposed at both ends of the first heating hood 200, and first heating tubes 220 are disposed on both sides of the first heating hood 200, and the first heating tubes 220 are U-shaped, and first connecting parts 221 are disposed at both ends of the first heating tubes 220, and the first connecting parts 221 are fixed to the upper end of the sintering box 100. The first heating hood 200 absorbs the heat of the first heating tubes 220 and radiates the heat into the first heating hood 200, so that the temperature on the first sintering rack 160 can be more uniform, and the sintering quality of the wafer backing ring can be better.

[0020] Further, the heating device includes a first drive motor 230 and a first fan blade 240, the first drive motor 230 is installed at the upper end of the sintering box 100, the first fan blade 240 is arranged between the sintering box 100 and the first heating cover 200, and the first drive motor 230 is connected to the first fan blade 240. The first drive motor 230 drives the first fan blade 240 to rotate, which can speed up the heat on the first heating tube 220 and send it into the first heating cover 200 through the first air inlet 210.

[0021] Furthermore, the heating device includes a first protective shell 250, which is disposed at both ends of the sintering box 100, and the first connection portion 221 corresponds to the first protective shell 250. The first protective shell 250 can protect the first connection portion 221 to prevent employees from touching it and causing danger.

[0022] Further, a first limiting frame 150 is provided at the rear end of the sintering box 100, a first limiting column is provided at the right end of the first box door 130, and a second limiting column 141 is provided at the left end of the second box door 140, and the first limiting column and the second limiting column are both matched with the first limiting frame 150. The first limiting column and the second limiting column 141 are inserted into the first limiting frame 150, so that the first box door 130 and the second box door 140 can be constrained to be closed.

[0023] It is worth mentioning that the technical features such as the structural shape of the first sintering rack 160 involved in the utility model patent application should be regarded as the prior art. The specific structure, working principle and possible control method and spatial layout method of these technical features can be selected according to the conventional methods in the field, and should not be regarded as the utility model points of the utility model patent. The utility model patent will not be further elaborated.

[0024] For those skilled in the art, it is still possible to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A sintering device for a wafer backing ring, characterized in that: The invention comprises a sintering box (100), wherein a first box door (130) is hingedly provided at the left end of the sintering box (100), and a second box door (140) is hingedly provided at the right end of the sintering box (100), and the first box door (130) and the second box door (140) are symmetrically arranged, a first guide rail frame (120) is arranged at the bottom of the sintering box (100), and a first clearance opening (110) is arranged at the lower end of the sintering box (100), and the first clearance opening (110) matches the first guide rail frame (120), a first sintering frame (160) is arranged inside the sintering box (100), and first limiting wheels (170) are arranged at both ends of the first sintering frame (160), and the first limiting wheels (170) match the first guide rail frame (120), and heating devices are arranged on both sides of the sintering box (100).

2. The sintering device for wafer backing ring according to claim 1, characterized in that: The heating device comprises a first heating hood (200), the first heating hood (200) is arranged in the sintering box (100), and a plurality of first air inlet holes (210) are arranged at both ends of the first heating hood (200), and first heating tubes (220) are arranged on both sides of the first heating hood (200), the first heating tubes (220) are U-shaped, and first connecting parts (221) are arranged at both ends of the first heating tubes (220), and the first connecting parts (221) are fixed to the upper end of the sintering box (100).

3. The sintering device for wafer backing ring according to claim 2, characterized in that: The heating device comprises a first driving motor (230) and a first fan blade (240), wherein the first driving motor (230) is mounted on the upper end of the sintering box (100), the first fan blade (240) is arranged between the sintering box (100) and the first heating cover (200), and the first driving motor (230) is connected to the first fan blade (240).

4. The sintering device for wafer backing ring according to claim 3, characterized in that: The heating device comprises a first protective shell (250), the first protective shell (250) is arranged at two ends of the sintering box (100), and the first connecting portion (221) corresponds to the inside of the first protective shell (250).

5. The sintering device for wafer backing ring according to claim 4, characterized in that: A first limiting frame (150) is provided at the rear end of the sintering box body (100), a first limiting column is provided at the right end of the first box door (130), and a second limiting column (141) is provided at the left end of the second box door (140), and the first limiting column and the second limiting column are both matched with the first limiting frame (150).

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